Electronic device comprising shield can

Abstract

An electronic device according to one embodiment may comprise: a PCB including a first conductive pad and a second conductive pad; a shield can disposed on the PCB; an insulating material disposed on the shield can; and a conductive line, which is attached to the insulating material, is electrically separated from the shield can, and extends from the first conductive pad of the PCB to the second conductive pad of the PCB while crossing the surface of an upper wall of the shield can. The conductive line can transmit a signal from the first conductive pad of the PCB to the second conductive pad of the PCB.

Description

Electronic device including a shield can

[0001] The present disclosure relates to an electronic device comprising a shield can.

[0002] An electronic device, such as a smartphone, may include a printed circuit board (PCB) and various electronic components disposed on the PCB. Additionally, the electronic device may include a shielding member, such as a shield can disposed on the PCB to cover the electronic components for electromagnetic interference (EMI) shielding of the electronic components.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to one embodiment, an electronic device may comprise: a printed circuit board (PCB) including a first conductive pad and a second conductive pad; a shield can disposed on the PCB; an insulating material disposed on the shield can; and a conductive line attached to the insulating material, electrically isolated from the shield can, and extending from the first conductive pad of the PCB to the second conductive pad of the PCB across the surface of the top wall of the shield can. The conductive line may be configured to transmit a signal from the first conductive pad of the PCB to the second conductive pad of the PCB.

[0005] According to one embodiment, an electronic device may comprise: a printed circuit board (PCB) including a first conductive pad and a second conductive pad; a shield can including a top wall and a side wall extending from the top wall to the PCB; an insulating material disposed on the top wall of the shield can; a first connector disposed on the first conductive pad of the PCB and electrically connected to the first conductive pad of the PCB; a second connector disposed on the second conductive pad of the PCB and electrically connected to the second conductive pad of the PCB; and a conductive line electrically separated from the shield can. The conductive line may comprise a first portion attached to the insulating material; a second portion extending from a first end of the first portion to the first connector along a first side of the side wall and electrically connected to the first conductive pad through the first connector; and may include a third portion extending from the second end of the first portion to the second connector along the second side of the sidewall and electrically connected to the second conductive pad through the second connector. The conductive line may be configured to transmit a signal from the first conductive pad of the PCB to the second conductive pad of the PCB.

[0006] According to one embodiment, an electronic device may include a printed circuit board (PCB) comprising a first conductive pad and a second conductive pad; a shield can comprising a top wall and a side wall extending from the top wall to the PCB. The side wall of the shield can may include a first portion disposed on the PCB; a second portion disposed on the PCB and separated from the first portion of the side wall; a third portion disposed on the PCB; and a fourth portion disposed on the PCB and separated from the third portion of the side wall. The electronic device may include an insulating material attached to the top wall of the shield can; and a conductive line. The conductive line may include a first portion located between the first portion of the side wall and the second portion of the side wall, spaced apart from the first portion of the side wall and the second portion of the side wall, and electrically connected to the first conductive pad of the PCB; It may include a second part positioned between the third part of the side wall and the fourth part of the side wall, spaced apart from the third part of the side wall and the fourth part of the side wall, and electrically connected to the second conductive pad of the PCB; and a third part attached to the insulating material so as to be spaced apart from the top wall of the shield can, and connecting the first part of the conductive line to the second part of the conductive line. The conductive line may be configured to transmit a signal from the first conductive pad of the PCB to the second conductive pad of the PCB.

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0009] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0010] FIGS. 3a and FIGS. 3b show a printed circuit board of an electronic device according to one embodiment.

[0011] FIG. 3c is an exploded view of a conductive bar attached to a shield can according to one embodiment.

[0012] FIG. 3d is an enlarged view showing a first portion of a conductive bar according to one embodiment.

[0013] FIG. 3e is an enlarged view showing a second portion of a conductive bar according to one embodiment.

[0014] Figure 4 shows a printed circuit board of an electronic device according to a comparative example.

[0015] FIG. 5a shows a printed circuit board of an electronic device according to one embodiment.

[0016] FIG. 5b is an exploded view of a conductive bar attached to a shield can according to one embodiment.

[0017] FIG. 5c is an enlarged view showing a first portion of a conductive bar according to one embodiment.

[0018] FIG. 5d is an enlarged view showing a second portion of a conductive bar according to one embodiment.

[0019] FIG. 6 is a drawing showing a printed circuit board of an electronic device and a speaker adjacent to the printed circuit board according to one embodiment.

[0020] FIG. 7a shows a printed circuit board of an electronic device according to one embodiment.

[0021] FIG. 7b is a cross-sectional view along line 7B-7B' of FIG. 7a.

[0022] FIG. 8a shows a printed circuit board of an electronic device according to one embodiment.

[0023] FIG. 8b is a cross-sectional view along line 8B-8B' of FIG. 8a.

[0024] FIG. 9a is a drawing showing a printed circuit board assembly according to one embodiment.

[0025] Figure 9b is an enlarged view of the area (R) of Figure 9a.

[0026] FIG. 10 shows a printed circuit board of an electronic device according to one embodiment.

[0027] FIGS. 11a and FIGS. 11b show a printed circuit board of an electronic device according to one embodiment.

[0028] FIG. 12a is a drawing showing a printed circuit board of an electronic device according to one embodiment.

[0029] FIG. 12b is a cross-sectional view along line 12B-12B' of FIG. 12a.

[0030] FIG. 13a is a drawing showing a printed circuit board of an electronic device according to one embodiment.

[0031] FIG. 13b is a cross-sectional view along line 13B-13B'-13B'' of FIG. 13a.

[0032] Identical or similar components in the drawings may be assigned the same reference numerals. Descriptions of components having the same reference numeral may be applied identically or in a corresponding manner when referring to different drawings, unless otherwise noted, and redundant descriptions of components having the same reference numeral may not be repeated. In the following descriptions referring to specific drawings, reference numerals from other drawings may be referenced.

[0033] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0035] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0036] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0037] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0041] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0042] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0043] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0047] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0049] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0052] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0054] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2a is a drawing illustrating an exemplary electronic device according to one embodiment. Referring to FIG. 2a, the electronic device (200) according to one embodiment may include a housing (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0057] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0058] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials.

[0059] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0060] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0061] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0062] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0063] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0064] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being able to overlap with the screen display area (201A). For example, the sensing area (201B) may mean an area capable of displaying visual information by the display (201) as well as acquiring the user's biometric information (e.g., fingerprint), similar to other areas of the screen display area (201A). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0065] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0066] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0067] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0068] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part of the third surface (200C) and a second microphone hole (204) formed in a part of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0069] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0070] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0071] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0072] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0073] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0074] In one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0075] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0076] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0077] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0078] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0079] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0080] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment. Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., side bezel structure (218) of FIG. 2a), a first printed circuit board (250), a second printed circuit board (252), and a battery (270) (e.g., battery (189) of FIG. 1).

[0081] In one embodiment, the frame structure (or frame) (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be placed. The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0082] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of a metal and / or a polymer.

[0083] The frame structure (240) (or the first part (241) of the frame structure (240)) may be referred to as a lateral member or lateral structure in that it forms the side of the electronic device (200). The frame structure (240) (or the second part (243) of the frame structure (240)) may be referred to as a support member, support structure, or bracket in that it supports various parts of the electronic device (200).

[0084] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may each be coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly positioned on the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned on the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0085] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0086] In one embodiment, the front plate (202) may be combined with the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0087] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0088] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0089] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0090] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., front (200A) of FIG. 2a).

[0091] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) through a connecting member (e.g., connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0092] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

[0093] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). In other words, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0094] FIGS. 3a and FIGS. 3b show a printed circuit board of an electronic device according to one embodiment.

[0095] Referring to FIGS. 3a and 3b, an electronic device (e.g., the electronic device (200) of FIG. 2b, hereinafter the electronic device (200)) according to one embodiment may include a printed circuit board (390). The printed circuit board (390) may be, for example, an example of the first printed circuit board (250) or the second printed circuit board (252) of FIG. 2b.

[0096] In one embodiment, the electronic device (200) may include an electronic component (392), a connector (394), and a shield can (340), each disposed on a printed circuit board (390). For example, the printed circuit board (390) may include a first surface and a second surface opposite to the first surface. For example, the electronic component (392), the connector (394), and the shield can (340) may each be disposed on the first surface of the printed circuit board (390). Alternatively, any one or both of the electronic component (392), the connector (394), and the shield can (340) may be disposed on the first surface of the printed circuit board (390), and the remainder may be disposed on the second surface of the printed circuit board (390). For example, the shield can (340) may be located between the electronic component (392) and the connector (394). For example, when the printed circuit board (390) is viewed from above (or projected), the shield can (340) may be located between the electronic component (392) and the connector (394).

[0097] The electronic component (392) may be, for example, a component with a relatively high power consumption among the electronic components of the electronic device (200), without limitation. For example, the electronic component (392) may include an LED module or a flash LED module of the electronic device (200) (e.g., the flash (213) of FIG. 2b). For example, the electronic component (392) may include a wireless communication module such as a WiFi module or an RF PAM (radio frequency power amplifier module) (e.g., the wireless communication module (192) of FIG. 1).

[0098] A battery of an electronic device (200), for example (e.g., battery (270) of FIG. 2b), can be electrically connected to the connector (394). For example, the battery, the connector (394), and the printed circuit board (390) can be electrically connected to each other by the connector of the battery being coupled to the connector (394).

[0099] According to one embodiment, the electronic device (200) may include a conductive bar (310) attached to a shield can (340) (e.g., through an insulating material (370) of FIG. 3c). The conductive bar (310) may be formed of an electrically conductive material. For example, but not limited to, the conductive bar (310) may be formed of a metal such as stainless steel.

[0100] In one embodiment, the conductive bar (310) may be insulated from the shield can (340). For example, the conductive bar (310) may be electrically disconnected from the shield can (340). For example, the conductive bar (310) may be spaced apart from the shield can (340) so as to be electrically separated from the shield can (340). For example, the conductive bar (310) may be spaced apart from the shield can (340) through an insulating material (e.g., the insulating material (370) of FIG. 3c and / or air).

[0101] The conductive bar (310) can be electrically connected to a printed circuit board (390). For example, a first end of the conductive bar (310) (e.g., the first part (311) in FIG. 3c) can be electrically connected to a first conductive pad (e.g., the first conductive pad (1198-1) in FIG. 11a) of the printed circuit board (390), and a second end of the conductive bar (310) (e.g., the second part (312) in FIG. 3c) can be electrically connected to a second conductive pad (e.g., the second conductive pad (1198-2) in FIG. 11a) of the printed circuit board (390).

[0102] In one embodiment, the conductive bar (310) may extend from the first conductive pad of the printed circuit board (390) across the shield can (340) from above to the second conductive pad of the printed circuit board (390). For example, the conductive bar (310) may extend from the first conductive pad of the printed circuit board (390) across the top surface (350A) of the shield can (340) from above to the second conductive pad of the printed circuit board (390). The top surface (350A) of the shield can (340) may face in the same direction as, for example, the surface of the printed circuit board (390) on which the shield can (340) is placed (e.g., the first surface or the second surface of the printed circuit board (390)).

[0103] In one embodiment, the conductive bar (310) may be configured to transmit a signal from the first conductive pad of the printed circuit board (390) to the second conductive pad of the printed circuit board (390). For example, the signal transmitted through the conductive bar (310) may include electricity, power, an electrical signal, a power signal, and / or an RF signal. For example, the second conductive pad of the printed circuit board (390) to which the conductive bar (310) is electrically connected may be electrically connected to an electronic component (392). Although not illustrated, the electronic device (200) may include a power management circuit (e.g., the power management module (188) of FIG. 1) disposed on the printed circuit board (390) and electrically connected to the battery through a connector (394). The power management circuit may be configured to transmit a power signal based on power supplied from the battery to a conductive bar (310) (e.g., through the first conductive pad of a printed circuit board (390) to which the conductive bar (310) is electrically connected). The power signal of an electronic component (392) may be transmitted through the conductive bar (310). The conductive bar (310) may be referred to as a connecting member, an electrical connecting member, a conductive pattern, a conductive line, a conductor, a wiring conductor, or wiring.

[0104] In one embodiment, various electronic components of an electronic device (200) may be located inside the shield can (340). The shield can (340) can protect the electronic components inside.

[0105] Additionally, the shield can (340) can provide EMI shielding for the electronic components inside. For example, the shield can (340) may be formed of an electrically conductive material (e.g., metal). The shield can (340) may be electrically connected to one or more third conductive pads of the printed circuit board (390) (e.g., a plurality of third conductive pads (1096) of FIG. 10). For example, the shield can (340) may be electrically connected to the one or more third conductive pads of the printed circuit board (390) by soldering to the one or more third conductive pads of the printed circuit board (390). For example, the shield can (340) may be electrically connected to the one or more third conductive pads of the printed circuit board (390) by being fastened to one or more connectors (e.g., clips) each attached to the one or more third conductive pads of the printed circuit board (390). The shield can (340) may be electrically connected to the ground of the printed circuit board (390) and / or the electronic device (200) through the one or more third conductive pads of the printed circuit board (390). The one or more third conductive pads of the printed circuit board (390) to which the shield can (340) is attached may be spaced apart from the first and second conductive pads of the printed circuit board (390) that are electrically connected to the conductive bar (310).

[0106] FIG. 3c is an exploded view of a conductive bar attached to a shield can according to one embodiment. FIG. 3d is an enlarged view showing a first portion of a conductive bar according to one embodiment. FIG. 3e is an enlarged view showing a second portion of a conductive bar according to one embodiment.

[0107] Referring to FIG. 3c, according to one embodiment, a shield can (340) may include a side wall (360) disposed on a printed circuit board (390) and a top wall (350) disposed on the side wall (360). For example, the side wall (360) may extend from the top wall (350) (or an edge portion of the top wall (350)) to the printed circuit board (390). For example, the top wall (350) may be disposed on the side wall (360) to cover an internal space defined by the side wall (360).

[0108] In one embodiment, the shield can (340) may include stepped portions forming a recess (or trench) (355). The stepped portions of the shield can (340) may include, for example, a horizontal portion (353), a first vertical portion (351) extending from one side of the horizontal portion (353), and a second vertical portion (352) extending from the other side of the horizontal portion (353). The stepped portions of the shield can (340) (e.g., portions (351, 352, and 353)) may be included in the top wall (350) of the shield can (340). For example, the recess (355) may be formed on the top surface (350A) of the shield can (340) (or top wall (350)). The horizontal portion (353) and the vertical portions (351 and 352) may be referred to as the floor portion (353) and the wall portions (351 and 352) defining the recess (355).

[0109] An electronic device (200) according to one embodiment may include an insulating material (370) disposed between a shield can (340) and a conductive bar (310). The insulating material (370) may be formed of and / or include a material having electrical insulating properties.

[0110] The insulating material (370) may be attached, for example, to a shield can (340) and a conductive bar (310). For example, the conductive bar (310) may be attached to the shield can (340) through the insulating material (370). For example, the conductive bar (310) may be attached to the insulating material (370) so as to be spaced apart from the shield can (340). The insulating material (370) may be formed to have adhesive properties. For example, the insulating material (370) may be formed from an adhesive material or an insulating adhesive material and / or may comprise the same. For example, the insulating material (370) may comprise an insulating tape. The insulating material (370) may be referred to as an adhesive material, an adhesive, an insulating adhesive material, or an insulating adhesive.

[0111] According to one embodiment, the conductive bar (310) may include a first part (311), a second part (312), and a third part (313) connecting the first part (311) to the second part (312).

[0112] Referring to FIG. 3c and FIG. 3d, in one embodiment, the insulating material (370) may be located within the recess (355) of the shield can (340). For example, the insulating material (370) may be placed (or attached) on the horizontal portion (353) defining the recess (355) of the shield can (340).

[0113] In one embodiment, a third portion (313) of the conductive bar (310) may be placed (or attached) on an insulating material (370). The third portion (313) of the conductive bar (310) may be located within a recess (355) of the shield can (340). For example, the third portion (313) of the conductive bar (310) may be located between a first vertical portion (351) and a second vertical portion (352) that define the recess (355).

[0114] In one embodiment, the third portion (313) of the conductive bar (310) may be separated from the shield can (340). For example, the third portion (313) of the conductive bar (310) may be separated from the horizontal portion (353) of the shield can (340) through an insulating material (370). For example, the third portion (313) of the conductive bar (310) may be separated from the first vertical portion (351) and the second vertical portion (352) of the shield can (340) through an insulating material (e.g., air). Accordingly, the third portion (313) of the conductive bar (310) may be electrically separated from the shield can (340).

[0115] In one embodiment, a first portion (311) of the conductive bar (310) may extend from a first end portion of a third portion (313) to a printed circuit board (390). For example, the first portion (311) of the conductive bar (310) may be connected from the first end portion of the third portion (313) to a first conductive pad of the printed circuit board (390). For example, the first portion (311) of the conductive bar (310) may be coupled to the first conductive pad of the printed circuit board (390) (e.g., by soldering). Accordingly, the first portion (311) of the conductive bar (310) may be attached to and electrically connected to the first conductive pad of the printed circuit board (390).

[0116] In one embodiment, the side wall (360) of the shield can (340) may include a first portion (361) and a second portion (362) spaced apart from the first portion (361). For example, the first portion (361) of the side wall (360) may be separated from the second portion (362) of the side wall (360). For example, the side wall (360) of the shield can (340) may include a first opening (365-1) between the first portion (361) and the second portion (362).

[0117] In one embodiment, the first portion (311) of the conductive bar (310) may be located between the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360). For example, the first portion (311) of the conductive bar (310) may be located within the first opening (365-1) between the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360). For example, but not limited to, the first portion (311) of the conductive bar (310) may be substantially parallel to the first portion (361) of the side wall (360) and / or the second portion (362) of the side wall (360).

[0118] In one embodiment, the first portion (311) of the conductive bar (310) may be spaced apart from the shield can (340). For example, the first portion (311) of the conductive bar (310) may be spaced apart from the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360). For example, the first portion (311) of the conductive bar (310) may be spaced apart from the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360) through an insulating material (e.g., air). Accordingly, the first portion (311) of the conductive bar (310) may be electrically insulated from the shield can (340).

[0119] Referring to FIG. 3e, in one embodiment, a second portion (312) of the conductive bar (310) may extend from a second end portion (e.g., opposite to the first end portion of the third portion (313)) to a printed circuit board (390). For example, the second portion (312) of the conductive bar (310) may be connected from the second end portion of the third portion (313) to a second conductive pad on the printed circuit board (390). For example, the second portion (312) of the conductive bar (310) may be coupled to the second conductive pad on the printed circuit board (390) (e.g., by soldering). Accordingly, the second portion (312) of the conductive bar (310) may be attached to and electrically connected to the second conductive pad on the printed circuit board (390).

[0120] In one embodiment, the side wall (360) of the shield can (340) may include a third portion (363) and a fourth portion (364) spaced apart from the third portion (363). For example, the third portion (363) of the side wall (360) may be separated from the fourth portion (364) of the side wall (360). For example, the side wall (360) of the shield can (340) may include a second opening (365-2) between the third portion (363) and the fourth portion (364).

[0121] In one embodiment, the second portion (312) of the conductive bar (310) may be located between the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360). For example, the second portion (312) of the conductive bar (310) may be located within the second opening (365-2) between the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360). For example, but not limited to, the second portion (312) of the conductive bar (310) may be substantially parallel to the third portion (363) of the side wall (360) and / or the fourth portion (364) of the side wall (360).

[0122] In one embodiment, the second portion (312) of the conductive bar (310) may be spaced apart from the shield can (340). For example, the second portion (312) of the conductive bar (310) may be spaced apart from the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360). For example, the second portion (312) of the conductive bar (310) may be spaced apart from the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360) through an insulating material (e.g., air). Accordingly, the second portion (312) of the conductive bar (310) may be electrically insulated from the shield can (340).

[0123] Figure 4 shows a printed circuit board of an electronic device according to a comparative example.

[0124] Referring to FIG. 4, an electronic device according to a comparative example may include a printed circuit board (490). An electronic component (392) and a connector (394) may be disposed on the printed circuit board (490). Additionally, an electrical path (421) for supplying power to the electronic component (392) may be formed on the printed circuit board (490). The electrical path (421) may extend between the connector (394) and the electronic component (392) to separate a first region (401) and a second region (402) of the printed circuit board (490). Accordingly, the degree of freedom in the wiring design of the printed circuit board (490) may be reduced.

[0125] As the functionality of electronic devices becomes increasingly advanced and the number of components mounted on the printed circuit board (490) increases, the implementation of many wirings within the limited area of ​​the printed circuit board (490) is required. However, due to the electrical path (421) which reduces the degree of freedom in wiring design of the printed circuit board (490) of the comparative example, bypass wiring that wastes the area of ​​the printed circuit board (490) may occur. As a result, it may be difficult to comply with the layout guide (e.g., wiring width and spacing with other wirings) to provide optimal performance for each component mounted on the printed circuit board (490), and consequently, the performance of the components mounted on the printed circuit board (490) may deteriorate.

[0126] Referring to FIG. 3a together with FIG. 4, according to one embodiment, the electrical path (421) of the printed circuit board (490) of the comparative example is replaced with a conductive bar (310) on the shield can (340), thereby expanding the wiring area of ​​the printed circuit board (390) of the electronic device (200) and improving the degree of freedom in the wiring design of the printed circuit board (390).

[0127] FIG. 5a shows a printed circuit board of an electronic device according to one embodiment. FIG. 5b is an exploded view of a conductive bar attached to a shield can according to one embodiment. FIG. 5c is an enlarged view showing a first portion of a conductive bar according to one embodiment. FIG. 5d is an enlarged view showing a second portion of a conductive bar according to one embodiment.

[0128] Referring to FIGS. 5a and 5b, an electronic device (200) according to one embodiment may include a conductive bar (510), an insulating material (570), and a shield can (540). For the conductive bar (510), the insulating material (570), and the shield can (540), the description provided with reference to the aforementioned conductive bar (310), the insulating material (370), and the shield can (340) may be applied substantially the same, similarly, or in a corresponding manner, respectively.

[0129] For example, referring to FIG. 5b, the shield can (540) may include a top wall (550) (e.g., top wall (350)) forming the top surface (550A) (e.g., top surface (350A)) of the shield can (540) and a side wall (560) (e.g., side wall (360)) extending from the edge portion of the top wall (550) to the printed circuit board (390). The top wall (550) may have a recess (555) (e.g., recess (355)) formed by a horizontal portion (553) (e.g., horizontal portion (353)) and vertical portions (551 and 552) (e.g., vertical portions (351 and 352)) on both sides of the horizontal portion (553). The conductive bar (510) may include a first part (511) (e.g., first part (311)), a second part (512) (e.g., second part (312)), and a third part (513) (e.g., third part (313)) connecting the first part (511) and the second part (512). An insulating material (570) may be attached to a horizontal part (553) so as to be located within a recess (555), and the third part (513) of the conductive bar (510) may be attached to the insulating material (570) so as to be spaced apart from the shield can (540). The conductive bar (510) attached to the insulating material (570) may be located within the recess (555) of the shield can (540). The conductive bar (510) may be electrically insulated from the shield can (540).

[0130] For example, referring to FIGS. 5c and FIGS. 5d, the conductive bar (510) may be electrically connected to the printed circuit board (390). For example, a first portion (511) of the conductive bar (510) may be electrically connected to a fourth conductive pad of the printed circuit board (390) (e.g., the first conductive pad (1198-1) of FIG. 11a), and a second portion (512) of the conductive bar (510) may be electrically connected to a fifth conductive pad of the printed circuit board (390) (e.g., the second conductive pad (1198-2) of FIG. 11a). The conductive bar (510) may be configured to transmit a signal (or electrical signal) from the fourth conductive pad of the printed circuit board (390) to the fifth conductive pad of the printed circuit board (390). The current flowing through the conductive bar (510) can generate a magnetic field. The magnetic field generated from the conductive bar (510) can be configured to cancel out other magnetic fields that may affect the performance of other electronic components. This will be described later with reference to FIG. 6.

[0131] For example, the side wall (560) may include a first part (561) (e.g., first part (361)) and a second part (562) (e.g., second part (362)) spaced apart from the first part (561) through a first opening (565-1) (e.g., first opening (365-1)). Additionally, the side wall (560) may include a third part (563) (e.g., third part (363)) and a fourth part (564) (e.g., fourth part (364)) spaced apart from the third part (563) through a second opening (565-2) (e.g., second opening (365-2)).

[0132] For example, the first portion (511) of the conductive bar (510) may be located within the first opening (565-1) between the first portion (561) of the side wall (560) and the second portion (562) of the side wall (560) so as to be spaced apart from the shield can (540). For example, the second portion (512) of the conductive bar (510) may be located within the second opening (565-2) between the third portion (563) of the side wall (560) and the fourth portion (564) of the side wall (560) so as to be spaced apart from the shield can (540).

[0133] FIG. 6 is a drawing showing a printed circuit board of an electronic device and a speaker adjacent to the printed circuit board according to one embodiment.

[0134] Referring to FIG. 6, according to one embodiment, the electronic device (200) may include a speaker (or speaker module) (696) adjacent to an edge portion (692) of a printed circuit board (390). A conductive bar (510) may be substantially parallel to the edge portion (692) of the printed circuit board (390).

[0135] A return current (C1) adjacent to the speaker (696) can flow through the printed circuit board (390). For example, the return current (C1) can flow through a conductive layer (e.g., a ground layer) of the printed circuit board (390). The return current (C1) can generate a magnetic field (H1). Due to the magnetic field (H1), noise may be generated in the speaker (696), which includes a magnet and a coil.

[0136] Through the conductive bar (510), a current (C2) in the opposite direction to the return current (C1) can flow. The current (C2) flowing in the opposite direction to the return current (C1) can generate a magnetic field (H2) that cancels out the magnetic field (H1) caused by the return current (C1). Accordingly, the performance degradation of the speaker (696) caused by the magnetic field (H1) can be reduced and / or prevented. The speaker (696) may be referred to as an electronic component including a magnet and / or a coil.

[0137] Referring to FIG. 4 in conjunction with FIG. 6, an electronic device according to a comparative example may include electrical paths (422 and 423) of a printed circuit board (490). The electrical paths (422 and 423) may include redundant paths to offset the magnetic field (H1) caused by a return current (C1), regardless of their original use, such as signal transmission. Accordingly, an area of ​​the printed circuit board (490) may be unnecessarily wasted. In contrast, according to one embodiment, the electrical paths (422 and 423) of the comparative example are replaced by a conductive bar (510) on a shield can (540), thereby expanding the wiring area of ​​the printed circuit board (390) of the electronic device (200) and improving the degree of freedom in the wiring design of the printed circuit board (390).

[0138] FIG. 7a shows a printed circuit board of an electronic device according to one embodiment. FIG. 7b is a cross-sectional view along line 7B-7B' of FIG. 7a.

[0139] Referring to FIGS. 7a and 7b, according to one embodiment, an electronic device (200) may include a conductive bar (710), an insulating material (770), and a shield can (740).

[0140] The conductive bar (710) may be an example of the aforementioned conductive bar (310) or conductive bar (510). For example, the conductive bar (710) may include a first part (711) (e.g., first parts (311 or 511)), a second part (712) (e.g., second parts (312 or 512)), and a third part (713) (e.g., third parts (313 or 513)).

[0141] The shield can (740) may be an example of the aforementioned shield can (340) or shield can (540). For example, the shield can (740) may include a top wall (750) (e.g., top walls (350 or 550)) and a side wall (760) (e.g., side walls (360 or 560)). For example, the side wall (760) may include a first part (761) (e.g., first parts (361 or 561)), a second part (762) (e.g., second parts (362 or 562)), a third part (763) (e.g., third parts (363 or 563)), and a fourth part (764) (e.g., fourth parts (364 or 564)). The insulating material (770) may be an example of the insulating material (370) or insulating material (570) described above.

[0142] In the previous drawings, the first portions (311 and 511) of the conductive bars (310 and 510) were described as being electrically connected to the printed circuit board (390) through soldering, but are not limited thereto.

[0143] For example, the electronic device (200) may include a first connector (781). The first connector (781) may be placed on a printed circuit board (390). For example, the first connector (781) may be attached to a conductive pad (e.g., the first conductive pad or the fourth conductive pad) of the printed circuit board (390) (e.g., via soldering). A first portion (711) of the conductive bar (710) may extend from a third portion (713) of the conductive bar (710) toward the printed circuit board (390) (e.g., to the first connector (781). The first portion (711) of the conductive bar (710) may be electrically connected to the conductive pad of the printed circuit board (390) through the first connector (781). For example, a first portion (711) of the conductive bar (710) may be connected to a first connector (781) and, through connection with the first connector (781), may be electrically connected to the conductive pad of the printed circuit board (390). The first connector (781) may include a clip configured to be connected to, for example, the first portion (711) of the conductive bar (710).

[0144] For example, the first connector (781) may be located between the first part (761) of the side wall (760) and the second part (762) of the side wall (760), and may be spaced apart from the first part (761) of the side wall (760) and the second part (762) of the side wall (760).

[0145] The description of the first part (711) of the conductive bar (710) described above may be applied in a corresponding manner to the second part (712) of the conductive bar (710) opposite to the first part (711).

[0146] For example, the electronic device (200) may include a second connector (782). The second connector (782) may be placed on a printed circuit board (390). For example, the second connector (782) may be attached to another conductive pad (e.g., the second conductive pad or the fifth conductive pad) of the printed circuit board (390) (e.g., via soldering). A second portion (712) of the conductive bar (710) may extend from a third portion (713) of the conductive bar (710) toward the printed circuit board (390) (e.g., to the second connector (782). The second portion (712) of the conductive bar (710) may be electrically connected to the other conductive pad of the printed circuit board (390) through the second connector (782). For example, a second portion (712) of the conductive bar (710) may be connected to a second connector (782) and, through connection with the second connector (782), may be electrically connected to the other conductive pad of the printed circuit board (390). The second connector (782) may include a clip configured to be connected to, for example, the second portion (712) of the conductive bar (710).

[0147] For example, the second connector (782) may be located between the third part (763) of the side wall (760) and the fourth part (764) of the side wall (760), and may be spaced apart from the third part (763) of the side wall (760) and the fourth part (764) of the side wall (760).

[0148] FIG. 8a shows a printed circuit board of an electronic device according to one embodiment. FIG. 8b is a cross-sectional view along line 8B-8B' of FIG. 8a.

[0149] Referring to FIG. 8a and FIG. 8b, according to one embodiment, an electronic device (200) may include a conductive bar (810), an insulating material (870), a shield can (840), a first connector (881), and a second connector (882).

[0150] The conductive bar (810) may be an example of the aforementioned conductive bar (310), conductive bar (510), or conductive bar (710). For example, the conductive bar (810) may include a first part (811) (e.g., first parts (311, 511, or 711)), a second part (812) (e.g., second parts (312, 512, or 712)), and a third part (813) (e.g., third parts (313, 513, or 713)).

[0151] The shield can (840) may be an example of the aforementioned shield can (340), shield can (540), or shield can (740). For example, the shield can (840) may include a top wall (850) (e.g., top walls (350, 550, or 750)) and a side wall (860) (e.g., side walls (360, 560, or 760)). For example, the side wall (860) may include a first part (861) (e.g., first parts (361, 561, or 761)), a second part (862) (e.g., second parts (362, 562, or 762)), a third part (863) (e.g., third parts (363, 563, or 763)), and a fourth part (864) (e.g., fourth parts (364, 564, or 764)).

[0152] The insulating material (870) may be an example of the aforementioned insulating material (370), insulating material (570), or insulating material (770). The first connector (881) may be an example of the aforementioned first connector (781). The second connector (882) may be an example of the aforementioned second connector (782).

[0153] In the previous drawings, the first portions (361, 561, or 761) of the side walls (360, 560, or 760) were described as being separated from the second portions (362, 562, or 762), but are not limited thereto. Also, between the first portions (361, 561, or 761) of the side walls (360, 560, or 760) and the second portions (362, 562, or 762), the first portions (311, 511, or 711) of the conductive bars (310, 510, or 710) and the first connector (781) were described as being located, but are not limited thereto.

[0154] For example, the side wall (860) of the shield can (840) may further include a portion (866) that extends from a portion of the top wall (850) of the shield can (840) to the printed circuit board (390) and connects a first portion (861) of the side wall (860) and a second portion (862) of the side wall (860). By the portion (866), an opening (e.g., first openings (365-1 or 565-1)) between the first portion (861) of the side wall (860) and the second portion (862) of the side wall (860) may be closed. If the portion (866) of the side wall (860) comes into contact with the printed circuit board (390), optionally, the portion (866) of the side wall (860) may be soldered to the printed circuit board (390). If the portion (866) of the side wall (860) is not soldered to the printed circuit board (390), the shorting of the shield can (840) to the conductive bar (810) and / or the first connector (881) due to an overflow of solder during the soldering of the portion (866) of the side wall (860) can be reduced and / or prevented.

[0155] Alternatively, a portion (866) of the side wall (860) may be spaced apart from the surface of the printed circuit board (390) so that the opening between the first portion (861) and the second portion (862) of the side wall (860) is partially closed.

[0156] If the side wall (860) of the shield can (840) includes a portion (866), referring to FIG. 8b, the insulating material (870) may include a portion (873) disposed between the top wall (850) of the shield can (840) and a third portion (813) of the conductive bar (810), such as the insulating materials (370, 570, or 770). Additionally, the insulating material (870) may further include a portion (871) connected to one side of the portion (873) and disposed between the portion (866) of the side wall (860) of the shield can (840) and a first portion (811) of the conductive bar (810). The portion (871) of the insulating material (870) may be attached to the portion (866) of the side wall (860). A first portion (811) of the conductive bar (810) may be attached to a portion (871) of the insulating material (870) so as to be spaced apart from the shield can (840). An end of the first portion (811) of the conductive bar (810) facing the printed circuit board (390) may be spaced apart from the printed circuit board (390).

[0157] If the side wall (860) of the shield can (840) includes a portion (866), the first connector (881) may be located outside the side wall (860) of the shield can (840). For example, a first portion (811) of the conductive bar (810) may be located between the first connector (881) and the portion (866) of the side wall (860).

[0158] Unlike the first connector (781) described above, which is connected to the first portion (711) of the conductive bar (710), the first connector (881) can electrically connect the conductive pad of the printed circuit board (390) to which the first connector (881) is attached to the conductive bar (810) by contacting the first portion (811) of the conductive bar (810). For example, the first connector (881) may include a C-clip, an elastic contact, a spring contact, or a spring connector.

[0159] A first portion (811) of the conductive bar (810) may be pressed by a first connector (881). The first portion (811) of the conductive bar (810) pressed by the first connector (881) may be supported by a portion (866) of the side wall (860) of the shield can (840). Accordingly, the reliability of the electrical connection (or contact therefor) between the first connector (881) and the first portion (811) of the conductive bar (810) may be improved.

[0160] The description of the first part (811) of the conductive bar (810) described above may be applied in a corresponding manner to the second part (812) of the conductive bar (810) opposite to the first part (811).

[0161] For example, referring to FIG. 8a and FIG. 8b, the side wall (860) of the shield can (840) may further include a portion (867) that extends from another portion of the top wall (850) of the shield can (840) to the printed circuit board (390) and connects a third portion (863) of the side wall (860) and a fourth portion (864) of the side wall (860). By the portion (867), an opening (e.g., second openings (365-2 or 565-2)) between the third portion (863) of the side wall (860) and the fourth portion (864) of the side wall (860) may be closed. When a portion (867) of the side wall (860) comes into contact with the printed circuit board (390), optionally, the portion (867) of the side wall (860) may be soldered to the printed circuit board (390). When the portion (867) of the side wall (860) is not soldered to the printed circuit board (390), shorting of the shield can (840) to the conductive bar (810) and / or the second connector (882) due to an overflow of solder during soldering of the portion (867) of the side wall (860) may be reduced and / or prevented.

[0162] Alternatively, a portion (867) of the side wall (860) may be spaced apart from the surface of the printed circuit board (390) so that the opening between the third portion (863) and the fourth portion (864) of the side wall (860) is partially closed.

[0163] If the side wall (860) of the shield can (840) includes a portion (867), referring to FIG. 8b, the insulating material (870) may further include a portion (872) connected to the other side of the portion (873) and positioned between the portion (867) of the side wall (860) of the shield can (840) and the second portion (812) of the conductive bar (810). The portion (872) of the insulating material (870) may be attached to the portion (867) of the side wall (860). The second portion (812) of the conductive bar (810) may be attached to the portion (872) of the insulating material (870) so as to be spaced apart from the shield can (840). The end of the second portion (812) of the conductive bar (810) facing the printed circuit board (390) can be spaced apart from the printed circuit board (390).

[0164] If the side wall (860) of the shield can (840) includes a portion (867), the second connector (882) may be located outside the side wall (860) of the shield can (840). For example, a second portion (812) of the conductive bar (810) may be located between the second connector (882) and the portion (867) of the side wall (860).

[0165] Unlike the aforementioned second connector (782) which is connected to the second portion (712) of the conductive bar (710), the second connector (882) can electrically connect the other conductive pad of the printed circuit board (390) to which the second connector (882) is attached to the conductive bar (810) by contacting the second portion (812) of the conductive bar (810). For example, the second connector (882) may include a C-clip, an elastic contact, a spring contact, or a spring connector.

[0166] The second portion (812) of the conductive bar (810) may be pressed by the second connector (882). The second portion (812) of the conductive bar (810) pressed by the second connector (882) may be supported by the portion (867) of the side wall (860) of the shield can (840). Accordingly, the reliability of the electrical connection (or contact therefor) between the second connector (882) and the second portion (812) of the conductive bar (810) may be improved.

[0167] FIG. 9a is a drawing showing a printed circuit board assembly according to one embodiment. FIG. 9b is an enlarged view of the area (R) of FIG. 9a.

[0168] Referring to FIG. 9a, an electronic device (200) according to one embodiment may include a printed circuit board assembly (990) (e.g., a printed circuit board (390)). For example, the printed circuit board assembly (990) may include a first printed circuit board (991), a second printed circuit board (992) spaced apart from the first printed circuit board (991), and an interposer (993) interposed between the first printed circuit board (991) and the second printed circuit board (992) to structurally and electrically connect the first printed circuit board (991) and the second printed circuit board (992).

[0169] The first printed circuit board (991) may include a first surface (991A) and a second surface (991B) opposite to the first surface (991A) and facing the second printed circuit board (992). The second printed circuit board (992) may include a first surface (992A) facing the first printed circuit board (991) and a second surface (992B) opposite to the first surface (992A). The interposer (993) may extend from the second surface (991B) of the first printed circuit board (991) to the first surface (992A) of the second printed circuit board (992).

[0170] According to one embodiment, the electronic device (200) may include a first shield can (940-1) and / or a second shield can (940-2). The first shield can (940-1) and the second shield can (940-2) may each be disposed on both sides of a printed circuit board assembly (990). For example, the first shield can (940-1) may be disposed on a first side (991A) of a first printed circuit board (991), and the second shield can (940-2) may be disposed on a second side (992B) of a second printed circuit board (992). The first shield can (940-1) may be an example of the aforementioned shield can (340, 540, 740, or 840). The second shield can (940-2) may be an example of the aforementioned shield can (340, 540, 740, or 840).

[0171] Referring to FIG. 9b, according to one embodiment, an electronic device (200) may include a first conductive bar (910-1) attached to an upper surface (A1) (e.g., upper surfaces (350A or 550A)) of a first shield can (940-1) so as to be spaced apart from the first shield can (940-1). For example, the first conductive bar (910-1) may be attached to the first shield can (940-1) through a first insulating material (970-1). The first conductive bar (910-1) may be an example of the aforementioned conductive bars (310, 510, 710, or 810). The first insulating material (970-1) may be an example of the aforementioned insulating materials (370, 570, 770, or 870).

[0172] In one embodiment, the first insulating material (970-1) and the first conductive bar (910-1) may be located within a recess (955-1) (e.g., recesses (355 or 555)) of the first shield can (940-1).

[0173] In one embodiment, the first conductive bar (910-1) (or the upper surface of the first conductive bar (910-1)) may be located at substantially the same height as the upper surface (A1) of the first shield can (940-1) or below it. For example, the sum of the thickness of the first insulating material (970-1) and the thickness of the portion of the first conductive bar (910-1) attached to the first insulating material (970-1) (e.g., the third portions (313, 513, 713, or 813)) may be substantially equal to or less than the depth of the recess (955-1).

[0174] According to one embodiment, the electronic device (200) may include a second conductive bar (910-2) attached to the top surface (A2) (e.g., top surfaces (350A or 550A)) of the second shield can (940-2) so as to be spaced apart from the second shield can (940-2). For example, the second conductive bar (910-2) may be attached to the second shield can (940-2) through a second insulating material (970-2). The second conductive bar (910-2) may be an example of the aforementioned conductive bars (310, 510, 710, or 810). The second insulating material (970-2) may be an example of the aforementioned insulating materials (370, 570, 770, or 870).

[0175] In one embodiment, the second insulating material (970-2) and the second conductive bar (910-2) may be located within the recess (955-2) (e.g., recesses (355 or 555)) of the second shield can (940-2).

[0176] In one embodiment, the second conductive bar (910-2) (or the upper surface of the second conductive bar (910-2)) may be located at substantially the same height as the upper surface (A2) of the second shield can (940-2) or below it. For example, the sum of the thickness of the second insulating material (970-2) and the thickness of the portion of the second conductive bar (910-2) attached to the second insulating material (970-2) (e.g., the third portions (313, 513, 713, or 813)) may be substantially equal to or less than the depth of the recess (955-2).

[0177] Although not illustrated, an electronic device (200) according to one embodiment may further include a first layer disposed on a first conductive bar (910-1). The first layer may cover the first conductive bar (910-1). The first layer may cover the first conductive bar (910-1) and the recess (955-1) of the first shield can (940-1). The first layer may include at least one of an insulating layer, a shielding layer, a heat dissipation layer, a shield-heat dissipation layer, a shielding film, a waterproof layer, and / or a waterproof coating. The electronic device (200) may include a first heat transfer device thermally connected to the first layer. For example, but not limited to, the first heat transfer device may include a heat pipe or a vapor chamber. For example, the first heat transfer device may be thermally connected to the first layer through a thermal interface material (TIM) disposed between the first layer and the first heat transfer device. For example, heat generated from a printed circuit board assembly (990) (e.g., a component inside the first shield can (940-1)) may be transferred to the first heat transfer device through the first shield can (940-1) (e.g., the first shield can (940-1) and the first conductive bar (910-1)), the first layer, and the TIM.

[0178] Although not illustrated, an electronic device (200) according to one embodiment may further include a second layer disposed on a second conductive bar (910-2). The second layer may cover the second conductive bar (910-2). The second layer may cover the second conductive bar (910-2) and the recess (955-2) of the second shield can (940-2). The second layer may include at least one of an insulating layer, a shielding layer, a heat dissipation layer, a shield-heat dissipation layer, a shielding film, a waterproof layer, and / or a waterproof coating. The electronic device (200) may include a second heat transfer device thermally connected to the second layer. For example, but not limited to, the second heat transfer device may include a heat pipe or a vapor chamber. For example, the second heat transfer device may be thermally connected to the second layer through a TIM disposed between the second layer and the second heat transfer device. For example, heat generated from a printed circuit board assembly (990) (e.g., a component inside the second shield can (940-2)) may be transferred to the second heat transfer device through the second shield can (940-2) (e.g., the second shield can (940-2) and the second conductive bar (910-2)), the second layer, and the TIM.

[0179] FIG. 10 shows a printed circuit board of an electronic device according to one embodiment.

[0180] Referring to FIG. 10, according to one embodiment, an electronic device (200) may include a printed circuit board (1090) (e.g., printed circuit boards (390, 991, or 992)) and a shield can (1040) (e.g., a shield can (340, 540, 740, 840, 940-1, or 940-2)) disposed on the printed circuit board (1090).

[0181] In one embodiment, the printed circuit board (1090) may include a first conductive pad (1098-1), a second conductive pad (1098-2), and a plurality of third conductive pads (1096). Each of the third conductive pads (1096) may be electrically connected to a shield can (1040). The shield can (1040) may be electrically connected to the ground of the printed circuit board (1090) and / or the electronic device (200) through the third conductive pads (1096).

[0182] According to one embodiment, the electronic device (200) may include a first conductive bar (1010-1) (e.g., conductive bars (310, 510, 710, 810, 910-1, or 910-2)) and a second conductive bar (1010-2) (e.g., conductive bars (310, 510, 710, 810, 910-1, or 910-2)).

[0183] In one embodiment, the first conductive bar (1010-1) may be attached to the outer surface of the shield can (1040) so as to be spaced apart from the shield can (1040). For example, at least a portion of the first conductive bar (1010-1) may be attached to the outer surface of the shield can (1040) through a first insulating material (e.g., insulating materials (370, 570, 770, 870, 970-1, or 970-2)). The second conductive bar (1010-2) may be attached to the inner surface of the shield can (1040) opposite to the outer surface so as to be spaced apart from the shield can (1040). For example, at least a portion of the second conductive bar (1010-2) may be attached to the inner surface of the shield can (1040) through a second insulating material (e.g., insulating materials (370, 570, 770, 870, 970-1, or 970-2)). The first conductive bar (1010-1) and the second conductive bar (1010-2) may overlap each other with the shield can (1040) in between.

[0184] In one embodiment, the first ends (e.g., first portions (311, 511, 711, or 811)) of the first conductive bar (1010-1) and the second conductive bar (1010-2) may be electrically connected to the first conductive pad (1098-1) of the printed circuit board (1090).

[0185] In one embodiment, the second ends (e.g., second portions (312, 512, 712, or 812)) of the first conductive bar (1010-1) and the second conductive bar (1010-2) may be electrically connected to the second conductive pad (1098-2) of the printed circuit board (1090). The first conductive bar (1010-1) and the second conductive bar (1010-2) may be configured to transmit a signal from the first conductive pad (1098-1) to the second conductive pad (1098-2).

[0186] FIGS. 11a and FIGS. 11b show a printed circuit board of an electronic device according to one embodiment.

[0187] Referring to FIG. 11a and FIG. 11b, according to one embodiment, a printed circuit board (1090) of an electronic device (200) may include a first conductive pad (1198-1), a second conductive pad (1198-2), a plurality of third conductive pads (1096), a fourth conductive pad (1199-1), and a fifth conductive pad (1199-2).

[0188] In the previous drawings, it was described that one conductive bar (310, 510, 710, 810, 910-1, and 910-2) is respectively disposed on the outer surfaces of the shield cans (340, 540, 740, 840, 940-1, and 940-2), but this is not limited thereto. For example, referring to FIG. 11a, the electronic device (200) may include a plurality of conductive bars attached to the outer surface of the shield can (1040). For example, the electronic device (200) may include a first conductive bar (1110-1) and a second conductive bar (1110-2) respectively attached to the outer surface of the shield can (1040) so as to be spaced apart from the shield can (1040). For example, the first conductive bar (1110-1) and the second conductive bar (1110-2) may be parallel to each other.

[0189] In one embodiment, a first end of the first conductive bar (1110-1) (e.g., first parts (311, 511, 711, or 811)) may be electrically connected to a first conductive pad (1198-1) of a printed circuit board (1090), and a second end of the first conductive bar (1110-1) (e.g., second parts (312, 512, 712, or 812)) may be electrically connected to a second conductive pad (1198-2) of a printed circuit board (1090). The first conductive bar (1110-1) may be configured to transmit a signal from the first conductive pad (1198-1) to the second conductive pad (1198-2).

[0190] In one embodiment, a first end of the second conductive bar (1110-2) (e.g., first parts (311, 511, 711, or 811)) may be electrically connected to a fourth conductive pad (1199-1) of the printed circuit board (1090), and a second end of the second conductive bar (1110-2) (e.g., second parts (312, 512, 712, or 812)) may be electrically connected to a fifth conductive pad (1199-2) of the printed circuit board (1090). The second conductive bar (1110-2) may be configured to transmit a signal from the fourth conductive pad (1199-1) to the fifth conductive pad (1199-2).

[0191] For the first conductive bar (1110-1) and the second conductive bar (1110-2), the description of the conductive bars (310, 510, 710, 810, 910-1, or 910-2) attached to the outer surface of the shield candle, as described above, may be applied to each in a substantially identical or corresponding manner.

[0192] Referring to FIG. 11b, the first conductive bar (1110-1) and the second conductive bar (1110-2) can each be attached to the inner surface of the shield can (1040), unlike FIG. 11a.

[0193] FIG. 12a is a drawing showing a printed circuit board of an electronic device according to one embodiment. FIG. 12b is a cross-sectional view along line 12B-12B' of FIG. 12a.

[0194] Referring to FIG. 12a, the printed circuit board (1090) may include a first conductive pad (1298-1), a second conductive pad (1298-2), a plurality of third conductive pads (1096), a fourth conductive pad (1299-1), and a fifth conductive pad (1299-2).

[0195] According to one embodiment, the electronic device (200) may include a first conductive bar (1210-1) (e.g., conductive bars (310, 510, 710, 810, 910-1, or 910-2)) and a second conductive bar (1210-2) (e.g., conductive bars (310, 510, 710, 810, 910-1, or 910-2)).

[0196] In one embodiment, the first conductive bar (1210-1) may be attached to the outer surface of the shield can (1040) so as to be spaced apart from the shield can (1040). The second conductive bar (1210-2) may be attached to the inner surface of the shield can (1040) so as to be spaced apart from the shield can (1040).

[0197] For example, a first end of the first conductive bar (1210-1) (e.g., first parts (311, 511, 711, or 811)) may be electrically connected to a first conductive pad (1298-1) of the printed circuit board (1090), and a second end of the first conductive bar (1210-1) (e.g., second parts (312, 512, 712, or 812)) may be electrically connected to a second conductive pad (1298-2) of the printed circuit board (1090). The first conductive bar (1210-1) may be configured to transmit a signal from the first conductive pad (1298-1) to the second conductive pad (1298-2).

[0198] For example, a first end of the second conductive bar (1210-2) (e.g., first parts (311, 511, 711, or 811)) may be electrically connected to a fourth conductive pad (1299-1) of the printed circuit board (1090), and a second end of the second conductive bar (1210-2) (e.g., second parts (312, 512, 712, or 812)) may be electrically connected to a fifth conductive pad (1299-2) of the printed circuit board (1090). The second conductive bar (1210-2) may be configured to transmit a signal from the fourth conductive pad (1299-1) to the fifth conductive pad (1299-2).

[0199] Unlike the first conductive bar (1010-1) and the second conductive bar (1010-2) of FIG. 10, which overlap each other over a substantial entire area, the first conductive bar (1210-1) and the second conductive bar (1210-2) may intersect each other.

[0200] Referring to FIG. 12b, according to one embodiment, a shield can (1040) may include an outer surface (1050A) (e.g., top surfaces (350A and 550A)) and an inner surface (1050B) opposite to the outer surface (1050A).

[0201] In one embodiment, at least a portion of the first conductive bar (1210-1) may be attached to the outer surface (1050A) of the shield can (1040) through the first insulating material (1270-1) (e.g., insulating materials (370, 570, 770, 870, 970-1, or 970-2)). The first insulating material (1270-1) and the first conductive bar (1210-1) may be seated within a recess (e.g., recesses (355, 555, 955-1, or 955-2)) formed on the outer surface (1050A) of the shield can (1040).

[0202] In one embodiment, at least a portion of the second conductive bar (1210-2) may be attached to the inner surface (1050B) of the shield can (1040) through the second insulating material (1270-2) (e.g., insulating materials (370, 570, 770, 870, 970-1, or 970-2)). For example, the inner surface (1050B) of the shield can (1040) may include a first area to which the second conductive bar (1210-2) is attached and a second area around the first area. The second area may extend from the first area without substantial step. The second conductive bar (1210-2) attached to the first area may protrude relative to the second area.

[0203] According to one embodiment, the electronic device (200) may further include a layer (1215) attached to the inner surface (1050B) of the shield can (1040) to cover the second conductive bar (1210-2). The layer (1215) may prevent the second conductive bar (1210-2) from coming into direct contact with electronic components inside the shield can (1040). The layer (1215) may include, for example, insulating tape or insulating coating, but is not limited to.

[0204] FIG. 13a is a drawing showing a printed circuit board of an electronic device according to one embodiment. FIG. 13b is a cross-sectional view along line 13B-13B'-13B'' of FIG. 13a.

[0205] Referring to FIG. 13a, the printed circuit board (1090) may include a first conductive pad (1398-1), a second conductive pad (1398-2), a plurality of third conductive pads (1096), a fourth conductive pad (1399-1), and a fifth conductive pad (1399-2).

[0206] According to one embodiment, the electronic device (200) may include a first conductive bar (1310-1) (e.g., conductive bars (310, 510, 710, 810, 910-1, or 910-2)) and a second conductive bar (1310-2) (e.g., conductive bars (310, 510, 710, 810, 910-1, or 910-2)).

[0207] For example, a first end of the first conductive bar (1310-1) (e.g., first parts (311, 511, 711, or 811)) may be electrically connected to a first conductive pad (1398-1) of the printed circuit board (1090), and a second end of the first conductive bar (1310-1) (e.g., second parts (312, 512, 712, or 812)) may be electrically connected to a second conductive pad (1398-2) of the printed circuit board (1090). The first conductive bar (1310-1) may be configured to transmit a signal from the first conductive pad (1398-1) to the second conductive pad (1398-2).

[0208] For example, a first end of the second conductive bar (1310-2) (e.g., first parts (311, 511, 711, or 811)) may be electrically connected to a fourth conductive pad (1399-1) of the printed circuit board (1090), and a second end of the second conductive bar (1310-2) (e.g., second parts (312, 512, 712, or 812)) may be electrically connected to a fifth conductive pad (1399-2) of the printed circuit board (1090). The second conductive bar (1310-2) may be configured to transmit a signal from the fourth conductive pad (1399-1) to the fifth conductive pad (1399-2).

[0209] Unlike in FIG. 12a and FIG. 12b, where the first conductive bar (1210-1) and the second conductive bar (1210-2) are respectively attached to the outer surface (1050A) and inner surface (1050B) of the shield can (1040) so as to intersect each other, as in FIG. 13a, the first conductive bar (1310-1) and the second conductive bar (1310-2) can respectively be attached to the outer surface (1050A) of the shield can (1040) so as to intersect each other.

[0210] Referring to FIG. 13b, in one embodiment, at least a portion of the second conductive bar (1310-2) may be attached to the outer surface (1050A) of the shield can (1040) through the second insulating material (1370-2) (e.g., insulating materials (370, 570, 770, 870, 970-1, or 970-2)).

[0211] In one embodiment, at least a portion of the first conductive bar (1310-1) may be attached to a portion of the second conductive bar (1310-2) and a portion of the outer surface (1050A) of the shield can (1040) through a first insulating material (1370-1) (e.g., insulating materials (370, 570, 770, 870, 970-1, or 970-2)). For example, a portion of the first insulating material (1370-1) may be interposed between a portion of the first conductive bar (1310-1) and said portion of the second conductive bar (1310-2), and another portion of the first insulating material (1370-1) may be interposed between another portion of the first conductive bar (1310-1) and said portion of the outer surface (1050A) of the shield can (1040).

[0212] In one embodiment, a recess (e.g., recesses (355, 555, 955-1, or 955-2)) formed on the outer surface (1050A) of a shield can (1040) may include a first portion (1355-1) and a second portion (1355-2) further recessed from the first portion (1355-1). A second insulating material (1370-2) and a second conductive bar (1310-2) may be seated on the second portion (1355-2) of the recess, and a first insulating material (1370-1) and a first conductive bar (1310-1) may be seated on the first portion (1355-1) and the second conductive bar (1310-2) of the recess.

[0213] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0214] According to one embodiment, an electronic device (101; 200) may include a printed circuit board (PCB) (390; 1090) comprising a first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) and a second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2). The electronic device (101; 200) may include a shield can (340; 540; 740; 840; 940-1; 940-2; 1040) disposed on the PCB (390; 1090). The electronic device (101; 200) may include an insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) attached to the shield can (340; 540; 740; 840; 940-1; 940-2; 1040).The electronic device (101; 200) is attached to the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) and is electrically separated from the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) by being spaced apart from the shield can (340; 540; 740; 840; 940-1; 940-2; 1040), and the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1) of the PCB (390; 1090); A conductive bar (310; 510; 710; 840; 940-1; 940-2; 1040) extending from above across the upper surface of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090); It may include 1310-1; 1310-2). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) extends from the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2) of the PCB (390; 1090); It can be configured to transmit signals to 1398-2; 1399-2).

[0215] In one embodiment, the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a stepped portion. The stepped portion may include a horizontal portion (353; 553) and vertical portions (351; 551; 352; 552) from both sides of the horizontal portion (353; 553). The insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) can be attached to the horizontal portion (353; 553) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040). A portion of the conductive bar (310; 510; 710; 810; 910-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) attached to the insulating material (370; 570; 770; 870; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is the vertical portions (351; 551; 352; 552) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) It can be located in between.

[0216] In one embodiment, the height of the portion of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) may be substantially the same as or lower than the heights of the vertical portions (351; 551; 352; 552) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040).

[0217] In one embodiment, the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a top wall (350; 550; 750; 850) and a side wall (360; 560; 760; 860) extending from the top wall (350; 550; 750; 850) to the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a first portion (361; 561; 761; 861) disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a second part (362; 562; 762; 862) separated from the first part (361; 561; 761; 861) of the side wall (360; 560; 760; 860) which is disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a third portion (363; 563; 763; 863) disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a fourth part (364; 564; 764; 864) disposed on the PCB (390; 1090) and separated from the third part (363; 563; 763; 863) of the side wall (360; 560; 760; 860).The insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) can be attached to the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is located between the first part (361; 561; 761; 861) of the side wall (360; 560; 760; 860) and the second part (362; 562; 762; 862) of the side wall (360; 560; 760; 860), and the first part (361; 561) of the side wall (360; 560; 760; 860); It may include a first part (311; 511; 711; 811) that is spaced apart from the second part (362; 562; 762; 862) of the side wall (360; 560; 760; 860) and is electrically connected to the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090).The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is located between the third part (363; 563; 763; 863) of the side wall (360; 560; 760; 860) and the fourth part (364; 564; 764; 864) of the side wall (360; 560; 760; 860), and the third part (363; 563) of the side wall (360; 560; 760; 860) It may include a second part (312; 512; 712; 812) that is spaced apart from the fourth part (364; 564; 764; 864) of the side wall (360; 560; 760; 860) and electrically connected to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090).The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is spaced apart from the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) Attached, and the first part (311; 511; 711; 811) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is attached to the second part (312) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2; It may include a third part (313; 513; 713; 813) connected to 512; 712; 812).

[0218] In one embodiment, the first end of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) can be soldered to the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090). The second end of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) can be soldered to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090).

[0219] In one embodiment, the electronic device (101; 200) may include an electronic component (213; 392) disposed on the PCB (390; 1090) and electrically connected to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) transmits a power signal of the electronic component (213; 392) from the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2). It can be configured to transmit.

[0220] In one embodiment, the electronic device (101; 200) may include a connector (394) disposed on the PCB (390; 1090). The electronic device (101; 200) may include a battery (270) electrically connected to the connector of the PCB (390; 1090). The shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may be located between the electronic component (213; 392) and the connector (394) of the PCB (390; 1090) when projected from above on the PCB (390; 1090).

[0221] In one embodiment, the electronic component (213; 392) may include a flash light emitting diode module.

[0222] In one embodiment, the PCB (390; 1090) may include one or more third conductive pads (1096) spaced apart from the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) and the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2). The shield can (340; 540; 740; 840; 940-1; 940-2; 1040) can be electrically connected to one or more third conductive pads (1096) of the PCB (390; 1090).

[0223] In one embodiment, the electronic device (101; 200) may include a speaker (696; 155) adjacent to an edge portion (692) of the PCB (390; 1090). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) may include a section substantially parallel to the edge portion (692) of the PCB (390; 1090).

[0224] According to one embodiment, an electronic device (101; 200) may include a printed circuit board (PCB) (390; 1090) comprising a first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) and a second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2). The electronic device (101; 200) may include a shield can (340; 540; 740; 840; 940-1; 940-2; 1040) comprising a top wall (350; 550; 750; 850) and a side wall (360; 560; 760; 860) extending from the top wall (350; 550; 750; 850) to the PCB (390; 1090). The electronic device (101; 200) may include an insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) attached to the top wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040). The electronic device (101; 200) may include a first connector (781; 881) disposed on the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090) and electrically connected to the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090).The electronic device (101; 200) may include a second connector (782; 882) disposed on the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090) and electrically connected to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090). The electronic device (101; 200) may include a conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is positioned around the first side of the side wall (360; 560; 760; 860) so as to be spaced apart from the side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040), and the first conductivity of the PCB (390; 1090) through the first connector (781; 881) It may include a first part (311; 511; 711; 811) electrically connected to a pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1).The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is positioned around the second side of the side wall (360; 560; 760; 860) so as to be spaced apart from the side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040), and the second conductivity of the PCB (390; 1090) through the second connector (782; 882) It may include a second part (312; 512; 712; 812) electrically connected to a pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is spaced apart from the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) Attached, and the first part (311; 511; 711; 811) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is attached to the second part (312) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2; It may include a third part (313; 513; 713; 813) connected to 512; 712; 812).The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) extends from the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2) of the PCB (390; 1090); It can be configured to transmit signals to 1398-2; 1399-2).

[0225] In one embodiment, the side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a first portion (361; 561; 761; 861) disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a second part (362; 562; 762; 862) separated from the first part (361; 561; 761; 861) of the side wall (360; 560; 760; 860) which is disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a third portion (363; 563; 763; 863) disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a fourth part (364; 564; 764; 864) disposed on the PCB (390; 1090) and separated from the third part (363; 563; 763; 863) of the side wall (360; 560; 760; 860). The first connector (781; 881) may be positioned between the first and second parts (361; 561; 761; 861; 362; 562; 762; 862) of the side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040).The second connector (782; 882) may be located between the third and fourth parts (363; 563; 763; 863; 364; 564; 764; 864) of the side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040).

[0226] In one embodiment, the PCB (390; 1090) may include a third conductive pad to which the first portion (361; 561; 761; 861) of the sidewall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) is electrically connected. The PCB (390; 1090) may include a fourth conductive pad to which the second portion (362; 562; 762; 862) of the side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) is electrically connected. The first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) may be spaced apart from the third conductive pad and the fourth conductive pad and may be located between the third conductive pad and the fourth conductive pad.

[0227] In one embodiment, the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) may include a first part (871) attached to a first part (866) of the side wall (360; 560; 760; 860). The insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) may include a second part (872) attached to a second part (867) of the side wall (360; 560; 760; 860). The insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) is attached to the upper wall (350; 550; 750; 850) of the side wall (360; 560; 760; 860), and the first part (871) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) is attached to the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1370-2); It may include a third part (873) connected to the second part (872) of 1270-2; 1370-1; 1370-2).The first portion (311; 511; 711; 811) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is spaced apart from the first portion (866) of the side wall (360; 560; 760; 860) on the first portion (871) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) It can be attached, in contact with the first connector (781; 881), and positioned between the first connector (781; 881) and the first part (866) of the side wall (360; 560; 760; 860). The second portion (312; 512; 712; 812) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is spaced apart from the second portion (867) of the side wall (360; 560; 760; 860) on the second portion (872) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) It can be attached and in contact with the second connector (782; 882), and positioned between the second connector (782; 882) and the second part (867) of the side wall (360; 560; 760; 860).The third part (313; 513; 713; 813) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is spaced apart from the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1) so as to be spaced apart from the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 970-2; 1270-1). It can be attached to the third part (873) of 1270-2; 1370-1; 1370-2).

[0228] In one embodiment, the electronic device (101; 200) may include a connector (394) disposed on the PCB (390; 1090). The electronic device (101; 200) may include a battery (270) electrically connected to the connector of the PCB (390; 1090). The electronic device (101; 200) may include a power management circuit (188) disposed on the PCB (390; 1090) and electrically connected to the battery (270) through the connector (394), and configured to transmit a power signal based on power supplied from the battery (270) to the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1). The electronic device (101; 200) may include an electronic component (213; 392) disposed on the PCB (390; 1090) and electrically connected to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090). The shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may be positioned between the connector (394) and the electronic component (213; 392). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) transmits the power signal received from the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) from the power management circuit (188) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1298-2) in order to transmit the power signal to the electronic component (213; 392). It can be configured to transmit to 1299-2; 1398-2; 1399-2).

[0229] In one embodiment, the electronic component (213; 392) may include a flash light emitting diode module.

[0230] In one embodiment, a recess (355; 555; 955-1; 955-2; 1355-1; 1355-2) may be formed on the upper surface of the shield can (340; 540; 740; 840; 940-1; 940-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) to accommodate a portion of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2).

[0231] In one embodiment, the first connector (781; 881) may include a clip into which the end portion of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is fitted, or a C-clip in contact with the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2).

[0232] According to one embodiment, an electronic device (101; 200) may include a printed circuit board (PCB) (390; 1090) comprising a first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) and a second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2). The electronic device (101; 200) may include a shield can (340; 540; 740; 840; 940-1; 940-2; 1040) comprising a top wall (350; 550; 750; 850) and a side wall (360; 560; 760; 860) extending from the top wall (350; 550; 750; 850) to the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a first portion (361; 561; 761; 861) disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a second part (362; 562; 762; 862) separated from the first part (361; 561; 761; 861) of the side wall (360; 560; 760; 860) which is disposed on the PCB (390; 1090). The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a third portion (363; 563; 763; 863) disposed on the PCB (390; 1090).The side wall (360; 560; 760; 860) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) may include a fourth part (364; 564; 764; 864) disposed on the PCB (390; 1090) and separated from the third part (363; 563; 763; 863) of the side wall (360; 560; 760; 860). The electronic device (101; 200) may include an insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) attached to the top wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040). The electronic device (101; 200) may include a conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2).The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is located between the first part (361; 561; 761; 861) of the side wall (360; 560; 760; 860) and the second part (362; 562; 762; 862) of the side wall (360; 560; 760; 860), and the first part (361; 561) of the side wall (360; 560; 760; 860); It may include a first part (311; 511; 711; 811) that is spaced apart from the second part (362; 562; 762; 862) of the side wall (360; 560; 760; 860) and is electrically connected to the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is located between the third part (363; 563; 763; 863) of the side wall (360; 560; 760; 860) and the fourth part (364; 564; 764; 864) of the side wall (360; 560; 760; 860), and the third part (363; 563) of the side wall (360; 560; 760; 860); It may include a second part (312; 512; 712; 812) that is spaced apart from the fourth part (364; 564; 764; 864) of the side wall (360; 560; 760; 860) and electrically connected to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2; 1398-2; 1399-2) of the PCB (390; 1090).The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is spaced apart from the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040) of the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) Attached, and the first part (311; 511; 711; 811) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) is attached to the second part (312) of the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2; It may include a third part (313; 513; 713; 813) connected to 512; 712; 812). The conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; 1310-2) extends from the first conductive pad (1098-1; 1198-1; 1199-1; 1298-1; 1299-1; 1398-1; 1399-1) of the PCB (390; 1090) to the second conductive pad (1098-2; 1198-2; 1199-2; 1298-2; 1299-2) of the PCB (390; 1090); It can be configured to transmit signals to 1398-2; 1399-2).

[0233] In one embodiment, on the surface of the upper wall (350; 550; 750; 850) of the shield can (340; 540; 740; 840; 940-1; 940-2; 1040), the insulating material (370; 570; 770; 870; 970-1; 970-2; 1270-1; 1270-2; 1370-1; 1370-2) and the conductive bar (310; 510; 710; 810; 910-1; 910-2; 1010-1; 1010-2; 1110-1; 1110-2; 1210-1; 1210-2; 1310-1; A recess (355; 555; 955-1; 955-2; 1355-1; 1355-2) that accommodates the third part (313; 513; 713; 813) of 1310-2) may be formed.

[0234] According to one embodiment, an electronic device (200) may include: a printed circuit board (390) comprising a first conductive pad and a second conductive pad; a shield can (340) disposed on the PCB (390); an insulating material (370) disposed on the shield can (340); and a conductive line (310) attached to the insulating material (370), electrically separated from the shield can (340), and extending from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390) across the surface of the top wall (350) of the shield can (340). The conductive line (310) may be configured to transmit a signal from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390).

[0235] In one embodiment, the shield can (340) may include a recess. The recess may include a bottom portion (353); and wall portions (351; 352) on both sides of the bottom portion (353). The insulating material (370) may be placed on the bottom portion (353) of the shield can (340). A portion of the conductive line (310) attached to the insulating material (370) may be located between the wall portions (351; 352) of the shield can (340) and spaced apart from the wall portions (351; 352).

[0236] In one embodiment, the height of the portion of the conductive line (310) may be substantially the same as or lower than the heights of the wall portions (351; 352) of the shield can (340).

[0237] In one embodiment, the shield can (340) may include a side wall (360) extending from the top wall (350) to the PCB (390). The side wall (360) of the shield can (340) may include a first portion (361) disposed on the PCB (390); a second portion (362) disposed on the PCB (390) and separated from the first portion (361) of the side wall (360); a third portion (363) disposed on the PCB (390); and a fourth portion (364) disposed on the PCB (390) and separated from the third portion (363) of the side wall (360). The insulating material (370) may be attached to the top wall (350) of the shield can (340). The conductive line (310) comprises: a first portion (311) positioned between the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360), spaced apart from the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360), and electrically connected to the first conductive pad of the PCB (390); and a second portion (312) positioned between the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360), spaced apart from the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360), and electrically connected to the second conductive pad of the PCB (390). and may include a third part (313) attached to the insulating material (370) so as to be spaced apart from the upper wall (350) of the shield can (340) and extending from the first part (311) of the conductive line (310) to the second part (312) of the conductive line (310).

[0238] In one embodiment, the first end of the conductive line (310) can be soldered to the first conductive pad of the PCB (390).

[0239] In one embodiment, the second end of the conductive line (310) can be soldered to the second conductive pad of the PCB (390).

[0240] In one embodiment, the electronic device (200) may include an electronic component (392) disposed on the PCB (390) and electrically connected to the second conductive pad of the PCB (390). The conductive line (310) may be configured to transmit a power signal of the electronic component (392) from the first conductive pad to the second conductive pad.

[0241] In one embodiment, the electronic device (200) may include a connector (394) disposed on the PCB (390); and a battery (270) electrically connected to the connector of the PCB (390). The shield can (340) may be located between the electronic component (392) and the connector (394) of the PCB (390) when viewed from above.

[0242] In one embodiment, the electronic component (392) may include a flash light emitting diode module.

[0243] In one embodiment, the electronic device (200) may include: a non-conductive layer disposed on the top wall (350) of the shield can (340) to cover a portion of the conductive line (310); a thermal interface material (TIM) disposed on the non-conductive layer; and a vapor chamber thermally connected to the shield can through the non-conductive layer and the TIM.

[0244] In one embodiment, the electronic device (200) may include a speaker (696) adjacent to the edge portion (692) of the PCB (390). The conductive line (310) may include a section substantially parallel to the edge portion (692) of the PCB (390).

[0245] In one embodiment, in order to offset at least a portion of the magnetic field generated by a return current flowing in a first direction substantially parallel to the edge portion (692) of the PCB (390), the section of the conductive line (310) may be configured so that a current in a second direction opposite to the first direction can flow.

[0246] In one embodiment, the top wall of the shield can may include another surface opposite to the surface of the top wall and facing the PCB.

[0247] In one embodiment, the surface of the top wall of the shield can may face the PCB.

[0248] According to one embodiment, an electronic device (200) comprises: a printed circuit board (PCB) (390) including a first conductive pad and a second conductive pad; a shield can (740; 840) including a top wall (750; 850) and a side wall (760; 860) extending from the top wall (750; 850) to the PCB (390); an insulating material (770; 870) disposed on the top wall (750; 850) of the shield can (740; 840); a first connector (781; 881) disposed on the first conductive pad of the PCB (390) and electrically connected to the first conductive pad of the PCB (390); and a second connector (782; 882) disposed on the second conductive pad of the PCB (390) and electrically connected to the second conductive pad of the PCB (390). and may include a conductive line (710; 810) electrically separated from the shield can (740; 840). The conductive line (710; 810) may include a first portion attached to the insulating material; a second portion extending from a first end of the first portion along a first side of the sidewall to a first connector and electrically connected to a first conductive pad through the first connector; and a third portion extending from a second end of the first portion along a second side of the sidewall to a second connector and electrically connected to a second conductive pad through the second connector. The conductive line (710; 810) may be configured to transmit a signal from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390).

[0249] In one embodiment, the side wall (760; 860) of the shield can (740; 840) may include a first portion (761; 861) disposed on the PCB (390); a second portion (762; 862) disposed on the PCB (390) and separated from the first portion (761; 861) of the side wall (760; 860); a third portion (763; 863) disposed on the PCB (390); and a fourth portion (764; 864) disposed on the PCB (390) and separated from the third portion (763; 863) of the side wall (760; 860). The first connector (781; 881) may be located between the first and second parts (761; 861; 762; 862) of the side wall (760; 860) of the shield can (740; 840). The second connector (782; 882) may be located between the third and fourth parts (763; 863; 764; 864) of the side wall (760; 860) of the shield can (740; 840).

[0250] In one embodiment, the PCB (390) may include a third conductive pad to which the first portion (761; 861) of the side wall (760; 860) of the shield can (740; 840) is electrically connected; and a fourth conductive pad to which the second portion (762; 862) of the side wall (760; 860) of the shield can (740; 840) is electrically connected. The first conductive pad may be spaced apart from the third conductive pad and the fourth conductive pad and may be located between the third conductive pad and the fourth conductive pad.

[0251] In one embodiment, the insulating material (770; 870) may include a first part (871) attached to a first part (866) of the side wall (760; 860); a second part (872) attached to a second part (867) of the side wall (760; 860); and a third part (873) attached to the top wall (750; 850) of the side wall (760; 860) and connecting the first part (871) of the insulating material (770; 870) to the second part (872) of the insulating material (770; 870). The second portion of the conductive line (710; 810) is attached to the first portion (871) of the insulating material (770; 870) so as to be spaced apart from the first portion (866) of the side wall (760; 860), is in contact with the first connector (781; 881), and can be located between the first connector (781; 881) and the first portion (866) of the side wall (760; 860). The third portion of the conductive line (710; 810) may be attached to the second portion (872) of the insulating material (770; 870) so as to be spaced apart from the second portion (867) of the side wall (760; 860), contact the second connector (782; 882), and may be located between the second connector (782; 882) and the second portion (867) of the side wall (760; 860). The first portion of the conductive line (710; 810) may be attached to the third portion (873) of the insulating material (770; 870) so as to be spaced apart from the top wall (750; 850) of the shield can (740; 840).

[0252] In one embodiment, the electronic device (200) may include: a connector (394) disposed on the PCB (390); a battery (270) electrically connected to the connector of the PCB (390); a power management circuit (188) disposed on the PCB (390) and electrically connected to the battery (270) through the connector (394), configured to transmit a power signal based on power supplied from the battery (270) to the first conductive pad; and an electronic component (392) disposed on the PCB (390) and electrically connected to the second conductive pad of the PCB (390). The shield can (740; 840) may be positioned between the connector (394) and the electronic component (392). The conductive line (710; 810) may be configured to transmit the power signal received from the first conductive pad to the second conductive pad in order to transmit the power signal to the electronic component (392).

[0253] In one embodiment, the electronic device (200) may include: a non-conductive layer disposed on the top wall (350) of the shield can (340) to cover a portion of the conductive line (310); a thermal interface material (TIM) disposed on the non-conductive layer; and a vapor chamber thermally connected to the shield can through the non-conductive layer and the TIM.

[0254] In one embodiment, a recess (355; 555) may be formed on the upper surface of the upper wall of the shield can (740; 840) to accommodate the first portion of the conductive line (710; 810).

[0255] In one embodiment, the first connector (781; 881) may include a clip into which the end portion of the conductive line (710; 810) is fitted.

[0256] According to one embodiment, an electronic device (200) may include a printed circuit board (PCB) (390) comprising a first conductive pad and a second conductive pad; a shield can (340) comprising a top wall (350) and a side wall (360) extending from the top wall (350) to the PCB (390). The side wall (360) of the shield can (340) may include a first portion (361) disposed on the PCB (390); a second portion (362) disposed on the PCB (390) and separated from the first portion (361) of the side wall (360); a third portion (363) disposed on the PCB (390); and a fourth portion (364) disposed on the PCB (390) and separated from the third portion (363) of the side wall (360). The electronic device (200) may include an insulating material (370) attached to the top wall (350) of the shield can (340); and a conductive line (310).The conductive line (310) comprises: a first portion (311) positioned between the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360), spaced apart from the first portion (361) of the side wall (360) and the second portion (362) of the side wall (360), and electrically connected to the first conductive pad of the PCB (390); and a second portion (312) positioned between the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360), spaced apart from the third portion (363) of the side wall (360) and the fourth portion (364) of the side wall (360), and electrically connected to the second conductive pad of the PCB (390). and may include a third part (313) attached to the insulating material (370) so as to be spaced apart from the upper wall (350) of the shield can (340) and connecting the first part (311) of the conductive line (310) to the second part (312) of the conductive line (310). The conductive line (310) may be configured to transmit a signal from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390).

[0257] In one embodiment, a recess (355; 555) may be formed on the surface of the upper wall (350) of the shield can (340) to accommodate the insulating material (370) and the third part (313) of the conductive line (310).

[0258] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0259] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0260] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0261] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0262] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0263] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0264] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A printed circuit board (PCB) including a first conductive pad and a second conductive pad; A shield can placed on the above PCB; Insulating material disposed on the shield can above; and It includes a conductive line attached to the insulating material, electrically separated from the shield can, and extending from the first conductive pad of the PCB to the second conductive pad of the PCB across the surface of the top wall of the shield can. The above conductive line is configured to transmit a signal from the first conductive pad of the PCB to the second conductive pad of the PCB. Electronic device.

2. In Claim 1, The above shield can includes a recess, The above recess is: Bottom part; and It includes wall portions from both sides of the floor portion, and The above insulating material is placed on the bottom portion of the shield can, and A portion of the conductive line attached to the insulating material is located between the wall portions of the shield can and spaced apart from the wall portions. Electronic device.

3. In Claim 2, The height of the portion of the above conductive line is substantially the same as or lower than the heights of the wall portions of the shield can. Electronic device.

4. In any one of claims 1 to 3, The shield can includes a side wall extending from the top wall to the PCB, and The side wall of the above shield can is: A first portion disposed on the above PCB; A second portion disposed on the PCB and separated from the first portion of the sidewall; A third portion disposed on the above PCB; and It includes a fourth portion disposed on the PCB and separated from the third portion of the sidewall, The above insulating material is attached to the top wall of the shield can, and The above conductive line is: A first portion positioned between the first portion of the sidewall and the second portion of the sidewall, spaced apart from the first portion of the sidewall and the second portion of the sidewall, and electrically connected to the first conductive pad of the PCB; A second portion positioned between the third portion of the sidewall and the fourth portion of the sidewall, spaced apart from the third portion of the sidewall and the fourth portion of the sidewall, and electrically connected to the second conductive pad of the PCB; and A third portion attached to the insulating material so as to be spaced apart from the upper wall of the shield can, and extending from the first portion of the conductive line to the second portion of the conductive line, Electronic device.

5. In any one of claims 1 to 4, The first stage of the above conductive line is soldered to the first conductive pad of the PCB, and The second stage of the above conductive line is soldered to the second conductive pad of the PCB, Electronic device.

6. In any one of claims 1 to 5, It includes an electronic component disposed on the PCB and electrically connected to the second conductive pad of the PCB, The above conductive line is configured to transmit a power signal of the electronic component from the first conductive pad to the second conductive pad. Electronic device.

7. In Claim 6, A connector disposed on the above PCB; and It includes a battery electrically connected to the connector of the PCB, The shield can is located between the electronic component and the connector of the PCB when viewed from above. Electronic device.

8. In Claim 7, The above electronic component includes a flash light emitting diode module. Electronic device.

9. In any one of claims 1 to 8, A non-conductive layer disposed on the top wall of the shield can to cover a portion of the conductive line; A thermal interface material (TIM) disposed on the above-mentioned non-conductive layer; and A vapor chamber comprising, which is thermally connected to the shield can through the above non-conductive layer and the above TIM, Electronic device.

10. In any one of claims 1 to 9, Includes a speaker adjacent to the edge portion of the above PCB, The conductive line above includes a section substantially parallel to the edge portion of the PCB, Electronic device.

11. In Claim 10, In order to offset at least a portion of the magnetic field generated by a return current flowing in a first direction substantially parallel to the edge portion of the PCB, the section of the conductive line is configured such that a current in a second direction opposite to the first direction can flow. Electronic device.

12. In any one of claims 1 to 11, The top wall of the shield can comprises another surface opposite to the surface of the top wall and facing the PCB, Electronic device.

13. In any one of claims 1 to 11, The surface of the top wall of the shield can faces the PCB. Electronic device.

14. In Claim 1, The shield can includes a top wall and a side wall extending from the top wall to the PCB, and The above insulating material is placed on the top wall of the shield can, and The above electronic device is, A first connector disposed on the first conductive pad of the PCB and electrically connected to the first conductive pad of the PCB; and It includes a second connector disposed on the second conductive pad of the PCB and electrically connected to the second conductive pad of the PCB, The above conductive line is: A first part attached to the insulating material above; A second portion extending from a first end of the first portion to the first connector along the first side of the above-mentioned sidewall and electrically connected to the first conductive pad through the first connector; and A third portion extending from the second end of the first portion to the second connector along the second side of the side wall and electrically connected to the second conductive pad through the second connector, Electronic device.

15. In Claim 14, The side wall of the above shield can is: A first portion disposed on the above PCB; A second portion disposed on the PCB and separated from the first portion of the sidewall; A third portion disposed on the above PCB; and It includes a fourth portion disposed on the PCB and separated from the third portion of the sidewall, The first connector is located between the first and second portions of the side wall of the shield can, and The second connector is located between the third and fourth portions of the side wall of the shield can. Electronic device.

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