Electronic device comprising heat dissipation material

Abstract

The present disclosure relates to an electronic device. According to an embodiment of the present disclosure, the electronic device may comprise a hole communicating with the inside of a shield can such that a heat dissipation material injected into a substrate assembly is introduced into the shield can therethrough According to an embodiment of the present disclosure, the electronic device may comprise at least one guide element disposed around the hole through which a heat dissipation material injected into the substrate assembly is introduced, so that the heat dissipation material is easily introduced into the shield can.

Description

Electronic device containing heat dissipation material

[0001] The present disclosure relates to an electronic device, for example, to an electronic device comprising a heat dissipation material.

[0002] The term "electronic device" may refer to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and vehicle navigation systems. For example, these electronic devices can output stored information as sound or video.

[0003] With the increasing integration density of electronic devices and the widespread adoption of high-speed, high-capacity wireless communication, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For example, not only communication functions but also entertainment functions like games, multimedia functions like music and video playback, communication and security functions like mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can carry them conveniently.

[0004] An electronic device according to one embodiment of the present disclosure comprises a housing that forms at least partially the exterior of the electronic device, and a circuit board assembly disposed inside the housing, wherein the circuit board assembly comprises: a first printed circuit board having a first surface and a second surface opposite to the first surface; a second printed circuit board spaced apart from the first printed circuit board and having a third surface facing the first surface; an interposer disposed between the first surface and the third surface and electrically connecting the first printed circuit board and the second printed circuit board; a first hole disposed on the first printed circuit board and / or the second printed circuit board and connecting the exterior of the circuit board assembly with the first printed circuit board, the second printed circuit board, and a first space defined by the interposer; a shield can disposed on the second surface of the first printed circuit board; a second hole disposed on the first printed circuit board and connecting the first space with a second space defined by the shield can and the first printed circuit board; and a gel disposed in the first space and the second space. It may include a heat dissipation material of the type, and at least one guide element disposed on at least one of the first surface of the first printed circuit board and the third surface of the second printed circuit board and positioned around the second hole.

[0005] According to one embodiment of the present disclosure, the at least one guide element is disposed on at least one of the first surface of the first printed circuit board and the third surface of the second printed circuit board and can at least partially surround the second hole at a position spaced apart from the area between the first hole and the second hole.

[0006] According to one embodiment of the present disclosure, the at least one guide element may be configured to guide the heat dissipation material injected into the first space through the first hole into the second space.

[0007] An electronic device according to one embodiment of the present disclosure comprises a housing that forms at least partially the exterior of the electronic device, and a circuit board assembly disposed inside the housing, wherein the circuit board assembly comprises: a first printed circuit board having a first surface and a second surface opposite to the first surface; a second printed circuit board spaced apart from the first printed circuit board and having a third surface facing the first surface; an interposer disposed between the first surface and the third surface and electrically connecting the first printed circuit board and the second printed circuit board; a first hole disposed on the first printed circuit board and / or the second printed circuit board and connecting the exterior of the circuit board assembly with a first space defined by the first printed circuit board, the second printed circuit board, and the interposer; a shield can disposed on the second surface of the first printed circuit board; a second hole disposed on the first printed circuit board and connecting the first space to a second space defined by the shield can and the first printed circuit board; and to the first space through the first hole It may include a gel-type heat dissipation material configured to be introduced and to be introduced into the second space through the second hole.

[0008] An electronic device according to one embodiment of the present disclosure comprises a housing forming the exterior of the electronic device and a circuit board assembly disposed inside the housing, wherein the circuit board assembly comprises a first printed circuit board having a first surface and a second surface opposite to the first surface, a second printed circuit board having a third surface facing the first surface, an interposer disposed between the first printed circuit board and the second printed circuit board to form a first space together with the first printed circuit board and the second printed circuit board and configured to electrically connect the first printed circuit board and the second printed circuit board, a shield can disposed on the second surface of the first printed circuit board to form a second space together with the first printed circuit board, an inlet hole formed in the first printed circuit board, a heat dissipation material disposed in the first space and the second space, and a portion of the heat dissipation material in a gel state injected into the first space and disposed on the first surface and / or the third surface and around the inlet hole and configured to guide the heat dissipation material to flow into the second space through the inlet hole. It may include at least one guide element.

[0009] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description, which is referenced together with the accompanying drawings.

[0010] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0011] FIG. 2 is a perspective view of an electronic device showing the front of the electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is a perspective view of an electronic device showing the rear side of the electronic device according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exploded perspective view of a circuit board assembly according to one embodiment of the present disclosure.

[0014] FIG. 5 illustrates a circuit board assembly according to one embodiment of the present disclosure, viewed from above a first printed circuit board.

[0015] FIG. 6 illustrates a circuit board assembly according to one embodiment of the present disclosure in which no heat dissipation material is injected, viewed from above on a first printed circuit board.

[0016] FIG. 7 is a cross-sectional view of a circuit board assembly according to one embodiment of the present disclosure, cut along the line AA' shown in FIG. 5.

[0017] FIG. 8 is a cross-sectional view taken along the BB' line shown in FIG. 6, illustrating the injection of a heat dissipation material.

[0018] FIG. 9 illustrates a first printed circuit board viewed from above on a first surface, according to one embodiment of the present disclosure.

[0019] FIG. 10 illustrates an enlarged view of a portion of a first surface according to one embodiment of the present disclosure illustrated in FIG. 9.

[0020] FIG. 11 illustrates a circuit board assembly according to one embodiment of the present disclosure, viewed from above a first printed circuit board.

[0021] FIG. 12 is a cross-sectional view of a circuit board assembly taken along the line AA' shown in FIG. 5, according to one embodiment of the present disclosure.

[0022] FIG. 13 is a cross-sectional view of a circuit board assembly taken along the line AA' shown in FIG. 5, according to one embodiment of the present disclosure.

[0023] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described herein may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0024] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the disclosure.

[0025] Unless the context clearly indicates otherwise, it must be understood that the singular forms of "a," "an," and "the" carry a plural meaning. Therefore, for example, "component surface" can be understood as one or more of the component surfaces.

[0026] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0028] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0029] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0030] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0034] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0035] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0036] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0040] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0042] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0045] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0050] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0051] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0052] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0053] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0054] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0055] FIG. 2 is a perspective view of an electronic device (101) showing the front (210A) of the electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a perspective view of an electronic device (101) showing the rear (210B) of the electronic device (101) according to one embodiment of the present disclosure.

[0056] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment of the present disclosure may include a housing (210) that forms at least a portion of the exterior of the electronic device (101). It may include a first surface (or front) (210A), a second surface (or rear) (210B), and a third surface (or side) (210C) that surrounds the space between the first surface (210A) and the second surface (210B).

[0057] According to one embodiment of the present disclosure, the first surface (210A) may be formed by a front plate (202) in which at least a portion is substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (210C) may be formed by a side structure (or "side bezel structure") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0058] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light-emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (217), or a light-emitting element (206)) or additionally include other components.

[0059] According to one embodiment of the present disclosure, the display (220) may be visible, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visible through the front plate (202) forming the first surface (210A) or through a portion of the side (210C). In one embodiment, the corners of the display (220) may be formed to be generally identical to the adjacent outer shape of the front plate (202).

[0060] In one embodiment of the present disclosure (not shown), a recess or opening is formed in a part of the screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or the opening. In one embodiment of the present disclosure (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (220). In one embodiment of the present disclosure (not shown), the display (220) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0061] According to one embodiment of the present disclosure, an audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound may be disposed inside the microphone hole (203), and in one embodiment, a plurality of microphones may be disposed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for communication. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0062] According to one embodiment of the present disclosure, a sensor module (204, 219) may generate an electrical signal or data value corresponding to an internal operating state of an electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of a housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., display (220)) of the housing (210) as well as on the second surface (210B) or side (210C). The electronic device (101) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0063] According to one embodiment of the present disclosure, a camera module (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of an electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) may detect depth information of the subject based on the time when the infrared light is received by the third sensor module (219).

[0064] According to one embodiment of the present disclosure, a key input device (217) may be disposed on a side (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second side (210B) of the housing (210).

[0065] According to one embodiment of the present disclosure, a light-emitting element (206) may be disposed, for example, on a first surface (210A) of a housing (210). The light-emitting element (206) may, for example, provide state information of an electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of a camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] The connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0067] According to one embodiment of the present disclosure, the electronic device (101) may include a circuit board assembly (M) disposed inside a housing (210). The circuit board assembly (M) may be located between a display (220) and a rear plate (211). According to one embodiment of the present disclosure, the circuit board assembly (M) will be described in detail later with reference to FIGS. 4 through 13.

[0068] FIG. 4 is an exploded perspective view of a circuit board assembly (M) according to one embodiment of the present disclosure.

[0069] Referring to FIG. 4, according to one embodiment of the present disclosure, a circuit board assembly (M) may include a first printed circuit board (310) and a second printed circuit board (320). A plurality of electronic components of an electronic device (101) (e.g., a processor (120), a memory (130), and / or a communication module (190), etc.) of FIG. 1 may be disposed in the circuit board assembly (M). The circuit board assembly (M) may include an interposer (330) that electrically connects the first printed circuit board (310) and the second printed circuit board (320).

[0070] According to one embodiment of the present disclosure, a first printed circuit board (310) may include a first surface (311) and a second surface (312) opposite to the first surface (311). Electronic components or electrical elements of an electronic device (101) may be disposed on the first surface (311) and / or the second surface (312). A second printed circuit board (320) may be spaced apart from the first printed circuit board (310). The second printed circuit board (320) may be disposed to face the first printed circuit board. The second printed circuit board (320) may include a third surface (321) facing the first surface (311) of the first printed circuit board (310). The second printed circuit board (320) may include a fourth surface (322) opposite to the third surface (321). Electronic components or electrical elements of the electronic device (101) may be placed on the third side (321) and / or the fourth side (322).

[0071] According to one embodiment of the present disclosure, an interposer (330) may be disposed between a first printed circuit board (310) and a second printed circuit board (320). The interposer (330) may electrically connect the first printed circuit board (310) and the second printed circuit board (320). The interposer (330) may include a plurality of vias that electrically connect the first printed circuit board (310) and the second printed circuit board (320). As an example, the interposer (330) may electrically connect the first printed circuit board (310) and the second printed circuit board (320) by being connected via soldering to a plurality of vias disposed at the edge (311e, see FIG. 9) of the first printed circuit board (310) and a plurality of vias disposed at the edge of the second printed circuit board (320).

[0072] According to one embodiment of the present disclosure, the interposer (330) may be extended in a loop shape along at least a portion of the edge of the second printed circuit board (320). The interposer (330) extended in a loop shape may provide a space between the first printed circuit board (310) and the second printed circuit board (320) in which an electronic component (e.g., guide elements (511, 512, 521, 522) of FIG. 5) is placed.

[0073] According to one embodiment of the present disclosure, a circuit board assembly (M) may include an electronic component (E). The electronic component (E) may be placed on a second surface (312) of a first printed circuit board (310) or on a fourth surface (322) of a second printed circuit board (320). FIG. 4 illustrates, by way of example, an electronic component (E) mounted on a fourth surface (322) of a second printed circuit board (320). The electronic component (E) may be placed so as to overlap at least partially with the shield can (410, 420) when viewed from above on the second surface (312) of the first printed circuit board (320) or the fourth surface (322) of the second printed circuit board (320).

[0074] According to one embodiment of the present disclosure, the electronic component (E) may be an integrated circuit. As an example, the electronic component (E) may be a processor (120, see FIG. 1). As another example, the electronic component (E) may be an integrated circuit package in which a processor (120, see FIG. 1) and a memory (130) are sequentially stacked.

[0075] According to one embodiment of the present disclosure, the electronic device (101) may include a first heat diffusion sheet (V1) configured to diffuse heat generated from the circuit board assembly (M) and spaced apart from the circuit board assembly (M) in the direction toward which the second surface (312) of the first printed circuit board (310) faces. The first heat diffusion sheet (V1) may be disposed inside the housing (210). The first heat diffusion sheet (V1) may be disposed facing the rear plate (211, see FIG. 3). The first heat diffusion sheet (V1) may have a shape extending parallel to the rear plate (211, see FIG. 3).

[0076] According to one embodiment of the present disclosure, an electronic device (101) may include a second heat diffusion sheet (V2) configured to diffuse heat generated from the circuit board assembly (M) and spaced apart from the circuit board assembly (M) in the direction toward which the fourth side (322) of the second printed circuit board (320) faces. The circuit board assembly (M) may be positioned between the first heat diffusion sheet (V1) and the second heat diffusion sheet (V2). The second heat diffusion sheet (V2) may be positioned inside the housing (210). The second heat diffusion sheet (V2) may be positioned below the display (220, see FIG. 2). The second heat diffusion sheet (V2) may have a shape that extends parallel to the display (220).

[0077] According to one embodiment of the present disclosure, the first heat diffusion sheet (V1) and the second heat diffusion sheet (V2) may be named as heat dispersion members. Heat generated in the circuit board assembly (M) may be dispersed through the first heat diffusion sheet (V1) and the second heat diffusion sheet (V2). For example, the first heat diffusion sheet (V1) and the second heat diffusion sheet (V2) may include a vapor chamber or a heat pipe.

[0078] FIG. 5 illustrates a circuit board assembly (M) according to one embodiment of the present disclosure, viewed from above on a first printed circuit board (310). FIG. 6 illustrates a circuit board assembly (M) according to one embodiment of the present disclosure, without the heat dissipation material (600) injected, viewed from above on a first printed circuit board (310). The coordinate axes illustrated in FIG. 5 and FIG. 6 include a first direction (D1) and a second direction (D2) that are orthogonal to each other. As an example, the first direction (D1) may be parallel to the Y-axis direction illustrated in FIG. 2 and FIG. 3, and the second direction (D2) may be parallel to the X-axis direction illustrated in FIG. 2 and FIG. 3.

[0079] Referring to FIGS. 5 and 6, according to one embodiment of the present disclosure, a circuit board assembly (M) may include a first hole (313) disposed in the first printed circuit board (310) or the second printed circuit board (320). FIGS. 5 and 6 illustrate a non-limiting example in which the first hole (313) is disposed in the first printed circuit board (320).

[0080] According to one embodiment of the present disclosure, a circuit board assembly (M) may include a cap (316) disposed on a second surface (312) of a first printed circuit board (310) and covering a first hole (313). As an example, the cap (316) may be formed of a rubber material. The cap (316) may include a slit for inserting an injector (N, see FIG. 8). The cap (316) will be described in detail later with reference to FIG. 7 and FIG. 8.

[0081] According to one embodiment of the present disclosure, the first hole (313) may penetrate the first printed circuit board (310). The first hole (313) may include a first hole (313) connecting the outside of the circuit board assembly (M) to a first space (S1) defined by the first printed circuit board (310), the second printed circuit board (320), and the interposer (330). The outside of the circuit board assembly (M) and the first space (S1) may be spatially connected through the first hole (313). A heat dissipation material (600) may be injected into the first space (S1) through the first hole (313). The first hole (313) may be named an injection hole.

[0082] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a shield can (410, 420) disposed on a second surface (312) of the first printed circuit board (310). The shield can (410, 420) and the first printed circuit board (310) may define a second space (S2). For convenience of explanation, the shield cans (410, 420) illustrated in FIGS. 5 and 6 may be named the first shield can (410) and the second shield can (420). The space defined by the first shield can (410) may be named the second-1 space (S21), and the space defined by the second shield can (420) may be named the second-2 space (S22).

[0083] According to one embodiment of the present disclosure, the circuit board assembly (M) is disposed on the first printed circuit board (310) and may include a second hole (314, 315) connecting the first space (S1) to a second space (S2) defined by the shield can (410, 420) and the first printed circuit board (310). When viewed from above on the second surface (312) of the first printed circuit board (310), the second hole (314, 315) may be covered by the shield can (410, 420). The first space (S1) and the second space (S2) may be spatially connected through the second hole (314, 315). A heat dissipation material (600) may be introduced from the first space (S1) to the second space (S2) through the second hole (314, 315). The second hole (314, 315) may be named an introducing hole. For convenience of explanation, the second holes (314, 315) may be named the second-1 hole (314) and the second-2 hole (315), or the first introducing hole (314) and the second introducing hole (315).

[0084] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a heat dissipation material (600) disposed in the first space (S1) and the second space (S2). The heat dissipation material (600) may be understood as a gel-type material and as a material containing various components. The "gel-type heat dissipation material" may be understood as a material having a certain range of viscosity that can be injected through an injector (N, see FIG. 8) and does not flow with large displacement within the interior of the circuit board assembly (M) (e.g., the first space (S1) and the second space (S2)). As an example, the heat dissipation material (600) may include, but is not limited to, heat dissipation particles (e.g., Al2O3 and / or AlN), additives (curing agents, catalysts, etc.), silicone resin, silicone oil, etc.

[0085] According to one embodiment of the present disclosure, the heat dissipation material (600) may include a first portion (610) disposed in the first space (S1) and a second portion (620, 630) disposed in the second space (S2). A portion of the heat dissipation material (600) located in the first space (S1) after being injected into the first space (S1) through a first hole (313) may be named the first portion (610). A portion of the heat dissipation material (600) located in the second space (S2) after being introduced into the second space (S2) through a second hole (314, 315) may be named the second portion (620, 630). A portion of the heat dissipation material (600) located in the second-1 space (S21) may be named the second-1 portion (620). A portion of the heat dissipation material (600) located in the second-2 space (S22) may be named the second-2 portion (630).

[0086] According to one embodiment of the present disclosure, a first shield can (410) may include a first shield can hole (411). A second-1 portion (620) of a heat dissipation material (600) located in a second-1 space (S21) may be visible through the first shield can hole (411). A second shield can (420) may include a second shield can hole (421). A second-2 portion (630) of a heat dissipation material (600) located in a second-2 space (S22) may be visible through the second shield can hole (421).

[0087] Referring to FIGS. 4 through 6, according to one embodiment of the present disclosure, the electronic component (E) may be located between the second heat diffusion sheet (V2) and the first portion (610) of the heat dissipation material (600). The second portion (620, 630) of the heat dissipation material (600) may be located between the first heat diffusion sheet (V1) and the first portion (610) of the heat dissipation material (600). Heat generated in the circuit board assembly (M) and / or the electronic component (E) may be dissipated to the outside of the circuit board assembly (M) through the first portion (610) and / or the second portion (620, 630) of the heat dissipation material (600). Heat released to the outside of the circuit board assembly (M) may be diffused through the first heat diffusion sheet (V1) and / or the second heat diffusion sheet (V2). Heat diffused through the first heat diffusion sheet (V1) and / or the second heat diffusion sheet (V2) can be dissipated to the outside of the electronic device (101) through the surface of the electronic device (101) (e.g., the first surface (210A) in FIG. 2 and / or the second surface (210B) in FIG. 3).

[0088] According to one embodiment of the present disclosure, the circuit board assembly (M) may include at least one guide element (511, 512, 521, 522) disposed on at least one of the first surface (311) of the first printed circuit board (310) or the third surface (321) of the second printed circuit board (320). As an example, the guide element (511, 512, 521, 522) may be an electrical element (e.g., a capacitor) electrically connected to the first printed circuit board (310) or the second printed circuit board (320).

[0089] According to one embodiment of the present disclosure, the at least one guide element (511, 512, 521, 522) may be configured to guide the heat dissipation material (600) injected into the first space (S1) through the first hole (313) into the second space (S2). As an example, FIGS. 5 to 10 illustrate a case where the guide element (511, 512, 521, 522) is disposed on the first surface (311) of the first printed circuit board (310).

[0090] According to one embodiment of the present disclosure, a guide element (511, 512, 521, 522) may protrude from at least one of a first surface (311) of the first printed circuit board (310) and a third surface (321) of the second printed circuit board (320). The height at which the guide element (511, 512, 521, 522) protrudes from at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320) may be greater than half the gap between the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320).

[0091] According to one embodiment of the present disclosure, the guide elements (511, 512, 521, 522) may be elements of a part of an electrical circuit for performing the function of an electronic device (101), or elements disposed on a first printed circuit board (310) or a second printed circuit board (320) independently of the function of the electronic device (101). As an example, the guide elements (511, 512, 521, 522) may include decoupling capacitors.

[0092] According to one embodiment of the present disclosure, guide elements (511, 512, 521, 522) may be formed in a plurality. For convenience of explanation, guide elements (511, 512) arranged around the second-1 hole (314) may be named first-1 guide elements (511) and first-2 guide elements (512). For convenience of explanation, guide elements (521, 522) arranged around the second-2 hole (315) may be named second-1 guide elements (521) and second-2 guide elements (522). The first-1 guide element (511) and the second-1 guide element (521) can be named the first guide element (511, 521), and the first-2 guide element (512) and the second-2 guide element (522) can be named the second guide element (512, 522).

[0093] According to one embodiment of the present disclosure, a first-1 guide element (511) and a first-2 guide element (512) may be arranged around a second-1 hole (314). The first-1 guide element (511) and the first-2 guide element (512) may at least partially surround the second-1 hole (314). The first-1 guide element (511) and the first-2 guide element (512) may be arranged along the perimeter of the second-1 hole (314). The first-1 guide element (511) and the first-2 guide element (512) may be configured to guide a heat dissipation material (600) into the second-1 hole (314) so ​​that the heat dissipation material (600) flows into the second-1 space (S21). The second-1 hole (314) can be located between the first hole (313), the first-1 guide element (511), and the first-2 guide element (512).

[0094] According to one embodiment of the present disclosure, a second-1 guide element (521) and a second-2 guide element (522) may be arranged around a second-2 hole (315). The second-1 guide element (521) and the second-2 guide element (522) may at least partially surround the second-2 hole (315). The second-1 guide element (521) and the second-2 guide element (522) may be arranged along the perimeter of the second-2 hole (315). The second-1 guide element (521) and the second-2 guide element (522) may be configured to guide a heat dissipation material (600) into the second-2 hole (315) so that the heat dissipation material (600) flows into the second-2 space (S22). The second-2 hole (315) can be located between the first hole (313), the second-1 guide element (521), and the second-2 guide element (522).

[0095] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a third hole (317, 318) disposed in the first printed circuit board (310). A portion (610) of the heat dissipation material (600) disposed in the first space (S1) may be visible to the outside of the circuit board assembly (M) through the third hole (317, 318). The third hole (317, 318) may be spaced further from the first hole (313) than the second hole (314, 315). The third hole (317, 318) may be named an inspection hole. For convenience of explanation, the third holes (317, 318) may be named a third-1 hole (317) and a third-2 hole (318).

[0096] According to one embodiment of the present disclosure, the third-1 hole (317) may be spaced apart from the first hole (313) in a direction intersecting the direction in which the second-1 hole (314) is spaced apart from the first hole (313). The third-1 hole (317) may be spaced further apart from the first hole (313) than the second-1 hole (314). A first portion (610) of the heat dissipation material (600) may be visible through the third-1 hole (317). The third-1 hole (317) may be named the first inspection hole (317).

[0097] According to one embodiment of the present disclosure, the third-2 hole (318) may be spaced apart from the first hole (313) in a direction intersecting the direction in which the second-2 hole (315) is spaced apart from the first hole (313). The third-2 hole (318) may be spaced further apart from the first hole (313) than the second-2 hole (315). A first portion (610) of the heat dissipation material (600) may be visible through the third-2 hole (318). The third-2 hole (318) may be named the second inspection hole (318).

[0098] According to one embodiment of the present disclosure, the first shield can hole (411), the second shield can hole (421), the third-1 hole (317), and / or the third-2 hole (318) may be covered by a transparent film. The first portion (610) of the heat dissipation material (600) may be visible through the transparent films covering the third-1 hole (317) and the third-2 hole (318). The second-1 portion (620) of the heat dissipation material (600) may be visible through the transparent film covering the first shield can hole (411). The second-2 portion (630) of the heat dissipation material (600) may be visible through the transparent film covering the second shield can hole (421).

[0099] According to one embodiment of the present disclosure, a heat dissipation material (600) injected through a first hole (313) can be introduced into a plurality of spaces (e.g., a first space (S1) and a second space (S2)) through a second hole (314, 315) connecting a plurality of spaces (e.g., a first space (S1) and a second space (S2)) inside a circuit board assembly (M). According to one embodiment of the present disclosure, an electronic device (101) includes a second hole (314, 315) so that the heat dissipation material (600) can be injected into a plurality of spaces (e.g., a first space (S1) and a second space (S2)) of a circuit board assembly (M) through a single process of injecting the heat dissipation material (600) through the first hole (313).

[0100] According to one embodiment of the present disclosure, the heat dissipation material (600) injected through the first hole (313) is guided through guide elements (511, 512, 521, 522) so that it can be easily introduced into the second hole (314, 315), thereby allowing the heat dissipation material (600) to be evenly introduced into a plurality of spaces (e.g., the first space (S1) and the second space (S2)) of the circuit board assembly (M).

[0101] FIG. 7 is a cross-sectional view of a circuit board assembly (M) according to one embodiment of the present disclosure, taken along the line AA' shown in FIG. 5. FIG. 8 is a cross-sectional view taken along the line BB' shown in FIG. 6, illustrating the injection of a heat dissipation material (600'). The solid and dotted arrows shown in FIG. 8 can be understood as indicating the flow of the heat dissipation material (600') injected into the interior of the circuit board assembly (M).

[0102] Referring to FIGS. 7 and 8, according to one embodiment of the present disclosure, a heat dissipation material (600) of a circuit board assembly (M) can be injected into a first space (S1) through an injector (N) inserted into a first hole (313). The injector (N) can be inserted into the interior of the first space (S1) by passing through a cap (316). The heat dissipation material (600') injected into the first space (S1) can spread from the first hole (313). As an example, the heat dissipation material (600') injected through the first hole (313) can spread radially (radial direction, RD, see FIG. 10) with respect to the first hole (313).

[0103] According to one embodiment of the present disclosure, a heat dissipation material (600') injected into a first space (S1) can be introduced into the interior of a second space (S2) through a second hole (314, 315). The heat dissipation material (600') spreading from the first space (S1) can be introduced into the second space (S2) through the second hole (314, 315) by being guided to the second hole (314, 315) by a guide element (511, 512, 521, 522). The heat dissipation material (600) introduced into the second space (S2) can spread from the second hole (314, 315). As an example, the injected heat dissipation material (600) can spread in a radial direction (e.g., the radial direction (RD) of FIG. 10) with respect to the second hole (314, 315).

[0104] FIG. 9 illustrates a first printed circuit board (310) according to one embodiment of the present disclosure, viewed from above on a first surface (311). FIG. 10 illustrates an enlarged view of a portion of the first surface (311) according to one embodiment of the present disclosure shown in FIG. 9.

[0105] The description of the first surface (311) of the first printed circuit board (310) described with reference to FIG. 9 and FIG. 10 may be applied substantially the same to the third surface (321) of the second printed circuit board (320) to the extent that they are not positioned relative to each other. The description of the second-2 hole (315) described with reference to FIG. 10 may be applied substantially the same to the second-1 hole (314) to the extent that they are not positioned relative to each other.

[0106] Referring to FIG. 9 and FIG. 10, according to one embodiment of the present disclosure, a first guide element (511, 521) may be spaced apart from the second hole (314, 315) in a first direction (e.g., first direction (D1)) when viewed from above the first surface (311) of the first printed circuit board (310). The second guide element (512, 522) may be spaced apart from the second hole (314, 315) in a second direction (e.g., second direction (D2)) that intersects the first direction. As an example, the first direction and the second direction may be substantially orthogonal to each other.

[0107] According to one embodiment of the present disclosure, when viewed from above on the first surface (311) of the second printed circuit board (320), the first hole (313) may overlap at least partially with the electronic component (E). Additionally, when viewed from above on the fourth surface (322) of the second printed circuit board (320), the first hole (313) may overlap at least partially with the electronic component (E). By positioning the first hole (313) to overlap with the electronic component (E), the first portion (610, see FIG. 5) of the heat dissipation material (600) injected through the first hole (313) can be stably overlapped with the electronic component (E), and the electronic component (E) can be effectively heat dissipated.

[0108] According to one embodiment of the present disclosure, the first surface (311) of the first printed circuit board (310) may include a surrounding area (311S) surrounding the second hole (314, 315). As an example, the surrounding area (311S) may be understood as an area within a predetermined distance (e.g., 4 mm) from the second hole (314, 315). The surrounding area (311S) may be named the surrounding area (311S) of the second hole (314, 315) or the surrounding area (311S) of the first surface (311) of the first printed circuit board (310).

[0109] According to one embodiment of the present disclosure, the surrounding area (311S) of the second hole (314, 315) may include a first area (311B) located between the first hole (313) and the second hole (314, 315). The surrounding area (311S) of the second hole (314, 315) may include a second area (311A) that is spaced apart from the first area (311B) and surrounds the second hole (314, 315).

[0110] According to one embodiment of the present disclosure, guide elements (511, 512, 521, 522) may be disposed in a second region (311A) spaced apart from a first region (311B) between the first hole (313) and the second hole (314, 315). The guide elements (511, 512, 521, 522) disposed in the second region (311A) may at least partially surround the second hole (314, 315).

[0111] According to one embodiment of the present disclosure, the first guide element (511, 521) may be spaced apart from the second hole (314, 315) in a first direction (e.g., first direction (D1)). The second guide element (512, 522) may be spaced apart from the second hole (314, 315) in a second direction (e.g., second direction (D2)) that intersects the first direction. The first direction and the second direction may intersect with the direction (SD) in which the second hole (314, 315) is spaced apart from the first hole (313). As an example, the first direction and the second direction may be substantially orthogonal to each other. As an example, the first direction and the second direction may be inclined from the direction (SD) in which the second hole (314, 315) is spaced apart from the first hole (313).

[0112] FIG. 11 illustrates a circuit board assembly (M1) according to one embodiment of the present disclosure, viewed from above a first printed circuit board (1310).

[0113] The description of components of an electronic device according to an embodiment of the present disclosure described with reference to FIG. 5 through 10 (e.g., circuit board assembly (M), electronic component (E), first printed circuit board (310), second printed circuit board (320), first hole (313), second hole (314), cap (316), shield can (410, 420), shield can hole (411, 421), guide element (511, 512, 521, 522), heat dissipation material (600), first part (610) of the heat dissipation material (600), and / or second part (620, 630) of the heat dissipation material (600)) is described with reference to FIG. 11, which describes components of an electronic device according to an embodiment of the present disclosure of the same name (e.g., circuit board assembly (M1), electronic component (E'), first printed circuit board (1310), second printed circuit board (1320), With respect to the first hole (1313), second hole (1314), cap (1316), shield can (1400), shield can hole (1401), guide element (1510, 1520), heat dissipation material (1600), first part (1610) of the heat dissipation material (1600), and / or second part (1620) of the heat dissipation material (1600), they can be applied substantially identically within a range that is not arranged with respect to each other.

[0114] According to one embodiment of the present disclosure, when viewed from above on the first printed circuit board (1310), the first hole (1313) may not overlap with the electronic component (E'). When viewed from above on the first printed circuit board (1310), the first hole (1313) may be located outside the electronic component (E'). The first hole (1313) may be located adjacent to the edge of the circuit board assembly (M1). As an example, the first hole (1313) may be located adjacent to the edge of the first printed circuit board (1310).

[0115] According to one embodiment of the present disclosure, when viewed from above the first printed circuit board (1310), the first hole (1313) may not overlap with the shield can (1400). When viewed from above the first printed circuit board (1310), the first hole (1313) may be located on the outside of the shield can (1400).

[0116] According to one embodiment of the present disclosure, when viewed from above the first printed circuit board (1310), the second hole (1314) may overlap with the shield can (1400). When viewed from above the first printed circuit board (1310), the second hole (1314) may be located inside the shield can (1400). When viewed from above the first printed circuit board (1310), the second hole (1314) may overlap with the electronic component (E'). When viewed from above the first printed circuit board (1310), the second hole (1314) may be located inside the electronic component (E'). By positioning the electronic component (E') so as to overlap with the shield can (1400), the second part (1620) of the heat dissipation material (1600) can be stably overlapped with the electronic component (E'), and the electronic component (E') can effectively dissipate heat through the second part (1620) of the heat dissipation material (1600). By positioning the electronic component (E') so as to overlap with the first part (1610) of the heat dissipation material (1600), the electronic component (E') can effectively dissipate heat through the first part (1610) of the heat dissipation material (1600).

[0117] FIG. 12 is a cross-sectional view of a circuit board assembly (M2) according to one embodiment of the present disclosure, taken along the line AA' shown in FIG. 5.

[0118] The description of components of an electronic device (e.g., circuit board assembly (M) and / or guide elements (511, 512, 521, 522)) according to one embodiment of the present disclosure described with reference to FIG. 5 through 10 may be applied substantially identically to components of an electronic device (e.g., circuit board assembly (M2) and / or guide elements (2511, 2512, 2521, 2522)) according to one embodiment of the present disclosure of the same name described with reference to FIG. 12, to the extent that they are not arranged with each other.

[0119] Referring to FIG. 12, according to one embodiment of the present disclosure, guide elements (2511, 2512, 2521, 2522) may be disposed on a third surface (321) of the second printed circuit board (320). The guide elements (2511, 2512, 2521, 2522) may be connected to the electronic component (E) disposed on a fourth surface (322). As an example, the guide elements (2511, 2512, 2521, 2522) may include a decoupling capacitor connected to the electronic component (E) through the second printed circuit board (320).

[0120] FIG. 13 is a cross-sectional view of a circuit board assembly (M3) according to one embodiment of the present disclosure, taken along the line AA' shown in FIG. 5.

[0121] Components of an electronic device (e.g., circuit board assembly (M), heat dissipation material (600), a first part (610) of the heat dissipation material (600), a second part (620, 630) of the heat dissipation material (600), and / or guide elements (511, 512, 521, 522)) according to an embodiment of the present disclosure described with reference to FIG. 5 through 10 are described with reference to components of an electronic device according to an embodiment of the present disclosure of the same name (e.g., circuit board assembly (M3), heat dissipation material (3600), a first part (3610) of the heat dissipation material (3600), a second part (3620, 3630) of the heat dissipation material (3600), and / or guide elements (3511, 3512, 3513, 3514, 3521, 3522, 3523), etc. Regarding 3524), it can be applied substantially identically to the extent that they do not conflict with each other.

[0122] Referring to FIG. 13, according to one embodiment of the present disclosure, a circuit board assembly (M3) may include a plurality of guide elements (3511, 3512, 3513, 3514, 3521, 3522, 3523, 3524). The plurality of guide elements (3511, 3512, 3513, 3514, 3521, 3522, 3523, 3524) may be disposed on a first surface (311) of a first printed circuit board (310) and a second surface (321) of a second printed circuit board (320), respectively.

[0123] According to one embodiment of the present disclosure, a plurality of guide elements (3511, 3512, 3513, 3514, 3521, 3522, 3523, 3524) may include a plurality of first guide elements (3511, 3513, 3521, 3523) disposed on a first surface (311) of a first printed circuit board (310). A plurality of guide elements (3511, 3512, 3513, 3514, 3521, 3522, 3523, 3524) may include a plurality of second guide elements (3512, 3514, 3522, 3524) disposed on a third surface (321) of a second printed circuit board (320). A plurality of first guide elements (3511, 3513, 3521, 3523) and a plurality of second guide elements (3512, 3514, 3522, 3524) may overlap each other. The plurality of first guide elements (3511, 3513, 3521, 3523) and the plurality of second guide elements (3512, 3514, 3522, 3524) may collectively have the form of a wall to guide the flow of the heat dissipation material (3600).

[0124] A circuit board assembly in which multiple components (e.g., processors, shield cans) are arranged may include multiple partitioned spaces, and the heat dissipation performance of the circuit board assembly can be improved by injecting a heat dissipation material into said multiple spaces (e.g., the interior of a shield can and the space between two circuit boards). Accordingly, for circuit board assemblies containing such multiple partitioned spaces, much research is being conducted on methods to simplify the process for filling the heat dissipation material or to facilitate the filling of the heat dissipation material.

[0125] The problem to be addressed in the present disclosure may be to reduce the number of injection holes required to inject a gel-type heat dissipation material into internal regions of a substrate assembly.

[0126] The problem to be addressed in the present disclosure may be to control the flow of a heat dissipation material so that a gel-type heat dissipation material is evenly distributed into internal regions of a substrate assembly.

[0127] The problems addressed in this disclosure are not limited to those mentioned above and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0128] An electronic device according to various embodiments of the present disclosure can reduce the number of injection holes required to inject a gel-type heat dissipation material into the internal regions of a substrate assembly by forming a passage connecting the internal regions of the substrate assembly separated from each other.

[0129] An electronic device according to various embodiments of the present disclosure can control the flow of a heat dissipation material so that the gel-type heat dissipation material is evenly distributed into internal regions of a substrate assembly by arranging an element that guides the flow of the heat dissipation material around a hole through which the gel-type heat dissipation material passes.

[0130] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the above description.

[0131] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (210) that at least partially forms the exterior of the electronic device (101).

[0132] According to one embodiment of the present disclosure, the electronic device (101) may include a circuit board assembly (M) disposed inside the housing (210).

[0133] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a first printed circuit board (310) comprising a first surface (311) and a second surface (312) opposite to the first surface (311).

[0134] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a second printed circuit board (320) that is spaced apart from the first printed circuit board (310) and includes a third surface (321) facing the first surface (311).

[0135] According to one embodiment of the present disclosure, the circuit board assembly (M) may include an interposer (330) disposed between the first surface (311) and the third surface (321) and electrically connecting the first printed circuit board (310) and the second printed circuit board (320).

[0136] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a first hole (313) that is disposed on the first printed circuit board (310) or the second printed circuit board (320) and connects the outside of the circuit board assembly (M) to a first space (S1) defined by the first printed circuit board (310), the second printed circuit board (320), and the interposer (330).

[0137] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a shield can (410, 420) disposed on a second surface (312) of the first printed circuit board (310).

[0138] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a second hole (314, 315) disposed on the first printed circuit board (310) and connecting the first space (S1) to a second space (S2) defined by the shield can (410, 420) and the first printed circuit board (310).

[0139] According to one embodiment of the present disclosure, the circuit board assembly (M) may include a gel-type heat dissipation material (600) disposed in the first space (S1) and the second space (S2).

[0140] According to one embodiment of the present disclosure, the circuit board assembly (M) may include at least one guide element (511, 512, 521, 522) disposed on at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320).

[0141] According to one embodiment of the present disclosure, at least one guide element (511, 512, 521, 522) may at least partially surround the second hole (314, 315) at a position (311A) spaced apart from the region (311B) between the first hole (313) and the second hole (314, 315).

[0142] According to one embodiment of the present disclosure, at least one guide element (511, 512, 521, 522) may be configured to guide the heat dissipation material (600) injected into the first space (S1) through the first hole (313) into the second space (S2).

[0143] According to one embodiment of the present disclosure, when viewed from above on the first surface (311) of the first printed circuit board (310), the second hole (314, 315) may be located between the first hole (313) and the at least one guide element (511, 512, 521, 522).

[0144] According to one embodiment of the present disclosure, the guide elements (511, 512, 521, 522) may include a first guide element (511, 521) spaced apart in a first direction from the second hole (314, 315) when viewed from above the first surface (311) of the first printed circuit board (310).

[0145] According to one embodiment of the present disclosure, the guide elements (511, 512, 521, 522) may include a second guide element (512, 522) spaced apart from the second hole (314, 315) in a second direction intersecting the first direction.

[0146] According to one embodiment of the present disclosure, the peripheral region (311S) of the second hole (314, 315) may include a first region (311B) located between the first hole (313) and the second hole (314, 315).

[0147] According to one embodiment of the present disclosure, the peripheral region (311S) of the second hole (314, 315) may be spaced apart from the first region (311B) and may include a second region (311A) surrounding the second hole (314, 315).

[0148] According to one embodiment of the present disclosure, the guide element (511, 512, 521, 522) may be disposed in the second region (311A) of the peripheral region (311S) of the second hole (314, 315).

[0149] According to one embodiment of the present disclosure, the circuit board assembly (M) may include an electronic component (E) disposed on a fourth surface (322) opposite to a third surface (321) of the second printed circuit board (320).

[0150] According to one embodiment of the present disclosure, the electronic component (E) may overlap at least partially with the shield can (410, 420) when viewed from above the fourth side (322) of the second printed circuit board (320).

[0151] According to one embodiment of the present disclosure, when viewed from above on the fourth surface (322) of the second printed circuit board (320), the first hole (313) may overlap at least partially with the electronic component (E).

[0152] According to one embodiment of the present disclosure, when viewed from above the first printed circuit board (1310), the second hole (1314) may overlap with the electronic component (E').

[0153] According to one embodiment of the present disclosure, the guide elements (2511, 2512, 2521, 2522) may include a decoupling capacitor disposed on a third surface (321) of the second printed circuit board (320) and connected to the electronic component (E).

[0154] According to one embodiment of the present disclosure, the electronic device may include a first heat diffusion sheet (V1) configured to diffuse heat generated from the circuit board assembly (M) and spaced apart from the circuit board assembly (M) in the direction toward which the second surface (312) of the first printed circuit board (310) faces.

[0155] According to one embodiment of the present disclosure, the electronic device may include a second heat diffusion sheet (V2) configured to diffuse heat generated from the circuit board assembly (M) and spaced apart from the circuit board assembly (M) in the direction toward which the fourth surface (322) of the second printed circuit board (320) faces.

[0156] According to one embodiment of the present disclosure, the heat dissipation material (600) may include a first portion (610) disposed in the first space (S1) and a second portion (620, 630) disposed in the second space (S2).

[0157] According to one embodiment of the present disclosure, the electronic component (E) may be located between the second heat diffusion sheet (V2) and the first portion (610) of the heat dissipation material (600).

[0158] According to one embodiment of the present disclosure, a second portion (620, 630) of the heat dissipation material (600) may be located between the first heat diffusion sheet (V1) and the first portion (610) of the heat dissipation material (600).

[0159] According to one embodiment of the present disclosure, when viewed from above on the second surface (312) of the first printed circuit board (310), the second hole (314, 315) may be covered by the shield can (410, 420).

[0160] According to one embodiment of the present disclosure, the height at which the guide element (511, 512, 521, 522) protrudes from at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320) may be greater than half the gap between the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320).

[0161] According to one embodiment of the present disclosure, the circuit board assembly (M) is disposed on the first printed circuit board (310) and may include a third hole (317, 318) spaced apart from the first hole (313) in a direction intersecting the direction in which the second hole (314, 315) is spaced apart from the first hole (313).

[0162] According to one embodiment of the present disclosure, a portion (610) of the heat dissipation material (600) disposed in the first space (S1) can be seen from the outside of the circuit board assembly (M) through the third hole (317, 318).

[0163] According to one embodiment of the present disclosure, the third hole (317, 318) may be spaced further away from the first hole (313) than the second hole (314, 315).

[0164] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of this document.

Claims

1. In an electronic device (101), A housing (210) forming the exterior of the above electronic device (101); It includes a circuit board assembly (M) disposed inside the above housing (210), and The above circuit board assembly (M) is: A first printed circuit board (310) comprising a first surface (311) and a second surface (312) opposite to the first surface (311); A second printed circuit board (320) including a third surface (321) facing the first surface (311); An interposer (330) disposed between the first printed circuit board (310) and the second printed circuit board (320) to form a first space (S1) together with the first printed circuit board (310) and the second printed circuit board (320), and configured to electrically connect the first printed circuit board (310) and the second printed circuit board (320); A shield can (410, 420) disposed on the second surface (312) of the first printed circuit board (310) to form a second space (S2) together with the first printed circuit board (310); Inlet holes (314, 315) formed in the first printed circuit board (310); A heat dissipation material (600) disposed in the first space (S1) and the second space (S2); and An electronic device comprising at least one guide element (511, 512, 521, 522) disposed on the first surface (311) and / or the third surface (321) and around the inlet hole (314, 315), configured to guide a portion of the gel-state heat dissipation material (600) injected into the first space (S1) to flow into the second space (S2) through the inlet hole (314, 315).

2. In Paragraph 1, It further includes an injection hole (313) formed in the first printed circuit board (310) and / or the second printed circuit board (320) and configured to connect the outside of the circuit board assembly (M) with the first space (S1), and An electronic device in which, when viewed from above on the first surface (311) of the first printed circuit board (310), the inlet hole (314, 315) is located between the injection hole (313) and the at least one guide element (511, 512, 521, 522).

3. In Paragraph 2, The above at least one guide element (511, 512, 521, 522) is, An electronic device formed on at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320), and positioned to at least partially surround the inlet hole (314, 315) at a position (311A) spaced apart from the area (311B) between the inlet hole (314, 315) and the injection hole (313).

4. In Paragraph 2 or 3, The above guide elements (511, 512, 521, 522) are: An electronic device comprising a first guide element (511, 521) spaced apart in a first direction from the inlet hole (314, 315) when viewed from above on a first surface (311) of the first printed circuit board (310), and a second guide element (512, 522) spaced apart in a second direction intersecting the first direction from the inlet hole (314, 315).

5. In any one of paragraphs 2 through 4, The surrounding area (311S) of the above-mentioned inlet holes (314, 315) is: A first region (311B) located between the injection hole (313) and the inflow holes (314, 315); and An electronic device comprising a second region (311A) spaced apart from the first region (311B), surrounding the inlet hole (314, 315), and having the guide element (511, 512, 521, 522) disposed therein.

6. In any one of paragraphs 1 through 5, The above circuit board assembly (M) is, An electronic device further comprising an electronic component (E) disposed on a fourth side (322) opposite to a third side (321) of the second printed circuit board (320), and at least partially overlapping with the shield can (410, 420) when viewed from above on the fourth side (322) of the second printed circuit board (320).

7. In Paragraph 6, When viewed from above on the first printed circuit board (1310), the inlet hole (1314) is an electronic device that overlaps with the electronic component (E').

8. In Paragraph 6 or 7, The above guide elements (2511, 2512, 2521, 2522) are, An electronic device comprising a decoupling capacitor disposed on the third side (321) of the second printed circuit board (320) and connected to the electronic component (E).

9. In any one of paragraphs 6 through 8, A first heat diffusion sheet (V1) configured to be spaced apart from the circuit board assembly (M) in the direction toward which the second surface (312) of the first printed circuit board (310) faces, and to diffuse heat generated from the circuit board assembly (M); and An electronic device further comprising a second heat diffusion sheet (V2) configured to diffuse heat generated from the circuit board assembly (M), spaced apart from the circuit board assembly (M) in the direction toward which the fourth side (322) of the second printed circuit board (320) faces.

10. In Paragraph 9, The above heat dissipation material (600) is, It includes a first part (610) disposed in the first space (S1) and a second part (620, 630) disposed in the second space (S2), The electronic component (E) is located between the second heat diffusion sheet (V2) and the first part (610) of the heat dissipation material (600), and The second portion (620, 630) of the heat dissipation material (600) is an electronic device located between the first heat diffusion sheet (V1) and the first portion (610) of the heat dissipation material (600).

11. In any one of paragraphs 1 through 10, When viewed from above on the second surface (312) of the first printed circuit board (310), the inlet hole (314, 315) is covered by the shield can (410, 420) of the electronic device.

12. In any one of paragraphs 1 through 11, An electronic device in which the height of the guide element (511, 512, 521, 522) protruding from at least one of the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320) is greater than half the gap between the first surface (311) of the first printed circuit board (310) and the third surface (321) of the second printed circuit board (320).

13. In any one of paragraphs 2 through 5, The above circuit board assembly (M) is: The first printed circuit board (310) is formed and includes an inspection hole (317, 318) spaced apart from the injection hole (313) in a direction intersecting the direction in which the inlet hole (314, 315) is spaced apart from the injection hole (313). A portion (610) of the heat dissipation material (600) placed in the first space (S1) is an electronic device visible from the outside of the circuit board assembly (M) through the inspection holes (317, 318).

14. In Paragraph 13, The above inspection holes (317, 318) are, An electronic device spaced further from the injection hole (313) than from the inflow hole (314, 315).

15. In any one of paragraphs 1 through 14, The above heat dissipation material (600) is: A first part (610) disposed in the first space (S1); and An electronic device comprising a second part (620, 630) disposed in the second space (S2) and overlapping with the first part (610) when viewed from above on the second surface (312) of the first printed circuit board (310).

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