Formulation of wound dressings and the uses thereof

Abstract

The present disclosure provides a wound dressing and the uses thereof.

Description

Attorney Docket No. I2106-7000WOFORMULATION OF WOUND DRESSINGS AND THE USES THEREOFCLAIM OF PRIORITYThis application claims priority to U.S. Provisional Application No. 63 / 716,605, filed on November 5, 2024, the entire contents of which are incorporated herein by reference in their entirety.BACKGROUND

[0001] Dressings are used to treat wounds and accelerate healing of all types of wounds, including bums, surgical wounds, abrasive wound, lacerations, puncture wounds, wounds resulting from projectiles or explosions and ulcers. Wound dressings provide transient physiologic wound closure, thereby helping to control pain, absorb wound exudate, prevent wound desiccation, and isolate the wound from the environment.

[0002] The requirements of a suitable wound dressing that forms in situ include the ability to form a flexible, conformal, strong, elastic, non-irritating dressing which covers the wound, possesses a high-water content (i.e., hydrated), and protects the wound from bacteria and other debris (e.g., dirt or clothing). Additionally, it requires that the dressing is both easy to apply and to remove in order to minimize tissue damage, patient discomfort and the time required to perform a dressing change.

[0003] Selection of the correct dressing for a burn is based on location and geometry of the wound, degree of the wound, needs (e.g., absorption of exudate or donation of moisture to the wound), as well as ease of application and removal, requirements for dressing change frequency, cost, and patient comfort. Various commercially available dressings such as hydrocolloids, polyurethane films, silicon coated nylon, biosynthetic skin substitutes, antimicrobial (silver and iodine) dressings, fibers, and wound dressing pads are already used for the treatment of bums. However, currently available dressings often adhere to the wound surface so that dressing changes can lead to traumatization of newly formed tissues, delayed healing, and physical pain and suffering for the patient. The average duration of a bum dressing change is reported to be 57.6 ± 34.4 min. The need for anesthesiology further increases time and complexity of the procedure and is routinely needed for pediatric patients. Adequate management of pain is a challenge and a variety of techniques, ranging from hypnosis to anesthesia, are used. While imagery, relaxation, diversion, or participation can sometimes help the patient relax, alone these alone can rarely provide sufficient pain relief. As a result, opioids are the mainstay of treatment for the severely burned patient.Attorney Docket No. I2106-7000WO

[0004] Current dressings in clinical use frequently require cutting and unintended mechanical debridement (as opposed to intended mechanical debridement performed purposefully to remove eschar and dead tissue) further damaging the wound area. Thus, these and other attributes of an idealized spray-on wound dressing have been difficult to achieve in prior art compositions for this use.DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 is an image that shows an example of incomplete (left) and nearly complete (right) mixing in the drip test.

[0006] FIG. 2 is a set of images showing hydrogel dressing applied to a 2nddegree burn on a pig, covered with a gauze secondary dressing (top); further supporting (bolster) dressings cover the hydrogel (middle); and dressing appearance after 48 hours of wear and tear on the pig demonstrates a patent dressing (bottom).

[0007] FIG. 3 is a bar graph that shows quantification of bacterial skin cultures on 2nddegree wounds treated with hydrogel wound dressings (far right) [i.e. , bum (+), bacteria (+), hydrogel (+)], a comparative control (second from right) [burn (+), bacteria (+), Mepilex Ag (+)], positive control (second from left) [burn (+), bacteria (+), dressing (-)], or negative control (far left) [bum (+), bacteria (-), dressing (-)] for 2 days.

[0008] FIG. 4 is a set of images of zone of inhibition assays used to evaluate antimicrobial activity of hydrogel components and combined dressing against Pseudomonas aemginosa SMC 232 (top left), Escherichia coli SMC 4460 (top right), Candida Albicans SC5314 (bottom left), Staphylococcus aureus Newman (bottom right).

[0009] FIG. 5 is an artistic rendering of a bag-and-bag “BaB” (dual bag-on-valve) spray delivery system produced by Lindal Group, Gmbh with dark grey (left) and light grey (right) colored materials representing two different components maintained in isolation, in separate bags, within the outer, pressurized canister (top); and a graphical / schematic representation of the BaB system (bottom).

[0010] FIG. 6 is a SolidWorks rendering of one, individual, mixing segment (top left); the side and top view images of three 3D printed mixing segments (top right); SolidWorks rendering of a threaded cap section (bottom left); and ejection of material revealing poor mixing (component A, colored dark grey, and component B, colored light grey, can be seen as distinct bands throughout the mixing apparatus and also on the target indicating incomplete mixing) and runniness on the target (bottom right). The dark grey component A clumps towards theAttorney Docket No. I2106-7000WO bottom of the applied material and the light grey component B smears towards the top of the applied material in the bottom right image.[Oil] FIG. 7 is a SolidWorks rendering of 3D printed mixing tube apparatus with multiple large-to-small reductions (top); and ejection of material revealing poor mixing (component A, colored dark grey, and component B, colored light grey, can be seen as distinct bands throughout the mixing apparatus and also on the target indicating incomplete mixing) and runniness on the target (bottom). The dark grey component A clumps towards the bottom of the applied material and the light grey component B smears towards the top of the applied material in the bottom image.

[0012] FIG. 8 is a photograph (top left image) of a reducer (bottom left of photograph), actuator (top left of photograph; modified from commercial version to adapt to the mixing tube), mixing tube (middle of photograph), cap (right of photograph) and green, square -rod static mixer based off of interconnected cubes (bottom of photograph), a fully assembled BaB canister (top right image) with the mixing apparatus from the top left image; and, a photograph (bottom left image) of a reducer (bottom left of photograph), actuator (top left of photograph; modified from commercial version to adapt to the mixing tube), mixing tube (middle top of photograph), cap (right of photograph) and white cylindrical rod based off of counter rotating spiraling flutes / blades (bottom of photograph) as well as of an assembled BaB canister (bottom right image) with mixing apparatus from the bottom left image. Canister dimensions: 53 mm diameter, 175 mm tall (providing approximate scale).

[0013] FIG. 9 is an image showing incomplete mixing achieved with the dark grey, squarerod static mixer leads to dripping and runniness (top); and an image showing incomplete mixing achieved with the white, spiral cylindrical rod static mixer leads to dripping and runniness (bottom).

[0014] FIG. 10 is a photograph (top left image) of a reducer (bottom left of photograph), actuator (top left of photograph; modified from commercial version to adapt to the mixing tube), mixing tube (middle top of photograph), cap (top right of photograph) and sections of dark grey, square -rod static mixer with reticulated polyether foam (black) (bottom of photograph) and an assembled BaB canister (top right image) with mixing apparatus from top left image; and, a photograph (bottom left image) of a reducer (bottom left of photograph), actuator (top left of photograph; modified from commercial version to adapt to the mixing tube), mixing tube (middle top of photograph), cap (top right of photograph) and sections of white, spiral static mixer with reticulated polyether foam (black) (bottom of photograph) asAttorney Docket No. I2106-7000WO well as of an assembled BaB canister with mixing apparatus from bottom left image. Canister dimensions: 53 mm diameter, 175 mm tall (providing approximate scale).

[0015] FIG. 11 is an image showing incomplete mixing achieved with a combination of two dark grey, square -rod static mixer segments sandwiching a piece of reticulated polyether foam leads to some dripping and runniness (top); and an image showing incomplete mixing achieved with a combination of two white, spiral cylindrical rod static mixer segments sandwiching a piece of reticulated polyether foam leads to some dripping and runniness (bottom).

[0016] FIG. 12 is a photograph (top) of a reducer (bottom left of photograph), actuator (top left of photograph; modified from commercial version to adapt to the mixing tube), mixing tube (middle top of photograph), cap (top right of photograph) and white, spiral static mixer (middle of photograph) with (white) polyurethane foam (bottom of photograph); a photograph (middle) of a partially assembled mixing apparatus with polyurethane foam wrapped around static mixer and inserted part way into the tube; a photograph (bottom left) of an assembled BaB canister with mixing apparatus from top / middle photographs. Canister dimensions: 53 mm diameter, 175 mm tall (providing approximate scale). Also, a photograph (bottom right) showing complete mixing is achieved with the combination of white, spiral cylindrical rod static mixer wrapped in a piece of white polyurethane foam. Negligible runniness is observed with nearly instantaneous gelation occurring upon contact with the target.

[0017] FIG. 13 is an image showing complete mixing is achieved with the combination of white, spiral cylindrical rod static mixer wrapped in a piece of black polyurethane foam. Negligible runniness is observed with nearly instantaneous gelation occurring upon contact with the target.

[0018] FIG. 14 is an image showing complete, though slightly less complete than in FIGS. 12 and 13, mixing is achieved with the combination of white, spiral cylindrical rod static mixer wrapped in a piece of lower density black polyurethane foam. Negligible runniness is observed with nearly instantaneous gelation occurring upon contact with the target.

[0019] FIG. 15 is an image of an alternative cap designs that utilize a narrow slot rather than a round hole (top); and an image showing complete mixing is achieved with the combination of white, spiral cylindrical rod static mixer wrapped in a piece of white polyurethane foam (bottom). Negligible runniness is observed with nearly instantaneous gelation occurring upon contact with the target and a 1-2 cm wide band of material laid down.

[0020] FIG. 16 is an image (top) of an alternative means of securing the mixing apparatus to the actuator by press fitting the mixing tube inside of the actuator orifice (bottom of image)Attorney Docket No. I2106-7000WO rather than around the outside diameter of the actuator (top of image), which requires modification to the commercial, off-the-shelf design. A second image (bottom) shows the alignment of the mixing tubes and attachment geometry for the exterior (top of image) vs. interior (bottom of image) press fits.

[0021] FIG. 17 is a series of scatter plots showing the use of the wound dressing as a drug delivery device. Specifically, panels Al) and A2) show the release of fluorescently labeled Dextran into a sink / release buffer. Panel B) shows the release of a hydrophilic red dye into a sink / release buffer. Panels Cl) and C2) show the release of omegahydrdoxy emodin (OHM) into a sink / release buffer. Dashed horizontal lines in A2) and C2) are visual guides for 100% payload release. All data points represent the average of at least 3 separate experimental replicates; error bars show standard deviation.DETAILED DESCRIPTION

[0022] The present disclosure provides a hydrogel-based wound dressing, its material compositions, and methods of preparation and use thereof. Specifically, a hydrogel system is described that is applied on wounds as the mixture of two liquids that gel, in situ.

[0023] The present bum wound dressing is a two-part formulation that gels in situ, on demand, while being applied onto any wound surface including intricate places such as digits and the webbing of a human hand. The wound dressing is applied as a viscous liquid and, following application, rapidly crosslinks into a pliable, elastic, and conformal hydrogel dressing. The dressing maintains a moist environment to facilitate healing, is able to absorb exudate in weeping wounds or donate moisture in dry wounds and serves as both a physical and chemical barrier against bacterial infection.

[0024] Bum patients often experience excmciating pain as conventional dressings are peeled away (resulting in unintended debridement). The current dressing peels off readily thereby minimizing pain to the patient at the time of dressing change. The present bum gel slips off without need for any unintended debridement (though release of the dressing from the skin can be further aided by introducing water or saline or another lubricating fluid under the edge of the dressing as via a squirt bottle or syringe), significantly reducing the associated pain while also saving time for healthcare professionals changing the dressing.Components of the FormulationComponent AAttorney Docket No. I2106-7000WOSolvent

[0025] In certain embodiments, Component A comprises a solvent.

[0026] In certain embodiments, the solvent is water.

[0027] In certain embodiments, solvent is present in Component A in an amount of about 90% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 98%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 97%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 96%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 95%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 94%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 93%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 92%. In certain embodiments, solvent is present in Component A in an amount of about 90% to about 91%.

[0028] In certain embodiments, solvent is present in Component A in an amount of about 91% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 98%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 97%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 96%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 95%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 94%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 93%. In certain embodiments, solvent is present in Component A in an amount of about 91% to about 92%.

[0029] In certain embodiments, solvent is present in Component A in an amount of about 93% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 93% to about 98%. In certain embodiments, solvent is present in Component A in an amount of about 93% to about 97%. In certain embodiments, solvent is present in Component A in an amount of about 93% to about 96%. In certain embodiments, solvent is present in Component A in an amount of about 93% to about 95%. In certain embodiments, solvent is present in Component A in an amount of about 93% to about 94%.

[0030] In certain embodiments, solvent is present in Component A in an amount of about 94% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 94% to about 98%. In certain embodiments, solvent is present in Component A in anAttorney Docket No. I2106-7000WO amount of about 94% to about 97%. In certain embodiments, solvent is present in Component A in an amount of about 94% to about 96%. In certain embodiments, solvent is present in Component A in an amount of about 94% to about 95%.

[0031] In certain embodiments, solvent is present in Component A in an amount of about 95% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 95% to about 98%. In certain embodiments, solvent is present in Component A in an amount of about 95% to about 97%. In certain embodiments, solvent is present in Component A in an amount of about 95% to about 96%.

[0032] In certain embodiments, solvent is present in Component A in an amount of about 96% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 96% to about 98%. In certain embodiments, solvent is present in Component A in an amount of about 96% to about 97%.

[0033] In certain embodiments, solvent is present in Component A in an amount of about 97% to about 99%. In certain embodiments, solvent is present in Component A in an amount of about 97% to about 98%.

[0034] In certain embodiments, solvent is present in Component A in an amount of about 98% to about 99%.

[0035] In certain embodiments, solvent is present in Component A in an amount of about 99.5%. In certain embodiments, solvent is present in Component A in an amount of about 99%. In certain embodiments, solvent is present in Component A in an amount of about 98.5%. In certain embodiments, solvent is present in Component A in an amount of about 98%. In certain embodiments, solvent is present in Component A in an amount of about 97.5%. In certain embodiments, solvent is present in Component A in an amount of about 97%. In certain embodiments, solvent is present in Component A in an amount of about 96.5%. In certain embodiments, solvent is present in Component A in an amount of about 96%. In certain embodiments, solvent is present in Component A in an amount of about 95.5%. In certain embodiments, solvent is present in Component A in an amount of about 95%. In certain embodiments, solvent is present in Component A in an amount of about 94.5%. In certain embodiments, solvent is present in Component A in an amount of about 94%. In certain embodiments, solvent is present in Component A in an amount of about 93.5%. In certain embodiments, solvent is present in Component A in an amount of about 93%. In certain embodiments, solvent is present in Component A in an amount of about 92.5%. In certain embodiments, solvent is present in Component A in an amount of about 92%. In certainAttorney Docket No. I2106-7000WO embodiments, solvent is present in Component A in an amount of about 91.5%. In certain embodiments, solvent is present in Component A in an amount of about 91%. In certain embodiments, solvent is present in Component A in an amount of about 90.5%. In certain embodiments, solvent is present in Component A in an amount of about 90%.Alginate

[0036] Alginate is the primary structural component of the hydrogel that is crosslinked by calcium ions. Alginate also serves as a thickening agent and retains water.

[0037] In certain embodiments, alginate is present at an amount of about 1.0% to about 6%. In certain embodiments, alginate is present at an amount of about 1.0% to about 5.5%. In certain embodiments, alginate is present at an amount of about 1.0% to about 5.0%. In certain embodiments, alginate is present at an amount of about 1.0% to about 4.5%. In certain embodiments, alginate is present at an amount of about 1.0% to about 4.0%. In certain embodiments, alginate is present at an amount of about 1.0% to about 3.5%. In certain embodiments, alginate is present at an amount of about 1.0% to about 3.0%. In certain embodiments, alginate is present at an amount of about 1.0% to about 2.5%. In certain embodiments, alginate is present at an amount of about 1.0% to about 2.0%.

[0038] In certain embodiments, alginate is present at an amount of about 1.5% to about 6%. In certain embodiments, alginate is present at an amount of about 1.5% to about 5.5%. In certain embodiments, alginate is present at an amount of about 1.5% to about 5.0%. In certain embodiments, alginate is present at an amount of about 1.5% to about 4.5%. In certain embodiments, alginate is present at an amount of about 1.5% to about 4.0%. In certain embodiments, alginate is present at an amount of about 1.5% to about 3.5%. In certain embodiments, alginate is present at an amount of about 1.5% to about 3.0%. In certain embodiments, alginate is present at an amount of about 1.5% to about 2.5%. In certain embodiments, alginate is present at an amount of about 1.5% to about 2.0%.

[0039] In certain embodiments, alginate is present at an amount of about 2.0% to about 6%. In certain embodiments, alginate is present at an amount of about 2.0% to about 5.5%. In certain embodiments, alginate is present at an amount of about 2.0% to about 5.0%. In certain embodiments, alginate is present at an amount of about 2.0% to about 4.5%. In certain embodiments, alginate is present at an amount of about 2.0% to about 4.0%. In certain embodiments, alginate is present at an amount of about 2.0% to about 3.5%. In certainAttorney Docket No. I2106-7000WO embodiments, alginate is present at an amount of about 2.0% to about 3.0%. In certain embodiments, alginate is present at an amount of about 2.0% to about 2.5%.

[0040] In certain embodiments, alginate is present at an amount of about 2.5% to about 6%. In certain embodiments, alginate is present at an amount of about 2.5% to about 5.5%. In certain embodiments, alginate is present at an amount of about 2.5% to about 5.0%. In certain embodiments, alginate is present at an amount of about 2.5% to about 4.5%. In certain embodiments, alginate is present at an amount of about 2.5% to about 4.0%. In certain embodiments, alginate is present at an amount of about 2.5% to about 3.5%. In certain embodiments, alginate is present at an amount of about 2.5% to about 3.0%.

[0041] In certain embodiments, alginate is present at an amount of about 3.0% to about 6%. In certain embodiments, alginate is present at an amount of about 3.0% to about 5.5%. In certain embodiments, alginate is present at an amount of about 3.0% to about 5.0%. In certain embodiments, alginate is present at an amount of about 3.0% to about 4.5%. In certain embodiments, alginate is present at an amount of about 3.0% to about 4.0%. In certain embodiments, alginate is present at an amount of about 3.0% to about 3.5%.

[0042] In certain embodiments, alginate is present at an amount of about 3.5% to about 6%. In certain embodiments, alginate is present at an amount of about 3.5% to about 5.5%. In certain embodiments, alginate is present at an amount of about 3.5% to about 5.0%. In certain embodiments, alginate is present at an amount of about 3.5% to about 4.5%. In certain embodiments, alginate is present at an amount of about 3.5% to about 4.0%.

[0043] In certain embodiments, alginate is present at an amount of about 4.0% to about 6%. In certain embodiments, alginate is present at an amount of about 4.0% to about 5.5%. In certain embodiments, alginate is present at an amount of about 4.0% to about 5.0%. In certain embodiments, alginate is present at an amount of about 4.0% to about 4.5%.

[0044] In certain embodiments, alginate is present at an amount of about 1%. In certain embodiments, alginate is present at an amount of about 1.5%. In certain embodiments, alginate is present at an amount of about 2.0%. In certain embodiments, alginate is present at an amount of about 2.5%. In certain embodiments, alginate is present at an amount of about 1%. In certain embodiments, alginate is present at an amount of about 3.0%. In certain embodiments, alginate is present at an amount of about 3.5%. In certain embodiments, alginate is present at an amount of about 4.0%. In certain embodiments, alginate is present at an amount of about 4.5%. In certain embodiments, alginate is present at an amount of about 5.0%. In certain embodiments, alginate is present at an amount of about 5.5%. In certain embodiments, alginate is present atAttorney Docket No. I2106-7000WO an amount of about 6.0%. In certain embodiments, alginate is present at an amount of about 6.5%. In certain embodiments, alginate is present at an amount of about 7.0%. In certain embodiments, alginate is present at an amount of about 7.5%. In certain embodiments, alginate is present at an amount of about 8.0%.Thickening Agent

[0045] In certain embodiments, Component A further comprises a thickening / suspending agent.

[0046] In certain embodiments, the thickening agent is selected from the group including xanthan gum, guar gum, locust bean gum, cornstarch, agar, carrageenan, pullulan, carboxymethylcellulose and hypromellose and other cellulose derivatives, alginate, calcium alginate, glucomannan, galactomannan, dextran, hyaluronic acid, chitosan, fumed silica, polyethylene glycol), poly(acrylic acid), and poly(vinyl alcohol).

[0047] In certain embodiments, the thickening / suspending agent is xanthan.

[0048] In certain embodiments, the thickening / suspending agent is present in Component A at an amount of about 0.05% to about 0.5%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.45%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.40%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.35%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.30%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.25%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.20%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.15%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.05% to about 0.10%.

[0049] In certain embodiments, the thickening / suspending agent is present in Component A at an amount of about 0.10% to about 0.5%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10% to about 0.45%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10% to about 0.40%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10% to about 0.35%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10% to about 0.30%. In certain embodiments, the thickening agentAttorney Docket No. I2106-7000WO is present in Component A at an amount of about 0.10% to about 0.25%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10% to about 0.20%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10% to about 0.15%.

[0050] In certain embodiments, the thickening / suspending agent is present in Component A at an amount of about 0.15% to about 0.5%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15% to about 0.45%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15% to about 0.40%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15% to about 0.35%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15% to about 0.30%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15% to about 0.25%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15% to about 0.20%.

[0051] In certain embodiments, the thickening / suspending agent is present in Component A at an amount of about 0.20% to about 0.5%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.20% to about 0.45%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.20% to about 0.40%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.20% to about 0.35%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.20% to about 0.30%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.20% to about 0.25%.

[0052] In certain embodiments, the thickening / suspending agent is present in Component A at an amount of about 0.25% to about 0.5%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.25% to about 0.45%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.25% to about 0.40%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.25% to about 0.35%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.25% to about 0.30%.

[0053] In certain embodiments, the thickening / suspending agent is present in Component A at an amount of about 0.05%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.10%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.15%. In certain embodiments, the thickeningAttorney Docket No. I2106-7000WO agent is present in Component A at an amount of about 0.20%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.25%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.30%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.35%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.40%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.45%. In certain embodiments, the thickening agent is present in Component A at an amount of about 0.50%.

[0054] In certain embodiments, the thickening / suspending agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.5%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.45%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.40%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.35%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.30%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.25%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.20%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.15%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.05% to about 0.10%.

[0055] In certain embodiments, the thickening / suspending agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.5%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.45%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.40%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.35%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.30%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.25%. In certain embodiments, the thickening agentAttorney Docket No. I2106-7000WO is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.20%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10% to about 0.15%.

[0056] In certain embodiments, the thickening / suspending agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.5%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.45%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.40%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.35%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.30%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.25%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15% to about 0.20%.

[0057] In certain embodiments, the thickening / suspending agent is xanthan, and xanthan is present in Component A at an amount of about 0.20% to about 0.5%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.20% to about 0.45%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.20% to about 0.40%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.20% to about 0.35%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.20% to about 0.30%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.20% to about 0.25%.

[0058] In certain embodiments, the thickening / suspending agent is xanthan, and xanthan is present in Component A at an amount of about 0.25% to about 0.5%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.25% to about 0.45%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.25% to about 0.40%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.25% to about 0.35%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.25% to about 0.30%.Attorney Docket No. I2106-7000WO

[0059] In certain embodiments, the thickening / suspending agent is xanthan, and xanthan is present in Component A at an amount of about 0.05%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.10%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.15%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.20%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.25%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.30%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.35%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.40%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.45%. In certain embodiments, the thickening agent is xanthan, and xanthan is present in Component A at an amount of about 0.50%.Calcium Salt

[0060] Component A further comprises a crosslinking agent. In certain embodiments, the crosslinking agent becomes a multivalent (e.g., a divalent or trivalent) cation upon dissolution in water.

[0061] In certain embodiments, the crosslinking agent is a calcium salt.

[0062] In certain embodiments, the calcium salt is selected from the group including calcium carbonate, calcium phosphate, calcium sulfate, calcium oxalate, calcium hydroxide, calcium lactate, calcium fluoride, and calcium gluconate.

[0063] In certain embodiments, the crosslinking agent is a zinc salt (e.g., zinc sulfate or zinc oxide), ferrous sulfate, a magnesium salt (e.g., magnesium chloride, magnesium sulfate, or magnesium oxide), a copper salt (e.g., copper sulfate), strontium carbonate.

[0064] In certain embodiments, the calcium salt is calcium carbonate.

[0065] In certain embodiments, the calcium salt is present in Component A as a particle.

[0066] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particleAttorney Docket No. I2106-7000WO having an average diameter of about 0.5 |am to about 400 |am. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 10 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 5 pm. In certain embodiments,Attorney Docket No. I2106-7000WO the calcium salt is present in Component A as a particle having an average diameter of about 0.5 pm to about 1 pm.

[0067] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle havingAttorney Docket No. I2106-7000WO an average diameter of about 1 |am to about 20 |am. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 10 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm to about 5 pm.

[0068] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about2.5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about2.5 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about2.5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A asAttorney Docket No. I2106-7000WO a particle having an average diameter of about 2.5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about2.5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about2.5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about2.5 pm to about 10 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2.5 pm to about 5 pm.

[0069] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 80 pm. In certain embodiments, the calcium saltAttorney Docket No. I2106-7000WO is present in Component A as a particle having an average diameter of about 5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm to about 10 pm.

[0070] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component A as aAttorney Docket No. I2106-7000WO particle having an average diameter of about 7.5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about7.5 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about7.5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about7.5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about7.5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7.5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about7.5 pm to about 10 pm.

[0071] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle havingAttorney Docket No. I2106-7000WO an average diameter of about 10 |am to about 110 |am. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm to about 15 pm.

[0072] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 120Attorney Docket No. I2106-7000WO m. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 115 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 15 pm to about 20 pm.

[0073] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 120Attorney Docket No. I2106-7000WO m. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 115 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm to about 30 pm.

[0074] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 115 pm. In certain embodiments, the calcium saltAttorney Docket No. I2106-7000WO is present in Component A as a particle having an average diameter of about 25 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 25 pm to about 30 pm.

[0075] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 115 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particleAttorney Docket No. I2106-7000WO having an average diameter of about 30 |am to about 90 |am. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm to about 40 pm.

[0076] In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 1 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 2 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 3 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 4 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 5 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 6 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 7 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 8 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 9 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 10 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 12 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 14 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 16 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 18 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 20 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 22 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 24 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of aboutAttorney Docket No. I2106-7000WO26 m. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 28 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 30 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 32 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 34 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 36 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 38 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 40 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 42 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 44 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 46 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 48 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 50 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 55 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 60 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 65 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 70 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 75 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 80 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 85 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 90 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 95 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 100 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 150 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 200 pm. In certain embodiments, the calcium salt is present in ComponentAttorney Docket No. I2106-7000WOA as a particle having an average diameter of about 250 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 300 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 350 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 400 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 450 pm. In certain embodiments, the calcium salt is present in Component A as a particle having an average diameter of about 500 pm.

[0077] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.08%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.06%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.04%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001% to about 0.02%.

[0078] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 1.8%. In certain embodiments, the calcium salt isAttorney Docket No. I2106-7000WO present in Component A at an amount of about 0.005% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.08%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.06%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.04%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005% to about 0.02%.

[0079] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.3%. In certain embodiments, the calcium salt is present inAttorney Docket No. I2106-7000WOComponent A at an amount of about 0.01% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.08%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.06%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.04%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01% to about 0.02%.

[0080] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.08%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.06%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03% to about 0.04%.

[0081] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to aboutAttorney Docket No. I2106-7000WO1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.08%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05% to about 0.06%.

[0082] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08% to about 0.1%.

[0083] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 1.6%. In certain embodiments, theAttorney Docket No. I2106-7000WO calcium salt is present in Component A at an amount of about 0.1% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1% to about 0.1%.

[0084] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 0.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15% to about 0.2%.

[0085] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to aboutAttorney Docket No. I2106-7000WO1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 0.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2% to about 0.3%.

[0086] In certain embodiments, the calcium salt is present in Component A at an amount of about 0.001%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.002%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.005%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.008%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.01%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.02%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.03%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.04%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.05%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.06%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.07%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.08%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.09%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.12%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.15%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.18%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.22%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.25%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.28%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.30%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.32%. InAttorney Docket No. I2106-7000WO certain embodiments, the calcium salt is present in Component A at an amount of about 0.35%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.38%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.40%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.42%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.45%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.48%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.7%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 0.9%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.0%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.1%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.2%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.3%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.4%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.5%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.6%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.7%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.8%. In certain embodiments, the calcium salt is present in Component A at an amount of about 1.9%. In certain embodiments, the calcium salt is present in Component A at an amount of about 2.0%.

[0087] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001%Attorney Docket No. I2106-7000WO to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.08%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.06%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.04%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001% to about 0.02%.

[0088] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present inAttorney Docket No. I2106-7000WOComponent A at an amount of about 0.005% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.08%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.06%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.04%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005% to about 0.02%.

[0089] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate and is present in Component A at an amount of about 0.01% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.08%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.06%. In certain embodiments, theAttorney Docket No. I2106-7000WO calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.04%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01% to about 0.02%.

[0090] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.08%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.06%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03% to about 0.04%.

[0091] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 1.6%. In certain embodiments, the calciumAttorney Docket No. I2106-7000WO salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.08%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05% to about 0.06%.

[0092] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to aboutAttorney Docket No. I2106-7000WO0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08% to about 0.1%.

[0093] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1% to about 0.1%.

[0094] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 1.2%. In certain embodiments, the calciumAttorney Docket No. I2106-7000WO salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 0.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15% to about 0.2%.

[0095] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 0.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2% to about 0.3%.

[0096] In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.001%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.002%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.005%. In certain embodiments, the calcium salt is calcium carbonate, and isAttorney Docket No. I2106-7000WO present in Component A at an amount of about 0.008%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.01%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.02%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.03%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.04%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.05%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.06%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.07%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.08%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.09%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.12%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.15%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.18%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.22%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.25%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.28%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.30%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.32%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.35%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.38%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.40%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.42%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.45%. In certain embodiments, the calciumAttorney Docket No. I2106-7000WO salt is calcium carbonate, and is present in Component A at an amount of about 0.48%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.7%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 0.9%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.0%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.1%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.2%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.3%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.4%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.5%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.6%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.7%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.8%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 1.9%. In certain embodiments, the calcium salt is calcium carbonate, and is present in Component A at an amount of about 2.0%.Antimicrobial Agent

[0097] In certain embodiments, Component A further comprises an antimicrobial agent.

[0098] In certain embodiments, the antimicrobial agent is selected from the group including water-soluble and water-insoluble silver salts, silver nitrate, colloidal silver, metallic silver, non- silver metals (including bismuth, copper, zinc), polymer-based antimicrobials (including Polyhexamethylene Biguanide or PHMB), quaternary ammonium compounds (e.g., benzalkonium chloride), and oxidizing agents (e.g., hydrogen peroxide, hypochlorous acid / sodium hypochlorite), antibiotic agents such as penicillin, amoxicillin, ciprofloxacin, erythromycin, tetracycline, vancomycin, doxycycline, azithromycin, metronidazole,Attorney Docket No. I2106-7000WO antifungals such as fluconazole, ketoconazole, amphotericin B, nystatin, clotrimazole, terbinafine, antivirals such as acyclovir, oseltamivir (Tamiflu), zidovudine, remdesivir, valacyclovir, ganciclovir, antiparasitics such as ivermectin, chloroquine, metronidazole, albendazole, praziquantel, broad range antiseptics such as chlorhexidine, hydrogen peroxide, or povidone-iodine, and quorum sensing inhibitors such as omega(hydroxyemodin) or apicidin, among others.

[0099] In certain embodiments the antimicrobial agent is released from the wound dressing to treat the local tissue. In certain embodiments the release rate is between 1% - 99% within 24 hours. In certain embodiments the release rate is between 10% - 90% within 24 hours. In certain embodiments the release rate is between 20% - 80% within 24 hours. In certain embodiments the release rate is between 30% - 70% within 24 hours. In certain embodiments the release rate is between 1% - 99% within 48 hours. In certain embodiments the release rate is between 10% - 90% within 48 hours. In certain embodiments the release rate is between 20% - 80% within 48 hours. In certain embodiments the release rate is between 30% - 70% within 48 hours. In certain embodiments the release rate is between 1% - 99% within 3 days. In certain embodiments the release rate is between 10% - 90% within 3 days. In certain embodiments the release rate is between 20% - 80% within 3 days. In certain embodiments the release rate is between 30% - 70% within 3 days. In certain embodiments the release rate is between 1% - 99% within 7 days. In certain embodiments the release rate is between 10% - 90% within 7 days. In certain embodiments the release rate is between 20% - 80% within 7 days. In certain embodiments the release rate is between 30% - 70% within 7 days.

[0100] In certain embodiments, the antimicrobial agent is a water-soluble silver salt.

[0101] In certain embodiments, the water-soluble silver salt is selected from the group including silver nitrate, silver sulfadiazine, silver oxide, silver sulfate, silver chloride, silver phosphate, silver lactate, silver acetate, silver sodium hydrogen zirconium phosphate, silver carboxymethylcellulose and other anionic polymers with silver counterions.

[0102] In certain embodiments, the water-soluble silver salt is silver nitrate.

[0103] In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.06%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.055%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.05%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.045%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to aboutAttorney Docket No. I2106-7000WO0.04%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.035%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.03%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.025%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.02%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.015%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.005% to about 0.01%.

[0104] In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.06%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.52%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.05%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.045%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.04%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.035%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.03%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.025%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.02%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01% to about 0.015%.

[0105] In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.06%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.055%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.05%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.045%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.04%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.035%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.03%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.025%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015% to about 0.02%.Attorney Docket No. I2106-7000WO

[0106] In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.06%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.055%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.05%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.045%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.04%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.035%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.03%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02% to about 0.025%.

[0107] In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.06%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.055%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.05%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.045%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.04%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.035%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025% to about 0.03%.

[0108] In certain embodiments, the silver salt is present in Component A at an amount of about 0.005%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.01%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.015%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.02%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.025%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.03%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.035%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.04%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.045%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.50%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.055%. In certain embodiments, the silver salt is present in Component A at an amount of about 0.06%.Attorney Docket No. I2106-7000WO

[0109] In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.06%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.055%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.05%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.045%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.04%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.035%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.03%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.025%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.02%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.015%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005% to about 0.01%.

[0110] In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.06%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.55%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.05%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.045%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.04%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.035%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.03%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.025%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present inAttorney Docket No. I2106-7000WOComponent A at an amount of about 0.01% to about 0.02%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01% to about 0.015%.

[0111] In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.06%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.055%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.05%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.045%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.04%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.035%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.03%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.025%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015% to about 0.02%.

[0112] In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.06%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.055%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.05%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.045%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.04%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.035%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.03%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02% to about 0.025%.

[0113] In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.06%. In certain embodiments, theAttorney Docket No. I2106-7000WO silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.055%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.05%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.045%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.04%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.035%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025% to about 0.03%.

[0114] In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.005%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.01%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.015%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.02%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.025%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.03%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.035%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.04%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.045%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.50%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.055%. In certain embodiments, the silver salt is silver nitrate, and the silver nitrate is present in Component A at an amount of about 0.06%.

[0115] In certain embodiments, the water-soluble silver salt is used in combination with a chloride salt that reacts with the water-soluble silver salt to form silver chloride colloids which exist as suspensions in the formulation, thereby serving as a source of silver ions and imparting antimicrobial activity.Attorney Docket No. I2106-7000WO

[0116] In certain embodiments, the chloride salt is a potassium chloride or sodium chloride. In certain embodiments, the chloride salt is beryllium chloride, magnesium chloride, strontium chloride, or calcium chloride. In certain embodiments, the calcium salt is hydrogen chloride.

[0117] In certain embodiments, the water-soluble silver salt reacts with the chloride salt to form silver chloride. In certain embodiments, the silver chloride forms a colloid.

[0118] In certain embodiments, the molar ratio of the chloride salt to the silver salt is 100:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 95:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 90:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 85:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 80:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 75:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 70:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 65:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 60:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 55:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 50:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 45:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 40:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 35:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 30:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 25:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 20:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 15:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 10:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 9:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 8:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 7:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 6:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 5:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 4.5:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 4:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 3.5:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 3:1. In certainAttorney Docket No. I2106-7000WO embodiments, the molar ratio of the chloride salt to the silver salt is 2.5:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 2:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.8:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.6:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.5:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.4:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.3:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.2:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1.1:1. In certain embodiments, the molar ratio of the chloride salt to the silver salt is 1:1.

[0119] In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 100:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 95: 1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 90:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 85:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 80:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 75:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 70:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 65:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 60:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 55:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 50:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 45:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 40:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 35:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 30:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 25:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 20:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 15:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 10:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 9: 1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 8:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 7:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 6:1. In certainAttorney Docket No. I2106-7000WO embodiments, the molar ratio of the sodium chloride to the silver nitrate is 5:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 4.5:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 4:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 3.5:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 3:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 2.5:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 2:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.8:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.6:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.5:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.4:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.3:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.2:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1.1:1. In certain embodiments, the molar ratio of the sodium chloride to the silver nitrate is 1:1.

[0120] In certain embodiments, Silver Acetate was added to component A as an antimicrobial agent instead of silver nitrate.

[0121] Silver Acetate was added either in combination with sodium chloride or by itself with no sodium chloride.

[0122] In certain embodiments, silver acetate was added at 0.03% with 0.5% sodium chloride.

[0123] In other embodiments, silver acetate was added at 0.005% , 0.01% and 0.03% without any sodium.

[0124] In certain embodiments, both variations of the silver acetate formulations — with and without sodium chloride — remained stable for up to eight months without exhibiting any signs of autogelation. However, the formulation containing 0.03% silver acetate in the absence of sodium chloride developed a dark brown coloration within approximately one month, despite being protected from light and heat. This observation indicates that a silver acetate concentration of 0.03% without sodium chloride may not be the best candidate for the formulation as it would be aesthetically questionable.

[0125] In contrast, the corresponding formulation containing 0.03% silver acetate and 0.5% sodium chloride in Component A, along with the other component A ingredients (e.g., 3-3.5% alginate, 0.2% xanthan, 0.3%-0.35% calcium carbonate), retained its original color and appearance over the same time period. Formulations prepared with lower silver acetateAttorney Docket No. I2106-7000WO concentrations (0.005% and 0.01%) in the absence of sodium chloride remained flowable and did not exhibit darkening, although a slight beige tint was observed. Additionally, at these lower concentrations, the formulations appeared marginally less viscous (i.e., more fluid) than those containing sodium chloride, even when equivalent alginate and xanthan gum levels were maintained.

[0126] In certain embodiments, Component A formulations containing silver acetate at concentrations ranging from approximately 0.005% to 0.03%, in the absence of sodium chloride but comprising nominal amounts of other constituents — namely 3%-4% alginate, 0.2% xanthan gum, and 0.3%-0.4% calcium carbonate — demonstrated performance characteristics comparable to, or potentially superior to, the existing formulation containing 3%-4% alginate, 0.2% xanthan gum, 0.3%-0.4% calcium carbonate, 0.3% silver nitrate, and 0.5% sodium chloride.

[0127] Without being bound by theory, it is contemplated that the silver acetate-based formulation may exhibit enhanced antimicrobial activity, as the silver species are expected to exist predominantly in ionic form (subject to verification). Furthermore, due to its more flowable rheological profile, this formulation may permit incorporation of higher alginate or xanthan concentrations without adversely affecting spray performance. Increased alginate content may, in turn, contribute to improved gel mechanical strength.

[0128] Furthermore, formulations containing lower concentrations of silver acetate (approximately 0.005%-0.03%) in the absence of sodium chloride exhibited slightly slower gelation kinetics when crosslinked with Component B comprising 0.4% salicylic acid, 85% glycerol, 15% polyethylene glycol (PEG), and 2.71% glucono-6-lactone (GDL). This observation suggests that such Component A formulations may be capable of accommodating modestly higher salicylic acid concentrations (i.e., greater than 0.4%) while maintaining acceptable gelation behavior.

[0129] In certain embodiments, sodium benzoate was incorporated to enhance the overall preservative efficacy of the formulation. It was theorized that the presence of approximately 0.0253% silver chloride — resulting from the combination of 0.03% silver nitrate and 0.5% sodium chloride — may not alone provide sufficient fungicidal and bactericidal activity to eliminate or inhibit potential microbial contamination introduced during manufacturing or filling operations. Such contamination may originate from spores or microorganisms present in raw materials, including packaging components (e.g., tubes or cans) or other formulation ingredients, which may be difficult to completely avoid.Attorney Docket No. I2106-7000WO

[0130] Accordingly, 1% sodium benzoate was evaluated in a Component A formulation comprising 3% alginate, 0.2% xanthan gum, 0.3% calcium carbonate, and either 0.3% silver acetate or 0.3% silver nitrate in combination with 0.5% sodium chloride. Formulations containing silver acetate and silver nitrate were prepared and tested independently to assess autogelation tendencies and their effects on gelation performance. Both variations of Component A, containing either 0.3% silver acetate or 0.3% silver nitrate along with the aforementioned excipients, demonstrated stability over a nine-month period, exhibiting no signs of autogelation while maintaining consistent gelation behavior.Component BSolvent

[0131] In certain embodiments, Component B comprises a solvent.

[0132] In certain embodiments, the solvent is glycerol, propylene glycol, or ethylene glycol.

[0133] In certain embodiments, the solvent is glycerol.

[0134] In certain embodiments, solvent is present in Component B in an amount of about 60% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 74%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 72%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 70%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 68%. In certain embodiments, solvent is present in Component B in an amount of about 60% to about 66%.

[0135] In certain embodiments, solvent is present in Component B in an amount of about 62% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 90%. In certain embodiments, solvent is present in Component B in anAttorney Docket No. I2106-7000WO amount of about 62% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 74%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 72%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 70%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 68%. In certain embodiments, solvent is present in Component B in an amount of about 62% to about 66%.

[0136] In certain embodiments, solvent is present in Component B in an amount of about 64% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 74%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 72%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 70%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 68%. In certain embodiments, solvent is present in Component B in an amount of about 64% to about 66%.

[0137] In certain embodiments, solvent is present in Component B in an amount of about 66% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 88%. In certain embodiments, solvent is present in ComponentAttorney Docket No. I2106-7000WOB in an amount of about 66% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 74%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 72%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 70%. In certain embodiments, solvent is present in Component B in an amount of about 66% to about 68%.

[0138] In certain embodiments, solvent is present in Component B in an amount of about 68% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 74%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 72%. In certain embodiments, solvent is present in Component B in an amount of about 68% to about 70%.

[0139] In certain embodiments, solvent is present in Component B in an amount of about 64% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 80%. In certainAttorney Docket No. I2106-7000WO embodiments, solvent is present in Component B in an amount of about 70% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 74%. In certain embodiments, solvent is present in Component B in an amount of about 70% to about 72%.

[0140] In certain embodiments, solvent is present in Component B in an amount of about 72% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 76%. In certain embodiments, solvent is present in Component B in an amount of about 72% to about 74%.

[0141] In certain embodiments, solvent is present in Component B in an amount of about 74% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 78%. In certain embodiments, solvent is present in Component B in an amount of about 74% to about 76%.

[0142] In certain embodiments, solvent is present in Component B in an amount of about 76% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 76% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 76% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 76% to about 86%. In certain embodiments, solvent is present inAttorney Docket No. I2106-7000WOComponent B in an amount of about 76% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 76% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 76% to about 80%. In certain embodiments, solvent is present in Component B in an amount of about 76% to about 78%.

[0143] In certain embodiments, solvent is present in Component B in an amount of about 78% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 78% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 78% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 78% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 78% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 78% to about 82%. In certain embodiments, solvent is present in Component B in an amount of about 78% to about 80%.

[0144] In certain embodiments, solvent is present in Component B in an amount of about 80% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 80% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 80% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 80% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 80% to about 84%. In certain embodiments, solvent is present in Component B in an amount of about 80% to about 82%.

[0145] In certain embodiments, solvent is present in Component B in an amount of about 82% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 82% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 82% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 82% to about 86%. In certain embodiments, solvent is present in Component B in an amount of about 82% to about 84%.

[0146] In certain embodiments, solvent is present in Component B in an amount of about 84% to about 95%. In certain embodiments, solvent is present in Component B in an amount of about 84% to about 90%. In certain embodiments, solvent is present in Component B in an amount of about 84% to about 88%. In certain embodiments, solvent is present in Component B in an amount of about 84% to about 86%.Diluent / co-solvent

[0147] In certain embodiments, Component B further comprises a diluent / co-solvent.

[0148] In certain embodiments, the diluent / co-solvent is an alcohol.Attorney Docket No. I2106-7000WO

[0149] In certain embodiments, the diluent / co-solvent is ethylene glycol or propylene glycol.

[0150] In certain embodiments, the diluent / co-solvent is poly (ethylene glycol) (PEG) or polypropylene glycol) (PPG).

[0151] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 0% to about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 35%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 30%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 25%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 0% to about 20%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 15%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 10%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 0% to about 5%.

[0152] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 5% to about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 35%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 30%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 25%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 5% to about 20%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 15%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5% to about 10%.

[0153] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 10% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 10% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 10% to about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 10% toAttorney Docket No. I2106-7000WO about 35%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 10% to about 30%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 10% to about 25%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 10% to about 20%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 10% to about 15%.

[0154] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 15% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 15% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 15% to about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 15% to about 35%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 15% to about 30%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 15% to about 25%. In certain embodiments, The diluent / co-solvent is present in Component B at an amount of about 15% to about 20%.

[0155] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 20% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 20% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 20% to about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 20% to about 35%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 20% to about 30%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 20% to about 25%.

[0156] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 25% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 25% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 25% to about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 25% to about 35%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 25% to about 30%.

[0157] In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 30% to about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 30% to about 45%. In certain embodiments, the diluent / co-Attorney Docket No. I2106-7000WO solvent is present in Component B at an amount of about 30% to about 40%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 30% to about 35%.

[0158] In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 35% to about 50%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 35% to about 45%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 35% to about 40%.

[0159] In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 40% to about 50%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 40% to about 45%.

[0160] In certain embodiments, the diluent / co- solvent is absent in Component B. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 5%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 10%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 15%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 20%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 25%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 30%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 35%. In certain embodiments, the diluent / co- solvent is present in Component B at an amount of about 40%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 45%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 50%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 55%. In certain embodiments, the diluent / co-solvent is present in Component B at an amount of about 60%.

[0161] In certain embodiments, the molecular weight of the PEG is about 200 to about 4000.In certain embodiments, the molecular weight of the PEG is about 200 to about 3000. In certain embodiments, the molecular weight of the PEG is about 200 to about 2000. In certain embodiments, the molecular weight of the PEG is about 200 to about 1500. In certain embodiments, the molecular weight of the PEG is about 200 to about 1000. In certain embodiments, the molecular weight of the PEG is about 200 to about 800.

[0162] In certain embodiments, the molecular weight of the PEG is about 200. In certain embodiments, the molecular weight of the PEG is about 300. In certain embodiments, theAttorney Docket No. I2106-7000WO molecular weight of the PEG is about 400. In certain embodiments, the molecular weight of the PEG is about 500. In certain embodiments, the molecular weight of the PEG is about 600. In certain embodiments, the molecular weight of the PEG is about 700. In certain embodiments, the molecular weight of the PEG is about 800. In certain embodiments, the molecular weight of the PEG is about 900. In certain embodiments, the molecular weight of the PEG is about 1000. In certain embodiments, the molecular weight of the PEG is about 1500. In certain embodiments, the molecular weight of the PEG is about 2000. In certain embodiments, the molecular weight of the PEG is about 3000. In certain embodiments, the molecular weight of the PEG is about 4000.

[0163] In certain embodiments, PEG is present in Component B at an amount of about 0% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 35%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 30%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 25%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 20%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 15%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 10%. In certain embodiments, PEG is present in Component B at an amount of about 0% to about 5%.

[0164] In certain embodiments, PEG is present in Component B at an amount of about 5% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 35%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 30%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 25%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 20%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 15%. In certain embodiments, PEG is present in Component B at an amount of about 5% to about 10%.

[0165] In certain embodiments, PEG is present in Component B at an amount of about 10% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 10% to about 45%. In certain embodiments, PEG is present in Component B at an amount ofAttorney Docket No. I2106-7000WO about 10% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 10% to about 35%. In certain embodiments, PEG is present in Component B at an amount of about 10% to about 30%. In certain embodiments, PEG is present in Component B at an amount of about 10% to about 25%. In certain embodiments, PEG is present in Component B at an amount of about 10% to about 20%. In certain embodiments, PEG is present in Component B at an amount of about 10% to about 15%.

[0166] In certain embodiments, PEG is present in Component B at an amount of about 15% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 15% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 15% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 15% to about 35%. In certain embodiments, PEG is present in Component B at an amount of about 15% to about 30%. In certain embodiments, PEG is present in Component B at an amount of about 15% to about 25%. In certain embodiments, PEG is present in Component B at an amount of about 15% to about 20%.

[0167] In certain embodiments, PEG is present in Component B at an amount of about 20% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 20% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 20% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 20% to about 35%. In certain embodiments, PEG is present in Component B at an amount of about 20% to about 30%. In certain embodiments, PEG is present in Component B at an amount of about 20% to about 25%.

[0168] In certain embodiments, PEG is present in Component B at an amount of about 25% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 25% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 25% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 25% to about 35%. In certain embodiments, PEG is present in Component B at an amount of about 25% to about 30%.

[0169] In certain embodiments, PEG is present in Component B at an amount of about 30% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 30% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 30% to about 40%. In certain embodiments, PEG is present in Component B at an amount of about 30% to about 35%.Attorney Docket No. I2106-7000WO

[0170] In certain embodiments, PEG is present in Component B at an amount of about 35% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 35% to about 45%. In certain embodiments, PEG is present in Component B at an amount of about 35% to about 40%.

[0171] In certain embodiments, PEG is present in Component B at an amount of about 40% to about 50%. In certain embodiments, PEG is present in Component B at an amount of about 40% to about 45%.

[0172] In certain embodiments, PEG is absent in Component B. In certain embodiments, PEG is present in Component B at an amount of about 5%. In certain embodiments, PEG is present in Component B at an amount of about 10%. In certain embodiments, PEG is present inComponent B at an amount of about 15%. In certain embodiments, PEG is present inComponent B at an amount of about 20%. In certain embodiments, PEG is present inComponent B at an amount of about 25%. In certain embodiments, PEG is present inComponent B at an amount of about 30%. In certain embodiments, PEG is present inComponent B at an amount of about 35%. In certain embodiments, PEG is present inComponent B at an amount of about 40%. In certain embodiments, PEG is present inComponent B at an amount of about 45%. In certain embodiments, PEG is present inComponent B at an amount of about 50%. In certain embodiments, PEG is present inComponent B at an amount of about 55%. In certain embodiments, PEG is present inComponent B at an amount of about 60%.

[0173] In certain embodiments, PEG has a molecular weight of about 200, and is present inComponent B at an amount of about 0% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 30%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 25%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 20%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 15%. In certain embodiments, PEG has a molecular weight of about 200, and is presentAttorney Docket No. I2106-7000WO in Component B at an amount of about 0% to about 10%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 0% to about 5%.

[0174] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 30%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 25%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 20%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 15%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5% to about 10%.

[0175] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 30%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 25%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 20%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10% to about 15%.

[0176] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% toAttorney Docket No. I2106-7000WO about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% to about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% to about 30%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% to about 25%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15% to about 20%.

[0177] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20% to about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20% to about 30%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20% to about 25%.

[0178] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 25% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 25% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 25% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 25% to about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 25% to about 30%.

[0179] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 30% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 30% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 30% to about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 30% to about 35%.Attorney Docket No. I2106-7000WO

[0180] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 35% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 35% to about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 35% to about 40%.

[0181] In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 40% to about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 40% to about 45%.

[0182] In certain embodiments, PEG has a molecular weight of about 200, and is absent in Component B. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 5%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 10%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 15%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 20%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 25%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 30%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 35%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 40%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 45%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 50%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 55%. In certain embodiments, PEG has a molecular weight of about 200, and is present in Component B at an amount of about 60%.Glucono-delta-lactone (GDL)

[0183] In certain embodiments, Component B further comprises GDL. Glucono-delta-lactone (GDL) serves to acidify the combination of components A and B post mixing. It is hydrolytically cleaved from its cyclic form to become gluconic acid, whereupon this reduces the pH of the combined A + B system, leading to the solubilization of calcium carbonate and subsequent crosslinking of alginate. GDL is added in proportion to the amount of calciumAttorney Docket No. I2106-7000WO carbonate, whether calcium carbonate is in component A or component B. Dissolved titers of GDL ranging from 0% GDL to 15% (i.e., 0:1 to 10:1 GDL:calcium carbonate molar ratio) in component B have been tested and were found to be compatible. However, > 3:1 GDL:calcium carbonate was found to increase syneresis for a given calcium carbonate concentration while providing no benefit in terms of expedited gelation. Therefore, the most optimal GDL:calcium carbonate molar ratio is 2:1 across all ranges of alginate (i.e., 1% to 5%). As the most optimal calcium carbonate concentration was also determined to be in a 2:1 molar ratio with respect to alginate, the actual concentration of GDL will vary according to the amount of alginate. For example, 3% alginate will require 0.3% calcium carbonate in component A.

[0184] In certain embodiments, GDL is present in Component B at an amount of about 1% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 2.2%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 2.0%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 1.8%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 1.6%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 1.4%. In certain embodiments, GDL is present in Component B at an amount of about 1% to about 1.2%.

[0185] In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount ofAttorney Docket No. I2106-7000WO about 1.2% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 2.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 2.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 1.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.2% to about 1.6%.

[0186] In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 2.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 2.0%. In certain embodiments, GDL is present inAttorney Docket No. I2106-7000WOComponent B at an amount of about 1.4% to about 1.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.4% to about 1.6%.

[0187] In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 2.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 2.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.6% to about 1.8%.

[0188] In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 3%. In certain embodiments, GDL is present in Component B at an amount of aboutAttorney Docket No. I2106-7000WO1.8% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 2.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 2.0%. In certain embodiments, GDL is present in Component B at an amount of about 1.8% to about 1.8%.

[0189] In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.0% to about 2.2%.

[0190] In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% toAttorney Docket No. I2106-7000WO about 3%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 2.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.2% to about 2.6%.

[0191] In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 2.4% to about 2.8%.

[0192] In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 3%. In certain embodiments, GDL is present in Component B at an amount of about 2.6% to about 2.8%.

[0193] In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 5%. In certain embodiments, GDL is present in Component B at an amount of aboutAttorney Docket No. I2106-7000WO2.8% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.8% to about 3%.

[0194] In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 5%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 4.0%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 3.0% to about 3.2%.

[0195] In certain embodiments, GDL is present in Component B at an amount of about 1%. In certain embodiments, GDL is present in Component B at an amount of about 1.2%. In certain embodiments, GDL is present in Component B at an amount of about 1.4%. In certain embodiments, GDL is present in Component B at an amount of about 1.6%. In certain embodiments, GDL is present in Component B at an amount of about 1.8%. In certain embodiments, GDL is present in Component B at an amount of about 2%. In certain embodiments, GDL is present in Component B at an amount of about 2.2%. In certain embodiments, GDL is present in Component B at an amount of about 2.4%. In certain embodiments, GDL is present in Component B at an amount of about 2.6%. In certain embodiments, GDL is present in Component B at an amount of about 2.8%. In certainAttorney Docket No. I2106-7000WO embodiments, GDL is present in Component B at an amount of about 3%. In certain embodiments, GDL is present in Component B at an amount of about 3.2%. In certain embodiments, GDL is present in Component B at an amount of about 3.4%. In certain embodiments, GDL is present in Component B at an amount of about 3.6%. In certain embodiments, GDL is present in Component B at an amount of about 3.8%. In certain embodiments, GDL is present in Component B at an amount of about 4%. In certain embodiments, GDL is present in Component B at an amount of about 4.2%. In certain embodiments, GDL is present in Component B at an amount of about 4.4%. In certain embodiments, GDL is present in Component B at an amount of about 4.6%. In certain embodiments, GDL is present in Component B at an amount of about 4.8%. In certain embodiments, GDL is present in Component B at an amount of about 5%.Acid

[0196] In certain embodiments, Component B further comprises an acid (in addition to and different from GDL). The acid serves to modify the pH of component B and, subsequently, of the mixture of component A and B. Unlike GDL, the acid does not need to hydrolyze in order to impart acidity (i.e., donate protons to) the combined component A + B. Therefore, the acid imparts “instantaneous” acidity to the mixture of A and B that is not afforded by GDL. The acid is added to the component B of the formulation by first dissolving it in glycerol or PEG.

[0197] In certain embodiments, the acid is an organic acid.

[0198] In certain embodiments, the acid is an organic acid comprising one acid group (e.g., carboxylic acid, sulfonic acid, etc.).

[0199] In certain embodiments, the acid is an organic acid comprising one acid group (e.g., carboxylic acid, sulfonic acid, etc.) and 1-8 carbon atoms.

[0200] In certain embodiments, the acid is salicylic acid.

[0201] In certain embodiments, the acid is selected from acetic acid, formic acid, trifluoracetic acid, tartaric acid, gallic acid, lactic acid, oxalic acid, benzoic acid, trichloroacetic acid, succinic acid, malic acid, picric acid, p-toluenesulfonic acid, glycolic acid, mandelic acid, butyric acid, maleic acid, tannic acid, cocodylic acid, adipic acid, valeric acid, decanoic acid, phthalic acid, barbituric acid, isobutyric acid, vanillic acid, camphoric acid, cinnamic acid, gluconic acid, azelaic acid, cyanuric acid, thio s alicyclic acid, abietic acid, glycerophosphoric acid, humic acid, thiodiglycolic acid, tiglic acid, diglycolic acid, pamoic acid, tetronic acid, and tartronic acid.Attorney Docket No. I2106-7000WO

[0202] In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.1%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.08%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.06%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.04%. In certain embodiments, the acid is present in Component B at an amount of about 0.001% to about 0.02%.

[0203] In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.3%. In certainAttorney Docket No. I2106-7000WO embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.1%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.08%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.06%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.04%. In certain embodiments, the acid is present in Component B at an amount of about 0.005% to about 0.02%.

[0204] In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.1%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.08%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.06%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.04%. In certain embodiments, the acid is present in Component B at an amount of about 0.01% to about 0.02%.

[0205] In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 1.2%. In certain embodiments,Attorney Docket No. I2106-7000WO the acid is present in Component B at an amount of about 0.03% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.1%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.08%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.06%. In certain embodiments, the acid is present in Component B at an amount of about 0.03% to about 0.04%.

[0206] In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.1%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.08%. In certain embodiments, the acid is present in Component B at an amount of about 0.05% to about 0.06%.

[0207] In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 1.8%. In certain embodiments, the acid is present in Component B atAttorney Docket No. I2106-7000WO an amount of about 0.08% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.08% to about 0.1%.

[0208] In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.1% to about 0.1%.

[0209] In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 1.2%. In certain embodiments,Attorney Docket No. I2106-7000WO the acid is present in Component B at an amount of about 0.15% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 0.3%. In certain embodiments, the acid is present in Component B at an amount of about 0.15% to about 0.2%.

[0210] In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 2%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 0.6%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 0.4%. In certain embodiments, the acid is present in Component B at an amount of about 0.2% to about 0.3%.

[0211] In certain embodiments, the acid is present in Component B at an amount of about0.001%. In certain embodiments, the acid is present in Component B at an amount of about0.002%. In certain embodiments, the acid is present in Component B at an amount of about0.005%. In certain embodiments, the acid is present in Component B at an amount of about0.008%. In certain embodiments, the acid is present in Component B at an amount of about0.01%. In certain embodiments, the acid is present in Component B at an amount of about0.02%. In certain embodiments, the acid is present in Component B at an amount of about0.03%. In certain embodiments, the acid is present in Component B at an amount of about0.04%. In certain embodiments, the acid is present in Component B at an amount of about0.05%. In certain embodiments, the acid is present in Component B at an amount of about0.06%. In certain embodiments, the acid is present in Component B at an amount of about0.07%. In certain embodiments, the acid is present in Component B at an amount of aboutAttorney Docket No. I2106-7000WO0.08%. In certain embodiments, the acid is present in Component B at an amount of about 0.09%. In certain embodiments, the acid is present in Component B at an amount of about 0.1%. In certain embodiments, the acid is present in Component B at an amount of about 0.12%. In certain embodiments, the acid is present in Component B at an amount of about0.15%. In certain embodiments, the acid is present in Component B at an amount of about0.18%. In certain embodiments, the acid is present in Component B at an amount of about0.2%. In certain embodiments, the acid is present in Component B at an amount of about 0.22%. In certain embodiments, the acid is present in Component B at an amount of about0.25%. In certain embodiments, the acid is present in Component B at an amount of about0.28%. In certain embodiments, the acid is present in Component B at an amount of about0.30%. In certain embodiments, the acid is present in Component B at an amount of about0.32%. In certain embodiments, the acid is present in Component B at an amount of about0.35%. In certain embodiments, the acid is present in Component B at an amount of about0.38%. In certain embodiments, the acid is present in Component B at an amount of about0.40%. In certain embodiments, the acid is present in Component B at an amount of about0.42%. In certain embodiments, the acid is present in Component B at an amount of about0.45%. In certain embodiments, the acid is present in Component B at an amount of about0.48%. In certain embodiments, the acid is present in Component B at an amount of about0.5%. In certain embodiments, the acid is present in Component B at an amount of about 0.6%.In certain embodiments, the acid is present in Component B at an amount of about 0.7%. In certain embodiments, the acid is present in Component B at an amount of about 0.8%. In certain embodiments, the acid is present in Component B at an amount of about 0.9%. In certain embodiments, the acid is present in Component B at an amount of about 1.0%. In certain embodiments, the acid is present in Component B at an amount of about 1.1%. In certain embodiments, the acid is present in Component B at an amount of about 1.2%. In certain embodiments, the acid is present in Component B at an amount of about 1.3%. In certain embodiments, the acid is present in Component B at an amount of about 1.4%. In certain embodiments, the acid is present in Component B at an amount of about 1.5%. In certain embodiments, the acid is present in Component B at an amount of about 1.6%. In certain embodiments, the acid is present in Component B at an amount of about 1.7%. In certain embodiments, the acid is present in Component B at an amount of about 1.8%. In certain embodiments, the acid is present in Component B at an amount of about 1.9%. In certain embodiments, the acid is present in Component B at an amount of about 2.0%.Attorney Docket No. I2106-7000WO

[0212] In certain embodiments, salicylic acid is present in Component B at an amount of about 0.001% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.08%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.06%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.04%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001% to about 0.02%.

[0213] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of aboutAttorney Docket No. I2106-7000WO0.005% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.08%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.06%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.04%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005% to about 0.02%.

[0214] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.08%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.06%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.04%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01% to about 0.02%.Attorney Docket No. I2106-7000WO

[0215] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.08%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.06%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03% to about 0.04%.

[0216] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.4%. In certain embodiments, the salicylic acid is present inAttorney Docket No. I2106-7000WOComponent B at an amount of about 0.05% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.08%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05% to about 0.06%.

[0217] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08% to about 0.1%.

[0218] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 0.6%. In certain embodiments,Attorney Docket No. I2106-7000WO the salicylic acid is present in Component B at an amount of about 0.1% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1% to about 0.1%.

[0219] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 0.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15% to about 0.2%.

[0220] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2%Attorney Docket No. I2106-7000WO to about 0.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2% to about 0.3%.

[0221] In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.001%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.002%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.005%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.008%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.01%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.02%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.03%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.04%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.05%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.06%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.07%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.08%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.09%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.12%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.15%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.18%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.22%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.25%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.28%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.30%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.32%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.35%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.38%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.40%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.42%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.45%. In certain embodiments, the salicylic acid is present in Component BAttorney Docket No. I2106-7000WO at an amount of about 0.48%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.7%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 0.9%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.0%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.1%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.2%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.3%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.4%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.5%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.6%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.7%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.8%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 1.9%. In certain embodiments, the salicylic acid is present in Component B at an amount of about 2.0%.

[0222] In certain embodiments, benzoic acid is incorporated as a preservative in Component B formulations comprising 85% glycerol and 15% polyethylene glycol (PEG), in the presence or absence of salicylic acid. In certain embodiments, benzoic acid is included at an amount of about 0.01% to 6.0%.

[0223] In certain embodiments, benzoic acid is present in Component B at an amount of 0.01%.In certain embodiments, benzoic acid is present in Component B at an amount of 0.02%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.03%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.04%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.05%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.06%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.07%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.08%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.09%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.1%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.2%. In certainAttorney Docket No. I2106-7000WO embodiments, benzoic acid is present in Component B at an amount of 0.3%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.4%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.5%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.6%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.7%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.8%. In certain embodiments, benzoic acid is present in Component B at an amount of 0.9%. In certain embodiments, benzoic acid is present in Component B at an amount of 1%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.1%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.2%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.3%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.4%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.5%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.6%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.7%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.8%. In certain embodiments, benzoic acid is present in Component B at an amount of 1.9%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.0%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.1%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.2%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.3%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.4%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.5%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.6%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.7%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.8%. In certain embodiments, benzoic acid is present in Component B at an amount of 2.9%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.0%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.1%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.2%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.3%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.4%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.5%. In certainAttorney Docket No. I2106-7000WQ embodiments, benzoic acid is present in Component B at an amount of 3.6%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.7%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.8%. In certain embodiments, benzoic acid is present in Component B at an amount of 3.9%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.0%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.1%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.2%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.3%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.4%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.5%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.6%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.7%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.8%. In certain embodiments, benzoic acid is present in Component B at an amount of 4.9%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.0%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.1%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.2%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.3%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.4%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.5%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.6%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.7%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.8%. In certain embodiments, benzoic acid is present in Component B at an amount of 5.9%. In certain embodiments, benzoic acid is present in Component B at an amount of 6.0%.

[0224] In certain embodiments, acetylsalicylic acid (0.4%) was incorporated into ComponentB comprising 85% glycerol and 15% polyethylene glycol (PEG). The compound exhibited good solubility within the solvent system. Upon mixing with Component A containing 4% alginate, 0.2% xanthan gum, 0.03% silver nitrate, 0.5% sodium chloride, and 0.4% calcium carbonate, the resulting formulation demonstrated a gelation time of approximately 40 seconds.Thickening AgentAttorney Docket No. I2106-7000WO

[0225] In certain embodiments, Component B further comprises a thickening / suspending agent.

[0226] In certain embodiments, the thickening agent is selected from the group including xanthan gum, guar gum, locust bean gum, cornstarch, agar, carrageenan, pullulan, carboxymethylcellulose and hypromellose and other cellulose derivatives, alginate, calcium alginate, glucomannan, galactomannan, dextran, hyaluronic acid, chitosan, fumed silica, polyethylene glycol), poly(acrylic acid), and poly(vinyl alcohol).

[0227] In certain embodiments, the thickening / suspending agent is xanthan.

[0228] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.08%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.07%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.06%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.05%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.04%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.03%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.01% to about 0.02%.

[0229] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.08%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.07%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.06%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.05%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.04%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.02% to about 0.03%.Attorney Docket No. I2106-7000WO

[0230] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.08%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.07%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.06%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.05%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.03% to about 0.04%.

[0231] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.04% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.04% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.04% to about 0.08%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.04% to about 0.07%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.04% to about 0.06%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.04% to about 0.05%.

[0232] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.05% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.05% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.05% to about 0.08%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.05% to about 0.07%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.05% to about 0.06%.

[0233] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.06% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.06% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount ofAttorney Docket No. I2106-7000WO about 0.06% to about 0.08%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.06% to about 0.07%.

[0234] In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.07% to about 0.1%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.07% to about 0.09%. In certain embodiments, the thickening / suspending agent is present in Component B at an amount of about 0.07% to about 0.08%.

[0235] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.08%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.07%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.06%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.05%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.04%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.03%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.01% to about 0.02%.

[0236] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.08%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.07%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.06%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at anAttorney Docket No. I2106-7000WO amount of about 0.02% to about 0.05%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.04%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.02% to about 0.03%.

[0237] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.08%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.07%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.06%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.05%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.03% to about 0.04%.

[0238] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.04% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.04% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.04% to about 0.08%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.04% to about 0.07%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.04% to about 0.06%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.04% to about 0.05%.

[0239] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.05% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.05% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.05% toAttorney Docket No. I2106-7000WO about 0.08%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.05% to about 0.07%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.05% to about 0.06%.

[0240] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.06% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.06% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.06% to about 0.08%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.06% to about 0.07%.

[0241] In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.07% to about 0.1%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.07% to about 0.09%. In certain embodiments, the thickening / suspending agent is xanthan, and the xanthan is present in Component B at an amount of about 0.07% to about 0.08%.Calcium Salt

[0242] In certain embodiments, Component B may further comprise a crosslinking agent. In certain embodiments, the crosslinking agent is a calcium salt.

[0243] In certain embodiments, the calcium salt is selected from the group including calcium carbonate, calcium phosphate, calcium sulfate, calcium oxalate, calcium hydroxide, calcium lactate, calcium fluoride, and calcium gluconate.

[0244] In certain embodiments, the crosslinking agent is a zinc salt (e.g., zinc sulfate or zinc oxide), ferrous sulfate, a magnesium salt (e.g., magnesium chloride, magnesium sulfate, or magnesium oxide), a copper salt (e.g., copper sulfate), strontium carbonate.

[0245] In certain embodiments, the calcium salt is calcium carbonate.

[0246] In certain embodiments, the calcium salt is present in Component B as a particle.

[0247] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particleAttorney Docket No. I2106-7000WO having an average diameter of about 0.5 |am to about 400 |am. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 10 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 5 pm. In certain embodiments,Attorney Docket No. I2106-7000WO the calcium salt is present in Component B as a particle having an average diameter of about 0.5 pm to about 1 pm.

[0248] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle havingAttorney Docket No. I2106-7000WO an average diameter of about 1 |am to about 20 |am. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 10 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm to about 5 pm.

[0249] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about2.5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about2.5 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about2.5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B asAttorney Docket No. I2106-7000WO a particle having an average diameter of about 2.5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about2.5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about2.5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about2.5 pm to about 10 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2.5 pm to about 5 pm.

[0250] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 80 pm. In certain embodiments, the calcium saltAttorney Docket No. I2106-7000WO is present in Component B as a particle having an average diameter of about 5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm to about 10 pm.

[0251] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 110 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component B as aAttorney Docket No. I2106-7000WO particle having an average diameter of about 7.5 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about7.5 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about7.5 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about7.5 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about7.5 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7.5 pm to about 15 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about7.5 pm to about 10 pm.

[0252] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle havingAttorney Docket No. I2106-7000WO an average diameter of about 10 |am to about 110 |am. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 100 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 20 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm to about 15 pm.

[0253] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 120Attorney Docket No. I2106-7000WO m. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 115 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 15 pm to about 20 pm.

[0254] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 120Attorney Docket No. I2106-7000WO m. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 115 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm to about 30 pm.

[0255] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 115 pm. In certain embodiments, the calcium saltAttorney Docket No. I2106-7000WO is present in Component B as a particle having an average diameter of about 25 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 25 pm to about 30 pm.

[0256] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 500 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 200 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 140 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 130 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 120 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 115 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particleAttorney Docket No. I2106-7000WO having an average diameter of about 30 |am to about 90 |am. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm to about 40 pm.

[0257] In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 1 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 2 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 3 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 4 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 5 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 6 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 7 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 8 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 9 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 10 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 12 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 14 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 16 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 18 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 20 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 22 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 24 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of aboutAttorney Docket No. I2106-7000WO26 m. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 28 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 30 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 32 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 34 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 36 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 38 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 40 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 42 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 44 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 46 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 48 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 50 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 55 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 60 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 65 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 70 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 75 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 80 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 85 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 90 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 95 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 100 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 150 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 200 pm. In certain embodiments, the calcium salt is present in ComponentAttorney Docket No. I2106-7000WOB as a particle having an average diameter of about 250 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 300 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 350 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 400 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 450 pm. In certain embodiments, the calcium salt is present in Component B as a particle having an average diameter of about 500 pm.

[0258] In certain embodiments, the calcium salt is present in Component B at an amount of about 0.001% to about 2%. In certain embodiments, the calcium salt is present in Component B at an amount of about 0.001% to about 1.8%. In certain embodiments, the...

Claims

Attorney Docket No. I2106-7000WOCLAIMS1. A wound dressing kit, comprising Component A, Component B, and a delivery device, wherein Component A comprises a solvent, alginate, and a crosslinking agent, and Component B comprises a solvent, a diluent / co-solvent, and glucono-delta-lactone (GDL), wherein the delivery device is configured to dispense Component A and Component B in the form of a viscous liquid for application to a wound.

2. The wound dressing kit of claim 1, wherein the Component A solvent is water.

3. The wound dressing kit of claim 2, wherein water is present in an amount of about 94% to 97%.

4. The wound dressing kit of claim 1, wherein Component A further comprises a thickening agent.

5. The wound dressing kit of claim 4, wherein the thickening agent is selected from the group including xanthan gum, guar gum, locust bean gum, cornstarch, agar, carrageenan, pullulan, carboxymethylcellulose and hypromellose and other cellulose derivatives, alginate, calcium alginate, glucomannan, galactomannan, dextran, hyaluronic acid, chitosan, fumed silica, polyethylene glycol), poly(acrylic acid), and poly(vinyl alcohol).

6. The wound dressing kit of claim 5, wherein the thickening agent is xanthan gum.

7. The wound dressing kit of claim 4, wherein the thickening agent is present in an amount of about 0.1% to about 0.3%.

8. The wound dressing kit of claim 1 , wherein the alginate is present in an amount of about 1% to about 6%.

9. The wound dressing kit of claim 1 , wherein the alginate is present in an amount of about 3%.

10. The wound dressing kit of claim 1, wherein the crosslinking agent is a calcium salt, a zinc salt (e.g., zinc sulfate or zinc oxide), ferrous sulfate, a magnesium salt (e.g., magnesium chloride, magnesium sulfate, or magnesium oxide), a copper salt (e.g., copper sulfate), strontium carbonate.

11. The wound dressing kit of claim 10, wherein the crosslinking agent is a calcium salt.Attorney Docket No. I2106-7000WO12. The wound dressing kit of claim 11, wherein the calcium salt is selected from the group including calcium carbonate, calcium phosphate, calcium sulfate, calcium oxalate, calcium hydroxide, calcium lactate, calcium fluoride, and calcium gluconate13. The wound dressing kit of claim 11, wherein the calcium salt is calcium carbonate.

14. The wound dressing kit of claim 13, wherein the calcium carbonate is present in an amount of about 0.1% to about 0.5%.

15. The wound dressing kit of claim 13, wherein the calcium carbonate is present in an amount of about 0.3%.

16. The wound dressing kit of claim 1, wherein Component A further comprises an antimicrobial agent.

17. The wound dressing kit of claim 16, wherein the antimicrobial agent is a water-soluble silver salt.

18. The wound dressing kit of claim 16, wherein antimicrobial agent is selected from the group including silver nitrate, silver sulfadiazine, silver oxide, silver sulfate, silver chloride, silver phosphate, silver lactate, silver acetate, silver sodium hydrogen zirconium phosphate, silver carboxymethylcellulose and other anionic polymers with silver counterions.

19. The wound dressing kit of claim 18, wherein the antimicrobial agent is silver nitrate.

20. The wound dressing kit of claim 19, wherein the silver nitrate is present in an amount of about 0.01% to about 0.05%.

21. The wound dressing kit of claim 19, wherein the silver nitrate is present in an amount of about 0.03%.

22. The wound dressing kit of claim 1, wherein Component A further comprises a chloride salt.

23. The wound dressing kit of claim 22, wherein the chloride salt is sodium chloride.

24. The wound dressing kit of claim 22, wherein the chloride salt is present in an amount of about 0.3% to about 0.7%.Attorney Docket No. I2106-7000WO25. The wound dressing kit of claim 22, wherein the chloride salt is present in an amount of about 0.5%.

26. The wound dressing kit of claim 1, wherein the Component B solvent is glycerol.

27. The wound dressing kit of claim 26, wherein the glycerol is present in an amount of about 50% to about 90%.

28. The wound dressing kit of claim 1, wherein the GDL is present in an amount of about 1% to about 4%.

29. The wound dressing kit of claim 1, wherein the GDL is present in an amount of about 2% to about 3%.

30. The wound dressing kit of claim 1, wherein the diluent / co-solvent is PEG.

31. The wound dressing kit of claim 30, wherein the PEG is PEG200.

32. The wound dressing kit of claim 30, wherein the PEG is present in an amount of about10% to about 45%.

33. The wound dressing kit of claim 1, wherein Component B further comprises an acid.

34. The wound dressing kit of claim 33, wherein the acid is salicylic acid.

35. The wound dressing kit of claim 34, wherein the salicylic acid is present in an amount of about 0.1% to about 0.5%.

36. The wound dressing kit of claim 33, wherein the acid is benzoic acid.

37. The wound dressing kit of claim 36, wherein the benzoic acid is present in an amount of about 0.01% to about 6%.

38. The wound dressing kit of claim 1, wherein Component A and Component B are contained in separate compartments in the delivery device.

39. The wound dressing kit of claim 1, wherein the delivery device comprises a mixing apparatus.Attorney Docket No. I2106-7000WO40. The wound dressing kit of claim 39, wherein the mixing apparatus is comprised of a rigid static mixing component and an elastic foam component.

41. The wound dressing kit of claim 40, wherein the elastic foam component is supported by the rigid static mixing component to reduce / mitigate the collapse of the elastic foam component during expulsion of high viscosity materials through the mixing apparatus.

42. The wound dressing kit of claim 1, wherein the delivery device is configured to mix the two liquids and dispense the mixed composition in the form of a high viscosity gel for application to a wound.

43. The wound dressing kit of claim 1 , wherein the delivery device comprises an applicator.

44. The wound dressing kit of claim 43, wherein the applicator is designed to provide sufficient mixing of the two liquids and facile coverage of the wound surface, especially on geometrically complex regions.

45. A method for using the wound dressing kit of claim 1 comprising delivery of the wound dressing composition onto the wound to provide a biocompatible barrier layer to protect the wound during healing.

46. The method of claim 45, wherein the delivery of the wound dressing composition onto the wound further comprises preventing bacterial contamination.

47. The method of claim 45, wherein the delivery of the wound dressing composition onto the wound further comprises allowing for gas exchange.

Images