Visual system for bonding apparatus, method for determining pose of component to be bonded, and storage medium
By combining multiple imaging modules and field-of-view adjustment mechanisms, the problem that traditional vision systems cannot cover chips of various sizes has been solved, achieving efficient wafer bonding and chip alignment.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- PIOTECH (HAINING) SEMICON EQUIP CO LTD
- Filing Date
- 2025-03-25
- Publication Date
- 2026-05-21
AI Technical Summary
Traditional high-precision vision systems have limited field of view for their imaging modules, which cannot fully cover chips of various sizes, affecting the bonding efficiency of wafers and chips.
By using multiple imaging modules and a field-of-view adjustment mechanism, the field-of-view position of the imaging modules is rotated and adjusted to acquire multiple marked images on parts of various sizes to be bonded, thereby determining their position and orientation.
It improves the bonding efficiency of wafer bonding process, reduces the cost of large chip alignment, and improves the accuracy of position and orientation acquisition.
Smart Images
Figure CN2025084716_21052026_PF_FP_ABST
Abstract
Description
A vision system for bonding devices, a method for determining the pose of parts to be bonded, and a storage medium. Technical Field
[0001] This invention relates to the field of semiconductor device fabrication, and more particularly to a vision system for a bonding apparatus, a method for determining the pose of a component to be bonded, and a computer-readable storage medium. Background Technology
[0002] In the chip-to-wafer bonding process, the chips being bonded often come in various sizes. However, in traditional high-precision vision systems, the field of view of the imaging module is typically only a few millimeters. When the size of the chips to be acquired varies by tens of millimeters, traditional vision systems cannot fully cover all chip sizes, affecting the acquisition of chip position and / or orientation, and thus impacting the bonding efficiency between the wafer and the chip.
[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved vision system for bonding devices, which can acquire images of multiple marks on parts of various sizes to be bonded, so as to improve the bonding efficiency of wafer bonding process. Summary of the Invention
[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.
[0005] To overcome the aforementioned deficiencies in the prior art, the present invention provides a vision system for a bonding apparatus, a method for determining the pose of a component to be bonded, and a computer-readable storage medium. By rotating and adjusting the field of view positions of multiple imaging modules, images of multiple marks on components of various sizes to be bonded can be acquired, thereby improving the bonding efficiency of the wafer bonding process.
[0006] Specifically, the vision system of the bonding apparatus provided according to the first aspect of the present invention includes a plurality of imaging modules and a field-of-view adjustment mechanism. The plurality of imaging modules are used to acquire images of a plurality of marks on a workpiece to be bonded, to characterize the position and / or orientation of the workpiece. The field-of-view adjustment mechanism is used to rotate at least one of the imaging modules, adjusting its field-of-view position to cover the plurality of marks on the workpiece to be bonded.
[0007] Furthermore, in some embodiments of the present invention, the vision system further includes a controller configured to: acquire spacing information between the plurality of marks to determine whether the field of view of one imaging module can simultaneously cover the plurality of marks; in response to the determination that the field of view of one imaging module can simultaneously cover the plurality of marks, rotate one imaging module via the field of view adjustment mechanism to acquire images of the plurality of marks to characterize the position and / or orientation of the component to be bonded; and in response to the determination that the field of view of one imaging module cannot simultaneously cover the plurality of marks, rotate the plurality of imaging modules via the field of view adjustment mechanism to acquire images of the plurality of marks in a cooperative manner to characterize the position and / or orientation of the component to be bonded.
[0008] Furthermore, in some embodiments of the present invention, the step of acquiring images of the plurality of marks by rotating one of the imaging modules via the field-of-view adjustment mechanism includes: acquiring coarse position information of the plurality of marks and first pose information of the first imaging module to determine a first rotation angle and a first rotation path range of the first imaging module; acquiring the current second pose information of the second imaging module and combining it with the first rotation path range to determine whether the second imaging module affects the rotation of the first imaging module; and in response to the determination result that the second imaging module affects the rotation of the first imaging module, determining a second rotation angle of the second imaging module based on the second pose information and the first rotation path range, and rotating the second imaging module via the field-of-view adjustment mechanism to avoid affecting the rotation of the first imaging module.
[0009] Furthermore, in some embodiments of the present invention, the step of acquiring images of the plurality of marks by rotating one of the imaging modules via the field-of-view adjustment mechanism further includes: in response to a determination that the second imaging module does not affect the rotation of the first imaging module, rotating the first imaging module via the field-of-view adjustment mechanism according to the first rotation angle to acquire images of the plurality of marks.
[0010] Furthermore, in some embodiments of the present invention, the controller is also configured to: determine fine position information of the plurality of marks based on the positions of the plurality of marks in the image and a first rotation angle of the first imaging module; and determine the position and / or orientation of the component to be bonded based on the fine position information of the plurality of marks.
[0011] Further, in some embodiments of the present invention, the component to be bonded is a chip, and two marks are provided at two feature positions on its edge. The vision system includes two imaging modules. The step of rotating the plurality of imaging modules via the field-of-view adjustment mechanism to cooperate in acquiring images of the plurality of marks includes: acquiring coarse position information of each mark and pose information of each imaging module; determining a first rotation angle of the first imaging module based on the first coarse position information of the first mark and the first pose information of the first imaging module, and rotating the first imaging module via the field-of-view adjustment mechanism to acquire a first image of the first mark; and determining a second rotation angle of the second imaging module based on the second coarse position information of the second mark and the second pose information of the second imaging module, and rotating the second imaging module via the field-of-view adjustment mechanism to acquire a second image of the second mark.
[0012] Furthermore, in some embodiments of the present invention, the controller is further configured to: determine first fine position information of the first mark based on a first position of the first mark in the first image and a first rotation angle of the first imaging module; determine second fine position information of the second mark based on a second position of the second mark in the second image and a second rotation angle of the second imaging module; and determine the position and / or orientation of the component to be bonded based on the first fine position information and the second fine position information.
[0013] Furthermore, in some embodiments of the present invention, the field-of-view adjustment mechanism includes a drive module, a transmission module, a limiting module, and a stop module. The drive module provides a rotational driving force. The transmission module transmits the rotational driving force to the corresponding imaging module to cause it to rotate. The limiting module restricts the rotation range of the imaging module to prevent it from colliding with other components. The stop module locks the rotating shaft of the imaging module after it has rotated to the target angle.
[0014] Furthermore, in some embodiments of the present invention, the imaging module includes a prism, a telescope, and a camera. The prism is located at one end of the imaging module near the component to be bonded, and is used to rotate the field of view of the imaging module. The telescope is located between the prism and the camera, and is used to project the image of the component to be bonded onto the imaging surface of the camera. The camera is located at one end of the imaging module away from the component to be bonded, and is used to acquire images of the plurality of marks on the component to be bonded via the telescope and the prism.
[0015] Furthermore, in some embodiments of the present invention, the component to be bonded is a chip, the length of which ranges from 0.1 mm to 50 mm. The field of view of the imaging module is circular, with a diameter between 1 and 10 mm. Alternatively, the field of view of the imaging module is rectangular, with a long side length between 1 and 10 mm.
[0016] Furthermore, the method for determining the pose of a component to be bonded according to the second aspect of the present invention includes the following steps: acquiring spacing information between multiple marks on the component to be bonded to determine whether the field of view of an imaging module of the vision system provided in the first aspect of the present invention can simultaneously cover the multiple marks; in response to the determination result that the field of view of an imaging module can simultaneously cover the multiple marks, rotating an imaging module via a field of view adjustment mechanism to acquire images of the multiple marks to characterize the position and / or orientation of the component to be bonded; and in response to the determination result that the field of view of an imaging module cannot simultaneously cover the multiple marks, rotating multiple imaging modules via the field of view adjustment mechanism to acquire images of the multiple marks in cooperation with each other to characterize the position and / or orientation of the component to be bonded.
[0017] Furthermore, the computer-readable storage medium provided according to the third aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, the method for determining the pose of a bonding element as provided in the second aspect of the present invention is implemented. Attached Figure Description
[0018] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.
[0019] Figure 1 shows a schematic diagram of the structure of a vision system for a bonding device provided according to some embodiments of the present invention.
[0020] Figure 2 shows a schematic diagram of the structure of a vision system for a bonding device provided according to some embodiments of the present invention.
[0021] Figure 3 shows a flowchart illustrating a method for determining the pose of a component to be bonded according to some embodiments of the present invention.
[0022] Figure 4 shows a schematic diagram of the field of view of the imaging module and the position of the component to be bonded according to some embodiments of the present invention.
[0023] Figure 5 shows a schematic diagram of the field of view of the imaging module and the position of the component to be bonded according to some embodiments of the present invention.
[0024] Figure 6 shows a schematic diagram of the field of view of an imaging module provided according to some embodiments of the present invention and the position of the component to be bonded. Detailed Implementation
[0025] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.
[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0027] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.
[0028] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.
[0029] As mentioned above, in traditional high-precision vision systems, the field of view of the imaging module is typically only a few millimeters. When the size of the chip to be acquired varies by tens of millimeters, traditional vision systems cannot fully cover all chip sizes, which affects the acquisition of the chip's position and / or orientation, thereby impacting the bonding efficiency between the wafer and the chip.
[0030] To overcome the aforementioned deficiencies in the prior art, the present invention provides a vision system for a bonding apparatus, a method for determining the pose of a component to be bonded, and a computer-readable storage medium. By rotating and adjusting the field of view positions of multiple imaging modules, images of multiple marks on components of various sizes to be bonded can be acquired, thereby improving the bonding efficiency of the wafer bonding process.
[0031] Please refer to Figures 1 and 2. Figure 1 shows a schematic diagram of the structure of a vision system for a bonding apparatus provided according to some embodiments of the present invention. Figure 2 shows a schematic diagram of the structure of a vision system for a bonding apparatus provided according to some embodiments of the present invention.
[0032] In the embodiment shown in Figure 1, the vision system of the bonding apparatus provided in the first aspect of the present invention includes a plurality of imaging modules and a field-of-view adjustment mechanism. Here, the plurality of imaging modules are used to acquire images of a plurality of marks on the workpiece to be bonded, to characterize the position (x, y) of the workpiece in the world coordinate system and / or the rotation angle θ relative to a preset direction in the horizontal plane. The field-of-view adjustment mechanism is used to rotate at least one imaging module, adjusting its field-of-view position to cover the plurality of marks on the workpiece to be bonded.
[0033] Furthermore, in the embodiment shown in Figure 1, the field-of-view adjustment mechanism includes a drive module 11, a transmission module 12, a limiting module 13, and a stop module 14. Here, the drive module 11 provides rotational driving force. The transmission module 12 transmits the rotational driving force to the corresponding imaging module, causing it to rotate. The limiting module 13 restricts the rotation range of the imaging module to prevent it from colliding with other components. The stop module 14 locks the shaft of the imaging module after it has rotated to the target angle to prevent jitter from introducing additional errors.
[0034] Furthermore, in the embodiment shown in FIG1, the limiting module 13 can limit the rotation range of the imaging module through photoelectric signals. Alternatively, in the embodiment shown in FIG2, the limiting module 13 can limit the rotation range of the imaging module through a mechanical structure.
[0035] Furthermore, in the embodiment shown in Figure 1, the imaging module includes a prism 21, a telescope 22, and a camera 23. Here, the prism 21 is located at the end of the imaging module closer to the component to be bonded, and is used to rotate the field of view of the imaging module. Specifically, the prism 21 can change the optical path inside the imaging module, so that as the imaging module rotates around the rotation center, the field of view of the imaging module rotates synchronously around the rotation center. The telescope 22 is located between the prism 21 and the camera 23, and is used to project the image of the component to be bonded onto the imaging surface of the camera. The camera 23 is located at the end of the imaging module furthest from the component to be bonded, and is used to acquire images of multiple marks on the component to be bonded via the telescope 22 and the prism 21.
[0036] Furthermore, in some embodiments, the component to be bonded is a chip, the length of which ranges from 0.1 mm to 50 mm. The field of view of the imaging module is circular, with a diameter between 1 and 10 mm. Alternatively, in some embodiments, the field of view of the imaging module is rectangular, with a long side length between 1 and 10 mm.
[0037] In some non-limiting embodiments, the vision system of the bonding apparatus described in the first aspect of the present invention includes a memory and a controller. Here, the memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect above, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the method for determining the pose of a member to be bonded as provided in the first aspect of the present invention.
[0038] The working principle of the vision system of the bonding device described above will be described below with reference to some embodiments of methods for determining the pose of the component to be bonded. Those skilled in the art will understand that these embodiments of methods for determining the pose of the component to be bonded are merely some non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide some specific solutions convenient for public implementation, rather than limiting all functions or all operating methods of the vision system of the bonding device. Similarly, the vision system of the bonding device is also only one non-limiting implementation provided by the present invention, and does not constitute a limitation on the executing entity and execution order of the steps in these methods for determining the pose of the component to be bonded.
[0039] Please refer to Figures 3 through 6 for details. Figure 3 shows a flowchart illustrating a method for determining the pose of a component to be bonded according to some embodiments of the present invention. Figure 4 shows a schematic diagram of the field of view of an imaging module and the position of the component to be bonded according to some embodiments of the present invention. Figure 5 shows a schematic diagram of the field of view of an imaging module and the position of the component to be bonded according to some embodiments of the present invention. Figure 6 shows a schematic diagram of the field of view of an imaging module and the position of the component to be bonded according to some embodiments of the present invention.
[0040] As shown in Figure 3, the controller can first obtain the spacing information between multiple marks on the component to be bonded in order to determine whether the field of view of an imaging module of the vision system provided in the first aspect of the present invention can cover multiple marks at the same time.
[0041] Subsequently, as shown in Figure 4, in response to the judgment result that the field of view of an imaging module can simultaneously cover multiple markers, the controller can rotate an imaging module via the field of view adjustment mechanism to acquire images of multiple markers to characterize the position and / or orientation of the bonding component 30.
[0042] Thus, the vision system of the bonding apparatus provided in the first aspect of the present invention can acquire the position and / or orientation of a small component to be bonded by using only the field of view of one imaging module, thereby overcoming the problem that the blind spots of the field of view of multiple imaging modules cannot cover the small chip mark, and reducing the secondary calculation requirements and errors of coordinate system transformation, thereby improving the alignment efficiency and accuracy of the component to be bonded.
[0043] Alternatively, in response to the judgment that the field of view of one imaging module cannot simultaneously cover multiple markers, the controller can rotate multiple imaging modules via the field of view adjustment mechanism to cooperate in acquiring images of multiple markers to characterize the position and / or orientation of the bonding component 30.
[0044] Specifically, the controller can first acquire coarse position information of multiple markers in the world coordinate system (e.g., approximate position with millimeter-level precision), as well as the first pose information of the first imaging module, to determine the first rotation angle and the first rotation path range of the first imaging module.
[0045] Then, the controller can obtain the current second pose information of the second imaging module and combine it with the first rotation path range to determine whether the second imaging module affects the rotation of the first imaging module.
[0046] Subsequently, in response to the judgment result that the second imaging module affects the rotation of the first imaging module, the controller can determine the second rotation angle of the second imaging module based on the second pose information and the first rotation path range, and rotate the second imaging module via the field of view adjustment mechanism to avoid affecting the rotation of the first imaging module.
[0047] Alternatively, in other embodiments, in response to the determination that the second imaging module does not affect the rotation of the first imaging module, the controller rotates the first imaging module according to a first rotation angle via a field-of-view adjustment mechanism to acquire images of multiple markers. In this way, the controller can directly control the second imaging module to return to a preset position that does not affect the rotation of the first imaging module without performing calculations or judgments.
[0048] Furthermore, in some preferred embodiments, the controller can also determine fine position information of multiple markers based on their positions in the image coordinate system and the first rotation angle of the first imaging module, and determine the position and / or orientation of the component to be bonded based on the fine position information of the multiple markers in the world coordinate system. Here, the accuracy of this fine position information is determined by the positioning accuracy level of the imaging module, and is below 0.01 mm.
[0049] In the embodiments shown in Figures 5 and 6, the component to be bonded 30 is a chip, with two marks at two feature locations on its edge. The vision system includes two imaging modules. Here, during the process of rotating multiple imaging modules via a field-of-view adjustment mechanism to cooperate in acquiring images of multiple marks, the controller can acquire coarse position information (e.g., approximate position with millimeter-level precision) for each mark, as well as pose information for each imaging module.
[0050] Subsequently, the controller can determine the first rotation angle of the first imaging module based on the first coarse position information of the first mark and the first pose information of the first imaging module, and rotate the first imaging module via the field of view adjustment mechanism to acquire the first image of the first mark.
[0051] Then, the controller can determine the second rotation angle of the second imaging module based on the second coarse position information of the second mark and the second pose information of the second imaging module, and rotate the second imaging module via the field of view adjustment mechanism to acquire the second image of the second mark.
[0052] Furthermore, in some preferred embodiments, the controller can also determine the first fine position information of the first marker in the world coordinate system based on the first position of the first marker in the first image in the image coordinate system and the first rotation angle of the first imaging module. Then, the controller can determine the second fine position information of the second marker in the world coordinate system based on the second position of the second marker in the second image in the image coordinate system and the second rotation angle of the second imaging module. Subsequently, the controller can determine the position and / or orientation of the component to be bonded based on the first and second fine position information.
[0053] Thus, the vision system of the bonding apparatus provided in the first aspect of the present invention can acquire the position and / or orientation of a large component to be bonded by utilizing the field of view of multiple imaging modules, thereby reducing the requirement for the field of view size of a single imaging module for large chips and thus reducing the cost of large chip alignment.
[0054] In summary, the vision system of the bonding apparatus, the method for determining the pose of the workpiece to be bonded, and the computer-readable storage medium provided by the present invention can all improve the bonding efficiency of wafer bonding processes by rotating and adjusting the field of view positions of multiple imaging modules to acquire images of multiple marks on workpieces of various sizes to be bonded.
[0055] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.
[0056] Those skilled in the art will understand that information, signals, and data can be represented using any of a variety of different techniques and arts. For example, the data, instructions, commands, information, signals, bits, symbols, and chips described throughout the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.
[0057] Although the controller described in the above embodiments can be implemented through a combination of software and hardware, it is understood that the controller can also be implemented in software or hardware. For hardware implementation, the controller can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection of combinations of the above devices. For software implementation, the controller can be implemented using independent software modules such as procedures and functions running on a general-purpose chip, each module performing one or more functions and operations described herein.
[0058] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.
[0059] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.
[0060] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A vision system for bonding apparatus, characterized by, include: Multiple imaging modules are used to acquire images of multiple marks on the component to be bonded, so as to characterize the position and / or orientation of the component to be bonded; as well as A field-of-view adjustment mechanism is used to rotate at least one of the imaging modules and adjust its field-of-view position to cover the plurality of marks on the component to be bonded.
2. The vision system of claim 1, wherein, The vision system also includes a controller, which is configured to: Obtain the spacing information between the multiple marks to determine whether the field of view of one of the imaging modules can simultaneously cover the multiple marks; In response to the judgment result that the field of view of one of the imaging modules can simultaneously cover the multiple marks, one of the imaging modules is rotated via the field of view adjustment mechanism to acquire images of the multiple marks in order to characterize the position and / or orientation of the component to be bonded. as well as In response to the determination that the field of view of one of the imaging modules cannot simultaneously cover the multiple marks, the multiple imaging modules are rotated via the field of view adjustment mechanism to acquire images of the multiple marks in cooperation with each other, so as to characterize the position and / or orientation of the component to be bonded.
3. The vision system of claim 2, wherein, The step of acquiring images of the plurality of markers by rotating one of the imaging modules via the field-of-view adjustment mechanism includes: Obtain the coarse position information of the multiple markers and the first pose information of the first imaging module to determine the first rotation angle and the first rotation path range of the first imaging module; Obtain the current second pose information of the second imaging module and combine it with the first rotation path range to determine whether the second imaging module affects the rotation of the first imaging module; and In response to the determination result that the second imaging module affects the rotation of the first imaging module, the second rotation angle of the second imaging module is determined according to the second pose information and the first rotation path range, and the second imaging module is rotated via the field of view adjustment mechanism to avoid affecting the rotation of the first imaging module.
4. The vision system of claim 3, wherein, The step of acquiring images of the plurality of markers by rotating one of the imaging modules via the field-of-view adjustment mechanism further includes: In response to the determination that the second imaging module does not affect the rotation of the first imaging module, the first imaging module is rotated according to the first rotation angle via the field of view adjustment mechanism to acquire images of the plurality of markers.
5. The vision system of claim 4, wherein, The controller is also configured to: Based on the positions of the multiple markers in the image and the first rotation angle of the first imaging module, the fine position information of the multiple markers is determined; as well as The position and / or orientation of the component to be bonded are determined based on the detailed position information of the multiple markers.
6. The vision system of claim 2, wherein, The component to be bonded is a chip, and two marks are provided at two feature positions on its edge. The vision system includes two imaging modules. The step of rotating multiple imaging modules via the field-of-view adjustment mechanism to cooperate in acquiring images of the multiple marks includes: The coarse position information of each of the markers and the pose information of each of the imaging modules are obtained respectively. Based on the first coarse position information of the first marker and the first pose information of the first imaging module, a first rotation angle of the first imaging module is determined, and the first imaging module is rotated via the field-of-view adjustment mechanism to acquire a first image of the first marker; and Based on the second coarse position information of the second mark and the second pose information of the second imaging module, the second rotation angle of the second imaging module is determined, and the second imaging module is rotated via the field adjustment mechanism to acquire the second image of the second mark.
7. The vision system of claim 6, wherein, The controller is also configured to: Based on the first position of the first mark in the first image and the first rotation angle of the first imaging module, the first fine position information of the first mark is determined; Based on the second position of the second mark in the second image and the second rotation angle of the second imaging module, the second fine position information of the second mark is determined; as well as Based on the first fine position information and the second fine position information, the position and / or orientation of the component to be bonded are determined.
8. The vision system of claim 1, wherein, The field-of-view adjustment mechanism includes: The drive module provides the rotational driving force. A transmission module is used to transmit the rotational driving force to the corresponding imaging module so that it can rotate. A limiting module is used to limit the rotation range of the imaging module to prevent it from colliding with other components; and A stop module is used to lock the shaft of the imaging module after the imaging module has been rotated to the target angle.
9. The vision system of claim 1, wherein, The imaging module includes: A prism, located at one end of the imaging module near the component to be bonded, is used to rotate the field of view of the imaging module; A telescope, located between the prism and the camera, is used to project the image of the part to be bonded onto the imaging surface of the camera; and The camera, located at the end of the imaging module away from the component to be bonded, is used to acquire images of the plurality of marks on the component to be bonded via the tube lens and the prism.
10. The vision system of claim 1, wherein, The component to be bonded is a chip, the length of which ranges from 0.1mm to 50mm. The imaging module has a circular field of view with a diameter between 1 and 10 millimeters, or The imaging module has a rectangular field of view, with its long side ranging from 1 to 10 millimeters.
11. A method for determining the pose of a component to be bonded, characterized in that, Includes the following steps: Obtain the spacing information between multiple marks on the component to be bonded, so as to determine whether the field of view of an imaging module of the vision system as described in claim 1 can simultaneously cover the multiple marks; In response to the judgment result that the field of view of one of the imaging modules can simultaneously cover the multiple marks, one of the imaging modules is rotated via the field of view adjustment mechanism to acquire images of the multiple marks in order to characterize the position and / or orientation of the component to be bonded. as well as In response to the determination that the field of view of one of the imaging modules cannot simultaneously cover the multiple marks, the multiple imaging modules are rotated via the field of view adjustment mechanism to acquire images of the multiple marks in cooperation with each other, so as to characterize the position and / or orientation of the component to be bonded.
12. A computer readable storage medium having stored thereon computer instructions, wherein, When the computer instructions are executed by the processor, the method for determining the pose of the component to be bonded as described in claim 11 is implemented.