Package substrate, chip package structure, and electronic device

Abstract

Embodiments of the present application relate to the technical field of electronic devices, and provide a package substrate, a chip package structure, and an electronic device. The package substrate comprises a glass core plate, a connection layer, and a protective layer. The glass core plate is provided with a through hole. The glass core plate comprises a first surface and a second surface which are opposite to each other, and the through hole penetrates through the first surface to the second surface. The connection layer comprises a first sublayer and two second sublayers. The first sublayer is arranged on an inner wall of the through hole. The two second sublayers are arranged on the first surface and the second surface, respectively, and the two second sublayers are each connected to the first sublayer. At least part of the protective layer is arranged between the glass core plate and the second sublayers. The hardness of the protective layer is greater than the hardness of the glass core plate, or the elastic modulus of the protective layer is less than that of the glass core plate. This structure reduces thermo-mechanical stress on the glass core plate in the package substrate, thereby reducing the risk of cracking of the glass core plate.

Description

Packaging substrate, chip packaging structure and electronic devices

[0001] This application claims priority to Chinese patent application filed on November 18, 2024, with application number 202411658293.2 and entitled "Packaging substrate, chip packaging structure and electronic device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and in particular to a packaging substrate, a chip packaging structure, and an electronic device. Background Technology

[0003] Glass core board-based chip packaging technology uses a glass substrate as the core board, encapsulating the chip on or inside the glass core board to form a chip packaging structure. This chip packaging structure has the advantages of good electrical performance and low manufacturing cost. This is because the size of the through-glass vias (TGVs) fabricated on the glass core board, as well as the size of the metal lines in the wiring layers fabricated on both sides of the glass core board, can be well adapted to the size of the metal lines on the PCB board, thus eliminating the need for an additional interconnect substrate between the chip packaging structure and the PCB.

[0004] However, glass core boards are prone to cracking, which limits the widespread application of chip packaging technology based on glass core boards. Summary of the Invention

[0005] This application provides a packaging substrate, a chip packaging structure, and an electronic device, with the aim of reducing the thermomechanical stress on the glass core plate in the packaging substrate, thereby reducing the risk of cracking of the glass core plate.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, a packaging substrate is provided, which includes a glass core, a connecting layer, and a protective layer.

[0008] The glass core panel has a through hole; the glass core panel includes a first surface and a second surface facing each other, and the through hole extends from the first surface to the second surface. The connecting layer includes a first sub-layer and two second sub-layers. The first sub-layer is disposed on the inner wall of the through hole, and the two second sub-layers are respectively disposed on the first and second surfaces, and each of the two second sub-layers is connected to the first sub-layer. At least a portion of the protective layer is disposed between the glass core panel and the second sub-layers. The hardness of the protective layer is greater than the hardness of the glass core panel, or the elastic modulus of the protective layer is less than the elastic modulus of the glass core panel.

[0009] In the packaging substrate provided in this application embodiment, by making the first sub-layer of the connecting layer lay on the inner wall of the through hole, the connecting layer is prevented from completely filling the through hole, reducing the volume of metal material in the through hole, thereby effectively reducing the magnitude of the thermomechanical stress that the connecting layer can generate, thereby reducing the probability of stress damage to the glass core board, for example, preventing cracking inside the glass core board.

[0010] Furthermore, by providing a second sub-layer, this embodiment ensures that the connecting layer, even when arranged in a layered manner, still has a large contact area for electrical connection with the conductive structure on the surface of the glass core board. By providing a protective layer at least between the glass core board and the second sub-layer, the portion of the glass core board facing the second sub-layer is protected, thereby avoiding the problem of damage to the surface of the glass core board caused by the large thermomechanical stress resulting from providing a second sub-layer on the surface of the glass core board to achieve the layered arrangement of the connecting layer.

[0011] That is, by setting a layered connecting layer, the volume of metal material is effectively reduced, thereby reducing the thermomechanical stress in the packaging substrate, reducing the risk of internal cracking of the glass core board, and improving the reliability of the packaging substrate. At the same time, by using a protective layer, the problem of stress damage to the surface of the glass core board caused by the layered setting of the connecting layer can be avoided.

[0012] In one possible implementation of the first aspect, a portion of the protective layer is also disposed between the inner wall of the through hole and the first sub-layer, thereby strengthening the protection of the portion of the glass core board belonging to the inner wall of the through hole, thereby further reducing the probability of cracking of the glass core board, for example, reducing the risk of cracking on the surface of the inner wall of the through hole, and further improving the reliability of the encapsulation substrate.

[0013] In one possible implementation of the first aspect, the material of the protective layer includes one or more of SiOx and SiNx, thereby ensuring that the protective layer has high hardness and thus ensuring that the protective layer has a good protective effect on the glass core.

[0014] In one possible implementation of the first aspect, a protective layer is disposed around the surface of the glass core board, and a portion of the protective layer is also disposed on the inner wall of the through hole, thereby protecting any position of the glass core board. This not only prevents stress damage to the portion of the glass core board directly opposite the connecting layer, but also protects other positions of the glass core board from external damage, thereby further reducing the risk of cracking of the glass core board and improving the reliability of the encapsulation substrate.

[0015] In one possible implementation of the first aspect, the material of the protective layer includes organic polymer materials, thereby ensuring that the protective layer has a small elastic modulus, ensuring that the protective layer has a good stress relief effect, and improving the protection of the glass core plate.

[0016] In one possible implementation of the first aspect, the protective layer is disposed only on the first and second surfaces, thereby separating the second sublayer from the glass core. At the same time, there is no need to cut the protective layer so that it is disposed only between the second sublayer and the glass core, thereby reducing the difficulty of fabricating the protective layer and improving the fabrication efficiency of the encapsulation substrate.

[0017] In one possible implementation of the first aspect, the side of the protective layer near the through hole is flush with the inner wall of the through hole, thereby protecting all the parts of the glass core board surface that are directly opposite the connecting layer, especially protecting the area of ​​the glass core board surface near the opening of the through hole where stress concentration is prone to occur, thus achieving full protection for the glass core board.

[0018] Alternatively, the protective layer may be positioned on the side of the through-hole that is further away from the centerline of the through-hole than from the inner wall of the through-hole. In other words, the protective layer may not be applied to the surface of the glass core board on the portion of the surface located at the opening of the through-hole. This ensures that the protective layer does not obstruct the through-hole and thus guarantees the connection effect of the connecting layer.

[0019] In one possible implementation of the first aspect, the protective layer includes a third sublayer and a fourth sublayer, which are at least partially stacked, with the third sublayer being closer to the glass core sheet than the fourth sublayer in the stacked portion. The third sublayer has a harderness than the glass core sheet, and the fourth sublayer has a lower elastic modulus than the glass core sheet.

[0020] By configuring the protective layer into multiple layers, with some layers having higher hardness to resist stress and others having lower elastic modulus to dissipate stress, the stress reduction effect can be superimposed, further reducing the risk of cracking in the glass core board.

[0021] In one possible implementation of the first aspect, the third sub-layer is disposed around the surface of the glass core plate, and part of the third sub-layer is also disposed on the inner wall of the through hole; the fourth sub-layer is disposed only on the first and second surfaces, so that while forming a certain protective effect on the inner wall of the through hole, the steps of preparing the protective layer on the inner wall of the through hole are avoided, thereby achieving a balance between the protective effect on the glass core plate and the difficulty of preparation.

[0022] Secondly, another packaging substrate is provided, which includes a glass core and a connector.

[0023] The glass core board has a through hole; the glass core board includes a first surface and a second surface facing each other, and the through hole extends from the first surface to the second surface. A connecting portion fills the through hole, and the connecting portion does not contact the end of the through hole near the surface of the glass core board.

[0024] In the packaging substrate provided in this application embodiment, by providing a connecting portion for filling through holes, sufficient external connection area can be achieved without setting metal material on the surface of the glass core plate, thereby avoiding stress damage to the surface of the glass core plate. Furthermore, by providing the inner wall of the through hole, the inner wall portions at the upper and lower ends do not contact the connecting portion, so that the through hole opening position, where stress concentration is prone to occur, has a large deformation space. This prevents the deformation of the connecting portion at this position from directly affecting the glass core plate, thereby also reducing the risk of cracking of the glass core plate and improving the reliability of the packaging substrate.

[0025] In a possible implementation of the second aspect, the connecting portion includes a first sub-portion and two second sub-portions, with the two second sub-portions respectively connected to both ends of the first sub-portion in a direction perpendicular to the glass core plate. The first sub-portion contacts the inner wall of the through hole, while the second sub-portions are spaced apart from the inner wall of the through hole. This allows the connecting portion to fill the through hole as much as possible, ensuring a good connection, while also ensuring that the two ends of the connecting portion are spaced apart from the glass core plate. This avoids stress concentration at the opening of the through hole and reduces the risk of cracking in the glass core plate.

[0026] In the second possible implementation, the two opposing surfaces of the connector in the direction perpendicular to the glass core are recessed into the through hole relative to the surface of the glass core, so that the connector and the inner walls at both ends of the through hole have no directly facing area, thereby avoiding stress damage to the opening of the through hole caused by the connector during thermal expansion.

[0027] In a possible implementation of the second aspect, the packaging substrate further includes a protective layer, at least partially disposed between the connection portion and the inner wall of the through hole; the hardness of the protective layer is greater than the hardness of the glass core, or the elastic modulus of the protective layer is less than the elastic modulus of the glass core.

[0028] In this embodiment, by setting the end of the connecting part to not contact the glass core board, thereby reducing the stress concentration at the opening of the through hole, a protective layer is also used to separate the connecting part from the glass core board, further reducing the risk of cracking of the glass core board.

[0029] Thirdly, a chip packaging structure is provided, the chip packaging structure including a chip and a packaging substrate provided in any one embodiment of the first or second aspect. The chip and the packaging substrate are electrically connected.

[0030] Fourthly, an electronic device is provided, comprising a motherboard and a chip package structure provided in the embodiments of the third aspect. The chip package structure is disposed on the motherboard and electrically connected to the motherboard.

[0031] The technical effects of the chip packaging structure in the third aspect and the electronic devices in the fourth aspect can be seen in the technical effects of the packaging substrate design in the first or second aspect, and will not be repeated here. Attached Figure Description

[0032] Figure 1 is a perspective view of an electronic device provided in an embodiment of this application;

[0033] Figure 2 is an exploded view of the structure of an electronic device provided in an embodiment of this application;

[0034] Figure 3 is a partial enlarged view of an electronic device provided in an embodiment of this application;

[0035] Figure 4 is a schematic diagram of a chip packaging structure provided in an embodiment of this application;

[0036] Figure 5 is a cross-sectional view of a packaging substrate provided in an embodiment of this application;

[0037] Figure 6 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0038] Figure 7 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0039] Figure 8 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0040] Figure 9 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0041] Figure 10 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0042] Figure 11 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0043] Figure 12 is another cross-sectional view of the packaging substrate provided in an embodiment of this application;

[0044] Figure 13 is another cross-sectional view of the packaging substrate provided in an embodiment of this application. Detailed Implementation

[0045] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0046] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "exemplary," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, a particular feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0048] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0049] Connection / linking: can refer to a mechanical or physical connection relationship, that is, A and B are connected or linked. It can mean that there are fastened components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate. A and B can be fixed, detachable, or integrated; they can be directly connected or indirectly connected through an intermediate medium.

[0050] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0051] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0052] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0053] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0054] Furthermore, the scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the emergence of new scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0055] Some embodiments of this application provide an electronic device. This electronic device can be a consumer electronics product, a home electronics product, an in-vehicle electronics product, a financial terminal product, or a communication electronics product. Consumer electronics products include, for example, mobile phones, tablets, laptops, e-readers, personal computers (PCs), personal digital assistants (PDAs), desktop monitors, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, and automobiles. Home electronics products include, for example, smart door locks, televisions, remote controls, refrigerators, and rechargeable small household appliances (e.g., soymilk makers, robot vacuum cleaners). In-vehicle electronics products include, for example, in-vehicle navigation systems and in-vehicle high-density digital video discs (DVDs). Financial terminal products include, for example, automated teller machines (ATMs) and self-service terminals. Communication electronics products include, for example, servers, memory devices, radar, base stations, and other communication equipment.

[0056] This application does not impose any special limitations on the specific form of the above-described electronic device. For ease of explanation, the following examples all use a mobile phone as an example.

[0057] Figure 1 is a perspective view of an electronic device provided in an embodiment of this application, and Figure 2 is an exploded view of the electronic device shown in Figure 1.

[0058] Referring to Figures 1 and 2, in this embodiment, the electronic device 1000 is a mobile phone. The electronic device 1000 may include a screen 100, a mid-frame 200, a back cover 300, and a motherboard 400 fixed on the mid-frame 200, as shown in Figure 2.

[0059] It is understood that Figures 1 and 2 only schematically illustrate some components included in the electronic device 1000, and the actual shape, size, location, and construction of these components are not limited by Figures 1 and 2. For example, in some other examples, the electronic device 1000 may not include the screen 100. Alternatively, the electronic device 1000 may also include the camera 500 as shown in Figure 2.

[0060] Figure 3 is a partial enlarged view of an electronic device 1000 provided in an embodiment of this application.

[0061] In some embodiments, as shown in FIG3, the electronic device 1000 may further include a chip package structure 600.

[0062] The chip package structure 600 can be disposed on the motherboard 400 and electrically connected to the motherboard 400. For example, the chip package structure 600 can be electrically connected to the motherboard 400 through a ball grid array (BGA) or multiple arrays of copper pillar bumps (CPB), thereby enabling the chip package structure 600 to transmit signals with other chips or chip stack structures on the motherboard 400.

[0063] For example, the motherboard 400 described above can be a printed circuit board (PCB).

[0064] It should be noted that the number of chip package structures 600 on the motherboard 400 is not limited in this application embodiment. For example, one, two or more chip package structures 600 can be provided on a motherboard 400.

[0065] For ease of description below, an X, Y, Z coordinate system can be established in some of the accompanying drawings. The plane on which the motherboard 400 shown in Figure 3 is located can be the XY plane. Taking the motherboard 400 shown in Figure 3 as a rectangle as an example, the X-axis can be the length direction of the motherboard 400, the Y-axis can be the width direction of the motherboard 400, and the Z-axis is the direction perpendicular to or approximately perpendicular to the motherboard 400 within the manufacturing tolerance range.

[0066] Figure 4 is a cross-sectional view of a chip packaging structure 600 provided in an embodiment of this application.

[0067] This application embodiment also provides a chip packaging structure 600, as shown in FIG4. The chip packaging structure 600 may include a packaging substrate (SUB) 10 and a chip 20.

[0068] As an example, referring to FIG4, the chip 20 can be disposed on the packaging substrate 10 and electrically connected to the packaging substrate 10.

[0069] For example, when the chip package structure 600 is disposed on the motherboard 400, the package substrate 10 can be disposed between the chip 20 and the motherboard 400 in order to realize the electrical connection between the chip 20 and the motherboard 400.

[0070] Alternatively, the chip 20 may also be embedded in the packaging substrate 10.

[0071] For example, the chip 20 can be a bare die (i.e., a singletie) or a chip stack structure (i.e., multiple bare dies stacked together).

[0072] For example, one packaging substrate 10 may be provided with one or more chips 20. In this embodiment of the application, the number of chips 20 packaged in the chip packaging structure 600 is not limited.

[0073] For example, referring to Figure 4, the chip package structure 600 may package only one chip 20, or for example, the chip package structure 600 may package two or more chips 20.

[0074] For example, when multiple chips 20 are packaged in the chip package structure 600, at least two chips 20 may be arranged in a direction parallel to the package substrate 10 (i.e., arranged in the same layer), and / or at least two chips 20 may be stacked in a direction perpendicular to the package substrate 10.

[0075] For example, the chip 20 can be a processing chip with data processing capabilities, such as a central processing unit (CPU), system on chip (SOC), or graphics processing unit (GPU) that can process data.

[0076] For example, referring to FIG4, the chip package structure 600 may further include a package layer 30.

[0077] The material of the encapsulation layer 30 can be a molding compound. Referring to Figure 4, the encapsulation layer 30 can encapsulate part or all of the chip 20 together with the encapsulation substrate 10 in order to protect the chip 20 from external damage and improve the mechanical strength and fracture toughness of the chip encapsulation structure 600.

[0078] Glass core board-based chip packaging technology uses a glass substrate as the core board, encapsulating the chip on or inside the glass core board to form a chip packaging structure. This chip packaging structure has the advantages of good electrical performance and low manufacturing cost. This is because the size of the through-glass vias (TGVs) fabricated on the glass core board, as well as the size of the metal lines in the wiring layers fabricated on both sides of the glass core board, can be well adapted to the size of the metal lines on the PCB board, thus eliminating the need for an additional interconnect substrate between the chip packaging structure and the PCB.

[0079] In TGV packaging structures, metal materials, such as copper, are placed in the vias of the glass core. However, the coefficient of thermal expansion of the metal (e.g., copper) differs significantly from that of the glass core, leading to substantial thermomechanical stress during processing due to temperature rise and fall. This results in the glass core bearing significant stress; for example, due to the mismatch in the coefficients of thermal expansion between the metal and the glass core, the glass core is susceptible to compressive forces from the metal, potentially causing cracking. This reduces the reliability of the packaging substrate and hinders the further development of chip packaging structures based on TGV technology.

[0080] To solve the above-mentioned technical problems, this application also provides a packaging substrate 10. Figures 5 to 9 are some other cross-sectional views of the packaging substrate 10 provided in this application.

[0081] In some embodiments, as shown in Figures 5 to 9, the encapsulation substrate 10 may include a glass core plate 1, a connecting layer 2, and a protective layer 3.

[0082] For example, the material of the glass core board 1 may include glass materials such as quartz glass or high silica glass.

[0083] Referring to Figures 5 to 9, the glass core plate 1 is provided with a through hole H. The glass core plate 1 includes a first surface 1a and a second surface 1b that are opposite each other. The through hole H extends from the first surface 1a to the second surface 1b.

[0084] Referring to Figures 5 to 9, the first surface 1a and the second surface 1b are two surfaces opposite each other in the third direction Z. That is, the through hole H completely penetrates the glass core plate 1 in the thickness direction, so as to set the connecting layer 2 in the through hole H and realize the interconnection between the conductive structure located on the side of the first surface 1a and the conductive structure located on the side of the second surface 1b.

[0085] For example, the through hole H can be formed on the glass core plate 1 by chemical etching (such as chemical etching with hydrofluoric acid), laser, laser-induced wet etching, etc.

[0086] Referring to Figures 5 to 9, the connecting layer 2 is used to realize the electrical connection between the conductive structures on the upper and lower sides of the glass core plate 1 (the side where the first surface 1a is located and the side where the second surface 1b is located).

[0087] Referring to Figures 5 to 9, the connecting layer 2 includes a first sub-layer 21 and two second sub-layers 22. The first sub-layer 21 is disposed on the inner wall of the through hole H, and the two second sub-layers 22 are disposed on the first surface 1a and the second surface 1b respectively, and the two second sub-layers 22 are respectively connected to the first sub-layer 21.

[0088] That is, the second sub-layer 22 is used to be disposed on the surface of the glass core board 1 so as to make electrical contact with the conductive structure (such as wiring, chip or other electronic device) disposed on the surface of the glass core board 1, and the first sub-layer 21 is used to be disposed in the through hole H so as to realize the electrical connection between the two second sub-layers 22, thereby realizing the electrical connection between the conductive structures on both sides of the glass core board 1 under the combined action of the first sub-layer 21 and the second sub-layer 22.

[0089] For example, the second sub-layer 22 may be disposed around the opening of the through hole H.

[0090] For example, the connecting layer 2 is relatively thin and is only laid on the surface of the glass core plate 1, without completely filling the entire through hole H.

[0091] For example, the two second sub-layers 22 and the first sub-layer 21 can be configured as a single unit.

[0092] For example, the bonding layer 2 can be prepared by sputtering or electroplating.

[0093] For example, the material of the connecting layer 2 is a conductive material, such as metals like copper and silver or some alloy materials.

[0094] Referring to Figures 5 to 9, at least a portion of the protective layer 3 is disposed between the glass core plate 1 and the second sub-layer 22. That is, at least the portion of the connecting layer 2 located near the through hole H of the glass core plate 1 does not directly contact the glass core plate 1, and the two are separated by the protective layer 3.

[0095] The protective layer 3 has a higher hardness than the glass core board 1. That is, the protective layer 3 has a better ability to resist stress, so as to resist and block the stress generated by the connecting layer 2, thereby reducing the stress transmitted from the connecting layer 2 to the glass core board 1, protecting the glass core board 1, and reducing the probability of the glass core board 1 cracking.

[0096] Alternatively, the elastic modulus of the protective layer 3 is less than that of the glass core board 1. That is, the protective layer 3 can have better buffering capacity, thereby buffering and dissipating the stress generated by the connecting layer 2. It can also reduce the stress transmitted from the connecting layer 2 to the glass core board 1, protect the glass core board 1, and reduce the probability of the glass core board 1 cracking.

[0097] In the encapsulation substrate 10 provided in this application embodiment, by making the first sub-layer 21 of the connecting layer 2 laid on the inner wall of the through hole H, the connecting layer 2 is prevented from completely filling the through hole H, the volume of the metal material in the through hole H is reduced, thereby effectively reducing the magnitude of the thermomechanical stress that the connecting layer 2 can generate, thereby reducing the probability of stress damage to the glass core plate 1, for example, preventing cracking inside the glass core plate 1.

[0098] Furthermore, by providing a second sub-layer 22, this embodiment ensures that the connecting layer 2, even when arranged in a layered manner, still has a large contact area for electrical connection with the conductive structure provided on the surface of the glass core board 1. By providing a protective layer 3 at least between the glass core board 1 and the second sub-layer 22, the portion of the glass core board 1 facing the second sub-layer 22 is protected, thereby avoiding the problem of damage to the surface of the glass core board 1 caused by the large thermomechanical stress resulting from providing the second sub-layer 22 on the surface of the glass core board 1 to achieve the layered arrangement of the connecting layer 2.

[0099] That is, by setting the layered connecting layer 2, the volume of the metal material is effectively reduced, thereby reducing the thermomechanical stress in the encapsulation substrate 10, reducing the risk of internal cracking of the glass core board 1, and improving the reliability of the encapsulation substrate 10. At the same time, by using the protective layer 3, the problem of stress damage to the surface of the glass core board 1 caused by the layered setting of the connecting layer 2 can be avoided.

[0100] In some embodiments, as shown in FIG5, the protective layer 3 can be provided only between the second sub-layer 22 and the glass core 1, thereby avoiding the protective layer 3 occupying too much design space while satisfying the protection function of the glass core 1.

[0101] In some embodiments, as shown in Figures 6 and 7, a portion of the protective layer 3 is also disposed between the inner wall of the through hole H and the first sub-layer 21, thereby strengthening the protection of the portion of the glass core plate 1 belonging to the inner wall of the through hole H, thereby further reducing the probability of cracking of the glass core plate 1, for example, reducing the risk of cracking on the surface of the inner wall of the through hole H, and further improving the reliability of the encapsulation substrate 10.

[0102] For example, as shown in FIG6, part of the protective layer 3 is disposed between the second sub-layer 22 and the glass core plate 1, and another part is disposed between the first sub-layer 21 and the glass core plate 1 (the inner wall of the through hole H). That is, the protective layer 3 is only disposed between the part of the connecting layer 2 that is directly opposite to the glass core plate 1, thereby separating the glass core plate 1 and the connecting layer 2 while avoiding the protective layer 3 occupying too much design space of the glass core plate 1.

[0103] Alternatively, as exemplarily shown in FIG7, the protective layer 3 may also be provided around all surfaces of the glass core plate 1. For example, in the case where the glass core plate 1 includes six sides, the protective layer 3 covers all six sides of the glass core plate 1 and also covers the inner wall of the through hole H, thereby protecting any position of the glass core plate 1. This not only prevents stress damage to the part of the glass core plate 1 that is directly opposite to the connecting layer 2, but also protects other positions of the glass core plate 1 from external damage, thereby further reducing the risk of cracking of the glass core plate 1 and improving the reliability of the encapsulation substrate 10.

[0104] In some embodiments, as shown in FIG8, the protective layer 3 may be disposed only on the first surface 1a and the second surface 1b, thereby separating the second sub-layer 22 from the glass core plate 1. At the same time, there is no need to cut the protective layer 3 so that the protective layer 3 is disposed only between the second sub-layer 22 and the glass core plate 1, thereby reducing the difficulty of preparing the protective layer 3 and improving the preparation efficiency of the encapsulation substrate 10.

[0105] In some embodiments, as shown in FIG9, the protective layer 3 can also be provided in multiple layers.

[0106] For example, as shown in Figure 9, the protective layer 3 may include a third sub-layer 31 and a fourth sub-layer 32, which are at least partially stacked. In the stacked portion, the third sub-layer 31 is closer to the glass core plate 1 than the fourth sub-layer 32. The hardness of the third sub-layer 31 is greater than that of the glass core plate 1, and the elastic modulus of the fourth sub-layer 32 is less than that of the glass core plate 1.

[0107] By making the protective layer 3 multi-layered, and setting some of the protective layers 3 to have higher hardness to resist stress, while others to have lower elastic modulus to dissipate stress, the stress reduction effect can be superimposed, further reducing the risk of cracking of the glass core board 1.

[0108] For example, the third sub-layer 31 and the fourth sub-layer 32 may both be disposed only between the second sub-layer 22 and the glass core plate 1, or the third sub-layer 31 and the fourth sub-layer 32 may both be disposed completely around all surfaces of the glass core plate 1, or the third sub-layer 31 and the fourth sub-layer 32 may both be disposed at least partially on the inner wall of the through hole H.

[0109] Alternatively, as exemplarily shown in Figure 9, the third sub-layer 31 is disposed around the surface of the glass core plate 1, and a portion of the third sub-layer 31 is also disposed on the inner wall of the through hole H. The fourth sub-layer 32 is disposed only on the first surface 1a and the second surface 1b. This can provide a certain degree of protection to the inner wall of the through hole H while avoiding the need for multiple steps of preparing the protective layer 3 on the inner wall of the through hole H, thereby achieving a balance between the protective effect on the glass core plate 1 and the difficulty of preparation.

[0110] In some embodiments, when the protective layer 3 is only provided on the first surface 1a and the second surface 1b, the side of the protective layer 3 near the through hole H is flush with the inner wall of the through hole H, thereby protecting all the parts of the glass core board 1 that are directly opposite the connecting layer 2. In particular, it protects the area of ​​the glass core board 1 surface near the opening of the through hole H, where stress concentration is prone to occur, thus achieving full protection for the glass core board 1.

[0111] Alternatively, in some embodiments, referring to Figures 8 and 9, when the protective layer 3 is only provided on the first surface 1a and the second surface 1b, the side of the protective layer 3 near the through hole H is further away from the centerline of the through hole H relative to the inner wall of the through hole H.

[0112] For example, the protective layer 3 is disposed around the opening of the through hole H, and the size of the opening on the protective layer 3 for exposing the through hole H is larger than the size (e.g., diameter) of the through hole H.

[0113] That is, the protective layer 3 is not provided on the surface of the glass core board 1 on the part of the surface located at the opening of the through hole H, so as to ensure that the protective layer 3 will not block the through hole H, thereby ensuring the connection effect of the connection layer 2.

[0114] In some embodiments, the material of the aforementioned protective layer 3 includes one or more of SiOx and SiNx, thereby ensuring that the protective layer 3 has high hardness and thus ensuring that the protective layer 3 has a good protective effect on the glass core plate 1.

[0115] For example, the protective layer 3 can be prepared using a dry process, such as PVD, PECVD or CVD.

[0116] This preparation method can obtain a protective layer 3 that completely surrounds the surface of the glass core board 1, thereby ensuring all-round protection of the glass core board 1.

[0117] In some embodiments, the material of the protective layer 3 includes organic polymer materials, such as polyimide (PI), thereby ensuring that the protective layer 3 has a small elastic modulus, ensuring that the protective layer 3 has a good stress relief effect, and improving the protection of the glass core plate 1.

[0118] For example, the protective layer 3 of the organic polymer material can be disposed only on the first surface 1a and the second surface 1b. While the connecting layer 2 is disposed in a layered manner to avoid cracking inside the glass core plate 1, the protective layer 3 is disposed between the layered connecting layer 2 and the surface of the glass core plate 1. This can satisfy the protection effect of the glass core plate 1 without the need to set the protective layer 3 on the inner wall of the through hole H, which reduces the difficulty of preparing the encapsulation substrate 10 and improves the preparation efficiency.

[0119] For example, the thickness of the protective layer 3 of the organic polymer material can be 3μm to 30μm.

[0120] This application also provides another type of encapsulation substrate 10, which can also alleviate stress concentration in the encapsulation substrate 10, reduce the risk of cracking of the glass core board 1, and improve the reliability of the encapsulation substrate 10.

[0121] Figures 10 to 13 are further cross-sectional views of the packaging substrate 10 provided in the embodiments of this application.

[0122] In some embodiments, as shown in Figures 10 to 13, the encapsulation substrate 10 includes a glass core plate 1 and a connecting portion 4.

[0123] In the aforementioned embodiment, the glass core plate 1 is provided with a through hole H. The glass core plate 1 includes a first surface 1a and a second surface 1b, which are opposite to each other. The through hole H extends from the first surface 1a to the second surface 1b. Other limitations of the glass core plate 1 can be found in the aforementioned embodiment, and will not be repeated here.

[0124] As shown in Figures 10 to 13, the connecting part 4 is filled in the through hole H, and the connecting part 4 does not contact the end of the inner wall of the through hole H near the surface of the glass core plate 1.

[0125] That is, taking the orientation in Figures 10 to 13 as an example, the inner wall of the through hole H, the inner wall at the upper and lower ends, does not contact the connecting part 4.

[0126] For example, the material of the connecting part 4 can be the same as the material of the aforementioned connecting layer 2, and the preparation method, function, etc. can also be the same, which will not be repeated here.

[0127] In the encapsulation substrate 10 provided in this application embodiment, by providing a connecting portion 4 that fills the through hole H, sufficient external connection area can be achieved without providing metal material on the surface of the glass core plate 1, thereby avoiding stress damage to the surface of the glass core plate 1. Furthermore, by providing the inner wall of the through hole H, the inner wall portions located at the upper and lower ends do not contact the connecting portion 4, so that the through hole H opening position, which is prone to stress concentration, has a large deformation space. This prevents the connecting portion 4 from directly acting on the glass core plate 1 when deforming at this position, thereby also reducing the risk of cracking of the glass core plate 1 and improving the reliability of the encapsulation substrate 10.

[0128] In some embodiments, as shown in FIG10, the connecting portion 4 includes a first sub-portion 41 and two second sub-portions 42. The two second sub-portions 42 are respectively connected to the two ends of the first sub-portion 41 in a direction perpendicular to the glass core plate 1. The first sub-portion 41 is in contact with the inner wall of the through hole H, and the second sub-portions 42 are spaced apart from the inner wall of the through hole H.

[0129] For example, the axes of the first sub-part 41 and the second sub-part 42 are on the same straight line, and the diameter of the second sub-part 42 is smaller than the diameter of the first sub-part 41. This allows the connecting part 4 to fill the through hole H as much as possible, ensuring the connection effect, while the two ends of the connecting part 4 are spaced apart from the glass core plate 1. This avoids stress concentration at the opening of the through hole H and reduces the risk of cracking of the glass core plate 1.

[0130] For example, the connecting part 4 can be completely filled with the through hole H first, and then selective etching can be used to etch away the sidewall of the part of the connecting part 4 located at the opening of the through hole H, so as to obtain the connecting part 4 shown in FIG10.

[0131] Referring to Figure 10, in this embodiment, the dimension of the connecting part 4 in the third direction Z is the same as the dimension of the through hole H in the third direction Z. This allows the structure used to connect the connecting part 4 externally to be connected without having to extend into the through hole H to connect with the connecting part 4, thereby reducing the difficulty of connecting the connecting part 4 externally.

[0132] In some embodiments, as shown in FIG11, the two opposing surfaces of the connecting portion 4 in the direction perpendicular to the glass core plate are recessed in the through hole H relative to the surface of the glass core plate 1.

[0133] That is, the connecting part 4 only fills the middle part of the through hole H, and does not fill the upper and lower ends of the through hole H (taking the orientation in Figure 11 as an example), so that the inner walls of the connecting part 4 and the two ends of the through hole H have no direct facing area, thereby avoiding stress damage to the opening of the through hole H by the connecting part 4 during thermal expansion.

[0134] For example, the connecting part 4 can be completely filled with the through hole H first, and then the part of the connecting part 4 located at the opening of the through hole H can be etched to a certain depth using an etching process to obtain the connecting part 4 shown in Figure 11.

[0135] In some embodiments, as shown in Figures 12 and 13, the encapsulation substrate 10 further includes a protective layer 3, at least a portion of which is disposed between the connecting portion 4 and the inner wall of the through hole H, wherein the hardness of the protective layer 3 is greater than the hardness of the glass core plate 1, or the elastic modulus of the protective layer 3 is less than the elastic modulus of the glass core plate 1.

[0136] It is understood that the materials and preparation methods of the protective layer 3 can be found in the description of the protective layer 3 in the foregoing embodiments, and will not be repeated here.

[0137] In this embodiment, by setting the end of the connecting part 4 to not contact the glass core plate 1, thereby reducing the stress concentration at the opening of the through hole H, the connecting part 4 and the glass core plate 1 are also separated by the protective layer 3, further reducing the risk of cracking of the glass core plate 1. For example, reducing the risk of cracks appearing on the inner wall surface of the through hole H, thereby further improving the reliability of the encapsulation substrate 10.

[0138] For example, referring to FIG12, the protective layer 3 may be disposed around the glass core 1, thereby providing protection for all surfaces of the glass core 1.

[0139] Alternatively, as exemplarily provided in FIG13, the protective layer 3 may be provided only between the portion of the through hole H opposite to the connecting portion 4 and the connecting portion 4.

[0140] In some embodiments, as shown in Figures 8 to 13, the encapsulation substrate 10 may include an insulating layer 5, which is used to wrap the connecting layer 2 or the connecting portion 4 to prevent the connecting layer 2 or the connecting portion 4 from having unexpected electrical connections. For example, referring to Figures 8 to 13, an opening may be formed in the insulating layer 5 at a preset position to expose a portion of the connecting layer 2 or the connecting portion 4, thereby facilitating the external connection of the connecting layer 2 or the connecting portion 4.

[0141] For example, an opening can be formed on the insulating layer 5 by photolithography or laser drilling.

[0142] For example, referring to Figures 10 to 13, the packaging substrate 10 may also include an external connection structure 6, which is embedded in the insulating layer 5 and electrically connected to the connection portion 4.

[0143] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed herein should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A package substrate, characterized by, include: A glass core board is provided with a through hole; the glass core board includes a first surface and a second surface opposite to each other, and the through hole extends from the first surface to the second surface; The connecting layer includes a first sub-layer and two second sub-layers. The first sub-layer is disposed on the inner wall of the through hole, and the two second sub-layers are disposed on the first surface and the second surface, respectively, and the two second sub-layers are respectively connected to the first sub-layer. A protective layer is disposed at least partially between the glass core and the second sub-layer; Wherein, the hardness of the protective layer is greater than the hardness of the glass core board, or the elastic modulus of the protective layer is less than the elastic modulus of the glass core board.

2. The package substrate of claim 1, wherein Part of the protective layer is also disposed between the inner wall of the through hole and the first sub-layer.

3. The package substrate according to claim 1 or 2, wherein The material of the protective layer includes one or more of SiO x and SiN x .

4. The package substrate of claim 3, wherein The protective layer is disposed around the surface of the glass core plate, and a portion of the protective layer is also disposed on the inner wall of the through hole.

5. The package substrate according to claim 1 or 2, wherein The protective layer is made of organic polymer materials.

6. The package substrate of claim 1, wherein The protective layer is applied only to the first surface and the second surface.

7. The package substrate of claim 6, wherein, The protective layer is flush with the inner wall of the through hole on the side closest to the through hole; or, The protective layer is located on the side of the through hole that is closer to the through hole, and is further away from the center line of the through hole relative to the inner wall of the through hole.

8. The package substrate according to any one of claims 1 to 7, wherein The protective layer includes a third sub-layer and a fourth sub-layer, which are at least partially stacked, and in the stacked portion, the third sub-layer is closer to the glass core plate than the fourth sub-layer. The hardness of the third sub-layer is greater than that of the glass core, and the elastic modulus of the fourth sub-layer is less than that of the glass core.

9. The package substrate of claim 8, wherein, The third sublayer is disposed around the surface of the glass core plate, and a portion of the third sublayer is also disposed on the inner wall of the through hole; the fourth sublayer is disposed only on the first surface and the second surface.

10. A package substrate, characterized by, include: A glass core board is provided with a through hole; the glass core board includes a first surface and a second surface opposite to each other, and the through hole extends from the first surface to the second surface; A connecting portion is filled in the through hole, and the connecting portion does not contact the end of the inner wall of the through hole near the surface of the glass core board.

11. The package substrate of claim 10, wherein, The connecting part includes a first sub-part and two second sub-parts, and the two second sub-parts are respectively connected to both ends of the first sub-part in a direction perpendicular to the glass core plate; The first sub-part contacts the inner wall of the through hole, and the second sub-part is spaced apart from the inner wall of the through hole.

12. The package substrate of claim 10, wherein, The two opposing surfaces of the connecting portion in a direction perpendicular to the glass core plate are recessed into the through hole relative to the surface of the glass core plate.

13. The package substrate according to any one of claims 10 to 12, wherein Also includes: A protective layer is at least partially disposed between the connecting portion and the inner wall of the through hole; the hardness of the protective layer is greater than the hardness of the glass core board, or the elastic modulus of the protective layer is less than the elastic modulus of the glass core board.

14. A chip package structure, comprising: include: chip; The packaging substrate as described in any one of claims 1 to 9, or the packaging substrate as described in any one of claims 10 to 13; the chip is electrically connected to the packaging substrate.

15. An electronic device, comprising: include: Motherboard; The chip package structure of claim 14, which is disposed on the main board and electrically connected with the main board.

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