Immersion-type server

Abstract

The present application relates to the technical field of liquid-cooled servers. Disclosed is an immersion-type server, comprising an enclosure, a mounting rack, a motherboard, a power circulation mechanism, and a convection switching device, wherein the mounting rack is arranged inside the enclosure; the mounting rack is spaced apart from a side wall of the enclosure to form a first flow space, and the mounting rack is provided with an accommodating cavity, the top end of the accommodating cavity being in communication with the first flow space; the motherboard is fixed in the accommodating cavity, and a temperature sensor is disposed on the motherboard; the power circulation mechanism is arranged in the first flow space; the convection switching device is fixed between the enclosure and the mounting rack, and is spaced apart from a base plate of the enclosure to form a second flow space, the second flow space being in communication with the bottom end of the accommodating cavity; and the convection switching device has a communicating position for communicating the first flow space with the second flow space and a separating position for separating the first flow space from the second flow space. The present application achieves rational flow of a cooling medium inside the server, preventing the phenomenon of uneven temperature distribution between the upper and lower portions of the cooling medium, and thereby improving cooling efficiency.

Description

Submerged server

[0001] Cross-reference to related applications

[0002] This application claims priority to the Chinese patent application No. 202411700075.0, filed on November 26, 2024, and entitled “Submerged server”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of liquid-cooled servers, in particular to a submerged server. BACKGROUND

[0004] With the rapid development of Internet technology, the amount of data is showing an exponential growth trend, which greatly promotes the rise of edge computing technology. The core strategy of edge computing is to deploy computing and storage resources near the data source, which effectively reduces the delay time of data transmission, and thus significantly improves the response speed and service quality of the system. However, the deployment environment of edge computing devices is often very harsh, for example, edge servers often need to face high temperature, low temperature, high humidity and dusty complex outdoor conditions, which puts extremely strict requirements on the heat dissipation performance of the device. The traditional air cooling technology is limited by its relatively low heat conduction efficiency and high energy consumption level, and it has become more and more difficult to meet the growing heat dissipation needs of high-density computing devices. In this background, the submerged cooling system, with its efficient heat conduction performance and excellent environmental adaptability, is gradually becoming the preferred solution to solve the heat dissipation problem of data centers.

[0005] The submerged cooling system is to directly immerse the server in the cooling liquid, so that the cooling liquid is in direct contact with the heat generating devices, and relies on the convection circulation of the cooling liquid to realize the heat dissipation of the server monomer. However, the processor, power supply module and other key heat generating components in the server monomer are often arranged in the middle or upper part of the mainboard; this layout leads to the accumulation of heat in the middle or upper part of the cooling liquid and the formation of convection under the action of thermal convection, while the lower part of the cooling liquid may form a relatively static area, thereby causing the uneven distribution of cold and heat in the upper and lower parts of the cooling liquid, and thus affecting the heat dissipation effect and reducing the heat dissipation efficiency of the server. SUMMARY

[0006] Therefore, the present application provides a submerged server to solve the problem of uneven distribution of cold and heat in the upper and lower parts of the cooling liquid, which affects the heat dissipation effect.

[0007] The application provides an immersed server, which comprises a cabinet body, a mounting rack, a mainboard, a power circulation mechanism and a convection switching device; the cabinet body is filled with cooling medium; the mounting rack is arranged in the cabinet body and below the liquid level of the cooling medium; a first flow space is formed between the mounting rack and the side wall of the cabinet body, and a containing cavity is arranged on the mounting rack; the top end of the containing cavity is communicated with the first flow space; the mainboard is fixed in the containing cavity; a temperature sensor is arranged on the mainboard; the power circulation mechanism is arranged in the first flow space; the convection switching device is fixed between the cabinet body and the mounting rack; a second flow space is formed between the convection switching device and the bottom plate of the cabinet body, and the second flow space is communicated with the bottom end of the containing cavity; the convection switching device has a communication position for communicating the first flow space and the second flow space and a separation position for separating the first flow space and the second flow space; when the temperature of the temperature sensor is lower than a preset temperature, the convection switching device is in the communication position, and the power circulation mechanism is in a closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device is in the separation position, and the power circulation mechanism is in an open state.

[0008] Since the containing cavity is arranged in the mounting rack, the mainboard is fixed in the containing cavity, and the first flow space is arranged between the mounting rack and the cabinet body, during the operation of the mainboard, the cooling medium in the containing cavity is heated due to the heat generated by the mainboard, the hot cooling medium rises to the top of the cabinet body, exchanges heat with the air outside, so as to realize cooling and heat dissipation, and then the cooling medium after heat dissipation flows downward through the first flow space, enters the second flow space, and finally returns to the containing cavity, thereby continuously providing cooling effect for the mainboard, realizing natural convection circulation of the cooling medium in the cabinet body, realizing reasonable flow of the cooling medium in the cabinet body, preventing heat accumulation in the middle or upper region of the cooling medium, avoiding uneven cooling of the upper and lower parts of the cooling medium, and improving the cooling efficiency; when the load of the mainboard increases, so that the temperature detected by the temperature sensor exceeds the preset value, the power circulation mechanism is started; at this time, the convection switching device is switched to the separation state, so as to ensure that the cooling medium is driven by the power circulation mechanism to flow in the containing cavity in a forced circulation mode, not only preventing heat accumulation in the middle or upper region of the cooling medium, but also significantly accelerating the circulation speed of the cooling medium and improving the heat dissipation efficiency.

[0009] In an optional embodiment, a shunt assembly is further arranged in the containing cavity, the shunt assembly is arranged in the containing cavity and forms a third flow space; a fourth flow space is formed in the shunt assembly; the third flow space, the fourth flow space and the first flow space are communicated with each other on the side close to the top of the cabinet body; the third flow space, the fourth flow space and the second flow space are communicated with each other on the side close to the bottom of the cabinet body; the mainboard is provided with a high-heat-emission component and a low-heat-emission component, the low-heat-emission component is arranged in the third flow space, and the high-heat-emission component is arranged in the fourth flow space.

[0010] By the arrangement of the shunt assembly, the third flow space and the fourth flow space are divided, and the arrangement of the third flow space and the fourth flow space can separate the high heat generating component and the low heat generating component from each other. The heat generated by the high heat generating component during operation is confined in the third flow space, and cannot adversely affect the low heat generating component located in the fourth flow space, so that the low heat generating component can stably work in a relatively low temperature environment, thereby improving the efficiency and reliability of the entire system.

[0011] In an alternative embodiment, the shunt assembly includes two shunt plates, the two shunt plates are arranged at intervals and form the fourth flow space; and the two shunt plates are arranged at intervals with the two opposite side walls of the accommodating cavity and form two third flow spaces, respectively; and the low heat generating components are provided in two groups, and the two groups of low heat generating components are arranged in the two third flow spaces, respectively.

[0012] By the arrangement of the two shunt plates, two independent third flow spaces can be formed, and the circulation flowability of the cooling medium is enhanced; and the two low heat generating components are located in the two third flow spaces, respectively, which not only ensures that each low heat generating component can be sufficiently cooled, but also effectively improves the overall heat dissipation performance by enhancing the circulation of the cooling medium, and realizes the optimization of the space layout and the improvement of the heat dissipation effect.

[0013] In an alternative embodiment, the shunt plate includes a first connecting plate, a second connecting plate and a third connecting plate, the first connecting plate, the second connecting plate and the third connecting plate are arranged in sequence along the vertical direction; the top end of the second connecting plate is connected with the first connecting plate, and the bottom end is connected with the third connecting plate; the distance between the two first connecting plates is less than the distance between the two third connecting plates.

[0014] Since the distance between the two first connecting plates is less than the distance between the two third connecting plates, it is ensured that sufficient cooling medium can be distributed between the two third connecting plates, and sufficient cooling medium can be distributed between the first connecting plate and the side wall of the accommodating cavity; the sufficient distribution of the cooling medium between the two third connecting plates and between the first connecting plate and the side wall of the accommodating cavity is realized, and the overall flowability of the cooling medium in the accommodating cavity is enhanced.

[0015] In an alternative embodiment, the high heat generating component is arranged between the two third connecting plates, and the low heat generating component is arranged between the first connecting plate and the side wall of the accommodating cavity.

[0016] The top end of the second connecting plate is connected with the first connecting plate, and the bottom end is connected with the third connecting plate, and the three connecting plates are arranged in sequence in the vertical direction, forming an ordered structure, so that the third connecting plate is located below the first connecting plate; since the high-heat-emitting components are arranged between the two third connecting plates, that is, close to one side of the cabinet bottom plate, when the high-heat-emitting components generate heat, the heat will flow upwards and be further cooled by the cooling medium above the cabinet, not only accelerating the heat dissipation efficiency, but also ensuring the full use of the cooling medium; the low-heat-emitting components are arranged in the space between the first connecting plate and the side wall of the accommodating cavity, and form a layout arranged in sequence in the vertical direction with the high-heat-emitting components, so that the heat generated by the low-heat-emitting components can quickly rise to the liquid level of the cooling medium for heat dissipation, and the heat generated by the high-heat-emitting components will not interfere with it, thereby ensuring the stability and efficiency of the entire heat dissipation system.

[0017] In an alternative embodiment, the convection switching device comprises a first partition plate, a switching plate and a power extension mechanism; the first partition plate is arranged between the mounting frame and the side wall of the cabinet; in the first direction, a first gap is provided between the mounting frame and the side wall of the cabinet; the first partition plate is provided with a plurality of convection holes, the plurality of convection holes are arranged at intervals, and the convection holes are located in the first gap; the switching plate is provided with a plurality of switching holes, and the plurality of switching holes correspond one-to-one with the plurality of convection holes; and the switching plate is in abutment with the first partition plate and is slidably arranged in the cabinet along the second direction; the first direction is perpendicular to the second direction; the power extension mechanism is connected with the switching plate through the power output end.

[0018] The power extension mechanism controls the sliding of the switching plate, when the power extension mechanism controls the switching plate to slide to the position corresponding to the switching hole and the convection hole, the communication between the first flow space and the second flow space can be realized; when the power extension mechanism drives the switching plate to slide to the position where the switching hole and the convection hole are staggered, the first flow space and the second flow space are effectively separated by physical blocking; through the cooperation of the power extension mechanism and the switching plate, the communication and separation of the first flow space and the second flow space are realized.

[0019] In an alternative embodiment, it further comprises a second partition plate, the second partition plate is arranged in the cabinet and divides the cabinet into a first accommodating space and a second accommodating space, the first accommodating space and the second accommodating space are arranged in sequence along the second direction; the cooling medium is arranged in the first accommodating space, and the mounting frame is located in the first accommodating space; the power extension structure is located in the second accommodating space, and the power output end of the power extension structure is connected with the switching plate through the second partition plate.

[0020] By setting the second partition, the cabinet can be divided into two independent areas: the first accommodating space and the second accommodating space. By setting the power telescopic mechanism in the second accommodating space, the working stability of the power telescopic mechanism is ensured, and the interference that the cooling medium may cause to it is avoided.

[0021] In one optional embodiment, a first heat dissipation mechanism is further included, with a second gap between the mounting bracket and the second partition plate; the first heat dissipation mechanism includes a first heat dissipation fin and a second heat dissipation fin; the first heat dissipation fin is disposed in the second gap and abuts against the mounting bracket and the second partition plate on both sides along the second direction respectively; the second heat dissipation fin is disposed in the second receiving space and connected to the first heat dissipation fin.

[0022] By setting up the first and second heat sinks, an efficient heat transfer path is constructed, which can effectively and quickly conduct the heat generated in the first containment space to the second containment space, thereby achieving rapid heat dissipation and cooling, ensuring the high efficiency of heat transfer and the significant heat dissipation effect.

[0023] In one optional embodiment, the first heat dissipation mechanism further includes a heat dissipation fan, which is disposed in the second accommodating space, and the side wall of the cabinet is provided with an air inlet and an air outlet, both of which are connected to the second accommodating space and are spaced apart.

[0024] By incorporating cooling fans, air inlets, and air outlets, the airflow within the second containment space can be accelerated. This not only enhances the heat dissipation effect but also ensures effective air circulation, thereby speeding up heat dissipation and making the heat dissipation process more efficient and reliable.

[0025] In one optional embodiment, a third partition plate is further included. The third partition plate is disposed within the second accommodating space and divides the second accommodating space into a first mounting space and a second mounting space. The second mounting space is located below the first mounting space. The second heat sink is located within the second mounting space. The cooling fan is fixed on the third partition plate, and the air inlet of the cooling fan is located within the first mounting space, while the air outlet is located within the second mounting space. The air inlet communicates with the first mounting space, and the air outlet communicates with the second mounting space.

[0026] Because the second heat sink is located within the second mounting space and the air outlet is connected to the second mounting component, the path for heat to dissipate from the second heat sink to the outside is shortened, thereby accelerating the heat dissipation process. Furthermore, because the air inlet is connected to the first mounting space, with the air inlet of the cooling fan located within the first mounting space and the air outlet located within the second mounting space, not only is a continuous supply of cool air drawn in from the first mounting space and delivered to the second mounting space by the cooling fan, but the overall heat dissipation effect is further optimized, allowing heat to be expelled more quickly and effectively.

[0027] In one optional embodiment, the mounting bracket includes one or more fixing components and a fixing plate; multiple sets of fixing components are arranged sequentially along a second direction; the fixing components include a mounting plate and two side plates; the two side plates are respectively arranged on both sides of the mounting plate along a first direction and enclose the mounting plate to form a receiving groove; the receiving groove and the adjacent fixing components enclose to form a receiving cavity; the fixing plate is located on the side of the fixing component away from the second partition plate, and the fixing plate and the receiving groove of the adjacent fixing component enclose to form a receiving cavity.

[0028] Multiple fasteners can be used to securely install multiple motherboards; and adjacent fasteners can form a cavity; fasteners can also form cavities with the end fasteners, making full use of space and providing a relatively independent and protected working environment for each motherboard.

[0029] In one alternative embodiment, a current splitter assembly is connected to the mounting plate, and the current splitter assembly is spaced apart from the mounting plate; the main board is located between the current splitter assembly and the mounting plate, and the main board is fixedly connected to the mounting plate and abuts against the current splitter assembly.

[0030] By connecting the diversion component to the fixed plate, the diversion component in the receiving cavity on the side opposite to the second separation plate is fixedly installed. This not only ensures that the diversion component can be firmly installed in the predetermined position, but also greatly facilitates the subsequent assembly process of the mounting bracket.

[0031] In one alternative embodiment, a shunt assembly is connected to the side of the mounting plate opposite to the side plate, and the shunt assembly is spaced apart from the adjacent mounting plate; the main board is located between the shunt assembly and the adjacent mounting plate, the main board is fixedly connected to the adjacent mounting plate, and abuts against the shunt assembly.

[0032] By connecting the diversion assembly to the side of the mounting plate away from the side plate, it is convenient to fix and install the diversion assembly in the receiving cavity formed by two adjacent fixed assemblies, and it is also convenient to assemble the mounting bracket.

[0033] In one alternative embodiment, a second heat dissipation mechanism is further included, which includes a third heat sink; the high-heat component includes a processor, and the third heat sink is attached to the processor.

[0034] By adding a third heatsink, the heat dissipation surface area of ​​the processor is increased, which not only directly improves the heat conduction efficiency, allowing the heat generated by the processor to be transferred to the cooling medium more quickly, but also allows the heat to be carried away more effectively through the flow of the cooling medium, enhancing the ability of convection heat dissipation. Furthermore, it optimizes the heat dissipation path, enhances the flow efficiency of the cooling medium, reduces the accumulation of heat around the processor, and promotes the rapid dissipation of heat.

[0035] In one optional embodiment, the high-heat component further includes a power supply module, and the power supply module and the processor are arranged sequentially in a vertical direction; the second heat dissipation mechanism further includes a fourth heat sink, which is attached to the power supply module.

[0036] By adding a fourth heat sink, the heat dissipation surface area of ​​the power supply module is increased. This not only directly improves the heat conduction efficiency, allowing the heat generated by the power supply module to be transferred to the cooling medium more quickly, but also allows the heat to be carried away more effectively through the flow of the cooling medium, enhancing the ability of convective heat dissipation. Furthermore, it optimizes the heat dissipation path, enhances the flow efficiency of the cooling medium, reduces the accumulation of heat around the power supply module, and promotes rapid heat dissipation. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0038] Figure 1 is a front view of an immersion server according to some embodiments of this application;

[0039] Figure 2 is a schematic diagram of the exploded structure of an immersion server according to some embodiments of this application;

[0040] Figure 3 is a structural schematic diagram of an immersion server from another perspective of some embodiments of this application;

[0041] Figure 4 is a side view of an immersion server according to some embodiments of this application;

[0042] Figure 5 is a cross-sectional view of Figure 4 (AA section);

[0043] Figure 6 is a cross-sectional view of BB in Figure 4;

[0044] Figure 7 is a front view of an immersion server according to some embodiments of this application;

[0045] Figure 8 is a CC cross-sectional view of Figure 7;

[0046] Figure 9 is a schematic diagram of the connection between the first partition plate and the cabinet in some embodiments of this application;

[0047] Figure 10 is a schematic diagram of the connection between the fixing plate and the diversion component in some embodiments of this application.

[0048] Explanation of reference numerals in the attached drawings: 1. Cabinet; 11. First flow space; 12. Second flow space; 13. Third flow space; 14. Fourth flow space; 15. Second partition plate; 16. Third partition plate; 17. Air inlet; 18. Air outlet; 2. Mounting bracket; 21. Diverter assembly; 211. Diverter plate; 2111. First connecting plate; 2112. Second connecting plate; 2113. Third connecting plate; 22. Fixing assembly; 221. Mounting plate; 222. Side panel; 23. Fixing plate; 3. Main board; 31. High-frequency... 311. Thermal component; 312. Processor; 313. Power supply module; 32. Low heat generation component; 321. Server memory; 322. Server hard disk; 4. Power circulation mechanism; 5. Convection switching device; 51. First partition plate; 511. Convection hole; 52. Switching plate; 521. Switching hole; 53. Power telescopic mechanism; 6. First heat dissipation mechanism; 61. First heat sink; 62. Second heat sink; 63. Cooling fan; 7. Second heat dissipation mechanism; 71. Third heat sink; 72. Fourth heat sink. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] The embodiments of this application are described below with reference to Figures 1 to 10.

[0051] According to some embodiments of this application, in one aspect, an immersion server is provided, including a cabinet 1, a mounting frame 2, a motherboard 3, a power circulation mechanism 4, and a convection switching device 5; the cabinet 1 is filled with a cooling medium; the mounting frame 2 is disposed inside the cabinet 1, located below the liquid surface of the cooling medium; a first flow space 11 is formed between the mounting frame 2 and the side wall of the cabinet 1, and the mounting frame 2 is provided with a receiving cavity; the top of the receiving cavity communicates with the first flow space 11; the motherboard 3 is fixed inside the receiving cavity; and a temperature sensor is provided on the motherboard 3; the power circulation mechanism 4 is disposed inside the first flow space 11; the convection switching device 5 is fixed to the cabinet 1. Between the mounting bracket 2 and the base plate of the cabinet 1, the convection switching device 5 is spaced apart to form a second flow space 12, which is connected to the bottom end of the receiving cavity. The convection switching device 5 has a connecting position that connects the first flow space 11 and the second flow space 12, and a separating position that separates the first flow space 11 and the second flow space 12. When the temperature of the temperature sensor is lower than the preset temperature, the convection switching device 5 is in the connecting position and the power circulation mechanism 4 is in the closed state. When the temperature of the temperature sensor is higher than the preset temperature, the convection switching device 5 is in the separating position and the power circulation mechanism 4 is in the open state.

[0052] Because the mounting bracket 2 has a receiving cavity, the motherboard 3 is fixed inside the receiving cavity, and a first flow space 11 is provided between the mounting bracket 2 and the cabinet 1, during the operation of the motherboard 3, the cooling medium in the receiving cavity will heat up due to the heat generated by the motherboard 3. The hot cooling medium rises to the top of the cabinet 1 and exchanges heat with the outside air, thereby achieving cooling and heat dissipation. The cooled medium then flows downward through the first flow space 11, enters the second flow space 12, and finally flows back into the receiving cavity to continue providing cooling for the motherboard 3. This realizes the natural convection circulation of the cooling medium within the cabinet 1, achieving the cooling medium's circulation within the cabinet. The reasonable flow inside body 1 prevents heat from accumulating in the middle or upper part of the cooling medium, avoiding uneven heating and cooling between the upper and lower parts of the cooling medium and improving cooling efficiency. When the load on motherboard 3 increases, causing the temperature detected by the temperature sensor to exceed the preset value, the power circulation mechanism 4 will be activated. At this time, the convection switching device 5 will also switch to the separation state to ensure that the cooling medium is forced to circulate in the containment cavity under the drive of the power circulation mechanism 4. This not only prevents heat from accumulating in the middle or upper part of the cooling medium, but also significantly accelerates the circulation speed of the cooling medium and improves heat dissipation efficiency.

[0053] In a specific implementation, when the server load is low, the motherboard 3 temperature is low, and the temperature detected by the temperature sensor is lower than the preset value. At this time, natural convection circulation can meet the server's heat dissipation needs, and the power circulation mechanism 4 is in the off state, saving energy consumption. When the server load is high, the motherboard 3 temperature is high, and the temperature detected by the temperature sensor is higher than the preset value. At this time, the power circulation mechanism 4 is in the on state, switching from natural convection mode to forced convection mode to ensure heat dissipation efficiency. Through the setting of temperature sensor and convection switching device 5, the cooling mode can be dynamically adjusted according to the actual workload to ensure good heat dissipation effect under different working conditions.

[0054] In a specific implementation, since the temperature detected by the temperature sensor is higher than the preset value, when the power circulation mechanism 4 is in the open state, the first flow space 11 and the second flow space 12 are separated, and the cooling medium only circulates in the receiving cavity and the second flow space 12, which reduces the load on the power circulation mechanism 4 and reduces energy consumption.

[0055] In a specific implementation, in a traditional cooling system design, since only a single cooling chamber is provided, the cooling medium, after being heated around the motherboard 3, rises and flows to the top of the cabinet 1 to exchange heat with the air for heat dissipation. However, when the cooled medium flows downwards, it often only reaches the heat-generating part of the motherboard 3 and is heated again before continuing to rise, failing to effectively flow to the area below the heat-generating part. This results in the cooling medium at the bottom remaining stagnant and failing to fully exert its cooling effect. Compared with the traditional structure, in this application, the cooled medium can flow to the area below the heat-generating part of the motherboard 3 through the first flow space 11, and through the provision of the second flow space 12, the cooling medium flowing to the area below the heat-generating part can flow back to the heat-generating part of the motherboard 3 to cool it. This ensures that the cooling medium can circulate under natural convection conditions, avoiding heat accumulation in the middle or upper part of the cooling medium and improving cooling efficiency.

[0056] In a specific implementation, the power circulation mechanism 4 is a circulation pump.

[0057] In a specific implementation, the cooling medium is a coolant.

[0058] In some embodiments of this application, a diversion component 21 is also provided in the receiving cavity, and the diversion component 21 is spaced apart from the side wall of the receiving cavity to form a third flow space 13; and a fourth flow space 14 is formed in the diversion component 21; on the side near the top of the cabinet 1, the third flow space 13, the fourth flow space 14 are interconnected with the first flow space 11; on the side near the bottom of the cabinet 1, the third flow space 13, the fourth flow space 14 are interconnected with the second flow space 12; a high-heat component 31 and a low-heat component 32 are provided on the main board 3, the low-heat component 32 is disposed in the third flow space 13, and the high-heat component 31 is disposed in the fourth flow space 14.

[0059] By setting up the flow divider 21, a third flow space 13 and a fourth flow space 14 are divided. The third flow space 13 and the fourth flow space 14 can separate the high-heat-generating component 31 and the low-heat-generating component 32. The heat generated by the high-heat-generating component 31 during operation is confined to the third flow space 13 and cannot adversely affect the low-heat-generating component 32 located in the fourth flow space 14. This ensures that the low-heat-generating component 32 can work stably in a relatively low-temperature environment, thereby improving the efficiency and reliability of the entire system.

[0060] In some embodiments of this application, the diversion assembly 21 includes two diversion plates 211, which are spaced apart to form a fourth flow space 14; and the two diversion plates 211 are spaced apart from two opposite side walls of the receiving cavity, and respectively form two third flow spaces 13; the low-heating assembly 32 is provided in two sets, and the two sets of low-heating assemblies 32 are respectively disposed in the two third flow spaces 13.

[0061] By setting up two flow dividers 211, two independent third flow spaces 13 can be formed, which enhances the circulation flow of the cooling medium. The two low-heat components 32 are located in the two third flow spaces 13 respectively, which not only ensures that each low-heat component 32 can be fully cooled, but also effectively improves the overall heat dissipation performance by enhancing the circulation of the cooling medium, thereby optimizing the spatial layout and improving the heat dissipation effect.

[0062] In a specific implementation, the shunt plate 211 is made of insulating material, which helps to prevent the risk of electrical short circuits and increases the safety and reliability of the system.

[0063] In some embodiments of this application, the diverter plate 211 includes a first connecting plate 2111, a second connecting plate 2112, and a third connecting plate 2113, which are arranged sequentially in a vertical direction; the top end of the second connecting plate 2112 is connected to the first connecting plate 2111, and the bottom end is connected to the third connecting plate 2113; the distance between the two first connecting plates 2111 is less than the distance between the two third connecting plates 2113.

[0064] Since the distance between the two first connecting plates 2111 is less than the distance between the two third connecting plates 2113, sufficient cooling medium is ensured to be distributed between the two third connecting plates 2113, and sufficient cooling medium is also distributed between the first connecting plate 2111 and the side wall of the receiving cavity; sufficient distribution of cooling medium between the two third connecting plates 2113 and between the first connecting plate 2111 and the side wall of the receiving cavity is achieved, and the overall flow of cooling medium in the receiving cavity is enhanced.

[0065] In some embodiments of this application, the high-heat-generating component 31 is disposed between two third connecting plates 2113, and the low-heat-generating component 32 is disposed between the first connecting plate 2111 and the side wall of the receiving cavity.

[0066] The top of the second connecting plate 2112 is connected to the first connecting plate 2111, and the bottom is connected to the third connecting plate 2113. These three connecting plates are arranged in sequence in the vertical direction, forming an orderly structure. Therefore, the third connecting plate 2113 is located below the first connecting plate 2111. Since the high-heat-generating component 31 is located between the two third connecting plates 2113, that is, on the side close to the bottom plate of the cabinet 1, when the high-heat-generating component 31 generates heat, the heat will flow upward and be further cooled by the cooling medium above the cabinet 1. This not only accelerates the heat dissipation efficiency but also ensures the full utilization of the cooling medium. The low-heat-generating component 32 is located in the space between the first connecting plate 2111 and the side wall of the receiving cavity, forming a sequential arrangement with the high-heat-generating component 31 in the vertical direction. This allows the heat generated by the low-heat-generating component 32 to rise quickly to the surface of the cooling medium for heat dissipation, while the heat generated by the high-heat-generating component 31 will not interfere with it, thus ensuring the stability and efficiency of the entire heat dissipation system.

[0067] Preferably, fan blades can also be provided between the two first connecting plates 2111. Since the heat generated by the high-heat component 31 can heat the cooling medium, the cooling medium is heated and rises. During this rising process, the heated cooling medium can naturally drive the fan blades to rotate. The rotation of the fan blades not only accelerates the rising speed of the heated medium, but also further promotes the convection circulation of the cooling medium, thereby improving the overall heat dissipation capacity.

[0068] In some embodiments of this application, the convection switching device 5 includes a first partition plate 51, a switching plate 52, and a power telescopic mechanism 53; the first partition plate 51 is disposed between the mounting frame 2 and the side wall of the cabinet 1; in a first direction, a first gap is provided between the mounting frame 2 and the side wall of the cabinet 1; the first partition plate 51 is provided with a plurality of convection holes 511, which are spaced apart from each other and located within the first gap; the switching plate 52 is provided with a plurality of switching holes 521, which correspond one-to-one with the plurality of convection holes 511; and the switching plate 52 abuts against the first partition plate 51 and is slidably disposed within the cabinet 1 along a second direction; the first direction is perpendicular to the second direction; the power output end of the power telescopic mechanism 53 is connected to the switching plate 52.

[0069] The switching plate 52 is controlled to slide by the power telescopic mechanism 53. When the power telescopic mechanism 53 controls the switching plate 52 to slide to the position corresponding to the switching hole 521 and the convection hole 511, the first flow space 11 and the second flow space 12 can be connected. When the power telescopic mechanism 53 drives the switching plate 52 to slide to the position where the switching hole 521 and the convection hole 511 are misaligned, the first flow space 11 and the second flow space 12 are effectively separated by physical isolation. Through the coordinated work of the power telescopic mechanism 53 and the switching plate 52, the connection and separation of the first flow space 11 and the second flow space 12 are realized.

[0070] In a specific implementation, the switching plate 52 is disposed below the first partition plate 51.

[0071] In a specific implementation, the power telescopic mechanism 53 is a telescopic cylinder.

[0072] In some embodiments of this application, a second partition plate 15 is also included. The second partition plate 15 is disposed inside the cabinet 1 and divides the interior of the cabinet 1 into a first accommodating space and a second accommodating space. The first accommodating space and the second accommodating space are arranged sequentially along a second direction. The cooling medium is disposed in the first accommodating space, and the mounting bracket 2 is located in the first accommodating space. The power telescopic structure is located in the second accommodating space, and the power output end of the power telescopic structure passes through the second partition plate 15 and is connected to the switching plate 52.

[0073] By setting the second partition 15, the cabinet 1 can be divided into two independent areas: the first accommodating space and the second accommodating space. By setting the power telescopic mechanism 53 in the second accommodating space, the working stability of the power telescopic mechanism 53 is ensured, and the interference that the cooling medium may cause to it is avoided.

[0074] In some embodiments of this application, a first heat dissipation mechanism 6 is also included, and a second gap is provided between the mounting frame 2 and the second partition plate 15; the first heat dissipation mechanism 6 includes a first heat dissipation fin 61 and a second heat dissipation fin 62; the first heat dissipation fin 61 is disposed in the second gap and abuts against the mounting frame 2 and the second partition plate 15 on both sides along the second direction respectively; the second heat dissipation fin 62 is disposed in the second accommodating space and is connected to the first heat dissipation fin 61.

[0075] By setting up the first heat sink 61 and the second heat sink 62, an efficient heat transfer path is constructed, which can effectively and quickly conduct the heat generated in the first containment space to the second containment space, thereby achieving rapid heat dissipation and cooling, ensuring the high efficiency of heat transfer and the significant heat dissipation effect.

[0076] In a specific implementation, the first heat sink 61 is located below the power circulation mechanism 4.

[0077] In a specific implementation, both the first heat sink 61 and the second heat sink 62 are heat dissipation fins.

[0078] In some embodiments of this application, the first heat dissipation mechanism 6 further includes a heat dissipation fan 63, which is disposed in the second accommodating space, and the side wall of the cabinet 1 is provided with an air inlet 17 and an air outlet 18, both of which are connected to the second accommodating space and are spaced apart.

[0079] The arrangement of the cooling fan 63, air inlet 17, and air outlet 18 accelerates the airflow within the second containment space, enhancing the heat dissipation effect and ensuring effective air circulation, thereby speeding up heat dissipation and making the heat dissipation process more efficient and reliable.

[0080] In some embodiments of this application, a third partition plate 16 is also included. The third partition plate 16 is disposed within the second accommodating space and divides the second accommodating space into a first installation space and a second installation space. The second installation space is located below the first installation space. The second heat sink 62 is located within the second installation space. The cooling fan 63 is fixed on the third partition plate 16, and the air inlet of the cooling fan 63 is located within the first installation space, and the air outlet is located within the second installation space. The air inlet 17 communicates with the first installation space, and the air outlet 18 communicates with the second installation space.

[0081] Since the second heat sink 62 is located in the second installation space and the air outlet 18 is connected to the second mounting component, the path for heat to dissipate from the second heat sink 62 to the outside is shortened, thereby accelerating the heat dissipation process. Furthermore, since the air inlet 17 is connected to the first installation space, the air inlet of the cooling fan 63 is located in the first installation space, and the air outlet is located in the second installation space. This not only ensures that a continuous supply of cool air can be drawn in from the first installation space and sent into the second installation space through the cooling fan 63, but also further optimizes the overall heat dissipation effect, allowing heat to be expelled more quickly and effectively.

[0082] In some embodiments of this application, the mounting frame 2 includes one or more fixing components 22 and a fixing plate 23; multiple sets of fixing components 22 are arranged sequentially along a second direction; the fixing component 22 includes a mounting plate 221 and two side plates 222; the two side plates 222 are respectively arranged on both sides of the mounting plate 221 along a first direction and surround the mounting plate 221 to form a receiving groove; the receiving groove surrounds the adjacent fixing component 22 to form a receiving cavity; the fixing plate 23 is located on the side of the fixing component 22 away from the second partition plate 15, and the fixing plate 23 surrounds the receiving groove of the adjacent fixing component 22 to form a receiving cavity.

[0083] By setting multiple fasteners, multiple motherboards 3 can be fixedly installed; and two adjacent fasteners 22 can form a receiving cavity; by setting the fastener 23, it can form a receiving cavity with the fastener 22 located at the end, making full use of space resources and providing a relatively independent and protected working environment for each motherboard 3.

[0084] In a specific implementation, the fixing component 22 is a gate-shaped structure, which facilitates the installation and disassembly of the internal structure of the server, and facilitates the daily maintenance and upgrade of the server.

[0085] In a specific implementation, the fixing plate 23 is made of insulating material, which helps to prevent the risk of electrical short circuits and increases the safety and reliability of the system.

[0086] In some embodiments of this application, a current splitter assembly 21 is connected to the fixed plate 23, and the current splitter assembly 21 is spaced apart from the mounting plate 221; the main board 3 is located between the current splitter assembly 21 and the mounting plate 221, the main board 3 is fixedly connected to the mounting plate 221, and abuts against the current splitter assembly 21.

[0087] By connecting the diversion component 21 to the fixing plate 23, the diversion component 21 in the receiving cavity on the side opposite to the second separation plate is fixedly installed. This not only ensures that the diversion component 21 can be firmly installed in the predetermined position, but also greatly facilitates the subsequent assembly process of the mounting bracket 2.

[0088] In some embodiments of this application, a diversion assembly 21 is connected to the side of the mounting plate 221 away from the side plate 222, and the diversion assembly 21 is spaced apart from the adjacent mounting plate 221; the main board 3 is located between the diversion assembly 21 and the adjacent mounting plate 221, the main board 3 is fixedly connected to the adjacent mounting plate 221, and abuts against the diversion assembly 21.

[0089] By connecting the diversion component 21 to the side of the mounting plate 221 away from the side plate 222, it is convenient to fix and install the diversion component 21 in the receiving cavity formed by the two adjacent fixed components 22, and it is also convenient to assemble the mounting bracket 2.

[0090] In some embodiments of this application, a second heat dissipation mechanism 7 is also included, which includes a third heat sink 71; the high-heat component 31 includes a processor 311, and the third heat sink 71 is attached to the processor 311.

[0091] By setting a third heat sink 71, the heat dissipation surface area of ​​the processor 311 is increased, which not only directly improves the heat conduction efficiency, allowing the heat generated by the processor 311 to be transferred to the cooling medium more quickly, but also the heat is carried away more effectively through the flow of the cooling medium, enhancing the ability of convection heat dissipation. In addition, the heat dissipation path is optimized, the flow efficiency of the cooling medium is enhanced, the heat accumulation around the processor 311 is reduced, and the rapid dissipation of heat is promoted.

[0092] In a specific implementation, the temperature processor 311 can be fixed on the motherboard 3 to monitor the temperature of the motherboard 3; or it can be fixed on the processor 311 of the motherboard 3 to monitor the temperature of the processor 311.

[0093] In a specific implementation, the third heat sink 71 is a heat dissipation fin.

[0094] In some embodiments of this application, the high-heat component 31 further includes a power supply module 312, and the power supply module 312 and the processor 311 are arranged sequentially in a vertical direction; the second heat dissipation mechanism 7 further includes a fourth heat sink 72, which is attached to the power supply module 312.

[0095] By setting the fourth heat sink 72, the heat dissipation surface area of ​​the power supply module 312 is increased, which not only directly improves the heat conduction efficiency, allowing the heat generated by the power supply module 312 to be transferred to the cooling medium more quickly, but also the heat is carried away more effectively through the flow of the cooling medium, enhancing the convective heat dissipation capability. Furthermore, the heat dissipation path is optimized, the flow efficiency of the cooling medium is enhanced, the accumulation of heat around the power supply module 312 is reduced, and the rapid dissipation of heat is promoted.

[0096] In a specific implementation, the power supply module 312 includes a first module and a second module. The first module supplies power to the processor 311, and the second module supplies power to the motherboard 3. Specifically, the first module and the second module are arranged alternately along a first direction.

[0097] In a specific implementation, the low-heat component 32 includes a plurality of server memory 321 arranged in sequence and a plurality of server hard disks 322 arranged in sequence, with the server hard disks 322 located above the server motherboard 3.

[0098] In a specific implementation, the fourth heat sink 72 is a heat dissipation fin.

[0099] In a specific implementation, when the server load is low, the temperature detected by the temperature sensor is below a preset value. At this time, the power circulation mechanism 4 is in the closed state, and the convection switching device 5 is in the connected position. When high-heat-generating components 31 such as the processor 311 and power supply module 312 generate heat, the heat heats the surrounding cooling medium. The heated cooling medium moves upward in the fourth flow space 14, carrying the heat from the third heat sink 71 and the fourth heat sink 72 upward. At the same time, the cooling medium in the third flow space 13 exchanges heat with the server memory 321 and the server hard disk 322. The cooling medium moves upward; then the heated cooling medium flows to the upper part of the third flow space 13 and the fourth flow space 14, and cools down by contacting the outside air and the outer wall of the cabinet 1. Then the cooled medium moves downward from the first flow space 11, passes through the convection hole 511 and the switching hole 521 of the convection switching device 5 and enters the second flow space 12. The cooling medium in the second flow space 12 then continues to enter the third flow space 13 and the fourth flow space 14 to cool down the low heat generation component 32 and the high heat generation component 31. The above process is repeated to achieve natural convection circulation heat dissipation.

[0100] In a specific implementation, when the server is under heavy load, the temperature detected by the temperature sensor is higher than the preset value. At this time, the power telescopic mechanism 53 moves to drive the switching plate 52 to move, so that the switching hole 521 and the convection hole 511 are misaligned, and the convection switching device 5 is in the separated position. Then, the cooling fan 63 and the power circulation mechanism 4 are both turned on. The power circulation mechanism 4 drives the cooling medium located above to move downward. The cooling medium moving downward enters the receiving cavity from the second flow space 12, carrying away the heat generated by the low-heating component and the high-heating component. At the same time, the first heat sink 61 and the second heat sink 62 transfer the heat of the heated cooling medium below the power circulation mechanism 4 to the second receiving space. The cooling fan 63 draws in the cold air from the outside through the air inlet 17, and then discharges the hot air after heat exchange with the second heat sink 62 through the air outlet 18.

[0101] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. An immersion server, characterized in that, include: Cabinet (1), the interior of which is filled with cooling medium; The mounting bracket (2) is disposed inside the cabinet (1) and located below the liquid surface of the cooling medium; a first flow space (11) is formed between the mounting bracket (2) and the side wall of the cabinet (1) at intervals, and the mounting bracket (2) is provided with a receiving cavity; the top of the receiving cavity is connected to the first flow space (11); The motherboard (3) is fixed inside the receiving cavity; and a temperature sensor is provided on the motherboard (3); The power circulation mechanism (4) is disposed within the first flow space (11); A convection switching device (5) is fixed between the cabinet (1) and the mounting bracket (2); the convection switching device (5) and the bottom plate of the cabinet (1) are spaced apart to form a second flow space (12), and the second flow space (12) is connected to the bottom end of the receiving cavity; The convection switching device (5) has a connection position that connects the first flow space (11) and the second flow space (12), and a separation position that separates the first flow space (11) and the second flow space (12). When the temperature of the temperature sensor is lower than the preset temperature, the convection switching device (5) is in the connected position and the power circulation mechanism (4) is in the closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device (5) is in the separated position and the power circulation mechanism (4) is in the open state.

2. The immersion server according to claim 1, characterized in that, The receiving cavity is further provided with a diversion component (21), and the diversion component (21) is spaced apart from the side wall of the receiving cavity to form a third flow space (13); and a fourth flow space (14) is formed in the diversion component (21); on the side near the top of the cabinet (1), the third flow space (13), the fourth flow space (14) are interconnected with the first flow space (11); on the side near the bottom of the cabinet (1), the third flow space (13), the fourth flow space (14) are interconnected with the second flow space (12); The motherboard (3) is provided with a high-heat component (31) and a low-heat component (32). The low-heat component (32) is disposed in the third flow space (13), and the high-heat component (31) is disposed in the fourth flow space (14).

3. The immersion server according to claim 2, characterized in that, The flow diversion assembly (21) includes two flow diversion plates (211), which are spaced apart to form the fourth flow space (14); and the two flow diversion plates (211) are spaced apart from the two opposite side walls of the receiving cavity, respectively forming two third flow spaces (13); the low-heating assembly (32) is provided in two sets, and the two sets of low-heating assemblies (32) are respectively arranged in the two third flow spaces (13).

4. The immersion server according to claim 3, characterized in that, The diverter plate (211) includes a first connecting plate (2111), a second connecting plate (2112), and a third connecting plate (2113), which are arranged in sequence along the vertical direction; the top end of the second connecting plate (2112) is connected to the first connecting plate (2111), and the bottom end is connected to the third connecting plate (2113); the distance between the two first connecting plates (2111) is less than the distance between the two third connecting plates (2113).

5. The immersion server according to claim 4, characterized in that, The high-heating component (31) is disposed between the two and the third connecting plate (2113), and the low-heating component (32) is disposed between the first connecting plate (2111) and the side wall of the receiving cavity.

6. The immersion server according to any one of claims 2 to 5, characterized in that, The convection switching device (5) includes: A first partition plate (51) is disposed between the mounting frame (2) and the side wall of the cabinet (1); in a first direction, a first gap is provided between the mounting frame (2) and the side wall of the cabinet (1); the first partition plate (51) is provided with a plurality of convection holes (511), the plurality of convection holes (511) are spaced apart from each other, and the convection holes (511) are located within the first gap; The switching plate (52) is provided with a plurality of switching holes (521), and the plurality of switching holes (521) correspond one-to-one with the plurality of convection holes (511); and the switching plate (52) abuts against the first partition plate (51) and is slidably disposed in the cabinet (1) along the second direction; the first direction is perpendicular to the second direction; The power telescopic mechanism (53) has its power output end connected to the switching plate (52).

7. The immersion server according to claim 6, characterized in that, It also includes a second partition plate (15), which is disposed inside the cabinet (1) and divides the interior of the cabinet (1) into a first accommodating space and a second accommodating space. The first accommodating space and the second accommodating space are arranged sequentially along the second direction. The cooling medium is disposed in the first accommodating space, and the mounting bracket (2) is located in the first accommodating space. The power telescopic structure is located within the second accommodating space, and the power output end of the power telescopic structure passes through the second partition plate (15) and is connected to the switching plate (52).

8. The immersion server according to claim 7, characterized in that, It also includes a first heat dissipation mechanism (6), wherein a second gap is provided between the mounting bracket (2) and the second partition plate (15); the first heat dissipation mechanism (6) includes: The first heat sink (61) is disposed in the second gap and abuts against the mounting bracket (2) and the second partition plate (15) on both sides along the second direction, respectively. The second heat sink (62) is disposed in the second accommodating space and connected to the first heat sink (61).

9. The immersion server according to claim 8, characterized in that, The first heat dissipation mechanism (6) further includes a heat dissipation fan (63), which is located in the second accommodating space. The side wall of the cabinet (1) is provided with an air inlet (17) and an air outlet (18). The air inlet (17) and the air outlet (18) are both connected to the second accommodating space, and the air inlet (17) and the air outlet (18) are spaced apart.

10. The immersion server according to claim 9, characterized in that, It also includes a third partition plate (16), which is disposed in the second accommodating space and divides the second accommodating space into a first installation space and a second installation space; the second installation space is located below the first installation space; the second heat sink (62) is located in the second installation space; the cooling fan (63) is fixed on the third partition plate (16), and the air inlet of the cooling fan (63) is located in the first installation space, and the air outlet is located in the second installation space; the air inlet (17) is connected to the first installation space, and the air outlet (18) is connected to the second installation space.

11. The immersion server according to any one of claims 7 to 10, characterized in that, The mounting bracket (2) includes: One or more fixing components (22), and multiple sets of the fixing components (22) are arranged sequentially along a second direction; the fixing component (22) includes a mounting plate (221) and two side plates (222); the two side plates (222) are respectively arranged on both sides of the mounting plate (221) along a first direction, and together with the mounting plate (221) form a receiving groove; the receiving groove and the adjacent fixing component (22) form the receiving cavity; A fixing plate (23) is located on the side of the fixing component (22) away from the second partition plate (15), and the fixing plate (23) and the receiving groove of the adjacent fixing component (22) enclose the receiving cavity.

12. The immersion server according to claim 11, characterized in that, The current splitter assembly (21) is connected to the fixed plate (23), and the current splitter assembly (21) is spaced apart from the mounting plate (221); the main board (3) is located between the current splitter assembly (21) and the mounting plate (221), and the main board (3) is fixedly connected to the mounting plate (221) and abuts against the current splitter assembly (21).

13. The immersion server according to claim 11, characterized in that, The mounting plate (221) is connected to the shunt assembly (21) on the side away from the side plate (222), and the shunt assembly (21) is spaced apart from the adjacent mounting plate (221); the main board (3) is located between the shunt assembly (21) and the adjacent mounting plate (221), and the main board (3) is fixedly connected to the adjacent mounting plate (221) and abuts against the shunt assembly (21).

14. The immersion server according to any one of claims 2 to 5, 7 to 10, 12, or 13, characterized in that, It also includes a second heat dissipation mechanism (7), which includes a third heat sink (71); the high-heat component (31) includes a processor (311), and the third heat sink (71) is attached to the processor (311).

15. The immersion server according to claim 14, characterized in that, The high-heat component (31) also includes a power supply module (312), and the power supply module (312) and the processor (311) are arranged in sequence along the vertical direction; the second heat dissipation mechanism (7) also includes a fourth heat sink (72), and the fourth heat sink (72) is attached to the power supply module (312).

16. The immersion server according to claim 4, characterized in that, A fan blade is provided between the two first connecting plates (2111).

17. The immersion server according to claim 14, characterized in that, The processor (311) is fixed on the board of the motherboard (3); the processor (311) is configured to monitor the temperature of the motherboard (3).

18. The immersion server according to claim 15, characterized in that, The power supply module (312) includes a first module and a second module; the first module is configured to supply power to the processor (311); and the second module is configured to supply power to the motherboard (3).

19. The immersion server according to claim 15, characterized in that, The low-heat component (32) includes at least one server memory (321) arranged in sequence and at least one server hard disk (322) arranged in sequence, and the server hard disk (322) is located above the motherboard (3).

20. The immersion server according to claim 15, characterized in that, The first heat sink (61), the second heat sink (62), the third heat sink (71) and the fourth heat sink (72) are heat dissipation fins.

21. An immersion server, characterized in that, include: Cabinet (1), the interior of which is filled with cooling medium; The mounting bracket (2) is disposed inside the cabinet (1) and located below the liquid surface of the cooling medium; a first flow space (11) is formed between the mounting bracket (2) and the side wall of the cabinet (1) at intervals, and the mounting bracket (2) is provided with a receiving cavity; the top of the receiving cavity is connected to the first flow space (11); The motherboard (3) is fixed inside the cavity; and the motherboard (3) is provided with a temperature sensor, a high-heat component (31) and a low-heat component (32); The power circulation mechanism (4) is disposed within the first flow space (11); A convection switching device (5) is fixed between the cabinet (1) and the mounting bracket (2); the convection switching device (5) and the bottom plate of the cabinet (1) are spaced apart to form a second flow space (12), and the second flow space (12) is connected to the bottom end of the receiving cavity; a diversion component (21) is also provided in the receiving cavity, and the diversion component (21) and the side wall of the receiving cavity are spaced apart to form a third flow space (13); and a fourth flow space (14) is formed in the diversion component (21); the low heat generation component (32) is set in the third flow space (13), and the high heat generation component (31) is set in the fourth flow space (14); The convection switching device (5) has a connection position that connects the first flow space (11) and the second flow space (12), and a separation position that separates the first flow space (11) and the second flow space (12). When the temperature of the temperature sensor is lower than the preset temperature, the convection switching device (5) is in the connected position and the power circulation mechanism (4) is in the closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device (5) is in the separated position and the power circulation mechanism (4) is in the open state.

22. An immersion server, characterized in that, include: Cabinet (1), the interior of which is filled with cooling medium; The mounting bracket (2) is disposed inside the cabinet (1) and located below the liquid surface of the cooling medium; a first flow space (11) is formed between the mounting bracket (2) and the side wall of the cabinet (1) at intervals, and the mounting bracket (2) is provided with a receiving cavity; the top of the receiving cavity is connected to the first flow space (11); The motherboard (3) is fixed inside the receiving cavity; and a temperature sensor is provided on the motherboard (3); The power circulation mechanism (4) is disposed within the first flow space (11); A convection switching device (5) is fixed between the cabinet (1) and the mounting bracket (2); the convection switching device (5) and the bottom plate of the cabinet (1) are spaced apart to form a second flow space (12), and the second flow space (12) is connected to the bottom end of the receiving cavity; The convection switching device (5) includes: a first partition plate (51), a switching plate (52), and a power telescopic mechanism (53); the first partition plate (51) is provided with a plurality of convection holes (511); the switching plate (52) is provided with a plurality of switching holes (521), and the plurality of switching holes (521) correspond one-to-one with the plurality of convection holes (511); the switching plate (52) abuts against the first partition plate (51) and is slidably disposed inside the cabinet (1); the power output end of the power telescopic mechanism (53) is connected to the switching plate (52); The power telescopic mechanism (53) is used to control the sliding of the switching plate (52), so that the switching plate (52) slides to the position corresponding to the switching hole (521) and the convection hole (511), and the convection switching device (5) is in the position of connecting the first flow space (11) and the second flow space (12), or so that the switching plate (52) slides to the position where the switching hole (521) and the convection hole (511) are misaligned, and the convection switching device (5) is in the position of separating the first flow space (11) and the second flow space (12); When the temperature of the temperature sensor is lower than the preset temperature, the convection switching device (5) is in the connected position and the power circulation mechanism (4) is in the closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device (5) is in the separated position and the power circulation mechanism (4) is in the open state.

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