Semiconductor test apparatus including multiple probe pins

The semiconductor test device addresses probe pin interference by using a configuration of alternating hole rows with wider second and third holes, ensuring stable and accurate semiconductor testing by allowing probe pins to penetrate at different locations.

WO2026116689A1PCT designated stage Publication Date: 2026-06-04OKINS ELECTRONICS

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
OKINS ELECTRONICS
Filing Date
2025-08-21
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

As the spacing between contact balls or contact pads on semiconductors becomes smaller, probe pins in semiconductor test devices interfere with each other during testing, leading to errors in electrical signals and deteriorating the quality of semiconductor testing.

Method used

A semiconductor test device with a configuration of first and second plates having alternating rows of holes for probe pins, where the second and third holes are spaced wider than the first holes, allowing first and second probe pins to be inserted at different locations without interference, with the first pins having a longer body length than the second pins.

Benefits of technology

Prevents interference between probe pins, ensuring stable and accurate semiconductor testing by allowing probe pins to penetrate at different locations, maintaining operational control and reducing signal errors.

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Abstract

Disclosed is a semiconductor test apparatus. According to an aspect of the present invention, the semiconductor test apparatus for testing a semiconductor may comprise: a first plate having multiple first holes arranged in a line; a second plate spaced apart from the first plate and having multiple second holes arranged in a line and multiple third holes spaced apart from the multiple second holes and arranged in a line; multiple first probe pins inserted into the multiple second holes and at least one of the multiple first holes; and multiple second probe pins inserted into the multiple third holes and at least another one of the multiple first holes.
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