Optical signal collection method and optical signal collection apparatus

Abstract

The present invention provides an optical signal collection method and an optical signal collection apparatus. The optical signal collection method comprises: segmenting and focusing a target optical signal; receiving segmented optical signals by means of interface units of an optical signal receiving module; and matching the etendue of an optical signal source with the etendue of an optical signal received by the optical signal receiving module. The optical signal collection method of the present invention realizes complete signal transmission between the optical signal source and the optical signal receiving module. The optical signal collection apparatus comprises an optical focusing structure and the optical signal receiving module. The optical signal is segmented and focused by means of the optical focusing structure, and the interface units of the optical signal receiving module receive the segmented optical signals. By matching the etendue of the optical signal source and the etendue of the optical signal received by the optical signal receiving module, the present invention finally realizes low-loss optical signal transmission. The present invention has the advantages of high transmission efficiency, good transmission quality, simplicity and convenience, and strong reusability.

Description

Optical signal collection method and optical signal collection device Technical Field

[0001] This invention relates to the field of optical signal transmission, and in particular to an optical signal collection method and an optical signal collection device. Background Technology

[0002] In the field of integrated circuits, optical chips can be applied to fiber optic communication, optical interconnects, and computing. They primarily utilize optical signals for data acquisition, transmission, computation, and display, offering advantages such as high transmission efficiency, low loss, strong parallel processing capabilities, and strong anti-interference capabilities. In fiber optic communication, optical interconnects, and computing, the optical spread received by optical chips is typically constant and relatively small, resulting in high transmission quality and efficiency. However, in scenarios requiring the transmission of large spread optical signals, the transmission quality and efficiency of existing optical chips are often suboptimal.

[0003] In existing technologies, to improve the transmission quality and efficiency of optical signals in high-spread optical scenarios, optimized fiber materials and wavelength division multiplexing (WDM) techniques are employed. However, there is still significant room for improvement in the transmission quality and efficiency of the optical signals received by the optical chip. Therefore, ensuring the integrity of optical signal transmission between the optical chip and the optical signal source has become a pressing issue for those skilled in the art.

[0004] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an optical signal collection method and an optical signal collection device to solve the problem that the prior art cannot guarantee that the optical chip can completely receive the target optical signal from the optical signal source.

[0006] To achieve the above and other related objectives, the present invention provides an optical signal collection method, which includes at least the following steps: S1: an optical signal source generates a target optical signal; S2: the target optical signal is divided into n*m unit optical signals, and each of the n*m ​​unit optical signals is focused, wherein the n*m ​​unit optical signals are arranged in an array; wherein n is a natural number greater than or equal to 1, and m is a natural number greater than or equal to 2; S3: when the interface unit array is distributed on the process surface of the optical chip, each i*j interface unit in the interface unit array receives a corresponding signal. There are one unit optical signal, and i*j interface units are arranged in an array. Each optical waveguide is distributed along the process surface and is connected to each interface unit in a one-to-one correspondence. Here, i and j are natural numbers greater than or equal to 1 and less than or equal to 2. When the interface unit array is distributed on the optical chip end face perpendicular to the process surface, each p*q interface unit in the interface unit array receives one unit optical signal. The p*q interface units are arranged in an array, and each optical waveguide is stacked in layers and parallel to the process surface. Each optical waveguide is connected to each interface unit in a one-to-one correspondence. Here, p and q are natural numbers greater than or equal to 1.

[0007] Optionally, a step S1' is provided between step S1 and step S2, in which the target optical signal is collimated before step S2 is performed.

[0008] Optionally, the optical signal of each unit enters the corresponding interface unit perpendicularly; or the optical signal of each unit enters the corresponding interface unit at a first angle to avoid the Bragg condition of the corresponding interface unit, wherein the range of the first angle is [40°, 90°].

[0009] To achieve the above and other related objectives, the present invention also provides an optical signal collection device, which includes at least: an optical focusing structure and an optical signal receiving module; the optical focusing structure includes n*m focusing elements, which divide and focus the target optical signal provided by the optical signal source to obtain n*m unit optical signals, and the n*m ​​focusing elements are arranged in an array; wherein n is a natural number greater than or equal to 1, and m is a natural number greater than or equal to 2; the optical signal receiving module receives the n*m ​​unit optical signals, and the optical signal receiving module includes X optical chips, an interface unit array disposed on the optical chips, and optical waveguides disposed on the optical chips, wherein the optical chips are arranged in parallel, and X is a natural number greater than or equal to 1. When the interface unit array is distributed on the process surface of the optical chip, each i*j interface unit in the interface unit array corresponds to a focusing element, and the i*j interface units are arranged in an array. Each optical waveguide is distributed along the process surface and connected to each interface unit in a one-to-one correspondence, where i and j are natural numbers greater than or equal to 1 and less than or equal to 2. When the interface unit array is distributed on the end face of the optical chip perpendicular to the process surface, each p*q interface unit in the interface unit array corresponds to a focusing element, and the p*q interface units are arranged in an array. Each optical waveguide is stacked layer by layer and parallel to the process surface. Each optical waveguide is connected to each interface unit in a one-to-one correspondence, where p and q are natural numbers greater than or equal to 1.

[0010] Optionally, the optical signal collecting device further includes a collimation device; the collimation device is disposed between the optical signal source and the optical focusing structure, and collimates the target optical signal.

[0011] Alternatively, the collimating device may be any one of a lens assembly, a multimode fiber, a mirror, or a compound parabolic concentrator.

[0012] Optionally, the optical focusing structure is any one of a microlens array, a mirror array, an end face array, a Fresnel lens array, an optical metasurface, a multilayer interference focusing structure, or a grating coupler array.

[0013] Optionally, when X is greater than or equal to 2, the optical chips are arranged in a one-dimensional array or a two-dimensional array.

[0014] Optionally, the distribution density of each interface unit is proportional to the energy distribution density of the target optical signal cross-section.

[0015] Optionally, the interface unit is a grating coupler or an edge coupling structure.

[0016] Optionally, the interface units on the same optical chip are located on different planes.

[0017] Optionally, when the interface unit array is distributed on the optical chip end face perpendicular to the process surface, the interface units on the same optical chip are located on different planes.

[0018] Optionally, the optical spread of the target optical signal is a first optical spread, and the optical spread received by the optical signal receiving module is a second optical spread, wherein the second optical spread is greater than or equal to the first optical spread.

[0019] As described above, the optical signal collection method and optical signal collection device of the present invention have the following beneficial effects:

[0020] 1. This invention calculates the optical spread that a single interface unit can receive and the optical spread of the target light, and sets the specific number of interface units in the optical signal receiving module. Theoretically, this matches the optical spread between the target light and the optical signal receiving module, so as to ensure that complete optical signal transmission between the optical chip and the target light in the optical signal source can be achieved in theory.

[0021] 2. The present invention segments the target optical signal and focuses it into a small interface unit array to ensure that the optical signal receiving module receives the segmented target optical signal completely as much as possible.

[0022] 3. This invention makes the laying surface of the interface unit array perpendicular to the laying surface of the optical waveguide. By avoiding the bending of the optical waveguide, the interface unit array is densely arranged, so that the optical signal receiving module can receive the target optical signal as completely as possible.

[0023] 4. This invention optimizes the efficiency of optical signal transmission by better segmenting the optical signal between the collimated optical signal source and the optical signal receiving module. Attached Figure Description

[0024] Figure 1 shows a schematic diagram of a light signal collector.

[0025] Figure 2 shows a schematic diagram of the optical signal collection device of the present invention.

[0026] Figure 3 shows a schematic diagram of the first structure of the optical signal collection device of the present invention.

[0027] Figure 4 shows a schematic diagram of the first structure of the interface unit array of the present invention.

[0028] Figure 5 shows a schematic diagram of the first structure of the optical chip array of the present invention.

[0029] Figure 6 shows a schematic diagram of a second structure of the optical chip array of the present invention.

[0030] Figure 7 shows a second structural schematic diagram of the optical signal collection device of the present invention.

[0031] Figure 8 shows a schematic diagram of a second structure of the interface unit array of the present invention.

[0032] Figure 9 shows a schematic diagram of the third structure of the optical chip array of the present invention.

[0033] Figure 10 shows a schematic diagram of the fourth structure of the optical chip array of the present invention.

[0034] Figure 11 shows a schematic diagram of the optical signal collection device containing a collimation device according to the present invention.

[0035] Figure 12 is a schematic flowchart of the optical signal collection method of the present invention.

[0036] Component Labeling Explanation: 1. Optical Focusing Structure 1a. Focusing Element 2. Optical Signal Receiving Module 21. Interface Unit Array 2a. Interface Unit 22. Optical Chip 2b. Optical Chip Process Surface 23. Optical Waveguide 3. Collimation Device 4. Transparent Material Layer Detailed Implementation

[0037] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0038] Please refer to Figures 1-12. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0039] Optical signals have various optical parameters, such as wavelength, bandwidth, and dispersion, which reflect some of the performance of the optical signal. However, considering the need to minimize the loss between the optical signal source and the optical signal receiving module to ensure the complete transmission of the optical signal, it is necessary to use optical parameters that can describe the optical signal as a whole.

[0040] Among the many parameters of an optical signal, optical spread reflects the divergence or focusing characteristics of light during propagation. The formula for optical spread is: Where S represents the area of ​​the beam cross-section, λ o Let ω0 represent the wavelength of the optical signal, NA represent the beam waist radius, and NA represent the numerical aperture. Matching the optical spread between the optical chip and the optical signal source (the optical spread of the optical chip being greater than or equal to the optical spread of the optical signal source) indicates that the optical chip has completely received the optical signal from the optical signal source. In transmitting optical signals with large optical spreads, a large number of interface units are needed to achieve optical spread matching between the optical signal source and the optical chip. However, as shown in Figure 1, since the optical waveguides connected to the interface units can only be laid parallel to the optical chip's process surface (the process surface refers to the surface on the optical chip where integrated circuits are formed), when a large number of interface units and each optical waveguide are arranged on the optical chip's process surface (the optical waveguide and interface unit are set up one-to-one, and the signal light received by the interface unit is led out), the bending radius of the optical waveguides limits the difficulty of laying them closer to the center of the process surface. Furthermore, a certain amount of space needs to be reserved between the interface units for the optical waveguides, resulting in a relatively sparse arrangement of interface units on the process surface. The optical spread that the interface unit can receive is less than the optical spread of the optical signal source, therefore the optical chip cannot achieve high-efficiency signal collection. For the reasons mentioned above, this invention proposes an optical signal collection method and an optical signal collection device, which enables the optical signal receiving module to match the optical spread of the target optical signal in order to completely receive the target optical signal. The specific implementation scheme is as follows:

[0041] Example 1

[0042] As shown in Figure 2, this embodiment provides an optical signal collection device, which includes an optical focusing structure 1 and an optical signal receiving module 2.

[0043] As shown in Figure 3, the optical focusing structure 1 includes n*m focusing elements 1a, which divide and focus the target optical signal provided by the optical signal source to obtain n*m unit optical signals. The n*m ​​focusing elements 1a are arranged in an array; where n is a natural number greater than or equal to 1 and m is a natural number greater than or equal to 2.

[0044] Specifically, in this embodiment, the target optical signal provided by the optical signal source can be all the optical signals provided by the optical signal source, or it can be a portion of the optical signals provided by the optical signal source. Further, when the optical signal source is a laser signal source, since the optical spread of laser light is relatively small, all of the laser signal can be selected as the target optical signal. When the optical signal source is a Raman scattering light signal source or a fluorescence signal source, since the optical spread of Raman scattering light or fluorescence is relatively large, when the intensity of Raman scattering light or fluorescence is high, a portion of Raman scattering light or fluorescence can be selected as the target optical signal; when the intensity of Raman scattering light or fluorescence is low, all of Raman scattering light or fluorescence can be selected as the target optical signal. In practical applications, the target optical signal can be defined as needed, and is not limited to this embodiment. Furthermore, to facilitate the calculation of optical spread, the optical signal source can be provided by an optical device with a regular output port. As an example, the device providing the optical signal source can be a regularly arranged multimode fiber or a regularly shaped output slit. In practical applications, the type of optical signal source device can be selected as needed, and is not limited to this embodiment.

[0045] Specifically, in this embodiment, the optical focusing structure 1 divides the target light signal through n*m focusing elements 1a arranged in an array. The area of ​​the focusing element array should not be less than the cross-sectional area of ​​the target light signal to ensure that the optical focusing structure 1 completely receives the target light signal. As an example, the optical focusing structure 1 can be any one of the following: microlens array, mirror array, end face array, Fresnel lens array, optical metasurface, multilayer interference focusing structure, or grating coupler array. In practical applications, the type of optical focusing structure 1 can be selected as needed and is not limited to this embodiment.

[0046] As shown in Figure 3, the optical signal receiving module 2 receives n*m unit optical signals. The optical signal receiving module 2 includes X optical chips 22, an interface unit array 21 disposed on the optical chips, and optical waveguides 23 disposed on the optical chips. The optical chips 22 are arranged in parallel, and X is a natural number greater than or equal to 1.

[0047] Specifically, in this embodiment, the interface unit array 21 is arranged opposite to the optical focusing structure 1, as shown in FIG4. When X equals 1, the interface unit array 21 is laid on the process surface 2b of one optical chip 22, and each optical waveguide 23 is laid along the process surface 2b and connected to each interface unit 2a in a one-to-one correspondence. Each optical waveguide 23 transmits the unit optical signal to the processing module of the optical chip 22. Further, as shown in FIG5 and FIG6 (FIG5 and FIG6 are top views of the optical chip 22), when X is greater than or equal to 2, the X optical chips 22 are arranged in a one-dimensional array (as shown in FIG5) or a two-dimensional array (as shown in FIG6). Each interface unit 2a and each optical waveguide 23 are distributed on the X optical chips 22, and the total number and laying method of the interface units 2a and optical waveguides 23 on the X optical chips are the same as the total number and laying method of the interface units 2a and optical waveguides 23 on the optical chips in FIG4, which will not be described in detail here.

[0048] Specifically, in this embodiment, the structure of the interface unit 2a can be a grating coupler or an edge coupling structure. Each interface unit 2a is connected to a corresponding optical waveguide. The optical waveguide is used to transmit the optical signal received by the interface unit 2a to the processing unit of the optical chip 22. In practical applications, the structure of the interface unit 2a can be selected as needed, and is not limited to this embodiment.

[0049] As shown in Figure 3, when the interface unit array 21 is distributed on the process surface 2b of the optical chip 22, each i*j interface unit 2a in the interface unit array 21 corresponds to a focusing element 1a, and the i*j interface units 2a are arranged in an array. Each optical waveguide is distributed along the process surface and is connected to each interface unit in a one-to-one correspondence. Here, i and j are both natural numbers greater than or equal to 1 and less than or equal to 2.

[0050] Specifically, in this embodiment, the row and column directions of the interface unit array, focusing element array, and optical chip array are consistent. To ensure that the unit optical signal output by a focusing element 1a can be completely received by the corresponding interface unit, i and j are set to natural numbers greater than or equal to 1 and less than or equal to 2. When both i and j are 1, the focusing element 1a and interface unit 2a are configured one-to-one, so the interface unit array does not need to be compactly arranged. When either i or j is not 1, the i*j interface units corresponding to a focusing element 1a are compactly arranged. As an example, as shown in Figure 3, the optical signal receiving module 2 includes an interface unit array 21 and one optical chip 22. The interface unit 2a is a grating coupler, and the focusing element 1a is a microlens. Each interface unit 2a is configured one-to-one with each focusing element 1a. The interface unit array can completely receive each unit optical signal, and by matching the spot radius of the focusing element 1a with the interface unit 2a, each interface unit can receive each unit optical signal with low loss.

[0051] Specifically, in this embodiment, the distribution density of each interface unit is proportional to the energy distribution density of the target optical signal cross-section, in order to improve the transmission efficiency of the target optical signal to the interface unit array 21. As an example, when the target optical signal exhibits a Gaussian distribution, the distribution density of the interface unit array 21 projected along the transmission direction of the unit optical signal onto the central region of the target optical signal cross-section is higher, while the distribution density projected onto the edge region of the target optical signal cross-section is lower. In practical applications, the distribution density of the interface unit array 21 is set according to the energy distribution characteristics of the target optical signal cross-section, and is not limited to this embodiment.

[0052] Specifically, in this embodiment, the interface units 2a on the same optical chip 22 can be located on the same plane or on different planes. When the number of interface units 2a on the optical chip is small, for example, when the number of interface units 2a is in the tens, the interface units can be located on the same plane; when the number of interface units on the optical chip is large, for example, when the number of interface units 2a is in the hundreds, the interface units are placed on different planes. By reducing the number of interface units 2a on the same plane, the difficulty of leading out each interface unit 2a from each optical waveguide 23 on the same plane is reduced.

[0053] Specifically, in this embodiment, as shown in FIG3, a transparent material layer 4 may be provided between the interface unit array 21 and the optical focusing structure 1. The purpose of providing the transparent material layer 4 is to allow the interface unit 2a to match the numerical aperture of the focusing element 1a. As an example, the material of the transparent material layer 4 is quartz glass and silicon carbide. In practical applications, the material of the transparent material layer is set according to the wavelength of the unit optical signal, and is not limited to this embodiment.

[0054] Specifically, in this embodiment, the optical spread of the target optical signal is the first optical spread, and the total optical spread received by the optical signal receiving module 2 through the interface unit array 21 is the second optical spread. When the second optical spread is greater than or equal to the first optical spread, it can be considered that the optical signal receiving module 2 has completely received the optical signal from the optical signal source. Specifically, the total number of interface units is set according to the first optical spread and the optical spread of a single interface unit 2a. As an example, the value of the first optical spread is 1.316 * 10^24. -9 The optical spread value received by a single interface unit 2a is 7.225*10. -13 The optical signal receiving module 2 should include at least With one interface unit 2a and the arrangement of the interface unit array 21 of the present invention, this example can achieve complete reception of the target optical signal.

[0055] Example 2

[0056] As shown in Figures 7 and 8, this embodiment provides an optical signal collection device. The difference between this embodiment and the first embodiment is that: when the interface unit array 21 is distributed on the optical chip end face perpendicular to the process surface 2b, each p*q interface unit 2a in the interface unit array 21 corresponds to a focusing element 1a, the p*q interface units 2a are arranged in an array, and each optical waveguide 23 is stacked layer by layer and parallel to the process surface. Each optical waveguide is connected to each interface unit in a one-to-one correspondence, where p and q are both natural numbers greater than or equal to 1.

[0057] Specifically, in this embodiment, the interface unit array 21 is arranged opposite to the optical focusing structure 1, as shown in Figure 8. When X equals 1, each optical waveguide 23 is stacked layer by layer and parallel to the process surface 2b. The interface unit array 21 is located on the optical chip end face perpendicular to the process surface 2b. Each optical waveguide 23 can be connected to the corresponding interface unit 2a one by one without bending. Each optical waveguide can transmit the optical signal received by each interface unit to the signal processing module of the optical chip. Furthermore, when arranging the interface units, there is no need to leave gaps for the optical waveguides to pass through. Therefore, the interface unit array 21 avoids the bending limitation of the optical waveguides. The interface unit array 21 can achieve dense arrangement, so the interface unit array 21 can completely receive the target optical signal. Furthermore, as shown in Figures 9 and 10 (Figures 9 and 10 are three-dimensional views of the optical chip 22), when X is greater than or equal to 2, the X optical chips 22 are arranged in a one-dimensional array (as shown in Figure 9) or a two-dimensional array (as shown in Figure 10). Each interface unit 2a and each optical waveguide 23 are distributed on the X optical chips, and the total number and laying method of the interface units 2a and optical waveguides 23 on the X optical chips are the same as the total number and laying method of the interface units 2a and optical waveguides 23 on the optical chips in Figure 8, which will not be described in detail here.

[0058] Specifically, in this embodiment, the row and column directions of the interface unit array, focusing element array, and optical chip array are all the same. As an example, as shown in Figure 7, the optical signal receiving module 2 has X (greater than or equal to 2) optical chips 22, the interface unit 2a is an end-face coupler, and the focusing element 1a is a cylindrical lens. The focusing element 1a and the optical chips 22 are arranged in a one-dimensional array and are set in a one-to-one correspondence (one optical chip can correspond to multiple focusing elements 1a, and one focusing element 1a can also correspond to multiple optical chips, not limited to this example). In this example, the sequential arrangement direction of each cylindrical lens and each optical chip 22 is defined as the column direction. As shown in Figure 7, both the cylindrical lens array and the optical chip array are arrays with one row and multiple columns. One cylindrical lens corresponds to one column and multiple rows of interface unit 2a. In practical applications, the row and column directions of the focusing element array, optical chip array, and interface unit array are defined as needed, and the number of focusing elements 1a, the number of optical chips, and the number of interface units 2a corresponding to the focusing element 1a are set according to actual needs, not limited to this embodiment.

[0059] Example 3

[0060] As shown in Figure 11, this embodiment provides a light signal collection device. The difference between this embodiment and embodiments one and two is that the light signal collection device further includes a collimation device 3. The collimation device 3 is located between the light signal source and the optical focusing structure 1, and collimates the target light signal.

[0061] Specifically, in this embodiment, as shown in Figures 3 and 7, the collimating device 3 shapes the target light signal, and expands the target light signal by replacing the collimating device 3 or changing the distance between the collimating device 3 and the light signal source, so as to facilitate the segmentation of the target light signal by the optical focusing structure 1. As an example, the collimating device 3 can be any of a lens assembly, multimode fiber, mirror, or compound parabolic concentrator. In practical applications, any device that can achieve beam shaping and expansion is suitable for the collimating device 3, and is not limited to this embodiment.

[0062] Example 4

[0063] As shown in Figure 12, this embodiment provides an optical signal collection method, the steps of which include:

[0064] As shown in Figure 12, in step S1, the optical signal source generates the target optical signal.

[0065] Specifically, in this embodiment, the target optical signal is provided by an optical signal source. When the target optical signal is all the optical signals provided by the optical signal source, it means that the optical chip needs to acquire all the optical signals from the optical signal source. When the target optical signal is only a portion of the optical signals provided by the optical signal source, it means that the optical chip only needs to acquire the optical signals from the optical signal source that contain the target information. In practical applications, the target optical signal from the optical signal source can be selected as needed, and this embodiment is not the only option.

[0066] As shown in Figure 12, in step S2, the target optical signal is divided into n*m unit optical signals, and each of the n*m ​​unit optical signals is focused. The n*m ​​unit optical signals are arranged in an array. Here, n is a natural number greater than or equal to 1, and m is a natural number greater than or equal to 2.

[0067] Specifically, in this embodiment, each unit optical signal enters the corresponding interface unit 2a perpendicularly; or each unit optical signal enters the corresponding interface unit 2a at a first angle to avoid the Bragg condition generated when each unit optical signal is perpendicularly incident on the corresponding interface unit 2a; wherein, the first angle represents the angle between the optical signal and the normal of the incident interface, and the range of the first angle is [40°, 90°), including but not limited to 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°. In actual applications, the value of the first angle is set as needed and is not limited to this embodiment.

[0068] As shown in Figure 12, in step S3, when the interface unit array 21 is distributed on the process surface 2b of the optical chip 22, each i*j interface unit 2a in the interface unit array receives one unit optical signal, and the i*j interface units 2a are arranged in an array. Each optical waveguide is distributed along the process surface and connected to each interface unit in a one-to-one correspondence. Here, i and j are natural numbers greater than or equal to 1 and less than or equal to 2. When the interface unit array 21 is distributed on the end face of the optical chip 22 perpendicular to the process surface 2b, each p*q interface unit 2a in the interface unit array receives one unit optical signal, and the p*q interface units 2a are arranged in an array. Each optical waveguide is stacked layer by layer and parallel to the process surface. Each optical waveguide is connected to each interface unit in a one-to-one correspondence. Here, p and q are natural numbers greater than or equal to 1.

[0069] Specifically, in this embodiment, when the interface unit array 21 and each optical waveguide 23 are both laid on the process surface 2b of the optical chip 22, as shown in Figure 4, due to the limitation of the bending radius of the optical waveguide 23, the interface unit array 21 cannot be densely arranged. However, since the target optical signal is segmented, one unit optical signal can be received by a group of i*j interface units 2a, so as to ensure that the optical spread received by the interface unit array 21 is greater than or equal to the first optical spread. In practical applications, any method or device for arbitrarily segmenting the target optical signal into unit optical signals and setting a corresponding small interface unit array for each unit optical signal to completely receive the target optical signal is within the protection scope of this invention and is not limited to this embodiment.

[0070] Specifically, in this embodiment, when the optical waveguides 23 are stacked layer by layer and parallel to the process surface, and the interface unit array 21 is distributed on the vertical surface of the process surface 2b, as shown in Figure 8, the optical waveguides 23 avoid bending, allowing the interface unit array 21 to be densely arranged, ensuring that the light spread received by the interface unit array 21 is greater than or equal to the first light spread. In practical applications, any method or apparatus that arbitrarily arranges the interface unit array 21 perpendicular to the optical waveguide 23 to achieve dense arrangement of the interface unit array 21 for complete reception of the target optical signal is within the protection scope of this invention and is not limited to this embodiment.

[0071] In this embodiment, the apparatus based on Embodiments 1 to 3 can be used to implement this embodiment. In practical applications, the apparatus for implementing this embodiment can be selected as needed, and is not limited to this embodiment.

[0072] Example 5

[0073] This embodiment provides a method for collecting optical signals. The difference between this embodiment and embodiment four is that a step S1' is set between step S1 and step S2. In step S1', the target optical signal is collimated before step S2 is performed.

[0074] Specifically, in this embodiment, the target optical signal is collimated to divide it into n*m unit optical signals, and the divided n*m unit optical signals are arranged in an array. In practical applications, optimization steps for the target optical signal can be set according to the actual needs of the target optical signal before division, and are not limited to this embodiment.

[0075] In summary, by calculating the optical spread of the target light and the optical spread received by a single interface unit, this invention calculates the specific values ​​of the interface units required for optical spread matching. By segmenting the optical signal and focusing it into a small array of interface units, or by making the laying surface of the interface unit array perpendicular to the laying surface of the optical waveguide, this invention enables the optical signal receiving module to receive the target optical signal as completely as possible. By collimating the target optical signal, this invention reduces the transmission error caused by segmenting irregular optical signals. Ultimately, this invention achieves low-loss transmission between the target optical signal and the optical signal receiving module. The optical signal collection method and device of this invention have the advantages of high transmission efficiency, good transmission quality, simplicity, convenience, and strong reusability. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0076] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for collecting optical signals, characterized in that, The optical signal collection method includes at least the following steps: S1: The optical signal source generates the target optical signal; S2: The target optical signal is divided into n*m unit optical signals, and each of the n*m ​​unit optical signals is focused, and the n*m ​​unit optical signals are arranged in an array; where n is a natural number greater than or equal to 1, and m is a natural number greater than or equal to 2; S3: When the interface unit array is distributed on the process surface of the optical chip, each i*j interface unit in the interface unit array receives one unit optical signal, and the i*j interface units are arranged in an array. Each optical waveguide is distributed along the process surface and connected to each interface unit in a one-to-one correspondence. Here, i and j are natural numbers greater than or equal to 1 and less than or equal to 2. When the interface unit array is distributed on the end face of the optical chip perpendicular to the process surface, each p*q interface unit in the interface unit array receives one unit optical signal, and the p*q interface units are arranged in an array. Each optical waveguide is stacked layer by layer and parallel to the process surface. Each optical waveguide is connected to each interface unit in a one-to-one correspondence. Here, p and q are natural numbers greater than or equal to 1.

2. The optical signal collection method according to claim 1, characterized in that: A step S1' is provided between step S1 and step S2. In step S1', the target optical signal is collimated before step S2 is performed.

3. The optical signal collection method according to claim 1, characterized in that: Each unit's optical signal enters the corresponding interface unit perpendicularly; or each unit's optical signal enters the corresponding interface unit at a first angle to avoid the Bragg condition of the corresponding interface unit, wherein the range of the first angle is [40°, 90°].

4. A light signal collection device, characterized in that, The optical signal collection device includes at least: an optical focusing structure and an optical signal receiving module; The optical focusing structure includes n*m focusing elements, which divide and focus the target optical signal provided by the optical signal source to obtain n*m unit optical signals. The n*m ​​focusing elements are arranged in an array; where n is a natural number greater than or equal to 1 and m is a natural number greater than or equal to 2. The optical signal receiving module receives n*m unit optical signals. The optical signal receiving module includes X optical chips, an interface unit array disposed on the optical chips, and waveguides disposed on the optical chips. The optical chips are arranged in parallel, and X is a natural number greater than or equal to 1. When the interface unit array is distributed on the process surface of the optical chips, each i*j interface unit in the interface unit array corresponds to a focusing element, and the i*j interface units are arranged in an array. Each optical waveguide is distributed along the process surface and connected to each interface unit in a one-to-one correspondence, where i and j are both natural numbers greater than or equal to 1 and less than or equal to 2. When the interface unit array is distributed on the end face of the optical chips perpendicular to the process surface, each p*q interface unit in the interface unit array corresponds to a focusing element, and the p*q interface units are arranged in an array. Each optical waveguide is stacked layer by layer and parallel to the process surface, and each optical waveguide is connected to each interface unit in a one-to-one correspondence, where p and q are both natural numbers greater than or equal to 1.

5. The optical signal collection device according to claim 4, characterized in that: The optical signal collection device further includes a collimation device; the collimation device is disposed between the optical signal source and the optical focusing structure, and collimates the target optical signal.

6. The optical signal collection device according to claim 5, characterized in that: The collimation device is any one of a lens assembly, a multimode fiber, a reflector, or a compound parabolic concentrator.

7. The optical signal collection device according to claim 4, characterized in that: The optical focusing structure is any one of the following: microlens array, mirror array, end face array, Fresnel lens array, optical metasurface, multilayer interference focusing structure, or grating coupler array.

8. The optical signal collection device according to claim 4, characterized in that: When X is greater than or equal to 2, the optical chips are arranged in a one-dimensional array or a two-dimensional array.

9. The optical signal collection device according to claim 4, characterized in that: The distribution density of each interface unit is proportional to the energy distribution density of the target optical signal cross-section.

10. The optical signal collecting device according to claim 4, characterized in that: The interface unit is a grating coupler or an edge coupling structure.

11. The optical signal collection device according to claim 4, characterized in that: The interface units on the same optical chip are located on different planes.

12. The optical signal collection device according to claim 4, characterized in that: When the interface unit array is distributed on the end face of the optical chip perpendicular to the process surface, the interface units on the same optical chip are located on different planes.

13. The optical signal collecting device according to any one of claims 4 to 12, characterized in that: The optical spread of the target optical signal is a first optical spread, and the optical spread received by the optical signal receiving module is a second optical spread, wherein the second optical spread is greater than or equal to the first optical spread.

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