Conductive film and transparent heater equipped therewith

Abstract

This conductive film (1A) is provided with: a base material (2); a first wiring pattern (11); a first inspection pad (21) that is physically connected to the first wiring pattern (11); and a second inspection pad (22) that is physically connected to the first wiring pattern (11) and is electrically connected to the first inspection pad (21). The first wiring pattern (11) has: a first main wiring (31); a second main wiring (32); and a first redundant wiring (41) that electrically connects the first main wiring (31) and the second main wiring (32).

Description

Conductive Film and Transparent Heater Comprising the Same 【0001】 The present disclosure relates to a conductive film and a transparent heater comprising the same. 【0002】 Conventionally, with regard to conductive films, those disclosed in, for example, Patent Document 1 and Patent Document 2 are known. 【0003】 Patent Document 1 discloses a conductive film including a patterned conductor 40 provided on a base material (base film 21a). The patterned conductor 40 is composed of a metal material such as copper (conductive material 112). The patterned conductor 40 includes a plurality of linear conductors 41 and a plurality of connecting conductors 42. The connecting conductors 42 intersect the linear conductors 41. The line width of each conductor is 2 μm or more and 20 μm or less. In the following description, each of the linear conductor 41 and the connecting conductor 42 in Patent Document 1 is simply referred to as a "metal fine wire". 【0004】 Patent Document 2 discloses a conductive film (transparent conductive film 100). This conductive film includes a base material (transparent film 102) and a conductive portion 104 formed in a mesh shape on the base material. The conductive portion 104 is composed of a metal material such as copper (conductive material 112). The conductive portion 104 includes a plurality of first conductive wires 114W extending in a first direction on the base material and a plurality of second conductive wires 114H extending in a second direction orthogonal to the first direction. The line width of each conductive wire is 200 nm to 3000 nm (0.2 μm to 3 μm). In the following description, each of the first conductive wire 114W and the second conductive wire 114H in Patent Document 2 is simply referred to as a "metal fine wire". 【0005】 International Publication No. 2020 / 175567, Japanese Patent Application Laid-Open No. 2023-25580 【0006】 By the way, in order to ensure the quality of the conductive film, it is desirable to electrically measure local abnormalities in the resistance value of the metal fine wire during the production of the conductive film. As this measurement, for example, a method of directly contacting inspection probes to any two locations on the metal fine wire and measuring the electrical resistance value of the metal fine wire between the two locations can be cited. 【0007】 The conductive films described in Patent Documents 1 and 2 have conductive regions formed in a predetermined pattern using multiple metal nanowires. In both Patent Documents 1 and 2, the metal nanowires are formed in a fine wire shape (with a line width of several micrometers to several tens of micrometers). On the other hand, when measuring the electrical resistance of the metal nanowires disclosed in Patent Documents 1 and 2 using the above measurement method, it is extremely difficult to stably contact the inspection probe with the metal nanowires. As a result, there is a problem in that it is difficult to identify the locations of disconnections, short circuits, wiring defects, etc. in the conductive regions during the manufacturing of the conductive films. 【0008】 Furthermore, in the conductive films of Patent Documents 1 and 2, the entire conductive region is electrically conductive due to a predetermined pattern (see, for example, paragraph 0045 of Patent Document 1 and paragraph 0014 of Patent Document 2). Therefore, if there is a specific region within the conductive region that exhibits an abnormally high electrical resistance, even if the inspection probe can be connected to any metal wire, the current will flow in a way that avoids the specific region with abnormally high electrical resistance. As a result, there is a problem in that it is not possible to identify the location of breaks, short circuits, wiring defects, etc., in a specific region. 【0009】 This disclosure has been made in view of the above, and its purpose is to identify localized locations of disconnections, short circuits, wiring defects, etc., in wiring patterns located in specific regions. 【0010】 To achieve the above objective, this disclosure relates to a conductive film, the conductive film comprising a substrate, a first wiring pattern located on the upper surface of the substrate, a first inspection pad located on the upper surface of the substrate and physically connected to the first wiring pattern, and a second inspection pad located on the upper surface of the substrate, physically connected to the first wiring pattern and electrically connected to the first inspection pad. The first wiring pattern has a first main wiring extending in a first direction, a second main wiring extending in the first direction and located in a second direction perpendicular to the first direction of the first main wiring, and a first redundant wiring electrically connecting the first main wiring and the second main wiring. 【0011】According to this disclosure, it is possible to identify localized locations of occurrences such as disconnections, short circuits, and wiring defects in specific wiring patterns. 【0012】 Figure 1 is a perspective view of the conductive film according to the first embodiment. Figure 2 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the first embodiment. Figure 3 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the first modified example of the first embodiment. Figure 4 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the second modified example of the first embodiment. Figure 5 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the third modified example of the first embodiment. Figure 6 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the fourth modified example of the first embodiment. Figure 7 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the fifth modified example of the first embodiment. Figure 8 is an enlarged view showing the connection state between the first inspection pad and the first wiring pattern in the sixth modified example of the first embodiment. Figure 9 is a perspective view of the conductive film according to the second embodiment. 【0013】 The embodiments of this disclosure will be described in detail below with reference to the drawings. The following descriptions of the embodiments are illustrative in nature and are not intended to limit this disclosure, its applications, or its uses. 【0014】 [First Embodiment] Figure 1 is a perspective view of a conductive film 1A according to the first embodiment. The conductive film 1A can be adapted for use in transparent heaters, electromagnetic shields, dimming films, transparent antennas, touch sensors, and the like. 【0015】 In the following explanation, the direction from the left side of Figure 1 to the right side of the page (direction D1 shown in the figure) is defined as the "first direction." The direction from the top side of Figure 1 to the bottom side of the page (direction D2 shown in the figure) is defined as the "second direction." 【0016】 As shown in Figure 1, the conductive film 1A according to the first embodiment of the present disclosure comprises a substrate 2, a first wiring pattern 11, and a plurality of inspection pads 20. 【0017】 (Substrate) The substrate 2 is made of, for example, a resin material having insulating and permeable properties. As shown in Figure 1, the substrate 2 of this embodiment is formed in a substantially rectangular shape when viewed from above. The substrate 2 has an upper surface 3. 【0018】 (First wiring pattern) The first wiring pattern 11 is located on the upper surface 3 of the substrate 2. The first wiring pattern 11 has a plurality of main wirings 30 extending in the first direction D1 and a plurality of redundant wirings 40. In this embodiment, the first wiring pattern 11 is located on the upper surface 3 of the substrate 2 in the direction opposite to the second direction D2 with respect to the first region R1 described later (upper side of the paper in Figure 1). 【0019】 In the following description, in the first embodiment of this disclosure, the first main wiring 31 and the second main wiring 32 shown in Figure 1 will be described as examples of the multiple main wirings 30 in the first wiring pattern 11. In addition, the first redundant wiring 41 shown in Figure 1 will be described as an example of the multiple redundant wirings 40 in the first wiring pattern 11. 【0020】 (First Main Wiring) As shown in Figure 1, the first main wiring 31 is located on the upper surface 3 of the base material 2. The first main wiring 31 is, for example, composed of a fine metal wire formed on the upper surface 3 of the base material 2. The first main wiring 31 extends linearly along the first direction D1. The line width of the first main wiring 31 is, for example, 1 μm or more and 15 μm or less. 【0021】 (Second Main Wiring) As shown in Figure 1, the second main wiring 32 is located on the upper surface 3 of the base material 2. The second main wiring 32 is composed of, for example, a fine metal wire formed on the upper surface 3 of the base material 2. The second main wiring 32 extends linearly along the first direction D1. The line width of the second main wiring 32 is, for example, 1 μm or more and 15 μm or less. 【0022】 The second main wiring 32 is located in a second direction D2 that is perpendicular to the first direction D1 of the first main wiring 31. In other words, the second main wiring 32 is separated from the first main wiring 31 in the second direction D2. 【0023】In this embodiment (see Figure 1), the second main wiring 32 is shown as being adjacent to the first main wiring 31 among the multiple main wirings 30, but is not limited to this. In other words, the second main wiring 32 does not necessarily have to be adjacent to the first main wiring 31. 【0024】 (First redundant wiring) As shown in Figure 1, the first redundant wiring 41 is located on the upper surface 3 of the substrate 2. The first redundant wiring 41 is, for example, composed of a fine metal wire formed on the upper surface 3 of the substrate 2. The first redundant wiring 41 extends linearly along the second direction D2. The line width of the first redundant wiring 41 is, for example, 1 μm or more and 15 μm or less. 【0025】 The first redundant wiring 41 electrically connects the first main wiring 31 and the second main wiring 32. As a result, even if a break occurs in either the first main wiring 31 or the second main wiring 32, the first redundant wiring 41 maintains the electrical connection between the first main wiring 31 and the second main wiring 32 regardless of the presence of the break. Consequently, the conductivity of the first wiring pattern 11 can be guaranteed. 【0026】 (First and Second Inspection Pads) As shown in Figure 1, the plurality of inspection pads 20 are located on the upper surface 3 of the substrate 2. The plurality of inspection pads 20 include a first inspection pad 21 and a second inspection pad 22. The first inspection pad 21 and the second inspection pad 22 are physically connected to the first wiring pattern 11. The first inspection pad 21 and the second inspection pad 22 are also electrically connected. 【0027】 This configuration makes it possible to detect localized fluctuations in resistance within a specific region of the conductive film 1A, namely the first wiring pattern 11. Therefore, it is possible to identify locations within the first wiring pattern 11 of the conductive film 1A where disconnections or short circuits have occurred in each wiring (including the first main wiring 31, the second main wiring 32, and the first redundant wiring 41), or where wiring defects such as localized variations in wiring width have occurred. 【0028】As shown in Figures 1 and 2, the first inspection pad 21 has a first pad portion 51 separated from the first wiring pattern 11, and a first lead wire portion 61 connecting the first wiring pattern 11 and the first pad portion 51. 【0029】 The first pad portion 51 includes a plurality of linearly formed metal fine wires 55. The first pad portion 51 is formed in a mesh-like manner by the plurality of metal fine wires 55 (see Figure 2). Note that the first pad portion 51 is not limited to a mesh-like arrangement of metal fine wires 55, but may also be formed from a thin metal film (not shown). 【0030】 The first pad portion 51 includes a circularly formed metal wire 56. The outer shape of the first pad portion 51 is formed in a circular shape by the metal wire 56 (see Figure 2). The circular diameter of the first pad portion 51 is, for example, 50 μm or more and 1000 μm or less. 【0031】 The first pad portion 51 is spaced apart from the first main wiring 31 in the second direction D2. The first pad portion 51 is not directly connected to the first main wiring 31. Furthermore, the first pad portion 51 is spaced apart from the second main wiring 32 in the opposite direction to the second direction D2 via the first lead wire portion 61. 【0032】 The first lead wire section 61 illustrated in Figures 1 and 2 is formed from a single thin metal wire. The first lead wire section 61 is connected to the first pad section 51. The first lead wire section 61 is also connected to the second main wiring 32. 【0033】 The second inspection pad 22 has a second pad portion 52 spaced apart from the first wiring pattern 11, and a second lead wire portion 62 connecting the second wiring pattern 12 and the second pad portion 52. 【0034】 The second pad portion 52 is formed in a mesh-like manner by a plurality of fine metal wires (with the same configuration as the fine metal wires 55 shown in Figure 2). Note that the second pad portion 52 is not limited to a mesh-like structure of fine metal wires, but may also be formed from a thin metal film (not shown). 【0035】 The outer shape of the second pad portion 52 is formed in a circular shape, similar to the outer shape of the first pad portion 51. 【0036】The second pad portion 52 is spaced apart from the first main wiring 31 in the second direction D2. The second pad portion 52 is not directly connected to the first main wiring 31. Furthermore, the second pad portion 52 is spaced apart from the second main wiring 32 in the opposite direction to the second direction D2 via the second lead wire portion 62. 【0037】 The second lead wire section 62 is formed from a single thin metal wire. The second lead wire section 62 is connected to the second pad section 52. The second lead wire section 62 is also connected to the second main wiring 32. 【0038】 By the way, in the embodiments of this disclosure, when measuring the electrical resistance value of the first wiring pattern 11, the electrical resistance value is measured by applying an inspection probe (not shown) to each pad portion 50 (each of the first pad portion 51 and the second pad portion 52). With this measurement, each pad portion 50 is separated from each main wiring 30 of the first wiring pattern 11 (each of the first main wiring 31 and the second main wiring 32), so that the inspection probe does not directly contact each main wiring 30. As a result, damage to the first wiring pattern 11 during the measurement of electrical resistance value (specifically, physical damage caused by the probe coming into contact with each main wiring 30 of the first wiring pattern 11) can be prevented. 【0039】 Furthermore, as shown in Figure 2, the first pad 51 has an area that is sufficiently large relative to the line widths of the first main wiring 31 and the second main wiring 32. That is, the first pad 51 has an area that allows the tip of a typical inspection probe to make sufficient contact. The second pad 52 is configured in the same way as the first pad 51. Therefore, when measuring the electrical resistance of the first wiring pattern 11, it is possible to make stable contact between the inspection probe and the first pad 51 and the second pad 52. As a result, during the manufacturing of the conductive film 1A, it is possible to identify localized locations of disconnections, short circuits, wiring defects, etc., in the first wiring pattern 11. 【0040】And, as described above, the first inspection pad 21 illustrated in FIG. 2 includes a first pad portion 51 separated from the first wiring pattern 11 and a first lead wire portion 61 connecting the first wiring pattern 11 and the first pad portion 51. That is, the first pad portion 51 is separated from any of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41 that constitute the first wiring pattern 11. Therefore, at the time of measuring the electrical resistance value, the inspection probe can be stably brought into contact with the first pad portion 51 without contacting any of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41. The second pad 52 of the second inspection pad 22 can also have the same operational effects as the first pad portion 51. 【0041】 The first inspection pad 21 is physically connected to only one of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41. 【0042】 The second inspection pad 22 is physically connected to only one of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41. 【0043】 That is, the inspection pad 20 is located inside the first wiring pattern 11 and is connected to only one of the plurality of main wirings 30. Or, the inspection pad 20 is located inside the first wiring pattern 11 and is connected to only one of the plurality of redundant wirings 40. 【0044】 In other words, the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) do not electrically connect the first main wiring 31 and the second main wiring 32 (main wirings 30, 30), the first main wiring 31 or the second main wiring 32 and the first redundant wiring 41 (main wiring 30 and redundant wiring 40), the first redundant wiring 41 and the first redundant wiring 41 (redundant wirings 40, 40). Thereby, it is possible to prevent changes in the current path and short circuits caused by the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) in the first wiring pattern 11. 【0045】 Also, it is desirable that the plurality of inspection pads 20 located in the first wiring pattern 11 be arranged along the lines of electric force in the first wiring pattern 11. 【0046】Note that the inspection pads 20 may electrically connect the main wirings 30 to each other, the main wiring 30 to the redundant wiring 40, and the redundant wirings 40 to each other. 【0047】 (Second Wiring Pattern) As shown in FIG. 1, the conductive film 1A further includes a second wiring pattern 12. The second wiring pattern 12 is located on the upper surface 3 of the base material 2. Note that the second wiring pattern 12 of this embodiment is located in the second direction D2 (the lower side of the paper surface of FIG. 1) with respect to the first region R1 on the upper surface 3 of the base material 2. 【0048】 The second wiring pattern 12 has a plurality of main wirings 30 extending in the first direction D1 and a plurality of redundant wirings 40. In the first embodiment of the present disclosure, the plurality of main wirings 30 in the second wiring pattern 12 will be described by taking the third main wiring 33 and the fourth main wiring 34 shown in FIG. 1 as examples. Also, the plurality of redundant wirings 40 in the second wiring pattern 12 will be described by taking the second redundant wiring 42 shown in FIG. 1 as an example. 【0049】 (Third Main Wiring) As shown in FIG. 1, the third main wiring 33 is located on the upper surface 3 of the base material 2. The third main wiring 33 is configured, for example, as a metal fine wire formed on the upper surface 3 of the base material 2. The third main wiring 33 extends linearly along the first direction D1. The line width of the third main wiring 33 is, for example, 1 μm or more and 15 μm or less. 【0050】 (Fourth Main Wiring) As shown in FIG. 1, the fourth main wiring 34 is located on the upper surface 3 of the base material 2. The fourth main wiring 34 is configured, for example, as a metal fine wire formed on the upper surface 3 of the base material 2. The fourth main wiring 34 extends linearly along the first direction D1. The line width of the fourth main wiring 34 is, for example, 1 μm or more and 15 μm or less. 【0051】 The fourth main wiring 44 is located in the second direction D2 orthogonal to the first direction D1 of the third main wiring 33. That is, the fourth main wiring 34 is separated from the third main wiring 33 in the second direction D2. 【0052】In this embodiment (see Figure 1), the fourth main wiring 34 is adjacent to the third main wiring 33 among the multiple main wirings 30, but is not limited to this. In other words, the fourth main wiring 34 does not necessarily have to be adjacent to the third main wiring 33. 【0053】 (Second redundant wiring) As shown in Figure 1, the second redundant wiring 42 is located on the upper surface 3 of the substrate 2. The second redundant wiring 42 is composed of, for example, a fine metal wire formed on the upper surface 3 of the substrate 2. The second redundant wiring 42 extends linearly along the second direction D2. The line width of the second redundant wiring 42 is, for example, 1 μm or more and 15 μm or less. 【0054】 The second redundant wiring 42 electrically connects the third main wiring 33 and the fourth main wiring 34. As a result, even if a break occurs in either the third main wiring 33 or the fourth main wiring 34, the second redundant wiring 42 maintains the electrical connection between the third main wiring 33 and the fourth main wiring 34 regardless of the presence of the break. Consequently, the conductivity of the second wiring pattern 12 can be guaranteed. 【0055】 (Third and Fourth Inspection Pads) The plurality of inspection pads 20 include a third inspection pad 23 and a fourth inspection pad 24. The third inspection pad 23 and the fourth inspection pad 24 are physically connected to the second wiring pattern 12. The third inspection pad 12 and the fourth inspection pad 24 are electrically connected. 【0056】 This configuration makes it possible to detect localized fluctuations in resistance within a specific region of the conductive film 1A, namely the second wiring pattern 12. Therefore, it is possible to identify locations within the second wiring pattern 12 of the conductive film 1A where wiring defects have occurred, such as disconnections or short circuits in each wiring (including the third main wiring 33, the fourth main wiring 34, and the second redundant wiring 42), or where localized variations in wiring width occur. 【0057】 The third inspection pad 23 has a third pad portion 53 and a third lead wire portion 63. 【0058】The third pad portion 53 is formed in a mesh-like manner by a plurality of metal nanowires (with the same configuration as the metal nanowires 55 shown in Figure 2). Note that the third pad portion 53 is not limited to a mesh-like arrangement of metal nanowires, but may also be formed from a thin metal film (not shown). 【0059】 The outer shape of the third pad portion 53 is formed in the same way as the outer shape of the first pad portion 51, for example, in a circular shape. 【0060】 The third pad portion 53 is spaced apart from the third main wiring 33 in the second direction D2. The third pad portion 53 is not directly connected to the third main wiring 33. Furthermore, the third pad portion 53 is spaced apart from the fourth main wiring 34 in the opposite direction to the second direction D2 via the third lead wire portion 63. 【0061】 The third lead wire section 63 is formed from a single thin metal wire. The third lead wire section 63 is connected to the third pad section 53. The third lead wire section 63 is also connected to the fourth main wiring 34. 【0062】 The fourth inspection pad 24 has a fourth pad portion 54 and a fourth lead wire portion 64. 【0063】 The fourth pad portion 54 is formed in a mesh-like manner by a plurality of metal nanowires (with the same configuration as the metal nanowires 55 shown in Figure 2). Note that the fourth pad portion 54 is not limited to a mesh-like arrangement of metal nanowires, but may also be formed from a thin metal film (not shown). 【0064】 The outer shape of the fourth pad portion 54 is formed in the same way as the outer shape of the first pad portion 51, for example, in a circular shape. 【0065】 The fourth pad portion 54 is spaced apart from the third main wiring 33 in the second direction D2. The fourth pad portion 54 is not directly connected to the third main wiring 33. Furthermore, the fourth pad portion 54 is spaced apart from the fourth main wiring 34 in the opposite direction to the second direction D2 via the fourth lead wire portion 64. 【0066】 The fourth lead wire section 64 is formed from a single thin metal wire. The fourth lead wire section 64 is connected to the fourth pad section 54. The fourth lead wire section 64 is also connected to the fourth main wiring 34. 【0067】In the embodiments of this disclosure, when measuring the electrical resistance value of the second wiring pattern 12, the electrical resistance value is measured by applying an inspection probe (not shown) to each pad portion 50 (each of the third pad portion 53 and the fourth pad portion 54). With this measurement, each pad portion 50 is separated from each main wiring 30 of the second wiring pattern 12 (each of the third main wiring 33 and the fourth main wiring 34), so that the inspection probe does not directly contact each main wiring 30. As a result, damage to the second wiring pattern 12 during the measurement of electrical resistance value (specifically, physical damage caused by the probe coming into contact with each main wiring 30 of the second wiring pattern 12) can be prevented. 【0068】 Furthermore, the third pad 53 has a sufficiently large area relative to the line widths of the third main wiring 33 and the fourth main wiring 34. That is, the third pad 53 has an area that allows the tip of a typical inspection probe to make sufficient contact. The fourth pad 54 is configured in the same way as the third pad 53. Therefore, when measuring the electrical resistance of the second wiring pattern 12, it is possible to make stable contact between the inspection probe and the third pad 53 and the fourth main wiring 34. As a result, it is possible to identify the locations where disconnections, short circuits, wiring defects, etc. occur in the second wiring pattern 12 during the manufacturing of the conductive film 1A. 【0069】 The third test pad 23 is physically connected to only one of the following: the third main wiring 33, the fourth main wiring 34, and the second redundant wiring 42. 【0070】 The fourth test pad 24 is physically connected to only one of the following: the third main wiring 33, the fourth main wiring 34, and the second redundant wiring 42. 【0071】 In other words, the test pad 20 is located inside the second wiring pattern 12 and is connected to only one of the multiple main wirings 30. Alternatively, the test pad 20 is located inside the second wiring pattern 12 and is connected to only one of the multiple redundant wirings 40. 【0072】In other words, the third test pad 23 and the fourth test pad 24 (test pads 20, 20) prevent the third main wiring 33 and the fourth main wiring 34 (main wirings 30, 30 together), the third main wiring 33 or the fourth main wiring 34 and the second redundant wiring 42 (main wiring 30 and redundant wiring 40), and the second redundant wiring 42 and the second redundant wiring 42 (redundant wirings 40, 40 together). This prevents changes in the current path or short circuits caused by the third test pad 23 and the fourth test pad 24 (test pads 20, 20) within the second wiring pattern 12. 【0073】 Furthermore, it is desirable that the multiple inspection pads 20 located within the second wiring pattern 12 be arranged along the electric field lines within the second wiring pattern 12. 【0074】 In the conductive film 1A according to the first embodiment, by providing a third inspection pad 23 and a fourth inspection pad 24, the resistance value between the first inspection pad 21 and the second inspection pad 22 can be compared with the resistance value between the third inspection pad 23 and the fourth inspection pad 24. 【0075】 The length between the third inspection pad 23 and the fourth inspection pad 24 (dimension L2 shown in Figure 1) is the same as the length between the first inspection pad 21 and the second inspection pad 22 (dimension L1 shown in Figure 1). Note that if the difference between dimension L1 and dimension L2 is within an error of approximately ±10%, then dimension L1 and dimension L2 are considered to be substantially the same length. 【0076】 By making dimensions L1 and L2 the same length, the resistance value between the third inspection pad 23 and the fourth inspection pad 24 in the absence of defects can be made approximately the same as the resistance value between the first inspection pad 21 and the second inspection pad 22. 【0077】 (First Region) A first region R1 is located on the upper surface 3 of the substrate 2. The first region R1 is located between the second main wiring 32 and the third main wiring 33. 【0078】Preferably, in the first region R1, the second wiring pattern 12 is not electrically connected to the first wiring pattern 11. For example, a slit (not shown) is provided between the first wiring pattern 11 and the second wiring pattern 12. This prevents the first wiring pattern 11 and the second wiring pattern 12 from being electrically connected to each other. Although not shown, in a part of the first region R1 (for example, near the first busbar 8 or near the second busbar 9), the first wiring pattern 11 and the second wiring pattern 12 may be electrically connected. 【0079】 As a result, the area where the first inspection pad 21 and the second inspection pad 22 are located and the area where the third inspection pad 23 and the fourth inspection pad 24 are located are independent of each other via the first area. Therefore, it is possible to accurately estimate the location of wiring defects in each of the areas where the first inspection pad 21 and the second inspection pad 22 are located and the area where the third inspection pad 23 and the fourth inspection pad 24 are located. 【0080】 (Relationship between the width of the first wiring pattern and the width of the second wiring pattern) The width of the first wiring pattern 11 in the second direction D1 (dimension L7 shown in Figure 1) is the same as the width of the second wiring pattern 12 in the second direction D2 (dimension L8 shown in Figure 1). By making the width of the first wiring pattern 11 and the width of the second wiring pattern 12 the same in this way, the electrical resistance values ​​of the first wiring pattern 11 and the electrical resistance values ​​of the second wiring pattern 12 can be made to be approximately the same. As a result, the error during inspection is reduced. Note that if the difference between dimension L7 and dimension L8 is an error of about ±10%, then dimension L7 and dimension L8 are considered to be substantially the same length. 【0081】 (First busbar and second busbar) As shown in Figure 1, the conductive film 1A further comprises a first busbar 8 connected to the first end 31a of the first main wiring 31, and a second busbar 9 connected to a second end 31b different from the first end 31a of the first main wiring 31. 【0082】The length between the third inspection pad 23 and the first busbar 8 (dimension L4 shown in Figure 1) is the same as the length between the first inspection pad 21 and the first busbar 8 (dimension L3 shown in Figure 1). That is, with respect to the position of the first busbar 8, the first inspection pad 21 and the third inspection pad 23 are in the same position in the first direction D1. Note that if the difference between dimension L3 and dimension L4 is within an error of approximately ±10%, then dimension L3 and dimension L4 are considered to be substantially the same length. 【0083】 Furthermore, the length between the fourth inspection pad 24 and the first busbar 8 (dimension L6 shown in Figure 1) is the same as the length between the second inspection pad 22 and the first busbar 8 (dimension L5 shown in Figure 1). That is, with respect to the position of the first busbar 8, the second inspection pad 22 and the fourth inspection pad 24 are in the same position in the first direction D1. Note that if the difference between dimension L5 and dimension L6 is within an error of approximately ±10%, then dimension L5 and dimension L6 are considered to be substantially the same length. 【0084】 As a result, the resistance values ​​between the inspection pads 20 in the first direction D1 (the resistance value between the first inspection pad 21 and the second inspection pad 22, or the resistance value between the third inspection pad 23 and the fourth inspection pad 24) become approximately the same. Therefore, the error during inspection is reduced. 【0085】 [First Modified Example of the First Embodiment] In the first embodiment described above, the first leader portion 61 is shown to be formed from a single metal wire, but the embodiment is not limited to this. For example, as shown in the first modified example in Figure 3, the first leader portion 61 may be formed from multiple metal wires. Also, although not shown, the second leader portion 62, the third leader portion 63, and the fourth leader portion 64 may also be formed from multiple metal wires, similar to the first leader portion 61. 【0086】 Figure 3 is an enlarged view showing the connection state between the first inspection pad 21 and the first wiring pattern 11 in a first modified example of the first embodiment. In Figure 3, components similar to those described in the first embodiment are denoted by the same reference numerals as those shown in Figure 2. 【0087】In this modified example, the first lead wire section 61 includes a plurality of wires 61a and 61b. Wire 61a connects the first redundant wire 41 to the first pad section 51. Wire 61b connects the second main wire 32 to the first pad 51. 【0088】 Thus, in this first modified example, since the first lead wire section 61 includes multiple wires 61a and 61b, the connection state between the first inspection pad 21 and the first wiring pattern 11 can be stabilized. 【0089】 [Second Modification of the First Embodiment] In the first embodiment described above, the first inspection pad 21 is shown to have a first lead wire portion 61, but the embodiment is not limited to this. For example, the first inspection pad 21 does not have to have a first lead wire portion 61. 【0090】 Figure 4 is an enlarged view showing the connection state between the first inspection pad 21 and the first wiring pattern 11 in a second modified example of the first embodiment. In Figure 4, components similar to those described in the first embodiment are denoted by the same reference numerals as those shown in Figure 2. 【0091】 As shown in Figure 4, in this modified example, the first pad portion 51 overlaps with the first wiring pattern 11 in a top view. In other words, the first inspection pad 21 has a first pad portion 51 that overlaps with the first wiring pattern 11 in a top view. 【0092】 Although not shown in the illustration, the second inspection pad portion 22 also has a second pad portion 52 that overlaps with the first wiring pattern 11 in a top view, similar to the first inspection pad 21 in the second modified example. 【0093】 With this modified configuration, it becomes unnecessary to place the inspection pad 20 between the main wirings 30, 30. Therefore, the main wirings 30, 30 can be placed close together. By placing the main wirings 30, 30 close together, many wirings can be placed within the conductive film 1A. 【0094】[Third Modification of the First Embodiment] In the first embodiment described above, the first lead wire section 61 is shown to be connected to the second main wiring 32, but the embodiment is not limited to this. For example, as shown in the third modification in Figure 5, the first lead wire section 61 is not connected only to the second main wiring 32. In Figure 5, the same reference numerals as those used in Figure 2 are used for components similar to those described in the first embodiment. 【0095】 As shown in Figure 5, in this modified example, the first lead wire section 61 is connected to the intersection of the second main wiring 32 and the first redundant wiring 41. 【0096】 In this modified example, even if a break occurs in either the second main wiring 32 or the first redundant wiring 41, the continuity between the first wiring pattern 11 and the first pad 51 is ensured by the wiring that does not have a break. As a result, the electrical resistance value of the first wiring pattern 11 can be appropriately measured using a test probe. 【0097】 Although not shown in the diagram, the second lead wire section 62 may also be connected to the intersection of the fourth main wiring 34 and the second redundant wiring 4. The third lead wire section 63 and the fourth lead wire section 6 can also be configured in the same way as in the modified example 3. 【0098】 [Fourth Modification of the First Embodiment] In the first embodiment described above, the first pad portion 51 is shown to include a circularly shaped metal wire 56, but the embodiment is not limited to this. For example, as shown in the fourth modification in Figure 6, the circularly shaped metal wire 56 may be replaced with a rectangularly shaped metal wire 57. That is, in the fourth modification, the outer shape of the first pad portion 51 is formed in a rectangular shape. With this configuration, it is possible to make the inspection probe contact the first pad portion 51 of the fourth modification more stably. Although not shown, the second to fourth pad portions 52 to 54 may also be configured in the same way as in the fourth modification. 【0099】[Fifth Modification of the First Embodiment] In the first embodiment described above, the first pad portion 51 is shown to include a circularly formed metal wire 56, but the embodiment is not limited to this. For example, as shown in the fifth modification in Figure 7, the circularly formed metal wire 56 may be omitted in the first pad portion 51. In this modification, by omitting the metal wire 56, the visible outline of the first pad portion 51 can be suppressed. Although not shown, the second to fourth pad portions 52 to 54 may also be configured in the same manner as in the fifth modification. 【0100】 [Sixth Modification of the First Embodiment] As a further modification of the fifth modification described above, as shown in the sixth modification in Figure 8, the metal wire 56 may be omitted and the number of metal wires 55 may be reduced to the minimum necessary amount (three in the illustrated example). In this configuration, the electrical resistance value can be measured by bringing the inspection probe into contact with the intersection of the metal wires 55. In addition, in the sixth modification, by reducing the number of metal wires 55 to the minimum necessary amount, the visibility of the first pad portion 51 is suppressed. Although not shown, the second to fourth pad portions 52 to 54 may also be configured in the same manner as in the sixth modification. 【0101】 [Second Embodiment] Figure 9 is a perspective view of the conductive film 1B according to the second embodiment. The conductive film 1B, like the conductive film 1A according to the first embodiment, can be applied to transparent heaters, electromagnetic shields, dimming films, transparent antennas, touch sensors, and the like. 【0102】 In the following description of the second embodiment, the same reference numerals as those used in the first embodiment will be used for components similar to the conductive film 1A according to the first embodiment, and a detailed explanation of such components will be omitted. 【0103】 As shown in Figure 9, the conductive film 1B comprises a base material 2, a mesh wiring pattern 70, and a plurality of inspection pads 20. 【0104】(Mesh wiring pattern) The mesh wiring pattern 70 is located on the upper surface 3 of the base material 2. The mesh wiring pattern 70 has a plurality of fine metal wires 80. The plurality of fine metal wires 80 are formed on the upper surface 3 of the base material 2. 【0105】 The mesh wiring pattern 70 is formed in a mesh-like manner by a plurality of metal nanowires 80. The metal nanowires 80 extend linearly along the first direction D1 or the second direction D2. However, the metal nanowires 80 do not have to be formed linearly. Although not shown in the figures, the metal nanowires 80 may be formed in a regular or irregular wavy pattern, for example. 【0106】 The mesh wiring pattern 70 has a first cell 91, a second cell 92, a third cell 93, and a fourth cell 94. 【0107】 The first cell 91 is formed in a rectangular shape using multiple thin metal wires 80. The second cell 92 is also formed in a rectangular shape using multiple thin metal wires 80. Note that the first cell 91 and the second cell 92 do not have to be formed in a rectangular shape, and may have shapes other than rectangular. 【0108】 The third cell 93 is formed in a rectangular shape by a plurality of thin metal wires 80. The fourth cell 94 is also formed in a rectangular shape by a plurality of thin metal wires 80. Note that the third cell 93 and the fourth cell 94 do not have to be formed in a rectangular shape, and may have shapes other than rectangular. (Electrified area) In this embodiment, the area where the mesh wiring pattern 70 is located in a top view is defined as the energized area Rc. The energized area Rc has a second area R2 and a third area R3. Note that in this embodiment, there are no thin metal wires 80 located between the second area R2 and the third area R3. 【0109】 The second region R2 is the region within the energized region Rc that is electrically connected as a whole. The second region R2 extends in the first direction D1. The first cell 91 and the second cell 92 are located in the second region R2. 【0110】The third region R3 is the region within the energized region Rc that is electrically connected as a whole. The third region R3 extends in the first direction D1. The third region R3 is not electrically connected to the second region R2. The third region R3 is separated from the second region R2 in the opposite direction to the second direction D2. The third cell 93 and the fourth cell 94 are located in the third region R3. 【0111】 The width of the second direction D2 in the second region R2, perpendicular to the first direction D1 (dimension L15 shown in Figure 9), is the same as the width of the second direction D2 in the third region R3 (dimension L16 shown in Figure 9). By making the widths of the second region R2 and the third region R3 the same in this way, the electrical resistance values ​​of the second region R2 and the third region R3 can be made to be approximately the same. As a result, the error during inspection is reduced. Note that if the difference between dimension L15 and dimension L16 is within an error of approximately ±10%, then dimension L15 and dimension L16 are considered to be substantially the same length. 【0112】 (Inspection Pads) Multiple inspection pads 20 are located on the upper surface 3 of the base material 2. It is desirable that the multiple inspection pads 20 within the mesh wiring pattern 70 be arranged along the electric field lines within the mesh wiring pattern 70. 【0113】 The multiple inspection pads 20 include a first inspection pad 21, a second inspection pad 22, a third inspection pad 23, and a fourth inspection pad 24, similar to the first embodiment described above. 【0114】 (First and Second Inspection Pads) The first inspection pad 21 is physically connected to the mesh wiring pattern 70. The second inspection pad 22 is physically connected to the mesh wiring pattern 70. In addition, the first inspection pad 21 and the second inspection pad 22 are electrically connected to each other. 【0115】The first inspection pad 21 and the second inspection pad 22 are located in the second region R2. This configuration makes it possible to detect localized fluctuations in resistance within the second region R2, which is a specific region within the energized region Rc. Therefore, it is possible to identify locations within the second region R2 in the energized region Rc where open circuits or short circuits have occurred in the mesh wiring pattern 70, or where wiring defects such as localized variations in wiring width have occurred. 【0116】 The first inspection pad 21 has a first pad portion 51 and a first lead wire portion 61. The first pad portion 51 is located inside the first cell 91. The first lead wire portion 61 connects the first cell 91 and the first pad portion 51. In this configuration, the first pad portion 51 is separated from the mesh wiring pattern 70 that constitutes the first cell 91 (see Figure 9). Therefore, when measuring electrical resistance, the inspection probe can be stably brought into contact with the first pad portion 51 without coming into contact with the mesh wiring pattern 70. 【0117】 The second inspection pad 22 has a second pad portion 52 and a second lead wire portion 62. The second pad portion 52 is located inside the second cell 92. The second lead wire portion 62 connects the second cell 92 and the second pad portion 52. In this configuration, the second pad portion 52 is separated from the mesh wiring pattern 70 that constitutes the second cell 92 (see Figure 9). Therefore, when measuring electrical resistance, the inspection probe can be stably made to contact the second pad portion 52 without contacting the mesh wiring pattern 70. 【0118】 Furthermore, the first inspection pad 21 is physically connected to only one side of the first cell 91 when viewed from above. Specifically, the first lead wire portion 61 of the first inspection pad 21 is physically connected to the metal wire 80 that constitutes one side of the first cell 91. 【0119】 The second inspection pad 22 is physically connected to only one side of the second cell 92 when viewed from above. Specifically, the second lead wire portion 62 of the second inspection pad 22 is physically connected to the metal thin wire 80 that constitutes one side of the second cell 92. 【0120】In other words, the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) prevent the edges within the cells from being electrically connected (i.e., the metal wire 80 that constitutes one edge of the first cell 91 and the metal wire 80 that constitutes one edge of the second cell 92). This prevents changes in the current path or short circuits caused by the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) within the second region R2 of the mesh wiring pattern 70. 【0121】 (Third and Fourth Inspection Pads) The third inspection pad 23 is physically connected to the mesh wiring pattern 70. The fourth inspection pad 24 is physically connected to the mesh wiring pattern 70. The fourth pad 54 of the fourth inspection pad 24 is located within the fourth cell 94. The third inspection pad 23 and the fourth inspection pad 24 are also electrically connected to each other. 【0122】 The third inspection pad 23 and the fourth inspection pad 24 are located in the third region R3. This configuration makes it possible to detect localized fluctuations in resistance within the third region R3, which is a specific region in the energized region Rc. Therefore, it is possible to identify locations within the third region R3 in the energized region Rc where open circuits or short circuits have occurred in the mesh wiring pattern 70, or where wiring defects such as localized variations in wiring width have occurred. 【0123】 The third inspection pad 23 has a third pad portion 53 and a third lead wire portion 63. The third pad portion 53 is located inside the third cell 93. The third lead wire portion 63 connects the third cell 93 and the third pad portion 53. In this configuration, the third pad portion 53 is separated from the mesh wiring pattern 70 that constitutes the third cell 93 (see Figure 9). Therefore, when measuring electrical resistance, the inspection probe can be stably brought into contact with the third pad portion 53 without coming into contact with the mesh wiring pattern 70. 【0124】The fourth inspection pad 24 has a fourth pad portion 54 and a fourth lead wire portion 64. The fourth pad portion 54 is located inside the fourth cell 94. The fourth lead wire portion 64 connects the fourth cell 94 and the fourth pad portion 54. In this configuration, the fourth pad portion 54 is separated from the mesh wiring pattern 70 that constitutes the fourth cell 94 (see Figure 9). Therefore, when measuring electrical resistance, the inspection probe can be stably brought into contact with the fourth pad portion 54 without coming into contact with the mesh wiring pattern 70. 【0125】 Furthermore, the third inspection pad 23 is physically connected to only one side of the third cell 93 when viewed from above. Specifically, the third lead wire portion 63 of the third inspection pad 23 is physically connected to the metal thin wire 80 that constitutes one side of the third cell 93. 【0126】 The fourth inspection pad 24 is physically connected to only one side of the fourth cell 94 when viewed from above. Specifically, the fourth lead wire portion 64 of the fourth inspection pad 24 is physically connected to the metal thin wire 80 that constitutes one side of the fourth cell 94. 【0127】 In other words, the third inspection pad 23 and the fourth inspection pad 24 (inspection pads 20, 20) prevent the edges within the cells from being electrically connected (i.e., the metal wire 80 that constitutes one edge of the third cell 93 and the metal wire 80 that constitutes one edge of the fourth cell 94). This prevents changes in the current path and short circuits caused by the third inspection pad 23 and the fourth inspection pad 24 within the third region R3 of the mesh wiring pattern 70. 【0128】 In the conductive film 1B according to the second embodiment, the length between the third inspection pad 23 and the fourth inspection pad 24 (dimension L10 shown in Figure 9) is the same as the length between the first inspection pad 21 and the second inspection pad 22 (dimension L9 shown in Figure 9). This makes it possible to make the resistance value between the third inspection pad 23 and the fourth inspection pad 24 approximately the same as the resistance value between the first inspection pad 21 and the second inspection pad 22 when there are no defects. Note that if the difference between dimension L9 and dimension L10 is an error of about ±10%, then dimensions L9 and L10 are considered to be substantially the same length. 【0129】 (First busbar and second busbar) As shown in Figure 9, the conductive film 1B includes a first busbar 8 connected to the first end 80a of the metal wire 80 of the mesh wiring pattern 70, and a second busbar 9 connected to the second end 80b of the metal wire 80, which is different from the first end 80a. 【0130】 In the second embodiment, as in the first embodiment, the length between the third inspection pad 23 and the first busbar 8 (dimension L12 shown in Figure 9) is the same as the length between the first inspection pad 21 and the first busbar 8 (dimension L11 shown in Figure 9). That is, with respect to the position of the first busbar 8, the first inspection pad 21 and the third inspection pad 23 are in the same position in the first direction D1. Note that if the difference between dimension L11 and dimension L12 is an error of about ±10%, then dimension L11 and dimension L12 are considered to be substantially the same length. 【0131】 Furthermore, the length between the fourth inspection pad 24 and the first busbar 8 (dimension L14 shown in Figure 9) is the same as the length between the second inspection pad 22 and the first busbar 8 (dimension L13 shown in Figure 9). That is, with respect to the position of the first busbar 8, the second inspection pad 22 and the fourth inspection pad 24 are in the same position in the first direction D1. Note that if the difference between dimension L13 and dimension L14 is within an error of approximately ±10%, then dimension L13 and dimension L14 are considered to be substantially the same length. 【0132】 As a result, the resistance values ​​between the inspection pads 20 in the first direction D1 (the resistance value between the first inspection pad 21 and the second inspection pad 22, or the resistance value between the third inspection pad 23 and the fourth inspection pad 24) become approximately the same. Therefore, the error during inspection is reduced. 【0133】 [Modifications of the Second Embodiment] In the second embodiment, the inspection pads 20 (each of the first to fourth inspection pads 21 to 24) can be configured in the same way as the configurations shown in the first to sixth modifications of the first embodiment (see Figures 3 to 8). Detailed explanations of each modification of the second embodiment are omitted. 【0134】[Summary] In the first disclosure, the conductive film 1A comprises a substrate 2, a first wiring pattern 11 located on the upper surface 3 of the substrate 2, a first inspection pad 21 located on the upper surface 3 of the substrate 2 and physically connected to the first wiring pattern 11, and a second inspection pad 22 located on the upper surface 3 of the substrate 2, physically connected to the first wiring pattern 11 and electrically connected to the first inspection pad 21. The first wiring pattern 11 has a first main wiring 31 extending in a first direction D1, a second main wiring 32 extending in the first direction D1 and located in a second direction D2 perpendicular to the first direction D1 of the first main wiring 31, and a first redundant wiring 41 electrically connecting the first main wiring 31 and the second main wiring 32. 【0135】 In the first disclosure, localized fluctuations in resistance can be detected within a specific region of the conductive film 1A, namely the first wiring pattern 11. Therefore, within the first wiring pattern 11 of the conductive film 1A, it is possible to identify locations where disconnections or short circuits have occurred in each wiring (including the first main wiring 31, the second main wiring 32, and the first redundant wiring 41), or locations where wiring defects such as localized variations in wiring width have occurred. 【0136】 As a second disclosure, the first test pad 21 is physically connected to only one of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41. The second test pad 22 is physically connected to only one of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41. 【0137】 In the second disclosure, the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) prevent the first main wiring 31 from being electrically connected to the second main wiring 32 (main wirings 30, 30 to each other), the first main wiring 31 or the second main wiring 32 from being electrically connected to the first redundant wiring 41 (main wiring 30 and redundant wiring 40), and the first redundant wiring 41 from being electrically connected to the first redundant wiring 41 (redundant wirings 40, 40 to each other). This prevents changes in the current path or short circuits caused by the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) within the first wiring pattern 11. 【0138】As a third disclosure, the first inspection pad 21 further includes a first pad portion 51 separated from the first wiring pattern 11 and a first lead wire portion 61 connecting the first wiring pattern 11 and the first pad portion 51. 【0139】 In the third disclosure, the first pad portion 51 is separated from all of the first main wiring 31, the second main wiring 32, and the first redundant wiring 41 that constitute the first wiring pattern 11 (see Figure 2). Therefore, when measuring the electrical resistance value, the test probe can be stably made to contact the first pad portion 51 without coming into contact with any of the first main wiring 31, the second main wiring 32, or the first redundant wiring 41. 【0140】 As a fourth disclosure, the first inspection pad 21 has a first pad portion 51 that overlaps with the first wiring pattern 11 in a top view. 【0141】 In the fourth disclosure, it becomes unnecessary to place the first inspection pad 21 between the first main wiring 31 and the second main wiring 32 (between the main wirings 30, 30). Therefore, the first main wiring 31 and the second main wiring 32 can be placed close together. By placing the first main wiring 31 and the second main wiring 32 close together, many wirings can be placed within the conductive film 1A. 【0142】 As a fifth disclosure, the conductive film 1A further comprises a second wiring pattern 12 located on the upper surface 3 of the substrate 2, a third inspection pad 23 located on the upper surface 3 of the substrate 2 and physically connected to the second wiring pattern 12, and a fourth inspection pad 24 located on the upper surface 3 of the substrate 2, physically connected to the second wiring pattern 12 and electrically connected to the third inspection pad 23. The second wiring pattern 12 has a third main wiring 33 extending in a first direction D1, a fourth main wiring 34 extending in the first direction D1 and located in a second direction D2 of the third main wiring 33, and a second redundant wiring 42 electrically connecting the third main wiring 33 and the fourth main wiring 34. 【0143】The fifth disclosure makes it possible to detect localized fluctuations in resistance within a specific region of the conductive film 1A, namely the second wiring pattern 12. Therefore, it is possible to identify locations within the second wiring pattern 12 of the conductive film 1A where disconnections or short circuits have occurred in each wiring (including the third main wiring 33, the fourth main wiring 34, and the second redundant wiring 42), or where wiring defects such as localized variations in wiring width have occurred. 【0144】 As a sixth disclosure, the third test pad 23 is physically connected to only one of the third main wiring 33, the fourth main wiring 34, and the second redundant wiring 42. The fourth test pad 24 is physically connected to only one of the third main wiring 33, the fourth main wiring 34, and the second redundant wiring 42. 【0145】 In the sixth disclosure, the third test pad 23 and the fourth test pad 24 (test pads 20, 20) prevent the third main wiring 33 and the fourth main wiring 34 (main wirings 30, 30 together), the third main wiring 33 or the fourth main wiring 34 and the second redundant wiring 42 (main wiring 30 and redundant wiring 40), and the second redundant wiring 42 and the second redundant wiring 42 (redundant wirings 40, 40 together). This prevents changes in the current path or short circuits caused by the third test pad 23 and the fourth test pad 24 (test pads 20, 20) within the second wiring pattern 12. 【0146】 As a seventh disclosure, in the first region R1 located between the second main wiring 32 and the third main wiring 33, the second wiring pattern 12 is not electrically connected to the first wiring pattern 11. 【0147】 In the seventh disclosure, the region where the first inspection pad 21 and the second inspection pad 22 are located and the region where the third inspection pad 23 and the fourth inspection pad 24 are located are independent of each other via the first region R1. Therefore, the location of wiring defects can be accurately estimated in each of the regions where the first inspection pad 21 and the second inspection pad 22 are located and the region where the third inspection pad 23 and the fourth inspection pad 24 are located. 【0148】The eighth disclosure is a transparent heater equipped with the conductive film 1A according to the first to seventh disclosures. The eighth disclosure provides a transparent heater that can achieve the same effects as the conductive film 1A according to the first to seventh disclosures. 【0149】 As the ninth disclosure, the conductive film 1B comprises a substrate 2, a mesh wiring pattern 70 located on the upper surface 3 of the substrate 2, a first inspection pad 21 located on the upper surface 3 of the substrate 2 and physically connected to the mesh wiring pattern 70, and a second inspection pad 22 located on the upper surface 3 of the substrate 2 and physically connected to the mesh wiring pattern 70. If the region where the mesh wiring pattern 70 is located in a top view is called the energized region Rc, the energized region Rc has a second region R2 which is electrically connected as a whole, and a third region R3 which is electrically connected as a whole but not electrically connected to the second region R2. The first inspection pad 21 is located in the second region R2. The second inspection pad 22 is located in the second region R2. The first inspection pad 21 is connected to the second inspection pad 22 via the mesh wiring pattern 70. 【0150】 In the ninth disclosure, since the first inspection pad 21 and the second inspection pad 22 are located in the second region R2, it is possible to detect local fluctuations in resistance within the second region R2, which is a specific region in the energized region Rc. Therefore, it is possible to identify locations within the second region R2 in the energized region Rc where open circuits or short circuits have occurred in the mesh wiring pattern 70, or where wiring defects such as localized variations in wiring width have occurred. 【0151】 In the tenth disclosure, the mesh wiring pattern 70 has a first cell 91 located in the second region R2 and a second cell 92 located in the second region R2. The first inspection pad 21 is physically connected to only one side of the first cell 91. The second inspection pad 22 is physically connected to only one side of the second cell 92. 【0152】In the tenth disclosure, the first inspection pad 21 and the second inspection pad 22 (inspection pads 20, 20) prevent the edges within the cells from being electrically connected (i.e., the metal wire 80 constituting one edge of the first cell 91 and the metal wire 80 constituting one edge of the second cell 92). This prevents changes in the current path or short circuits caused by the first inspection pad 21 and the second inspection pad 22 within the second region R2 of the mesh wiring pattern 70. 【0153】 As an eleventh disclosure, the first inspection pad 21 further comprises a first pad portion 51 located inside the first cell 91 and a first lead wire portion 61 connecting the first cell 91 and the first pad portion 51. 【0154】 In the eleventh disclosure, the first pad portion 51 is separated from the mesh wiring pattern 70 that constitutes the first cell 91 (see Figure 9). Therefore, when measuring the electrical resistance value, the test probe can be stably brought into contact with the first pad portion 51 without coming into contact with the mesh wiring pattern 70. 【0155】 As a twelfth disclosure, the mesh wiring pattern 70 has metal wires 80, and the first inspection pad 21 has a first pad portion 51 that overlaps with the metal wires 80 of the mesh wiring pattern 70 in a top view. 【0156】 In the twelfth disclosure, it is no longer necessary to place the first inspection pad 21 between the metal wires 80. Therefore, the metal wires 80 can be placed close together. By placing the metal wires 80 close together, many metal wires 80 can be placed within the mesh wiring pattern 70 of the conductive film 1B. 【0157】 As a thirteenth disclosure, the conductive film 1B further comprises a third inspection pad 23 located on the upper surface 3 of the substrate 2 and a fourth inspection pad 24 located on the upper surface 3 of the substrate 2. The third inspection pad 23 is located in a third region R3. The fourth inspection pad 24 is located in a third region R3. The third inspection pad 23 is connected to the fourth inspection pad 24 via a mesh wiring pattern 70. 【0158】In the thirteenth disclosure, since the third inspection pad 23 and the fourth inspection pad 24 are located in the third region R3, it is possible to detect local fluctuations in resistance within the third region R3, which is a specific region in the energized region Rc. Therefore, it is possible to identify locations within the third region R3 in the energized region Rc where open circuits or short circuits have occurred in the mesh wiring pattern 70, or where wiring defects such as localized variations in wiring width have occurred. 【0159】 As a fourteenth disclosure, the mesh wiring pattern 70 further comprises a third cell 93 located in the third region R3 and a fourth cell 94 located in the third region R3. The third inspection pad 23 is physically connected to only one side of the third cell 93. The fourth inspection pad 24 is physically connected to only one side of the fourth cell 94. 【0160】 In the fourteenth disclosure, the third inspection pad 23 and the fourth inspection pad 24 (inspection pads 20, 20) do not electrically connect the edges within the cells (i.e., the metal wire 80 that constitutes one edge of the third cell 93 and the metal wire 80 that constitutes one edge of the fourth cell 94). This prevents changes in the current path and short circuits caused by the third inspection pad 23 and the fourth inspection pad 24 within the third region R3 of the mesh wiring pattern 70. 【0161】 The fifteenth disclosure is a transparent heater equipped with the conductive film 1B according to the disclosures ninth to fourteenth above. The fifteenth disclosure provides a transparent heater that can achieve the same effects as the conductive film 1B according to the disclosures ninth to fourteenth above. 【0162】 The conductive film relating to this disclosure can be applied to transparent heaters, electromagnetic shielding, dimming films, transparent antennas, touch sensors, and the like. Therefore, the conductive film relating to this disclosure is industrially applicable. 【0163】1A, 1B: Conductive film 2: Substrate 3: Top surface 8: First busbar 9: Second busbar 11: First wiring pattern 12: Second wiring pattern 20: Test pad 21: First test pad 22: Second test pad 23: Third test pad 24: Fourth test pad 30: Main wiring 31: First main wiring 32: Second main wiring 33: Third main wiring 34: Fourth main wiring 40: Redundant wiring 41: First redundant wiring 42: Second redundant wiring 50: Pad section 51: First pad section 52: Second pad section 53: Third pad section 54: Fourth pad section 55: Fine metal wires in pad section 61: First lead wire section 62: Second lead wire section 63: Third lead wire section 64: Fourth lead wire section 70: Mesh wiring pattern 80: Metal thin wires in mesh wiring pattern 91: First cell 92: Second cell 93: Third cell 94: Fourth cell D1: First direction D2: Second direction R1: First region Rc: Conductive region R2: Second region R3: Third region

Claims

1. A conductive film comprising: a substrate; a first wiring pattern located on the upper surface of the substrate; a first inspection pad located on the upper surface of the substrate and physically connected to the first wiring pattern; and a second inspection pad located on the upper surface of the substrate, physically connected to the first wiring pattern and electrically connected to the first inspection pad, wherein the first wiring pattern comprises: a first main wiring extending in a first direction; a second main wiring extending in the first direction and located in a second direction perpendicular to the first direction of the first main wiring; and a first redundant wiring electrically connecting the first main wiring and the second main wiring.

2. The conductive film according to claim 1, wherein the first inspection pad is physically connected to only one of the first main wiring, the second main wiring, and the first redundant wiring, and the second inspection pad is physically connected to only one of the first main wiring, the second main wiring, and the first redundant wiring.

3. The conductive film according to claim 1, wherein the first inspection pad further comprises a first pad portion separated from the first wiring pattern and a first lead wire portion connecting the first wiring pattern and the first pad portion.

4. The conductive film according to claim 1, wherein the first inspection pad has a first pad portion that overlaps with the first wiring pattern in a top view.

5. The conductive film according to claim 1, further comprising: a second wiring pattern located on the upper surface of the substrate; a third inspection pad located on the upper surface of the substrate and physically connected to the second wiring pattern; and a fourth inspection pad located on the upper surface of the substrate, physically connected to the second wiring pattern and electrically connected to the third inspection pad, wherein the second wiring pattern comprises: a third main wiring extending in the first direction; a fourth main wiring extending in the first direction and located in the second direction of the third main wiring; and a second redundant wiring electrically connecting the third main wiring and the fourth main wiring.

6. The conductive film according to claim 5, wherein the third test pad is physically connected to only one of the third main wiring, the fourth main wiring, and the second redundant wiring, and the fourth test pad is physically connected to only one of the third main wiring, the fourth main wiring, and the second redundant wiring.

7. In a first region located between the second main wiring and the third main wiring, the second wiring pattern is not electrically connected to the first wiring pattern, the conductive film according to claim 5.

8. A transparent heater comprising the conductive film described in claims 1 to 7.

9. A conductive film comprising: a base material; a mesh wiring pattern located on the upper surface of the base material; a first inspection pad located on the upper surface of the base material and physically connected to the mesh wiring pattern; and a second inspection pad located on the upper surface of the base material and physically connected to the mesh wiring pattern, wherein, when viewed from above, the area where the mesh wiring pattern is located is defined as the energized area, the energized area comprises: a second area within the energized area that is electrically connected as a whole; and a third area within the energized area that is electrically connected as a whole but not electrically connected to the second area, the first inspection pad located in the second area, the second inspection pad located in the second area, and the first inspection pad connected to the second inspection pad via the mesh wiring pattern.

10. The conductive film according to claim 9, wherein the mesh wiring pattern has a first cell located in the second region and a second cell located in the second region, the first inspection pad is physically connected to only one side of the first cell, and the second inspection pad is physically connected to only one side of the second cell.

11. The conductive film according to claim 9, wherein the first inspection pad further comprises a first pad portion located inside the first cell and a first lead wire portion connecting the first cell and the first pad portion.

12. The conductive film according to claim 9, wherein the mesh wiring pattern has fine metal wires, and the first inspection pad has a first pad portion that overlaps with the fine metal wires of the mesh wiring pattern in a top view.

13. The conductive film according to claim 9, further comprising: a third inspection pad located on the upper surface of the substrate; and a fourth inspection pad located on the upper surface of the substrate, wherein the third inspection pad is located in the third region, the fourth inspection pad is located in the third region, and the third inspection pad is connected to the fourth inspection pad via the mesh wiring pattern.

14. The conductive film according to claim 13, wherein the mesh wiring pattern further comprises a third cell located in the third region and a fourth cell located in the third region, the third inspection pad being physically connected to only one side of the third cell and the fourth inspection pad being physically connected to only one side of the fourth cell.

15. A transparent heater comprising the conductive film described in claims 9 to 14.

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