Photovoltaic-thermal module, method and solar system

Abstract

The invention relates to a photovoltaic-thermal module (100) comprising - a plurality of solar cells (2), which are arranged on a first side (31) of a carrier (3), and - a surface cooling plate (10), wherein - the surface cooling plate (10) is arranged on a second side (32) of the carrier (3), the second side (32) being arranged opposite the first side (31), and forms a plurality of cooling channels (11), wherein the surface cooling plate (10) is fastened to the carrier (3) by means of a connecting layer (4).

Description

[0001] P2024, 0937 WO N September 24, 2025

[0002] 1

[0003] Description

[0004] Photovoltaic-thermal module, process and solar system

[0005] A photovoltaic-thermal module is specified. A solar system is also specified, in particular a solar system with such a photovoltaic-thermal module. Furthermore, a method for manufacturing a photovoltaic-thermal module is specified, in particular a

[0006] Photovoltaic-thermal module according to the present disclosure.

[0007] Publication WO 2015 / 184402 Al concerns a photovoltaic module with integrated liquid cooling.

[0008] It is desirable to specify a photovoltaic-thermal module that can be reliably manufactured and operated. It is also desirable to specify a method for manufacturing a photovoltaic-thermal module that can be reliably implemented. Furthermore, it is desirable to specify a solar system that enables reliable operation.

[0009] Embodiments of the disclosure relate to a photovoltaic-thermal module. Further embodiments of the disclosure relate to a method for manufacturing a photovoltaic-thermal module, in particular for manufacturing a photovoltaic-thermal module according to one of the embodiments described herein. Further embodiments of the disclosure relate to a solar system, in particular a solar system with a plurality of the photovoltaic-thermal modules described herein. P2024, 0937 WO N 24 September 2025

[0010] 2

[0011] According to embodiments, the photovoltaic-thermal module, or PVT module for short, has a large number of solar cells.

[0012] The solar cells are based, for example, on silicon and / or germanium and / or on a compound semiconductor material such as CdTe or CuInGaS (CIGS) or CuInS (CIS). They can also be based on perovskite or at least an organic, photoactive material. In thin-film modules, particularly those based on CdTe, CIGS, CIS, amorphous Si, or perovskite, the photoactive layers are preferably arranged in strips, for example, with a width of at least 3 mm and / or at most 3 cm.

[0013] It is possible that several different types of solar cells or semiconductor materials are combined in the PVT module to achieve higher efficiency. For example, the individual solar cells, such as crystalline cells, have a mean diameter of at least 5 cm or at least 10 cm and / or at most 50 cm. The mean diameter D is calculated from the area A of the solar cell, for example, as follows: D = (4A / π) 0,5 .

[0014] The photovoltaic-thermal module has a support structure.

[0015] The solar cells are arranged on one side of the carrier.

[0016] The PVT module features a surface cooling plate. The surface cooling plate is arranged on a second side of the support. This second side is positioned opposite the first side. In particular, it complies with P2024, 0937 WO N 24 September 2025.

[0017] 3

[0018] The first side and the second side are the main sides of the carrier, along which the carrier is longer and wider than along sides oriented perpendicular to them.

[0019] The surface cooling plate forms a multitude of cooling channels. The surface cooling plate is attached to the support by means of a bonding layer.

[0020] In particular, a heat exchanger can be formed on the second side of the substrate using the surface cooling plate. Accordingly, the photovoltaic-thermal module, for example, has a rear-side cooler. The surface cooling plate is based, for example, on at least one inorganic material, such as glass or a metal, especially aluminum. Specifically, at least 80% by weight, at least 90% by weight, or at least 98% by weight of the surface cooling plate is formed by the at least one inorganic material.

[0021] The cooling channels are designed to allow a coolant to flow through them. Specifically, the cooling channels are surrounded by both the cooling plate and the connecting layer and / or the support to form a fluid-tight cooling channel or channels.

[0022] The cooling plate extends continuously over the relevant solar cells or parts of the solar cells. For example, all solar cells of the PVT module are coupled to a single, shared cooling plate. P2024, 0937 WO N 24 September 2025

[0023] 4

[0024] The surface cooling plate is formed in particular from a single plate. This is attached directly to the support, in particular by means of the bonding layer.

[0025] For example, a single metal plate is attached to the substrate to provide the cooling channels through which the coolant flows. Specifically, a single aluminum plate is attached to the back of the substrate, with the cooling channels formed in the aluminum plate and sealed off from the substrate and / or the bonding layer on the side facing the solar cells. It is also possible to form the surface cooling plate from a glass plate, a plastic plate, or a film. The cooling channels are formed into the surface cooling plate.

[0026] The surface cooling plate with the cooling channels thus forms a surface cooling body together with the back of the carrier.

[0027] The bonding material is, for example, a lamination material and / or an adhesive. For instance, the bonding layer consists of an EVA (ethylene-vinyl acetate), PVB (polyvinyl butyral), POE (polyolefin elastomer), and / or TPO (thermoplastic polyolefin) film. During manufacturing, the film is heated, for example, to temperatures between 110 °C and 150 °C, to bond the cooling plate and the substrate. This process, which can also be called lamination, thus serves to bond the substrate and the cooling plate together.

[0028] The bonding layer and materials are selected so that the surface cooling plate is sufficiently strongly bonded to the substrate to withstand, for example, an overpressure of 0.5 P2024, 0937 WO N 24 September 2025

[0029] 5

[0030] to withstand pressures of 6 bar or more, for example, the pressure at which coolant typically flows through the cooling channels. For example, the compound layer and materials are adapted to withstand a test pressure of 6 bar or more. For example, the compound layer and materials are adapted to withstand an operating pressure of 1 to 2 bar or more.

[0031] The compound layer is designed and selected, for example, to be resistant to the coolant, which is, for example, a glycol-water mixture.

[0032] The substrate is, for example, the back side of a PV module. The substrate may be made of glass, metal, plastic, or a film. The substrate serves to stabilize, support, and / or protect the solar cells. For example, the solar cells are embedded in an encapsulating material and arranged on the substrate. The encapsulating material may be an EVA film, a PVB film, a POE film, and / or a TPO film. A cover glass is provided on the side of the solar cells facing away from the substrate.

[0033] The cooling channels are free, nearly free, and / or sufficiently free of the compound layer so that, during operation, the coolant can flow through the cooling channels with the desired pressure drop. The compound layer and / or the cooling channels are designed in such a way as to prevent material from entering the PVT module during its manufacture. P2024, 0937 WO N 24 September 2025

[0034] 6

[0035] The bonding layer could penetrate too deeply into the cooling channels and thus block them. For example, the cooling channels are designed to be sufficiently deep so that even if material from the bonding layer penetrates, the cooling channels will not be blocked and will remain sufficiently clear to allow the coolant to flow through.

[0036] According to embodiments, the cooling plate has a plurality of recessed channel areas by means of which the cooling channels are formed. The cooling plate has a plurality of mounting areas arranged between the channel areas. For example, a flank of the cooling plate is formed between the channel area and the immediately adjacent mounting area.

[0037] The channel sections and mounting areas are arranged alternately. Thus, a mounting area is positioned between each pair of channel sections.

[0038] A channel section is arranged between each pair of fastening areas.

[0039] The bonding layer is applied to the mounting areas to fasten the cooling plate and the support to each other. It is possible that the bonding layer is also applied in the channel areas. Alternatively, the support may be free of the bonding layer in the area of ​​the cooling channels. Thus, no bonding layer is applied in the channel areas. The bonding layer is not continuous but has cutouts. These cutouts correspond to the cooling channels. The bonding layer is applied, for example, with a striped pattern, where the stripes are marked with P2024, 0937 WO N 24 September 2025

[0040] 7

[0041] The bonding layer corresponds to the mounting areas of the cooling plate. Therefore, the bonding layer is not applied over the entire surface of the support, but only where there are no cooling channels, but rather the mounting areas.

[0042] This prevents the bonding layer from spreading excessively within the cooling channels. This prevents the cooling channels from becoming blocked. Reliable flow through the cooling channels is thus ensured.

[0043] According to certain embodiments, a barrier layer is provided. This barrier layer is located, in particular, in the area of ​​the cooling channels. The barrier layer prevents the compound layer from penetrating the cooling channels, especially during the manufacturing of the PV module.

[0044] For example, the barrier layer is only present in the area of ​​the cooling channels. In this area, the barrier layer covers the bonding layer that extends across the entire surface of the substrate. The barrier layer thus prevents the bonding layer from penetrating too deeply into the cooling channel during manufacturing. Outside the cooling channels, for example, no barrier layer is provided, ensuring a reliable bond between the substrate and the cooling plate via the bonding layer. The barrier layer may, for example, consist of a plastic film with cutouts in the areas where it is attached. The barrier layer may therefore be strip-shaped, extending particularly along the channel sections.

[0045] According to embodiments, the barrier layer is formed in an area outside the cooling channels. P2024, 0937 WO N 24 September 2025

[0046] 8

[0047] The barrier layer extends completely across the entire surface of the bonding layer. The barrier layer is specifically designed in both the channel areas and the fastening areas. The barrier layer is designed to adequately block the penetration of the bonding layer into the cooling channels. The barrier layer is designed to allow sufficient penetration of the bonding layer into the barrier layer to enable the connection of the cooling plate to the support via the bonding layer through the barrier layer. For example, the barrier layer may have a structural element for this purpose. For example, the barrier layer may be formed from or have a fiberglass mesh. The barrier layer may be, for example, a thin fiberglass mat. For example, the barrier layer may be formed from or have a metal mesh.The barrier layer is, for example, a thin metal mesh mat. The metal is, for example, aluminum or contains aluminum. Other metals are also possible. The barrier layer can also be made of or consist of a woven and / or knitted fabric, such as a fiberglass fabric or a metal fabric. The barrier layer is, for example, made of aluminum fabric.

[0048] According to embodiments, the PVT module comprises a plurality of solar cells. The PVT module includes a cooling device. In particular, the cooling device is provided instead of a flat cooling plate. The cooling device extends partially or completely over the solar cells or parts of the solar cells. The cooling device comprises a plurality of cooling tubes. Each cooling tube has an internal structure. The internal structure is designed P2024, 0937 WO N 24 September 2025

[0049] 9

[0050] and designed to achieve a predetermined pressure drop in the cooling device.

[0051] The surface cooling plate, for example, is replaced by the cooling device with cooling tubes. The cooling tubes are, for example, aluminum tubes. The cooling tubes can also be referred to as cooling strips. The internal structure and, for example, the cross-section and / or diameter of the cooling tubes allow for precise adjustment of the pressure drop, in particular the pressure drop of the coolant, especially the cooling fluid, during operation as it flows through the cooling device. This ensures that the coolant flows through the cooling tubes as homogeneously and evenly as possible during operation.

[0052] For example, the cooling system with cooling tubes is more cost-effective than a flat heat sink. Furthermore, the cooling system does not require lamination to attach it to the solar cell substrate. Therefore, differing thermal properties between aluminum and the substrate, which might be made of glass, for example, can be disregarded during manufacturing. Since a large number of separate cooling tubes are used, only negligible thermal stresses occur during production. The cooling tubes are coupled to each other for fluid communication, allowing the coolant to flow through them and thus cover as much of the module as possible. Nevertheless, the cooling tubes retain at least some flexibility relative to each other to prevent thermal stresses.

[0053] According to embodiments, the cooling device has a first and a second hollow tube. The cooling tubes and the two hollow tubes extend along a first direction. P2024, 0937 WO N 24 September 2025

[0054] 10

[0055] Along a second direction, perpendicular to the first, the cooling pipes are arranged between the first and second hollow tubes. Thus, along the second direction, the first hollow tube is arranged first, followed by the cooling pipes, and then the second hollow tube. Unlike the cooling pipes, the hollow tubes do not have an internal structure. The hollow tubes allow for the coolant to flow through with minimal resistance. For example, the hollow tubes of several PVT modules can be connected to form manifolds.

[0056] The hollow tubes are made of aluminum, for example. The hollow tubes are, for example, extruded aluminum tubes. The cooling tubes are, for example, extruded aluminum profiles.

[0057] According to embodiments, the cooling device has a first and a second side tube. The first and the second side tubes each run transversely to the cooling tubes.

[0058] In particular, the first and second side tubes each run along the second direction. The cooling tubes are arranged along the first direction between the first and second side tubes. The cooling tubes are each fluidly connected to the first and second side tubes. Fluid can thus flow from one cooling tube to the next via the side tubes. For example, the first and second side tubes are each made of plastic. Using a special joining technique and material pretreatment, it is possible to connect the cooling tubes, which are made of aluminum, for example, and the plastic tubes to each other in order to allow the fluid to flow through the side tubes and the cooling tubes. According to embodiments, the first and second side tubes are also P2024, 0937 WO N 24 September 2025

[0059] 11

[0060] The second hollow tube is connected to the first and second side tubes in a fluid-conducting manner.

[0061] According to certain embodiments, the cooling tubes each have an external finned structure. It is also possible for the hollow tubes to have an external finned structure. It is possible for all cooling tubes to have an external finned structure, or only some of them. The finned structure increases the surface area of ​​the cooling tubes. For example, in so-called monovalent operation, where the PVT modules are the sole heat source for a heat pump, this allows additional ambient heat, known as anergy, to be extracted from the cold air at low temperatures, such as in winter. This means that fewer PVT modules are required to operate a corresponding heat pump.

[0062] According to embodiments, a solar system comprises a plurality of photovoltaic-thermal modules according to one of the embodiments described herein. The surface cooling plates are, for example, connected to one another in series via fluid conductivity. The cooling devices of the PVT modules are, for example, connected in series via fluid conductivity. The hollow tubes of the plurality of photovoltaic-thermal modules are each connected in series via fluid conductivity. The first hollow tubes thus jointly form a manifold. The second hollow tubes thus jointly form a manifold. For example, the first manifold from the first hollow tubes serves to supply the fluid, and the second manifold from the second hollow tubes serves to discharge the fluid. Between the first manifold and the second P2024, 0937 WO N 24 September 2025

[0063] 12

[0064] The fluid flows through the cooling pipes of the respective PVT module via the manifold.

[0065] According to embodiments, a plurality of solar cells are provided for the manufacture of a PVT module, in particular a PVT module according to one of the embodiments described herein. The plurality of solar cells is, for example, arranged on a first side of a carrier or is arranged on the first side of the carrier. A bonding agent is applied to a second side of the carrier. The second side is arranged opposite the first side. A cooling plate is arranged over the bonding agent. Alternatively, it is also possible to attach a cooling device with a plurality of cooling tubes over the bonding agent. The cooling plate has a plurality of cooling channels.

[0066] For example, a barrier is installed, at least in the area of ​​the cooling channels. A bonding layer is formed using the bonding material, for example, by applying heat. The bonding material could be a laminating material such as an EVA film, a PVB film, a POE film, and / or a TPO film, so that the bonding layer is formed through a lamination process. It is also possible that the bonding material is an adhesive. The bonding layer is used to attach the cooling plate or cooling device to the substrate.

[0067] In particular, the bonding layer is used to attach the surface cooling plate by means of the bonding agent and P2024, 0937 WO N 24 September 2025

[0068] 13

[0069] the carrier is formed against each other, with the barrier blocking the penetration of the connecting material into the cooling channels.

[0070] It is also possible to forgo the application of the barrier. For example, if the cooling pipes of the cooling device are attached to the support, the barrier can be omitted.

[0071] For example, a soluble material, such as a water-soluble material, is placed in the cooling channels. This material must be sufficiently temperature-resistant to withstand the temperatures during the formation of the compound layer. After the compound layer has formed, the soluble material is dissolved. For example, the soluble material is water-soluble and is dissolved with water after the compound layer has formed. The soluble material in the cooling channels prevents unwanted penetration of the compound or the compound layer into the cooling channels during the formation of the compound layer. Subsequently, the soluble material is dissolved, so that the cooling channels are clear and allow the desired fluid flow.

[0072] Alternatively or additionally, a barrier layer is applied, which has a pattern corresponding to the arrangement of the numerous cooling channels. This pattern can also be referred to as a design. Thus, the barrier layer is positioned within the area of ​​the cooling channels. Outside the cooling channels, the barrier layer has recesses. These recesses allow for a reliable connection between the cooling plate and the substrate. The barrier layer prevents undesired P2024, 0937 WO N 24 September 2025

[0073] 14

[0074] Penetration of the bonding agent or bonding layer into the cooling channels.

[0075] Alternatively or additionally, a grid structure, such as a fiberglass grid, is arranged. This grid structure extends, for example, across the entire surface of the bonding material. During the formation of the bonding layer, the grid structure allows the bonding material or bonding layer to penetrate the grid structure, thus connecting the cooling plate and the substrate. Additionally, the grid structure prevents unwanted penetration of the bonding material or bonding layer into the cooling channels, ensuring that these remain sufficiently clear for fluid flow.

[0076] According to embodiments, the bonding agent is applied to the second side of the support such that it is only present in the mounting area of ​​the support, leaving channel areas between the mounting areas free of the bonding agent. These channel areas correspond in particular to the cooling channels of the surface cooling plate. The mounting areas are attached to the support by means of the bonding agent and the bonding layer formed from it. Because no bonding agent is present in the channel areas, unwanted penetration of the bonding agent or the bonding layer into the cooling channels is prevented, ensuring that these channels remain sufficiently clear for fluid flow.

[0077] The advantages, features, and further training of the PVT module also apply to the procedure, and vice versa. P2024, 0937 WO N 24 September 2025

[0078] 15

[0079] Further advantages, features, and advanced developments are explained below with reference to the drawings. The same reference symbols can indicate the same elements in the individual figures. These are not to scale; rather, individual elements may be exaggerated for clarity.

[0080] They show:

[0081] Figures 1 to 6 each show a schematic representation of a PVT module according to exemplary embodiments.

[0082] Figure 7 shows a schematic representation of a PVT module according to an exemplary embodiment, and

[0083] Figure 8 shows a schematic representation of a solar system according to an exemplary embodiment.

[0084] A photovoltaic-thermal module 100, or PVT module for short, combines photovoltaic modules for electricity generation with the utilization of the modules' waste heat. The PVT module 100 thus converts incoming solar energy into electricity, and the resulting waste heat is utilized. In addition to electrical energy, such PVT modules 100 simultaneously produce heat, for example, in the form of hot water or other cooling fluids. Examples of the basic functionality and application areas of the PVT modules 100 described here are, for example, described in German patent application 102021123000, the contents of which are hereby fully incorporated by reference. P2024, 0937 WO N 24 September 2025

[0085] 16

[0086] Figure 1 shows a sectional view of an embodiment of the photovoltaic-thermal module 100. The PVT module 100 has a front glass 1. The PVT module 100 has a support 3. Solar cells 2 are arranged along a stacking direction 8 between the front glass 1 and the support 3. The solar cells 2 are connected to each other via electrical cell connectors. The solar cells are, for example, laminated in an embedding material 21 (for example, Figure 6). The solar cells 2 are arranged on a first side 31 of the support 3.

[0087] The front glass 1, the solar cells 2, the carrier 3, the bonding layer 4, and the cooling plate 10 together form a stack 7. The front glass 1, the solar cells 2, the carrier 3, the bonding layer 4, and the cooling plate 10 are stacked along the stacking direction 8.

[0088] The carrier 3 has a second side 32 facing away from the solar cells 2. The first side 31 and the second side 32 are arranged opposite each other along the stacking direction 8.

[0089] The second side 32 can also be referred to as the back. For example, the front glass 1, the solar cells 2 and the support 3 form a photovoltaic module.

[0090] On the second page 32, a bonding layer 4 is formed. The bonding layer 4 is formed, for example, from an adhesive or by an EVA film, a PVB film, a POE film and / or a TPO film, or by another material that can create a bond, for example, by means of a lamination process. The bonding layer 4 serves to bond a P2024, 0937 WO N 24 September 2025

[0091] 17

[0092] The cooling plate 10 is attached to the support 3. The support 3 is connected to the cooling plate 10 by means of the connecting layer 4. The connecting layer 4 is arranged along the stacking direction 8 between the second side 32 of the support 3 and the cooling plate 10.

[0093] The bonding layer 4 extends in particular over the entire area and in particular without any gaps over the second side 32.

[0094] The surface cooling plate 10, for example, has a thin aluminum sheet or is formed from a thin aluminum sheet. For example, a multitude of cooling channels 11 are embossed into the surface cooling plate 10 by a stamping process. The cooling channels 11 are, in particular, fluid-conductingly connected to one another, so that a fluid can flow through the cooling channels 11 along the second side 32.

[0095] The surface cooling plate 10 has channel areas 12 that are set back from the mounting areas 13 along the stacking direction 8. The channel areas 12 are located further from the second side 32 along the stacking direction 8 than the mounting areas 13. Each channel area 12 is provided between two mounting areas 13. A flank 14, in particular an inclined flank 14, extends between each channel area and the immediately adjacent mounting area 13. The flank 14 connects the channel area 12 and the mounting area 13.

[0096] The cooling channels 11 are formed by means of the channel sections 12. In the section shown, each cooling channel 11 is bounded by the channel section 12 and two flanks 14 of the surface cooling plate 10 and the connecting layer 4.

[0097] In particular, only a single surface cooling plate 10 P2024, 0937 WO N 24 September 2025

[0098] 18

[0099] Each PVT module 100 is provided. Unlike conventional PVT modules, where a surface heat sink is formed from two plates that are connected to each other and form the cooling channels, the surface cooling plate 10 of the PVT module 100 according to Figure 1 is directly connected to the support 3, which is made of glass, for example, without a second aluminum plate.

[0100] The fastening areas 13 of the surface cooling plate 10 are in direct contact with the bonding layer 4. The bonding layer 4 directly connects the surface cooling plate 10 and the support 3. The channel areas 12 are spaced away from the bonding layer 4, and in particular, no further aluminum layer is provided between the bonding layer 4 and the channel areas 12 of the surface cooling plate 10.

[0101] The channel sections 12 are set back sufficiently far along the stacking direction 8 so that they are not blocked by the bonding layer 4 during the bonding process of the surface cooling plate 10 to the support 3. The bonding layer 4 does not penetrate the cooling channels 11, or only penetrates them to such an extent that they remain open for sufficient fluid flow during operation.

[0102] Figure 2 shows the PVT module 100 according to a further embodiment. The PVT module 100 essentially corresponds to the PVT module 100 according to Figure 1. However, it is possible that the channel areas 12 are set back less far along the stacking direction 8. In addition, a barrier layer 5 is provided. The barrier layer 5 is arranged to prevent the ingress of material from the bonding layer 4, for example bonding agent 42 (for example, Figure 3), during manufacturing. P2024, 0937 WO N 24 September 2025

[0103] 19

[0104] to block the cooling channels 11. In particular, the barrier layer 5 is arranged on a side of the connecting layer 4 facing away from the support 3.

[0105] The barrier layer 5, for example, has a pattern such that the barrier 5 is only arranged in the cooling channels 11. No barrier layer 5 is arranged at the fastening areas 13 of the cooling plate 10. Thus, a reliable connection of the cooling plate 10 to the support 3 via the connecting layer 4 is enabled.

[0106] The barrier layer 5, for example, has a film 51. The film 51 has, for example, a pattern such that strips of the film 51 are arranged on the connecting layer 4 in areas that correspond to the channel areas 12. The film 51 has, for example, recesses 54 that correspond to the fastening areas 13. Thus, the film 51 has, for example, a pattern that corresponds to the arrangement of the channel areas 12 and the fastening areas 13 relative to each other.

[0107] During manufacturing, for example, bonding agent 42 is first applied to the second side 32. Then the film 51 is laid on top. Next, the cooling plate 10 is placed on top so that the fastening areas 13 are in contact with the bonding agent 42 through the recesses 54. Subsequently, the bonding agent 42 is activated, for example in a lamination process or by curing the adhesive.

[0108] Figure 3 shows the PVT module 100 according to a further embodiment during manufacturing. For example, P2024, 0937 WO N 24 September 2025

[0109] 20

[0110] In contrast to the embodiment shown in Figure 2, no barrier layer 5 is provided. Instead, a barrier 6 is provided, for example, which fills the cooling channels 11 during manufacturing. The barrier 6 is, for example, made of or comprised of a soluble material 61. The soluble material 61 is, for example, water-soluble or soluble by another method. During manufacturing, the barrier 6, for example strips of the soluble material 61, is applied to the bonding agent 42. Subsequently, the surface cooling plate 10 is placed on top, so that the soluble material 61 is arranged correspondingly in the channel areas 12.

[0111] During the subsequent activation of the compound 42 to form the bonding layer 4, for example by introducing heat in a lamination process, the soluble material 61 prevents the penetration of the compound 42 and / or the bonding layer 4 into the cooling channel 11. The soluble material 61 blocks the penetration of the compound 42 into the cooling channels 11, so that these remain free of compound 42 and the bonding layer 4.

[0112] After the cooling plate 10 and the support 3 are joined together by forming the bonding layer 4, the soluble material 61 is dissolved to expose the cooling channels 11. For example, the soluble material 61 is dissolved by flushing with water so that the cooling channels 11 are subsequently clear and can be filled with fluid during operation.

[0113] Figure 4 shows the PVT module 100 according to a further embodiment. Instead of the barrier layer 5 and / or P2024, 0937 WO N 24 September 2025

[0114] 21

[0115] The barrier 6 has recesses 41 in the bonding layer 4. The recesses 41 are located at points that correspond to the channel areas 12 of the cooling surface 10. The bonding layer 4 is not applied to the entire surface of the second side 32 of the support 3. The bonding layer 4 is only applied in the areas where the cooling surface 10 has the fastening areas 13. The recesses 41 are provided between these areas.

[0116] During manufacturing, the bonding material 42 is applied, for example, in strip form, with a recess 41 provided between each pair of strips. The cooling plate 10 is then placed on top, so that the mounting areas 13 each rest on the strips of bonding material 42. In the subsequent activation process, for example by lamination, the bonding layer 4 is formed in strip form, while the cooling channels 11 remain unobstructed, as the recesses 41 prevent unwanted penetration of the bonding material 42 and / or the bonding layer 4 into the cooling channels 11.

[0117] For example, the bonding material 42 is applied using a rolling technique, which is particularly appropriate when adhesive is used as the bonding material 42. If a lamination film, such as an EVA film, a PVB film, a POE film, and / or a TPO film, is used as the bonding material 42, it is, for example, cut into strips and / or has a striped pattern that corresponds to the arrangement of the fastening areas 13 of the surface cooling plate 10. P2024, 0937 WO N 24 September 2025

[0118] 22

[0119] Figure 5 shows the PVT module 100 according to a further embodiment. Similar to the embodiments according to Figures 2 and 3, the bonding layer 4 is arranged continuously over the entire surface of the second side 32 of the carrier 3. In particular, no recesses 41 are provided.

[0120] The barrier layer 5 is provided to cover, for example, the entire surface of, one side of the connecting layer 4 facing away from the support 3. In particular, no recesses 54 are provided as in the embodiment shown in Figure 2. The barrier layer 5 in the embodiment shown in Figure 5 has, in particular, a grid structure 52 and is formed, for example, from a glass fiber grid 53. The grid structure 52 can also be referred to as a woven structure. The glass fiber grid 53 can also be referred to as a glass fiber fabric 53.

[0121] During manufacturing, the grid structure 52 is placed onto the bonding material 42, which subsequently forms the bonding layer 4. Before the bonding layer 4 is formed, the surface cooling plate 10 is placed onto the barrier layer 5. The grid structure 52 is thus arranged along the stacking direction 8 between the bonding material 42 and the surface cooling plate 10. The fastening areas 13 are in contact with the grid structure 52. During lamination, the bonding material 42 penetrates the grid structure 52 and forms penetration areas 55. The grid structure 52 has a sufficiently large mesh to allow adequate penetration of the bonding material 42, so that adequate lamination is achieved via the penetration areas 55. P2024, 0937 WO N 24 September 2025

[0122] 23

[0123] and thus the attachment of the surface cooling plate 10 to the support 3 is made possible by means of the connecting layer 4.

[0124] The penetration areas 55 are formed in particular corresponding to the fastening areas 13. The fastening areas 13 are in direct contact with the bonding layer 4 at the penetration areas 15, so that the surface cooling plate 10 is fastened through the grid structure 52 by means of the bonding layer 4 on the second side 32.

[0125] In the channel areas 12, the lattice structure 12 sufficiently blocks the penetration of the compound 42 or the compound layer 4 into the cooling channels 11. During manufacturing, the compound 42 is introduced into the lattice structure 52, for example. However, during manufacturing, the compound 42 does not penetrate from the lattice structure 52 into the cooling channels 11 in the channel areas 12, thus preventing them from becoming blocked. For example, after the manufacturing process, the lattice structure 52 is completely or almost completely permeated by the compound 42 and is therefore an integral part of the compound layer 4.

[0126] It is also possible that the grid structure 52 is placed on the bonding material 42 if the bonding material 42 is an adhesive. In this case, the adhesive penetrates the grid structure 52 at the fastening areas 13. However, the adhesive is not forced out of the grid structure 52 into the cooling channels 11, so these remain open and are not blocked. P2024, 0937 WO N 24 September 2025

[0127] 24

[0128] The PVT module 100 with the surface cooling plate 10 enables higher thermal efficiency due to the direct contact of the cooling medium with the back of the carrier 3, thus improving heat transfer. Higher electrical efficiency is possible through the improved cooling of the solar cells 2. In particular, there is no need to solder two aluminum plates together at high temperatures. This results in cost savings. Mass production is possible.

[0129] Figure 6 shows the PVT module 100 according to a further embodiment. Instead of the one-piece surface cooling plate 10 according to Figures 1 to 5, a cooling device 110 is provided.

[0130] The PVT module 100 comprises the front glass 1, the solar cells 2, and the support 3 along the stacking direction 8. The support 3 is, for example, a back glass or a back film. A frame 9 is provided, which is made, for example, of a metal, such as aluminum, or a plastic. The frame 9 is designed to mechanically support the PVT module 100. It is also possible to omit the frame 9.

[0131] The carrier 3 has a first side 31 on which the solar cells 2 are arranged in the embedding material 21. For example, the solar cells 2 are laminated into the embedding material 21. On the opposite second side 32, the cooling device 110 is attached by means of an adhesive layer 113. The adhesive layer 113 comprises, for example, an adhesive film and / or a bond. P2024, 0937 WO N 24 September 2025

[0132] 25

[0133] The cooling device 110 has a plurality of cooling tubes 120. The cooling tubes have, for example, a rectangular cross-section, so that they can be arranged flat on the second side 32. The cooling tubes 120 are arranged side by side along a second direction 112. For example, the cooling tubes 120 have a small spacing of 1 mm or less, more than 0.5 mm to 3 mm, 1 mm ± 10%, or another spacing in the range of a few millimeters along the second direction 112.

[0134] For example, the cooling tubes 120 along the second direction 112 are as wide as one of the solar cells 2, or as two solar cells 2, or as several solar cells 2. For example, one solar cell 2 is 182 mm wide. Accordingly, for example, one of the cooling tubes 120 is 182 mm + / - 10% wide along the second direction 112. For example, the cooling tube 120 along the stacking direction 8 is between 10 and 30 mm high.

[0135] The cooling tubes 120 each have an internal structure 121. This internal structure is, for example, lattice-like or labyrinthine and / or features internal roughening. The internal structure 121 is designed to achieve a predetermined pressure drop in the cooling device 110. This pressure drop occurs during operation as the fluid flows through the cooling tubes. The pressure drop can also be referred to as pressure loss or pressure differential.

[0136] The cooling pipes 120 are made of aluminum, for example. The cooling pipes 120 each, for example, are made of aluminum. The cooling pipes 120 each, for example, are manufactured using an extrusion process.

[0137] The cooling tubes 120 extend along a first direction 111 (Figure 7). The first direction 111 and the second direction 112 are perpendicular to each other. The first direction 111 and the second direction 112 are, for example, perpendicular to the stacking direction 8. P2024, 0937 WO N 24 September 2025

[0138] 26

[0139] The cooling tubes 120 each have a lamellar structure 122. According to further embodiments, the lamellar structure 122 is omitted. The lamellar structure forms lamellae on a side of the cooling tubes 120 facing away from the support 3. The lamellar structure 120 increases the surface area of ​​the cooling tubes 120. Thus, in certain operating modes, for example at cold temperatures in winter, it is possible to extract additional ambient heat, so-called anergy, from the air.

[0140] For example, if the PVT module 100 serves as the sole heat source for a connected heat pump, additional energy is provided for this heat pump. Therefore, fewer PVT modules are needed to operate this heat pump. The fin structure 122 is not provided in other embodiments not explicitly shown and is particularly unnecessary for heat exchange between the carrier 3 and the fluid in the cooling tubes 120.

[0141] The cooling device 110 of the PVT module 100 has two hollow tubes 131, 132. The first hollow tube 131 is arranged along the second direction 112. The cooling tubes 120 are arranged next to it. Finally, the second hollow tube 132 is arranged along the second direction 112. The hollow tubes 131, 132 do not have an internal structure 121 like the cooling tubes 120. The hollow tubes 131, 132 are, for example, each made of aluminum. The hollow tubes 131, 132 are, for example, each manufactured by means of an extrusion process.

[0142] The two hollow tubes 131, 132 and the cooling tubes 120 are connected to each other in a fluid-conducting manner by means of two side tubes 141, 142.

[0143] Figure 7 shows the two side tubes 141, 142, which extend along the second direction 112. The first side tube 141 is initially arranged along the first direction 111. The hollow tubes 131, 132 and the cooling tubes 120 are connected to the side tube 141 by means of connections 180. [On the first P2024, 0937 WO N 24. September 2025]

[0144] 27

[0145] The second side tube 112 is arranged on the side opposite direction 111. The hollow tubes 131, 132 and the cooling tubes 120 are in turn fluid-tightly connected to the side tube 142 by means of connections 180. Along the first direction 111, the hollow tubes 131, 132 and the cooling tubes 120 are arranged between the two side tubes 141, 142.

[0146] An inlet 150 is formed at the transition between the first side pipe 141 and the first hollow pipe 131, as well as at the transition between the first side pipe 141 and the second hollow pipe 132. For example, during operation, a cooler fluid is introduced at the inlet 150 on the first hollow pipe 131. It is also possible for the inlet 150 to be formed on the first side pipe 141.

[0147] The fluid then flows through the side tubes 141 and 142 and the cooling tubes 120 between them. This heats the fluid. The warmer fluid can then be discharged through a drain 160 at the transition between the second hollow tube 132 and the second side tube 142. For example, the drain 160 is located on the second hollow tube 132. It is also possible for the drain 160 to be located on the second side tube 142.

[0148] For example, two inlets 150 are formed on the first side pipe 141. For example, two outlets are formed on the second side pipe 142.

[0149] For example, the first hollow pipe 131j has an inlet 150 and an outlet 160. For example, the second hollow pipe 132j ​​has an inlet 150 and an outlet 160.

[0150] In a series connection, as explained below in Figure 8, heated fluid from a further PVT module 100 is fed into the inlet 150 at the second hollow tube 132. Fluid that is fed into the inlet 150 at the first hollow tube 131. P2024, 0937 WO N 24 September 2025

[0151] 28

[0152] Part of the flow can be discharged at the outlet 160 at the transition between the first hollow pipe 131 and the second side pipe 142 and fed to a third PVT module 100.

[0153] The side pipes 141 and 142 are, for example, both made of plastic. These pipes have an internal fluid channel to direct the fluid into the connected cooling pipes 120. During operation, the fluid flows in a zigzag pattern through the cooling pipes 120 and the side pipes 141 and 142.

[0154] Figure 8 shows a solar system 200 according to an exemplary embodiment. The solar system 200 comprises, for example, a plurality of PVT modules 100 according to the exemplary embodiments shown in Figures 6 and 7. The PVT modules 100 are connected to one another by means of flexible hoses 170. In particular, inlets 150 and outlets 160 located directly adjacent to each other are connected to one another by means of a hose 170. Thus, a first manifold for the cooler fluid is formed by means of the first hollow tubes 131 and the associated hoses 170. A second manifold for the warmer fluid is formed by means of the second hollow tubes 132 and the associated hoses 170. Thus, separate manifolds, which would otherwise have to be installed in addition to the PVT modules 100, are unnecessary. The flexible hoses 150 can also be designed to be significantly shorter than those for connection to a separate manifold.This allows for cost savings in hydraulic circuitry.

[0155] The cooler fluid can be supplied to a first of the inlets 150 of the solar system 200 via a pipe 151. In the illustrated embodiment, this is the right inlet 150 of the right PVT module 100. The last inlet 150, in the illustrated figure the left inlet 150 of the left module 110, is closed, for example by means of a blanking plug. P2024, 0937 WO N 24 September 2025

[0156] 29

[0157] The heated fluid from the collecting line formed by the second hollow tubes 132 is discharged, for example, from the last outlet 160 by means of a pipe 161. In the figure shown, this is the left outlet 160 of the left PVT module 100. The opposite outlet 160 is closed, for example with a blind flange. In Figure 8, this is the right outlet 160 of the right PVT module 100.

[0158] The cooling device 110 is composed of several individual parts, which are provided separately and are at least slightly movable relative to each other even in the ready-to-use state within the PVT module 100. Slight relative movement is also possible during manufacturing, thus preventing thermal stresses from occurring during manufacturing and operation.

[0159] Connection fittings are provided at the inlets 150 and the outlets 160, for example. These are made of plastic. The connection fittings are foldable, for instance, so that they do not protrude during transport. This makes it possible, for example, to reduce the depth of the frame 9 along the stacking direction 8. This results in material savings and therefore cost savings.

[0160] The cooling device 110, for example, offers cost savings compared to the surface cooling plate 10, due to its simpler manufacturing process. Furthermore, it uses less aluminum and requires less expensive tools. Assembling the cooling device 110 onto the support 3 is also simpler, as no thermal stresses need to be considered.

[0161] The PVT module 100 with the cooling device 110 can be manufactured easily and reliably, since there are no different coefficients of expansion between the carrier 3 and a surface heat sink made of aluminum P2024, 0937 WO N 24 September 2025

[0162] 30

[0163] This compensates for the fact that less expensive tools can be used than for manufacturing a surface heat sink with aluminum plates. High manufacturing and / or operational efficiency is possible.

[0164] Applications for the PVT modules 100 described here with the surface cooling plate 10 and / or the cooling device 110 are solar cells 2 of all types, for example crystalline or bifacial crystalline modules or thin-film modules.

[0165] Furthermore, the following areas of application for the Module 100 are particularly suitable: On roofs, in industry, open spaces, low-temperature heat networks, floating installations, large open-space solar parks, for example in hot regions such as the USA, India, Spain, Arabia, Australia, Chile.

[0166] Both the use of the surface cooling plate 10 and the cooling device 110 offer cost reductions compared to a surface heat sink made of two interconnected plates. Furthermore, the weight of the PVT module 100 can be reduced by using less metal. Significant simplifications in the production process are possible. A considerably lower use of expensive materials is achievable. Lower costs and greater efficiency are therefore possible. P2024, 0937 WO N 24 September 2025

[0167] 31

[0168] Reference sign

[0169] 100 Photovoltaic-thermal modules (PVT modules) 200 Solar systems

[0170] 1 Front glass

[0171] 2 solar cells

[0172] 21 Embedding material

[0173] 3 carriers

[0174] 31 first page

[0175] 32 second page

[0176] 4. Bonding layer

[0177] 41 recess

[0178] 42 Connective material

[0179] 5 Barrier layer

[0180] Slide 51

[0181] 52 structural bodies

[0182] 53 fiberglass grids

[0183] 54 Exclusion

[0184] 55 Penetration area

[0185] 6 Barrier

[0186] 61 soluble material

[0187] 7 stacks

[0188] 8 Stacking direction

[0189] 9 frames

[0190] 10 surface cooling plates

[0191] 11 cooling channels

[0192] 12 channel areas

[0193] 13 Mounting area

[0194] 14th flank

[0195] 110 Cooling device

[0196] 111 first direction

[0197] 112 second direction

[0198] 113 Detention shift P2024, 0937 WO N 24 September 2025

[0199] - 32 -

[0200] 120 cooling pipe

[0201] 121 internal structure

[0202] 122 lamella structure

[0203] 131, 132 Hollow tube

[0204] 141, 142 side tube

[0205] 150 inflow

[0206] 151 pipe

[0207] 160 Drain

[0208] 161 pipe

[0209] 170 hose

[0210] 180 connection

Claims

P2024, 0937 WO N September 24, 2025 33 Patent claims 1. Photovoltaic-thermal module (100) with - a plurality of solar cells (2) arranged on a first side (31) of a carrier (3), and - a surface cooling plate (10), where - the surface cooling plate (10) is arranged on a second side (32) of the support (3 ), wherein the second side (32) is arranged opposite the first side (31), and forms a plurality of cooling channels (11), wherein the surface cooling plate (10) is attached to the support (3 ) by means of a connecting layer (4).

2. Photovoltaic-thermal module (100) according to the preceding claim, wherein the surface cooling plate (10) has a plurality of recessed channel areas (12) by means of which the cooling channels (11) are formed, and has a plurality of fastening areas (13) arranged between the channel areas (12), wherein the connecting layer (4) is arranged at the fastening areas (13) to fasten the surface cooling plate (10) and the support (3) to each other.

3. Photovoltaic-thermal module (100) according to one of the preceding claims, wherein the carrier (3 ) is free of the bonding layer (4) in the area of ​​the cooling channels (11).

4. Photovoltaic-thermal module (100) according to one of claims 2 or 3, wherein the bonding layer (4) extends over the entire surface of the support, such that the bonding layer (4) is located in the area of ​​the cooling channels (11) P2024, 0937 WO N September 24, 2025 34 is arranged, wherein the cooling channels (11) are free from the connecting layer (4).

5. Photovoltaic-thermal module (100) according to one of the preceding claims, comprising a barrier layer (5) which is arranged in the area of ​​the cooling channels (11) and which blocks the penetration of the connecting layer (4) into the cooling channels (11).

6. Photovoltaic-thermal module (100) according to the preceding claim, wherein the barrier layer (5) is formed in a region (13) outside the cooling channels (11).

7. Photovoltaic-thermal module (100) according to claim 5 or 6, wherein the barrier layer (5) has a structural body (52) and extends over the surface of the support (3), wherein the structural body (52) is configured such that the surface cooling plate (10) is attached to the support through the structural body (52) by means of the connecting layer (4) and the structural body (52) blocks the penetration of the connecting layer (4) into the cooling channels (11).

8. Photovoltaic-thermal module (100) according to the preceding claim, wherein the structural body (52) comprises a glass fiber lattice and / or a metal lattice (53) or is formed from a glass fiber lattice or a metal lattice (53).

9. Method for manufacturing a photovoltaic-thermal module (100), comprising: - Providing a plurality of solar cells (2) arranged on a first side (31) of a carrier (3 ), P2024, 0937 WO N September 24, 2025 35 - Applying a bonding agent (42) to a second side (32) of the carrier (3), wherein the second side (32) is arranged opposite the first side (31), - Arranging a surface cooling plate (10) forming a plurality of cooling channels (11) over the bonding material (42), - Arranging a barrier (5, 6) at least in the area of ​​the cooling channels (11), - Forming a bonding layer (4) by means of the bonding material (42) to fasten the surface cooling plate (10) and the support (3) to each other, wherein the barrier (5, 6) blocks the penetration of the bonding material (42) into the cooling channels (11).

10. The method of claim 9, wherein the arrangement of the barrier (5, 6) comprises: - Arranging a soluble material (61) in the cooling channels (11), - Dissolving of the soluble material (61) after formation of the compound layer (4).

11. The method of claim 9 or 10, wherein the arrangement of the barrier comprises: - Arranging a barrier layer (5) having a pattern corresponding to the arrangement of the plurality of cooling channels (11), such that the barrier layer (5) is arranged in the area of ​​the cooling channels (11) and the barrier layer has recesses (54) outside the cooling channels (11).

12. Method according to claim 9 or 10, wherein the arrangement of the barrier (5, 6) comprises: - Arranging a structural body (52) that extends over the surface of the connecting material (42). P2024, 0937 WO N September 24, 2025 - 36 - 13. Method for manufacturing a photovoltaic thermal module (100), comprising: - Providing a plurality of solar cells (2) arranged on a first side (31) of a support (3), - Providing a surface cooling plate (10) having a plurality of recessed channel areas (12) by means of which a plurality of cooling channels (11) is formed, and having a plurality of fastening areas (13), - Applying a bonding agent (42) to a second side (32) of the carrier (3), wherein the second side (32) is arranged opposite the first side (31), at fastening areas (13) of the carrier, such that the channel areas (12) between the fastening areas (13) remain free of the bonding agent (42), - Arrange the surface cooling plate (10) above the bonding material (42) so that the fastening areas (13) of the surface cooling plate (10) are in contact with the bonding material (42), - Forming a bonding layer (4) using the bonding material (42) to fasten the surface cooling plate (10) and the support (3) to each other.

14. Photovoltaic-thermal module (100) with - a large number of solar cells (2), and - a cooling device (110) which extends partially or completely over the solar cells (2) or parts of the solar cells (2), wherein - the cooling device (110) has a plurality of cooling tubes (120), wherein the cooling tubes (120) each have an internal structure (121) for a predetermined pressure drop of the cooling device (110). P2024, 0937 WO N September 24, 2025 - 37 - 15. Photovoltaic thermal module (100) according to the preceding claim, wherein the cooling device (110) has a first and a second hollow tube (131, 132), wherein the cooling tubes (120) and the two hollow tubes (131, 132) extend along a first direction (111) and the cooling tubes (120) are arranged along a second direction (112) perpendicular to the first direction (111) between the first and the second hollow tube (131, 132).

16. Photovoltaic thermal module (100) according to claim 14 or 15, wherein the cooling tubes (120) and / or the hollow tubes (131, 132) are each designed as aluminum extruded tubes.

17. Photovoltaic-thermal module (100) according to one of claims 14 to 16, wherein the cooling device (110) has a first and a second side tube (140), wherein the first and a second side tube (141, 142) extend transversely to the cooling tubes (120) and the cooling tubes (120) are arranged between the first and the second side tube (141, 142), and wherein the cooling tubes (120) are each fluidly connected to the first and the second side tube (141, 142).

18. Photovoltaic-thermal module (100) according to claim 17, wherein the first and the second side tube (141, 142) each have a plastic tube or are formed from a plastic tube.

19. Photovoltaic thermal module (100) according to one of claims 14 to 18, wherein the cooling tubes (120) each have an outer fin structure (122). P2024, 0937 WO N September 24, 2025 - 38 - 20. Solar system comprising a plurality of photovoltaic-thermal modules according to any one of claims 14 to 19, wherein the cooling devices (110) of the photovoltaic-thermal modules (100) are connected serially in a fluid-conducting manner.

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