Antenna for emc shielding of a radar chip

Abstract

The invention relates to a shielding device (100), wherein the shielding device (100) has at least one printed circuit board (102), electronic components (104) attached to the printed circuit board (102), a waveguide antenna (106) attached to the printed circuit board (102), and a metal heat distribution element (108), wherein the metal heat distribution element (108) is electrically conductively connected to the waveguide antenna (106), and wherein the waveguide antenna (106) and the metal heat distribution element (108) enclose the electronic components (104) attached to the printed circuit board (102) and are designed such that a Faraday cage (110) results from the waveguide antenna (106) and the metal heat distribution element (108).

Description

1 2023PF02879 Antenna for EMC shielding of a radar chip AREA OF TECHNOLOGY

[0001] The invention relates to the electromagnetic shielding of electronic components on a printed circuit board, in particular the shielding of radar chips coupled to waveguide antennas. STATE OF THE ART

[0002] Radar chips are used in a wide variety of technical fields, particularly in the automotive industry, where they can be used, for example, to detect distances between a vehicle and people or objects surrounding it, as well as for wireless data transmission, such as communication with vehicle computer systems. These radar chips can be mounted on a printed circuit board (PCB). Waveguide antennas can also be attached to the PCB via a waveguide launcher, allowing the radar chip to be coupled to the antenna. The antenna can be a microstrip antenna or a waveguide antenna, especially a cavity waveguide antenna.

[0003] The radar chips can be configured to generate electrical signals, which are converted into electromagnetic waves, particularly radar signals, via the waveguide junction and coupled into the waveguide antenna. The waveguide antenna is configured to radiate the radar signals into space and to receive reflected radar signals. The reflected radar signals are coupled out of the waveguide antenna via the waveguide junction and transformed into electrical signals. These electrical signals can then be received and processed by the radar chip.

[0004] Electromagnetic compatibility (EMC) refers to the protection of electronic components from unwanted electromagnetic interference. Such interference can originate, for example, from other devices located near the electronic components. 2 2023PF02879 may be emitted by other electronic components or devices. The interference signals could impair the functionality of the electronic components, especially the radar chip.

[0005] Document US 2022 / 196792 A1 describes a method for manufacturing a radar sensor. The method involves a printed circuit board (PCB). One surface of the PCB is equipped with a radar transceiver. A waveguide structure made of plastic material is provided. Waveguide channels are formed within the waveguide structure, each with at least one metallically conductive coated sidewall and one open side. The waveguide structure is soldered to a surface of the PCB, with the open side facing the PCB. SUMMARY

[0006] It is an object of the invention to provide an improved shielding device. The objects underlying the invention are solved by the features of the independent claims.

[0007] In one aspect, a shielding device is disclosed which comprises at least a printed circuit board, electronic components attached to the printed circuit board, a waveguide antenna attached to the printed circuit board, and a metallic heat distribution element, wherein the metallic heat distribution element is electrically connected to the waveguide antenna, and wherein the waveguide antenna and the metallic heat distribution element enclose the electronic components attached to the printed circuit board and are designed such that a Faraday cage results from the waveguide antenna and the metallic heat distribution element.

[0008] The Faraday cage completely encloses the electronic components mounted on the circuit board, thus ensuring electromagnetic compatibility for all components. Specifically, the Faraday cage encloses both electronic components located on the same side of the board as the waveguide antenna and those located on the opposite side. Therefore, the Faraday cage effectively shields the electronic components from interference. 3 2023PF02879

[0009] The Faraday cage could thus allow the attachment of further electronic components on the side of the circuit board facing away from the waveguide antenna, while ensuring electromagnetic compatibility for these electronic components on the side of the circuit board facing away from the waveguide antenna.

[0010] According to one example, the shielding device has a radome on the side of the waveguide antenna facing away from the circuit board.

[0011] The radome could protect the waveguide antenna from environmental influences such as contamination, weather-related influences such as rain, snow, or hail, chemical influences such as corrosive agents, and mechanical damage from impacts. Thus, the radome could increase the lifespan of the waveguide antenna.

[0012] In one example, the radome is mechanically connected to the waveguide antenna and / or the metallic heat distribution element. This could increase the mechanical stability of the shielding device, as the radome and the metallic heat distribution element can be attached to more than one other element of the shielding device.

[0013] According to one example, the electrically conductive connection of the metallic heat distribution element with the waveguide antenna includes an electrically conductive connection of the heat distribution element with side walls of the waveguide antenna, a side of the waveguide antenna facing the circuit board and / or a side of the waveguide antenna facing away from the circuit board.

[0014] The electrically conductive connection could be adapted depending on the size of the printed circuit board and / or the size of the waveguide antenna. Advantageously, the electrically conductive connection could be made as an electrically conductive connection between the metallic heat distribution element and the side of the waveguide antenna facing the printed circuit board, if the size of the waveguide antenna is larger than the size of the printed circuit board. This would minimize the size of the metallic heat distribution element, resulting in reduced material consumption and a smaller shielding device. A small shielding device could prove advantageous when integrating the shielding device into other systems or devices, as the space allocated for the shielding device might be limited by the spatial design of the system or device. 4 2023PF02879

[0015] According to one example, the metallic heat distribution element comprises a metal sheet, wherein the metal sheet has a funnel shape with a funnel and the circuit board with the attached electronic components is received by the funnel.

[0016] Designing the metallic heat distribution element as a sheet metal component could allow for advantageous formability, for example, by pressing the metal sheet into a predefined mold. This would enable the funnel shape to be adapted to the spatial dimensions of the circuit board, the radar chip, and / or the waveguide antenna. Furthermore, the funnel shape could be adapted in a material-saving manner compared to, for example, a cuboid box shape. The funnel shape could also allow for a reduction in the size of the shielding device. Finally, the funnel shape could simplify the mounting of the metallic heat distribution element to the waveguide antenna, as it could be mounted by simply slipping it over the circuit board.

[0017] For example, the metallic heat distribution element can be connected to the waveguide antenna and / or the radome by means of an adhesive. Furthermore, the metallic heat distribution element can be mechanically fixed to the waveguide antenna and / or the radome. This fixing can include, in particular, a connection by means of a snap-fit ​​connection, screws, rivets, soldered joints, and / or heat-shrink connections.

[0018] Advantageously, the adhesive element could be used to ensure uniform mechanical tension in the connection between the waveguide antenna and / or the radome. Furthermore, the adhesive element could be used to prevent material weakening, particularly when using the metal sheet enclosed by the metallic heat distribution element. Additionally, using the adhesive element can prevent heat generation during the connection of the metallic heat distribution element to the waveguide antenna and / or the radome, which could otherwise lead to damage to the electronic components mounted on the circuit board, the waveguide antenna, the metallic heat distribution element, and / or the radome.

[0019] The mechanical fixing could be used to achieve higher mechanical strength of the shielding device, which could be particularly advantageous in protecting the waveguide antenna and the electronic components from mechanical shocks. 5 2023PF02879 In particular, mechanical fastening using a snap-fit ​​connection or screws could be advantageous to allow for reversible release of the mechanical fastening. This reversible release could facilitate repairs and / or modifications to the shielding device, such as replacing or adding electronic components. Furthermore, mechanical fastening could be advantageously used to reduce the shielding device's susceptibility to environmental influences such as temperature fluctuations and humidity.

[0020] According to one example, the electronic components mounted on the circuit board include at least one radar chip. The term "radar chip," as used herein, encompasses radar sensors, radar receivers, radar transceivers, and radar systems on integrated circuits.

[0021] According to one example, the metallic heat distribution element is in mechanical contact with the radar chip, with a portion of the metallic heat distribution element forming part of the radar chip's housing. The heat distribution element could thus simultaneously serve to protect the radar chip and dissipate heat from it. Furthermore, this could simplify the structure of the shielding device, since the housing is not a separate element from the metallic heat distribution element.

[0022] According to one example, the radar chip has a thermally conductive material on an area of ​​the radar chip that is in mechanical contact with the metallic heat distribution element. The thermally conductive material may, for example, be thermal paste, a copper sheet, a graphite foil, an aluminum foil, and / or a metal foam. Advantageously, the thermally conductive material could facilitate improved heat dissipation from the radar chip to the heat distribution element.

[0023] According to one example, the metallic heat distribution element has connecting regions and non-connecting regions, wherein the metallic heat distribution element is electrically conductively connected to the waveguide antenna at the connecting regions and / or is in mechanical contact with the radar chip. According to this example, the heat distribution element has a protective coating at the non-connecting regions, wherein the protective coating preferably comprises a plastic coating, a rubber coating, an electroplated coating, and / or a protective lacquer coating. 6 2023PF02879

[0024] According to one example, the metallic heat distribution element exhibits the Protective coating on an outer side facing away from the circuit board and / or on an inner side of the metallic heat distribution element facing the circuit board.

[0025] The protective coating, particularly on the outer surface of the metallic heat spreader facing away from the circuit board, protects the metallic heat spreader from environmental influences. For example, the protective coating could prevent corrosion of the metallic heat spreader. Furthermore, the protective coating could act as impact protection against mechanical stress on the metallic heat spreader. Additionally, the protective coating could prevent oxidation of the metallic heat spreader, thereby maintaining its electrical and / or thermal conductivity. This could increase the service life of the shielding device.Using the electroplated coating as a protective coating could further result in an advantageous increase in the thermal conductivity of the metallic heat distribution element, thereby improving the dissipation of heat from the radar chip.

[0026] According to one example, the metallic heat distribution element and / or the radome have at least one opening, wherein the circuit board and / or the radar chip have at least one connecting element preferably positively engaged in the opening, wherein the connecting element is designed for connecting a connector corresponding to the connecting element for a power supply or communication connection of the radar chip.

[0027] The opening could provide power to the shielding device and allow control of the electronic components, particularly the radar chip, via the communication link. Furthermore, the opening could enable the shielding device to be connected to other electronic components, devices, and / or computer systems outside the shielding device via the communication link. The Faraday cage is maintained due to the form-fitting connection element within the opening. Thus, communication with the electronic components of the shielding device could be established via the connection element without impairing the electromagnetic compatibility of the electronic components with the other electronic components, devices, and / or computer systems. 7 2023PF02879

[0028] According to one example, the opening is an opening of the metallic heat distribution element, wherein the connecting element is designed such that the faradaic cage results from the waveguide antenna, the metallic heat distribution element and the connecting element.

[0029] According to another example, the opening is an opening in the metallic heat distribution element, wherein the shielding device includes the connector and the connector is designed such that the faraday cage results from the waveguide antenna, the metallic heat distribution element and the connector.

[0030] For example, the opening of the metallic heat distribution element could include a bore or a protrusion of the metallic heat distribution element, wherein the bore or protrusion is designed in its shape and spatial dimensions to positively enclose the connector. According to this example, the connector is designed to create a connection to the mating connecting element.

[0031] For example, the connecting element could be a type of "socket" or socket for providing a power supply, and the connector could include a mating plug with a power supply cable for connecting to the socket.

[0032] According to another example, the connector and connecting element could each include a USB plug and USB socket, a coaxial plug and coaxial socket, a subminiature push-on plug and subminiature push-on socket, a subminiature push-on micro plug and subminiature push-on micro socket, a subminiature connector plug and subminiature connector socket, a high-speed data plug and high-speed data socket, or a fiber optic plug and fiber optic socket.

[0033] In particular, the connecting element corresponding to the connector can be attached to an inner surface of the metallic heat distribution element facing the circuit board, behind the opening of the metallic heat distribution element, so that the connection of the connector to the connecting element simultaneously results in a Faraday cage consisting of the waveguide antenna, the metallic heat distribution element, and the connector, while preventing movement of the connector through the opening during the connection process. The connecting element could, for example, be secured behind the opening by the adhesive element. 8 2023PF02879

[0034] It is understood that one or more of the aforementioned examples can be combined with each other, as long as the examples do not exclude each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The following examples are explained in more detail using the drawings. They show:

[0036] Fig. 1A shows a diagram of a lateral cross-section of the shielding device, wherein the metallic heat distribution element, the waveguide antenna and the radome are mechanically connected by the adhesive element.

[0037] Fig. 1B shows a diagram of a lateral cross-section of the shielding device, wherein the radome has an overhang and the metallic heat distribution element, the waveguide antenna and the radome are mechanically connected by the mechanical fixing.

[0038] Fig. 2A shows a diagram of a lateral cross-section of the shielding device, with the metallic heat distribution element in contact with the radar chip.

[0039] Fig. 2B shows a diagram of a lateral cross-section of the shielding device, wherein the metallic heat distribution element has an overhang, and wherein the metallic heat distribution element has the protective coating.

[0040] Fig. 3A shows a diagram of a lateral cross-section of the shielding device, wherein the connecting element is positively engaged in the opening of the metallic heat distribution element.

[0041] Fig. 3B shows a diagram of a lateral cross-section of the shielding device, wherein the connector is positively engaged in the opening of the metallic heat distribution element.

[0042] Fig. 4A shows a diagram of a lateral cross-section of the shielding device, wherein the metallic heat distribution element has an opening, and wherein the connecting element is positively engaged in the opening of the metallic heat distribution element.

[0043] Fig. 4B shows a diagram of a lateral cross-section of the shielding device, wherein the metallic heat distribution element and the radome have openings, and wherein the connecting element is positively engaged in the opening of the metallic heat distribution element. 9 2023PF02879 DETAILED DESCRIPTION

[0044] In the following, similar elements are marked with the same reference symbols.

[0045] Figure 1A shows a diagram of a side cross-section of a shielding device 100, wherein a metallic heat distribution element 108, a waveguide antenna 106, and a radome 200 are mechanically connected by an adhesive element 202. The radome 200 and the adhesive element 202 are to be considered optional features of the shielding device 100.

[0046] A waveguide launcher (or RF port) 306 of the waveguide antenna 106 is mounted on a printed circuit board 102, the waveguide launcher 306 having an open side facing the printed circuit board 102. The open side of the waveguide launcher 306 is configured to couple electromagnetic waves into and out of the waveguide antenna 106. The waveguide antenna 306 can be mounted on the printed circuit board 102, for example, by screws, a snap-in mechanism, or mechanical pressure. Electronic components 104, in particular a radar chip 300, are mounted on the printed circuit board 102.

[0047] The electronic components 104 attached to the circuit board 102 include, for example, resistors, capacitors, coils, diodes, transistors, integrated circuits, microprocessors, oscillators, for example quartz oscillators, and / or transformers.

[0048] The radar chip 300 and the waveguide antenna 106 could, for example, be mounted on the same side of the circuit board 102. Alternatively, the radar chip 300 could be mounted on the opposite side of the circuit board 102 from the waveguide antenna 106, as shown in Figure 1. The circuit board 102 can have vias, the vias of which conductively connect different layers of the circuit board 102. In particular, the through-connections can establish electrical connections between a top layer, a bottom layer, and intermediate layers. The radar chip 300 is configured, by way of example, to generate electrical signals, wherein the electrical signals can be transformed into electromagnetic waves by the waveguide junction 306 and coupled into the waveguide antenna 106. The radar chip 300 is further configured, by way of example, to receive electrical signals, wherein the electrical signals consist of electromagnetic waves received by the waveguide antenna 106 and a 10 2023PF02879 Transformation of the electromagnetic waves into the electrical signals through the waveguide junction 306 results.

[0049] Electrical signals generated by the radar chip 300 can be electrically conducted to the side of the circuit board opposite the radar chip 300 via one or more vias. In particular, the vias can be used to electrically conduct the electrical signals generated by the radar chip 300 to the waveguide junction 306, as well as to electrically conduct the electromagnetic waves received by the waveguide antenna 106 and converted into electrical signals by the waveguide junction 306.

[0050] The radar chip 300 comprises, for example, a processor, memory, and a communication interface. The processor can be configured to execute machine-executable instructions, the execution of which causes the radar chip 300 to generate and / or process electrical signals. The generated and / or processed electrical signals can be transmitted from the radar chip 300 to and received by the waveguide junction 306.

[0051] According to Figure 1A, the metallic heat distribution element 108 is electrically connected to the waveguide antenna 106 on side walls of the waveguide antenna 106. Alternatively, the metallic heat distribution element 108 can also be connected to the side of the waveguide antenna 106 facing away from the circuit board 102 or to the side of the waveguide antenna 106 facing the circuit board. According to Figure 1A, the Faraday cage 110 results from the waveguide antenna 106 and the metallic heat distribution element 108. Since the Faraday cage 110, as shown in Figure 1A, completely encloses the circuit board 102, it provides shielding for all electronic components 104 attached to the circuit board 102.

[0052] As shown in Figure 1A, the circuit board 102 has a length and / or width that is smaller than the length and / or width of the waveguide antenna 106. It is also possible that the length and / or width of the circuit board 102 is greater than or equal to the length and / or width of the waveguide antenna 106.

[0053] According to one example, the length and / or width of the printed circuit board 102 can be smaller than the length and / or width of the waveguide antenna 106, wherein the metallic heat distribution element 108 is electrically connected to the side of the waveguide antenna 106 facing the printed circuit board 102. According to another example, the length 11 2023PF02879 and / or width of the printed circuit board 102 are equal to the length and / or width of the waveguide antenna 106, wherein the metallic heat distribution element 108 is electrically connected to the side walls of the waveguide antenna 106. According to another example, the length and / or width of the printed circuit board 102 can be greater than the length and / or width of the waveguide antenna 106, wherein the metallic heat distribution element 108 is electrically connected to the side of the waveguide antenna 106 facing away from the printed circuit board 102.

[0054] The waveguide antenna 106 can, for example, be a cavity waveguide antenna 106, wherein the cavity waveguide antenna 106 has one or more waveguide channels, the waveguide channels being configured for guiding electromagnetic waves. The waveguide channels can, for example, be configured in the form of a cuboid. The waveguide channels can have slots on a side facing away from the circuit board 102, the slots being configured for coupling out electromagnetic waves and for radiating the electromagnetic waves into free space. The waveguide antenna 106 can be entirely metallic or partially metallized. According to one example, the waveguide antenna 106 can be made entirely of a metallic material, for example, copper. According to another example, the waveguide antenna 106 can be made partially of a metallic material, for example, metallized plastic.According to this example, the waveguide antenna 106 can have a metallic layer located on the plastic on an inside and / or on an outside of the waveguide antenna 106.

[0055] The metallic heat distribution element 108 can, for example, consist of copper and / or aluminum. The metallic heat distribution element can also consist of an alloy, for example, an alloy of copper and aluminum. Furthermore, the alloy can contain other metals, for example, zinc and / or magnesium.

[0056] The metallic heat distribution element 108 can comprise a metal sheet. The metal sheet can, for example, have a thickness between 0.5 mm and 5 mm, preferably between 1 mm and 3 mm. The metal sheet can be an embossed metal sheet which has been formed into a funnel shape by embossing, the funnel shape being designed to enclose the radar chip and the circuit board.

[0057] The Radom 200 can be made of a non-metallic material. For example, the Radom 200 can be made of plastic, in particular polycarbonate, acrylonitrile butadiene styrene, polytetrafluoroethylene, and / or glass fiber reinforced plastic. Furthermore, the 12 2023PF02879 Radom 200, for example, consists of foam, such as polyurethane foam, or a ceramic material.

[0058] The metallic heat distribution element 108 can be mechanically connected to the waveguide antenna 106 and / or the radome 200 by means of an adhesive element 202, as shown in Figure 1A. Furthermore, the radome 200 can be mechanically connected to the waveguide antenna 106 by means of the adhesive element 202. The adhesive element 202 can, for example, be applied to the side walls of the waveguide antenna 106, either on the side facing away from the circuit board 102 or on the side facing the circuit board 102. According to another example, the radome 200 can extend beyond the metallic heat distribution element 108. In this example, the adhesive element can also be applied to an outer surface of the metallic heat distribution element 108 facing away from the circuit board 102, thereby enabling a mechanical connection between the metallic heat distribution element 108 and the radome 200.The adhesive element 202 can, for example, comprise a liquid adhesive, an epoxy resin, an acrylate adhesive and / or a silicone adhesive.

[0059] The features of the shielding device 100 described with respect to Figure 1A, in particular with respect to the materials used, the positions of the waveguide antenna 106 and the radar chip 300 relative to the circuit board 102, as well as the spatial dimensions of the waveguide antenna 106 relative to the circuit board 102, the electrically conductive connection, the mechanical connections, and the electronic components 104 mounted on the circuit board 102, can also be transferred to the following figures and combined with the features shown in the following figures, insofar as these are not marked as alternatives.

[0060] Figure 1B shows a diagram of a lateral cross-section of the shielding device 100, wherein in the variant shown here the radome 200 has an overhang 200' directed towards the circuit board 102 and projecting beyond the waveguide antenna 106, and wherein the metallic heat distribution element 108, the waveguide antenna 106 and the radome 200 are mechanically connected by the mechanical fixing 204.

[0061] The metallic heat distribution element 108 and / or the radome 200 can have contact points, wherein the contact points are for establishing a mechanical fixation 204 of the metallic heat distribution element 108 to the waveguide antenna 106, the circuit board 102 and / or the radome 200, in particular the overhang 200' of the radome 200, 13 2023PF02879 are formed. The mechanical fixing 204 includes, for example, the metallic heat distribution element 108 and the waveguide antenna 106, the circuit board 102 and / or the radome, snap-fit ​​connections, soldered connections, shrink-fit connections, screws and / or rivets. The contact points can be, for example, holes for screws or rivets.

[0062] According to the variant shown in Figure 1B, the metallic heat distribution element 108 is electrically connected to the side walls of the waveguide antenna 106. Furthermore, the mechanical fixing 204 comprises screws 204, wherein the screws 204 mechanically connect the overhang 200' of the radome 200 to the metallic heat distribution element 108, for example by means of the contact points, wherein, according to this example, the contact points comprise the bores for screws in the overhang 200' of the radome 200 and the metallic heat distribution element 108.Alternatively or in addition to the screws 204, the radome 200, in particular the overhang 200' of the radome 200, can be mechanically connected to the waveguide antenna 106 and / or the metallic heat distribution element, for example by means of the adhesive element 202, wherein the adhesive element 202 is attached according to Figure 1B between the radome 200, in particular the overhang 200' of the radome 200, and an outer surface of the metallic heat distribution element 108 facing away from the circuit board 102.

[0063] The features described with respect to Figure 1B, in particular with respect to the overhang 200' of the radome 200 and the mechanical fixing 204, can be transferred to the following figures and combined with the adhesive element 202 shown in Figure 1A.

[0064] Fig. 2A shows a diagram of a lateral cross-section of the shielding device 100, wherein in the variant shown here the metallic heat distribution element 108 is in contact with the radar chip 300.

[0065] The metallic heat distribution element 108 can be located in a connecting area in mechanical contact with the radar chip 300. The metallic heat distribution element 108 can have this mechanical contact with the radar chip 300 on side walls of the radar chip 300 and / or on a side of the radar chip 300 facing away from the circuit board 102. The connecting area can, in particular, form part of a housing 302 of the radar chip 300. Heat generated by the radar chip 300 can be conducted to the metallic heat distribution element 108 via the housing 302 and / or the connecting area of ​​the radar chip 300. 14 2023PF02879

[0066] The housing 302 shown in Figure 2A can extend over the side walls of the radar chip 300 and the side of the radar chip 300 facing away from the circuit board 102, with the area of ​​the housing 302 located on the side of the radar chip facing away from the circuit board 102 being formed by the metallic heat distribution element 108. The contact between the radar chip 300 and the metallic heat distribution element 108 shown in Figure 2A can be transferred to the variants shown in Figures 1A and 1B, as well as to the variants shown in the following figures.

[0067] Fig. 2B shows a diagram of a lateral cross-section of the shielding device 100, wherein in the variant shown here the metallic heat distribution element 108 has an overhang 108' and wherein the metallic heat distribution element 108 further has the protective coating 400.

[0068] The radar chip 300 and / or the metallic heat distribution element 106 can have a thermally conductive material 304 in the area mechanically connecting the radar chip 300 and the metallic heat distribution element 106. The thermally conductive material 304 can, for example, comprise a thermal paste. The thermal paste can, for example, be a polymer-based thermal paste, a ceramic-filled thermal paste, and / or a silicone-based thermal paste.

[0069] In non-connecting areas where the metallic heat distribution element 108 is not electrically conductively connected to the waveguide antenna 106 and is not in contact with the radar chip 300, the metallic heat distribution element 108 can have the protective coating 400, for example, on an inner side facing the circuit board 102 and / or on an outer side facing away from the circuit board 102.

[0070] According to Fig. 2B, the metallic heat distribution element 108 can, for example, have a projection 108' aligned parallel to the circuit board 102. The projection 108' of the metallic heat distribution element can be electrically connected to the side walls, the side facing away from the circuit board 102, and / or the side facing the circuit board 102 of the waveguide antenna 106. According to this example, the radome 200 can be mechanically connected to the projection 108' of the metallic heat distribution element. According to another example, the radome 200 can have a metallization on a region of the radome 200 in contact with the projection 108' of the metallic heat distribution element 108, thus enabling the creation of a soldered connection between the radome 200 and the metallic heat distribution element 108. 15 2023PF02879

[0071] According to another example, the projection 200' of the radome shown in Fig. 1B and Fig. 2A or the projection 108' of the metallic heat distribution element shown in Fig. 2B can further have an angle relative to the circuit board 102.

[0072] The protective coating 400 shown in Figure 2B can be applied analogously to the variants shown in the preceding and following figures, as can the use of the thermally conductive material 304. The projection 108' of the metallic heat distribution element shown in Figure 2B can be considered an alternative to the projection 200' of the radome shown in Figures 1B and 2A.

[0073] Fig. 3A shows a diagram of a lateral cross-section of the shielding device 100, wherein in the variant shown here a connecting element 502 is attached to the side of the radar chip 300 facing away from the circuit board 102, and the connecting element 502 is positively engaged in an opening of the metallic heat distribution element 108, so that the faraday cage 110 results from the waveguide antenna 106, the metallic heat distribution element and the connecting element 502.

[0074] The connecting element 502 can be attached to the printed circuit board 102 or to the radar chip 300. According to one example, the connecting element 502 includes a power supply for the electronic components 104 of the printed circuit board 102 or a power supply for the radar chip 300. According to another example, the connecting element includes a communication connection for the electronic components 104, in particular a communication connection for the radar chip 300. The communication connection can, for example, be a USB connection, a coaxial connection, a subminiature push-on (SMP) connection, a subminiature push-on micro (SMPM) connection, a subminiature connector (SMC) connection, an HSD (high-speed data) connection, or a fiber optic connection. The connecting element 502 is configured to provide the power supply or the communication connection for the electronic components 104, in particular the radar chip 300.

[0075] The opening 500 allows the shielding device 100 to be connected to other electronic components, electronic devices and / or computer systems outside the shielding device 100 via the communication link. For example, the shielding device 100 can be integrated into a vehicle, with the connecting element 502 being designed for connection to a counterpart connector 504, for example a connector 504 “plug” of the vehicle. 16 2023PF02879

[0076] The opening 500 of the metallic heat distribution element 108 can, for example, comprise a bore and / or a protrusion of the metallic heat distribution element 108. The opening 500 can, for example, have a rectangular, circular, or elliptical shape. The opening 500 has a length and width or a diameter that allows for a positive-locking engagement of the connecting element 502 in the opening 500, so that the Faraday cage 110 in the opening 500 is maintained by the connecting element 502.

[0077] Fig. 3B shows a diagram of a lateral cross-section of the shielding device 100, wherein in the variant shown here a connector 504 is positively engaged in an opening of the metallic heat distribution element 108, so that the faraday cage 110 results from the waveguide antenna 106, the metallic heat distribution element and the connector 504.

[0078] The opening 500 of the metallic heat distribution element 108 can, for example, comprise a bore and / or a protrusion of the metallic heat distribution element 108. The opening 500 can, for example, have a rectangular, circular, or elliptical shape. The opening 500 has a length and width or a diameter that allows for a positive-locking fit of the connector 504 in the opening 500, so that the Faraday cage 110 in the opening 500 is maintained by the connector 504.

[0079] The production of the faraday cage 110 shown in Figure 3A and Figure 3B by means of the connecting element 502 or the connector 504 which is positively engaged in the opening 500 can be combined with the variants shown in the previous figures.

[0080] Fig. 4A shows a diagram of a lateral cross-section of the shielding device 100, wherein the variant shown here can be combined with the variants shown in Figures 1A and 1B, as well as with the projections 108', 200' and the protective coating 400 shown in Figures 2A and 2B.

[0081] In the variant shown in Figure 4A, the metallic heat distribution element 108 has an opening 500, wherein a first connecting element 502 is attached to the side of the radar chip 300 facing away from the circuit board 102, and the first connecting element 502 is connected to a second connecting element 502" via an extension cable 502', the second connecting element 502" being positively engaged in the opening of the metallic heat distribution element 108. It is also possible that the first 17 2023PF02879 Connecting element 502 is attached to a side wall of the radar chip 300 or to the circuit board 102.

[0082] The opening 500 of the metallic heat distribution element 108 can, for example, comprise a bore and / or a protrusion of the metallic heat distribution element 108. The opening 500 can, for example, have a rectangular, circular, or elliptical shape. The opening 500 has a length and width or diameter that allows for a positive-locking engagement of the second connecting element 502" in the opening 500, so that the Faraday cage 110 in the opening 500 is maintained by the second connecting element 502".

[0083] Fig. 4B shows a diagram of a lateral cross-section of the shielding device, wherein the variant shown here can be combined with the variants shown in Figures 1A and 1B, as well as with the projections 108', 200', the protective coating 400 and the thermally conductive material 304 shown in Figures 2A and 2B.

[0084] In the variant shown in Figure 4B, the metallic heat distribution element 108 and the radome 200 have openings 500, wherein a first connecting element 502 is attached to a side wall of the radar chip 300, and the first connecting element 502 is connected to a second connecting element 502" via an extension cable 502', and wherein the extension cable 502' is positively engaged in the opening 500 of the metallic heat distribution element 108 and the second connecting element 502" is positively engaged in the opening 500 of the radome 200.

[0085] The opening 500 of the metallic heat distribution element 108 can, for example, comprise a bore and / or a protrusion of the metallic heat distribution element 108. The opening 500 can, for example, have a rectangular, circular, or elliptical shape. The opening 500 has a length and width or a diameter that allows the extension cable 502' to be positively engaged in the opening 500 of the metallic heat distribution element 108, so that the Faraday cage 110 in the opening 500 is maintained by the extension cable 502'.

[0086] According to another variant, the extension cable 502' shown in Figure 4A and Figure 4B can pass through an opening 500 of the circuit board 102.

[0087] Although the invention is illustrated and described in detail in the drawings and the preceding description, this illustration and description 2023PF02879 is to be considered exemplary and not limiting; the invention is not limited to the disclosed embodiments. 19 2023PF02879 LIST OF REFERENCE MARKS 100 shielding device 102 circuit board 104 electronic components 106 Waveguide antenna 108 metallic heat distribution element 108' Projection of the metallic heat distribution element 110 Faraday cage 200 Radome 200' overhang of the radome 202 adhesive element 204 mechanical fixation 300 radar chips 302 Cases 304 thermally conductive material 306 Waveguide transition 400 protective coating 500 opening 502, 502" connecting element 502' extension cable 504 connectors

Claims

20 2023PF02879 REQUIREMENTS 1. Shielding device (100), wherein the shielding device (100) comprises at least a printed circuit board (102), electronic components (104) attached to the printed circuit board, a waveguide antenna (106) attached to the printed circuit board, and a metallic heat distribution element (108), wherein the metallic heat distribution element (108) is electrically connected to the waveguide antenna (106), and wherein the waveguide antenna (106) and the metallic heat distribution element (108) enclose the electronic components (104) attached to the printed circuit board (102) and are configured such that a Faraday cage (110) results from the waveguide antenna (106) and the metallic heat distribution element (108).

2. Shielding device (100) according to claim 1, wherein the shielding device (100) has a radome (200) on a side of the waveguide antenna (106) facing away from the circuit board (102), wherein the radome (200) is in particular mechanically connected to the waveguide antenna (106) and / or to the metallic heat distribution element (108).

3. Shielding device (100) according to one of the preceding claims, wherein the electrically conductive connection of the metallic heat distribution element (108) with the waveguide antenna (106) comprises an electrically conductive connection of the heat distribution element (108) with side walls of the waveguide antenna (106).

4. Shielding device (100) according to one of the preceding claims, wherein the electrically conductive connection of the metallic heat distribution element (108) with the waveguide antenna (106) comprises an electrically conductive connection of the heat distribution element (108) with a side of the waveguide antenna (106) facing the circuit board (102). 21 2023PF02879 5. Shielding device (100) according to one of the preceding claims, wherein the electrically conductive connection of the metallic heat distribution element (108) with the waveguide antenna (106) comprises an electrically conductive connection of the heat distribution element (108) with a side of the waveguide antenna (106) facing away from the circuit board (102).

6. Shielding device (100) according to one of the preceding claims, wherein the metallic heat distribution element (108) comprises a metal sheet, and wherein the metal sheet has a funnel shape with a funnel and the circuit board (102) with the attached electronic components (104) is received by the funnel.

7. Shielding device (100) according to one of the preceding claims, wherein the metallic heat distribution element (108) is connected to the waveguide antenna (106) by an adhesive element (202).

8. Shielding device (100) according to one of claims 1 to 6, wherein the metallic heat distribution element (108) is mechanically fixed to the waveguide antenna (106), wherein the fixing (204) in particular comprises a connection by means of a snap connection, screws, rivets, soldered connections, and / or shrink connections.

9. Shielding device (100) according to one of the preceding claims, wherein the electronic components (104) attached to the circuit board (102) comprise at least one radar chip (300).

10. Shielding device (100) according to claim 9, wherein the metallic heat distribution element (108) is in mechanical contact with the radar chip (300), wherein the radar chip (300) preferably has a thermally conductive material (304) on an area of ​​the radar chip (300) that is in mechanical contact with the metallic heat distribution element (108).

11. Shielding device (100) according to claim 10, wherein the metallic heat distribution element (108) has connecting areas and non-connecting areas, wherein the metallic heat distribution element (108) is electrically conductively connected to the waveguide antenna (106) at the connecting areas and / or 22 2023PF02879 is in mechanical contact with the radar chip (300) and wherein the heat distribution element has a protective coating (400) on the non-connecting areas, wherein the protective coating (400) preferably comprises a plastic coating, a rubber coating, an electroplated coating and / or a protective lacquer coating, in particular wherein the metallic heat distribution element (108) has the protective coating (400) on an outer side facing away from the circuit board (102) and / or on an inner side of the metallic heat distribution element (108) facing the circuit board (102).

12. Shielding device (100) according to one of claims 9 to 11, wherein the metallic heat distribution element (108) has at least one opening (500), and wherein the circuit board (102) and / or the radar chip (300) have at least one connecting element (502) preferably positively received in the opening (500), wherein the connecting element (502) is designed for connecting a connector (504) corresponding to the connecting element (502) for a power supply or communication connection of the radar chip (300).

13. Shielding device (100) according to claim 12, wherein the opening (500) is an opening of the metallic heat distribution element (108), wherein a. the connecting element (502) is configured such that the faraday cage (110) results from the waveguide antenna (106), the metallic heat distribution element (108) and the connecting element (502), or b. the shielding device (100) comprises the connector (504) and the connector is configured such that the faraday cage (110) results from the waveguide antenna (106), the metallic heat distribution element (108) and the connector (504).

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