Cooling plate
The cooling plate design with an expanded upstream channel and narrowing connecting channel section addresses air accumulation issues, ensuring effective cooling by maintaining high coolant flow velocity and thermal conductivity, particularly when coolant flows against gravity.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- AISIN CORP
- Filing Date
- 2025-12-08
- Publication Date
- 2026-06-25
AI Technical Summary
Existing cooling plates face issues with air accumulation in the upper portion of cooling channels when coolant flows against gravity, leading to reduced thermal conductivity and ineffective cooling of electronic components.
The cooling plate design features an expanded channel section with a wider upstream channel section and a connecting channel section that narrows to increase coolant flow velocity, preventing air accumulation and enhancing cooling efficiency.
This design effectively suppresses air layer formation, ensuring efficient cooling of electronic components by maintaining high coolant flow velocity and thermal conductivity, even when coolant flows against gravity.
Smart Images
Figure JP2025042703_25062026_PF_FP_ABST
Abstract
Description
Cooling plate
[0001] The present disclosure relates to a cooling plate.
[0002] Conventionally, there is known a cooling plate that suppresses a temperature rise by cooling an electronic component by bringing a heat-generating electronic component into contact with or close to the surface and absorbing the generated heat into a coolant flowing inside. As a technique related to such a cooling plate, for example, there is one described in Patent Document 1 cited below.
[0003] Patent Document 1 discloses a metal cooling plate (a housing and a second lid in Patent Document 1) that suppresses a temperature rise by cooling a plurality of electronic components by absorbing heat generated from a plurality of electronic components (heat-generating components in Patent Document 1) having different mounting heights mounted on one substrate into a coolant (a refrigerant in Patent Document 1) flowing through a cooling channel. In this cooling plate, steps are provided in the cooling channel according to the mounting heights of the plurality of electronic components to change the height, so that the thickness of the partition wall between each of the cooling channel and the plurality of electronic components is made the same. Thereby, any of the plurality of electronic components having different mounting heights is cooled equally.
[0004] Japanese Patent Application Laid-Open No. 2018-49870
[0005] In the cooling plate of Patent Document 1, the coolant is configured to flow in the opposite direction to the gravitational direction (from bottom to top) at the step portion of the cooling channel. When the coolant flows in the opposite direction to the gravitational direction, air mixed in the coolant may accumulate in the upper portion of the cooling channel, and there is a possibility that an air layer may be formed by the accumulated air. Since air has a lower thermal conductivity than the partition wall of the metal cooling plate, if an air layer is formed in the upper portion of the cooling channel, it becomes difficult to absorb the heat generated by the electronic component with the coolant. In this case, there is a possibility that the cooling of the electronic component may be inhibited, and there was room for improvement.
[0006] Therefore, there has been a demand for a cooling plate in which air hardly accumulates in the upper portion of a cooling channel having a portion where the coolant flows in the opposite direction to the gravitational direction.
[0007] One embodiment of the cooling plate according to the present disclosure is a cooling plate having a plate surface in which an electronic component to be cooled comes into contact, wherein a cooling channel is formed inside the cooling plate through which a coolant capable of cooling the electronic component flows, and the cooling channel has an expanded channel section, an upstream channel section provided upstream of the expanded channel section in the direction of flow of the coolant, and a connecting channel section connecting the expanded channel section and the upstream channel section, wherein the expanded channel section is configured such that the portion in contact with the electronic component on the plate surface is higher than the upstream channel section when viewed in a direction along the plate surface, thereby expanding the cross-sectional area of the channel, the channel width of the upstream channel section is set to be wider than the channel width of the expanded channel section when viewed in a direction perpendicular to the plate surface, and the connecting channel section is configured to narrow from the connection point with the upstream channel section toward the connection point with the expanded channel section when viewed in a direction perpendicular to the plate surface.
[0008] In the cooling plate according to this embodiment, the flow width of the upstream flow channel is set to be wider than the flow width of the enlarged flow channel when viewed perpendicular to the plate surface, and the connecting flow channel is configured to narrow from the connection point with the upstream flow channel to the connection point with the enlarged flow channel. With the cooling plate configured in this way, the flow velocity of the coolant can be rapidly increased at the connection point between the enlarged flow channel and the connecting flow channel while suppressing pressure loss of the coolant flowing through the cooling channel. When a fast-flowing coolant flows into the enlarged flow channel, air is less likely to accumulate in the upper part of the enlarged flow channel in the direction of gravity compared to when the flow velocity is slow, and the generation of an air layer in that part is suppressed. As a result, the electronic components to be cooled can be cooled effectively. In this way, a cooling plate has been obtained in which air is less likely to accumulate in the upper part of the cooling channel having a portion in which the coolant flows in the opposite direction to the direction of gravity.
[0009] This is a perspective view showing the schematic configuration of a power control unit including a cooling plate according to this embodiment. This is a cross-sectional view taken along the line II-II in Figure 1. This is a cross-sectional view taken along the line III-III in Figure 1. This is a cross-sectional view taken along the line IV-IV in Figure 1.
[0010] The embodiments of the cooling plate according to this disclosure will be described in detail below with reference to the drawings. The embodiments described below are illustrative examples for illustrating the cooling plate according to this disclosure, and the cooling plate is not limited to these embodiments. Therefore, the cooling plate according to this disclosure can be implemented in various forms without departing from its essence.
[0011] [Cooling Plate Configuration] Figure 1 shows a power control unit B including a cooling plate A, which is installed in vehicles (not shown) such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs).
[0012] The power control unit B according to this embodiment is composed of a cooling plate A and a plurality of electronic components that are to be cooled by the cooling plate A. The cooling plate A is composed of a pair of upper plate members 10 and lower plate members 11 made of a metal with high thermal conductivity such as aluminum, joined together by welding or the like (see Figures 1 and 2). The plurality of electronic components specifically include a pair of primary power modules 1 and 2, a secondary power module 2, a transformer coil 3, a first FET 4 (an example of an electronic component), a PFC coil 5, a second FET 6 (an example of an electronic component), a secondary coil 7, and an inverter 8. Note that the cooling plate A does not necessarily have to be composed of an upper plate member 10 and a lower plate member 11. The cooling plate A may be composed of one component or of three or more components.
[0013] Since the cooling plate A is installed on the vehicle in the position shown in Figure 1, the vertical relationship of each part of the cooling plate A will be explained in accordance with this position. Hereinafter, the vertical direction will be referred to as the Z direction, the side and direction in which the upper plate member 10 is positioned relative to the lower plate member 11 will be referred to as the Z1 side and Z1 direction, and the side and direction in which the lower plate member 11 is positioned relative to the upper plate member 10 will be referred to as the Z2 side and Z2 direction. In this case, the Z2 direction is the direction of gravity, and the Z1 direction is the direction opposite to the direction of gravity (hereinafter also referred to as the "anti-gravity direction").
[0014] Of the multiple electronic components, a pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 are arranged on the Z1 side, which is the side of the upper plate member 10 of the cooling plate A, and the inverter 8 is arranged on the Z2 side, which is the side of the lower plate member 11. The pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 arranged on the Z1 side are mounted on a single substrate (not shown) or multiple substrates (not shown) arranged at the same height. In other words, the mounting surfaces of the substrates on which the pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 are mounted are at the same height.
[0015] Inside the cooling plate A, a cooling channel P is formed by grooves formed in at least one of a pair of upper plate members 10 and lower plate members 11. Coolant F flows through the cooling channel P. The coolant F absorbs the heat generated by multiple electronic components contained in the power control unit B and suppresses the temperature rise of these electronic components. Hereinafter, this effect of the coolant F will also be simply referred to as "the coolant F cools the electronic components." The lower plate member 11 has a supply port Pa at one end of the cooling channel P and an outlet port Pb at the other end of the cooling channel P. The coolant F flowing outside the cooling plate A flows into the cooling plate A from the supply port Pa, flows through the cooling channel P, and is discharged to the outside from the outlet port Pb. The coolant F includes cooling water such as antifreeze or long-life coolant mainly composed of ethylene glycol, or cooling oil composed of insulating oil such as paraffin. In other words, coolant F is a general term for cooling water and cooling oil.
[0016] As shown in Figure 1, the upper plate member 10 has a plate surface 10a that contacts each of the primary power module 1, secondary power module 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7. Specifically, the plate surface 10a is part of the first cooling section C1 that the pair of primary power modules 1 contact, the second cooling section C2 that the secondary power module 2 contact, the third cooling section C3 that the transformer coil 3 contact, the fourth cooling section C4 that the first FET 4 contact, the fifth cooling section C5 that the PFC coil 5 contact, the sixth cooling section C6 that the second FET 6 contact, and the seventh cooling section C7 that the secondary coil 7 contacts. In this embodiment, the plate surface 10a is a plane perpendicular to the Z direction (horizontal plane). The cooling channel P is formed at least directly below (on the Z2 side of) each of the plate surfaces 10a from the first cooling section C1 to the seventh cooling section C7. The thickness of the wall between the plate surface 10a and the cooling channel P in the upper plate member 10 (the distance between the plate surface 10a and the cooling channel P) is preferably as thin as possible while ensuring the necessary strength of the upper plate member 10. This allows the coolant F flowing through the cooling channel P to effectively cool the electronic components.
[0017] As shown in Figure 1, the primary power module 1, secondary power module 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7, mounted on a mounting surface of the same height, each have different heights (lengths along the Z direction). To cool these electronic components with different heights using the coolant F, the flow path height (length along the Z direction) of the cooling channel P changes according to the height of the opposing electronic component. That is, in areas facing lower-height electronic components (for example, the primary power module 1, the first FET 4, and the second FET 6), the flow path height of the cooling channel P is increased in the Z1 direction (anti-gravity direction) to approach the electronic component, thereby relatively increasing the flow path cross-sectional area. In other words, the flow path is configured such that the portion of the plate surface 10a that contacts lower-height electronic components (for example, the primary power module 1, the first FET 4, and the second FET 6) is formed to be higher in the Z1 direction (upward in the direction of gravity), thereby relatively increasing the flow path cross-sectional area. On the other hand, in areas corresponding to tall electronic components (for example, the secondary power module 2, the transformer coil 3, the PFC coil 5, and the secondary coil 7), the height of the cooling channel P is reduced to relatively decrease the cross-sectional area of the channel. Hereinafter, the area of the cooling channel P in which the channel height is increased in the Z1 direction to relatively increase the cross-sectional area of the channel compared to other areas will be referred to as the enlarged channel section P1.
[0018] In this embodiment, the portion of the cooling channel P that constitutes the fourth cooling section C4 and the sixth cooling section C6, where the first FET 4 and the second FET 6 are in contact, is defined as the enlarged channel section P1. Although the channel height of the cooling channel P in the first cooling section C1 is relatively high, the cooling channel P in the first cooling section C1 is directly connected to the supply port Pa, and is therefore excluded from the enlarged channel section P1 in this embodiment.
[0019] As shown in Figure 2, the inner wall surface of the expanded flow channel P1 constituting the sixth cooling section C6 extends from the inlet P12 at the upstream end of the expanded flow channel P1 in a direction inclined toward the Z1 direction and downstream towards the second FET 6, extends from the end in the inclined direction in close proximity to and parallel to the plate surface 10a, and extends from the parallel end in a direction inclined toward the Z2 direction and downstream towards the second FET 6. In other words, when viewed along the direction perpendicular to the flow direction of the coolant F and the Z direction, the expanded flow channel P1 has a trapezoidal shape. Hereinafter, the two wall surfaces of the inner wall surface constituting the expanded flow channel P1 that extend in a direction inclined toward the Z direction will be referred to as inclined surfaces P11. That is, the expanded flow channel P1 has inclined surfaces P11 that extend from the inlet P12 to the part that contacts the electronic component (second FET 6). Note that the expanded flow channel P1 constituting the fourth cooling section C4 has a similar configuration, so a detailed explanation will be omitted.
[0020] As shown in Figure 2, when considering a virtual extension surface (shown by a dashed line) that extends in the direction of the plate surface 10a along the two inclined surfaces P11 in the enlarged flow channel P1, the second FET 6 is positioned such that the contact surface between the second FET 6 and the plate surface 10a is located inside the virtual intersection lines L1 and L2 where the virtual extension surface and the plate surface 10a intersect. That is, the contact surface between the second FET 6 and the plate surface 10a is located downstream of the virtual intersection line L1 on the upstream side in the flow direction of the coolant F, and upstream of the virtual intersection line L2 on the downstream side in the flow direction. By positioning the second FET 6 in this way, the entire contact surface between the second FET 6 and the plate surface 10a faces the coolant F in the closest possible position, so the second FET 6 is effectively cooled by the coolant F. The contact surface between the first FET 4 and the plate surface 10a is also positioned in the same location as the second FET 6.
[0021] In this embodiment, the upstream channel section P2 is located upstream of the expanded channel section P1. The expanded channel section P1 has a higher channel height in the Z1 direction (anti-gravity direction) relative to the upstream channel section P2, and the channel cross-sectional area is expanded. In other words, the expanded channel section P1 is formed such that the portion that contacts low-height electronic components (e.g., primary power module 1, first FET 4, second FET 6) on the plate surface 10a is higher than the upstream channel section P2 when viewed in a direction perpendicular to the Z direction (view along the plate surface 10a), thereby relatively expanding the channel cross-sectional area. The upstream channel section P2 is formed such that it is lower in the Z2 direction (gravity direction) than the portion that contacts low-height electronic components (first FET 4 and second FET 6) on the plate surface 10a, thereby configuring the channel. In this case, if the flow velocity of the coolant F flowing from the upstream channel P2 to the expanded channel P1 is slow, air mixed in the coolant F may accumulate on the Z1 side of the expanded channel P1, potentially creating an air layer. Since air has a lower thermal conductivity than the metal cooling plate A (upper plate member 10), if an air layer forms on the Z1 side of the expanded channel P1, the first FET 4 and the second FET 6 will be less effectively cooled by the coolant F.
[0022] Therefore, this embodiment has the configuration shown in Figure 3. Figure 3 shows an enlarged section cross-sectional view extending from the enlarged flow channel P1 to the upstream flow channel P2 that constitutes the sixth cooling section C6. As shown in Figure 3, in a plan view along the direction perpendicular to the plate surface 10a (Z direction), the upstream flow channel width W2 (an example of a flow channel width), which is the flow channel width of the upstream flow channel P2 of the cooling channel P, is wider than the enlarged flow channel width W1 (an example of a flow channel width), which is the flow channel width of the enlarged flow channel P1. A connecting flow channel P3 is provided between the upstream flow channel P2 and the enlarged flow channel P1. In a plan view along the direction perpendicular to the plate surface 10a (Z direction), the connecting flow channel P3 is configured to narrow from the connection point with the upstream flow channel P2 toward the inlet P12 of the enlarged flow channel P1 (an example of a connection point between the enlarged flow channel P1 and the connecting flow channel P3). Therefore, in the cooling plate A, by providing a connecting flow channel P3, the upstream flow channel width W2 is gradually narrowed (restricted) to the enlarged flow channel width W1, thereby reducing the flow channel cross-sectional area. As the flow channel cross-sectional area of the cooling flow channel P decreases, the flow velocity of the circulating coolant F increases, and the coolant F with increased flow velocity flows into the inlet P12 of the enlarged flow channel P1.
[0023] In the upstream side of the sixth cooling section C6 of this embodiment, as shown in Figure 3, each of the walls on both sides of the connecting channel section P3 is curved in a plan view so as to bulge outward relative to the inlet P12 (the connection point between the expanded channel section P1 and the connecting channel section P3). Furthermore, the connecting channel section P3 and the expanded channel section P1 are connected such that the angle θ between the extensions of the walls on both sides of the downstream end of the connecting channel section P3 and the wall at the upstream end of the expanded channel section P1 is obtuse. With the connecting channel section P3 and the expanded channel section P1 connected in this way, the flow velocity of the coolant F flowing through the cooling channel P can be rapidly increased at the inlet P12 of the expanded channel section P1 while suppressing pressure loss of the coolant F. In this way, when a high-velocity coolant F flows into the expanded channel section P1, air is less likely to accumulate in the Z1 direction (anti-gravity direction) of the expanded channel section P1 that is close to the second FET 6, compared to when the flow velocity is slow, and the generation of an air layer in that area is suppressed. Therefore, the second FET 6 can be efficiently cooled by the coolant F.
[0024] Figure 4 shows an enlarged cross-sectional view of the fourth cooling section C4, extending from the enlarged flow channel P1 to its upstream flow channel P2. As shown in Figures 1 and 4, in a plan view, the flow direction of the coolant F at the inlet P12 of the enlarged flow channel P1 (the connection point between the enlarged flow channel P1 and the connecting flow channel P3) intersects the flow direction of the coolant F at the point in the upstream flow channel P2 connected to the upstream end of the connecting flow channel P3 (the connection point between the upstream flow channel P2 and the connecting flow channel P3). Specifically, the flow direction of the coolant F at the downstream end of the connecting flow channel P3 (inlet P12) intersects the flow direction of the coolant F at the upstream end of the connecting flow channel P3 at a 90-degree angle. That is, the upstream and downstream ends of the connecting flow channel P3 are curved at a 90-degree angle, and the connecting flow channel P3 bends the flow direction of the coolant F by 90 degrees.
[0025] In the expanded flow channel P1 that constitutes the fourth cooling section C4, the upstream flow channel width W2 of the cooling channel P2 is configured to be wider than the expanded flow channel width W1 of the expanded flow channel P1 when viewed from above. A connecting flow channel P3 is provided between the upstream flow channel P2 and the expanded flow channel P1. As a result, the flow direction of the coolant F is bent by 90 degrees in the connecting flow channel P3, and the upstream flow channel width W2 is gradually narrowed (constricted) to the expanded flow channel width W1, thereby reducing the flow channel cross-sectional area. Consequently, the coolant F, with its increased flow velocity, flows into the inlet P12 of the expanded flow channel P1.
[0026] Upstream of the fourth cooling section C4, as shown in Figure 4, in a plan view, the radially outer (left) and radially inner (right) walls of the connecting channel section P3 are curved so as to bulge outward relative to the inlet P12. Furthermore, the connecting channel section P3 and the expanding channel section P1 are connected such that the angle θ between the extension of the radially outer wall at the downstream end of the connecting channel section P3 and the wall at the upstream end of the expanding channel section P1 is obtuse. With the connecting channel section P3 and the expanding channel section P1 connected in this way, the flow velocity of the coolant F flowing through the cooling channel P can be rapidly increased at the inlet P12 of the expanding channel section P1 while suppressing pressure loss of the coolant F. In this way, when a high-velocity coolant F flows into the expanding channel section P1, air is less likely to accumulate in the Z1 direction (anti-gravity direction) of the expanding channel section P1 that is close to the first FET 4, compared to when the flow velocity is slow, and the generation of an air layer in that area is suppressed. Therefore, the first FET 4 can be efficiently cooled by the coolant F.
[0027] [Other Embodiments] (1) In the above embodiment, the pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 are all in contact with the plate surface 10a of the upper plate member 10. However, they may also be placed in close proximity to the plate surface 10a without contacting it, as long as this does not significantly hinder heat conduction. In this case, it is preferable that the distance between the plate surface 10a and these electronic components be as close as possible. Alternatively, a heat conductive sheet may be placed between the plate surface 10a and these electronic components. By placing a heat conductive sheet, the heat generated by these electronic components can be efficiently transferred to the coolant F via the sheet. A gap filler may be placed instead of a heat conductive sheet. "In contact" includes all of these embodiments.
[0028] (2) In the above embodiment, the degree of inclination of the inclined surface P11 of the expanded flow channel P1 with respect to the Z direction was made the same on the upstream and downstream sides of the cooling flow channel P, but the degree of inclination of the inclined surface P11 may be different on the upstream and downstream sides. Furthermore, the degree of inclination of the inclined surface P11 of the expanded flow channel P1 with respect to the Z direction is preferably as steep as possible, as long as no air layer is generated. This is because the size of the cooling plate A can be reduced and the length of the flow channel in the part close to the electronic components can be increased.
[0029] (3) In the sixth cooling section C6 of the above embodiment, the connecting flow channel P3 is formed so as not to change the flow direction of the coolant F, and in the fourth cooling section C4, the connecting flow channel P3 is configured to change the flow direction of the coolant F by 90 degrees. However, the amount of change (angle of change) in the flow direction of the coolant F in the connecting flow channel P3 can be changed in any direction depending on the configuration of the cooling channel P formed in the cooling plate A.
[0030] (4) In the above embodiment, the walls on both sides of the connecting channel P3 are curved in a plan view so as to bulge outward relative to the connection portion between the enlarged channel P1 and the connecting channel P3, but the embodiment is not limited to this. For example, the walls on both sides of the connecting channel P3 may be tapered in a plan view. Alternatively, the walls on both sides of the connecting channel P3 may have a stepped shape so that the distance between them decreases in stages. However, from the viewpoint of reducing the pressure loss of the coolant F in the connecting channel P3, it is preferable that no steps are formed on the walls on both sides of the connecting channel P3.
[0031] (5) In the above embodiment, the plate surface 10a is configured to be a plane (horizontal plane) perpendicular to the Z direction (direction of gravity), but the invention is not limited to this. The plate surface 10a may be a plane that intersects with the Z direction (direction of gravity). That is, the cooling plate A may be used in a position where the plate surface 10a is horizontal, or it may be used in a position where the plate surface 10a is tilted with respect to the horizontal.
[0032] In the cooling plate A described in the above embodiment, the following configuration can be envisioned.
[0033] <1> One embodiment of the cooling plate (A) is a cooling plate (A) having a plate surface (10a) in contact with the electronic components (4, 6) to be cooled, wherein the cooling plate (A) has a cooling channel (P) formed inside through which a coolant (F) capable of cooling the electronic components (4, 6) flows, and the cooling channel (P) has an expanded channel section (P1), an upstream channel section (P2) provided upstream of the expanded channel section (P1) in the direction of flow of the coolant (F), and a connecting channel section (P3) connecting the expanded channel section (P1) and the upstream channel section (P2), and the expanded channel section (P1) is the plate surface (10a In the above, the portion that comes into contact with the electronic components (4, 6) is formed to be higher than the upstream channel (P2) when viewed in a direction along the plate surface (10a), thereby expanding the channel cross-sectional area. When viewed in a direction perpendicular to the plate surface (10a), the channel width (W2) of the upstream channel (P2) is set to be wider than the channel width (W1) of the expanded channel (P1). When viewed in a direction perpendicular to the plate surface (10a), the connecting channel (P3) is configured to become narrower from the connection point with the upstream channel (P2) to the connection point with the expanded channel (P1).
[0034] In the cooling plate (A) according to this embodiment, the flow width (W2) of the upstream flow channel (P2) is set to be wider than the flow width (W1) of the expanding flow channel (P1) when viewed in a direction perpendicular to the plate surface (10a), and the connecting flow channel (P3) is configured to narrow from the connection point with the upstream flow channel (P2) toward the connection point with the expanding flow channel (P1). With the cooling plate (A) configured in this way, the flow velocity of the coolant (F) flowing through the cooling channel (P) can be rapidly increased at the connection point between the expanding flow channel (P1) and the connecting flow channel (P3) (the inlet (P12) of the expanding flow channel (P1)). When a fast-flowing coolant (F) flows into the expanding flow channel (P1), air is less likely to accumulate in the upper part of the expanding flow channel (P1) in the direction of gravity compared to when the flow velocity is slow, and the generation of an air layer in that part is suppressed. This allows for effective cooling of the electronic components (4, 6) to be cooled. In this way, a cooling plate (A) was obtained in which air is less likely to accumulate in the upper part of the cooling channel (P) through which the coolant (F) flows from bottom to top in the direction of gravity.
[0035] <2> In the cooling plate (A) described in <1> above, it is preferable that, when viewed in a direction perpendicular to the plate surface (10a), each of the wall surfaces on both sides of the connecting channel section (P3) is formed to curve outward relative to the connection portion (inlet (P12)) between the enlarged channel section (P1) and the connecting channel section (P3).
[0036] According to this embodiment, the coolant (F) flows along the curved wall surface of the connecting channel section (P3) toward the expanded channel section (P1), thereby further suppressing pressure loss of the coolant (F).
[0037] <3> In the cooling plate (A) described in <2> above, it is preferable that the direction of flow of the coolant (F) at the connection point between the expanded flow channel (P1) and the connecting flow channel (P3) (the inlet (P12) of the expanded flow channel (P1)) intersects with the direction of flow of the coolant (F) at the connection point between the upstream flow channel (P2) and the connecting flow channel (P3).
[0038] According to this embodiment, the direction of flow of the coolant (F) at the connection point between the expanded flow channel (P1) and the connecting flow channel (P3) (the inlet (P12) of the expanded flow channel (P1)) intersects with the direction of flow of the coolant (F) at the connection point between the upstream flow channel (P2) and the connecting flow channel (P3) (the point where the upstream flow channel (P2) is connected to the upstream end of the connecting flow channel (P3)). Even in such a case, the direction of flow of the coolant (F) can be changed by the connecting flow channel (P3) with curved walls on both sides, so that the flow velocity of the coolant (F) can be rapidly increased at the connection point between the expanded flow channel (P1) and the connecting flow channel (P3) (the inlet (P12) of the expanded flow channel (P1)) while suppressing pressure loss of the coolant (F) flowing through the cooling channel (P) (see Figure 4).
[0039] <4> In the cooling plate (A) described in <1> to <3> above, the expanded flow channel (P1) has an inclined surface (P11) that extends from the connection portion with the connecting flow channel (P3) (inlet (P12)) to the portion that contacts the electronic components (4, 6), and it is preferable that the entire contact surface between the electronic components (4, 6) and the plate surface (10a) is located downstream in the flow direction of the coolant (F) from the virtual intersection line (L1) where the virtual extension surface of the inclined surface (P11) and the plate surface (10a) intersect.
[0040] According to this embodiment, the entire contact surface between the electronic components (4, 6) and the plate surface (10a) is located downstream in the flow direction of the coolant (F) from the virtual intersection line (L1) where the virtual extension surface of the inclined surface (P11) and the plate surface (10a) intersect. As a result, the contact surface between the electronic components (4, 6) and the plate surface (10a) is in the closest possible position to the coolant (F) throughout the entire flow direction of the coolant (F), so that the electronic components (4, 6) in contact with the plate surface (10a) can be reliably cooled by the coolant (F).
[0041] This disclosure is applicable to cooling plates.
[0042] 4: First FET (electronic component), 6: Second FET (electronic component), 10a: Plate surface, F: Coolant, L1: Virtual intersection line, P: Cooling channel, P1: Enlarged channel section, P2: Upstream channel section, P3: Connecting channel section, P11: Inclined surface, P12: Inlet (connection point between enlarged channel section and connecting channel section), W1: Enlarged channel width (channel width), W2: Upstream channel width (channel width)
Claims
1. A cooling plate having a plate surface in which an electronic component to be cooled comes into contact, wherein the cooling plate has a cooling channel formed inside through which a coolant capable of cooling the electronic component flows, the cooling channel having an expanded channel section, an upstream channel section provided upstream of the expanded channel section in the direction of coolant flow, and a connecting channel section connecting the expanded channel section and the upstream channel section, the expanded channel section is configured such that the portion of the plate surface in contact with the electronic component is higher than the upstream channel section when viewed in a direction along the plate surface, thereby expanding the cross-sectional area of the channel, the channel width of the upstream channel section is set to be wider than the channel width of the expanded channel section when viewed in a direction perpendicular to the plate surface, and the connecting channel section is configured to narrow from the connection point with the upstream channel section toward the connection point with the expanded channel section when viewed in a direction perpendicular to the plate surface.
2. The cooling plate according to claim 1, wherein, when viewed in a direction perpendicular to the plate surface, each of the wall surfaces on both sides of the connecting channel portion is formed to curve outward with respect to the connection portion between the enlarged channel portion and the connecting channel portion.
3. The cooling plate according to claim 2, wherein the direction of flow of the coolant at the connection point between the enlarged flow channel and the connecting flow channel is in a direction intersecting the direction of flow of the coolant at the connection point between the upstream flow channel and the connecting flow channel.
4. The cooling plate according to any one of claims 1 to 3, wherein the expanded flow channel portion has an inclined surface extending from the connection portion with the connecting flow channel portion to the portion in contact with the electronic component, and the entire contact surface between the electronic component and the plate surface is located downstream in the flow direction of the coolant from a virtual intersection line where the virtual extension surface of the inclined surface and the plate surface intersect.