High-pressure substrate processing apparatus

Abstract

A high-pressure substrate processing apparatus is disclosed. The high-pressure substrate processing apparatus may include a chamber and a valve module. The chamber may be configured to accommodate a process gas at a pressure higher than atmospheric pressure. The valve module may be positioned in the chamber so as to be exposed to the pressure of the process gas. The valve module may include a valve, an actuator, and a casing. The valve may be configured to have a first position in which a flow path for guiding the process gas to the chamber is open and a second position in which the flow path is closed. The actuator may be connected to the valve and configured to drive the valve to switch between the first position and the second position. The casing may have a pressure-resistant chamber that accommodates the actuator. The pressure of the process gas may be higher than the pressure of the pressure-resistant chamber.

Description

High-pressure substrate processing device

[0001] The present invention relates to a high-pressure substrate processing device.

[0002]

[0003] Generally, various processing steps are performed on the semiconductor substrate during the semiconductor device manufacturing process. Examples of such processing steps include oxidation, nitridation, ion implantation, and deposition. There is also a hydrogen or deuterium heat treatment process to improve the interface characteristics of the semiconductor device.

[0004] The above process can be broadly classified into vacuum processes and high-pressure processes depending on the gas pressure in the reaction chamber where the substrate is processed. While the former is performed at a pressure lower than atmospheric pressure, the latter is performed at a pressure higher than atmospheric pressure. In equipment for high-pressure processes, individual components must also be able to operate smoothly under high pressure.

[0005]

[0006] As determined by the inventors, valves that open and close flow paths communicating with the reaction chamber do not function properly in high-pressure environments. For example, check valves are opened and closed by the pressure of gas or liquid flowing within the flow path; however, due to low cracking pressure, they may open during the venting of the reaction chamber, failing to prevent the backflow of gases, etc. Furthermore, since check valves are made of metal, they may cause problems in which the liquid carries metal particles into the reaction chamber. Even if the valve is replaced with a different type, the means for driving the valve to open and close may not function properly under high pressure.

[0007] In light of these problems, one objective of the present invention is to provide a high-pressure substrate processing device that enables the opening and closing of a valve to be performed without problems by means of an actuator that operates stably even at high pressure.

[0008] The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by a person skilled in the art from the description below.

[0009]

[0010] A high-pressure substrate processing apparatus according to one aspect of the present invention for realizing the above-mentioned problem comprises: a chamber formed to receive a process gas at a pressure higher than atmospheric pressure; and a valve module located within the chamber to be exposed to the pressure of the process gas, wherein the valve module comprises a valve formed to have a first position that opens a flow path guiding the process gas into the chamber and a second position that closes the flow path; an actuator connected to the valve and formed to drive the valve to switch between the first position and the second position; and a casing having an internal pressure chamber that accommodates the actuator, wherein the pressure of the process gas may be higher than the pressure of the internal pressure chamber.

[0011] Here, the casing may have a strength capable of withstanding the pressure of the process gas, which is several to tens of times higher than the pressure of the internal pressure chamber.

[0012] Here, the process gas comprises a reaction gas and a protective gas, and the chamber comprises a housing and a door formed to open and close the housing, the housing comprises an inner housing formed to accommodate a substrate and the reaction gas acting as a first pressure on the substrate; and an outer housing formed to accommodate the inner housing and the protective gas forming a second pressure set in relation to the first pressure, and the door is formed to close at least one of the inner housing and the outer housing, and the valve module may be exposed to the second pressure of the protective gas.

[0013] Here, the actuator includes an operating shaft connected to the valve, and the casing includes a first body formed to allow the operating shaft to pass through; and a second body that defines the internal pressure chamber together with the first body, and the valve module may further include a sealing member that seals the internal pressure chamber.

[0014] Here, the sealing member may include at least one of a body ring disposed between the first body and the second body, and a shaft ring disposed between the operating shaft and the first part.

[0015] Here, the valve module may further include a reinforcing frame disposed in the internal pressure chamber and supporting the second body relative to the first body.

[0016] Here, the valve module further includes a bracket mounted on the casing and on which the valve is installed, and the bracket may include a mounting channel that accommodates the valve to maintain the installation direction.

[0017] Here, the valve includes an inlet and an outlet, and the bracket can seal the remaining part of the valve excluding the inlet and the outlet.

[0018] Here, the valve can be made of engineering plastic.

[0019] Herein, a mounting module formed to mount the valve module in the chamber is further included, and the mounting module may include a base member to which the valve module is coupled and which is rotatably installed in the chamber.

[0020] Here, the chamber includes a housing and a door for opening and closing the housing, the mounting module further includes an insulating member fixed to the chamber, and the base member may be located on the opposite side of the heater embedded in the door with respect to the insulating member.

[0021] Here, the mounting module may further include a compression block formed to compress the base member against the insulation member.

[0022] Here, the mounting module further includes a coupling member that couples the insulating member to the chamber, and the base member can be sandwiched between the coupling member and the compression block.

[0023] Here, the door has a trough shape, and the insulating member can be inserted into the space defined by the trough-shaped door.

[0024]

[0025] According to the high-pressure substrate processing apparatus of the present invention configured as described above, the valve module located in an atmosphere of process gas with a pressure higher than atmospheric pressure is equipped with an actuator that drives the valve and a casing that accommodates the actuator and protects it from the pressure of the process gas, so the actuator can operate stably even in a high-pressure atmosphere. As the actuator operates stably in a high-pressure atmosphere, even a manual valve that is free from problems such as particles can be used.

[0026] As the mounting module rotatably mounts the valve module to the chamber, the operator can adjust the valve module to a direction suitable for connection with the flow path. Accordingly, installation and repair of the valve module can be easily performed.

[0027] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

[0028]

[0029] FIG. 1 is a conceptual diagram showing a high-pressure substrate processing apparatus according to one embodiment of the present invention.

[0030] FIG. 2 is a cutaway perspective view showing the valve module and mounting module installed on the inner door of FIG. 1.

[0031] Figure 3 is an exploded perspective view of the mounting module of Figure 2.

[0032] FIG. 4 is a partially cutaway perspective view showing the installation state of the base member.

[0033] Figure 5 is a perspective view of the valve module of Figure 2.

[0034] Figure 6 is a cross-sectional view of the valve module of Figure 5.

[0035]

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0037] The present invention is not limited to the embodiments disclosed below, but can be modified and implemented in various different forms. The embodiments provided are merely intended to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Accordingly, the present invention should be understood not to be limited to the embodiments disclosed below, but to include all modifications, equivalents, and substitutions that fall within the technical spirit and scope of the present invention, as well as substituting or adding the configuration of any one embodiment with the configuration of another embodiment.

[0038] The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; rather, it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the invention. In the drawings, components may be depicted as being exaggeratedly large or small in size or thickness for the sake of convenience of understanding, but the scope of protection of the invention should not be interpreted restrictively as a result thereof.

[0039] The terms used in this specification are used merely to describe specific embodiments or examples and are not intended to limit the invention. Furthermore, singular expressions include plural expressions unless the context clearly indicates otherwise. Terms such as "includes" or "consists of" in this specification are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this specification. That is, terms such as "includes" or "consists of" in this specification should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0040] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0041] When it is stated that one component is "connected / communicated" or "connected" to another component, it should be understood that while it may be directly connected / communicated or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected / communicated" or "directly connected" to another component, it should be understood that there are no other components in between.

[0042] When it is stated that one component is "above" or "below" another component, it should be understood that it is not only placed directly above the other component, but that another component may also exist in between.

[0043] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0044] FIG. 1 is a conceptual diagram of a high-pressure substrate processing device according to one embodiment.

[0045] Referring to the drawing, the high-pressure substrate processing device (100) may include an inner chamber (110), an outer chamber (120), a fluid supply module (130), an exhaust module (140), and a valve module (150).

[0046] The inner chamber (110) may have a housing (inner housing) that defines a reaction space for accommodating a substrate. A door for opening and closing the reaction space may be provided at the bottom of the housing. The inner chamber (110) may be made of a non-metallic material, for example, quartz, to reduce the risk of contamination of the substrate in a high-temperature and high-pressure working environment. Depending on the operation of a heater (not shown) placed on the outside of the inner housing, the internal temperature of the reaction space may reach hundreds to thousands of degrees Celsius or higher. The substrate may be, for example, a semiconductor wafer mounted on a loading platform. The substrate is not limited to the wafer and may be any other as long as it is a base structure for making circuits. For example, the substrate may also include glass for making displays. The loading platform may be a boat for loading one or more substrates.

[0047] The outer chamber (120) may be provided with an (outer) housing having a protective space that accommodates the inner chamber (110). A door is also provided at the bottom of the outer housing, and the door (outer door) can descend together with the door (inner door) of the inner chamber (110) to open the protective space. The inner chamber (110) may be mounted on the outer chamber (120). Unlike the inner chamber (110), the outer chamber (120) may be made of metal because it is free from concerns about causing contamination to the substrate.

[0048] The fluid supply module (130) is configured to supply fluid to the inner chamber (110) and the outer chamber (120). The fluid supply module (130) may have a fluid supply unit (131) connected to the utility (fluid supply facility) of the substrate processing plant. The fluid supply unit (131) may selectively provide, for example, hydrogen gas (H2), deuterium gas (D2), gaseous hydrogen oxide, fluorine gas (F2), ammonia gas (NH3), chlorine gas (Cl2), nitrogen gas (N2), etc. as a reaction gas to the reaction chamber. The gaseous hydrogen oxide may be produced in a vaporizer (not shown) and supplied to the reaction chamber. In that case, the fluid supply module (130) may provide a raw material fluid for producing the gaseous hydrogen oxide, for example, ultrapure water, to the vaporizer. The above gaseous hydrogen oxide can be used for wet oxidation, atomic layer deposition (ALD), chemical vapor deposition (CVD), heat treatment (annealing), etc. The fluid supply unit (131) can provide, for example, inert gases such as nitrogen gas or argon gas (Ar) as a protective gas to the above protective chamber. The above reaction gas and the above protective gas can simply be referred to as process gases. The above process gas is injected into the above reaction chamber or the above protective chamber through the reaction gas line (133) or the protective gas line (135). The protective gas supplied to the above protective chamber is specifically injected into the remaining space (protective region) of the outer chamber (120), excluding the space occupied by the inner chamber (110).

[0049] The process gas may be at a pressure higher than atmospheric pressure (high pressure) in the reaction chamber and the protection chamber, for example, from several atmospheres to tens of atmospheres or higher. When the pressure of the reaction gas in the reaction chamber is a first pressure and the pressure of the protection gas in the protection chamber is a second pressure, they may be maintained within a set relationship (range). For example, the second pressure may be set to be substantially equal to or slightly higher than the first pressure. Such a pressure relationship provides the advantage of preventing the reaction gas from leaking from the reaction chamber and preventing the inner chamber (110) from breaking. The second pressure may also be set to be slightly lower than the first pressure, in which case a similar effect to the above may be achieved.

[0050] The exhaust module (140) is configured to exhaust the process gas. To exhaust the reaction gas from the inner chamber (110), an exhaust pipe (141) may be connected to the upper part of the inner chamber (110). Similarly, to exhaust the protection gas from the outer chamber (120), an exhaust pipe (145) connected to the outer chamber (120) may be provided. If the exhaust pipes (141 and 145) are integrated into one, the reaction gas is diluted by the protection gas during the exhaust process, and its concentration is lowered.

[0051] The valve module (150) is configured to allow or block the flow of fluid to the reaction chamber or the vaporizer. To this end, the valve module (150) may be installed in the reaction gas line (133). For example, if the valve module (150) is located in the protection chamber, the valve module (150) may be exposed to the pressure (the second pressure) of the process gas (specifically, the protection gas). The valve module (150) can effectively prevent backflow of the fluid that may occur during or after the process.

[0052] The specific installation structure of the valve module (150) will be explained with reference to FIG. 2. FIG. 2 is a cutaway perspective view showing the valve module and mounting module installed on the inner door of FIG. 1.

[0053] Referring to the drawing (and FIG. 1), the inner door (125) may be equipped with a spiral tube (126) and a heater (129). The spiral tube (126) may guide the reaction gas to the reaction chamber while extending along a spiral path. The upper end of the spiral tube (126) may be located in the reaction chamber, and the lower end may be located below the inner door (125). A joint (127) may be installed at the lower end of the spiral tube (126). The heater (129) may be positioned to act as a heat source and to provide thermal action to the spiral tube (126). Accordingly, the reaction gas may be preheated in the spiral tube (126) before entering the reaction chamber. The heater (129) may also heat the lower region of the reaction chamber.

[0054] The inner door (125) may generally have a trough shape. The boat may be mounted on the upper part of the inner door (125), and a hollow portion open to the outside may be formed on the lower part. A valve module (150) and a mounting module (170) may be located in the hollow portion.

[0055] The valve module (150) may have a valve (151), a casing (155), and a feed-through (159). The valve (151) may open and close a flow path, for example, a reaction gas line (133). The valve (151) may have an inlet (152a) and an outlet (152b), the inlet (152a) may be in communication with a fluid supply unit (131) and the outlet (152b) may be in communication with a joint (127). The casing (155) protects an actuator (161, see FIG. 6) that drives the valve (151) to open and close from the second pressure, so that the actuator (161) may operate without problems even in a high-pressure environment. The feed-through (159) is configured to feed a wire into the interior of the casing (155). The above wire can provide power and signal to the actuator (161). The feedthrough (159) can also be manufactured to withstand the second pressure.

[0056] The mounting module (170) is configured to mount the valve module (150) to the inner door (125). The mounting module (170) may have a trough shape similar to the inner door (125). The mounting module (170) also has a space open toward the downward, and the valve module (150) may be positioned in that space.

[0057] The specific shape of the mounting module (170) is described with reference to FIG. 3. FIG. 3 is an exploded perspective view of the mounting module of FIG. 2.

[0058] Referring to the present drawing (and FIG. 2), the mounting module (170) may have a base member (171) to which the valve module (150) is coupled. The base member (171) may be in the form of a space open downward and may be referred to as a base cap. A flange portion (171a) extending outward may be formed at the lower part of the base cap. The base member (171) is not limited to the shape of the base cap and may, for example, have a plate shape.

[0059] The base member (171) can be rotatably installed on the inner door (125). The base member (171) can be installed directly on the inner door (125), but as in the present embodiment, it can also be installed indirectly on the inner door (125) via an insulating member (173). The insulating member (173) can be fixedly installed on the inner door (125). The insulating member (173) also has a shape generally identical to the base cap and can be referred to as an insulating cap. The insulating cap provides the advantage of being able to block heat transmitted from above and to the side thereof. The insulating member (173) can be made of a material with better thermal insulation performance than the base member (171), for example, Polytetrafluoroethylene (PTFE), Polyether ether ketone (PEEK), Polyimide (PI), or Polybenzimidazole (PBI). Since the base member (171) is located on the opposite side of the heater (129) with respect to the insulating member (173), heat generated from the heater (129) can be blocked by the insulating member (173) before being transferred to the valve module (150). The shape of the insulating member (173) is not limited to the insulating cap and may be, for example, in the form of a plate.

[0060] The mounting module (170) may further have a coupling member (175) that connects the insulating member (173) to the inner door (125). The coupling member (175) may be connected to the outer door (125) through a screw hole (176a) and a screw (not shown). Since the coupling member (175) is connected to the outer door (125) while supporting the insulating member (173), the insulating member (173) may also be connected to the outer door (125). The coupling member (175) may have a ring shape considering the shape of the insulating member (173) and the outer door (125), but is not limited thereto. For example, the coupling member (175) may be divided into several parts.

[0061] For joining the connecting member (175) {and the insulating member (173)} and the base member (171), a compression block (177) may be further provided. The compression block (177) may compress a part of the base member (171), specifically the flange portion (171a), against the connecting member (175). To do this, a screw (178) installed in the compression block (177) may be coupled with a screw hole (176b) of the connecting member (175). In such a coupling relationship, the flange portion (171a) may be sandwiched between the connecting member (175) and the compression block (177). The compression block (177) is exemplified as being divided into multiple parts, but is not limited thereto. For example, the compression block (177) may have a ring shape like the connecting member (175).

[0062] The valve module (150) may not be directly connected to the base member (171) but may be connected indirectly through another insulating member (179). If the previously described insulating member (173) primarily blocks the heat generated from the heater (129), the other insulating member (179) can secondarily block that heat. Due to the double heat blocking structure, the valve module (150) can operate stably even if a large amount of heat is generated from the heater (129).

[0063] FIG. 4 is a partially cutaway perspective view showing the installation state of the base member.

[0064] Referring to the present drawing (and FIG. 3), the coupling member (175) may have a stepped portion (176). The flange portion (171a) of the base member (171) may be seated on the stepped portion (176). A friction-reducing pad (172) may be attached to the flange portion (171a) as needed. The friction-reducing pad (172) may be made of a material with a low coefficient of friction, for example, PTFE. A compression block (177) may be placed on the lower side of the friction-reducing pad (172). The compression block (177) may be compressed against the coupling member (175) by a screw (178).

[0065] When the screw (178) is loosened as in FIG. 4(a), the flange portion (171a) {and base member (171)} can rotate relative to the insulating member (173). The valve module (150) can also rotate together with the base member (171). The rotation of the valve module (150) and the base member (171) can be performed along a rotational direction centered on the central axis of the insulating member (173). When the flange portion (171a) rotates, the generation of particles can be minimized by the friction reduction pad (172).

[0066] As the valve module (150) is rotated, it becomes easier for the operator to connect the outlet (152b) and the joint (127, see FIG. 2 above). Even if the orientation of the joint (127) relative to the outlet (152b) varies depending on the equipment, the operator can rotate the valve module (150) to accommodate it.

[0067] In contrast, when the screw (178) is tightened as in Fig. 4 (b), the base member (171) is prevented from rotating relative to the insulating member (173).

[0068] Now, the specific configuration of the valve module (150) will be described with reference to FIGS. 5 and FIG. 6. FIG. 5 is a perspective view of the valve module of FIG. 2, and FIG. 6 is a cross-sectional view of the valve module of FIG. 5.

[0069] Referring to the drawings, the valve module (150) may further include a bracket (153) and an actuator (161), in addition to the valve (151), casing (155), and feedthrough (159) described above.

[0070] The valve (151) may be formed to have a first position that opens the flow path (reaction gas line (133, see FIG. 1)) and a second position that closes the flow path. Specifically, in the first position and the second position, the operating handle (151a) of the valve (151) may be arranged along different directions. The valve (151) may be made of engineering plastic, for example, ethylene tetrafluoroethylene (ETFE) or PEEK, so as to withstand high pressure without producing metal particles when in contact with the fluid.

[0071] The bracket (153) is an object on which the valve (151) is mounted. A seating channel (153a) may be formed in the bracket (153) to maintain the direction in which the valve (151) is installed. The seating channel (153a) is a portion that accommodates the valve (151) and may extend in a direction connecting the inlet (152a) and the outlet (152b). Since the valve (151) can withstand high pressure, the bracket (153) may not seal the valve (151). The bracket (153) may be coupled to the casing (155). A stopper (154) may also be installed in the bracket (153). The stopper (154) is positioned at a level corresponding to the operating handle (151a) so as to limit the rotation angle of the operating handle (151a). In an alternative embodiment, the bracket (153) can seal the remaining portion of the valve (151) excluding the inlet (152a) and the outlet (152b). By sealing the valve (151) with the bracket (153), particles that may be generated from components associated with the operation of the valve (151), such as the stopper (154), adapter (163), and operating handle (151a), can be prevented from floating in the protection chamber.

[0072] The casing (155) may be provided with a first body (156) and a second body (157). The first body (156) and the second body (157) may be combined to define an internal pressure chamber (156a). An actuator (161) may be accommodated in the internal pressure chamber (156a). If the first body (156) has a cylindrical shape with one end closed and the other end open, the second body (157) may have a cover shape that closes the other end. The pressure in the internal pressure chamber (156a) may be lower than the pressure of the protective gas (the second pressure). For example, as the first body (156) and the second body (157) are assembled in the atmosphere, the pressure in the internal pressure chamber (156a) may be 1 atmosphere. The second pressure may be, for example, several to tens of atmospheres. The casing (155) can have strength capable of withstanding the difference between the pressure of the internal pressure chamber (156a) and the second pressure.

[0073] The actuator (161) is connected to the valve (151) and configured to drive the valve (151) to switch between the first position and the second position. The actuator (161) may be, for example, an electric motor, but is not limited thereto. The actuator (161) may be a configuration that generates rotational force, such as a rotary cylinder, or a hydraulic / pneumatic cylinder that generates linear driving force. The hydraulic / pneumatic cylinder may be connected to the operating handle (151a) via a link to rotate the operating handle (151a). The output shaft of the motor, that is, the operating shaft (162), may extend outward by penetrating the first body (156). The operating shaft (162) is connected to the operating handle (151a) through an adapter (163), but depending on the shape of the operating shaft (162), the operating shaft (162) may be directly connected to the operating handle (151a).

[0074] To seal the internal pressure chamber (156a) to the outside, a sealing member may be additionally provided. The sealing member may be an O-ring or a gasket. The sealing member may have, for example, a body ring (165) positioned between the first body (156) and the second body (157). The sealing member may also have a shaft ring (166) positioned between the operating shaft (162) and the first body (156).

[0075] To improve the pressure resistance of the pressure chamber (156a), a reinforcing frame (167) may be placed in the pressure chamber (156a). The reinforcing frame (167) may support the second body (157) against the first body (156). The reinforcing frame (167) may have one or more posts surrounding the actuator (161). If there are multiple posts, they may be connected to each other.

[0076] In this specification, a processing device having a double chamber has been described as an example of a substrate processing device (100), but the invention is not limited thereto. The valve module (150) and the mounting module (170) may also be applied to a semi-double chamber, which is an intermediate form between the double chamber and the single chamber. The semi-double chamber may have two housings {inner housing and outer housing} and one door. The two housings may be joined by their own shapes or with the interposition of separate members to form a closed space (corresponding to the protection zone). As in the preceding embodiment, the substrate is placed in the reaction chamber of the inner housing and the reaction gas is injected, and the protection gas may be injected into the closed space. Unlike the preceding embodiment, the door is not fully protected by the protection gas and is exposed to the outside. In this respect, the door may correspond to the outer door in the preceding embodiment. The door may open and close the reaction chamber. The valve module (150) and the mounting module (170) can be placed in the closed space, for example.

[0077] This specification exemplifies a batch-type processing apparatus, but the invention is not limited thereto. The invention may be applied as is to a single-wafer-type processing apparatus.

[0078]

[0079] The present invention has industrial applicability in the field of manufacturing high-pressure substrate processing devices.

Claims

1. A chamber formed to receive process gas at a pressure higher than atmospheric pressure; and It includes a valve module located within the chamber to be exposed to the pressure of the process gas, and The above valve module is, A valve formed to have a first position that opens a flow path guiding the process gas to the chamber and a second position that closes the flow path; An actuator connected to the above valve and formed to drive the valve to switch between the first position and the second position; and It includes a casing having a pressure chamber for accommodating the above actuator, and A high-pressure substrate processing device in which the pressure of the process gas is higher than the pressure of the internal pressure chamber.

2. In Paragraph 1, The above casing is, A high-pressure substrate processing device having strength capable of withstanding the pressure of the process gas, which is several to tens of times higher than the pressure of the pressure chamber above.

3. In Paragraph 1, The above process gas is, Includes reaction gas and protective gas, The above chamber is, It includes a housing and a door formed to open and close the housing, and The above housing is, An inner housing formed to accommodate a substrate and the reaction gas acting as a first pressure on the substrate; and It includes an outer housing formed to accommodate the inner housing and the protective gas forming a second pressure set in relation to the first pressure, and The above door is, It is formed to close at least one of the inner housing and the outer housing, and The above valve module is, A high-pressure substrate processing device exposed to the second pressure of the above-mentioned protective gas.

4. In Paragraph 1, The above actuator is, It includes an operating shaft connected to the above valve, The above casing is, A first body formed to allow the above-mentioned operating shaft to pass through; and It includes a second body that defines the internal pressure chamber together with the first body, and The above valve module is, A high-pressure substrate processing device further comprising a sealing member for sealing the above-mentioned pressure chamber.

5. In Paragraph 4, The above sealing member is, A high-pressure substrate processing device comprising at least one of a body ring disposed between the first body and the second body, and a shaft ring disposed between the operating shaft and the first part.

6. In Paragraph 4, The above valve module is, A high-pressure substrate processing device further comprising a reinforcing frame disposed in the above-mentioned pressure chamber and supporting the second body relative to the first body.

7. In Paragraph 1, The above valve module is, It further includes a bracket mounted on the above casing and on which the above valve is installed, The above bracket is, A high-pressure substrate processing device comprising a mounting channel that accommodates the above valve to maintain the installation direction.

8. In Paragraph 7, The above valve is, It includes an inlet and an outlet, The above bracket is, A high-pressure substrate processing device that seals the remaining part of the valve excluding the inlet and outlet.

9. In Paragraph 1, The above valve is, High-pressure substrate processing device made of engineering plastic.

10. In Paragraph 1, It further includes a mounting module formed to mount the above valve module to the chamber, and The above mounting module is, A high-pressure substrate processing device comprising a base member rotatably installed in the chamber and to which the valve module is coupled.

11. In Paragraph 10, The above chamber is, It includes a housing and a door for opening and closing the housing, The above mounting module is, It further includes an insulating member fixed to the above chamber, and The above base member is, A high-pressure substrate processing device located on the opposite side of the heater embedded in the door, based on the above-mentioned insulating member.

12. In Paragraph 11, The above mounting module is, A high-pressure substrate processing device further comprising a compression block formed to compress the base member against the insulation member.

13. In Paragraph 12, The above mounting module is, It further includes a coupling member that connects the above-mentioned insulating member to the chamber, and The above base member is, A high-pressure substrate processing device sandwiched between the above-mentioned coupling member and the above-mentioned compression block.

14. In Paragraph 11, The above door is, Having the shape of a manger, The above-mentioned insulating member is, A high-pressure substrate processing device inserted into a space defined by the above-mentioned trough-shaped door.

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