Retainer, top ring, and substrate processing apparatus

Abstract

The present invention prevents wear of an outer peripheral edge of a retainer and improves the uniformity of the polishing profile of a substrate.　A retainer 314 is disposed so as to surround a substrate on a top ring which presses the substrate toward a polishing pad. The retainer 314 includes: a first member 314a that has a sliding surface with the polishing pad; a second member 314b that has a sliding surface with the polishing pad disposed outside of the sliding surface of the first member 314a, and that has higher wear resistance to sliding with the polishing pad than the first member 314a does; and a joining mechanism 320 that joins the first member 314a and the second member 314b.

Description

Retainer, top ring, and substrate processing apparatus

[0001] This application relates to a retainer, a top ring, and a substrate processing apparatus. This application claims priority based on Japanese Patent Application No. 2024-230701 filed on December 26, 2024. All disclosure contents including the specification, claims, drawings, and abstract of Japanese Patent Application No. 2024-230701 are incorporated herein by reference in their entirety.

[0002] There is a CMP (Chemical Mechanical Polishing) apparatus, which is a type of substrate processing apparatus used in semiconductor processing steps. CMP apparatuses can be broadly classified into "face-up type (the polished surface of the substrate faces upward)" and "face-down type (the polished surface of the substrate faces downward)" depending on the direction in which the polished surface of the substrate faces.

[0003] A face-down type chemical mechanical polishing apparatus includes a top ring that holds a substrate and a polishing table to which a polishing pad is attached, and is configured to polish the substrate by pressing the substrate against the polishing pad while rotating the top ring and the polishing table. Here, when polishing the substrate, the substrate may come off the top ring and fly out to the outside of the top ring.

[0004] On the other hand, for example, Patent Document 1 discloses a polishing apparatus in which a retainer is arranged around the substrate to prevent the substrate from flying out when the top ring is rotating. This polishing apparatus can prevent the substrate from flying out by arranging the retainer and can improve the polishing profile of the substrate by pressing the polishing pad with the retainer.

[0005] Japanese Unexamined Patent Application Publication No. 2015-95526

[0006] However, the prior art does not consider that the polishing profile of the substrate becomes non-uniform due to wear of the outer peripheral end of the retainer.

[0007] In other words, when polishing a substrate, the retainer slides against the polishing pad, causing wear on the retainer's sliding surface. Here, stronger pressure is applied to the outer edge of the retainer's sliding surface than to other parts, so as the polishing process continues, the outer edge of the retainer's sliding surface wears down more significantly than other parts. When polishing a substrate using such a retainer, the protrusion of the polishing pad between the substrate and the retainer becomes larger, causing the outer edge of the substrate to come into strong contact with the polishing pad. As a result, the polishing rate of the outer edge of the substrate becomes higher than that of other parts of the substrate, and consequently, the polished profile of the substrate becomes uneven.

[0008] Therefore, one of the objectives of this invention is to suppress wear on the outer peripheral edge of the retainer and improve the uniformity of the polished profile of the substrate.

[0009] According to one embodiment, a retainer is disclosed which is arranged to surround a substrate in a top ring that presses the substrate toward a polishing pad, and includes a first member having a sliding surface with respect to the polishing pad, a second member having a sliding surface with respect to the polishing pad located outside the sliding surface of the first member and having abrasion resistance to sliding with the polishing pad that is higher than the abrasion resistance of the first member, and a coupling mechanism that connects the first member and the second member.

[0010] Figure 1 is a plan view showing the overall configuration of a CMP apparatus as an example of a substrate processing apparatus according to one embodiment of the present invention. Figure 2 is a schematic perspective view showing a polishing apparatus. Figure 3 is a schematic cross-sectional view showing a top ring. Figure 4 is a schematic cross-sectional view showing a retainer. Figure 5 is a diagram illustrating the connection between the first member and the second member. Figure 6 is a diagram illustrating the connection between the first member and the second member. Figure 7 is a diagram illustrating the connection between the first member and the second member. Figure 8 is a diagram illustrating the connection between the first member and the second member. Figure 9 is a diagram illustrating the connection between the first member and the second member. Figure 10 is a diagram illustrating the connection between the first member and the second member. Figure 11 is a diagram illustrating the connection between the first member and the second member. Figure 12 is a diagram illustrating the connection between the first member and the second member.

[0011] Hereinafter, a retainer, a top ring, and a substrate processing apparatus according to one embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0012] <Polishing Apparatus> Figure 1 is a plan view showing the overall configuration of a CMP apparatus as an example of a substrate processing apparatus according to one embodiment of the present invention. As shown in Figure 1, the CMP apparatus 1000 comprises a substantially rectangular housing 1. The interior of the housing 1 is divided by partition walls 1a and 1b into a load / unloading apparatus 2, a polishing apparatus 3, and a cleaning apparatus 4. The load / unloading apparatus 2, the polishing apparatus 3, and the cleaning apparatus 4 are each assembled independently and exhausted independently. The cleaning apparatus 4 also comprises a power supply member that supplies power to the polishing apparatus and a control device 5 that controls the processing operation.

[0013] <Loading / Unloading Device> The loading / unloading device 2 includes two or more (four in this embodiment) front loading members 20 on which wafer cassettes for stocking a large number of objects to be processed (for example, disc-shaped wafers (substrates)) are placed. These front loading members 20 are arranged adjacent to the housing 1 and aligned along the width direction (perpendicular to the longitudinal direction) of the polishing device. The front loading members 20 can be equipped with open cassettes, SMIF (Standard Manufacturing Interface) pods, or FOUP (Front Opening Unified Pod). Here, SMIF and FOUP are sealed containers that house wafer cassettes inside and are covered with partitions, thereby maintaining an environment independent of the external space.

[0014] Furthermore, a travel mechanism 21 is laid along the arrangement of the front load members 20 in the load / unload device 2. Two transport robots (loaders, transport mechanisms) 22, which can move along the direction of the wafer cassette arrangement, are installed on the travel mechanism 21. The transport robots 22 can access the wafer cassettes mounted on the front load members 20 by moving along the travel mechanism 21. Each transport robot 22 has two hands, one above and one below. The upper hand is used to return processed wafers to the wafer cassette. The lower hand is used to remove wafers from the wafer cassette before processing. In this way, the upper and lower hands can be used interchangeably. In addition, the lower hand of the transport robot 22 is configured to be able to invert the wafer.

[0015] <Polishing Apparatus> Polishing apparatus 3 is the area where the wafer is polished (planarized). Polishing apparatus 3 comprises a first polishing apparatus 3A, a second polishing apparatus 3B, a third polishing apparatus 3C, and a fourth polishing apparatus 3D. The first polishing apparatus 3A, the second polishing apparatus 3B, the third polishing apparatus 3C, and the fourth polishing apparatus 3D are arranged along the longitudinal direction of the polishing apparatus, as shown in Figure 1.

[0016] As shown in Figure 1, the first polishing apparatus 3A includes a polishing table 30A to which a polishing pad (polishing tool) 10 having a polishing surface is attached, a top ring 31A for holding a wafer and polishing it while pressing it against the polishing pad 10 on the polishing table 30A, a polishing liquid supply nozzle 32A for supplying polishing liquid and dressing liquid (e.g., pure water) to the polishing pad 10, a dresser 33A for dressing the polishing surface of the polishing pad 10, and an atomizer 34A for spraying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) to remove slurry, polishing products, and polishing pad residue from the polishing surface due to dressing.

[0017] Similarly, the second polishing device 3B includes a polishing table 30B, a top ring 31B, a polishing fluid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing device 3C includes a polishing table 30C, a top ring 31C, a polishing fluid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing device 3D includes a polishing table 30D, a top ring 31D, a polishing fluid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

[0018] Since the first polishing device 3A, the second polishing device 3B, the third polishing device 3C, and the fourth polishing device 3D have the same configuration, only the first polishing device 3A will be described below.

[0019] Figure 2 is a schematic perspective view of the first polishing apparatus 3A. The top ring 31A is supported by a rotating shaft 36. A polishing pad 10 is attached to the upper surface of the polishing table 30A. The upper surface of the polishing pad 10 forms a polishing surface for polishing the substrate W. The top ring 31A and the polishing table 30A are configured to rotate around their axes as indicated by the arrows. The substrate W is held by vacuum suction on the lower surface of the top ring 31A. During polishing, polishing fluid is supplied to the polishing surface of the polishing pad 10 from the polishing fluid supply nozzle 32A, and the substrate W to be polished is pressed against the polishing surface of the polishing pad 10 by the top ring 31A and polished.

[0020] <Transportation Mechanism> Next, the transport mechanism for transporting wafers will be described. As shown in Figure 1, the first linear transporter 6 is positioned adjacent to the first polishing apparatus 3A and the second polishing apparatus 3B. The first linear transporter 6 is a mechanism that transports wafers between four transport positions (in order from the load / unloading apparatus side, these are the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4) along the direction in which the polishing apparatuses 3A and 3B are arranged.

[0021] Furthermore, a second linear transporter 7 is positioned adjacent to the third polishing apparatus 3C and the fourth polishing apparatus 3D. The second linear transporter 7 is a mechanism for transporting wafers between three transport positions (which are designated as the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7, in order from the load / unloading apparatus side) along the direction in which the polishing apparatuses 3C and 3D are arranged.

[0022] The wafers are transported to polishing apparatuses 3A and 3B by the first linear transporter 6. The top ring 31A of the first polishing apparatus 3A moves between the polishing position and the second transport position TP2 by the swinging motion of the top ring head. Therefore, the transfer of wafers to top ring 31A takes place at the second transport position TP2. Similarly, the top ring 31B of the second polishing apparatus 3B moves between the polishing position and the third transport position TP3, and the transfer of wafers to top ring 31B takes place at the third transport position TP3. The top ring 31C of the third polishing apparatus 3C moves between the polishing position and the sixth transport position TP6, and the transfer of wafers to top ring 31C takes place at the sixth transport position TP6. The top ring 31D of the fourth polishing apparatus 3D moves between the polishing position and the seventh transport position TP7, and the transfer of wafers to top ring 31D takes place at the seventh transport position TP7.

[0023] A lifter 11 is positioned at the first transport position TP1 to receive wafers from the transport robot 22. The wafers are transferred from the transport robot 22 to the first linear transporter 6 via the lifter 11. A shutter (not shown) is provided in the partition wall 1a between the lifter 11 and the transport robot 22, and the shutter is opened when the wafers are being transported to allow the wafers to be transferred from the transport robot 22 to the lifter 11. A swing transporter 12 is positioned between the first linear transporter 6, the second linear transporter 7, and the cleaning device 4. The swing transporter 12 has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5. The transfer of wafers from the first linear transporter 6 to the second linear transporter 7 is performed by the swing transporter 12. The wafers are then transported by the second linear transporter 7 to the third polishing device 3C and / or the fourth polishing device 3D. Furthermore, the wafers polished in the polishing device 3 are transported to the cleaning device 4 via the swing transporter 12.

[0024] The first linear transporter 6 and the second linear transporter 7 each have multiple transport stages (not shown), as described in Japanese Patent Application Publication No. 2010-50436. This allows for the use of separate transport stages, for example, for transporting unpolished wafers to each transport position and for transporting polished wafers from each transport position. This enables the wafers to be quickly transported to the transport position to start polishing, and the polished wafers to be quickly sent to the cleaning device.

[0025] <Top Ring> Figure 3 is a schematic cross-sectional view of the top ring. The top ring 31A comprises a rotating shaft 36, a top ring body 312 fixed to the rotating shaft 36, and a retainer 314 attached to the top ring body 312. The retainer 314 is an annular member arranged in the top ring 31A so as to surround the substrate W, and is a member for preventing the substrate W from flying out of the top ring 31A during the polishing process. The retainer 314 is arranged so as to surround the substrate W when viewed from a direction perpendicular to the polishing surface, which is the surface of the substrate W that is polished. Here, perpendicular does not have to be strictly perpendicular, and may be approximately perpendicular.

[0026] Figure 4 is a schematic cross-sectional view of the retainer. Figure 4 is an enlarged view of the area enclosed by the dashed line in Figure 3. Figures 4(a) to 4(h) show various patterns of the retainer. As shown in Figure 4, the retainer 314 includes a first member 314a having a sliding surface with respect to the polishing pad 10. More specifically, the first member 314a has a sliding surface that slides against the polishing pad 10 when the polishing surface is pressed toward the polishing pad 10. In one example, the first member 314a is formed in an annular shape. The retainer 314 also includes a second member 314b having a sliding surface with respect to the polishing pad 10, which is located outside the sliding surface of the first member 314a. More specifically, the second member 314b has a sliding surface that slides against the polishing pad 10 when the polishing surface is pressed toward the polishing pad 10. In one example, the second member 314b is formed in an annular shape. The second member 314b is made of a material that has higher wear resistance to sliding against the polishing pad 10 than the wear resistance of the first member 314a. In other words, if the first member 314a has a first level of wear resistance against the polishing pad 10, the second member 314b is made of a material that has a second level of wear resistance against the polishing pad 10 that is greater than the first level of wear resistance. As a result, when the second member 314b slides against the polishing pad 10, it experiences less wear than the first member 314a. For example, if the first member 314a has a first level of hardness, a first level of Young's modulus, or a first level of sliding properties, the second member 314b is made of a material that has a second level of hardness, a second level of Young's modulus, or a second level of sliding properties that is greater than the first level of hardness, a first level of Young's modulus, or a first level of sliding properties.

[0027] As shown in Figure 4(a), the first member 314a may have a base portion 314a-1 positioned inside the second member 314b, and a flange portion 314a-2 extending from the base portion 314a-1 to the upper part of the second member 314b. As shown in Figure 4(b), the second member 314b may have a sliding surface positioned outside the sliding surface of the first member 314a, spaced apart from the first member 314a. As shown in Figure 4(c), the upper part of the second member 314b may extend outward. As shown in Figure 4(d), the first member 314a may be positioned outside the upper part of the second member 314b.

[0028] Furthermore, as shown in Figures 4(e) and 4(f), the second member 314b may be positioned only at the outer corners of the sliding surface of the first member 314a with respect to the polishing pad 10. As shown in Figure 4(g), the first member 314a has a plurality of (two in this embodiment) sliding surfaces arranged at intervals, and the second member 314b may have a sliding surface positioned outside the sliding surface of the first member 314a, spaced apart from the sliding surface of the first member 314a. Also, as shown in Figure 4(h), the second member 314b may have a plurality of (two in this embodiment) sliding surfaces positioned outside the sliding surface of the first member 314a, spaced apart from the sliding surface of the first member 314a, and the sliding surfaces of the plurality of second members 314b may be spaced apart from each other.

[0029] What is common to the various patterns in Figures 4(a) to 4(h) is that the sliding surface of the retainer 314 with the polishing pad 10 has a first member 314a positioned on the inside and a second member 314b positioned on the outside (outermost periphery). According to this embodiment, wear on the outer peripheral end of the retainer 314 can be suppressed and the uniformity of the polishing profile of the substrate can be improved. That is, since the second member 314b, which has higher wear resistance to the polishing pad 10 than the wear resistance of the first member 314a, is positioned at the outer peripheral end of the retainer 314, even if the polishing process of the substrate W is continued, the outer peripheral end of the sliding surface of the retainer 314 is less likely to wear down significantly compared to other parts. Therefore, when polishing a substrate using such a retainer 314, it is possible to suppress the increase in the protrusion of the polishing pad between the substrate W and the retainer 314, so that the outer peripheral part of the substrate W is less likely to come into strong contact with the polishing pad 10. Therefore, the polishing rate of the outer periphery of the substrate W becomes equivalent to that of other parts of the substrate W, and as a result, the uniformity of the substrate's polishing profile can be improved.

[0030] Next, the coupling mechanism for connecting the first member 314a and the second member 314b will be described. Figure 5 is a diagram illustrating the coupling between the first member 314a and the second member 314b.

[0031] As shown in Figure 5, the second member 314b has a base portion 314b-1 positioned outside the first member 314a, and a flange portion 314b-2 that extends from the base portion 314b-1 to the upper part of the first member 314a. Multiple flange portions 314b-2 (eight in this embodiment) are formed along the circumferential direction of the retainer 314, spaced apart from one another.

[0032] The coupling mechanism 320 includes an alignment hole 322 that penetrates the flange portion 314b-2 and reaches the interior of the first member 314a, and an alignment pin 324 that protrudes downward from the top ring body 312 of the top ring 31A and is inserted into the alignment hole 322. The coupling mechanism 320 also includes a screw hole 326 that penetrates the top ring body 312 and reaches the interior of the first member 314a, and a screw member 328 that is inserted into the screw hole 326 and fixes the first member 314a to the top ring body 312.

[0033] By providing a screw hole 326 in the first member 314a and a flange portion 314b-2 (step) for catching on the second member 314b, the first member 314a can be fixed to the top ring body 312 with a screw member 328 (bolt), and at the same time, the second member 314b can also be fixed. The positional relationship between the first member 314a and the second member 314b can be adjusted using an alignment pin 324 provided on the top ring body 312. Alternatively, the second member 314b may be provided with a screw hole and the first member 314a may be provided with a flange portion (step) for catching on.

[0034] Figures 6 to 8 illustrate the connection between the first member and the second member. As shown in Figures 6 to 8, the first member 314a has a base portion 314a-1 positioned inside the second member 314b, and a flange portion 314a-2 that extends from the base portion 314a-1 to the upper part of the second member 314b.

[0035] The coupling mechanism 330 includes an annular groove 332 formed at the contact point between the base portion 314a-1 and the second member 314b, and a rod-shaped fitting member 334 positioned in the groove 332. Figure 6 shows the state in which the fitting member 334 is being inserted into the groove 332, and Figure 7 shows the state in which the fitting member 334 has been fully inserted into the groove 332.

[0036] Furthermore, the coupling mechanism 330 includes a pin hole 336 that penetrates the flange portion 314a-2 and reaches the interior of the second member 314b, and a rotation-preventing pin 338 inserted into the pin hole 336. As shown in Figures 7 and 8, the coupling mechanism 330 further includes an insertion opening 339 that communicates with the groove 332 from the outside of the second member 314b. The fitting member 334 is inserted into the groove 332 via the insertion opening 339 and positioned in the groove 332.

[0037] In this embodiment, a rod-shaped fitting member 334 is inserted into a groove 332 formed between the base portion 314a-1 and the second member 314b. The fitting member 334 is elastic and is inserted through an insertion opening 339 provided in the second member 314b. The first member 314a and the second member 314b are constrained vertically by the fitting member 334 and also constrained rotationally by the rotation-retaining pin 338. The fitting member 334 may be made of a resin such as polyvinyl chloride or a metal spring steel. The rotation-retaining pin 338 may also be made of a resin or a metal such as stainless steel. The insertion opening 339 may be filled with a sealant such as silicone rubber to prevent polishing slurry from entering the interior. According to this embodiment, the first member 314a can withstand the upward and lateral forces that the second member 314b receives during polishing.

[0038] Figure 9 is a diagram illustrating the connection between the first member and the second member. As shown in Figure 9, the first member 314a has a base portion 314a-1 positioned inside the second member 314b and a flange portion 314a-2 that extends from the base portion 314a-1 to the upper part of the second member 314b.

[0039] The coupling mechanism 340 includes a first flow path 341 formed in an annular shape at the contact portion between the flange portion 314a-2 and the second member 314b, and a plurality of first holes 342 communicating with the first flow path 341 from the upper surface of the flange portion 314a-2. The coupling mechanism 340 also includes a first fixing member 343 filled in the first flow path 341 and the plurality of first holes 342. More specifically, the plurality of first holes 342 include a first injection hole 342-1 communicating with the first flow path 341 from the upper surface of the flange portion 314a-2, and a first air vent hole 342-2 communicating with the first flow path 341 from the upper surface of the flange portion 314a-2. The first fixing member 343 is formed by being introduced into the first flow path 341 via the first injection hole 342-1, filling the first flow path 341, the first injection hole 342-1, and the first air vent hole 342-2, and curing, and is made of, for example, epoxy resin.

[0040] Furthermore, the coupling mechanism 340 includes a second flow path 345 formed in an annular shape at the contact portion between the base portion 314a-1 and the second member 314b, and a plurality of second holes 346 communicating with the second flow path 345 from the inner surface of the base portion 314a-1. The coupling mechanism 340 also includes a second fixing member 347 that fills the second flow path 345 and the plurality of second holes 346. More specifically, the plurality of second holes 346 include a second injection hole 346-1 communicating with the second flow path 345 from the inner surface of the base portion 314a-1, and a second air vent hole 346-2 communicating with the second flow path 345 from the inner surface of the base portion 314a-1. The second fixing member 347 is formed by flowing into the second flow path 345 through the second injection hole 346-1, filling the second flow path 345, the second injection hole 346-1, and the second air vent hole 346-2, and curing, and is made of, for example, epoxy resin.

[0041] As in this embodiment, by pouring a resin or the like into the flow paths formed in the first member 314a and the second member 314b and curing it inside, the first member 314a and the second member 314b can be joined. As the resin to be poured, for example, a two-component epoxy resin or the like can be considered. According to this embodiment, since the first air vent hole 342-2 is formed at the location farthest from the first injection hole 342-1 and in the middle path of the first flow path 341, air and excess epoxy resin can be removed, and it is possible to prevent voids from remaining inside the first flow path 341. Also, according to this embodiment, since the second air vent hole 346-2 is formed at the location farthest from the second injection hole 346-1 and in the middle path of the second flow path 345, air and excess epoxy resin can be removed, and it is possible to prevent voids from remaining inside the second flow path 345.

[0042] FIGS. 10 and 11 are diagrams for explaining the joining of the first member and the second member. As shown in FIGS. 10 and 11, the coupling mechanism 350 includes a first thread 352 formed on the outer peripheral surface of the first member 314a and a second thread 354 formed on the inner peripheral surface of the second member 314b. The second thread 354 is formed on the outer peripheral surface of the first member 314a so as to be screwed with the first thread 352.

[0043] Further, the coupling mechanism 350 includes a pin hole 356 formed at the contact portion of the first member 314a and the second member 314b, which are coupled by screwing the first thread 352 and the second thread 354 together, and a rotation prevention pin 358 inserted into the pin hole 356.

[0044] According to this embodiment, as shown in FIG. 11, the second member 314b can be screwed into the first member 314a to join the two. After joining, a top surface hole is machined to form the pin hole 356, and a rotation prevention pin 358 such as an insert or a ring part is press-fitted into the pin hole 356, so that permanent rotation prevention after joining can be performed.

[0045] Figure 12 is a diagram illustrating the joining of the first member and the second member. As shown in Figure 12, the joining mechanism 360 comprises a tapered outer surface 362 of the first member 314a and an inner surface 364 of the second member 314b that is tapered to join with the outer surface 362 of the first member 314a. The first member 314a and the second member 314b are joined by rotational friction by rotating at least one of the first member 314a and the second member 314b so that the outer surface 362 of the first member 314a and the inner surface 364 of the second member 314b rub against each other.

[0046] More specifically, a disc-shaped first member 314a is attached to jig 1, and a rectangular plate-shaped second member 314b with a circular hole in the center is attached to jig 2. Jigs 1 and 2 are configured such that one side rotates and the other is fixed, or that they rotate in opposite directions. In this embodiment, jig 1 rotates and jig 2 is fixed. By bringing the first member 314a and the second member 314b into contact with each other and rotating jig 1, frictional heat is generated between the outer circumferential surface 362 of the first member 314a and the inner circumferential surface 364 of the second member 314b, allowing for thermal diffusion bonding. At this time, the dimensions of the tapered portions of each member are set to interfere with each other as a melting allowance. In addition, the processed surface of the high-melting-point member may be deliberately made rough to contribute to improving the bonding strength from the low-melting-point side. After thermal diffusion bonding of the two, the retainer 314 in the final product shape is obtained by processing it into an arbitrary ring shape.

[0047] Although several embodiments of the present invention have been described above, the embodiments described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved without departing from its spirit, and of course, equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved.

[0048] In one embodiment, the present application discloses a retainer that is arranged to surround a substrate in a top ring that presses a substrate toward a polishing pad. The retainer includes a first member having a sliding surface with the polishing pad, a second member having a sliding surface with the polishing pad and arranged outside the sliding surface of the first member, and the wear resistance of the second member against sliding with the polishing pad is higher than that of the first member, and a coupling mechanism that couples the first member and the second member.

[0049] In one embodiment, the present application further discloses a retainer that is arranged to surround a substrate in a top ring that holds a substrate and presses it toward a polishing pad. The first member is formed in an annular shape, and the second member is formed in an annular shape.

[0050] In one embodiment, the present application further discloses a retainer that is arranged to surround a substrate when viewed from a direction perpendicular to a polishing surface that is the surface of the substrate to be polished. The first member has a sliding surface that slides with the polishing pad when pressing the polishing surface toward the polishing pad, and the second member has a sliding surface that slides with the polishing pad when pressing the polishing surface toward the polishing pad.

[0051] In one embodiment, the present application further discloses a retainer in which the first member has a base portion arranged inside the second member and a flange portion protruding from the base portion to the upper part of the second member.

[0052] In one embodiment, the present application further discloses a retainer in which the second member has a base portion arranged outside the first member and a flange portion protruding from the base portion to the upper part of the first member. The coupling mechanism includes an alignment hole that penetrates the flange portion and reaches the inside of the first member, an alignment pin that protrudes downward from a top ring body of the top ring and is inserted into the alignment hole, a screw hole that penetrates the top ring body and reaches the inside of the first member, and a screw member that is inserted into the screw hole and fixes the first member to the top ring body.

[0053] Furthermore, in one embodiment, the present application discloses a retainer in which the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member, and the coupling mechanism includes an annular groove formed at the contact portion between the base portion and the second member, a rod-shaped fitting member disposed in the groove, a pin hole that penetrates the flange portion and reaches the interior of the second member, and a rotation-preventing pin inserted into the pin hole.

[0054] Furthermore, the present application discloses a retainer in which, as one embodiment, the coupling mechanism further includes an insertion opening that communicates with the groove from the outside of the second member, and the fitting member is inserted into the groove via the insertion opening and positioned in the groove.

[0055] Furthermore, the present application discloses a retainer in one embodiment in which the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member, and the coupling mechanism includes a first flow path formed in an annular shape at the contact portion between the flange portion and the second member, a plurality of first holes communicating with the first flow path from the upper surface of the flange portion, a first fixing member filled in the first flow path and the plurality of first holes, a second flow path formed in an annular shape at the contact portion between the base portion and the second member, a plurality of second holes communicating with the second flow path from the inner surface of the base portion, and a second fixing member filled in the second flow path and the plurality of second holes.

[0056] Furthermore, the present application discloses a retainer in which, as one embodiment, the plurality of first holes include a first injection hole communicating with the first flow path from the upper surface of the flange portion and a first vent hole communicating with the first flow path from the upper surface of the flange portion, and the first fixing member is flowed into the first flow path through the first injection hole and filled and hardened in the first flow path, the first injection hole and the first vent hole; and the plurality of second holes include a second injection hole communicating with the second flow path from the inner surface of the base portion and a second vent hole communicating with the second flow path from the inner surface of the base portion, and the second fixing member is flowed into the second flow path through the second injection hole and filled and hardened in the second flow path, the second injection hole and the second vent hole.

[0057] Furthermore, in one embodiment, the present application discloses a retainer in which the coupling mechanism includes a first thread formed on the outer circumferential surface of the first member, a second thread formed on the inner circumference of the second member so as to screw into the first thread, a pin hole formed at the contact portion between the first member and the second member, which are coupled by screwing the first thread and the second thread together, and a rotation-preventing pin inserted into the pin hole.

[0058] Furthermore, the present application discloses a retainer in which, as one embodiment, the coupling mechanism includes a tapered outer surface of the first member and an inner surface of the second member tapered to join with the outer surface of the first member, and the first member and the second member are rotationally friction-joined by rotating at least one of the first member and the second member to rub against the outer surface of the first member and the inner surface of the second member.

[0059] Furthermore, the present application discloses, as one embodiment, a top ring for holding a substrate and pressing it toward a polishing pad, comprising a rotating shaft, a top ring body fixed to the rotating shaft, and a retainer as described above attached to the top ring body.

[0060] Furthermore, the present application discloses, as one embodiment, a substrate processing apparatus having the top ring described above and a polishing table configured to hold a polishing pad.

[0061] 3 Polishing device 10 Polishing pad 30A Polishing table 31A Top ring 312 Top ring body 314 Retainer 314a First component 314a-1 Base part 314a-2 Flange part 314b Second component 314b-1 Base part 314b-2 Flange part 320 Coupling mechanism 322 Alignment hole 324 Alignment pin 326 Screw hole 328 Screw member 330 Coupling mechanism 332 Groove 334 Fitting member 336 Pin hole 338 Rotation stopper pin 339 Insertion port 340 Coupling mechanism 341 First flow path 342 First hole 342-1 First injection hole 342-2 First air vent hole 343 First fixing member 345 Second flow path 346 Second hole 346-1 Second injection hole 346-2 Second air vent hole 347 Second fixing member 350 Coupling mechanism 352 First screw thread 354 Second screw thread 356 Pin hole 358 Rotation stopper pin 360 Coupling mechanism 362 Outer surface 364 Inner surface 1000 CMP device W substrate

Claims

1. A retainer disposed in a top ring that presses a substrate toward a polishing pad, the retainer comprising: a first member having a sliding surface with respect to the polishing pad; a second member having a sliding surface with respect to the polishing pad, disposed outside the sliding surface of the first member, and having abrasion resistance to sliding with the polishing pad that is higher than the abrasion resistance of the first member; and a coupling mechanism that connects the first member and the second member.

2. The retainer according to claim 1, wherein the retainer is arranged to surround the substrate in a top ring that holds the substrate and presses it toward a polishing pad, the first member is formed in an annular shape, and the second member is formed in an annular shape.

3. The retainer according to claim 2, wherein the retainer is arranged to surround the substrate when viewed from a direction perpendicular to the polishing surface which is the surface of the substrate to be polished, the first member has a sliding surface that slides with the polishing pad when the polishing surface is pressed toward the polishing pad, and the second member has a sliding surface that slides with the polishing pad when the polishing surface is pressed toward the polishing pad.

4. The retainer according to claim 3, wherein the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member.

5. The retainer according to claim 1, wherein the second member has a base portion disposed on the outside of the first member and a flange portion extending from the base portion to the upper part of the first member, and the coupling mechanism includes an alignment hole that penetrates the flange portion and reaches the interior of the first member, an alignment pin that protrudes downward from the top ring body of the top ring and is inserted into the alignment hole, a screw hole that penetrates the top ring body and reaches the interior of the first member, and a screw member that is inserted into the screw hole and fixes the first member to the top ring body.

6. The retainer according to claim 1, wherein the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member, and the coupling mechanism includes an annular groove formed at the contact portion between the base portion and the second member, a rod-shaped fitting member disposed in the groove, a pin hole that penetrates the flange portion and reaches the interior of the second member, and a rotation-preventing pin inserted into the pin hole.

7. The retainer according to claim 6, wherein the coupling mechanism further includes an insertion opening communicating with the groove from the outside of the second member, and the fitting member is inserted into the groove via the insertion opening and positioned in the groove.

8. The retainer according to claim 1, wherein the first member has a base portion disposed inside the second member and a flange portion extending from the base portion to the upper part of the second member, and the coupling mechanism includes: a first flow path formed in an annular shape at the contact portion between the flange portion and the second member; a plurality of first holes communicating with the first flow path from the upper surface of the flange portion; a first fixing member filling the first flow path and the plurality of first holes; a second flow path formed in an annular shape at the contact portion between the base portion and the second member; a plurality of second holes communicating with the second flow path from the inner surface of the base portion; and a second fixing member filling the second flow path and the plurality of second holes.

9. The retainer according to claim 8, wherein the plurality of first holes include a first injection hole communicating with the first flow path from the upper surface of the flange portion and a first air vent hole communicating with the first flow path from the upper surface of the flange portion, the first fixing member is flowed into the first flow path through the first injection hole and filled and hardened in the first flow path, the first injection hole and the first air vent hole, the plurality of second holes include a second injection hole communicating with the second flow path from the inner surface of the base portion and a second air vent hole communicating with the second flow path from the inner surface of the base portion, the second fixing member is flowed into the second flow path through the second injection hole and filled and hardened in the second flow path, the second injection hole and the second air vent hole.

10. The retainer according to claim 1, wherein the coupling mechanism includes: a first thread formed on the outer circumferential surface of the first member; a second thread formed on the inner circumference of the second member so as to screw into the first thread; a pin hole formed at the contact portion between the first member and the second member, which are coupled by screwing the first thread and the second thread together; and a rotation-preventing pin inserted into the pin hole.

11. The retainer according to claim 1, wherein the coupling mechanism includes a tapered outer surface of the first member and an inner surface of the second member tapered to join with the outer surface of the first member, and the first member and the second member are rotationally friction-joined by rotating at least one of the first member and the second member to rub against the outer surface of the first member and the inner surface of the second member.

12. A top ring for holding a substrate and pressing it toward a polishing pad, comprising: a rotating shaft; a top ring body fixed to the rotating shaft; and a retainer according to any one of claims 1 to 11 attached to the top ring body.

13. A substrate processing apparatus comprising the top ring described in claim 12 and a polishing table configured to hold a polishing pad.

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