Heat dissipation structure and power electronic device

By incorporating a liquid-contacting structure in the energy storage converter to collect leaked coolant, the problems of internal chassis temperature rise and safety risks are solved, achieving both efficient heat dissipation and improved safety performance.

WO2026143919A1PCT designated stage Publication Date: 2026-07-09SUNGROW POWER SUPPLY CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SUNGROW POWER SUPPLY CO LTD
Filing Date
2025-04-29
Publication Date
2026-07-09

AI Technical Summary

Technical Problem

The high integration of components such as energy storage converters and battery units leads to severe overheating inside the chassis. When using air-liquid heat exchangers for heat dissipation, coolant leakage affects safe operation and may even cause the risk of explosion or fire.

Method used

Design a heat dissipation structure including a heat exchanger and a liquid receiving structure. The liquid receiving structure is set below the heat exchanger to collect leaked coolant, reduce direct contact between coolant and electrical components, and improve safety performance.

Benefits of technology

It effectively collects leaked coolant, reduces direct contact with electrical components, improves the safety performance of the chassis, and reduces the risk of engine crashes and fires.

✦ Generated by Eureka AI based on patent content.

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Abstract

A heat dissipation structure and a power electronic device, relating to the technical field of thermal management. The heat dissipation structure comprises a heat exchanger (30) and a liquid-receiving structure (50), wherein a circulating coolant is configured in the heat exchanger (30); the liquid-receiving structure (50) is located below the heat exchanger (30), and the liquid receiving structure (50) is provided with a liquid-accommodating cavity and a liquid-receiving port in communication with the liquid-accommodating cavity; and the orthographic projection of the heat exchanger (30) facing the liquid-receiving structure (50) is located in the liquid-receiving port.
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