Submerged thermal management system

Abstract

This utility model provides an immersion thermal management system, comprising: a working chamber for housing a heating element; a cooling unit array located within the working chamber, the cooling unit array comprising multiple cooling units arranged at intervals, each cooling unit containing a flowing cooling liquid, the heating element being located between adjacent cooling units; a first heat exchanger connected to the cooling unit array via a liquid pipeline for cooling the cooling liquid; and a gas source connected to the working chamber via a gas pipeline for supplying a high thermal conductivity gas to the working chamber, the heating element being immersed in the high thermal conductivity gas, the high thermal conductivity gas flowing within the working chamber, transferring the heat generated by the heating element to the cooling units, thereby cooling the heating element.

Description

Technical Field

[0001] This utility model relates to the field of cooling technology, specifically to an immersion thermal management system. Background Technology

[0002] With the rise of AI technologies such as ChatGPT, the demand for high computing power in chips and computing devices has exploded, leading to a significant increase in the demand for high-power servers, and consequently, a corresponding increase in the demand for heat dissipation and energy saving.

[0003] Traditional cooling solutions include air cooling and liquid cooling. Air cooling uses airflow to remove heat, ensuring stable server operation. Liquid cooling can be divided into contact liquid cooling and non-contact liquid cooling, depending on the method of heat exchange between the coolant and the server.

[0004] Contact liquid cooling refers to a form of liquid cooling where the coolant is in direct contact with the server, primarily including immersion liquid cooling. Immersion liquid cooling uses coolant as the heat transfer medium, completely immersing the server in the coolant, allowing direct heat exchange between the server and the coolant. Based on whether there is a phase change in the coolant during heat exchange, it can be divided into two categories: immersion single-phase liquid cooling and immersion phase-change liquid cooling. Immersion single-phase liquid cooling immerses the server in coolant, and the coolant dissipates heat through temperature fluctuations in conjunction with the cooling system. During this process, the coolant does not undergo a phase change, resulting in higher heat dissipation efficiency than air cooling. It is suitable for servers with high power density, and the coolant can be recycled. Immersion phase-change liquid cooling immerses the server in coolant, where the coolant dissipates heat through liquid-to-gas transitions, utilizing the principle of liquid vaporization and heat absorption. This results in even higher heat dissipation efficiency and is suitable for ultra-high power density servers, but the system is relatively more complex.

[0005] Non-contact liquid cooling refers to a form of liquid cooling where the coolant does not directly contact the server, such as plate-type liquid cooling. In this method, the liquid cooling plate is attached to the server, and the cooling system dissipates heat indirectly through the liquid cooling plate to the coolant enclosed in the circulation pipes, where the coolant then carries the heat away. This method avoids direct contact with the server, transferring heat indirectly through the liquid cooling plate, making maintenance relatively convenient and suitable for general server scenarios where heat dissipation requirements are not particularly high.

[0006] With the simultaneous and significant increase in chip computing power and power consumption, high-power servers are generating more heat, making traditional cooling technologies such as air cooling and liquid cooling insufficient to meet heat dissipation requirements. Therefore, the cooling industry urgently needs a practical cooling device that can effectively solve the problems of heat dissipation and energy saving. Utility Model Content

[0007] To solve the above-mentioned technical problems, the embodiments of this utility model provide an immersion thermal management system that integrates the advantages of air cooling, cold plate cooling and immersion cooling. In a sealed working chamber, the heating device is immersed in a gas cooling medium with good thermal conductivity. The heat generated by the heating device is carried away by the cooling unit through the reflux circulation of the gas cooling medium.

[0008] According to some embodiments of this utility model, an immersion thermal management system is provided, comprising: a working chamber for placing a heating device; a cooling unit array located within the working chamber, the cooling unit array comprising a plurality of cooling units arranged at intervals, each cooling unit containing a flowing cooling liquid, the heating device being located between adjacent cooling units; a first heat exchanger connected to the cooling unit array via a liquid pipeline for cooling the cooling liquid; and a gas source connected to the working chamber via a gas pipeline for supplying a high thermal conductivity gas into the working chamber, the heating device being immersed in the high thermal conductivity gas, the high thermal conductivity gas flowing within the working chamber, transferring the heat generated by the heating device to the cooling units, thereby cooling the heating device.

[0009] According to some embodiments of this utility model, the high thermal conductivity gas includes an inert gas, hydrogen, nitrogen, or air.

[0010] According to some embodiments of this utility model, the inert gas includes helium and neon.

[0011] According to some embodiments of the present invention, the liquid pipeline includes an inlet pipeline and an outlet pipeline. The inlet pipeline is provided with a first pressure sensor for detecting the pressure of the cooling liquid in the inlet pipeline; and / or the outlet pipeline is provided with a first temperature sensor for detecting the temperature of the cooling liquid in the outlet pipeline.

[0012] According to some embodiments of the present invention, the interface between the liquid pipeline and each cooling unit of the cooling unit array is located outside the working chamber.

[0013] According to some embodiments of the present invention, the gas pipeline is provided with: a second temperature sensor for detecting the temperature of the high thermal conductivity gas in the gas pipeline; and / or a second pressure sensor for detecting the pressure of the high thermal conductivity gas in the gas pipeline.

[0014] According to some embodiments of the present invention, the gas pipeline is further provided with a second heat exchanger for cooling the high thermal conductivity gas.

[0015] According to some embodiments of the present invention, the high thermal conductivity gas flows vertically within the working chamber, multiple cooling units are arranged at intervals along the vertical direction, and multiple heating devices are arranged at intervals along the horizontal direction between adjacent cooling units.

[0016] According to some embodiments of this utility model, each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is perpendicular to the flow direction of the high thermal conductivity gas.

[0017] According to some embodiments of the present invention, the high thermal conductivity gas flows horizontally within the working chamber, multiple cooling units are arranged at intervals along the vertical direction, and the heating device is arranged between adjacent cooling units.

[0018] According to some embodiments of this utility model, each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is parallel to the flow direction of the high thermal conductivity gas.

[0019] According to some embodiments of the present invention, the high thermal conductivity gas flows horizontally within the working chamber, the cooling unit array includes multiple sets of cooling units, the multiple sets of cooling units are arranged at intervals along the vertical direction, each set of cooling units includes multiple cooling units arranged at intervals along the horizontal direction, and multiple heating devices are arranged at intervals along the vertical direction between adjacent cooling units.

[0020] According to some embodiments of this utility model, each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is perpendicular to the flow direction of the high thermal conductivity gas.

[0021] According to some embodiments of the present invention, at least two working chambers are included, and adjacent working chambers are interconnected.

[0022] According to some embodiments of the present invention, the high thermal conductivity gas flows horizontally within the working chamber, the cooling unit array includes multiple sets of cooling units, the multiple sets of cooling units are arranged at intervals along the horizontal direction, each set of cooling units includes multiple cooling units arranged at intervals along the vertical direction, the heating device is arranged between adjacent cooling units, and the cooling units in adjacent sets are arranged alternately, so that the heating components are arranged alternately.

[0023] According to some embodiments of this utility model, each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is parallel to the flow direction of the high thermal conductivity gas.

[0024] According to some embodiments of this utility model, the gas pipeline is equipped with a safety valve, which discharges the high thermal conductivity gas in the working chamber when the pressure in the working chamber is too high.

[0025] According to some embodiments of this utility model, the pressure inside the working chamber is not less than 0.25 atm, and the flow velocity of the high thermal conductivity gas is not less than 0.25 m / s.

[0026] According to the immersion thermal management system of this utility model, the heating element and the cooling unit are arranged in the working chamber, the heating element is arranged between adjacent cooling units, the working chamber is filled with a high thermal conductivity gas, the heating element is immersed in the high thermal conductivity gas, the high thermal conductivity gas flows in the working chamber, and transfers the heat generated by the heating element to the cooling unit, thereby cooling the heating element.

[0027] According to some embodiments of this invention, heat transfer efficiency is improved by selecting a gas with high thermal conductivity as the heat transfer medium. Optimal temperature control is achieved by adjusting the flow field of the high thermal conductivity gas within the working chamber.

[0028] According to some embodiments of this utility model, the interface of each cooling unit in the cooling unit array is located outside the working chamber. Even if the pipeline leaks, because the interface is external, the leaked cooling liquid will not come into contact with the heat-generating device and will not affect its operation.

[0029] According to some embodiments of this utility model, by setting a pressure sensor, the pressure inside the working chamber can be adjusted to improve heat transfer efficiency.

[0030] According to some embodiments of this utility model, by selecting an inert gas as the heat transfer medium, the inert gas has stable chemical properties and does not react with the heating device, which can prevent the sulfidation of the component, block impurities, improve the stability of the heating device, reduce the probability of failure, and reduce maintenance costs. Attached Figure Description

[0031] The above and other objects, features and advantages of this disclosure will become more apparent from the more detailed description of exemplary embodiments thereof taken in conjunction with the accompanying drawings, wherein like reference numerals generally denote like parts.

[0032] Figure 1 A schematic diagram of an immersion thermal management system according to an embodiment of the present invention is shown;

[0033] Figure 2 A schematic diagram of the structure of an immersion thermal management system according to another embodiment of the present invention is shown;

[0034] Figure 3 It shows Figure 2 A schematic diagram of the front side of the immersion thermal management system in the middle;

[0035] Figure 4 A schematic diagram of the structure of an immersion thermal management system according to another embodiment of the present invention is shown;

[0036] Figure 5 A schematic diagram of the structure of an immersion thermal management system according to another embodiment of the present invention is shown;

[0037] Figure 6 A schematic diagram of the structure of an immersion thermal management system according to another embodiment of the present invention is shown;

[0038] Figure 7A The diagram shows the temperature field distribution of a heating device cooled by an immersion thermal management system according to an embodiment of the present invention.

[0039] Figure 7B The temperature field distribution diagram of a heat-generating device that is cooled by air in the prior art is shown. Detailed Implementation

[0040] The implementation and use of the embodiments are discussed in detail below. However, it should be understood that the specific embodiments discussed are merely illustrative of specific ways of implementing and using the present invention, and are not intended to limit the scope of the present invention. In the description, the structural positions of the various components, such as upper, lower, top, bottom, etc., are not absolute but relative. These directional descriptions are appropriate when the various components are arranged as shown in the figures, but these directional descriptions also change accordingly when the positions of the various components in the figures change.

[0041] With the simultaneous and significant increase in chip computing power and power consumption, high-power servers generate more heat, making it difficult for traditional cooling technologies such as air cooling and liquid cooling to meet heat dissipation requirements.

[0042] Air cooling has disadvantages such as low heat exchange efficiency, poor heat dissipation, high noise, and reduced server lifespan. It is mainly used in low-computing-power environments.

[0043] Cold plate liquid cooling involves bonding a liquid cooling plate to heat-dissipating components on the server, such as computing chips, using thermally conductive silicone to remove heat. Its complex structure requires comprehensive design considerations based on the server backplane, PCBA, connection methods, and components, resulting in high design requirements and costs. Furthermore, cold plate liquid cooling systems typically have numerous pipe joints, posing a risk of leakage and potentially impacting server lifespan.

[0044] Phase change immersion liquid cooling removes heat by evaporating liquid refrigerants such as fluorinated liquids, resulting in a complex system structure. Immersion in liquid also affects the electrical signals and device reliability of communication equipment. Furthermore, fluorinated liquids are expensive and face environmental policy pressures, posing a risk of production shutdowns.

[0045] Single-phase immersion liquid cooling involves submerging the server in liquid, which can cause swelling of connectors, printed circuit boards, and devices, leading to device failure. Replacing air with coolant can affect dielectric properties due to changes in the liquid's dielectric constant, impacting the signal integrity of connectors and PCBs. Additionally, it incurs high initial construction and modification costs.

[0046] Therefore, embodiments of this utility model provide an immersion thermal management system that integrates the advantages of air cooling, cold plate cooling, and immersion cooling. In a sealed working chamber, the heating element is immersed in a gas cooling medium with good thermal conductivity. Through the reflux circulation of the gas cooling medium, the heat generated by the heating element is carried away by the cooling unit.

[0047] According to an embodiment of this utility model, an immersion thermal management system is provided. The immersion thermal management system includes: a working chamber for housing a heating element; a cooling unit array located within the working chamber, the cooling unit array comprising multiple cooling units arranged at intervals, each cooling unit containing a flowing cooling liquid, the heating element located between adjacent cooling units; and a gas source connected to the working chamber via a gas pipeline for supplying a high thermal conductivity gas to the working chamber. The heating element is immersed in the high thermal conductivity gas, which flows within the working chamber, transferring the heat generated by the heating element to the cooling units, thereby cooling the heating element.

[0048] Figure 1 A schematic diagram of an immersion thermal management system 100 according to an embodiment of the present invention is shown. Figure 1As shown, the immersion thermal management system 100 includes a working chamber 10, a cooling unit array 20, and a gas source 30. The working chamber 10 can be formed as a container for housing multiple heat-generating devices 40, such as servers. The cooling unit array 20 is located within the working chamber 10 and includes multiple cooling units 21 arranged at intervals. Each cooling unit 21 contains a flowing cooling liquid, such as cooling water, with an initial temperature typically between -20°C and 20°C. Heat-generating devices 40 are located between adjacent cooling units 21, and one or more heat-generating devices 40 can be arranged between adjacent cooling units 21. The gas source 30, such as a gas cylinder, supplies a high thermal conductivity gas to the working chamber 10, immersing the heat-generating devices 40 in the gas. The high thermal conductivity gas flows within the working chamber 10, transferring the heat generated by the heat-generating devices 40 to the cooling units 21. Heat is then exchanged with the cooling liquid in the cooling units 21, removing the heat and thus cooling the heat-generating devices 40.

[0049] In some embodiments, the distance between the cooling unit 21 and the heating device 40 is 5 mm to 40 mm, and the distance between adjacent cooling units 21 can be adjusted according to the size of the heating device 40 to be cooled. The cooling unit 21 and the heating device 40 can be placed in the working chamber 10 by means of a bracket or the like.

[0050] In some embodiments, the high thermal conductivity gas is an inert gas, such as helium or neon. In some embodiments, the high thermal conductivity gas may also be hydrogen, nitrogen, or air. When air is used, the working chamber may be sealed or not completely sealed. Not completely sealed means that a completely sealed state is not pursued in the design, allowing for areas of incomplete sealing within the working chamber; when inert gases, hydrogen, or nitrogen are used, the working chamber is sealed and not connected to the outside atmosphere.

[0051] In some embodiments, the immersion thermal management system 100 further includes a first heat exchanger 22, which is connected to the cooling unit array 20 via a liquid pipeline 23 for heat exchange with the cooling liquid flowing out of the cooling unit 21, thereby reducing the temperature of the cooling liquid. The liquid pipeline 23 can be made of a material with high thermal conductivity, such as aluminum alloy or copper, to facilitate heat transfer. The size of the liquid pipeline 23 can be adjusted according to the heat output of the heating device 40.

[0052] In some embodiments, the liquid pipeline 23 includes an inlet pipeline 231 and an outlet pipeline 232. The inlet pipeline 231 of the liquid pipeline 23 is equipped with a first pressure sensor 24, such as a pressure gauge, for detecting the pressure of the cooling liquid within the inlet pipeline 231. In some embodiments, the outlet pipeline 232 of the liquid pipeline 23 is equipped with a first temperature sensor 25, such as a thermometer, for detecting the temperature of the cooling liquid within the outlet pipeline 232. By providing the first pressure sensor 24 and the first temperature sensor 25, it is convenient to monitor the system's operating status and adjust the pressure, flow rate, etc., of the liquid pipeline 23 in real time. For example, when the monitoring system detects that the temperature of the first temperature sensor 25 is higher than a set value, the flow rate of the cooling liquid is increased via a control device.

[0053] In some embodiments, the liquid line 23 is connected to each cooling unit 21 of the cooling unit array 20 via an interface 233. As shown in the figure, one end of each cooling unit 21 is connected to the inlet line 231 of the liquid line 23 via an interface 233, and the other end is connected to the outlet line 232 of the liquid line 23 via an interface 233. These interfaces 233 are all located outside the working chamber 10. Even if a coolant leak occurs, the heating element 40 inside the working chamber 10 will not be damaged.

[0054] In some embodiments, the gas source 30 is connected to the working chamber 10 via the gas pipeline 32. High thermal conductivity gas flows into the working chamber 10 through the gas pipeline 32, transferring the heat generated by the heating device 40 to the cooling unit 21, and then flows back from the working chamber 10 to the gas pipeline 32, forming a gas circulation loop.

[0055] In some embodiments, the gas pipeline 32 is provided with a second pressure sensor 33, such as a pressure gauge, for detecting the pressure of the high thermal conductivity gas within the gas pipeline 32. In some embodiments, the gas pipeline 32 is provided with a second temperature sensor 34, such as a thermometer, for detecting the temperature of the high thermal conductivity gas within the gas pipeline 32. When the outlet temperature of the gas pipeline 32 is high, the flow rate of the cooling liquid in the cooling unit 21 can be adjusted, and the inlet gas pressure and flow rate of the gas pipeline 32 can be increased.

[0056] By setting a second pressure sensor 33 and a second temperature sensor 34, the system's operating status can be easily monitored, and the pressure and flow rate of the gas pipeline 32 can be adjusted in real time. In some embodiments, the gas source 30 also includes a gas replenishment pipeline. For example, when the pressure of the high thermal conductivity gas is lower than a set threshold, gas is replenished through a gas source cylinder to maintain the pressure inside the working chamber 10. The gas replenishment pipeline solves the problem of chronic gas leakage. The gas replenishment pipeline can also be set up separately. When the pressure inside the working chamber 10 is too high, the safety valve on the gas pipeline 32 can be opened to discharge the gas inside the working chamber 10, thereby achieving pressure relief.

[0057] In some embodiments, the gas pipeline 32 is provided with a second heat exchanger 31 for exchanging heat with the high thermal conductivity gas exiting the working chamber 10, thereby reducing the temperature of the high thermal conductivity gas. In some embodiments, the high thermal conductivity gas transfers heat to the cooling unit 21. Since the temperature difference between the high thermal conductivity gas entering and leaving the working chamber 10 is not significant, the gas source 30 may not include the second heat exchanger 31. In some embodiments, the first heat exchanger 22 and the second heat exchanger 31 may share a single heat exchanger.

[0058] The gas pipeline 32 includes an inlet pipeline 321 and an outlet pipeline 322. A second pressure sensor 33 is disposed on the inlet pipeline 321, located between the working chamber 10 and the second heat exchanger 31. A second temperature sensor 34 is disposed on the outlet pipeline 322, located between the working chamber 10 and the second heat exchanger 31. The gas pipeline 32 also includes multiple inlets and multiple outlets, each connected to the working chamber 10.

[0059] Heat exchangers are key components for heat exchange between cold and hot fluids. Through a separate dual-circulation design, they can effectively cool the main equipment. In embodiments of this invention, the first heat exchanger 22 and the second heat exchanger 31 can be either air-cooled or liquid-cooled heat exchangers.

[0060] In an air-cooled heat exchanger, the heat transfer medium flows through the inner cavity of a metal pipe, while air flows through the outer wall of the metal pipe. Forced convection by a fan causes the air to sweep across the fin surface, carrying away heat and thus achieving heat exchange. For example, in embodiments of this invention, the first heat exchanger 22 and the second heat exchanger 31 employ air-cooled finned tube condensers. High-temperature liquid or gaseous refrigerant flows inside copper pipes, and heat is conducted to the fins via the copper pipes. An outdoor fan operates, causing air to flow rapidly across the fin surface, carrying away heat and cooling the liquid or gaseous refrigerant.

[0061] In a liquid-cooled heat exchanger, the working principle is based on heat conduction and heat convection. The heating device transfers heat to the refrigerant (such as the cooling liquid and highly thermally conductive gas in this invention) that is in contact with it or indirectly in contact with it. The refrigerant circulates and carries away the heat. Then, on the other side of the heat exchanger, a low-temperature cooling medium (such as water, alcohol, or other cooling liquid) absorbs the heat transferred from the refrigerant, thereby cooling the heating device and realizing the transfer of heat from the heating device to the cooling medium.

[0062] In a liquid-cooled heat exchanger, the cold and hot fluids are separated by a solid wall, and heat transfer occurs through the wall; the two fluids do not mix. Types of heat exchangers include shell-and-tube, plate, spiral plate, and plate-fin heat exchangers.

[0063] Figure 2-3A schematic diagram of the structure of an immersion thermal management system 100 according to another embodiment of the present invention is shown. Figure 2-3 As shown, a highly thermally conductive gas flows in a generally vertical direction within the working chamber 10, for example, from bottom to top. A plurality of cooling units 21 are arranged at intervals in a generally vertical direction, and a plurality of heating devices 40 are arranged at intervals in a generally horizontal direction between adjacent cooling units 21.

[0064] In some embodiments, each heating element 40 is parallel to the flow direction of the high thermal conductivity gas; that is, the plane of the largest area of ​​each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, i.e., arranged along the vertical direction. Each cooling unit 21 is perpendicular to the flow direction of the high thermal conductivity gas; that is, the plane of the largest area of ​​each cooling unit 21 is perpendicular to the flow direction of the high thermal conductivity gas, i.e., arranged along the horizontal direction. Through this arrangement, the high thermal conductivity gas can quickly carry away the heat generated by the heating element 40 and transfer it to the cooling unit 21.

[0065] Cooling liquid (e.g., low-temperature cooling water) in the first heat exchanger 22 (e.g., a chiller) flows into the cooling unit 21 through the inlet pipe 231 of the liquid pipe 23, and then flows back into the first heat exchanger 22 through the outlet pipe 232 of the liquid pipe 23, forming a liquid circulation loop.

[0066] The high thermal conductivity gas in the gas source 30 flows into the working chamber 10 through the gas pipeline 32, and then flows back from the working chamber 10 to the gas pipeline 32, forming a gas circulation loop. Alternatively, a second heat exchanger 31 is installed on the gas pipeline 32 to cool the gas after heat exchange before it flows into the working chamber 10, forming a gas circulation loop.

[0067] The gas pipeline 32 is equipped with a second pressure sensor 33 for detecting the pressure of the high thermal conductivity gas in the gas pipeline 32, and a second temperature sensor 34 for detecting the temperature of the high thermal conductivity gas in the gas pipeline 32.

[0068] Gas pipeline 32 is also equipped with a safety valve 35. When the second pressure sensor 33 detects that the pressure of the high thermal conductivity gas in gas pipeline 32, i.e. the pressure in working chamber 10, is too high, the safety valve 35 is opened to discharge the high thermal conductivity gas in working chamber 10.

[0069] The gas line 32 may also be equipped with a check valve to prevent backflow of the high thermal conductivity gas. The gas line 32 may also be equipped with a ball valve to regulate the flow rate of the high thermal conductivity gas.

[0070] The heat-generating device 40, such as a server, is an object that needs to be cooled and generates heat during operation. Cooling units 21, such as condensers, are arranged in an array within the working chamber 10. The heat-generating devices 40 are arranged between the cooling units 21. Since the working chamber 10 is filled with a highly thermally conductive gas, the heat-generating devices 40 are immersed in the highly thermally conductive gas environment. The highly thermally conductive gas comes into contact with the heat-generating devices 40 and transfers the heat of the heat-generating devices 40 to the cooling units 21. The cooling liquid in the cooling units 21 carries away the heat, and the hot cooling liquid flows to the first heat exchanger 22 to continuously transfer the heat.

[0071] Gas source 30 provides high thermal conductivity gas to working chamber 10 and provides circulation power for the gas circulation loop, ensuring continuous circulation of the high thermal conductivity gas within working chamber 10 and continuously removing heat from heating device 40. The high thermal conductivity gas enters working chamber 10 from the bottom, contacts heating device 40, and transfers heat from heating device 40 to the high thermal conductivity gas. The high thermal conductivity gas flows out from the top of working chamber 10, flowing to the second heat exchanger 31 of gas source 30 to transfer heat, and then flows back to working chamber 10 to continue cooling heating device 40, forming a gas circulation loop.

[0072] A sealing ring 12 is installed on the door 11 of the working chamber 10 to provide a sealed environment and prevent leakage of the high thermal conductivity gas inside the working chamber 10. A reflux device 13, such as a reflux fan, is installed above the working chamber 10 to accelerate the circulation of the high thermal conductivity gas, assist in heat dissipation, and accelerate the dissipation of heat inside the working chamber 10, achieving a rapid cooling effect. The working chamber 10 may also be equipped with a flow equalization device, such as a flow equalization plate, to make the airflow distribution more uniform and ensure the effectiveness of heat exchange.

[0073] Figure 4 A schematic diagram of an immersion thermal management system 100 according to an embodiment of the present invention is shown. Figure 4 As shown, a high thermal conductivity gas flows in from one side of the working chamber 10 and flows out from the other side of the working chamber 10. The high thermal conductivity gas flows in the working chamber 10 in a generally horizontal direction. Multiple cooling units 21 are arranged at intervals in a generally vertical direction. A heating device 40 is arranged between adjacent cooling units 21.

[0074] In some embodiments, each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, that is, the plane of the largest area of ​​each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, i.e., arranged in a horizontal direction; each cooling unit 21 is parallel to the flow direction of the high thermal conductivity gas, that is, the plane of the largest area of ​​each cooling unit 21 is parallel to the flow direction of the high thermal conductivity gas, i.e., arranged in a horizontal direction.

[0075] In the illustrated embodiment, the high thermal conductivity gas enters and exits from one side, and the airflow direction of the high thermal conductivity gas is parallel to the heating device 40 and the cooling unit 21. The high thermal conductivity gas enters the working chamber 10 from one side through the flow equalization plate, passes through the heating device 40 and the cooling unit 21, and then flows out from the other side. The hot high thermal conductivity gas flows to the second heat exchanger 31, transfers heat, and then flows back to the working chamber 10 to continue cooling the heating device 40, forming a gas circulation loop.

[0076] Figure 5 A schematic diagram of an immersion thermal management system 100 according to an embodiment of the present invention is shown. Figure 5 As shown, a high thermal conductivity gas flows in the working chamber 10 in a generally horizontal direction. The cooling unit array 20 includes multiple sets of cooling units, with each row of cooling units constituting a set of cooling units. The working chamber 10 in the figure is provided with three sets of cooling units, which are arranged at intervals along a generally vertical direction. Each set of cooling units includes multiple cooling units 21 arranged at intervals along a horizontal direction. Multiple heat-generating devices 40 are arranged at intervals along a generally vertical direction between adjacent cooling units 21.

[0077] In some embodiments, each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, that is, the plane of the largest area of ​​each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, i.e., arranged in a horizontal direction; each cooling unit 21 is perpendicular to the flow direction of the high thermal conductivity gas, that is, the plane of the largest area of ​​each cooling unit 21 is perpendicular to the flow direction of the high thermal conductivity gas, i.e., arranged in a vertical direction.

[0078] In the illustrated embodiment, the immersion thermal management system 100 includes two working chambers 10, which are interconnected by gas pipelines. Each working chamber 10 contains a cooling unit array 20. High thermal conductivity gas flows into the first working chamber 10 through multiple inlets 323 of the gas pipeline 32, flows within the first working chamber 10, transfers the heat generated by the heating element 40 to the cooling unit 21, and then flows out of the first working chamber 10 through multiple outlets 324. Then, the gas flows into the adjacent second working chamber 10 through the gas pipeline, transfers the heat generated by the heating element 40 to the cooling unit 21, and then flows out of the second working chamber 10 through multiple outlets 324. Finally, the gas flows back into the first working chamber 10 through the gas pipeline 32, forming a gas circulation loop. By connecting multiple working chambers 10 in series and sharing a single heat exchanger system, it offers good economic efficiency and saves space.

[0079] In the illustrated embodiment, the heating element 40 is placed horizontally, the flow direction of the high thermal conductivity gas is parallel to the heating element 40, and the cooling unit 21 is perpendicular to the heating element 40. The overall structure is compact, has a large loading capacity, and is suitable for heating elements with low heat generation.

[0080] Figure 6 A schematic diagram of an immersion thermal management system 100 according to an embodiment of the present invention is shown. Figure 6 As shown, a high thermal conductivity gas flows in the working chamber 10 in a generally horizontal direction. The cooling unit array 20 includes multiple sets of cooling units, with each column of cooling units constituting a set of cooling units. The working chamber 10 in the figure has three sets of cooling units, which are arranged at intervals along a generally horizontal direction. Each set of cooling units includes multiple cooling units 21 arranged at intervals along a generally vertical direction. The heating element 40 is arranged between adjacent cooling units, and the cooling units 21 in adjacent sets are arranged in an alternating manner, so that the heating element 40 is arranged in an alternating manner.

[0081] In some embodiments, each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, that is, the plane of the largest area of ​​each heating element 40 is parallel to the flow direction of the high thermal conductivity gas, i.e., arranged in a horizontal direction; each cooling unit 21 is parallel to the flow direction of the high thermal conductivity gas, that is, the plane of the largest area of ​​each cooling unit 21 is parallel to the flow direction of the high thermal conductivity gas, i.e., arranged in a horizontal direction.

[0082] In the illustrated embodiment, the heating element 40 is placed horizontally, and the flow direction of the high thermal conductivity gas is parallel to the heating element 40 and the cooling unit 21. The heating element 40 and the cooling unit 21 are arranged alternately to ensure heat exchange efficiency, increase loading capacity, save space, and are economical. This method is suitable for heating equipment with large heat generation.

[0083] In some embodiments, the thermal conductivity of a gas is related to the thermal motion of gas molecules and intermolecular collisions. Under high pressure conditions, the distance between gas molecules is very small, the mean free path is very short, intermolecular collisions are extremely frequent, and intermolecular interactions are enhanced. Therefore, the thermal conductivity of the gas increases with increasing gas pressure, and heat transfer becomes more rapid. Thus, the pressure within the working chamber 10 is not less than 0.25 atm; for example, the pressure within the working chamber 10 is between 0.25 atm and 2 atm.

[0084] In some embodiments, a high thermal conductivity gas is delivered to the working chamber 10 via a pipe or gas cylinder, maintaining a predetermined pressure in the working chamber 10. The working chamber 10 and the cooling unit 21 are filled with the high thermal conductivity gas, which circulates within the working chamber 10, efficiently transferring heat from the heating device 40 to the cooling unit array. The high thermal conductivity gas is continuously flowing within the working chamber 10 through a circulation pipeline, ensuring uniform and efficient heat transfer from the heating device 40 to the cooling unit 21. An external heat exchanger can also be connected to the high thermal conductivity gas circulation loop to cool the gas. The cooled high thermal conductivity gas is then returned to the working chamber 10 for further circulation. Therefore, the flow velocity of the high thermal conductivity gas is not less than 0.25 m / s. For example, the flow velocity of the high thermal conductivity gas is between 0.25 m / s and 10 m / s.

[0085] In the high thermal conductivity gas circulation loop, some auxiliary components, such as flow equalization plates and flow guide plates, can also be set to further optimize the flow distribution and heat exchange effect of the high thermal conductivity gas in the working chamber.

[0086] In some embodiments, the cooling unit 21 mainly consists of copper tubes and fins. The copper tubes, as the core component of the cooling unit array system, are used for the flow of liquid refrigerant and heat exchange. The copper tubes are arranged in a serpentine or spiral pattern within the cooling unit to increase the flow path and heat exchange area of ​​the liquid refrigerant within the tubes. To improve the heat exchange efficiency of the cooling unit 21, fins are installed on the outside of the copper tubes. The fins are typically made of aluminum, which has advantages such as light weight, good thermal conductivity, and corrosion resistance. The fins come in various shapes, such as straight fins, corrugated fins, and louvered fins. The cooling unit 21 is equipped with a liquid refrigerant inlet and outlet for connecting to the piping of the heat exchange system. The inlet and outlet pipe interfaces are located outside the working chamber.

[0087] This immersion thermal management system has a wide range of applications, including data centers, computing devices, servers, switches, communication equipment, precision instruments, energy storage power stations, and fast charging piles. It is also used in electronic devices, such as for cooling heat-generating components like server chips and computer CPUs. Furthermore, it is applied to energy storage cooling, dissipating heat absorbed by battery modules and improving equipment reliability.

[0088] Table 1 shows the server temperature range after cooling using the immersion thermal management system according to an embodiment of the utility model.

[0089]

[0090] The server temperature range refers to the temperature range formed by the lowest to highest temperature of the server inside the working chamber after the thermal management system has been operating stably.

[0091] According to Newton's law of cooling, the convective heat transfer Q (in W) per unit time is:

[0092] Q = h·A·(Ts-Tg);

[0093] Where h represents the convective heat transfer coefficient (W / (m²)). 2 ·K), which is related to gas velocity, physical properties, and flow state, and A represents the effective contact area between the solid and the gas (m²). 2 Ts represents the solid surface temperature (K), and Tg represents the gas inlet temperature (K).

[0094] Under steady-state conditions, the solid's heat output power P is entirely carried away by the gas, that is:

[0095] P=Q= h·A·(Ts-Tg);

[0096] Therefore, Ts = Tg + P / (h·A);

[0097] If it is necessary to reduce the solid surface temperature, the gas inlet temperature Tg should be reduced, the effective contact area A should be increased, or the gas flow rate should be increased (increasing the convective heat transfer coefficient h). Increasing the gas pressure will increase the gas thermal conductivity, thereby increasing the convective heat transfer coefficient h and reducing the solid surface temperature Ts.

[0098] Figure 7A The diagram shows the temperature field distribution of a heating device cooled by an immersion thermal management system according to an embodiment of the present invention. Figure 7B The temperature field distribution diagram of a heat-generating device that is cooled by air in the prior art is shown.

[0099] Figure 7A Corresponding to Example 1, using Figure 6 The immersion thermal management system shown is used for cooling. The server is a 4U unit with a power of 800W. The high thermal conductivity gas is helium with a pressure of 1 atmosphere and a flow rate of 1m / s. The thermal conductivity of helium is 0.15W / (m·K). The server temperature is stable at around 50℃, with uniform temperature distribution and little temperature difference between different locations.

[0100] Figure 7B In contrast to existing air-cooling technologies, the server is a 4U unit with a power of 800W, an air pressure of 1 atmosphere, and a flow rate of 2m / s. The server temperature is stable at around 70℃, resulting in poor cooling performance and uneven temperature distribution with significant temperature differences between different locations.

[0101] According to an embodiment of this invention, a cooling unit array is arranged within the working chamber, with the heating element distributed among the cooling unit array. A gas immersion method is employed, with gas circulating within the working chamber. This rapidly transfers the heat generated by the heating element to the cooling unit, which then works in conjunction with an external cooling circulation system to efficiently remove the heat. This invention immerses the heating element in a gaseous environment, with the gas circulating back and forth, allowing the heat to be carried away by an external heat exchanger. The gaseous medium has virtually no impact on the integrity of high-speed signals, solving the compatibility and signal integrity issues of liquid media in traditional immersion liquid cooling. Furthermore, gas has better permeability than liquid media, allowing it to quickly enter the gaps between complex devices and components, and its excellent fluidity rapidly removes heat. Moreover, the high-speed flow of liquid media exerts a significant impact on devices on the circuit board, affecting their operational stability. This invention uses a gaseous medium with low density, maintaining a high flow rate and minimizing its impact on the devices.

[0102] According to embodiments of this invention, a gaseous refrigerant with high thermal conductivity is used, circulating under pressure. Simultaneously, a cold plate cooling system, combined with an external cooling circulation system, removes heat, resulting in high heat exchange efficiency and excellent cooling effect. While immersion liquid cooling offers good heat dissipation, the coolant is expensive and maintenance is complex. Cold plate cooling is limited by the material of the liquid cooling plate and contact thermal resistance. High thermal conductivity gas, however, can quickly absorb and transfer heat from the heat-generating components, ensuring heat dissipation performance while being lower in cost, simpler to maintain, and quieter. Furthermore, the gas's good flowability allows for more even heat distribution, effectively preventing localized overheating and ensuring that all components of the heat-generating device are in a more suitable temperature environment, thus extending the equipment's lifespan.

[0103] According to embodiments of this invention, a pressure sensor is installed inside the working chamber, allowing for flexible adjustment of the pressure in the sealed system while the server is operating normally, thereby improving heat transfer efficiency. Traditional cooling methods struggle to actively adjust ambient pressure to optimize heat dissipation. Air cooling is heavily influenced by ambient air pressure and cannot be actively changed, while immersion liquid cooling and cold plate cooling have low pressure control requirements and lack effective adjustment methods. This invention, however, adjusts pressure to change gas density and thermal conductivity, accelerating heat transfer. Furthermore, it appropriately increases pressure under high temperature and high load conditions to enhance heat dissipation, and reduces pressure under low load conditions to save energy and reduce consumption, achieving precise and efficient thermal management. This allows it to adapt to the heat dissipation needs of heat-generating devices in different operating scenarios.

[0104] According to embodiments of this invention, optimal temperature control can be achieved by adjusting the flow field of the gas medium within the system. Traditional air-cooled systems suffer from uneven flow field distribution, easily leading to heat dissipation dead zones. Immersion liquid cooling systems have relatively fixed flow fields, making it difficult to flexibly adapt to differences in heat generation in different parts of the server. Cold plate cooling systems have limited ability to adjust the flow field. The immersion thermal management system of this invention can precisely control the gas flow field by designing gas circuits based on the heat generation status of different areas of the heat-generating components, ensuring that more cooling gas flows through areas with concentrated heat, guaranteeing uniform temperature across all components, and comprehensively improving the stability and reliability of server operation.

[0105] According to embodiments of this invention, selecting an inert gas as the medium can effectively ensure more stable operation of the heating element. Inert gases are chemically stable and do not react with the heating element, creating a pure internal environment, preventing sulfidation of the component, eliminating moisture and dust corrosion, greatly improving the operational stability of the heating element, reducing the probability of malfunctions, and lowering maintenance costs.

[0106] According to embodiments of this invention, the cooling unit's pipe interface is located outside the working chamber. Even if a leak occurs during use, it will not affect the heat-generating device itself. Traditional air cooling does not offer this advantage; a failure of the external cooling device directly impacts heat dissipation. Leaks in plate-type cooling pipes can also affect the heat-generating device. This immersion thermal management system externalizes the cooling unit's pipe interface, isolating the risk of leakage from the heat-generating device. Even if there is a problem with the external piping, the heat-generating device can still operate normally, improving system safety and reliability, reducing downtime due to cooling system failures, and ensuring continuous and stable operation of the heat-generating device.

[0107] According to an embodiment of this utility model, in a cold plate system, since the heating element is in an air environment, the temperature of the cooling water is usually higher than the dew point to avoid damage to the heating element from condensation. This would affect the heat dissipation efficiency of the heating element. In this utility model, since the server is immersed in a dry medium atmosphere in the working chamber, there is no condensation problem. Therefore, the temperature of the cooling liquid can be set without restriction to achieve a higher heat transfer efficiency.

[0108] The technical content and features of this utility model have been disclosed above. However, it is understood that, under the creative concept of this utility model, those skilled in the art can make various changes and improvements to the disclosed concept, all of which fall within the protection scope of this utility model. The description of the above embodiments is illustrative rather than restrictive, and the protection scope of this utility model is determined by the claims.

Claims

1. An immersion thermal management system, characterized in that, include: The working chamber is used to house the heating element; A cooling unit array is located within the working chamber. The cooling unit array includes multiple cooling units arranged at intervals. Each cooling unit contains a flowing cooling liquid, and the heating device is located between adjacent cooling units. A first heat exchanger, connected to the cooling unit array via a liquid pipeline, is used to cool the cooling liquid; and A gas source, connected to the working chamber via a gas pipeline, is used to supply high thermal conductivity gas into the working chamber. The heating device is immersed in the high thermal conductivity gas, which flows within the working chamber, transferring the heat generated by the heating device to the cooling unit, thereby cooling the heating device.

2. The immersion thermal management system according to claim 1, characterized in that, The high thermal conductivity gas includes inert gas, hydrogen, nitrogen, or air.

3. The immersion thermal management system according to claim 2, characterized in that, The inert gases include helium and neon.

4. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The liquid pipeline includes an inlet pipeline and an outlet pipeline. The inlet pipe is equipped with a first pressure sensor for detecting the pressure of the cooling liquid within the inlet pipe; and / or The outlet pipe is equipped with a first temperature sensor for detecting the temperature of the cooling liquid in the outlet pipe.

5. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The interfaces between the liquid pipeline and each cooling unit of the cooling unit array are located outside the working chamber.

6. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The gas pipeline is equipped with: A second temperature sensor is used to detect the temperature of the highly thermally conductive gas within the gas pipeline; and / or The second pressure sensor is used to detect the pressure of the high thermal conductivity gas in the gas pipeline.

7. The immersion thermal management system according to claim 6, characterized in that, The gas pipeline is also equipped with a second heat exchanger for cooling the highly thermally conductive gas.

8. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The high thermal conductivity gas flows vertically within the working chamber, multiple cooling units are arranged at intervals along the vertical direction, and multiple heating devices are arranged at intervals along the horizontal direction between adjacent cooling units.

9. The immersion thermal management system according to claim 8, characterized in that, Each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is perpendicular to the flow direction of the high thermal conductivity gas.

10. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The high thermal conductivity gas flows horizontally within the working chamber, and multiple cooling units are arranged at intervals along the vertical direction, with the heating element positioned between adjacent cooling units.

11. The immersion thermal management system according to claim 10, characterized in that, Each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is parallel to the flow direction of the high thermal conductivity gas.

12. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The high thermal conductivity gas flows horizontally within the working chamber. The cooling unit array includes multiple sets of cooling units, which are arranged at intervals along the vertical direction. Each set of cooling units includes multiple cooling units arranged at intervals along the horizontal direction. Multiple heat-generating devices are arranged at intervals along the vertical direction between adjacent cooling units.

13. The immersion thermal management system according to claim 12, characterized in that, Each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is perpendicular to the flow direction of the high thermal conductivity gas.

14. The immersion thermal management system according to claim 12, characterized in that, It includes at least two working chambers, and adjacent working chambers are interconnected.

15. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The high thermal conductivity gas flows horizontally within the working chamber. The cooling unit array includes multiple sets of cooling units, which are arranged at intervals along the horizontal direction. Each set of cooling units includes multiple cooling units arranged at intervals along the vertical direction. The heating element is arranged between adjacent cooling units, and the cooling units in adjacent sets are arranged in an alternating manner, so that the heating element is arranged in an alternating manner.

16. The immersion thermal management system according to claim 15, characterized in that, Each heating element is parallel to the flow direction of the high thermal conductivity gas, and each cooling unit is parallel to the flow direction of the high thermal conductivity gas.

17. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The gas pipeline is equipped with a safety valve. When the pressure in the working chamber is too high, the high thermal conductivity gas in the working chamber is discharged through the safety valve.

18. The immersion thermal management system according to any one of claims 1 to 3, characterized in that, The pressure inside the working chamber is not less than 0.25 atm, and the flow rate of the high thermal conductivity gas is not less than 0.25 m / s.

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