Electro-polishing head and conductive system for electrochemical mechanical planarization apparatus, and assembly method for conductive system

Abstract

Disclosed in the present invention are an electro-polishing head and a conductive system for an electrochemical mechanical planarization apparatus, and an assembly method for the conductive system. The electro-polishing head comprises: a conductive member, which passes through a polishing head carrier and is used for connecting to an external power supply unit; a conductive post, which passes through a polishing head or the polishing head carrier and at least comprises a housing, a retractable member and a conductive probe, wherein the conductive probe and the housing are separately connected to the retractable member, so that the conductive probe and the housing can slide relative to each other in the axial direction, and the outer wall of the conductive probe is in contact with the inner wall of the housing and is electrically conductive therewith, so that sliding-contact electrical conduction is formed between the conductive probe and the housing; and a conductive post connecting unit, which is provided on the polishing head and is detachably connected to the conductive post. In the present invention, a sliding contact-type conductive device is used in a limited and closed space to tightly connect conductive structures on two adjacent components, thus enabling efficient electrical energy transfer between the adjacent components.

Description

An electropolishing head, conductive system, and assembly method for an electrochemical mechanical planarization device. Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, and in particular relates to an electropolishing head, a conductive system, and an assembly method thereof for an electrochemical mechanical planarization device. Background Technology

[0002] Chemical mechanical planarization (CMP) equipment typically includes a semiconductor equipment front-end module (EFEM), a cleaning unit, and a polishing unit. In the polishing unit, by adjusting parameters such as the pressure applied to the wafer by the polishing head, the polishing head rotation speed, and the polishing pad rotation speed, the wafer undergoes chemical mechanical polishing or planarization treatment on the polishing pad.

[0003] Existing electrochemical mechanical polishing (EMP) planarization processes apply electrical energy to the wafer surface, utilizing the conductivity of the wafer substrate or its surface thin film to initiate an electrochemical reaction on the wafer substrate or its surface thin film, thereby increasing the chemical reaction rate and improving the efficiency of the wafer EMP planarization process.

[0004] In the context of electrochemical mechanical planarization (EMP) processes, polishing heads, in addition to fulfilling their basic functions of clamping, pressing, and rotating wafers, need to add the ability to apply electrical energy to the wafer substrate or wafer surface thin film. Current technology uses ordinary conductive cables within the polishing head structure for conduction during EMP processes. However, this approach leads to problems such as difficulties in installing the conductive cables in certain parts of the structure, and wear and tear damage caused by long-term bending at the connection points between the conductive cables and the structure. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides an electropolishing head, a conductive system and an assembly method for an electrochemical mechanical planarization device, which ensures the conduction of the internal circuit, realizes efficient power transmission, and has a simple and stable installation structure.

[0006] The technical solution adopted by this invention to solve its technical problem is: an electropolishing head for an electrochemical mechanical planarization device, comprising:

[0007] A conductive component, inserted through the polishing head carrier, is used to connect to an external power supply unit;

[0008] A conductive post, inserted into a polishing head or a polishing head carrier, includes at least a housing, a telescopic component, and a conductive probe. The conductive probe and the housing are respectively connected to the telescopic component so that the conductive probe and the housing can slide relative to each other along the axial direction, and the outer wall of the conductive probe contacts and conducts electricity with the inner wall of the housing, so that a sliding contact conductivity is formed between the conductive probe and the housing.

[0009] A conductive post connection unit is located on the polishing head and is detachably connected to the conductive post.

[0010] Furthermore, the conductive element is connected to the conductive post to guide electrical energy to the conductive post.

[0011] Furthermore, the telescopic component is axially assembled inside the housing, and the conductive probe is axially inserted inside the housing with its end face abutting against the telescopic component.

[0012] Furthermore, the conductive probe, telescopic component, and outer shell are arranged concentrically and coaxially.

[0013] Furthermore, the conductive probe head is provided with a conductive connector, which forms a limiting groove, and the conductive probe end forms an end that can be limited and matched with the limiting groove.

[0014] Furthermore, the conductive post connection unit includes a conductive structural component that mates with the polishing head, a flexible cable, and a conductive post connector. The conductive post connector is detachably connected to the conductive post, and the flexible cable is electrically connected to the conductive structural component and the conductive disk inside the polishing head.

[0015] Furthermore, the number of flexible cables is one or two or more; the polishing head has a cavity in which the flexible cables are bent and accommodated.

[0016] Furthermore, the conductive post connection unit includes a conductive post connector that can be detachably connected to the conductive disk.

[0017] Furthermore, the end of the conductive post is provided with a threaded section, which is threadedly connected to the conductive post connecting unit to increase the contact area for transmitting electrical energy.

[0018] The present invention also discloses a conductive system for an electrochemical mechanical planarization device, comprising:

[0019] Power supply unit;

[0020] The electropolishing head as described above;

[0021] wafers;

[0022] The conductive elements, conductive pillars, and conductive disks of the electropolishing head are connected to the power supply unit so that when the polishing head presses the wafer located on the conductive disk, the power supply unit, the electropolishing head, the wafer, and the conductive disk form a conductive path.

[0023] Furthermore, the polishing head has a connector, or the polishing head carrier has a connector, and the conductive post passes through the connector.

[0024] This invention further discloses an assembly method for a conductive system in an electrochemical mechanical planarization device, comprising the following steps:

[0025] The conductive element is inserted into the internal circuit channel of the polishing head carrier, and one end of the conductive element is fixed to the conductive element connector inside the polishing head carrier.

[0026] Fix the conductive post housing to the conductive post connector;

[0027] The conductive post connector is fixed to the internal conductive structure of the polishing head;

[0028] One end of the flexible cable is fixed to the conductive structure inside the polishing head, and the other end of the flexible cable is fixed to the conductive disk.

[0029] The conductive disk is fixedly mounted on the polishing head, and the conductive film is fixedly mounted on the conductive disk;

[0030] The polishing head is fixedly assembled with the polishing head carrier, the telescopic part of the conductive post abuts against the conductive probe, and the end of the conductive probe is tightly attached to the conductive connector to achieve conductivity.

[0031] The beneficial effects of this invention are: 1) In a confined space, a sliding contact conductive device is used to tightly connect two adjacent components (polishing head carrier and polishing head), enabling efficient transmission of electrical energy between adjacent components; 2) By utilizing the sliding and tight contact connection of the conductive column, conductive probe, and conductive column shell, and the setting of the telescopic component in the conductive column, electrical energy is efficiently transmitted between the conductive column, conductive probe, conductive column shell, and their respective connected conductive components and conductive column connectors. The conductive column achieves conductivity through the tight cooperation between the shell and the conductive column connecting unit, realizing efficient transmission of electrical energy; 3) The conductive column includes a separable shell, telescopic component, and conductive probe, simplifying the assembly structure and allowing for easier and faster installation of conductive components inside the polishing head. It also facilitates the assembly and connection of the polishing head and carrier, improving the installation efficiency of the electropolishing head in electrochemical processes. Furthermore, the shell, telescopic component, and conductive probe are non-rigidly connected, increasing the fault tolerance of the conductive structure and making it more convenient and simple to install. 4) The conductive pillars and the conductive pillar connection units are detachably connected, facilitating the assembly of the overall structure; 5) The threaded section structure at the end of the conductive pillar not only increases the connection strength, enabling a stable assembly connection between the conductive pillars and the conductive pillar connection units, but also increases the contact area between the two, achieving more efficient power transmission; 6) The conductive pillar connection unit includes a flexible cable, which can be bent and accommodated in the cavity, providing expansion space for the assembly connection of the conductive disk and the polishing head, reducing assembly difficulty; 7) Utilizing the conductive pillar structure, compared to ordinary cable conduction, reduces the space occupied by the conductive structure and reduces the risk of damage caused by bending of ordinary cables, resulting in higher safety performance; 8) By utilizing the cooperation of multiple components to form a conductive path, only some components need to be replaced when a circuit problem occurs, reducing the usage cost of the conductive path; for different process cavities or usage environments, it is easier to update or replace some components, reducing the update cost of the conductive path. Attached Figure Description

[0032] Figure 1 is a cross-sectional view of the electropolishing head provided by the present invention.

[0033] Figure 2 is a partial cross-sectional view of the electropolishing head provided by the present invention.

[0034] Figure 3 is an exploded structural diagram of the conductive probe, telescopic component, and outer shell provided by the present invention.

[0035] Figure 4 is an exploded view of the installation of the electropolishing head provided by the present invention.

[0036] Figure 5 is a second cross-sectional view of the electropolishing head provided by the present invention.

[0037] Figure 6 is a partial cross-sectional view of the electropolishing head provided by the present invention.

[0038] Figure 7 is a simplified diagram of the conductive system provided by the present invention.

[0039] Among them, 1-polishing head, 11-polishing head carrier, 111-circuit channel, 12-conductive disk, 13-connector, 14-cavity, 15-conductive film, 16-air passage, 2-conductive component connector, 21-limiting groove, 3-conductive post, 31-outer shell, 32-telescopic component, 33-conductive probe, 331-conductive probe end, 34-threaded section, 4-conductive post connection unit, 41-conductive structural component, 42-flexible cable, 421-flexible cable mounting component, 43-conductive post connector, 5-conductive component, 6-external power supply unit, 61-power switching device, 7-wafer, 8-clamp. Detailed Implementation

[0040] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0041] As shown in Figure 1, an electropolishing head for an electrochemical mechanical planarization device includes a conductive connector 2 disposed on a polishing head support 11, a conductive post 3 disposed on the polishing head 1 or disposed on the polishing head support 11, and a conductive post connecting unit 4 disposed on the polishing head 1, wherein the conductive post connecting unit 4 is detachably connected to the conductive post 3.

[0042] The conductive connector 2 is connected to a conductive element 5, which passes through the circuit channel 111 inside the polishing head carrier 11. The conductive element 5 is connected to an external power supply unit 6 to guide electrical energy to the conductive connector 2, that is, to transmit external electrical energy into the polishing head 1. Of course, in other embodiments, the conductive connector 2 can also be directly connected to the external power supply unit 6, and there is no specific limitation. Alternatively, the conductive connector 2 can be omitted, and the conductive element 5 can be directly connected to the external power supply unit 6 and the conductive post 3 to guide electrical energy to the conductive post 3.

[0043] The polishing head carrier 11 is a conductive metal structure. Therefore, the conductive component 5 is often wrapped with an insulating structure to prevent leakage.

[0044] The conductive post 3 includes at least a housing 31, a telescopic member 32, and a conductive probe 33. The conductive probe 33 and the housing 31 are respectively connected to the telescopic member 32, so that the conductive probe 33 and the housing 31 can slide relative to each other along the axial direction, as shown in Figure 6. The outer wall of the conductive probe 33 is in contact with and conductive to the inner wall of the housing 31, so that a sliding contact conductive contact is formed between the conductive probe 33 and the housing 31. When the conductive member connector 2 is provided, the conductive probe 31 abuts against the conductive member connector 2, or in other words, the head of the conductive probe 33 and the conductive member connector 2 are integrally connected.

[0045] As shown in Figure 3, during the assembly process of the conductive post 3, the telescopic component 32 is first placed inside the housing 31, and then the conductive probe 33 is axially installed inside the housing 31. At this time, the upper end of the telescopic component 32 abuts against the lower end of the conductive probe 33, and the lower end of the telescopic component 32 abuts against the bottom of the inner wall of the housing 31. In particular, a snap-fit ​​assembly can be set inside the housing 31 and outside the conductive probe 33 to prevent the conductive post 3 from being spread apart by external force or the force of the internal telescopic component 32 after assembly.

[0046] Thus, when the polishing head 1 holds the wafer 7 located on the conductive disk 12, the power supply unit 6, the conductive component connector 2, the conductive post 3, the conductive post connecting unit 4, the wafer 7, and the conductive disk 12 can form a conductive path. Moreover, because the telescopic component 32 of the conductive post 3 presses upward against the conductive component connector 2 and downward against the conductive post connecting unit 4, a stable connection is formed at both ends of the conductive post 3, thereby ensuring effective circuit conduction.

[0047] Specifically, as shown in Figure 2, the outer shell 31 is hollow inside. The telescopic component 32 is axially assembled inside the outer shell 31, and the conductive probe 33 is axially inserted inside the outer shell 31, with the end face of the conductive probe 33 abutting against the end of the telescopic component 32. Furthermore, the conductive probe 33, the telescopic component 32, and the outer shell 31 are arranged concentrically and coaxially. The end of the conductive post 3 is provided with a threaded section 34. Specifically, a threaded section 34 is provided at the end of the outer shell 31, and this threaded section 34 is concentrically and coaxially arranged with the conductive probe 33, the telescopic component 32, and the outer shell 31. This threaded section 34 is threadedly connected to the conductive post connecting unit 4, thereby increasing the contact area between the two for better energy transfer. The threaded section 34 also supports the conductive post 3 to be stably and reliably fixed to the conductive post connecting component 43 inside the polishing head 1.

[0048] To ensure the stability of the connection between the conductive connector 2 and the conductive post 3 and to prevent them from deviating from each other, a limiting groove 21 is formed on the side of the conductive connector 2 facing the conductive post 3, and a tip 331 is formed at the top of the conductive probe 33. The tip 331 can extend into the limiting groove 21, and the two form a limiting fit.

[0049] As shown in Figures 1 and 4, the conductive post connection unit 4 includes a conductive structural component 41 that mates with the polishing head 1, a flexible cable 42, and a conductive post connector 43. The conductive post connector 43 is detachably connected to the conductive post 3. The flexible cable 42 is electrically connected to the conductive structural component 41 and the conductive disk 12 inside the polishing head 1. The conductive post connection unit 4 penetrates the upper and lower surfaces of the polishing head 1, transmitting electrical energy from the conductive post connector 43 to the flexible cable 42.

[0050] The term "conductive structural component 41 cooperating with polishing head 1" here means that a portion of the conductive structural component 41 extends into the polishing head 1, or that a portion of the conductive structural component 41 not only extends into the polishing head 1 but is also fixedly assembled and connected to the polishing head 1.

[0051] In this embodiment, the longitudinal section of the conductive structure 41 is inverted T-shaped. The polishing head 1 has a cavity 14. The longitudinal portion of the conductive structure 41 is inserted into the polishing head 1, and its transverse portion abuts against the top surface of the cavity 14. One end of the flexible cable 42 is fixedly connected to this transverse portion via a mounting member 421 and is conductive. The other end of the flexible cable 42 is also fixedly connected to the conductive disk 12 via a mounting member and is conductive. The conductive disk 12 transmits electrical energy from the flexible cable 42 to the conductive film 15. The conductive film 15 is in close contact with the wafer 7 during the process, transmitting electrical energy to the surface of the wafer 7. The flexible cable 42 is bent and accommodated within the cavity 14, meaning that the flexible cable 42 is in a stretchable state. There is no limitation on the number of flexible cables 42; there can be one, two, or more, which can adapt to high-current process requirements and support the passage of larger amounts of electrical energy.

[0052] The longitudinal end of the conductive structural component 41 is detachably connected to the conductive post connector 43, and the conductive post connector 43 is detachably connected to the threaded section 34 of the conductive post 3.

[0053] After assembly, the top of the conductive probe 33 abuts against the conductive connector 2, achieving effective conduction between the conductive post 3 and the conductive connector 2; the conductive structural component 41 abuts against the flexible cable 42, achieving effective conduction between the conductive post connecting unit 4 and the conductive disk 12.

[0054] As shown in Figure 5, it is possible that the conductive connector 2 and the end 331 of the conductive probe 33 are integrally connected.

[0055] As shown in Figure 7, a conductive system for an electrochemical mechanical planarization device includes a power supply unit 6, an electropolishing head as described above, and a wafer 7. The conductive connector 2, conductive post 3, and conductive disk 12 of the electropolishing head are connected to the power supply unit 6, so that when the polishing head 1 presses the wafer 7 located on the conductive disk 12, the power supply unit 6, the electropolishing head, the wafer 7, and the conductive disk 12 form a conductive path.

[0056] The power supply unit 6 is switched on and off by the power switching device 61. During the process, gas enters the cavity 14 through the gas passage 16. The gas pressure is transmitted to the conductive film 15 and applied to the surface of the wafer 7, making the wafer 7 adhere tightly to the conductive pad 12. Electrical energy is transmitted to the wafer 7 in sequence through the following components in the positive or negative electrode path: conductive component 5, conductive component connector 2, conductive pillar 3, conductive pillar connector 43, conductive structural component 41, flexible cable 42, conductive pad 12, and conductive film 15. Chemical liquid participates in this process flow and completes the electrochemical mechanical planarization process together with the above steps.

[0057] In this embodiment, the polishing head 1 has a connector 13, or more specifically, the polishing head carrier 11 has a connector 13, and the conductive post 3 passes through the connector 13. The connector 13 is used to rigidly connect the polishing head carrier 11 and the polishing head 1, and it also has a circuit channel 111 inside.

[0058] More specifically, the conductive connector 2 can be fixedly connected inside the polishing head carrier 11, and the conductive structural component 41 can be fixed inside the polishing head 1. The polishing head 1 and the polishing head carrier 11 can also be tightly connected around the circumference by a clamp 8.

[0059] An assembly method for a conductive system in an electrochemical mechanical planarization device includes the following steps:

[0060] As shown in Figure 4, the conductive connector 2 is fixed inside the polishing head carrier 11, and the conductive structural component 41 is fixed inside the polishing head 1.

[0061] The conductive element 5 is inserted into the internal circuit channel 111 of the polishing head carrier 11, and one end of the conductive element 5 is fixed to the conductive element connector 2 inside the polishing head carrier 11.

[0062] The outer shell 31 of the conductive post 3 is fixed to the conductive post connector 43; specifically, the two are connected by a threaded structure, that is, the threaded section 34 of the outer shell 31 is threadedly connected to the conductive post connector 43.

[0063] The conductive post connector 43 is fixed to the conductive structure 41 inside the polishing head 1; specifically, the conductive post connector 43 and the conductive structure 41 are connected by a threaded structure.

[0064] One end of the flexible cable 42 is fixed to the conductive structure 41 inside the polishing head 1 through the mounting part 421, and the other end of the flexible cable 42 is fixed to the conductive disk 12 through the mounting part 421.

[0065] The conductive disk 12 is fixedly installed at the bottom of the polishing head 1. At this time, the flexible cable 42 is bent and accommodated in the cavity 14, and the conductive film 15 is fixedly installed on the conductive disk 12.

[0066] The polishing head 1 is fixedly assembled with the polishing head carrier 11. The telescopic part 32 of the conductive post 3 abuts against the conductive probe 33. The end of the conductive probe 33 is tightly attached to the conductive component connector 2, thereby achieving conductivity and enabling the conductive component connector 2 to efficiently conduct electrical energy from the conductive component 5 to the conductive post 3.

[0067] The polishing head 1 and the polishing head carrier 11 are tightly connected by the clamp 8, so that the air and electrical circuits between the polishing head 1 and the polishing head carrier 11 can be stably connected.

[0068] The above specific embodiments are used to explain and illustrate the present invention, but not to limit the present invention. Any modifications and changes made to the present invention within the spirit and scope of the claims shall fall within the protection scope of the present invention.

Claims

1. An electro-polishing head for an electro-chemical mechanical planarization apparatus, characterized by: include, A conductive element (5) is inserted through the polishing head carrier (11) for connecting to an external power supply unit (6). The conductive post (3) is inserted into the polishing head (1) or the polishing head carrier (11) and includes at least a housing (31), a telescopic member (32), and a conductive probe (33). The conductive probe (33) and the housing (31) are respectively connected to the telescopic member (32) so that the conductive probe (33) and the housing (31) can slide relative to each other along the axial direction, and the outer wall of the conductive probe (33) contacts and conducts electricity with the inner wall of the housing (31), so that a sliding contact conduction is formed between the conductive probe (33) and the housing (31). The conductive post connecting unit (4) is located on the polishing head (1) and is detachably connected to the conductive post (3).

2. The electro-polishing head for an electro-chemical mechanical planarization apparatus as recited in claim 1, wherein: The conductive element (5) is connected to the conductive post (3) and is used to guide electrical energy to the conductive post (3).

3. The electro-polishing head for use in an electro-chemical mechanical planarization apparatus as recited in claim 1, wherein: The telescopic component (32) is axially assembled inside the housing (31), and the conductive probe (33) is axially inserted inside the housing (31) with its end face abutting against the telescopic component (32).

4. The electro-polishing head for use in an electro-chemical mechanical planarization apparatus as recited in claim 3, wherein: The conductive probe (33), telescopic component (32), and outer shell (31) are arranged concentrically and coaxially.

5. The electro-polishing head for use in an electro-chemical mechanical planarization apparatus as recited in claim 1, wherein: The conductive probe (33) is provided with a conductive connector (2) at its head. The conductive connector (2) forms a limiting groove (21), and the end of the conductive probe (33) forms an end (331) that can be limited and matched with the limiting groove (21).

6. The electropolishing head for an electrochemical mechanical planarization device according to claim 1, characterized in that: The conductive post connection unit (4) includes a conductive structure (41) that cooperates with the polishing head (1), a flexible cable (42), and a conductive post connector (43). The conductive post connector (43) is detachably connected to the conductive post (3). The flexible cable (42) is electrically connected to the conductive structure (41) and the conductive disk (12) in the polishing head (1).

7. The electropolishing head for an electrochemical mechanical planarization device according to claim 6, characterized in that: The number of the flexible cables (42) is one or two or more; the polishing head (1) has a cavity (14) in which the flexible cables (42) are bent and accommodated.

8. The electropolishing head for an electrochemical mechanical planarization device according to claim 1, characterized in that: The conductive post connection unit (4) includes a conductive post connector that can be detachably connected to the conductive disk (12).

9. The conductive device for an electrochemical mechanical planarization apparatus according to claim 3, characterized in that: The conductive post (3) has a threaded section (34) at its end, which is threadedly connected to the conductive post connecting unit (4) to increase the contact area for transmitting electrical energy.

10. A conductive system for an electrochemical mechanical planarization device, characterized in that: include, Power supply unit (6); The electropolishing head as described in any one of claims 1-9; Wafer (7); The conductive element (5), conductive post (3), and conductive disk (12) of the electropolishing head are connected to the power supply unit (6) so that when the polishing head (1) presses the wafer (7) located on the conductive disk (12), the power supply unit (6), the electropolishing head, the wafer (7), and the conductive disk (12) form a conductive path.

11. The conductive system for an electrochemical mechanical planarization device according to claim 10, characterized in that: The polishing head (1) has a connector (13), or the polishing head carrier (11) has a connector (13), and the conductive post (3) passes through the connector (13).

12. A method for assembling a conductive system for an electrochemical mechanical planarization device, characterized in that, Includes the following steps: The conductive element is inserted into the internal circuit channel of the polishing head carrier, and one end of the conductive element is fixed to the conductive element connector inside the polishing head carrier. Fix the conductive post housing to the conductive post connector; The conductive post connector is fixed to the internal conductive structure of the polishing head; One end of the flexible cable is fixed to the conductive structure inside the polishing head, and the other end of the flexible cable is fixed to the conductive disk. The conductive disk is fixedly mounted on the polishing head, and the conductive film is fixedly mounted on the conductive disk; The polishing head is fixedly assembled with the polishing head carrier, the telescopic part of the conductive post abuts against the conductive probe, and the end of the conductive probe is tightly attached to the conductive connector to achieve conductivity.

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