Antenna module including polytetrafluoroethylene layer and communication device including same

Abstract

The antenna module may include: an antenna board including a plurality of conductive layers and having an external hole formed to penetrate the plurality of conductive layers, the antenna board including a dielectric layer disposed between at least two conductive layers and having polytetrafluoroethylene; a plurality of radiation structures disposed on the antenna board; a plated through-hole formed to penetrate the dielectric layer and at least one of the plurality of conductive layers within the external hole and electrically connected to at least one of the plurality of radiation structures; and non-conductive ink disposed between the external hole and the plated through-hole. The thermal expansion coefficient of the non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the thermal expansion coefficient of polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

Description

Antenna module including a polytetrafluoroethylene layer and a communication device including the same

[0001] The present disclosure relates to an antenna module comprising a polytetrafluoroethylene layer and a communication device comprising said antenna module.

[0002] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Generally, beamforming uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. To operate beamforming technology, a communication device may be equipped with multiple antennas.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to embodiments of the present disclosure, an antenna module is provided. The antenna module may comprise an antenna board having an external hole formed to penetrate the plurality of conductive layers, wherein the antenna board comprises a dielectric layer having polytetrafluoroethylene disposed between at least two of the plurality of conductive layers; a plurality of radiating structures disposed on the antenna board; a plating through hole (PTH) formed to penetrate at least one of the plurality of conductive layers and the dielectric layer within the external hole and electrically connected to at least one of the plurality of radiating structures; and a non-conductive ink disposed between the external hole and the plating through hole. The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

[0005] According to embodiments of the present disclosure, a communication device is provided. The communication device may include: a processor; RF (radio frequency) processing circuits connected to the processor; a plurality of filters connected to the RF processing circuits; and an antenna board having an external hole formed to penetrate the plurality of conductive layers, wherein the antenna board comprises a dielectric layer having polytetrafluoroethylene disposed between at least two of the plurality of conductive layers; a plurality of radiation structures disposed on the antenna board; and a plated through hole (PTH) formed to penetrate the at least one conductive layer and the dielectric layer among the plurality of layers within the external hole and electrically connected to at least one of the plurality of radiation structures, wherein the plated through hole is connected to at least one of the plurality of filters; and a non-conductive ink disposed between the external hole and the plated through hole. The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

[0006] According to embodiments of the present disclosure, an antenna module is provided. The antenna module comprises an antenna board including a first conductive layer facing a first direction and a second conductive layer facing a second direction opposite to the first direction; the antenna board comprises polytetrafluoroethylene disposed to fill the space between the first conductive layer and the second conductive layer; at least one conductive pattern formed on the antenna board; a plurality of radiating structures disposed on the antenna board and electrically connected to the at least one conductive pattern; and a plated through hole (PTH) comprising a hole formed to penetrate the first conductive layer and the second conductive layer of the antenna board and a plated portion formed along the hole. The plated through hole may be electrically connected to the at least one conductive pattern. Each of the first conductive layer and the second conductive layer may include a ground. The diameter of the plated through hole formed across the first conductive layer and the second conductive layer may be 0.9 mm or more.

[0007] Figure 1 shows a wireless communication system.

[0008] Figure 2 shows examples of components of a communication device.

[0009] Figures 3a and 3b show examples of communication devices.

[0010] FIGS. 4A, FIGS. 4B, FIGS. 4C, and FIGS. 4D show the functional components of a communication device.

[0011] Figure 5 shows an example of an antenna board including a polytetrafluoroethylene (PTFE) layer.

[0012] Figure 6a shows an example of plastic strain according to the thickness of a polytetrafluoroethylene layer.

[0013] Figure 6b shows an example of plastic strain according to the hole size of a plated through hole (PTH).

[0014] Figure 6c shows an example of plastic strain according to the thickness of the plated portion and the size of the plated through-hole.

[0015] Figure 7a shows an example of an antenna board including a polytetrafluoroethylene layer.

[0016] Figure 7b shows an example of plastic strain according to the thickness of the plated portion and the size of the plated through-hole.

[0017] Figure 8 shows an example of an antenna board containing a polytetrafluoroethylene layer and having a double hole structure.

[0018] Figure 9 shows an example of a double hole structure.

[0019] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0020] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0021] Terms referring to components of an electronic device used in the following description (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), board, PBA (printed board assembly), module, antenna, antenna board, antenna element, antenna element, circuit, processor, chip, component, or device), terms referring to the shape of a component (e.g., plate, substrate, structure, structure, support, contact, or protrusion), terms referring to a part of a component (e.g., point, section, region), terms referring to connections between structures (e.g., connection part, joint part, contact part, weld part, connection part, contact part, support part, contact structure, conductive member, or assembly), terms referring to a circuit (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, or Terms such as "combiner" are provided as examples for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as "...part," "...device," "...object," or "...body" used below may refer to at least one shape structure or a unit that processes a function.

[0022] Additionally, in this disclosure, expressions such as "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions such as "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of the elements from A (including A) to B (including B). Below, "C" and / or "D" refers to at least one of "C" or "D," i.e., including {"C," "D," and "C" and "D"}. Furthermore, below, the meaning of "approximately E" may be substituted with a value within an error range of ±5% or ±10% based on E.

[0023] FIG. 1 illustrates a wireless communication system. The wireless communication environment of FIG. 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), a third terminal (120-3)) as a part of the nodes using a wireless channel.

[0024] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance over which it can transmit signals. In addition to being a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5G node (5th generation node)', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit)), 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU)', remote radio head (RRH), communication device, or other terms having an equivalent technical meaning. The base station (110) can transmit downlink signals or receive uplink signals.

[0025] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without user involvement. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as 'user equipment (UE)', 'mobile station', 'subscriber station', 'customer premises equipment (CPE)', 'remote terminal', 'wireless terminal', 'electronic device', or 'vehicle terminal', 'user device', or other terms having an equivalent technical meaning.

[0026] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. Therefore, to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, a base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0027] A key technology for enhancing the data capacity of 5G communication is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. However, increasing the number of RF paths leads to larger product sizes, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using dividers (or splitters) in the RF paths. Here, the antenna elements corresponding to the RF paths may be referred to as sub-arrays. As a non-limiting example, sub-array technology may be utilized to increase the signal radiation gain. An antenna array may include multiple sub-arrays. The antennas of the antenna array may be divided into the multiple sub-arrays. The signal may be radiated through each of the antennas of the sub-arrays.

[0028] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain a communication device including an antenna, but the embodiments of the present disclosure are not limited thereto. As a communication device according to the embodiments of the present disclosure, in addition to the base station (110), any wireless equipment performing a function equivalent to that of a base station, wireless equipment connected to a base station (e.g., TRP), the terminal (120) of FIG. 1, or other communication equipment used for 5G communication is possible. Hereinafter, as a structure of multiple antennas for communication in a MIMO (Multiple Input Multiple Output) environment, an antenna array composed of sub-arrays is described as an example, but it is not limited to examples where easy modifications for beamforming are possible.

[0029] FIG. 2 illustrates examples of components of a communication device. The communication device may be a base station (110) of FIG. 1 or a component of the base station (110). Meanwhile, unlike what is illustrated, the present disclosure does not exclude the possibility that the communication device may be implemented in a terminal (120).

[0030] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna section (211), a filter section (212), an RF (radio frequency) processing section (213), and a processor (214).

[0031] The antenna section (211) may include a plurality of antennas. The antennas may perform functions for transmitting and receiving signals over a wireless channel. The antennas may include a radiator made of a conductor (e.g., metal structure) or a conductive pattern formed on a substrate (e.g., PCB, non-conductive substrate (e.g., plastic substrate)). The antennas may radiate upconverted signals over a wireless channel or acquire signals radiated by another device. Each antenna may be referred to by an antenna element, antenna component, antenna radiator, radiating part, radiator, and / or equivalent technical terms. The antenna section (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna section (211) may be electrically connected to the filter section (212) via RF signal lines. For example, a plurality of antenna elements of the antenna section (211) may be coupled to a board (e.g., PCB, non-conductive substrate). The antenna elements may be disposed on one side of the board, or a module on which the antenna elements are disposed (e.g., a module including a non-conductive substrate and a radiating structure disposed on the non-conductive substrate) may be disposed. The board may include RF signal lines connecting each antenna element and the RF filters of the filter section (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiating board, a radiating board, an RF board, an RF board, and / or an equivalent technical term.

[0032] The filter section (212) can perform filtering to transmit a signal of a desired frequency. The filter section (212) may include a plurality of RF filters. The RF filters can perform the function of selectively passing a frequency by forming resonance. The filter section (212) may include at least one of a band-pass filter, a low-pass filter, a high-pass filter, or a band-reject filter. The filter section (212) may include RF circuits for obtaining a signal in a frequency band for transmission or a frequency band for reception. Each RF filter of the filter section (212) may be electrically connected to the antennas of the antenna section (211) and the RF processing circuit of the RF processing section (213). According to one embodiment, one or more RF filters may be placed on the same board as the board on which the antennas are placed (hereinafter referred to as the antenna board). For example, the antennas may be placed on a first surface of the antenna board, and the one or more RF filters may be placed on a second surface opposite to the first surface of the antenna board. As another example, the antennas and the one or more RF filters may be placed on one surface of the antenna board. According to another embodiment, the one or more RF filters may be placed on a board other than the antenna board where the antennas are placed (e.g., a main board where the RF processing unit (213) and the processor (214) are placed).

[0033] The RF processing unit (213) may include a plurality of RF processing circuits. An RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through an antenna. An RF processing circuit may include a plurality of paths corresponding to the antennas. At least one RF processing circuit may be referred to as an RF chain. An RF chain may include a plurality of RF elements. For example, the RF processing unit (213) may include a communication chip (e.g., RFIC). The RF elements may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The up converter and the DAC form part of the transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Additionally, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. For example, the communication device (210) may include a board having a stacked structure in the order of an antenna unit (211), a filter unit (212), and an RF processing unit (213).As another example, the communication device (210) may include a board having a stacked structure in the order of filter section (212) - RF processing section (213) and an antenna board having an antenna section (211) arranged thereon.

[0034] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating the transmitted bit sequence. Also, for example, when receiving data, the processor (214) restores the received bit sequence by demodulating and decoding the baseband signal. The processor (214) may perform the functions of a protocol stack required by the communication standard.

[0035] In FIG. 2, functional components of a communication device (210) are described as a communication device comprising a plurality of antennas. However, the example shown in FIG. 2 is merely an exemplary configuration for a conductive pattern for supplying a signal to the antenna elements of an array antenna described later, and the embodiments of the present disclosure are not limited to the descriptions of the components of the communication device shown in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationships of the components are different, any device (e.g., communication device, communication module) comprising a substrate (e.g., antenna board) having a polytetrafluoroethylene (PTFE) layer can be understood as an embodiment of the present disclosure.

[0036] FIGS. 3a and 3b illustrate examples of communication devices (e.g., communication device (210)). The communication device (210) may be referred to as a base station (110), a radio unit (RU), or an MMU.

[0037] Referring to FIG. 3a, in example (300a), the communication device (210) may include a front housing (301), an antenna assembly (302), a shield can (303), a circuit assembly (304), and a rear housing (305). According to one embodiment, the antenna assembly (302), the shield can (303), and the circuit assembly (304) may be understood as components of an antenna module. In terms of the antenna assembly (302) and the circuit assembly (304) being separable, the antenna module may be understood to have a separable structure.

[0038] The communication device (210) may include a front housing (301). The front housing (301) may be configured to enclose an antenna assembly (302). The front housing (301) may protect a plurality of antennas (or antenna elements) of the antenna assembly (302). In terms of protecting the plurality of antennas, it may be referred to as a front cover, antenna cover, radome, and / or an equivalent technical term. As an example, but not limited to, the front housing (301) may be configured to reduce transmission loss of the frequency band used in the communication device (210). One area of ​​the front housing (301) may be composed of a material with excellent radio wave transmittance and excellent environmental resistance.

[0039] The communication device (210) may include an antenna assembly (302). The antenna assembly (302) may include a plurality of antennas. For example, the antenna assembly (302) may include a plurality of antennas and an antenna board on which the plurality of antennas (e.g., antenna elements, antenna arrays, antenna sub-arrays) are arranged. For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna section (211) of FIG. 2 may be referenced. The antenna board may be referred to by technical terms other than antenna board, such as a radiating substrate, a radiating plate, an insulating substrate, and / or equivalent. If the antenna board includes an insulating substrate, a conductive pattern formed on the insulating substrate may be used as a feed line to each radiator.

[0040] The communication device (210) may include a shield can (303) and a circuit assembly (304). The circuit assembly (304) may include a printed circuit board (PCB) and a plurality of components disposed on the PCB. The PCB may be referred to by technical terms such as main board, main board, main board, digital board, and / or equivalent, in that major RF components are disposed on the PCB. In addition to the circuit assembly, the circuit assembly (304) may be referred to by technical terms such as main assembly, wireless assembly, wireless module, RU module, RU assembly, and / or equivalent. For example, the circuit assembly (304) may include RF filter(s) (e.g., filter section (212)), RF processing circuit(s) (e.g., RF processing section (213), power amplifier module (PAM)), processor(s) (e.g., processor (214)), and / or a circulator. A shield can (303) can be used to shield electromagnetic waves from a plurality of components placed on the PCB and to reduce interference and noise. For example, due to the shield can (303), the influence on signals emitted through a plurality of antennas by at least some of the components of the circuit assembly (304) can be reduced. The shield can (303) can be placed between the antenna assembly (302) and the circuit assembly (304). In an example that is not limited, an RF filter, an RF processing circuit, and a circulator may be placed on a first side of the PCB, and a processor may be placed on a second side of the PCB opposite to the first side. In an example that is not limited, an RF filter, an RF processing circuit, a circulator, and a processor may be placed together on one side of the PCB.

[0041] The communication device (210) may include a rear housing (305). The rear housing (305) may be used to protect at least some of the components of the communication device (210). The rear housing (305) may include a heat sink for heat dissipation. The heat sink may be configured to dissipate heat generated by at least some of the components of the circuit assembly (304) to the outside.

[0042] Referring to FIG. 3b, in example (300b), the communication device (210) may include a front housing (351), an antenna module (352), and a rear housing (353). According to one embodiment, the antenna module (352) may include an antenna board. The antenna board of the antenna assembly (302) of FIG. 3a and the main PCB of the circuit assembly (304) may be designed as a single substrate. The single substrate may be referred to as the antenna board of the antenna module (352). In terms of the antenna assembly (302) and the circuit assembly (304) being implemented through a common board, the antenna module may be understood to have an integrated structure.

[0043] The communication device (210) may include a front housing (351). The front housing (351) may be configured to enclose an antenna assembly (302). The front housing (351) may protect a plurality of antennas (or antenna elements) of the antenna assembly (302). In terms of protecting the plurality of antennas, it may be referred to as a front cover, antenna cover, radome, and / or an equivalent technical term. As an example, but not limited to, the front housing (351) may be configured to reduce transmission loss of the frequency band used in the communication device (210). One area of ​​the front housing (351) may be composed of a material with excellent radio wave transmittance and excellent environmental resistance.

[0044] The communication device (210) may include an antenna module (352). The antenna module (352) may include a plurality of antennas, an antenna board on which the plurality of antennas (e.g., antenna elements, antenna arrays, antenna sub-arrays) are arranged, components for RF signal processing, and a processor (e.g., processor (214)) for processing baseband signals. For example, the components for RF signal processing may include RF filter(s) (e.g., filter section (212)), RF processing circuit(s) (e.g., RF processing section (213), power amplifier module (PAM)), and / or a circulator. Each of the plurality of antennas may include a radiating structure. Each radiating structure may be formed of a conductive material. For the plurality of antennas, the descriptions of the antenna section (211) of FIG. 2 may be referenced. The antenna board may be referred to as a radiating substrate, a radiating plate, a main board, a main substrate, and / or equivalent technical terms, in addition to the antenna board.

[0045] The communication device (210) may include a rear housing (353). The rear housing (353) may be used to protect at least some of the components of the communication device (210). The rear housing (353) may include a heat sink for heat dissipation. The heat sink may be configured to dissipate heat generated by at least some of the components of the antenna module (352) to the outside.

[0046] FIGS. 4a through 4d show the functional components of a communication device (e.g., communication device (210)).

[0047] Referring to FIG. 4a, the communication device (210) may include an antenna module having a separable structure (e.g., the structure of FIG. 3a). The antenna module may include a plurality of antennas (or antenna elements) (e.g., the antenna section (211) of FIG. 2) and an antenna board (410). For example, the antenna module may include a first antenna (411), a second antenna (412), and a third antenna (413). The antennas may be placed on the antenna board (410). The conductive layers of the antenna board (410) may be referred to as antenna layers or antenna layer sets. For the antennas, the descriptions of the antenna assembly (302) of FIG. 3a may be referenced. The antenna module may include a main board (420) and processing components placed on the main board (420). For example, the processing components may include a filter (440) (e.g., filter section (212) of FIG. 2), a processor (430) (e.g., processor (214) of FIG. 2), a PAM (460) (e.g., RF processing section (213) of FIG. 2), and a circulator (465) (e.g., RF processing section (213) of FIG. 2). For the main board (420) and the processing components, the descriptions of the circuit assembly (304) of FIG. 3a may be referenced. According to one embodiment, the antenna module may include a connecting structure (445) (e.g., a connector, a pogo pin connector) for electrically connecting the filter (440) and a region of the antenna board (410) (e.g., a conductive pattern connected to the first antenna (411), the second antenna (412), and the third antenna (413)). A connecting structure (445) may be positioned to connect the filter (440) and the antenna board (410). According to one embodiment, the filter (440), PAM (460), and circulator (465) may be positioned on a first surface of the main board (420). A processor (430) may be positioned on a second surface opposite to the first surface of the main board (420).For electromagnetic shielding of processing components on the main board (420), the antenna module may include a shield can (463) (e.g., the shield can (303) of FIG. 3a). To dissipate heat generated from the processor (430) to the outside, the antenna module may include a heat sink (470). The heat sink (470) may be positioned to be connected to (e.g., in contact with) the processor (430).

[0048] Referring to FIG. 4b, the communication device (210) may include an antenna module having an integrated structure (e.g., the structure of FIG. 3b). The antenna module may include an antenna board (480). The antenna board (480) may include a first set of layers (480a) for antennas and a second set of layers (480b) for a plurality of processing components. The first set of layers (480a) may be referred to as antenna layers or an antenna layer set. The first set of layers (480a) and the second set of layers (480b) may be formed as an antenna board (480) integrally. The first set of layers (480a) may be combined with the second set of layers (480b). A first surface of the first set of layers (480a) may be combined with the antennas. The second surface opposite to the first surface of the first set of layers (480a) can be combined with the first surface of the second set of layers (480b). The second surface opposite to the first surface of the second set of layers (480b) can be combined with a plurality of processing parts.

[0049] The antenna module may include a plurality of antennas (or antenna elements) (e.g., the antenna section (211) of FIG. 2). For example, the antennas may include a first antenna (411), a second antenna (412), and a third antenna (413). The antennas may be placed on an antenna board (480). The antennas may be placed on a first set of layers of the antenna board (480) (e.g., the top layer among the first set of layers). The antenna module may include a plurality of processing components. For example, the processing components may include a filter (440) (e.g., the filter section (212) of FIG. 2), a processor (430) (e.g., the processor (214) of FIG. 2), a PAM (460) (e.g., the RF processing section (213) of FIG. 2), and a circulator (465) (e.g., the RF processing section (213) of FIG. 2). The plurality of processing components may be disposed on an antenna board (480). The plurality of processing components may be disposed on a second set of layers of the antenna board (480) (e.g., the lowest layer among the second set of layers). For the antennas and the processing components, the description of the antenna module (352) in FIG. 3b may be referenced. According to one embodiment, the antenna module may include a connection structure (445) (e.g., a connector) for electrically connecting a filter (440) and antennas (e.g., a conductive pattern connected to a first antenna (411), a second antenna (412), and a third antenna (413)). The connection structure (445) may be disposed across the layers of the antenna board (480). According to one embodiment, the antenna module may include a heat sink (470) to dissipate heat generated from at least some of the processing components (e.g., a processor (430), a PAM (460)) to the outside. For example, the heatsink (470) can be positioned to be connected to (e.g., in contact with) the processor (430).For example, the heat sink (470) can be positioned to be connected to (e.g., in contact with) the PAM (460).

[0050] Referring to FIG. 4c, the communication device (210) may include an antenna module having a separable structure (e.g., the structure of FIG. 3a). The communication device (210) may include a plurality of antennas (e.g., a first antenna (411), a second antenna (412), a third antenna (413), a fourth antenna (414), a fifth antenna (415), and / or a sixth antenna (416)) and an antenna board (410) on which the plurality of antennas are arranged. The antenna board (410) may include an antenna layer (410a), a metal substrate (410b), and a phase shifter layer (410c). The antenna board (410) may be connected to a filter assembly (e.g., including a filter (440) and a main board (420)) through a connection structure (445). A plated through hole (PTH) may be used as a technique for transmitting a signal to the antenna. According to one embodiment, the plating through-hole may be formed across the antenna layer (410a). To reduce signal loss, polytetrafluoroethylene (PTFE) (e.g., Teflon) with a low loss factor (df) (e.g., less than about 0.015) and / or dielectric constant (dk) may be used as the dielectric material between the top and bottom layers of the antenna layer (410a). For example, the antenna layer (410a) may have a polytetrafluoroethylene (PTFE) layer placed between two conductive layers.

[0051] Referring to FIG. 4d, the communication device (210) may include an antenna module having a separate structure (e.g., the structure of FIG. 3a). The communication device (210) may include an antenna module having an integrated structure (e.g., the structure of FIG. 3b). The communication device (210) may include a plurality of antennas (e.g., a first antenna (411), a second antenna (412), a third antenna (413), a fourth antenna (414), a fifth antenna (415), and / or a sixth antenna (416)) and an antenna board (410) on which the plurality of antennas are arranged. The antenna board (480) may include a first set of layers (480a) and a second set of layers (480b) for a plurality of processing components. The first set of layers (480a) may include a layer for the antennas (e.g., corresponding to the antenna layer (410a) in FIG. 4c) and / or a layer for a phase shifter (e.g., corresponding to the phase shifter layer (410c) in FIG. 4c). A phase shifter circuit (490) may be placed on the upper layer of the first set of layers (480a). A plated through hole (PTH) may be used as a technique for transmitting a signal to the antenna. According to one embodiment, the plated through hole may be formed across the first set of layers (480a). To reduce signal loss, polytetrafluoroethylene (PTFE) with a low loss factor (df) and / or dielectric constant (dk) may be used as the dielectric material between the first set of layers (480a). For example, a polytetrafluoroethylene (PTFE) layer may be placed between two layers of the first set of layers (480a).

[0052] The present disclosure relates to an antenna module and a communication device including the antenna module in a wireless communication system. Specifically, an antenna module according to the embodiments of the present disclosure may include an antenna board comprising a polytetrafluoroethylene (PTFE) layer. In a wireless communication system, a very low loss (VLL) material is required to reduce losses due to signal transmission. A very low loss material is a material having a relatively low dissipation factor (df) and dielectric constant (dk). In the embodiments of the present disclosure, polytetrafluoroethylene (PTFE) may be placed within the antenna board to provide a signal to the antenna with low loss.

[0053] FIG. 5 shows an example of an antenna board (e.g., antenna board (410), antenna board (480)) comprising a polytetrafluoroethylene (PTFE) layer.

[0054] Referring to FIG. 5, the antenna board may include a set of antenna layers. The set of antenna layers may include a first conductive layer (510) (e.g., a copper plate), a second conductive layer (520) (e.g., a copper plate), and a polytetrafluoroethylene (PTFE) layer (530). The polytetrafluoroethylene (PTFE) layer (530) may correspond to a dielectric layer between the first conductive layer (510) and the second conductive layer (520). According to one embodiment, the antenna board may include a plating through hole (540) formed to penetrate the first conductive layer (510) and the second conductive layer (520) in one direction (e.g., the z-axis direction). The plating through hole (540) may have a hole (550) formed to penetrate the first conductive layer (510) and the second conductive layer (520) in one direction (e.g., z-axis direction) and may include a plating portion (543) formed along the hole (550). As an example, but not limited to, a first conductive pad (541) may be placed at a first end (e.g., an end in the (+)z-axis direction) of the plating portion (543). A second conductive pad (542) may be placed at a second end (e.g., an end in the (-)z-axis direction) of the plating portion (543).

[0055] The polytetrafluoroethylene (PTFE) layer (530) can provide relatively low dielectric loss and a low dielectric constant compared to other dielectric materials (e.g., FR4). However, polytetrafluoroethylene (PTFE) provides a high coefficient of thermal expansion, low strength, and low surface tension instead of superior heat resistance compared to FR4 (Flame Retardant Grade 4). Additionally, the polytetrafluoroethylene (PTFE) layer (530) may have anisotropy. Anisotropy of a material refers to a property (e.g., strength, elasticity, conductivity) that differs depending on the viewing direction (e.g., the direction of the crystal axis) of the material or structure. The coefficient of thermal expansion (CTE) of polytetrafluoroethylene (PTFE) may have a high CTE in one direction (e.g., the z-axis direction). This can cause problems with cracking in the plating through-hole (540) formed through the polytetrafluoroethylene (PTFE) layer (530). To resolve the aforementioned problem, embodiments of the present disclosure describe techniques for a structure that satisfies specified conditions (e.g., thermal shock conditions) and has reliability in an antenna board comprising polytetrafluoroethylene (PTFE) as a dielectric material and having a plating through-hole formed between two conductive layers.

[0056] FIG. 6a shows an example of plastic strain according to the thickness of a polytetrafluoroethylene layer (e.g., polytetrafluoroethylene layer (530)).

[0057] Referring to FIG. 6a, graph (600a) shows the plastic strain of a polytetrafluoroethylene layer according to its thickness. The horizontal axis of graph (600a) represents the thickness of the polytetrafluoroethylene layer (unit: millimeter (mm)), and the vertical axis of graph (600a) represents the plastic strain of the plating through-hole (unit: none). For example, the Coffin-Manson equation may be referenced for the plastic strain.

[0058]

[0059] or represents plastic strain. is the ductility coefficient, which indicates the deformation ability of a material, is the number of times until uniform occurrence, c has a negative value and represents a plastic fatigue index to reflect the intrinsic plastic deformation characteristics of the material.

[0060] Referring to graph (600a), it can be confirmed that as the thickness of the polytetrafluoroethylene layer increases, the plastic strain of the plating through hole increases. As the plastic strain decreases, the probability of cracking in the plating through hole decreases. Therefore, as the thickness of the polytetrafluoroethylene layer decreases, the probability of cracking in the plating through hole penetrating the polytetrafluoroethylene layer can be reduced.

[0061] FIG. 6b shows an example of plastic strain according to the hole size of a plated through hole (PTH) (e.g., plated through hole (540)).

[0062] Referring to FIG. 6b, graph (600b) shows the plastic strain of a plating through-hole according to the hole size (e.g., hole diameter). Graph (600b) shows the hole size of the plating through-hole (unit: millimeter (mm)), and the vertical axis of graph (600b) shows the plastic strain of the plating through-hole (unit: none). For example, the Coffin-Manson equation of [Equation 1] may be referenced for the plastic strain. Referring to graph (600b), it can be confirmed that as the hole size of the plating through-hole increases, the plastic strain of the plating through-hole decreases. As the plastic strain decreases, it can be indicated that the probability of cracking in the plating through-hole decreases. Therefore, as the hole size of the plating through-hole increases, the probability of cracking in the plating through-hole penetrating the polytetrafluoroethylene layer can be reduced.

[0063] FIG. 6c shows an example of plastic strain according to the thickness of the plated portion and the size of the plating through hole. It may be required to reduce the plastic strain described through the graph (600a) of FIG. 6a and the graph (600b) of FIG. 6b. According to embodiments of the present disclosure, in order to reduce the plastic strain, design optimization of the polytetrafluoroethylene layer (e.g., polytetrafluoroethylene layer (530)) and the plating through hole (e.g., plating through hole (540)) may be required.

[0064] Referring to FIG. 6c, graph (600c) shows the plastic strain rate according to the hole size (e.g., hole diameter) of the plating through hole. Graph (600c) shows the hole size of the plating through hole (unit: millimeter (mm)), and the vertical axis of graph (600c) shows the plastic strain rate of the plating through hole (unit: none). For performance testing, the plating through hole may be formed through a single plating process (e.g., plating thickness of about 30 μm). The first line (651) shows the plastic strain rate according to the hole size of the plating through hole for a polytetrafluoroethylene layer having a first thickness (0.8 T) (e.g., about 0.8 mm). The second line (652) shows the plastic strain rate according to the hole size of the plating through hole for a polytetrafluoroethylene layer having a second thickness (0.5 T) (e.g., about 0.5 mm).

[0065] It was confirmed that cracks occur in plating through holes with a hole size of approximately 0.5φ (e.g., approximately 0.5 mm) in a polytetrafluoroethylene layer with a thickness of approximately 0.8 T. On the other hand, it was confirmed that cracks do not occur in plating through holes with a hole size (diameter) of approximately 1.1φ (e.g., approximately 1.1 mm) in a polytetrafluoroethylene layer with a thickness of approximately 0.5 T. As the plastic strain decreases below a critical value in graph (600c), conditions in which cracks do not occur can be confirmed. According to one embodiment, the diameter of the plating through hole (e.g., plating through hole (540)) may be approximately 0.9 mm or more. For example, the diameter of the plating through hole may be approximately 1.0 mm or more. According to one embodiment, the thickness of the polytetrafluoroethylene layer (e.g., polytetrafluoroethylene layer (530)) may be approximately 0.4 mm or more and less than approximately 0.9 mm. As a non-limiting example, an antenna module having a polytetrafluoroethylene layer and a plating through-hole diameter that provides a plastic strain of about 1500 or less can be understood as a substrate structure for preventing cracking of the plating through-hole due to polytetrafluoroethylene according to the embodiments of the present disclosure.

[0066] In FIGS. 5, 6a, 6b, and 6c, a plating through-hole penetrating two conductive layers and a dielectric layer having polytetrafluoroethylene filled between the two conductive layers is described, but the embodiments of the present disclosure are not limited thereto. The plating through-hole may be formed to penetrate not only the dielectric layer but also other layers within the antenna board. Hereinafter, a laminated structure having a plating through-hole penetrating a dielectric layer other than the dielectric layer having polytetrafluoroethylene is described through FIGS. 7a and 7b.

[0067] FIG. 7a shows an example of an antenna board (e.g., antenna board (410), antenna board (480)) including a polytetrafluoroethylene layer.

[0068] Referring to FIG. 7a, the antenna board may include an antenna layer set. The antenna layer set may include a plurality of layers. The antenna layer set may include a first conductive plate (710), a first conductive layer (731), a second conductive layer (732), a third conductive layer (733), a fourth conductive layer (734), and a second conductive plate (720). A first dielectric layer (741) may be disposed between the first conductive layer (731) and the second conductive layer (732). For example, the first dielectric layer (741) may be composed of FR4 material. A second dielectric layer (742) may be disposed between the second conductive layer (732) and the third conductive layer (733). For example, the first dielectric layer (741) may be composed of FR4 material as prepreg. A third dielectric layer (743) may be disposed between the third conductive layer (733) and the fourth conductive layer (734). According to one embodiment, the third dielectric layer (743) may be composed of a polytetrafluoroethylene material. The third dielectric layer (743) may be referred to as a polytetrafluoroethylene layer. The antenna layer set may include a PSR layer (701), an aluminum plate (702), and a nickel plate (703) above the first conductive plate (710). The antenna layer set may include a nickel plate (753) and an aluminum plate (752) below the second conductive plate (720).

[0069] According to one embodiment, the antenna module may include a plating through hole (790). The plating through hole (790) may be formed to penetrate a first conductive plate (710), a first conductive layer (731), a first dielectric layer (741) (which may be referred to as a first non-conductive layer), a second conductive layer (732), a second dielectric layer (742) (which may be referred to as a second non-conductive layer), a third conductive layer (733), a third dielectric layer (743) (which may be referred to as a third non-conductive layer), a fourth conductive layer (734), and a second conductive plate (720).

[0070] Figure 7b shows an example of plastic strain according to the thickness of the plated portion and the size of the plated through-hole.

[0071] Referring to FIG. 7b, graph (700b) shows the plastic strain rate according to the hole size (e.g., hole diameter) of the plating through hole. Graph (700b) shows the hole size of the plating through hole (unit: mm), and the vertical axis of graph (700b) shows the plastic strain rate (unit: none). For performance testing, the plating through hole may be formed through a single plating process (e.g., plating thickness of about 30 μm or 60 μm). The first line (771) shows the plastic strain rate according to the hole size of the plating through hole having a plating thickness of 60 μm for the antenna layer set (e.g., layers of the first set (480a)) having a thickness of 1.09 T (e.g., about 1.09 mm). The second line (772) shows the plastic strain rate by hole size of the plating through hole having a plating thickness of 30 µm for the antenna layer set (e.g., layers of the first set (480a)) having a thickness of 1.09 T (e.g., about 1.09 mm).

[0072] By comparing the first line (771) and the second line (772), it can be confirmed that as the thickness decreases, the plastic strain of the plating through hole decreases in a certain range (e.g., less than about 1.3 mm) of hole size. According to one embodiment, it was confirmed that cracks occurred in the plating through hole having a plating thickness of about 60 μm and a hole size of about 0.8 φ (e.g., about 0.8 mm) in the antenna layer set (e.g., layers of the first set (480a)) having a thickness of about 1.09 T. On the other hand, in the above antenna layer set having a thickness of about 1.09T (e.g., layers of the first set (480a)), in a plating through hole having a plating thickness of about 30µm and a hole size of about 0.8φ (e.g., about 0.8mm) or a plating through hole having a plating thickness of about 30µm and a hole size of about 1.0φ (e.g., about 1.0mm), cracks may not occur.

[0073] According to one embodiment, the diameter of the plating through hole (e.g., plating through hole (540)) may be about 0.9 mm or more. For example, the diameter of the plating through hole may be about 1.0 mm or more. According to one embodiment, when the plating through hole (e.g., plating through hole (540)) is about 0.9 mm or more, the thickness of the polytetrafluoroethylene layer (e.g., third dielectric layer (743)) may be about 0.4 mm or more and less than about 0.9 mm. For example, the thickness of the third dielectric layer (743) may be 0.5 T (e.g., about 0.5 mm, 508 ± 64 µm). As an example, but not limited to, an antenna module having a polytetrafluoroethylene layer providing a plastic strain of about 1500, a plating thickness of a plating through hole, and a diameter of a plating through hole can be understood as a substrate structure for preventing cracking of a plating through hole according to the embodiments of the present disclosure.

[0074] FIG. 8 shows an example of an antenna board (e.g., antenna board (410), antenna board (480)) having a double hole structure and including a polytetrafluoroethylene layer (e.g., polytetrafluoroethylene layer (530), third dielectric layer (743)).

[0075] Referring to FIG. 8, the antenna board may include a set of antenna layers. The set of antenna layers may include a plurality of conductive layers. The plurality of conductive layers may include a first conductive layer (810) (e.g., a copper plate) and a second conductive layer (820) (e.g., a copper plate). The set of antenna layers may include a polytetrafluoroethylene (PTFE) layer (830). The polytetrafluoroethylene (PTFE) layer (830) may correspond to a dielectric layer between the first conductive layer (810) and the second conductive layer (820). According to one embodiment, the antenna board may have an external hole (871) formed to penetrate the plurality of conductive layers. For example, the external hole (871) may penetrate the first conductive layer (810), the second conductive layer (820), and the polytetrafluoroethylene (PTFE) layer (830). According to one embodiment, the outer hole (871) may be formed as a non-pated through hole (NPTH) without a plated portion. The antenna board may include a plated through hole (840) formed to penetrate the first conductive layer (810), the second conductive layer (820), and the polytetrafluoroethylene (PTFE) layer (830). The plated through hole (840) may be electrically connected to antennas (e.g., radiating structures) (e.g., first antenna (411), second antenna (412), third antenna (413), fourth antenna (414), fifth antenna (415), and / or sixth antenna (416)) coupled to the antenna board. The plated through hole (840) may be electrically connected to filter(s) (e.g., filter (440)) coupled to the antenna board.

[0076] According to one embodiment, the plating through hole (840) may include an inner hole (872) for an outer hole (871) and a plating portion (843) formed along the inner hole (872). The plating portion (843) may be formed to penetrate a first conductive layer (810), a second conductive layer (820), and a polytetrafluoroethylene (PTFE) layer (830). The plating through hole (840) may include a conductive pad for signal transmission. For example, a first conductive pad (841) may be placed at a first end of the plating portion (843) (e.g., an end in the (+)z-axis direction). A second conductive pad (842) may be placed at a second end of the plating portion (843) (e.g., an end in the (-)z-axis direction).

[0077] In order to reduce the plastic deformation rate caused by the polytetrafluoroethylene (PTFE) layer (830), it is required to reduce the influence caused by the polytetrafluoroethylene (PTFE) layer (830). To reduce the influence caused by the polytetrafluoroethylene (PTFE) layer (830), a plugging ink with a low coefficient of thermal expansion (CTE) may be used. According to one embodiment, a non-conductive ink may be placed between the outer hole (871) and the plating through hole (840). The outer hole (871) is a non-pated through hole (NPTH) and may come into contact with the non-conductive ink without a plating portion. The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction (e.g., z-axis direction) of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the polytetrafluoroethylene (PTFE) layer (830) in the stacking direction of the plurality of conductive layers. According to one embodiment, non-conductive ink may be filled into the inner hole (872). The coefficient of thermal expansion of the non-conductive ink in the inner hole (872) in the stacking direction (e.g., z-axis direction) of the plurality of conductive layers may be lower than the coefficient of thermal expansion of polytetrafluoroethylene in the polytetrafluoroethylene (PTFE) layer (830) in the stacking direction of the plurality of conductive layers.

[0078] Reliability can be improved by surrounding the plating through hole (840) for signal feeding to the antenna with an ink having a coefficient of thermal expansion lower than that of polytetrafluoroethylene. In addition, the design freedom for the plating through hole (840) can be increased. As described through FIGS. 5 to 7b, the hole size of the plating through hole can affect the plastic strain. Accordingly, the relationship between the outer hole (871) and the inner hole (872) can also be understood as an embodiment of the present disclosure. According to one embodiment, the diameter of the inner hole (872) may be about 0.1 mm or more. According to one embodiment, the difference between the diameter of the outer hole (871) and the diameter of the inner hole (872) may be about 0.2 mm or more. For example, if the diameter of the inner hole (872) is about 0.2 mm, the outer diameter may be about 0.41 mm or more. According to one embodiment, the diameter of the outer hole (871) may be about 0.9 mm or more and less than about 1.1 mm (within a 1 mm standard error range of 10%). The diameter of the inner hole (872) may be about 0.18 mm or more and less than about 0.22 mm (within a 0.2 mm standard error range of 10%).

[0079] To manufacture the structure exemplified in FIG. 8, an outer diameter drilling process, an inner diameter drilling process, and ink plugging may be performed. For example, an outer hole (871) may be formed in an antenna board through an outer diameter drilling process. Non-conductive ink may be filled into the outer hole (871) through ink plugging. After baking, an inner hole (872) may be formed through an inner diameter drilling process. Through plating treatment, a plated portion (843) may be formed along the inner hole (872). Non-conductive ink may be filled into the space of the inner hole (872) within the plated portion (843) through ink plugging. Subsequently, a first conductive pad (841) and a second conductive pad (842) may be attached to each of the two ends of the plated portion (843). A structure having an inner hole (872) and a plating through hole (840) formed within an outer hole (871) may be referred to as a double hole structure.

[0080] FIG. 9 illustrates an example of a double hole structure. For the double hole structure, a plating through hole (840) formed within an outer hole (871) having an inner hole (872) may be referenced. The same numbers may be used for the same description.

[0081] Referring to FIG. 9, FIG. 9 is a view of the antenna module exemplified in FIG. 8 in one direction (e.g., the (-)z-axis direction). A polytetrafluoroethylene (PTFE) layer (830) may have an outer hole (871). A plated portion (843) of a plating through hole (840) may be placed within the outer hole (871). The plated portion (843) may include an inner hole (872). The plating through hole (840) may be used for signal feeding. There is a difference between the outer diameter of the outer hole (871) and the inner diameter of the inner hole (872). Since the outer hole (871) is NPTH and has no conductive portion, it is required that the plated portion (843) of the plating through hole (840) be electrically connected to an antenna outside the outer diameter of the outer hole (871).

[0082] A first conductive pad (841) may be used to transmit RF signals to antennas (e.g., first antenna (411), second antenna (412), third antenna (413), fourth antenna (414), fifth antenna (415), and / or sixth antenna (416)). The first conductive pad (841) may be formed to protrude in one direction (e.g., the (+)x-axis direction) of the outer hole (871). The protruding portion may be understood as a signal feed path. For the signal feed path, a portion of the first conductive layer (810) (e.g., a copper portion) may be used as a ground. For example, a first ground portion (810a) and a second ground portion (810b) may be placed along the periphery of the feed path.

[0083] Although not illustrated in FIG. 8, at least one conductive pattern may be used to electrically connect the first conductive pad (841) with at least one of a plurality of antennas (e.g., first antenna (411), second antenna (412), third antenna (413), fourth antenna (414), fifth antenna (415), and / or sixth antenna (416)). For example, the at least one conductive pattern may be formed on an upper layer of the antenna board or on a separate insulating substrate. For the at least one conductive pattern, a portion of the first conductive layer (810) (e.g., a copper portion) may be used as a ground. For example, the ground may be formed around the at least one conductive pattern along the longitudinal direction of the at least one conductive pattern.

[0084] In the present disclosure, examples of an antenna board comprising a dielectric layer having polytetrafluoroethylene (PTFE) (e.g., Teflon) and an antenna module comprising said antenna board have been described, but the embodiments of the present disclosure are not limited thereto. The structure according to the embodiments of the present disclosure may be applied to any substrate having a polytetrafluoroethylene layer and plating through holes, on which components configured to process RF signals, such as filters or power amplifiers, as well as antenna modules, are arranged.

[0085] Antenna gain can be improved through a polytetrafluoroethylene material having a low dielectric constant and a low loss factor. In addition, a structure stable in terms of reliability and thermal shock can be designed through the thickness of the dielectric layer having polytetrafluoroethylene within a specified range, the hole size of the plating through-hole within a specified range, and / or the plating thickness of the plating through-hole within a specified range.

[0086] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0087] According to embodiments of the present disclosure, an antenna module is provided. The antenna module comprises an antenna board having an external hole (871) formed to penetrate the plurality of conductive layers, wherein the antenna board comprises a dielectric layer (830) having polytetrafluoroethylene disposed between at least two of the plurality of conductive layers; a plurality of radiating structures disposed on the antenna board; a plated through hole (840) formed to penetrate at least one of the plurality of conductive layers and the dielectric layer (830) within the external hole (871) and electrically connected to at least one of the plurality of radiating structures; and a non-conductive ink disposed between the external hole (871) and the plated through hole (840). The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

[0088] For example, the plating through hole (840) may include an inner hole (872) formed to penetrate the plurality of conductive layers and a plating portion formed along the inner hole (872). The outer hole (871) may be a non-pated through hole (NPTH) and may be formed to contact the non-conductive ink without a plating portion.

[0089] For example, the difference between the diameter of the outer hole (871) and the diameter of the inner hole (872) of the plating through hole (840) may be 0.2 mm or more.

[0090] For example, the diameter of the outer hole (871) may be 0.9 mm or more and less than 1.1 mm. The diameter of the inner hole (872) of the plating through hole (840) may be 0.18 mm or more and less than 0.22 mm.

[0091] For example, the diameter of the outer hole (871) may be 0.7 mm or more and less than 1.1 mm. The diameter of the inner hole (872) of the plating through hole (840) may be 0.18 mm or more and less than 0.5 mm.

[0092] For example, the antenna board may include an antenna layer. The plurality of radiating structures may be disposed on a first surface of the antenna layer. The plurality of conductive layers may include a first layer corresponding to the first surface of the antenna layer and a second layer corresponding to a second surface opposite to the first surface of the antenna layer. The first layer may include a first ground area for a signal line using the plating through hole (840). The second layer may include a second ground area for the signal line using the plating through hole (840).

[0093] For example, the antenna module may include a conductive pad disposed on the first layer and connected to the end of the plating through hole (840); and at least one conductive pattern disposed on the first layer and connected to the conductive pad. Each of the plurality of radiation structures may be connected to the at least one conductive pattern.

[0094] For example, at least a portion of the first ground region may be formed around the at least one conductive pattern along the longitudinal direction of the at least one conductive pattern in the first layer of the antenna layer.

[0095] For example, the plurality of conductive layers may include a first layer facing a first direction and a second layer facing a second direction opposite to the first direction. The polytetrafluoroethylene may be arranged to fill the space between the first layer and the second layer. The thickness of the dielectric layer (830) having the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers may be 0.4 mm or more and less than 0.6 mm.

[0096] For example, the plurality of conductive layers may include a first layer facing a first direction, a second layer below the first layer, a third layer below the second layer, and a fourth layer facing a second direction opposite to the first direction and below the third layer. The polytetrafluoroethylene may be arranged to fill the space between the third layer and the fourth layer. The thickness of the dielectric layer (830) having the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers may be 1.0 mm or more and less than 1.2 mm.

[0097] For example, the antenna module may include a second non-conductive ink disposed in the inner hole (872) of the plating through hole (840). The coefficient of thermal expansion of the second non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

[0098] According to embodiments of the present disclosure, a communication device (210) is provided. The communication device (210) comprises: a processor; RF (radio frequency) processing circuits connected to the processor; a plurality of filters connected to the RF processing circuits; and an antenna board having an external hole (871) formed to penetrate the plurality of conductive layers, wherein the antenna board comprises a dielectric layer (830) having polytetrafluoroethylene disposed between at least two of the plurality of conductive layers; a plurality of radiation structures disposed on the antenna board; and a plated through hole (840) formed to penetrate the at least one conductive layer and the dielectric layer (830) among the plurality of layers within the external hole (871) and electrically connected to at least one of the plurality of radiation structures, wherein the plated through hole (840) is connected to at least one of the plurality of filters; and may include a non-conductive ink disposed between the outer hole (871) and the plating through hole (840). The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

[0099] For example, the plating through hole (840) may include an inner hole (872) formed to penetrate the plurality of conductive layers and a plating portion formed along the inner hole (872). The outer hole (871) may be formed to contact the non-conductive ink without a plating portion.

[0100] For example, the difference between the diameter of the outer hole (871) and the diameter of the inner hole (872) of the plating through hole (840) may be 0.2 mm or more.

[0101] For example, the diameter of the outer hole (871) may be 0.9 mm or more and less than 1.1 mm. The diameter of the inner hole (872) of the plating through hole (840) may be 0.18 mm or more and less than 0.22 mm.

[0102] For example, the diameter of the outer hole (871) may be 0.7 mm or more and less than 1.1 mm. The diameter of the inner hole (872) of the plating through hole (840) may be 0.18 mm or more and less than 0.5 mm.

[0103] For example, the antenna board may include an antenna layer. The plurality of radiating structures may be disposed on a first surface of the antenna layer. The plurality of filters may be disposed on the first surface of the antenna layer or on a second surface opposite to the first surface. The plurality of conductive layers may include a first layer corresponding to the first surface of the antenna layer and a second layer corresponding to the second surface of the antenna layer. The first layer may include a first ground area for a signal line using the plating through hole (840). The second layer may include a second ground area for a signal line using the plating through hole (840).

[0104] For example, the communication device (210) may include a conductive pad disposed on the first layer and connected to the end of the plating through hole (840); and at least one conductive pattern disposed on the first layer and connected to the conductive pad. Each of the plurality of radiating structures may be connected to the at least one conductive pattern.

[0105] For example, at least a portion of the first ground region may be formed around the at least one conductive pattern along the longitudinal direction of the at least one conductive pattern in the first layer of the antenna layer.

[0106] For example, the communication device (210) may include a second non-conductive ink disposed in the inner hole (872) of the plating through hole (840). The coefficient of thermal expansion of the second non-conductive ink in the stacking direction of the plurality of conductive layers may be lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers.

[0107] According to embodiments of the present disclosure, an antenna module is provided. The antenna module comprises an antenna board including a first conductive layer facing a first direction and a second conductive layer facing a second direction opposite to the first direction, the antenna board comprising polytetrafluoroethylene (530) disposed to fill between the first conductive layer and the second conductive layer; at least one conductive pattern formed on the antenna board; a plurality of radiating structures disposed on the antenna board and electrically connected to the at least one conductive pattern; and a plated through hole (540) (PTH) comprising a hole formed to penetrate the first conductive layer and the second conductive layer of the antenna board and a plated portion formed along the hole. The plated through hole (540) may be electrically connected to the at least one conductive pattern. Each of the first conductive layer and the second conductive layer may include a ground. The diameter of the plating through hole (540) formed across the first conductive layer and the second conductive layer may be 0.9 mm or more.

[0108] For example, in the stacking direction of the first conductive layer and the second conductive layer, the thickness of the polytetrafluoroethylene (530) in the antenna board may be 0.4 mm or more and less than 0.9 mm.

[0109] For one or more embodiments, at least one of the components described in one or more of the prior art drawings may be configured to perform one or more operations, techniques, processes and / or methods as described in the present disclosure. For example, a processor (e.g., a baseband processor) described in the present disclosure in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described in the present disclosure. As another example, circuits associated with user equipment (UE), a base station, a network element, etc., as described above in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described herein.

[0110] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0111] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0112] When implemented in software, a computer-readable storage medium (e.g., a non-transient computer-readable storage medium) storing one or more programs (software modules) may be provided. One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0113] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0114] Additionally, the program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WAN (wide area network), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0115] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0116] According to the embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as those performed by the corresponding component among the plurality of components prior to the integration. According to the embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0117] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure.

Claims

1. Regarding the antenna module, An antenna board comprising a plurality of conductive layers and having an external hole formed to penetrate the plurality of conductive layers, wherein the antenna board comprises a dielectric layer having polytetrafluoroethylene disposed between at least two of the plurality of conductive layers; A plurality of radiation structures disposed on the antenna board above; A plated through hole (PTH) formed to penetrate at least one of the plurality of conductive layers and the dielectric layer within the above external hole and electrically connected to at least one of the plurality of radiating structures; and It includes a non-conductive ink disposed between the outer hole and the plating through hole, and The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction of the plurality of conductive layers is lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers. Antenna module.

2. In Claim 1, The plating through hole comprises an inner hole formed to penetrate the plurality of conductive layers and a plating portion formed along the inner hole. The above external hole is an NPTH (non-pated through hole) formed to come into contact with the non-conductive ink without a plated portion, Antenna module.

3. In Claim 2, The difference between the diameter of the outer hole and the diameter of the inner hole of the plating through hole is 0.2 mm or more, Antenna module.

4. In Claim 3, The diameter of the above outer hole is 0.7mm or more and less than 1.1mm, and The diameter of the inner hole of the above-mentioned plating through-hole is 0.18mm or more and less than 0.5mm, Antenna module.

5. In Claim 1, The above antenna board includes an antenna layer, and The above plurality of radiation structures are disposed on the first surface of the antenna layer, and The plurality of conductive layers include a first layer corresponding to the first surface of the antenna layer and a second layer corresponding to the second surface opposite to the first surface of the antenna layer, The first layer includes a first ground region for a signal line using the plating through hole, and The second layer comprises a second ground region for the signal line utilizing the plating through hole, Antenna module.

6. In Claim 5, A conductive pad disposed on the first layer and connected to the end of the plating through hole; and It further includes at least one conductive pattern disposed on the first layer and connected to the conductive pad, and Each of the above plurality of radiation structures is connected to the at least one conductive pattern, Antenna module.

7. In Claim 6, At least a portion of the first ground region is formed around the at least one conductive pattern along the longitudinal direction of the at least one conductive pattern in the first layer of the antenna layer, Antenna module.

8. In Claim 1, The plurality of conductive layers include a first layer facing a first direction and a second layer facing a second direction opposite to the first direction, and The above polytetrafluoroethylene is arranged to fill the space between the first layer and the second layer, and The thickness of the dielectric layer having polytetrafluoroethylene in the stacking direction of the plurality of conductive layers is 0.4 mm or more and less than 0.6 mm, Antenna module.

9. In Claim 1, The plurality of conductive layers include a first layer facing a first direction, a second layer below the first layer, a third layer below the second layer, and a fourth layer facing a second direction opposite to the first direction and below the third layer. The above polytetrafluoroethylene is arranged to fill the space between the third layer and the fourth layer, and The thickness of the dielectric layer having polytetrafluoroethylene in the stacking direction of the plurality of conductive layers is 1.0 mm or more and less than 1.2 mm, Antenna module.

10. In Claim 1, It further includes a second non-conductive ink disposed in the inner hole of the plating through hole, and The thermal expansion coefficient of the second non-conductive ink in the stacking direction of the plurality of conductive layers is lower than the thermal expansion coefficient of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers. Antenna module.

11. In a communication device, processor; RF (radio frequency) processing circuits connected to the above processor; A plurality of filters connected to the above RF processing circuits; and An antenna board comprising a plurality of conductive layers and having an external hole formed to penetrate the plurality of conductive layers, wherein the antenna board comprises a dielectric layer having polytetrafluoroethylene disposed between at least two of the plurality of conductive layers; A plurality of radiation structures disposed on the antenna board above; and A plated through hole (PTH) formed to penetrate at least one conductive layer and the dielectric layer among the plurality of layers within the above external hole and electrically connected to at least one of the plurality of radiation structures, wherein the plated through hole is connected to at least one of the plurality of filters; and It includes a non-conductive ink disposed between the outer hole and the plating through hole, and The coefficient of thermal expansion (CTE) of the non-conductive ink in the stacking direction of the plurality of conductive layers is lower than the coefficient of thermal expansion of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers. Communication device.

12. In Claim 11, The plating through hole comprises an inner hole formed to penetrate the plurality of conductive layers and a plating portion formed along the inner hole. The above external hole is formed to contact the above non-conductive ink without a plated portion, Communication device.

13. In Claim 12, The difference between the diameter of the outer hole and the diameter of the inner hole of the plating through hole is 0.2 mm or more, and The diameter of the above outer hole is 0.7mm or more and less than 1.1mm, and The diameter of the inner hole of the above-mentioned plating through-hole is 0.18mm or more and less than 0.5mm, Communication device.

14. In Claim 11, A conductive pad disposed on the first layer and connected to the end of the plating through hole; and It further includes at least one conductive pattern disposed on the first layer and connected to the conductive pad, and The above antenna board includes an antenna layer, and The above plurality of radiation structures are disposed on the first surface of the antenna layer, and The plurality of filters are disposed on the first surface of the antenna layer or on the second surface opposite to the first surface, and The plurality of conductive layers include a first layer corresponding to the first surface of the antenna layer and a second layer corresponding to the second surface of the antenna layer, and The first layer includes a first ground region for a signal line using the plating through hole, and The second layer includes a second ground region for the signal line using the plating through hole, and Each of the plurality of radiation structures is connected to the at least one conductive pattern, and At least a portion of the first ground region is formed around the at least one conductive pattern along the longitudinal direction of the at least one conductive pattern in the first layer of the antenna layer, Communication device.

15. In Claim 11, It further includes a second non-conductive ink disposed in the inner hole of the plating through hole, and The thermal expansion coefficient of the second non-conductive ink in the stacking direction of the plurality of conductive layers is lower than the thermal expansion coefficient of the polytetrafluoroethylene in the stacking direction of the plurality of conductive layers. Communication device.

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