Electronic device including structure for guiding connection between printed circuit board and flexible circuit board

Abstract

An electronic device according to an embodiment of the present disclosure may comprise a printed circuit board. The electronic device may comprise a first connector disposed on the printed circuit board. The electronic device may comprise a flexible circuit board including a second connector connected to the first connector. The electronic device may include a first electronic component disposed on the printed circuit board in a first direction with respect to the first connector. may comprise a first electronic component disposed on the printed circuit board in a first direction with respect to the first connector. The electronic device may comprise a first support member, which includes a body formed of an insulating material and at least one first contact pad coupled to one surface of the body facing the printed circuit board, is disposed between the first connector and the first electronic component, and has at least a portion overlapping a portion of the flexible circuit board corresponding to a peripheral region of the second connector. The printed circuit board may comprise at least one first conductive pad connected to the first connector. The printed circuit board may comprise at least one second conductive pad connected to the at least one first contact pad. The printed circuit board may comprise at least one third conductive pad connected to the first electronic component. The printed circuit board may comprise a first signal pattern connected to the at least one first conductive pad, the at least one second conductive pad, and the at least one third conductive pad. Various other embodiments are possible.

Description

Electronic device including a structure that guides the connection between a printed circuit board and a flexible circuit board

[0001] The various embodiments disclosed in this document relate to an electronic device comprising a structure that guides the connection between a printed circuit board and a flexible circuit board.

[0002] With the development of electronic, information, and communication technologies, various functions are being integrated into a single electronic device. For example, smartphones include communication functions as well as features such as audio playback devices, imaging devices, or electronic notebooks, and even more diverse functions can be implemented on smartphones through the additional installation of applications. Electronic devices can not only execute installed applications or stored files but also connect to servers or other electronic devices via wired or wireless means to receive various information in real time.

[0003] As the performance of electronic devices advances, the performance and integration density of various electronic components are improving. Furthermore, as the use of electronic devices such as smartphones becomes commonplace, user demands for more diverse functions and higher performance are increasing. To satisfy these user demands, electronic devices can be equipped with higher-performance electronic components (or a greater number of components with equivalent performance) and batteries with higher capacities. However, considering portability, there are constraints on expanding the internal space of electronic devices. Therefore, within this limited internal space, increasing the integration density of various electronic components allows for the miniaturization of printed circuit boards and the securing of space for other electronic components.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] Various electronic components (e.g., cameras, displays, sensors) placed inside an electronic device can be driven by being electrically connected to a printed circuit board (printed circuit board) on which a processor (e.g., an application processor (AP)) is placed, via a flexible circuit board. Connectors for connection may be placed on the printed circuit board and the flexible circuit board, respectively. For example, a first connector of the printed circuit board may be connected to a second connector of the flexible circuit board. During the process of connecting the second connector of the flexible circuit board to the first connector of the printed circuit board, the substrate portion (e.g., the rigid portion) of the flexible circuit board where the second connector is located may be pressed. Depending on the direction in which the rigid portion of the flexible circuit board is pressed during this process, the second connector of the flexible circuit board may not be fully connected to the first connector of the printed circuit board and may become loose. Therefore, a support member that supports the rigid portion of the flexible circuit board may be placed on the printed circuit board. The support member may be formed of an insulating material to prevent electrical connection with the signal patterns and electronic components of the printed circuit board. The support member supports the rigid portion of the flexible circuit board so that the rigid portion is not pressed to one side, thereby allowing the first connector of the printed circuit board and the second connector of the flexible circuit board to be fully connected.

[0006] A support member can be bonded to a conductive pad (e.g., a bonding pad) formed on a printed circuit board via solder. For example, a contact pad formed on one side of a support member can be bonded to a conductive pad of the printed circuit board via solder.

[0007] Meanwhile, the support member may be positioned between the first connector of the printed circuit board and an electronic component placed on the printed circuit board. In this case, the signal pattern of the printed circuit board for connecting the first connector and the electronic component may be formed by bypassing the support member. Consequently, the complexity of the signal pattern of the printed circuit board may increase. Furthermore, since the conductive pad on which the support member is positioned cannot be utilized as part of the signal pattern, the integration density of the printed circuit board may be reduced.

[0008] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0009] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board. The electronic device may include a first connector disposed on the printed circuit board. The electronic device may include a flexible circuit board comprising a second connector connected to the first connector. The electronic device may include a first electronic component disposed in a first direction relative to the first connector on the printed circuit board. The electronic device may include a body formed of an insulating material and at least one first contact pad coupled to one surface of the body facing the printed circuit board, and may include a first support member disposed between the first connector and the first electronic component, at least a portion of which overlaps with a portion corresponding to a peripheral area of ​​the second connector on the flexible circuit board. The printed circuit board may include at least one first conductive pad connected to the first connector. The printed circuit board may include at least one second conductive pad connected to the at least one first contact pad. The printed circuit board may include at least one third conductive pad connected to the first electronic component. The printed circuit board may include a first signal pattern connected to the at least one first conductive pad, the at least one second conductive pad, and the at least one third conductive pad.

[0010] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board. The electronic device may include a first connector disposed on the printed circuit board. The electronic device may include a flexible circuit board including a second connector connected to the first connector. The electronic device may include a first electronic component disposed in a first direction relative to the first connector on the printed circuit board. The electronic device may include a second electronic component disposed in the first direction relative to the first connector on the printed circuit board. The electronic device may include a body formed of an insulating material and at least one first contact pad coupled to one surface of the body facing the printed circuit board, and may include a first support member disposed between the first connector and the first electronic component, at least a portion of which overlaps with a portion corresponding to a peripheral area of ​​the second connector on the flexible circuit board. The printed circuit board may include at least one first conductive pad connected to the first connector. The printed circuit board may include at least one second conductive pad connected to the at least one first contact pad. The printed circuit board may include at least one third conductive pad connected to the first electronic component. The printed circuit board may include at least one fourth conductive pad connected to the second electronic component. The printed circuit board may include a first signal pattern connected to the at least one first conductive pad, the at least one second conductive pad, and the at least one third conductive pad. The printed circuit board may include a second signal pattern connecting the at least one first conductive pad and the at least one fourth conductive pad, and not electrically connected to the second conductive pad.

[0011] According to various embodiments disclosed in this document, a conductive pad formed on a support member can be connected to a conductive pad of a printed circuit board bonded to a connector and a conductive pad of a printed circuit board bonded to an electronic component in a single conductive pattern. Accordingly, the electronic component and the connector can be connected without bypassing the support member.

[0012] In addition, the conductive pad bonded to the support member can be utilized as part of the signal path of electronic components, thereby increasing the integration density of the printed circuit board.

[0013] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0014] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0015] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0016] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 2b is a perspective view of the rear side of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0018] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0019] FIG. 4a is a diagram illustrating the positional relationship of a first connector, a first contact pad disposed on a first support member, and an electronic component according to one embodiment of the present disclosure.

[0020] FIG. 4b is a diagram in which a first conductive pad joined to a first connector, a second conductive pad joined to a first contact pad of a first support member, and a third conductive pad joined to a first electronic component are connected through a first signal pattern according to one embodiment of the present disclosure.

[0021] Figure 5a is a cross-sectional view taken along the line 5a-5a of Figure 4b.

[0022] Figure 5b is a cross-sectional view taken along the line 5b-5b of Figure 4b.

[0023] FIGS. 6a and 6b are drawings in which a second electronic component and a connector are connected through a second signal pattern passing between a plurality of second conductive pads joined to a first support member, according to one embodiment of the present disclosure.

[0024] Figure 7a is a cross-sectional view taken along the line 7a-7a of Figure 6b.

[0025] Figure 7b is a cross-sectional view taken along the line 7b-7b of Figure 6b.

[0026] FIG. 8a is a drawing in which a first contact pad disposed on a support member is divided in correspondence with the number of first electronic components, according to one embodiment of the present disclosure.

[0027] FIG. 8b is a diagram according to one embodiment of the present disclosure in which a first electronic component is connected to a connector through a first signal pattern connected to a second conductive pad, and a third electronic component is connected to a connector through a third signal pattern that does not overlap with a first support member.

[0028] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0029] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0030] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0031] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0035] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0036] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0037] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0041] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0043] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0046] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197). According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0050] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0051] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0052] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0053] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0054] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0055] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0056] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0057] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0058] An indicator may be disposed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0059] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0060] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0061] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device that is capable of bending deformation of a display (e.g., display (330) in FIG. 3), so that at least a portion may be folded, wound or rolled, at least a portion of the area may be expanded, and / or can be housed inside a housing (e.g., housing (210) in FIG. 2a and 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0062] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0063] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIG. 2a and FIG. 2b, or may include other embodiments of the electronic device.

[0064] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2a or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover), a display (330) (e.g., the display (201) of FIG. 2a), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0065] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (311) may have a display (330) attached to one side and a substrate (340) attached to the other side. The substrate (340) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0066] Memory may include, for example, volatile memory or non-volatile memory.

[0067] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0068] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the substrate (340). The battery (350) may be integrally disposed inside the electronic device (300). In one embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0069] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or combination thereof of the side bezel structure (310) and / or the first support member (311).

[0070] FIG. 4a is a diagram illustrating the positional relationship of a first connector, a first contact pad of a first support member, and an electronic component according to one embodiment of the present disclosure. FIG. 4b is a diagram illustrating, according to one embodiment of the present disclosure, a first conductive pad joined to the first connector, a second conductive pad joined to the first contact pad of the first support member, and a third conductive pad joined to the first electronic component connected through a first signal pattern. FIG. 5a is a cross-sectional view taken along the line 5a-5a of FIG. 4b. FIG. 5b is a cross-sectional view taken along the line 5b-5b of FIG. 4b.

[0071] According to one embodiment, various electronic components (e.g., camera (e.g., camera module (180) of FIG. 1, camera module (205, 212) of FIG. 2a), display (e.g., display module (180) of FIG. 1, display (201) of FIG. 2a), sensor (e.g., sensor module (176) of FIG. 1, sensor module (204, 219) of FIG. 2a), input device (203) of FIG. 2a, sound output device (207, 214), key input device (217), connector (208)) placed in an electronic device (e.g., electronic device (101) of FIG. 1, electronic device (200) of FIG. 2a) can be electrically connected to a printed circuit board (400) (e.g., board (340) of FIG. 3) on which a processor (120) (e.g., processor (120) of FIG. 1)) is placed through a flexible circuit board (500). In one embodiment, referring to FIG. 5b to be described later, the printed circuit board (400) may include a first connector (410). In one embodiment, the flexible circuit board (500) connected to the electronic component may include a second connector (510) connected to the first connector (410) of the printed circuit board (400). The electronic component connected to the flexible circuit board (500) may be electrically connected to the printed circuit board (400) through the flexible circuit board (500) and driven.

[0072] In one embodiment, the flexible circuit board (500) may include a rigid portion and a bending portion (not shown). In one embodiment, the rigid portion may be an area where a substrate (not shown) connected to the second connector (510) is placed. The bending portion may be an area formed of a flexible material that is bendable relative to the rigid portion, and may be an area where signal wiring connected to the substrate placed in the rigid portion is placed. In one embodiment, the second connector (510) of the flexible printed circuit board (500) may be connected to the first connector (410) of the printed circuit board (400) by pressing the rigid portion of the flexible circuit board (500) toward the printed circuit board (400). Meanwhile, the second connector (510) of the flexible circuit board (500) may not be fully connected to the first connector (410) of the printed circuit board (400) depending on the direction in which the rigid part is pressed during the process of the rigid part of the flexible circuit board (500) being pressed. For example, if the rigid part is pressed toward the printed circuit board (400) from one direction, the second connector (510) of the flexible circuit board (500) may not be fully connected to the first connector (410) as force is applied in a unilateral direction relative to the first connector (410) of the printed circuit board (400). Accordingly, at least one support member (e.g., the first support member (420) and the second support member (430) of FIG. 5b) that supports the rigid part of the flexible circuit board (400) may be disposed on the printed circuit board (400) in an area adjacent to the first connector (410). In one embodiment, the support member (420, 430) may overlap with the periphery of the rigid portion where the second connector (510) is placed when viewed vertically from the printed circuit board (400). In one embodiment, the support member (420, 430) may support the rigid portion of the flexible circuit board (500) during an external shock applied to the electronic device (200) or during the process of connecting the flexible circuit board (500) to the printed circuit board (400).In one embodiment, a portion of the support member (420, 430) may be formed of an insulating material so as not to cause a short circuit with the conductive layer of the printed circuit board (400) (e.g., signal patterns (401, 402, 403)) and the electronic component disposed on the printed circuit board (400) (e.g., first electronic component (440a), second electronic component (440b), third electronic component (440c)). For example, the first support member (420) may include a body (4201) (e.g., first body) formed of an insulating material. The second support member (430) may include a body (4301) (e.g., second body) formed of an insulating material.

[0073] In one embodiment, referring to FIG. 4a, the support members (420, 430) may include a first support member (420) and a second support member (430) that are positioned on both sides of the first connector (410) on the printed circuit board (400) to support the rigid portion of the flexible circuit board (500). In one embodiment, the first support member (420) may be positioned in a first direction (e.g., the + X direction in FIG. 4a) with respect to the first connector (410) of the printed circuit board (400). The second support member (430) may be positioned in a second direction (e.g., the - X direction in FIG. 4a) opposite to the first direction with respect to the first connector (410) of the printed circuit board (400). In some embodiments, the first support member (420) and the second support member (430) may be integral. For example, the support member (420, 430) may be formed in a shape that surrounds the first connector (410) on the printed circuit board (400).

[0074] In one embodiment, the first support member (420) and the second support member (430) may be arranged along the long side of the first connector (410) (e.g., the side in the +Y axis direction of FIG. 4a). In some embodiments, a support member (not shown) may be included that is arranged along the short side of the first connector (410) (e.g., the side in the X axis direction of FIG. 4a). In addition, the printed circuit board (400) may have various numbers and various shapes of support members (e.g., the first support member (420), the second support member (430)) arranged in an area adjacent to the first connector (410) to support the flexible circuit board (500) on the printed circuit board (400).

[0075] In one embodiment, with reference to FIGS. 4a, 4b and 5b, the first support member (420) and the second support member (430) are positioned on the printed circuit board (400) with the first connector (410) in between, and may overlap at least partially with the rigid portion where the second connector (510) of the flexible circuit board (500) is located. For example, the first support member (420) and the second support member (430) may support the rigid portion of the flexible circuit board (500) when the rigid portion of the flexible circuit board (500) is pressed toward the printed circuit board (400) so that the second connector (510) of the flexible circuit board (500) is connected to the first connector (410) of the printed circuit board (400). Accordingly, the second connector (510) of the flexible circuit board (500) can be connected to the first connector (410) of the printed circuit board (400) through the support of the first support member (420) and the second support member (430).

[0076] In one embodiment, referring to FIGS. 4a and 4b, the first support member (420) may be positioned in a first direction relative to the first connector (410) and positioned between the first connector (410) and at least one first electronic component (440a). In one embodiment, the first support member (420) may include a body (4201) formed of an insulating material and at least one first contact pad (4202) coupled to the body (4201). In one embodiment, the first contact pad (4202) may be a single configuration or a plurality of configurations. In one embodiment, the first contact pad (4202) may be coupled to one side of the body (4201) of the first support member (420) facing the printed circuit board (400). In one embodiment, the first support member (420) may be coupled to the printed circuit board (400) as the first contact pad (4202) is soldered to the second conductive pad (421) disposed on the printed circuit board (400).

[0077] In one embodiment, referring to FIGS. 4a and 4b, the second support member (430) may be positioned in a second direction opposite to the first direction with respect to the first connector (410). In one embodiment, the second support member (430) may include a body (4301) formed of an insulating material and a second contact pad (4302) coupled to the body (4301). In one embodiment, the second contact pad (4302) may be a single configuration or a plurality of configurations. In one embodiment, the second contact pad (4302) may be coupled to one side of the body (4301) of the second support member (430) facing the printed circuit board (400). In one embodiment, the second support member (430) may be coupled to the printed circuit board (400) as the second contact pad (4302) is soldered to a coupling pad (431) positioned on the printed circuit board (400).

[0078] According to one embodiment, as illustrated in FIG. 4a, 4b and 5, a printed circuit board (400) comprises at least one first conductive pad (411) joined via solder to a pad (4101) of at least one first connector (410) (e.g., pad (4101) of FIG. 5b), at least one second conductive pad (421) joined via solder to at least one first contact pad (4202) of a first support member (420), and conductive pads (e.g., a third conductive pad (4411), a fourth conductive pad (4412), and a fifth conductive pad joined via solder to pads of a plurality of electronic components (440a, 440b, 440c) (e.g., pad (4401a) of the first electronic component (440a) of FIG. 5b, pad (4401b) of the second electronic component (440b) of FIG. 7b). It may include at least one bonding pad (431) (e.g., a sixth conductive pad) that is bonded via solder to at least one second contact pad (4302) of the pad (4413) and / or the second support member (430). In one embodiment, the first conductive pad (411), the second conductive pad (421), the third conductive pad (4411), the fourth conductive pad (4412), the fifth conductive pad (4413), and the bonding pad (431) may comprise a conductive material.

[0079] According to one embodiment, the first connector (410) and the first conductive pad (411) of the printed circuit board (400) may be electrically and physically connected through pre-solder (e.g., solder). For example, the pad (4101) of the first connector (410) may be joined to the first conductive pad (411) through pre-solder. In one embodiment, the pre-solder may bond the pad (4101) of the first connector (410) and the first conductive pad (411) together through a reflow process.

[0080] According to one embodiment, the second connector (510) and the conductive pad (511) of the flexible circuit board (500) can be electrically and physically connected through pre-solder (e.g., solder).

[0081] According to one embodiment, pads of electronic components (440a, 440b, 440c) and conductive pads of a printed circuit board (e.g., a third conductive pad (4411), a fourth conductive pad (4412), a fifth conductive pad (4413)) can be electrically and physically connected through pre-solder (e.g., solder). For example, a pad (4401a) of a first electronic component (440a) (e.g., pad (4401a) of FIG. 5b) can be joined to a third conductive pad (4411) through pre-solder. A pad (4401b) of a second electronic component (440b) (e.g., pad (4401b) of FIG. 7b) can be joined to a fourth conductive pad (4412) through pre-solder. A pad (not shown) of the third electronic component (440c) can be joined to the fifth conductive pad (4413) via pre-solder. In one embodiment, the pre-solder can bond the pads of the electronic components (440a, 440b, 440c) and the conductive pads of the printed circuit board (e.g., the third conductive pad (4411), the fourth conductive pad (4412), the fifth conductive pad (4413)) together through a reflow process.

[0082] In one embodiment, referring to FIG. 5a, the first support member (420) may include at least one first contact pad (4202) coupled to a surface facing the printed circuit board (400) (e.g., a surface facing the -Z direction in FIG. 5a). The first contact pad (4202) may be composed of a plurality. For example, the first contact pad (4202) (e.g., the first-1 contact pad (4202a) and the first-2 contact pad (4202b) in FIG. 5a) may be arranged at regular intervals on one surface of the first support member (420). At least one second conductive pad (421) of the printed circuit board (400) (e.g., the second-1 conductive pad (421a) and the second-2 conductive pad (421b) in FIG. 5a) may correspond to a plurality of first contact pads (4202). A plurality of first contact pads (4202) and a plurality of second conductive pads (421) can be electrically and physically connected through pre-solder. In one embodiment, the pre-solder can bond the plurality of first contact pads (4202) and the plurality of second conductive pads (421) together through a reflow process.

[0083] In one embodiment, a plurality of second conductive pads (421) may be spaced apart at a certain interval on one side of a printed circuit board (400). For example, the spacing between adjacent second conductive pads (421) may be approximately 0.15 mm to 0.3 mm. In addition, the spacing between adjacent second conductive pads (421) may vary to various values ​​depending on the design environment. Thus, interference (e.g., short circuit) between adjacent second conductive pads (421) can be prevented.

[0084] In one embodiment, a plurality of first contact pads (4202) of the first support member (420) may each correspond to a plurality of second conductive pads (421). In one embodiment, the spacing between the plurality of first contact pads (4202) may correspond to the spacing between the plurality of second conductive pads (421). For example, the spacing between adjacent first contact pads (4202) may be approximately 0.15 mm to 0.3 mm. In addition, the spacing between the plurality of first contact pads (4202) may vary to various values ​​depending on the design environment.

[0085] In one embodiment, referring to FIG. 5b, the second support member (430) may include a second contact pad (4302) coupled to a surface facing the printed circuit board (400) (e.g., a surface facing the -Z direction in FIG. 5b). In one embodiment, the second contact pad (4302) may not be composed of multiple pads, unlike the first contact pad (4202). In some embodiments, the second contact pad (4302) may be composed of multiple pads. A coupling pad (431) of the printed circuit board (400) may correspond to the second contact pad (4302). The second support member (430) may be electrically and physically connected through a pre-solder in contact with the second contact pad (4302) and the coupling pad (431) of the printed circuit board (400). In one embodiment, the pre-solder can bond the second contact pad (4302) and the bonding pad (431) together through a reflow process.

[0086] The soldering process is not limited to reflow soldering, and various methods other than reflow soldering, such as flow soldering, can be used.

[0087] According to one embodiment, as illustrated in FIGS. 4a, 4b and 5b, various electronic components (e.g., a first electronic component (440a), a second electronic component (440b), a third electronic component (440c)) may be disposed on a printed circuit board (400). In one embodiment, the electronic components (440a, 440b, 440c) disposed on the printed circuit board (400) may include passive components (e.g., resistors, capacitors, inductors) and active components (e.g., diodes, transistors, processors (120), power management modules (188), memory (130), and communication modules (190)). In addition, various types of electronic components may be disposed on the printed circuit board (400).

[0088] In the following description, the first electronic component (440a) may be an electronic component located in the first direction (the + X direction in FIG. 4a) with respect to the first support member (420), as shown in FIG. 5b. The description is based on the premise that the first electronic component (440a) is an electronic component connected to the first conductive pad (411) of the first connector (410) through one of at least one second conductive pad (421) of the printed circuit board (400) that is bonded to at least one first contact pad (4202) of the first support member (420). The second electronic component (440b) may be an electronic component located in the first direction with respect to the first support member (420), as shown in FIG. 6b to be described later. The second electronic component (440b) is described on the premise that it is an electronic component connected to the first conductive pad (411) of the first connector (410) through a signal pattern (e.g., second signal pattern (402)) of the printed circuit board (400) passing between at least one first contact pad (4202) of the first support member (420) and at least one second conductive pad (421) of the printed circuit board (400). The third electronic component (440c) may be an electronic component that does not overlap with the first support member (420) and / or the second support member (430) when the printed circuit board (400) is viewed vertically, as shown in FIG. 6b to be described later. The third electronic component (440c) is described on the premise that it is an electronic component connected to the first conductive pad (411) of the first connector (410) through a signal pattern (e.g., the third signal pattern (403)) of the printed circuit board (400).

[0089] According to one embodiment, as illustrated in FIGS. 4a, 4b, 5a, and 5b, the first support member (420) may be disposed between the first connector (410) and a plurality of electronic components (440a, 440b, 440c) on the printed circuit board (400). As described above, the first support member (420) may be disposed on the printed circuit board (400) as a plurality of first contact pads (4202) disposed on one side are bonded to a plurality of second conductive pads (421) of the printed circuit board (400) through solder.

[0090] In one embodiment, referring to FIG. 5a, a plurality of first contact pads (4202) (e.g., first-1 contact pad (4202a) and first-2 contact pad (4202b)) and a plurality of second conductive pads (421) (e.g., second-1 conductive pad (421a) and second-2 conductive pad (4202b)) may be arranged at regular intervals along the long side (e.g., the Y-axis direction of FIG. 5a) of the first connector (410). In one embodiment, the plurality of first contact pads (4202) and the plurality of second conductive pads (421) may be joined by solder between the opposing components. Thus, the plurality of first contact pads (4202) may not be physically or electrically connected. Additionally, the plurality of second conductive pads (421) may not be physically or electrically connected.

[0091] According to one embodiment, as illustrated in FIGS. 4b and FIGS. 5b, a printed circuit board (400) may include a plurality of first conductive pads (411) bonded to a first connector (410), a plurality of second conductive pads (421) bonded to a plurality of first contact pads (4202) disposed on a first support member (420), and a first signal pattern (401) connected to a third conductive pad (4411) bonded to a first electronic component (440a). When the printed circuit board (400) is viewed from a vertical direction, at least a portion of the first signal pattern (401) may overlap with the first support member (420). In one embodiment, the first signal pattern (401) may be part of a conductive layer (e.g., a copper layer) of the printed circuit board (400). In one embodiment, the first signal pattern (401) is located below the solder resistor layer, which is an insulating layer of the printed circuit board (400), so that contact with the solder applied to the first conductive pad (411), the second conductive pad (421), the third conductive pad (4411), the fourth conductive pad (4412), and the fifth conductive pad (4413) can be prevented. Accordingly, the first connector (410) can be electrically connected to the first electronic component (440a) through the first signal pattern (401) which connects at least one of the plurality of first conductive pads (411), any one of the plurality of second conductive pads (421), and the third conductive pad (4411) bonded to the first electronic component (440a). The printed circuit board (400) can electrically connect the first conductive pad (411) connected to the first connector (410) and the third conductive pad (4411) connected to the first electronic component (440a) through the second conductive pad (421) connected to the first contact pad (4202) of the first support member (420) and the first signal pattern (401) connected thereto.The first electronic component (440a) and the first connector (410) can transmit or receive various signals (e.g., data signal, control signal, power signal, clock signal, analog signal) through the first signal pattern (401). In one embodiment, the first electronic component (440a) is connected to the first connector (410) through the first signal pattern (401) to perform signal filtering and / or impedance matching.

[0092] In one embodiment, referring to FIG. 5b, the first signal pattern (401) may be electrically connected to the first conductive pad (411), the second conductive pad (421), and the third conductive pad (4411) at the bottom of the first conductive pad (411), the second conductive pad (421), and the third conductive pad (4411). In some embodiments, the first signal pattern (401) may be located between the first conductive pad (411) and the second conductive pad (421) and / or between the second conductive pad (421) and the third conductive pad (4411) and be electrically connected to the first conductive pad (411), the second conductive pad (421), and the third conductive pad (4411).

[0093] In one embodiment, a plurality of first signal patterns (401) (e.g., first-1 signal pattern (401a), first-2 signal pattern (401b)) may be formed so that a plurality of first electronic components (440a) and a first connector (410) are connected by the shortest distance. For example, a plurality of first signal patterns (401) may be extended in the X-axis direction of FIG. 6b and connected to at least one of a plurality of first conductive pads (411) joined to the first connector (410), any one of a plurality of second conductive pads (421), and a third conductive pad (4411) joined to the first electronic component (440a).

[0094] In one embodiment, with reference to FIG. 4b and FIG. 6b to be described later, the first signal pattern (401) may include a plurality of signal patterns (e.g., a first-1 signal pattern (401a) and a first-2 signal pattern (401b)) each connected to a plurality of first electronic components (440a). In one embodiment, the plurality of signal patterns (401) may electrically connect different second conductive pads (421) among a plurality of second conductive pads (421) and different electronic components among a plurality of first electronic components (440a) to a first conductive pad (411) connected to a first connector (410). In one embodiment, the first-1 signal pattern (401a) may be connected to a third conductive pad (4411) connected to any one of the plurality of first electronic components (440a), any one of the plurality of second conductive pads (421) (e.g., second-1 conductive pad (421a)), and at least one of the plurality of first conductive pads (411) connected to the first connector (410). In one embodiment, the first-2 signal pattern (401b) may be connected to a third conductive pad (4411) connected to another of the plurality of first electronic components (440a), another of the plurality of second conductive pads (421) (e.g., second-2 conductive pad (421b)), and at least one of the plurality of first conductive pads (411) connected to the first connector (410).

[0095] FIGS. 6a and 6b are drawings in which a second electronic component and a connector are connected through a second signal pattern passing between a plurality of second conductive pads joined to a first support member, according to one embodiment of the present disclosure. FIG. 7a is a cross-sectional view taken along the line 7a-7a of FIG. 6b. FIG. 7b is a cross-sectional view taken along the line 7b-7b of FIG. 6b.

[0096] According to one embodiment, FIGS. 6a to 7b described below may be an embodiment in which a printed circuit board (400) includes a second signal pattern (402) connecting a second electronic component (440b) and a first connector (410) and a third signal pattern (403) connecting a third electronic component (440c) and a first connector (410).

[0097] Below, we will focus on the differences from the embodiments of FIGS. 4a to 5b described above.

[0098] According to one embodiment, with reference to FIG. 6a and FIG. 6b, a plurality of second conductive pads (421) may correspond to the number of first electronic components (440a) located in a first direction (e.g., the + X direction in FIG. 6a) with respect to the first support member (420). The first contact pads (4202) of the first support member (420) may be configured in a number corresponding to the number of the plurality of second conductive pads (421). Thus, the first contact pads (4202) of the first support member (420) may also correspond to the number of first electronic components (440a). In some embodiments, a first signal pattern (401) may be connected to a plurality of first electronic components (440a). In this case, the number of first contact pads (4202) and second conductive pads (421) may be equal to the number of first signal patterns (401).

[0099] In one embodiment, referring to FIG. 7a, the number of a plurality of second conductive pads (421) and a plurality of first contact pads (4202) may be three, corresponding to the number of first electronic components (440a). In this case, the plurality of first contact pads (4202) disposed on the body (4201) of the first support member (420) may include a first-1 contact pad (4202a), a first-2 contact pad (4202b), and a first-3 contact pad (4202c). A plurality of second conductive pads (421) may include a second-1 conductive pad (421a) corresponding to a first-1 contact pad (4202a), a second-2 conductive pad (421b) corresponding to a first-2 contact pad (4202b), and a second-3 conductive pad (421c) corresponding to a first-3 contact pad (4202c). A first signal pattern (401) may include a plurality of signal patterns (e.g., a first-1 signal pattern (401a), a first-2 signal pattern (401b), and a first-3 signal pattern (401c)) each connected to a plurality of first electronic components (401a). In one embodiment, the first-1 signal pattern (401a) may be connected to a third conductive pad (4411) connected to any one of the plurality of first electronic components (440a), any one of the plurality of second conductive pads (421) (e.g., second-1 conductive pad (421a)), and a first conductive pad (411) connected to the first connector (410).

[0100] In one embodiment, the first-2 signal pattern (401b) may be connected to a third conductive pad (4411) connected to another of the plurality of first electronic components (440a), another of the plurality of second conductive pads (421) (e.g., second-2 conductive pad (421b)), and a first conductive pad (411) connected to the first connector (410). In one embodiment, the first-3 signal pattern (401c) may be connected to a third conductive pad (4411) connected to yet another of the plurality of first electronic components (440a), another of the plurality of second conductive pads (421) (e.g., second-3 conductive pad (421c)), and a first conductive pad (411) connected to the first connector (410). Accordingly, the first electronic component (440a) can be electrically connected to the first connector (410) through the first signal pattern (401).

[0101] In one embodiment, a plurality of first signal patterns (401) (e.g., first-1 signal pattern (401a), first-2 signal pattern (401b) and first-3 signal pattern (401c)) may be formed so that a plurality of first electronic components (440a) and a first connector (410) are connected by the shortest distance. For example, a plurality of first signal patterns (401) may be extended in the X-axis direction of FIG. 6b and connected to at least one of a plurality of first conductive pads (411) joined to the first connector (410), any one of a plurality of second conductive pads (421), and a third conductive pad (4411) joined to the first electronic component (440a).

[0102] In one embodiment, referring to FIGS. 6a, 6b and 7b, the second electronic component (440b) may be an electronic component located in a first direction relative to the first support member (420). The second electronic component (440b) may be connected to the first conductive pad (411) of the first connector (410) through a second signal pattern (402) of the printed circuit board (400) passing between a plurality of second conductive pads (421) of the printed circuit board (400). In one embodiment, the second signal pattern (402) may not be electrically connected to the second conductive pad (421) and the first contact pad (4202). The second signal pattern (402) may connect at least one of a plurality of first conductive pads (411) connected to a plurality of first connectors (410) and a fourth conductive pad (4412) connected to the second electronic component (440b). The second signal pattern (402) extends along the X-axis direction of FIG. 6b and can pass between a plurality of second conductive pads (421). In one embodiment, the second signal pattern (402) may be a pattern of the shortest path connecting the first conductive pad (411) and the fourth conductive pad (4412).

[0103] In one embodiment, referring to FIG. 6b, the number of second signal patterns (402) may correspond to the number of second electronic components (440b). For example, if there are multiple second electronic components (440b), the second signal pattern (402) may include a second-1 signal pattern (402a) and a second-2 signal pattern (402b) connecting a fourth conductive pad (4412) connected to each of the multiple second electronic components (440b) and a first conductive pad (411) connected to the first connector (410). The second electronic components (440b) and the first connector (410) may transmit or receive various signals (e.g., data signal, control signal, power signal, clock signal, analog signal) through the second signal pattern (402). In one embodiment, the second electronic component (440b) is connected to the first connector (410) through the second signal pattern (402) to perform signal filtering and / or impedance matching.

[0104] In one embodiment, the second signal pattern (402) may not overlap with the plurality of first contact pads (4202) corresponding to the plurality of second conductive pads (421) when viewed from a vertical direction (e.g., the Z-axis direction of FIG. 7a) as it passes between the plurality of second conductive pads (421).

[0105] In one embodiment, referring to FIG. 6b, the third electronic component (403) may be positioned in the -Y direction of FIG. 6b with respect to the first support member (420) so as not to overlap with the first support member (420). In one embodiment, referring to FIG. 6b, the third electronic component (403) may be connected to the first connector (410) through the third signal pattern (403). In one embodiment, the third signal pattern (403) may not be electrically connected to the second conductive pad (421) and the first contact pad (4202). The fifth conductive pad (4413) of the printed circuit board (400) bonded to the third electronic component (403) may be connected to a plurality of first conductive pads (411) of the printed circuit board (400) bonded to the first connector (410) through the third signal pattern (403). The third electronic component (440b) and the first connector (410) can transmit or receive various signals (e.g., data signal, control signal, power signal, clock signal, analog signal) through the third signal pattern (403). In one embodiment, the third electronic component (440c) is connected to the first connector (410) through the third signal pattern (403) to perform signal filtering and / or impedance matching.

[0106] FIG. 8a is a drawing in which a first contact pad of a support member is divided in correspondence with the number of first electronic components, according to one embodiment of the present disclosure. FIG. 8b is a drawing in which, according to one embodiment of the present disclosure, a first electronic component is connected to a connector through a first signal pattern connected to a second conductive pad, and a third electronic component is connected to a connector through a third signal pattern that does not overlap with the first support member.

[0107] Hereinafter, the description will focus on the differences from the embodiments of FIGS. 4a to 7b described above. Compared to the embodiments of FIGS. 4a to 5b described above, FIGS. 8a and 8b described below may include a printed circuit board (400) that includes a third signal pattern (403) connecting a third electronic component (440c) and a first connector (410). Additionally, compared to FIGS. 6a to 7b described above, FIGS. 8a and 8b may omit the second electronic component (440b) and the second signal pattern (402) that connects the second electronic component (440b) and the first connector (410).

[0108] In one embodiment, referring to FIGS. 8a and FIGS. 8b, the third electronic component (403) may be positioned in the -Y direction of FIG. 6b with respect to the first support member (420) so as not to overlap with the first support member (420). In one embodiment, referring to FIG. 6b, the third electronic component (403) may be connected to the first connector (410) through the third signal pattern (403). For example, the fifth conductive pad (4413) of the printed circuit board (400) bonded to the third electronic component (403) may be connected to a plurality of first conductive pads (411) of the printed circuit board (400) bonded to the first connector (410) through the third signal pattern (403).

[0109] According to various embodiments disclosed in this document, a plurality of first contact pads (4202) that are bonded to a plurality of second conductive pads (421) of a printed circuit board (400) may be bonded to one side of the body (4201) of the first support member (420). The plurality of first contact pads (4202) and the plurality of second conductive pads (421) may correspond to each other. A first conductive terminal bonded to the first connector (410), any one of the plurality of second conductive pads (421), and a third conductive pad (4411) bonded to the first electronic component (440a) may be connected to a first signal pattern (401) of the printed circuit board (400). The first signal pattern (401) may overlap with the first support member (420) when the printed circuit board (400) is viewed from a vertical direction. Accordingly, the first electronic component (440a) and the first connector (410) can be connected without bypassing the first support member (420). Additionally, the first contact pad (4202) of the first support member (420) and the second conductive pad (421) of the printed circuit board (400) can be utilized as part of the signal path of the first electronic component (440a), thereby increasing the integration density of the printed circuit board (400).

[0110] According to one embodiment of the present disclosure, an electronic device (101, 200) may include a printed circuit board (340, 400). The electronic device may include a first connector (410) disposed on the printed circuit board. The electronic device may include a flexible circuit board (500) comprising a second connector (510) connected to the first connector. The electronic device may include a first electronic component (440a) disposed in a first direction relative to the first connector on the printed circuit board. The electronic device may include a body (420) formed of an insulating material, and at least one first contact pad (4202) coupled to one surface of the body facing the printed circuit board, and may include a first support member (420) disposed between the first connector and the first electronic component, with at least a portion overlapping with a portion corresponding to a peripheral area of ​​the second connector on the flexible circuit board. The printed circuit board may include at least one first conductive pad (411) connected to the first connector. The printed circuit board may include at least one second conductive pad (421) connected to the at least one first contact pad. The printed circuit board may include at least one third conductive pad (4411) connected to the first electronic component. The printed circuit board may include a first signal pattern (401) connected to the at least one first conductive pad, the at least one second conductive pad, and the at least one third conductive pad.

[0111] In one embodiment, the first support member can support a portion of the flexible circuit board.

[0112] In one embodiment, the at least one first contact pad and the at least one second conductive pad may be arranged at regular intervals along the long side of the first connector.

[0113] In one embodiment, the at least one first contact pad and the at least one second conductive pad may be composed of a plurality. The first signal pattern may include a first-1 signal pattern connecting the plurality of first conductive pads, any one of the plurality of second conductive pads, and the third conductive pad connected to any one of the plurality of first electronic components, and a first-2 signal pattern connecting the plurality of first conductive pads, another of the plurality of second conductive pads, and the third conductive pad connected to another of the plurality of first electronic components.

[0114] In one embodiment, the electronic device may further include a second electronic component (440b) positioned in the first direction with respect to the first connector on the printed circuit board. The printed circuit board may include at least one fourth conductive pad (4412) connected to the second electronic component. The printed circuit board may include a second signal pattern (402) connecting the at least one first conductive pad and the at least one fourth conductive pad and passing between a plurality of second conductive pads.

[0115] In one embodiment, the at least one first contact pad and the at least one second conductive pad may be composed of a plurality of them. The second signal pattern of the printed circuit board may not be electrically connected to the plurality of first contact pads.

[0116] In one embodiment, the electronic device may further include a third electronic component (440c) disposed on the printed circuit board. The printed circuit board may include at least one fifth conductive pad (4413) connected to the third electronic component and a third signal pattern (403) connecting the at least one first conductive pad and the at least one fifth conductive pad. The third signal pattern of the printed circuit board may not overlap with the first support member when the printed circuit board is viewed vertically.

[0117] In one embodiment, the at least one first contact pad and the at least one second conductive pad may correspond to the number of signals connected to the first electronic component.

[0118] In one embodiment, the flexible circuit board may include a rigid portion on which the second connector is disposed and a bending portion that is bendable with respect to the rigid portion. The first support member may overlap with the rigid portion of the flexible circuit board when the printed circuit board is viewed vertically.

[0119] In one embodiment, the electronic device comprises a body formed of an insulating material and at least one second contact pad (4302) coupled to one surface facing the printed circuit board, and may further comprise a second support member (430) disposed in a second direction opposite to the first direction with respect to the first connector on the printed circuit board, with at least a portion overlapping with a portion corresponding to the peripheral area of ​​the second connector. The substrate may include a coupling pad (431) connected to the at least one second contact pad.

[0120] In one embodiment, the first support member may surround the first connector.

[0121] In one embodiment, the pad of the first connector may be joined to the at least one first conductive pad via solder. The first contact pad of the first support member may be joined to the at least one second conductive pad via solder. The pad of the first electronic component may be joined to the at least one third conductive pad via solder.

[0122] According to one embodiment of the present disclosure, an electronic device (101, 200) may include a printed circuit board (340, 400). The electronic device may include a first connector (410) disposed on the printed circuit board. The electronic device may include a flexible circuit board (500) comprising a second connector (510) connected to the first connector. The electronic device may include a first electronic component (440a) disposed on the printed circuit board in a first direction relative to the first connector. The electronic device may include a second electronic component (440b) disposed on the printed circuit board in the first direction relative to the first connector. The electronic device may include a body formed of an insulating material and at least one first contact pad (4202) coupled to one side of the body facing the printed circuit board, and may include a first support member (420) disposed between the first connector and the first electronic component, with at least a portion overlapping with a portion corresponding to the peripheral area of ​​the second connector on the flexible circuit board. The printed circuit board may include at least one first conductive pad (411) connected to the first connector. The printed circuit board may include at least one second conductive pad (421) connected to the at least one first contact pad. The printed circuit board may include at least one third conductive pad (4411) connected to the first electronic component. The printed circuit board may include at least one fourth conductive pad (4412) connected to the second electronic component. The printed circuit board may include a first signal pattern (401) connected to the at least one first conductive pad, the at least one second conductive pad, and the at least one third conductive pad.The printed circuit board may include a second signal pattern (402) that connects the at least one first conductive pad and the at least one fourth conductive pad and is not electrically connected to the second conductive pad.

[0123] In one embodiment, the at least one first contact pad and the at least one second conductive pad may be composed of a plurality of them. The second signal pattern may pass between the plurality of the second conductive pads.

[0124] In one embodiment, the at least one first contact pad and the at least one second conductive pad may be arranged at regular intervals along the long side of the first connector.

[0125] In one embodiment, the first signal pattern may include a first-1 signal pattern connecting the third conductive pad connected to any one of the plurality of first conductive pads, any one of the plurality of second conductive pads, and any one of the plurality of first electronic components, and a first-2 signal pattern connecting the third conductive pad connected to the plurality of first conductive pads, another one of the plurality of second conductive pads, and another one of the plurality of first electronic components.

[0126] In one embodiment, the electronic device may further include a third electronic component (440c) disposed on the printed circuit board. The printed circuit board may include at least one fifth conductive pad (4413) connected to the third electronic component and a third signal pattern (403) connecting the at least one first conductive pad and the at least one fifth conductive pad. The third signal pattern of the printed circuit board may not overlap with the first support member when the printed circuit board is viewed vertically.

[0127] In one embodiment, the at least one first contact pad and the at least one second conductive pad may correspond to the number of signals connected to the first electronic component.

[0128] In one embodiment, the flexible circuit board may include a rigid portion on which the second connector is disposed and a bending portion that is bendable with respect to the rigid portion. The first support member may overlap with the rigid portion of the flexible circuit board when the printed circuit board is viewed vertically.

[0129] In one embodiment, the electronic device comprises a body formed of an insulating material and at least one second contact pad (4302) coupled to one surface facing the printed circuit board, and may further comprise a second support member (430) disposed in a second direction opposite to the first direction with respect to the first connector on the printed circuit board, with at least a portion overlapping with a portion corresponding to the peripheral area of ​​the second connector. The board may include a coupling pad (431) connected to the at least one second contact pad.

[0130] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0131] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0132] It will be understood that the present invention considers and includes, in addition to the embodiments disclosed above, embodiments based on any two or more combinations of the disclosed embodiments and embodiments including any combination of the features disclosed herein. That is, the absence of an explicit indication that two features can be combined or two embodiments can be combined does not mean that such combination is not conceived, but should be understood as such combination being included herein.

Claims

1. In an electronic device (101, 200), Printed circuit board (340, 400); A first connector (410) disposed on the printed circuit board above; A flexible circuit board (500) including a second connector (510) connected to the first connector; A first electronic component (440a) positioned in a first direction relative to the first connector on the printed circuit board; and A first support member (420) comprising a body (420) formed of an insulating material and at least one first contact pad (4202) coupled to one surface of the body facing the printed circuit board, disposed between the first connector and the first electronic component, and having at least a portion overlapping with a portion corresponding to the peripheral area of ​​the second connector on the flexible circuit board. The above printed circuit board is, At least one first conductive pad (411) connected to the first connector, At least one second conductive pad (421) connected to the at least one first contact pad, At least one third conductive pad (4411) connected to the first electronic component, and An electronic device comprising a first signal pattern (401) connected to at least one first conductive pad, at least one second conductive pad, and at least one third conductive pad.

2. In Paragraph 1, The first support member above is, An electronic device that supports a portion of the above flexible circuit board.

3. In Paragraph 1, The above at least one first contact pad and the above at least one second conductive pad are, Electronic devices arranged at regular intervals along the long side of the first connector.

4. In Paragraph 1, The above at least one first contact pad and the above at least one second conductive pad are composed of a plurality of, The above first signal pattern is, A first-1 signal pattern connecting any one of the plurality of first conductive pads, any one of the plurality of second conductive pads, and any one of the plurality of first electronic components, and a third conductive pad connected to the plurality of first conductive pads, and An electronic device comprising a first-2 signal pattern connecting the plurality of first conductive pads, another of the plurality of second conductive pads, and the third conductive pad connected to another of the plurality of first electronic components.

5. In Paragraph 1, It further includes a second electronic component (440b) positioned in the first direction relative to the first connector on the printed circuit board, and The above printed circuit board is, At least one fourth conductive pad (4412) connected to the second electronic component, and An electronic device comprising a second signal pattern (402) that connects the at least one first conductive pad and the at least one fourth conductive pad and passes between a plurality of second conductive pads.

6. In Paragraph 5, The above at least one first contact pad and the above at least one second conductive pad are composed of a plurality of, The second signal pattern of the above printed circuit board is, An electronic device that is not electrically connected to the plurality of first contact pads mentioned above.

7. In Paragraph 1, It further includes a third electronic component (440c) disposed on the printed circuit board above, and The above printed circuit board is, It includes at least one fifth conductive pad (4413) connected to the third electronic component and a third signal pattern (403) connecting the at least one first conductive pad and the at least one fifth conductive pad, The third signal pattern of the printed circuit board is, An electronic device that does not overlap with the first support member when the above printed circuit board is viewed vertically.

8. In Paragraph 1, The above at least one first contact pad and the above at least one second conductive pad are, An electronic device corresponding to the number of signals connected to the first electronic component.

9. In Paragraph 1, The above flexible circuit board is, It includes a rigid portion on which the second connector is disposed and a bending portion that is bendable with respect to the rigid portion, The first support member above is, An electronic device that overlaps with the rigid portion of the flexible circuit board when the printed circuit board is viewed vertically.

10. In Paragraph 1, The device further comprises a second support member (430) including a body formed of an insulating material and at least one second contact pad (4302) coupled to one surface facing the printed circuit board, and positioned in a second direction opposite to the first direction with respect to the first connector on the printed circuit board, with at least a portion overlapping with a portion corresponding to the peripheral area of ​​the second connector. The above substrate is, An electronic device comprising a coupling pad (431) connected to at least one second contact pad.

11. In Paragraph 1, The above first support member is An electronic device surrounding the first connector.

12. In Paragraph 1, The pad of the first connector is joined to the at least one first conductive pad through soldering, and The first contact pad of the first support member is joined to the at least one second conductive pad through solder, and The pad of the first electronic component is joined to the at least one third conductive pad through soldering in an electronic device.

13. In an electronic device (101, 200), Printed circuit board (340, 400); A first connector (410) disposed on the printed circuit board above; A flexible circuit board (500) including a second connector (510) connected to the first connector; A first electronic component (440a) positioned in a first direction relative to the first connector on the printed circuit board; A second electronic component (440b) positioned in the first direction relative to the first connector on the printed circuit board; and A first support member (420) comprising a body formed of an insulating material and at least one first contact pad (4202) coupled to one surface of the body facing the printed circuit board, disposed between the first connector and the first electronic component, and having at least a portion overlapping with a portion corresponding to the peripheral area of ​​the second connector on the flexible circuit board. The above printed circuit board is, At least one first conductive pad (411) connected to the first connector, At least one second conductive pad (421) connected to the at least one first contact pad, At least one third conductive pad (4411) connected to the first electronic component, At least one fourth conductive pad (4412) connected to the second electronic component, A first signal pattern (401) connected to the at least one first conductive pad, the at least one second conductive pad, and the at least one third conductive pad, and An electronic device comprising a second signal pattern (402) that connects the at least one first conductive pad and the at least one fourth conductive pad and is not electrically connected to the second conductive pad.

14. In Paragraph 13, The above at least one first contact pad and the above at least one second conductive pad are composed of a plurality of, The above second signal pattern is an electronic device passing between a plurality of the above second conductive pads.

15. In Paragraph 13, The above at least one first contact pad and the above at least one second conductive pad are, Electronic devices arranged at regular intervals along the long side of the first connector.

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