A stepped water bath for electroplating

Abstract

This invention discloses a water bath tank body, in which copper guide rails are arranged inside. The length direction of the copper guide rails is parallel to the length direction of the water bath tank body. A water bath liquid inlet pipe is fixedly connected to the side of the water bath tank body. There are several copper guide rails, which are distributed in a stepped manner, with the copper guide rails on the side closer to the water bath liquid inlet pipe having the highest height. Filler blocks are fixedly connected or integrally formed between the copper guide rails. This invention has a high water bath liquid utilization rate, and the contact pads of the conductive brush and the copper guide rails are submerged below the water bath liquid. This satisfies the stepped water bath conductivity method for electroplating, avoids sparks generated by the conductive brush during movement, and ensures safe production.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment, and more specifically to a stepped water bath for electroplating. Background Technology

[0002] Current technologies use carbon brushes or direct contact between carbon-copper and copper tracks for conductivity. The biggest drawback of this method is that it easily generates sparks, which can cause fires, resulting in significant economic losses and safety hazards. This solution uses two technical means to address the problems existing at this stage: 1. Using a water bath, the solution can completely submerge the conductive contact area, preventing high temperatures at the contact point and preventing instantaneous excessive current and sparks caused by a sudden decrease in the contact area at a certain point in time; 2. Using a stepped arrangement, the conductive tracks are arranged in a stepped manner, allowing the solution to flow from the highest to the lowest position. Through pump circulation, the solution is repeatedly reused, becoming a flowing liquid. This prevents bacterial growth in the liquid and carries impurities from higher positions to the collection point at the lowest position, preventing sharp impurities from damaging the conductive blocks. Summary of the Invention

[0003] The purpose of this invention is to provide a stepped water bath for electroplating.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A stepped water bath for electroplating includes a water bath body, inside which copper guide rails are provided. The length direction of the copper guide rails is parallel to the length direction of the water bath body. A water bath liquid inlet pipe is fixedly connected to the side of the water bath body. There are several copper guide rails, which are distributed in a stepped manner, with the copper guide rails on the side closer to the water bath liquid inlet pipe having the highest height. Filler blocks are fixedly connected or integrally formed between the copper guide rails.

[0006] Furthermore, a low-level solution collection chamber is formed between the copper guide rail on the side away from the water bath liquid inlet pipe and the water bath tank body, and a circulation outlet is provided on the low-level solution collection chamber.

[0007] Furthermore, the circulation outlet is located on the body of the water bath tank and on the side away from the water bath liquid inlet pipe.

[0008] Furthermore, a support platform is fixedly connected to the lower part of the water bath body, and the support platform is set on the ground.

[0009] Furthermore, an electroplating walking frame is provided above the water bath body, and two conductive brushes are fixedly connected to the bottom of the electroplating walking frame, with the bottom surfaces of the two conductive brushes abutting against two of the copper guide rails respectively.

[0010] Compared with the prior art, the beneficial effects of the present invention are:

[0011] The copper guide rail of this invention adopts a novel stepped layout; the water bath liquid flows from the highest point to the lowest point to the collection point, and is then recirculated back to the highest point by the pump body, thus repeating the cycle repeatedly; the contact pad between the conductive brush and the copper guide rail is submerged below the water bath liquid; this satisfies the stepped water bath conductivity method for electroplating, avoids sparks generated by the conductive brush during movement, and ensures safe production. Attached image description:

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a left cross-sectional view of the present invention;

[0014] Figure 2 This is the front view of the present invention;

[0015] Figure 3 This is a diagram showing the distribution of the guide rail track in this invention. Detailed implementation method:

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0017] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0018] It should be noted that, unless otherwise specified, the embodiments and features described in this invention can be combined with each other.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] Please see Figures 1-3 As shown,

[0023] A stepped water bath for electroplating includes a water bath body 1. A copper guide rail 2 is installed inside the water bath body 1, with the length direction of the copper guide rail 2 parallel to the length direction of the water bath body 1. A water bath liquid inlet pipe 3 is fixedly connected to the side of the water bath body 1. There are several copper guide rails 2 arranged in a stepped manner, with the copper guide rail 2 closest to the water bath liquid inlet pipe 3 having the highest height. Filler blocks 9 are fixedly connected to or integrally formed between the copper guide rails 2 to prevent water bath liquid from accumulating between them.

[0024] In this embodiment, a low-level solution collection chamber 4 is formed between the copper guide rail on the side away from the water bath liquid inlet pipe 3 and the water bath tank body 1, and a circulation outlet 8 is provided on the low-level solution collection chamber 4.

[0025] In this embodiment, the circulation outlet 8 is located on the water bath tank body 1 and is located on the side away from the water bath liquid inlet pipe 3.

[0026] In this embodiment, a support platform 7 is fixedly connected to the lower part of the water bath body 1, and the support platform 7 is set on the ground.

[0027] In this embodiment, an electroplating walking frame 5 is provided above the water bath body 1. Two conductive brushes 6 are fixedly connected to the bottom of the electroplating walking frame 5, and the bottom surfaces of the two conductive brushes 6 abut against two of the copper guide rails 2 respectively.

[0028] The copper guide rail of this invention adopts a novel stepped layout; the water bath liquid flows from the highest point to the lowest point to the collection point, and is then recirculated back to the highest point by the pump body, thus repeatedly circulating and improving the utilization rate of the water bath liquid; the contact pad between the conductive brush and the copper guide rail is submerged below the water bath liquid; in order to meet the requirements of the stepped water bath conductivity for electroplating, the conductive brush is prevented from generating sparks during movement, which can ensure safe production.

[0029] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A stepped water bath for electroplating, comprising a water bath body, a copper guide rail is arranged inside the water bath body, the length direction of the copper guide rail and the length direction of the water bath body are kept parallel, characterized in that: The side of the water bath body is fixedly connected with a water bath liquid inlet pipe; the copper guide rails are in the form of a plurality of steps, and the copper guide rail on the side close to the water bath liquid inlet pipe is the highest; the copper guide rails are fixedly connected or integrally formed with filling blocks; The copper guide rail on the side away from the water bath liquid inlet pipe and the water bath body form a low-position solution collecting cavity, and a circulating outlet is formed on the upper side of the low-position solution collecting cavity.

2. The stepped water bath for electroplating according to claim 1, wherein: The circulating outlet is formed on the water bath body and located on the side away from the water bath liquid inlet pipe.

3. The stepped water bath for electroplating according to claim 1, wherein: The lower part of the water bath body is fixedly connected with a bearing table, and the bearing table is arranged on the ground.

4. The stepped water bath for electroplating according to claim 1, wherein: An electroplating walking frame is arranged above the water bath body, two conductive brushes are fixedly connected to the bottom of the electroplating walking frame, and the bottom surfaces of the two conductive brushes are respectively in abutment with two copper guide rails.

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