Devices, systems, and methods for recording brain structures

Abstract

According to an aspect of the disclosure, a method of manufacturing a portion of a probing device is provided. The method includes forming a plurality of cables on a wafer. A length of each cable of the plurality of cables is greater than any dimension of the wafer. The method further includes cutting through a flexible portion of the wafer to separate the plurality of cables from the wafer.

Description

Atorney Docket No.: 00406-0003-00304DEVICES, SYSTEMS, AND METHODS FOR RECORDING BRAIN STRUCTURESCROSS-REFERENCE TO RELATED APPLICATIONS |0001] This application claims the benefit of priority to U. S. Provisional Application No.63 / 762,356, filed February 24, 2025, which is hereby incorporated by reference in its entirety.FIELD OF INVENTION

[0002] The present disclosure relates to neural recording devices and systems, and more particularly to electrode arrays integrated on substrates for recordings in deep brain structures.BACKGROUND|0003] Deep brain stimulation (DBS) and neural recording procedures require precise electrode placement within target brain structures. Existing electrode technologies face challenges in achieving high-density recordings from deep bram regions while minimizing tissue damage during insertion. Additionally, stereoelectroencephalography (sEEG) procedures for epilepsy monitoring would benefit from electrodes capable of both macrolevel and micro-level recordings. The background description provided herein is for the purpose of generally presenting the context of the disclosure. Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to be prior art, or suggestions of the prior art, by inclusion in this section,SUMMARY

[0004] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. Uris summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0005] According to an aspect of the disclosure, a method of manufacturing a portion of a probing device is provided. The method includes forming a plurality of cables on a wafer. A length of each cable of the plurality of cables is greater than any dimension of the wafer. The method further includes cutting through a flexible portion of the wafer to separate the plurality of cables from the wafer,

[0006] Each of the aspects disclosed herein may have any of tire following features, alone or in any combination. Prior to cuting through tire flexible portion of the wafer, the plurality of cables may each have a first straight portion, a second straight portion, and aAtorney Docket No.: 00406-0003-00304bulbous portion therebetween. A diameter of the bulbous portion may be greater than a distance between the first straight portion and the second straight portion. A proximal end of a first bulbous portion of a first cable of the plurality of cables may be adjacent to a distal end of a second bulbous portion of a second cable of the plurality of cables. The method may further include positioning a substrate in a trench on a backside of the wafer and bonding the substrate to a cable of the plurality' of cables before separating the cable from the wafer. The method may further include etching the trench on the substrate. At least two of the plurality of cables may be stacked on top of one another prior to cuting through the flexible portion of the wafer.|0007] According to another aspect of the disclosure, a probing device is provided. Tire probing device includes a casing. A cable extends from the casing. A substrate has a plurality of recording channels. A chip is disposed between the cable and the substrate. The chip is configured for mating to a micro-drive.

[0008] Each of the aspects disclosed herein may have any of the following features, alone or in any combination. Tire chip may be further configured to align the cable and the substrate. Tire cable may be a first cable, and the device may further include a second cable configured to connect to the chip. The substrate may be wrapped with the plurality of recording channels. The plurality of recording channels may extend proximally and distally along the substrate in a hybrid mapping configuration. Tire substrate may be configured for insertion into brain tissue. The casing may include a first portion and a second portion, and the second portion may include a feature configured to couple the casing to a jig. At least two PCBs may be disposed within the casing, and the at least two PCBs may be in a stacked configuration. The at least two PCBs may share a single shank.

[0009] According to another aspect of the disclosure, a probing device is provided. The probing device includes a stage having a central opening, a top surface, and a bottom surface. A first recording tower extends from the top surface. At least one printed circuit board is fixed to a side surface of the first recording tower. A plurality of testing probes extends from the at least one printed circuit board and through the central opening. Each of the plurality of testing probes is configured for insertion into brain tissue.

[0010] Each of the aspects disclosed herein may have any of the following features, alone or in any combination. The device may further include a second recording tower extending from the top surface. The second recording tower may include at least one printedAtorney Docket No.: 00406-0003-00304circuit board fixed to a side surface of the second recording tower. A second plurality of testing probes may extend from the at least one printed circuit board of the second recording tower and through the central opening. Each of the second plurality of testing probes may be configured for insertion into brain tissue. The first recording tower and the second recording tower may be disposed on opposite sides of the stage. The device may further include a third recording tower extending from the top surface. The third recording tower may include at least one printed circuit board fixed to a side surface of the third recording tower. A third plurality of testing probes may extend from the at least one printed circuit board of the third recording tower and through the central opening. Each of the third plurality of testing probes may be configured for insertion into brain tissue.

[0011] The foregoing general description of the illustrative embodiments and the following detailed description thereof are merely exemplary’ aspects of the teachings of this disclosure and are not restrictive.BRIEF DESCRIPTION OF FIGURES

[0012] Hie accompanying drawings, which are incorporated in and constitute a part of this application, illustrate exemplary' aspects of this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0013] FIGS. 1A-1B illustrates a perspective view' of an array.

[0014] FIG, 2 illustrates a perspective view of a shank.

[0015] FIGS. 3A-3B illustrate aspects of a substrate.

[0016] FIGS. 4A-4b illustrate aspects of substrates.

[0017] FIGS. 5A-5B illustrate other aspects of substrates.

[0018] FIG. 6 illustrates substrate with contacts.

[0019] FIG. 7 illustrates a cable.

[0020] FIG. 8 illustrates a shank and a substrate.

[0021] FIGS. 9A-9B illustrate aspects of substrates and contact arrangements.

[0022] FIGS. 10A-10C illustrate a reinforcement rod.

[0023] FIG. 11A illustrates a shank assembly.

[0024] FIGS. 1 IB-11C illustrate aspects of a PCB assembly.

[0025] FIGS. 12A-12B illustrate aspects of a casing.

[0026] FIGS. 13A-13B illustrate aspects of a PCB assembly.

[0027] FIGS. 14A-14B illustrate aspects of another PCB assembly.

[0028] FIG. 15 illustrates shanks with contact configurations.Atorney Docket No.: 00406-0003-00304

[0029] FIGS. 16A-16B illustrate a PCB assembly.

[0030] FIGS. 17A-17B illustrates a PCB assembly.

[0031] FIGS. 18-19 illustrate deposition configurations.

[0032] FIGS. 20-21 illustrate ASIC and cable configurations

[0033] FIGS. 22-24 illustrate arrays.

[0034] FIG. 25 illustrates a deep array with connectors.

[0035] FIG. 26 illustrates another array.

[0036] FIG. 27 illustrates a view of an array with contacts and a PCB.

[0037] FIG. 28 illustrates alternative arrays.

[0038] FIG. 29 illustrates a setup fortesting an array.

[0039] FIG. 30 illustrates a setup incorporating an array.

[0040] FIG. 31 illustrates a setup configured for recording operations.

[0041] FIG, 32 illustrates an array with a strain relief.

[0042] FIGS. 33A-33C illustrate an array with multiple probes.

[0043] FIG. 34 illustrates an array with a probe and cable.

[0044] FIG. 35 illustrates an array.

[0045] FIGS. 36-37 illustrate arrays with flexible portions.

[0046] FIGS. 38-40 illustrate recording setups.

[0047] FIG. 41 illustrates an array with an optical fiber.

[0048] FIGS, 42A-43 illustrate aspects of a guide tube.

[0049] FIG. 44 illustrates a jig and guide tube assembly.

[0050] FIG. 45 illustrates an array with a protective cover.

[0051] FIGS. 46A-46B illustrates another array.

[0052] FIGS. 47-48 illustrate another array.

[0053] FIG. 49 illustrates another array.

[0054] FIG. 50 illustrates a probe assembly.

[0055] FIG, 51 illustrates a probe and a cannula.

[0056] FIG. 52 illustrates a probe assembly.

[0057] FIG. 53 illustrates a cannula assembly.

[0058] FIG. 54 illustrates another array.

[0059] FIGS. 55A-55C illustrates aspects of a guide.

[0060] FIG. 56 illustrates another guide.

[0061] FIGS. 57A-57C illustrates a further guide.

[0062] FIG. 58 is a diagram illustrating anatomical relationships of brain structures.Atorney Docket No.: 00406-0003-00304

[0063] FIG. 59 depicts recording spans.

[0064] FIG. 60 illustrates shanks with recording span configurations.

[0065] FIG. 61 depicts a setup for targeting a subthalamic nucleus.

[0066] FIG. 62 illustrates another array.

[0067] FIG. 64-65 illustrate another array.

[0068] FIG, 65 illustrates a skirt assembly.

[0069] FIGS. 66A-66C illustrate a probe assembly.

[0070] FIGS. 67A-67B illustrate another array.

[0071] FIGS. 68A-68B illustrate another array.

[0072] FIG. 68C-68D illustrate aspects of a substrate.

[0073] FIG. 69A-69B illustrate aspects of a cable with recording sites.

[0074] FIG. 70A-70B illustrate another cable.

[0075] FIGS, 71A-71B illustrate deep arrays in pass-through configurations, according to an embodiment.

[0076] FIG. 72A72D illustrate aspects of a stylet.

[0077] FIG. 73 illustrate an array with a bent configuration.

[0078] FIGS. 74A-74B illustrate a manufacturing configurations with flex cables on a wafer.

[0079] FIG. 75 illustrates a flex cable connected to a substrate.

[0080] FIGS, 76A-77 illustrate exemplary fabrication paths,

[0081] FIG. 78 illustrates an array with a tearaway portion.

[0082] FIG. 79 illustrates a perspective view of a wafer with trenches.DETAILED DESCRIP TION

[0083] Tire following description sets forth exemplary’ aspects of the present disclosure. It should be recognized, however, that such description is not intended as a limitation on the scope of the present disclosure. Rather, the description also encompasses combinations and modifications to those exemplary’ aspects described herein.

[0084] Particular aspects of the disclosure are described in greater detail below. The terms and definitions provided herein control, if in conflict with terms or definitions incorporated by reference. Wherever possible, the same or similar reference numbers wall be used through the draw ings to refer to the same or like parts. Where feasible, reference numbers ending in the same tens and ones digits refer to corresponding components.

[0085] As used herein, the terms ‘■comprises,” “comprising,” “including,” “includes,” “having,” “has,” or any other variation thereof, are intended to cover a non-exclusiveAtorney Docket No.: 00406-0003-00304inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Tire term ‘'exemplary'” is used in the sense of “example,” rather than “ideal.” The term “or” is used disjunctively, such that “at least one of A or B” includes, (A), (B), (A and A), (A and B), etc. The term “or” includes “and / or,” Relative terms such as “about,” “substantially,” and “approximately,” etc,, are used to indicate a possible variation of ±10% of the stated numeric value or range. Tire term "diameter" includes a width of a non-circular element, unless otherw ise specified. The term "circumference" or "circumferential" refers to the perimeter of a non-circular element, unless otherwise specified.|0086] The following description sets forth exemplary aspects of this disclosure. It should be recognized, however, that such description is not intended as a limitation on the scope of this disclosure. Rather, the description also encompasses combinations and modifications to those exemplary' aspects described herein.

[0087] The present disclosure describes deep array devices and systems for neural recording applications, lire deep array devices include microfabricated electrodes integrated on substrates configured for recording in deep brain structures. Various embodiments describe electrode configurations with cables, substrates, contacts, and recording spans arranged for interfacing with neural tissue. The disclosure further describes manufacturing methods for flexible substrates, including techniques for maximizing wafer real estate through cut path configurations such as U-turns, zig-zags, winding, spiraling, mirroring, and stacking. Additional embodiments describe hybrid stereoelectroencephalography (sEEG) configurations combining macro and micro recording sites, pass-through configurations for introducing microelectrode recordings into sEEG procedures, and integration with microdialysis and optical stimulation modalities. Recording setups, guide tubes, stylets, and associated assembly components are also described for positioning and deploying the deep array devices during surgical procedures.

[0088] The deep array devices and systems described herein may be used in vivo for neural recording applications in living subjects. Additionally, the deep array devices may be used ex vivo for probing organoids, brain slices, or other tissue preparations outside of a living organism. The configurations and recording capabilities of the deep array devices enable interfacing with neural tissue in both in vivo and ex vivo contexts, providing flexibility for research applications across different experimental paradigms.Atorney Docket No.: 00406-0003-00304

[0089] Referring to FIGS. 1A-1B, a deep array 100 is shown. Deep array 100 includes a first portion 102, a second portion 104, a casing 106, a sheathed shank 108, an exposed shank 110, a reinforcement rod 112, a port 114, and a switch 116. Deep array 100 may be configured as a microfabricated electrode integrated on a substrate for single-unit recordings in deep brain structures.

[0090] Casing 106 is positioned at first portion 102 and may house internal components of deep array 100. Casing 106 may be made from 3D printed materials, injection molding, milling, or other manufacturing modalities. In some cases, casing 106 may be integrated with a wire mesh or formed from materials that enable casing 106 to serve as a faraday shield protecting sensitive electronics from EMF noise. Casing 106 may include a conical portion filled with epoxy that secures a probe shank to a PCB and increases rigidity of reinforcement rod 112 at a PCB interface.

[0091] With continued reference to FIGS. 1A-1B, sheathed shank 108 extends from casing 106 and transitions into exposed shank 110 at second portion 104. Reinforcement rod 112 is coupled to casing 106 and extends along a portion of sheathed shank 108, providing structural support to deep array 100. As shown in FIG. IB, port 114 and switch 116 are positioned on casing 106, Port 114 provides a connection interface on casing 106, while switch 116 enables user control of deep array 100. Exposed shank 110 extends distally from sheathed shank 108 and terminates at a distal end of deep array 100.

[0092] Referring to FIG, 2, a shank 210 is shown. Shank 210 includes a cable 218, a substrate 220, a distal tip 222, and contacts 224. Substrate 220 extends along the length of shank 210 and terminates at distal tip 222, which is positioned at one end of the structure. Cable 218 is connected to substrate 220 and extends from shank 210, providing a pathway for signal transmission.

[0093] Contacts 224 are arranged along substrate 220, forming a linear array that extends toward distal tip 222. Contacts 224 may be configured to interface with tissue or other target structures for recording or stimulation purposes. Tire elongated configuration of shank 210 may facilitate insertion into target regions, with contacts 224 positioned to enable signal acquisition along the length of substrate 220.

[0094] With continued reference to FIG. 2, substrate 220 may be comprised of stainless steel. In some cases, substrate 220 may be comprised of tungsten, glass, optical fibers, cannulas, stereoelectroencephalography (sEEG) electrodes, or micro-dialysis needles as alternative materials to stainless steel. Substrate 220 may have a diameter larger than 200um, such as 1.2mm outer diameter (OD) or greater when bonding to a cannula or sEEG electrode.Atorney Docket No.: 00406-0003-00304In some cases, substrate 220 may have a diameter smaller than 200um, such as lOOum, for chronic recordings to minimize tissue damage and prolong the life of the recording.

[0095] Referring to FIGS. 3A-3B, a substrate 320 with a distal tip 322 is shown. FIG. 3A illustrates a side view of substrate 320 extending along a longitudinal axis and tapering toward distal tip 322. Substrate 320 includes dimensional annotations including a first length XI measured along a portion of substrate 320, a second length X2 measured along another portion of substrate 320, and a taper T1 indicating a tapering region where substrate 320 narrows toward distal tip 322.

[0096] FIG. 3B illustrates a close-up view of distal tip 322 of substrate 320. Distal tip 322 includes a radius Rl indicating curvature at a terminal end of substrate 320. Substrate 320 exhibits a gradual taper that terminates at distal tip 322, with radius Rl defining a rounded geometry of the tip. In some cases, distal tip 322 may have a taper profile of approximately 4 degrees tapering down to a lOum tip radius over a 1mm length. Such a taper profile may facilitate penetrating the dura without damaging the probe. In some cases, distal tip 322 may have a semi-spherical profile with 100pm radius for medical device or human research applications. A semi-spherical profile may minimize risks of hemorrhage and fracture.

[0097] Referring to FIGS. 4A-4B, two substrate configurations for deep array 100 are shown. FIG. 4A shows a substrate 420 having an elongated, tapered profile that terminates at a distal tip 422. Distal tip 422 is positioned at a pointed end of substrate 420 and features a sharp, needle-like geometry / suitable for insertion into tissue. Substrate 420 extends from distal tip 422 with a gradually widening profile along its length.

[0098] With continued reference to FIGS. 4A-4B, FIG. 4B shows a substrate 520 that also includes an elongated profile terminating at a distal tip 522. Distal tip 522 in FIG, 4B exhibits a curled geometry' at its terminal end, demonstrating the effect of non-optimized tip geometry. The curled configuration of distal tip 522 illustrates what may occur when a probe tip is too sharp and conies into contact with an inner wall of a guide tube during in sertion. The probe should be sharp enough to enter the brain easily, but blunt enough so as to not curl if coming into contact with the inner wall of the guide tube. Optimizing tip geometry involves balancing sharpness fortissue penetration against sufficient bluntness to prevent curling during insertion through guide tubes. Both substrate 420 and substrate 520 demonstrate thin, flat profiles designed for minimally invasive insertion. Referring to FIGS. 5A-5B, substrates with associated cables and tapers are shown. FIG. 5A illustrates a substrate 620 with an associated cable 622. Substrate 620 is an elongated component that extends from cable 622.Atorney Docket No.: 00406-0003-00304A taper 626 is formed at a distal end of substrate 620, providing a gradual reduction in width toward a tip. Taper 626 transitions substrate 620 from a main body width to a narrower point.

[0099] FIG. 5B illustrates a substrate 720 with an associated cable 722. Substrate 720 extends from cable 722. A taper 726 is positioned at a distal end of substrate 720. Taper 726 in FIG. 5B exhibits a different geometry compared to taper 626 shown in FIG. 5A, demonstrating an alternative tapering configuration for the substrate. Substrates 620 and 720 shown in FIGS. 5 A and 5B respectively illustrate different distal tip designs that may be employed in deep array configurations.

[0100] In some cases, where an end of a micro-fabricated flex falls relative to a beginning of a taper may affect delamination susceptibility. If a start of the flex falls past a start of the taper, a resulting geometry may be more susceptible to delamination upon insertion. Aligning the flex so that the flex falls before the start of the taper may allow for application of an epoxy ramp. The epoxy ramp may be applied at a transition from substrate to flex to prevent delamination and smooth the transition, thereby reducing tissue damage.

[0101] Referring to FIG. 6, a substrate 820 with a distal tip 822 and contacts 824 is shown. Substrate 820 forms an elongated structure that extends horizontally. At one end of substrate 820, distal tip 822 is positioned, featuring a rounded or curved profile that tapers from a main body of substrate 820. Along an upper edge of substrate 820, a series of contacts 824 are arranged in a linear configuration. Contacts 824 appear as circular or oval-shaped elements spaced at regular intervals along the length of substrate 820. Tire arrangement of contacts 824 along substrate 820 facilitates electrical connectivity for recording or sensing applications.

[0102] With continued reference to FIG. 6, contacts 824 may be formed from biocompatible conductive materials. In some cases, contacts 824 may be formed from platinum (Pt), platinum / iridium (Pt / Ir), iridium (Ir), iridium oxide (IrOx), titanium nitride (TiN), or tungsten (W). Contacts 824 may be formed with precisely deposited gold and then electroplated with PEDOT-PSS, Contacts 824 may have any geometry including square, circle, hexagon, or triangle shapes.

[0103] Referring to FIG. 7, a cable 918 associated with deep array 100 is shown. Cable 918 includes a recording span 928 that defines a portion of cable 918 where electrical activity can be detected. Cable 918 features a plurality of contacts 924 arranged in rows along recording span 928. Contacts 924 are positioned to interface with neural tissue for recording electrical signals. Interconnect lines 930 extend along the length of cable 918 and provide electrical pathways connecting contacts 924 to processing circuitry. Interconnect lines 930Atorney Docket No.: 00406-0003-00304are shown as parallel lines running through cable 918. The arrangement of contacts 924 in multiple rows allows for increased recording density within recording span 928, enabling detection of neural activity from multiple locations simultaneously.|0104] With continued reference to FIG. 7, recording span 928 may be customized to match user needs by adjusting vertical and horizontal pitch between micro-contacts. Such custom configurations may include single column, dual column, grid, or radially distributed channels. In some cases, recording span 928 may be precisely engineered to match user requirements for length and channel-to-channel pitch. Interconnect lines 930 may run the length of cable 918 from recording span 928 to a backend, where interconnect lines 930 may map to an ASIC chip for analog-to-digital signal conversion or to PCB bond pads for analog signal output through a passive connector.

[0105] Referring to FIG. 8, a sequence showing assembly of a shank 1010 with a substrate 1020 is shown. On a left side of FIG, 8, shank 1010 is shown positioned above substrate 1020, -with a cable 1018 extending from shank 1010. Substrate 1020 is depicted as a circular element. Arrows indicate a direction of movement as shank 1010 is brought toward substrate 1020. On a right side of FIG. 8, an assembled configuration is shown where shank 1010 with cable 1018 has been coupled to substrate 1020. Substrate 1020 appears as a circular structure with cable 1018 positioned along an upper portion of substrate 1020. A break 1032 is indicated at a lower portion of the assembled structure, showing a discontinuity or separation point in the configuration,

[0106] With continued reference to FIG. 8, cable 1018, which may be a thin, flat rectangle, may be bonded to substrate 1020 by wrapping cable 1018 around a circumference of substrate 1020. Cable 1018 may be designed to match the circumference of substrate 1020 so that all surfaces are covered. The wrapping process may use a heat-curing epoxy applied to substrate 1020 via brush, dip coating, or spray coating. In some cases, the wrapping process may use a UV curing epoxy instead of heat-curing epoxy.

[0107] The wrapping process may use heat shrink tubing placed over a distal end of substrate 1020 and cable 1018, then run through a hot gun to compress and cure cable 1018 around the circumference of substrate 1020. A wrapping jig may include a glass slide or thermally conductive material with micro features including a recess for precise positioning, a conical recess matching a diameter of substrate 1020, or micro-holes for vacuum. In some cases, the wuapping process may use vacuum applied through micro-holes to pull substrate 1020 down into contact with cable 1018 or to remove overflowing epoxy. In some cases, theAtorney Docket No.: 00406-0003-00304wrapping process may use positive pressure to blow cable 1018 against substrate 1020 and aid in wrapping.

[0108] The wrapping may be performed vertically using a jig configured such that wrapping is assisted by gravity. Cable 1018 may include an eyelet at a distal end which may¬ be gripped by graspers to pull cable 1018 straight and taut relative to substrate 1020 during wrapping. In some cases, cable 1018 may be attached to substrate 1020 through folding, bending, or rolling rather than wrapping.

[0109] Referring to FIG. 9A, multiple substrates arranged in a side-by-side configuration showing various contact arrangements are shown. FIG. 9A depicts a substrate 1120', a substrate 1120", a substrate 1120'", a substrate 1120"", and a substrate 1120, each having a distinct pattern of contacts distributed along their lengths. Substrate 1120' includes contacts 1124' arranged in a sparse vertical pattern. Substrate 1120" features contacts 1124" arranged in a denser configuration with multiple columns. Substrate 1120'" displays contacts 1124'" in a similar multi-column arrangement. Substrate 1120"" shows contacts 1124"" positioned in a pattern that varies along the length of substrate 1120"". Substrate 1120 includes contacts 1124"'" arranged in a curved or offset pattern along its length. The substrates demonstrate different contact density and distribution options for recording or stimulation purposes.

[0110] With continued reference to FIG. 9A, recording span 928 may be customized to match user needs by adjusting vertical and horizontal pitch between micro-contacts. Such custom configurations may include single column, dual column, grid, or radially distributed channels. Substrate 1120' demonstrates a single column configuration where contacts 1124' extend proximally and distally along substrate 1120'. Substrates 1120" and 1120'" demonstrate dual column configurations where contacts 1124" and contacts 1124'" are arranged in multiple columns. Substrate 1120"" demonstrates a grid configuration where contacts 1124"" are distributed in a pattern that varies along the length of substrate 1120"". Substrate 1120 demonstrates a hybrid mapping configuration where contacts 1124 are arranged in a curved or offset pattern.

[0111] Referring to FIG. 9B, a cross-sectional view- showing an arrangement of substrates and contacts in a stacked or layered configuration is shown. The cross-sectional view depicts substrate 1120' with contacts 1124' positioned around a circumference of substrate 1120', substrate 1120" w ith contacts 1124" arranged around a perimeter of substrate 1120", and substrate 1120'" with contacts 1124"' distributed around an outer surface of substrate 1120'". Tlie circular cross-sections reveal how the substrates and their respective contacts are positioned relative to one another, with contacts 1124', contacts 1124", andAtorney Docket No.: 00406-0003-00304contacts 1124"' shown as dashed or solid circular outlines indicating their placement on respective substrates 1120', 1120", and 1120"'. In some cases, contacts 1124', contacts 1124", and contacts 1124'" may be distributed along the circumference of their respective substrates to provide radially distributed channels for recording from multiple directions simultaneously.

[0112] Referring to FIGS. 10A-I0C, a reinforcement rod 1212 is shown, FIG, 10A illustrates a side view of reinforcement rod 1212. Reinforcement rod 1212 is an elongated component featuring a cutout 1234 and a channel 1236. Cutout 1234 is positioned along a length of reinforcement rod 12.12, while channel 1236 extends from one end of reinforcement rod 1212 toward cutout 1234. Channel 1236 appears as a recessed portion along an upper surface of reinforcement rod 1212.

[0113] FIG. 10B illustrates a top view of reinforcement rod 1212. In this view, an overall length L I of reinforcement rod 1212 is indicated, along with a length L2 that corresponds to a portion of reinforcement rod 1212 extending from cutout 1234 to one end. Cutout 1234 is visible as a notched feature along reinforcement rod 1212. Reinforcement rod 1212 provides structural support, and cutout 1234 and channel 1236 may facilitate integration with other components of the assembly,

[0114] With continued reference to FIGS. 10A-10C, reinforcement rod 1212 may be a thin-walled 20G stainless steel hypodermic tube with a wire-EDM bevel running half the length of the rod. In some cases, reinforcement rod 1212 may protrude 10mm from an end of a PCB case. Channel 1236 may be formed by cutting reinforcement rod 1212 to create a mating feature for securing reinforcement rod 1212 to a PCB. Channel 1236 may be configured to grant access to a substrate running through a center of reinforcement rod 1212, allowing simultaneous coupling of reinforcement rod 1212 and the substrate to a bond pad on the PCB for grounding the assembly.

[0115] Referring to FIG. 10C, a side view of reinforcement rod 1212 is shown.Reinforcement rod 1212 is an elongated cylindrical component that extends horizontally across the view. Reinforcement rod 1212 includes channel 1236 formed along a portion of its length. Channel 1236 appears as a recessed section within a body of reinforcement rod 1212. Cutout 1234 is positioned at one end of channel 1236, providing a transition point along reinforcement rod 1212, An angle 1240 is indicated by dashed lines extending from cutout 1234, showing an angular relationship of cutout 1234 relative to a longitudinal axis of reinforcement rod 1212.Atorney Docket No.: 00406-0003-00304

[0116] With continued reference to FIG. 10C. a half-moon bevel formed by cutout 1234 may be positioned 2-3mm off an edge of the PCB so that a micro-fabricated flexible cable can be routed to a top half of the PCB without damage. Since the flexible cable may be prone to mechanical damage due to abrasion, edges of reinforcement rod 1212 may be smooth, containing no burrs or sharp edges. A flaring pin may be used to gently increase a diameter of an opening of reinforcement rod 1212 to allow the flexible cable to exit from this point without risk of contact with walls or edges. Reinforcement rod 1212 provides structural support, and channel 1236 and cutout 1234 may facilitate attachment or routing of other components within the assembly. In some cases, reinforcement rod 1212 may be electrically coupled to a sheath and a substrate through laser welding, silver epoxy, or forced mechanical contacts such as crimping to provide grounding for the assembly.

[0117] Referring to FIG. 11A, a side view of a shank assembly is shown. The assembly includes a PCB 1338 positioned at a proximal end, which connects to a reinforcement rod 1312. Reinforcement rod 1312 extends along the length of the assembly and provides structural support. A cable 1318 is shown connecting to reinforcement rod 1312, transitioning from a thicker proximal section to a thinner distal section. A substrate 1320 extends distally from cable 1318, forming an elongated portion that tapers toward a distal tip. The configuration shows how PCB 1338, reinforcement rod 1312, cable 1318, and substrate 1320 are arranged in a linear fashion, with the components decreasing in cross-sectional dimension from the proximal end toward the distal end of the assembly.

[0118] With continued reference to FIG. 11A, PCB 1338 may serve as a platform for electronic components and may provide electrical connections between cable 1318 and external systems. Reinforcement rod 1312 may extend from PCB 1338 along a portion of the assembly to increase rigidity and provide mechanical stability during insertion procedures. Cable 1318 may provide electrical pathways for signal transmission between substrate 1320 and PCB 1338. Substrate 1320 may include recording channels positioned along its length for interfacing with neural tissue.

[0119] Referring to FIGS. 1 IB and 11 C, isometric views of a PCB 1438 assembly from different angles are shown. In FIG. 1 IB, PCB 1438 is shown with a connector mounted on its surface, featuring multiple pins extending from a connector housing. PCB 1438 includes various circuit traces and mounting holes visible on its surface. A reinforcement rod 1412 is positioned adjacent to PCB 1438, and a cable 1418 extends from the assembly, providing electrical connectivity to other components.Atorney Docket No.: 00406-0003-00304

[0120] FIG. 11C presents an alternative isometric view of PCB 1438 assembly, showing an opposite side and revealing additional structural details including connector orientation and the relationship between reinforcement rod 1412 and PCB 1438. Reinforcement rod 1412 provides structural support to the assembly, while cable 1418 facilitates signal and power transmission between PCB 1438 and external components.

[0121] With continued reference to FIGS. 11B and 11C, reinforcement rod 1412 may be bonded to a bond pad on a botom of PCB 1438. PCB 1438 may serve to ground the assembly. In some cases, sheathed shank 108 may be tied to ground by electrically coupling sheathed shank 108 to reinforcement rod 1412. lire electrical coupling between sheathed shank 108 and reinforcement rod 1412 may be achieved through laser welding, silver epoxy, or forced mechanical contacts such as crimping. Grounding sheathed shank 108 through reinforcement rod 1412 may prevent sheathed shank 108 from acting as a floating antenna and distorting signal quality from contacts positioned on the substrate. Cable 1418 may be routed outside of reinforcement rod 1412 to a top of PCB 1438 where cable 1418 bonds to ASICs for signal processing.

[0122] Referring to FIG. 12A, an exploded view of a casing assembly for deep array 100 is shown. Tire assembly includes a first casing portion 1406A, PCB 1438, and a second casing portion 1406B. First casing portion 1406A is positioned at a top of the assembly and features a rectangular box-like structure with a curved indentation on an upper surface. PCB 1438 is positioned in a middle of the assembly and includes various electronic components, connection points, and circuitry visible on a surface of PCB 1438. The cable extends from one side of PCB 1438.

[0123] Second casing portion 1406B is positioned at a bottom of the assembly and has a complementary rectangular box-like structure with a recessed area on an upper surface designed to receive and support PCB 1438. Second casing portion 1406B also features a curved indentation similar to first casing portion 1406A. When assembled, first casing portion 1406A and second casing portion 1406B enclose PCB 1438, providing protection and structural support for electronic components contained within deep array 100.

[0124] With continued reference to FIG. 12A, first casing portion 1406A and second casing portion 1406B may be configured to snap shut around PCB 1438. Prior to assembly inside the casing, PCB 1438 may be encapsulated in a medical grade epoxy. A bonding agent may be used to seal first casing portion 1406 A and second casing portion 1406B shut after assembly. The casing may serve to protect PCB 1438 and sensitive electronics from environmental conditions and may shield electrical architecture of deep array 100.Atorney Docket No.: 00406-0003-00304

[0125] The casing may be made from 3D printed materials or through injection molding, milling, or other manufacturing modalities. In some cases, a tool may be used so that custom casing geometry could be over-molded or potted directly onto a backend of deep array 100. The casing may also be integrated with a wire mesh, or formed from other materials, that enable the casing to serve as a faraday shield protecting sensitive electronics on PCB 1438 from EMF noise.

[0126] Referring to FIG. 12B, an isometric view of a casing portion 1506B of a deep array assembly is shown. Casing portion 1506B is a housing component that forms part of an enclosure for internal components of deep array 100. Casing portion 1506B has a generally rectangular body with chamfered edges and a recessed central region. A feature 1540 is positioned on an upper surface of casing portion 1506B, appearing as a raised channel or rail structure that extends across a top of casing portion 1506B. Feature 1540 may serve as a guide or alignment mechanism for mating with corresponding components.

[0127] With continued reference to FIG. 12B, casing portion 1506B also includes a protruding element on one side that may function as a latch or connection point. The design of casing portion 1506B allows casing portion 1506B to interface with a corresponding first casing portion to form a complete enclosure for housing internal electronics and providing structural protection for the deep array assembly. Feature 1540 may be configured as a dovetail feature for sliding into a custom jig. In some cases, additional features may be formed on casing portion 1506B to meet user needs for mating and mounting to surgical drives or shipping containers. The casing may serve as a reliable reference geometry for mating and mounting to surgical drives or shipping containers.

[0128] Referring to FIGS. 13A-13B, perspective views of a PCB Assembly 1642 in two different configurations are shown. In FIG. 13A, PCB Assembly 1642 includes a data and power transmission module 1644 positioned at one end. A thin-flex 1646 extends from data and power transmission module 1644 and connects to ASICs 1648, which are mounted on a PCB 1638. PCB 1638 provides a platform for electronic components. A cable 1618 extends from the assembly, and a reinforcement rod 1612 runs alongside cable 1618 to provide structural support.

[0129] FIG. 13B shows another view of PCB Assembly 1642 with additional components visible. PCB 1638 is shown with bond pads 1650 positioned on a surface of PCB 1638. A referencing substrate 1652 is connected to PCB 1638 and extends outward from the assembly. A toggle switch 1654 is positioned on PCB 1638, providing a mechanism for user control or mode selection. Cable 1618 and reinforcement rod 1612 extend from the assemblyAtorney Docket No.: 00406-0003-00304in a similar manner to FIG. 13A. The arrangement of components in both figures demonstrates integration of electronic elements within PCB Assembly 1642, with reinforcement rod 1612 providing mechanical stability to cable 1618 portion of the assembly.

[0130] With continued reference to FIGS. 13A-13B, PCB 1638 may include integrated CMOS or LVDS chips for data amplification, analog-to-digital conversion, and multiplexing. ASICs 1648 may be configured to convert analog signals from micro-contacts into digital outputs. In some cases, thin-flex 1646 may be bonded directly to ASICs 1648 without routing through an interposer. Data and power transmission module 1644 may provide a 12-pin SPI connector for data and power transmission between PCB Assembly 1642 and external systems.

[0131] Toggle switch 1654 may be configured for switching between various referencing modes. In some cases, toggle switch 1654 may enable switching between referencing substrate 1652 and short ref-to-gnd modes. Bond pads 1650 may provide electrical and mechanical connections to a shank and may support alignment of components within PCB Assembly 1642. Bond pads 1650 may be located at a center of PCB 1638 or along an edge of PCB 1638. In some cases, edge connecting may be utilized to optimize a number of probes that may enter a single recording setup,

[0132] As further shown in FIGS. 13A-13B, PCB 1638 may include an additional connector for external leads or auxiliary signal inputs. In some cases, the additional connector may accommodate EEG, ECOG, or other auxiliary inputs. Several channels of ASICs 1648 may be shorted to the external connector to enable auxiliary signal acquisition. Referencing substrate 1652 may be shorted to a recording channel through a similar procedure. Cable 1618 may include flying leads for ref / gnd and auxiliary inputs extending from PCB Assembly 1642,

[0133] Referring to FIGS. 14A and 14B, isometric views of a PCB Assembly 1742 are shown. In FIG. 14A, PCB Assembly 1742 includes a PCB 1738 and a connector 1756. PCB 1738 serves as abase component that supports electrical connections and circuitry’. Connector 1756 is mounted on PCB 1738 and provides an interface for establishing electrical connections with other components or assemblies.

[0134] FIG. 14B illustrates another isometric view of PCB Assembly 1742 from a different angle. In this view, PCB Assembly 1742 includes PCB 1738, a referencing substrate 1752, and leads 1758. Referencing substrate 1752 is positioned on PCB 1738 and provides a reference point or additional functionality for the assembly. Leads 1758 extend from PCB 1738 and provide electrical connections for transmitting signals or power to and from PCBAtorney Docket No.: 00406-0003-00304Assembly 1742. Leads 1758 are shown as elongated conductors that facilitate integration of PCB Assembly 1742 with other components of the system.

[0135] With continued reference to FIGS. 14A and 14B, PCB Assembly 1742 may be configured as a passive configuration. In passive configurations, rather than bonding the flexible cable to one or more integrated ASICs, the flex may be bonded directly to PCB 1738 where each micro-recording channel is routed 1: 1 to an analog pinout. Connector 1756 may provide the analog pinout for transmitting signals from the micro-recording channels to external systems. In some cases, leads 1758 may serve as flying leads for ref / gnd connections extending from PCB Assembly 1742.

[0136] As further shown in FIGS. 14A and 14B, deep array 100 may be used with a headstage in passive configurations. The headstage may be an interposer PCB integrated with an ASIC compatible with a recording system of a user’s choosing. In some cases, users may opt to use a passive probe that is plugged into the headstage, where the headstage provides analog-to-digital conversion and signal processing capabilities external to PCB Assembly 1742. Referencing substrate 1752 may be electrically coupled to PCB 1738 to provide grounding or reference signals for the assembly.

[0137] Referring to FIG. 15, multiple exposed shanks showing different configurations of substrates and contacts are shown. FIG. 15 depicts three exposed shanks arranged vertically, each showing variations in structural elements.

[0138] An exposed shank 1810 is positioned at a top of FIG. 15 and includes a substrate 1820 extending along its length. Substrate 1820 terminates at a distal tip 1822 on a left side of FIG. 15. Contacts 1824 are distributed along substrate 1820, appearing as a series of elements arranged in a linear pattern along the length of exposed shank 1810.

[0139] With continued reference to FIG. 15, an exposed shank 1810' is shown below exposed shank 1810 with a similar configuration. Exposed shank 1810' includes a substrate 1820' with a distal tip 1822' at its terminus. Contacts 1824' are positioned along substrate 1820' in a comparable arrangement to contacts 1824 on exposed shank 1810,

[0140] An exposed shank 1810" is positioned at a bottom of FIG. 15. Exposed shank 1810" includes a substrate 1820" extending from a distal tip 1822". Contacts 1824" are arranged along substrate 1820" in a pattern similar to the other exposed shanks shown in FIG.15.

[0141] The three exposed shanks depicted in FIG. 15 demonstrate the elongated nature of substrates 1820, 1820', and 1820" and the distribution of contacts 1824, contacts 1824', and contacts 1824" along their lengths. Each substrate extends from its respective distal tipAtorney Docket No.: 00406-0003-00304toward a right side of FIG. 15. with contacts 1824, contacts 1824', and contacts 1824" providing recording or stimulation sites along exposed portions of the shanks. Different contact distributions along substrates 1820, 1820', and 1820" may serve various recording requirements depending on target tissue characteristics and desired spatial resolution. In some aspects, exposed shank 1810" may include a 256-channel arrangement.

[0142] As further shown in FIG, 15, deep array 100 may achieve channel counts greater than 256, 512, or 1024 through microfabrication techniques such as minimizing trace width or multilayer metal deposition. In some cases, deep array 100 may achieve higher channel counts through assembly methods such as double wrapping, rolling, or stacking multiple flex cables around a single substrate. The configurations of exposed shank 1810, exposed shank 1810', and exposed shank 1810" demonstrate how varying contact arrangements along substrates 1820, 1820', and 1820" may accommodate different channel count requirements and recording applications.

[0143] Referring to FIG S. 16A and 16B, isometric and side views of a PCB Assembly 1942 are shown. PCB Assembly 1942 includes a PCB 1938, a cable 1918, and a reinforcement rod 1912. In FIG. 16A, PCB 1938 serves as a main circuit board platform that supports electrical connections and circuitry. Cable 1918 extends from one side of PCB 1938, providing electrical connectivity to external components. Reinforcement rod 1912 is positioned adjacent to cable 1918, providing structural support to the assembly. PCB 1938 includes various electronic components and connectors mounted on a surface of PCB 1938.

[0144] FIG. 16B illustrates a side view of PCB Assembly 1942. This view shows the relationship between the components from a different perspective. Cable 1918 is shown extending from PCB 1938, with reinforcement rod 1912 positioned alongside cable 1918. PCB 1938 is visible with a layered structure and mounted components. This side view reveals a vertical arrangement and spatial relationship of PCB Assembly 1942 components, demonstrating how- cable 1918 and reinforcement rod 1912 interface with PCB 1938.

[0145] With continued reference to FIGS. 16A and 16B, PCB Assembly 1942 may be configured to accommodate higher channel counts through stacked configurations. In some cases, at least two PCBs may be disposed within casing 106, and the at least two PCBs may be in a stacked configuration, lire stacked configuration may allow for increased channel density w hile maintaining a compact form factor within casing 106. PCB 1938 may include integrated ASICs for data amplification, analog-to-digital conversion, and multiplexing of signals from multiple recording channels.Atorney Docket No.: 00406-0003-00304

[0146] As further shown in FIGS. 16A and 16B, reinforcement rod 1912 may be bonded to a bond pad on PCB 1938 to provide grounding for the assembly. Cable 1918 may be routed alongside reinforcement rod 1912 to facilitate signal transmission between recording channels and PCB 1938. In some cases, multiple PCB assemblies similar to PCB Assembly 1942 may be stacked to achieve channel counts greater than 256, 512, or 1024. The stacked configuration of PCBs within casing 106 may enable deep array 100 to accommodate varying recording requirements while maintaining structural integrity through reinforcement rod 1912.

[0147] Referring to FIGS. 17A and 17B, a PCB assembly 2042 configured with multiple PCBs 2038 arranged in a radial configuration is shown. PCB assembly 2042 includes a plurality of PCBs 2038 extending outward from a central region. Each PCB 2038 is positioned at an angle relative to adjacent PCBs 2038, creating a multi-directional arrangement. A base 2039 is positioned at a lower portion of the assembly, providing structural support. A shared shank 2060 extends from the assembly, connecting to the central configuration of PCBs 2038.

[0148] FIG. 17B illustrates a top view of PCB assembly 2042 showing the radial arrangement of the multiple PCBs 2038, From this perspective, PCBs 2038 are distributed around a central point, extending outward in a spoke-like pattern. Base 2039 is visible as structural elements extending between PCBs 2038, providing interconnection and support for the radial configuration. PCB assembly 2042 demonstrates a configuration where multiple PCBs 2038 are arranged to extend in different directions from a common central assembly point, with base 2039 elements providing structural connectivity between individual PCBs 2038.

[0149] With continued reference to FIGS. 17A and 17B, the plurality’ of PCBs 2038 may be arranged on base 2039 in a star configuration. Tire star configuration allows PCBs 2038 to radiate outw ard from a central location while sharing common structural and electrical connections through base 2039. In some cases, the plurality’ of PCBs 2038 may be disposed within casing 106, and the plurality of PCBs 2038 may be arranged on base 2039 in the star configuration to accommodate higher channel counts within a compact form factor.

[0150] As further shown in FIGS. 17A and 17B, the plurality of PCBs 2038 may share shared shank 2060. Shared shank 2060 extends from the central region of PCB assembly 2042 and provides a single insertion point for recording from multiple PCBs 2038 simultaneously. The configuration where the plurality of PCBs 2038 share shared shank 2060 may enable channel counts greater than or equal to 256, 512, or 1024 channels whileAtorney Docket No.: 00406-0003-00304maintaining a single insertion pathway into target tissue. In some cases, shared shank 2060 may include a substrate wrapped with a micro-fabricated flex cable that connects to each of the plurality of PCBs 2038 through base 2039. The star configuration of PCBs 2038 on base 2039 with shared shank 2060 may simplify insertion procedures while maximizing recording channel density from a single penetration site.

[0151] Referring to FIGS. 18 and 19, multilayer deposition configurations for increasing channel counts are shown. FIG. 18 illustrates a section view' of a deposition configuration 2162. Deposition configuration 2162 includes a first layer 2162A positioned at a bottom, a second layer 2162B disposed on top of first layer 2162A, and a third layer 2162C positioned on top of second layer 2162B. First layer 2162A extends horizontally and provides a base for the structure. First layer 2162A may be an insulating material. Second layer 2162B is positioned above and in contact with first layer 2162A. Second layer 2162B may be a conductive (e.g., metal) layer. Third layer 2162C comprises multiple discrete conductive segments 2163 A, B that are spaced apart from one another along a top surface of second layer 2162B. Third layer 2162C may also include a gap 2165 that exposes second layer 2162B.

[0152] With continued reference to FIGS. 18 and 19, FIG. 19 illustrates a section view of a deposition configuration 2262. Deposition configuration 2262 includes a first layer 2262A (e.g., an insulating layer) positioned at a bottom, a second layer 2262B disposed on top of first layer 2262A, a third layer 2262C positioned on top of second layer 2262B, a fourth layer 2262D disposed on top of third layer 2262C, and a fifth layer 2262E positioned on top of fourth layer 2262D. First layer 2262A extends horizontally and provides a base for the structure. Second layer 2262B is positioned above and in contact with first layer 2262A. Second layer 2262B may be a conductive layer and may have multiple portions (as shown) or be a single layer. Third layer 2262C is disposed above second layer 2262B. Third layer 2262C may be an insulating layer that may have gaps formed therein for conductive material, as explained below. Fourth layer 2262D is positioned above third layer 2262C, Fourth layer 2262D may include conductive and insulative material. For example, fourth layer 2262D may include multiple conductive portions 2263A, 2263B. Insulative portions 2265 A, 2265B may surround a gap that is in communication with a gap in second layer 2262B. Fifth layer 2262E comprises multiple discrete segments that are spaced apart from one another along a top surface of fourth layer 2262D. For example, fifth layer 2262E may include multiple conductive segments 2267A, 2267B separated by insulative segments. Conductive material 2269 may be deposited through a gap in fifth layer 2262E and may extend into gaps formedAtorney Docket No.: 00406-0003-00304in fourth layer 2262D and third layer 2262C. Conductive material 2269 may be in electrical communication with (e.g., contact) second layer 2262B and isolated from other conductive portions. Conductive portions 2267 A, 2267B may be in electrical communication with (e.g., contact) conductive portions 2236A, 2263B, respectively, and may be isolated from other conductive portions. Deposition configuration 2262 demonstrates a multi-layer arrangement with additional layers compared to deposition configuration 2162 shown in FIG. 18,

[0153] As further shown in FIGS. 18 and 19, multilayer metal deposition may be used to increase micro-channel yield on the cable. In some cases, deep array 100 may produce 128 or more channels with a single layer of metal deposition as shown in deposition configuration 2162. The micro-channel yield may be doubled by increasing a thickness of the cable and introducing additional layers of metal deposition with traces running in parallel underneath top layer metal as shown in deposition configuration 2262. In some cases, deposition configuration 2262 with five layers may enable channel counts greater than 256 channels from a single cable wrapped around the substrate.

[0154] The multilayer deposition configurations shown in FIGS. 18 and 19 may simplify a wrapping procedure by reducing a number of times the substrate is wrapped for higher channel counts. In some cases, rather than double wrapping multiple flex cables around a single substrate to achieve higher channel counts, a stacked flex cable using multilayer metal deposition may be wrapped once around the substrate. The stacked configuration of deposition configuration 2262 may route greater than 128 channels via a y-cable to multiple ASICs 1648 on PCB 1638. First layer 2162A and first layer 2262A may comprise a polyimide or other insulating material that provides a base for subsequent metal deposition layers. Second layer 2162B and second layer 2262B may comprise conductive traces for routing signals from contacts to a backend of the cable. Third layer 2162C and fifth layer 2262E may comprise exposed contact sites configured to interface with neural tissue for recording electrical signals.

[0155] Referring to FIGS. 20 and 21, configurations for arranging ASICs on a cable for higher channel counts are shown. FIG. 20 depicts a configuration 2364A featuring multiple ASICs 2365 positioned along a cable 2366. ASICs 2365 appear as rectangular components separated by spacing elements. Cable 2366 extends downward from configuration 2364A, providing electrical connectivity between ASICs 2365 and recording channels on the substrate.

[0156] FIG. 21 depicts a configuration 2364B with an increased number of ASICs 2365 positioned along cable 2366. Similar to configuration 2364A, ASICs 2365 in configurationAtorney Docket No.: 00406-0003-003042364B are arranged as rectangular components with spacing elements between them. Cable 2366 extends downward from configuration 2364B. Configuration 2364A and configuration 2364B demonstrate different scaling options for integrating varying quantities of ASICs 2365 onto cable 2366. with configuration 2364B accommodating more ASICs 2365 than configuration 2364A.

[0157] With continued reference to FIGS. 20 and 21, a configuration 2364C may be provided with a further increased number of ASICs 2365 positioned along cable 2366.Configuration 2364C may accommodate channel counts greater than those provided by configuration 2364A and configuration 2364B. The configurations demonstrate how deep array 100 may scale to accommodate varying channel count requirements by adjusting the number of ASICs 2365 arranged along cable 2366.

[0158] As further shown in FIGS. 20 and 21, cable 2366 may be configured as a y-cable that routes signals from the recording span to multiple ASICs 2365, The y-cable configuration of cable 2366 may simplify a wrapping procedure for higher channel counts by reducing the number of times the substrate is wrapped. In some cases, rather than double wrapping multiple flex cables around a single substrate to achieve higher channel counts, a stacked flex cable using multilayer metal deposition may be wrapped once around the substrate and routed via cable 2366 to multiple ASICs 2365.

[0159] The y-cable routing provided by cable 2366 may enable channel counts greater than 128 channels to be processed by distributing signals across multiple ASICs 2365 in configuration 2364A, configuration 2364B, or configuration 2364C. In some cases, cable 2366 may split into multiple branches, with each branch connecting to a respective one of ASICs 2365. The arrangement of ASICs 2365 along cable 2366 in configuration 2364A, configuration 2364B, and configuration 2364C may accommodate channel counts of 256, 512, 1024, or greater depending on the number of ASICs 2365 integrated into the configuration.

[0160] Referring to FIG, 22, an exploded view of a deep array 2500 is shown. Deep array 2500 includes a proximal portion 2502 comprising a casing 2506 positioned at an upper end of the assembly. Extending from proximal portion 2502 are multiple sheathed shanks 2508, which are shown as elongated tubular structures that provide protection and support along their length. At distal ends of sheathed shanks 2508 are exposed shanks 2510, which extend beyond the sheathed portions. Deep array 2500 further includes PCBs 2538, which are shown connected to sheathed shanks 2508. In aspects, deep array 2500 may be a 32-channelAtorney Docket No.: 00406-0003-00304deep array. Deep array 2500 may have alternative configurations (e.g., more or fewer channels).

[0161] With continued reference to FIG. 22, PCBs 2538 appear as rectangular circuit board assemblies that interface with sheathed shanks 2508. providing electrical connectivity and signal processing capabilities. The arrangement shows multiple parallel sheathed shanks 2508 extending from casing 2506, with each sheathed shank 2508 terminating in an exposed shank 2510 at its distal end. PCBs 2538 are positioned along sheathed shanks 2508 to facilitate data transmission between exposed shanks 2510 and proximal portion 2502.

[0162] Referring to FIGS. 23 and 24, deep arrays with multi-shank arrangements are shown. FIG. 23 illustrates an isometric view of a deep array 2600. Deep array 2600 includes a proximal portion 2602 comprising a casing 2606. A PCB 2638 is shown positioned adjacent to casing 2606. Deep array 2600 further includes a sheathed shank 2608 extending from proximal portion 2602. Sheathed shank 2608 transitions to an exposed shank 2610 at a distal end of the assembly. The configuration shows two exposed shanks 2610 extending from respective sheathed shanks 2608, indicating a multi-shank arrangement. In aspects, deep array 2600 may be a passive deep array having 128-channels. Deep array 2600 may have alternative configurations (e.g., more or fewer channels).

[0163] FIG. 24 illustrates an isometric view of a deep array 2700. Deep array 2700 includes a proximal portion 2702 comprising a casing 2706. A PCB 2738 is shown positioned adjacent to casing 2706, with PCB 2738 featuring multiple connector ports on one side. Deep array 2700 includes multiple sheathed shanks 2708 extending from proximal portion 2702. Each sheathed shank 2708 transitions to a corresponding exposed shank 2710 at a distal end. The configuration depicts three sheathed shanks 2708 with three corresponding exposed shanks 2710, demonstrating a multi-channel arrangement suitable for recording applications,

[0164] Referring to FIG. 25, a perspective view of a deep array 2800 is shown. Deep array 2800 includes a sheathed shank 2808 extending from a PCB 2838. Sheathed shank 2808 appears as an elongated element that provides structural support and protection for internal components. PCB 2838 is positioned at one end of deep array 2800 and serves as the electronic interface for the device. A pair of connectors 2863 are shown extending from PCB 2838. Connectors 2863 facilitate electrical connections between deep array 2800 and external systems or devices. The arrangement shows sheathed shank 2808 positioned horizontally with PCB 2838 and connectors 2863 located at one end of the assembly.

[0165] Referring to FIG. 26, an isometric view of a deep array 2900 is shown. Deep array 2900 includes a proximal portion 2902, a sheathed shank 2908, and an exposed shankAtorney Docket No.: 00406-0003-003042910. Proximal portion 2902 is depicted as a rectangular box-shaped housing positioned at one end of the device. Sheathed shank 2908 extends from proximal portion 2902 and provides a protected pathway for internal components. Exposed shank 2910 continues from sheathed shank 2908 and extends distally, terminating at a tip region. The configuration of deep array 2900 presents an elongated probe-like structure with proximal portion 2902 serving as a connection point or housing for electronic components, while sheathed shank 2908 and exposed shank 2910 form the insertable portion of the device.

[0166] Referring to FIG. 27, a deep array 3000 is shown. Deep array 3000 includes a sheathed shank 3008 and an exposed shank 3010. Exposed shank 3010 extends from sheathed shank 3008 and includes contacts 3024 arranged along its length. An inset view shows a magnified portion of exposed shank 3010, revealing the arrangement of contacts 3024 in a pattern along the substrate. Deep array 3000 further includes a PCB 3038, which is connected to sheathed shank 3008. PCB 3038 includes electronic components and connection pads for interfacing with external systems. An additional inset view shows a close-up of sheathed shank 3008, illustrating its elongated profile.

[0167] Referring to FIG. 28, two deep arrays 3100A and 3100B are shown in a comparative arrangement. Deep array 3100 includes a casing 3102A, a sheathed shank 3108 A, and an exposed shank 3110A. Casing 3102A houses electronic components and provides structural support for the assembly. Sheathed shank 3108A extends from casing 3102A, and exposed shank 3110A extends distally from sheathed shank 3108A. Similarly, deep array 3100B includes a casing 3102B, a sheathed shank 3108B, and an exposed shank 3110B. Casing 3102B is positioned below casing 3102A in the figure and houses corresponding electronic components. Sheathed shank 3108B extends from casing 3102B, with exposed shank 3110B extending distally from sheathed shank 3108B. Both deep arrays 3100A and 3100B demonstrate a similar configuration with their respective casings, sheathed shanks, and exposed shanks arranged in parallel orientations.

[0168] Referring to FIG, 29, a perspective view of a setup 3200 for testing or operating a deep array is shown. Setup 3200 includes a tower 3270 mounted on a base 3272. Tower 3270 extends vertically from base 3272 and provides a support structure for positioning components. A container 3274 is positioned beneath tower 3270 on base 3272, which may be used to hold a solution or specimen during testing procedures.

[0169] Referring to FIG. 30, a perspective view of a setup 3300 incorporating a deep array 3301 is shown. Setup 3300 includes a tower 3370 mounted on a base 3372. Deep array 3301 is attached to tower 3370 and includes a sheathed shank 3308 extending downward.Atorney Docket No.: 00406-0003-00304Tower 3370 provides vertical positioning capability for deep array 3301. allowing for precise placement of sheathed shank 3308 during experimental or recording procedures.

[0170] Referring to FIG. 31, a perspective view of a setup 3400 configured for testing or recording operations is shown. Setup 3400 includes a deep array 3401 with a sheathed shank 3408 extending from tire assembly. A tower 3470 supports deep array 3401 and provides positioning control. A setup 3474 is positioned below sheathed shank 3408, which may contain a specimen or solution for recording or testing purposes. The arrangement of tower 3470 and setup 3474 enables controlled insertion and positioning of sheathed shank 3408 during experimental procedures.

[0171] Referring to FIG. 32, an isometric view of a deep array 3500 is shown. Deep array 3500 includes a sheathed shank 3508 that extends from a PCB 3538. PCB 3538 is positioned at one end of the assembly and includes visible electronic components and connection points. Sheathed shank 3508 is an elongated flexible element that connects PCB 3538 to the distal components of deep array 3500. A interposer chip 3576 is positioned along sheathed shank 3508, providing structural support and protection at a transition point along the length of the shank. A needle 3810 extends from interposer chip 3576, forming the distal portion of deep array 3500, Needle 3810 appears as a thin, elongated element designed for insertion purposes. The overall configuration of deep array 3500 demonstrates a design where PCB 3538 serves as the proximal electronic interface, connected via sheathed shank 3508 through interposer chip 3576 to needle 3810 at the distal end.

[0172] With continued reference to FIG. 32, interposer chip 3576 may be a silicon chip that serves multiple functions within deep array 3500. Interposer chip 3576 may act as a packaging intermediary between the high density flexible cable and a secondary cable, facilitating electrical connections between components having different geometries or contact pitches. The interposer chip 3576 may include redistribution layers that route signals from fine-pitch contacts on the flexible cable to coarser-pitch contacts suitable for connection to external electronics. In some cases, interposer chip 3576 may include through-silicon vias (TSVs) that enable vertical electrical connections through the chip substrate, reducing the overall footprint of the interconnection region. Interposer chip 3576 may also serve as a critical alignment and handling feature during assembly and use of deep array 3500, providing a rigid reference point for positioning the flexible cable relative to needle 3810 and enabling manipulation of the assembly without directly contacting the delicate flexible cable structures. The rigid nature of interposer chip 3576 may provide mechanical stability at the transition between the flexible cable and needle 3810, reducing stress concentrations thatAtorney Docket No.: 00406-0003-00304could otherwise lead to cable fatigue or delamination. In some cases, interposer chip 3576 may include alignment marks or fiducials that facilitate precise positioning during automated assembly processes. Interposer chip 3576 may further include test pads that enable electrical verification of connections prior to final assembly, allowing identification of defective units before additional manufacturing steps are performed. The dimensions of interposer chip 3576 may be selected to provide sufficient surface area for bond pad placement while minimizing the overall profile of deep array 3500 at the transition region.

[0173] FIG. 33B provides a side view of deep array 3600 showing casing 3602 with both first probe 3608A and second probe 3608B extending from the assembly. First probe 3608A and second probe 3608B are shown as parallel elongated elements with epoxy 3678 positioned at the casing 3602 interface. The side view reveals the spatial relationship between first probe 3608A and second probe 3608B as they extend from casing 3602.

[0174] FIG, 33C provides tw'O additional views of deep array 3600, A first view show's casing 3602 from above, revealing circular features on its surface. A second view' show's casing 3602 from a different angle with first probe 3608A, second probe 3608B, and epoxy 3678 visible. Epoxy 3678 is applied to secure first probe 3608A and second probe 3608B to casing 3602. The configuration of deep array 3600 with the dual probe arrangement of first probe 3608A and second probe 3608B extending from casing 3602 enables recording from multiple locations simultaneously.

[0175] Referring to FIG, 34, an isometric view of a deep array 3700 is shown. Deep array 3700 includes a PCB 3738 positioned at one end, from which a probe 3708A and a cable 3708B extend. Probe 3708A and cable 3708B extend outward from PCB 3738 and converge toward a distal portion 3780. PCB 3738 is shown as a rectangular circuit board with various electronic components mounted on its surface. The configuration demonstrates the arrangement of probe 3708A and cable 3708B as they extend from PCB 3738 toward distal portion 3780 of deep array 3700. In some aspects, cable 2078B may connect a substrate of probe 3708A to a reference ground on PCB 3738, In other aspects, cable 2078B may be coupled to recording channel (e.g., on an ASIC) so that a user may record from a tip of the substrate.

[0176] Referring to FIG. 35, a perspective view of a deep array 3800 is shown. Deep array 3800 includes a proximal portion 3802 positioned on the left side of the image.Proximal portion 3802 contains a PCB 3838, which is visible as a circuit board with various electronic components mounted thereon. PCB 3838 is supported by what appears to be a mounting substrate or backing material. Extending from proximal portion 3802 is a probeAtorney Docket No.: 00406-0003-003043708A, which connects to a cable 3708B. Cable 3708B is shown as a wire that extends from the PCB 3838 area toward probe 3708A. Probe 3708A appears as a thin elongated element that extends toward a distal portion 3880. Distal portion 3880 is shown on the right side of the image and includes a vertical support structure through which the probe extends. The deep array 3800 configuration demonstrates the arrangement of electronic components at the proximal end with the recording or sensing elements extending distally through the cable and probe assembly.

[0177] Referring to FIG. 36, a side view of a deep array 3900 is shown. Deep array 3900 includes a proximal portion 3902 positioned at the upper right of the figure, shown as a solid black rectangular component. Extending from proximal portion 3902 is a proximal shank 3908A, depicted as an elongated element that extends diagonally downward toward the center of the figure. Proximal shank 3908A connects to a bend portion 3982, which is indicated by a small circular region where the shank changes direction. From bend portion 3982, a tail 3984 extends downward and to the right. Additionally, a distal shank 3908B extends horizontally to the left from bend portion 3982. At the leftmost end of distal shank 3908B is an exposed shank 3910. The configuration of deep array 3900 demonstrates a bent or angled arrangement where proximal shank 3908A and distal shank 3908B meet at bend portion 3982, allowing for positioning flexibility of exposed shank 3910 relative to proximal portion 3902. Bend portion 3982 may be flexible and may be positioned at any suitable angle. Furthermore, one or both of proximal shank 3908A and distal shank 3908B may be flexible. In some embodiments, bend portion 3982 may be configured to bend in two or more directions. In some aspects, one or more of bend portion 2982, proximal shank 3908A, and distal shank 3908B may have shape memory features to retain them in a desired bent or angled state.

[0178] Referring to FIG. 37, a view of a deep array 4000 is shown. Deep array 4000 includes several components, including a proximal cable 4008A, a distal sheathed shank 4008B, an exposed shank 4010, a PCB 4038, a bend portion 4082, and a tail 4084, As discussed above for FIG. 36, bend portion 4082, cable 4008A, and distal shank sheathed shank 4008B may be flexible. Deep array 4000 may have any feature of deep array 3900 unless otherwise provided herein. PCB 4038 is positioned at the proximal end of the assembly and connects to proximal shank 4008A. Proximal cable 4008 extends from PCB 4038 and transitions at bend portion 4082, where the shank changes direction. Bend portion 4082 connects proximal cable 4008A to distal sheathed shank 4008B. Distal sheathed shank 4008B extends from bend portion 4082 and terminates at exposed shank 4010. Tail 4084Atorney Docket No.: 00406-0003-00304extends from bend portion 4082 in a direction different from distal sheathed shank 4008B. Exposed shank 4010 is positioned at the distal end of the assembly and extends outward from distal sheathed shank 4008B. This configuration allows deep array 4000 to accommodate various insertion angles and positioning requirements during deployment. In some aspects, proximal cable 4008A may a cable having a silicone coating. The silicone coating may be a protective layer, for example, against abrasion.

[0179] Referring to FIG. 38, a top view of a recording setup 4100 is shown. Recording setup 4100 includes a plurality of probes 4186 arranged in a configuration around a central region. Probes 4186 are positioned at various locations around recording setup 4100, with four probes 4186 visible in the image. Each probe 4186 appears as a dark circular component. Recording setup 4100 also includes a base 4188, which provides structural support for the assembly. Various wires and cables extend from the central region of recording setup 4100, connecting probes 4186 and other internal components.

[0180] Referring to FIGS. 39A and 39B, recording setups with probe towers are shown. FIG. 39A illustrates an isometric view of a recording setup 4200. Recording setup 4200 includes a first probe tower 4286A and a second probe tower 4286B positioned on an upper surface. Each probe tower is associated with a tower support 4290 that provides structural stability. Multiple PCBs 4292 are mounted around the periphery of recording setup 4200, arranged in a circular configuration. Recording setup 4200 includes a base 4296 that forms the lower portion of the structure. An opening 4298 is visible in the central region of base 4296. Cables 4294 extend downward from base 4296, providing electrical connections to external systems.

[0181] FIG. 39B illustrates a top view of a recording setup 4300. Recording setup 4300 shows multiple probe towers 4386 arranged around the periphery of the structure. Probe towers 4386 are positioned at various locations along the circular configuration of recording setup 4300. An opening 4398 is located in the central region of recording setup 4300. A base 4396 forms the outer boundary of recording setup 4300, providing structural support for probe towers 4386 and other components. The top view? reveals the spatial arrangement of probe towers 4386 relative to central opening 4398 and demonstrates how' the components are distributed around the circumference of recording setup 4300.

[0182] Referring to FIG. 40, a perspective view of a cartridge 4300A is shown, Cartridge 4300A includes a plurality of shanks 4308A extending from a casing 4338A. Plurality of shanks 4308 are arranged in a parallel configuration and extend from casing 4338A, which serves as a connection point for the shanks. Cartridge 4300A may be configured as anAtorney Docket No.: 00406-0003-00304implant that can be mechanically registered to a recording chamber or tower and then driven to a target position during surgical procedures. The cartridge configuration enables a "bed of nails" approach where multiple shanks can be simultaneously positioned and inserted into target tissue regions. In some aspects, cartridge 4300A may include alignment features that mate with corresponding features on a recording tower to ensure precise positioning and repeatability across multiple insertion procedures. The mechanical registration between cartridge 4300A and the recording tower may be achieved through kinematic mounting features, magnetic alignment, or precision-machined interfaces that constrain movement in multiple degrees of freedom. Cartridge 4300A may be pre-loaded with plurality of shanks 4308 A prior to surgical procedures, allowing for rapid deployment once the cartridge is registered to the recording tower.

[0183] In some aspects, cartridge 4300A may be disposable, enabling single-use deployment of plurality of shanks 4308A w'hile the recording tower remains reusable across multiple procedures. The parallel arrangement of plurality of shanks 4308A within cartridge 4300A may enable simultaneous recording from multiple brain regions or provide redundancy for recording from a single target structure. Casing 4338A may include electrical connections that interface with the recording tower to transmit signals from plurality of shanks 4308 to external data acquisition systems.

[0184] Referring to FIG. 41, a perspective view of a deep array 4400 is shown. Deep array 4400 includes a sheathed shank 4408 extending from a proximal portion 4406, A transmission 4407 is connected to proximal portion 4406. Sheathed shank 4408 transitions to an exposed shank 4410 at both ends of deep array 4400. Exposed shank 4410 includes contacts 4424 positioned along its length and terminates at a tip 4422. An optical fiber 4425 is integrated with deep array 4400, extending along the length of the device. Deep array 4400 is configured in an elongated form with optical fiber 4425 providing optical functionality in conjunction with the electrical recording capabilities provided by contacts 4424.

[0185] Referring to FIGS. 42A and 42B, orthogonal views of a guide tube 4500 are shown. FIG. 42A provides a side view of guide tube 4500, showing the overall elongated profile of the component. Guide tube 4500 includes a tube portion 4511 that extends along the length of the structure. At one end of guide tube 4500, a bevel 4599 is formed, providing an angled surface at the proximal end of tube portion 4511. The opposite end of guide tube 4500 features a rounded termination. FIG. 42B provides an end view of guide tube 4500, showing the cross-sectional profile of the component. From this perspective, bevel 4599 is visible at the upper portion, and tube portion 4511 extends downward from the beveledAtorney Docket No.: 00406-0003-00304region. Tube portion 4511 appears to have a hollow configuration suitable for receiving or guiding other components. Bevel 4599 may facilitate insertion or alignment of guide tube 4500 during use.|0186] Referring to FIG. 43, a perspective view of a guide tube 4600 is shown. Guide tube 4600 includes a tube portion 4613 and a liner 4615. Liner 4615 is positioned within or along tube portion 4613, extending from a proximal region of guide tube 4600. Tube portion 4613 forms tire outer structural component of guide tube 4600 and appears to have a cylindrical configuration. Liner 4615 is visible as a distinct section with a different surface appearance compared to tube portion 4613, suggesting liner 4615 may be composed of a different material or have a different surface treatment. Guide tube 4600 is configured to provide guidance and support for components such as probes or shanks during insertion procedures.

[0187] Referring to FIG, 44, a guide tube assembly 4717 and a jig 4700 used in conjunction with guide tube assembly 4717 are shown. The figure presents two schematic views of guide tube assembly 4717 along with a photograph of jig 4700. Guide tube assembly 4717 includes a proximal portion 4719, a proximal guide tube 4721, a distal guide tube 4723, a liner 4725, and a guide 4727. Proximal portion 4719 is depicted as a dark rectangular element positioned at one end of the assembly. Proximal guide tube 4721 extends from proximal portion 4719 and connects to distal guide tube 4723. Liner 4725 is shown positioned between proximal guide tube 4721 and distal guide tube 4723, Guide 4727 is indicated by an arrow in the upper schematic view, showing the direction of movement or insertion along the assembly. The lower schematic view provides an alternative representation of guide tube assembly 4717, displaying the same components including proximal portion 4719, proximal guide tube 4721, distal guide tube 4723, and liner 4725, Jig 4700, shown in the photograph on the left side of the figure, appears as a white molded structure with multiple channels or grooves that may be used to support or align guide tube assembly 4717 during manufacturing or assembly processes.

[0188] Referring to FIG, 45, an isometric view of a deep array 4800 is shown. Deep array 4800 includes a casing 4802 positioned at a proximal end of the assembly. Casing 4802 houses internal electronics and a switch. The switch may be configured to use the substrate as a reference point, or to short the reference and / or substrate to ground. A connector 4859 is attached to the top of casing 4802, providing an interface for external connections. Cables 4858 extend from casing 4802, terminating in pin connectors for electrical communication with external devices. A reinforcement rod 4812 extends from casing 4802 and providesAtorney Docket No.: 00406-0003-00304structural support to the assembly. A sheathed shank 4808 runs parallel to reinforcement rod 4812, extending distally from casing 4802. Sheathed shank 4808 transitions into an exposed shank 4810 at a distal region of the assembly. A protective cover 4829 surrounds a portion of exposed shank 4810, providing protection to the underlying components. The deep array 4800 configuration integrates reinforcement rod 4812 with sheathed shank 4808 and exposed shank 4810 to form an elongated probe structure suitable for insertion applications.

[0189] Referring to FIGS. 46A and 46B, perspective views of a deep array 4900 in different configurations are shown. In FIG. 46A, deep array 4900 is shown in a compact arrangement. Deep array 4900 includes a first portion 102 comprising a first casing portion 4835 A and a second casing portion 4835B. A holder 4831 extends from the casing portions and connects to a sheathed shank 108. Sheathed shank 108 terminates at a distal opening 4833. In FIG. 46B, deep array 4900 is shown in an extended configuration where the components are more clearly visible. First portion 102 includes first casing portion 4835A and second casing portion 4835B. Holder 4831 is positioned along the length of the assembly. A deep array 100 is shown with sheathed shank 108 extending distally and transitioning to an exposed shank 110. A mounting bracket 4902 is attached to second casing portion 4835B, providing a mechanism for securing or positioning deep array 4900. Exposed shank 110 extends beyond sheathed shank 108 and terminates at a distal end suitable for insertion into target tissue.

[0190] Referring to FIGS. 47 and 48, views of a deep array 5000 configured for microdialysis functionality are shown. In FIG. 47, deep array 5000 is shown in an operational context with a cannula 5037 and a membrane 5010. Membrane 5010 is depicted in an enlarged view showing the microdialysis process, where perfusate flows through the system and dialysate containing analyte is collected. Membrane 5010 permits the exchange of molecules between the perfusate and the surrounding environment, with arrows indicating the directional flow of perfusate entering and dialysate exiting the membrane region.

[0191] FIG. 48 provides a detailed view of deep array 5000 showing the structural arrangement of components. Deep array 5000 includes an inlet 5039A and an outlet 5039B positioned at the proximal end, which facilitate fluid flow into and out of the device. Cannula 5037 extends from the proximal region and connects to tubes 5041, which provide the fluid pathways for the microdialysis operation. At the distal end, a microdialysis fiber 5043 is positioned, featuring a textured or porous surface that enables the exchange of analytes during operation. The configuration allows for simultaneous neural recording and microdialysis sampling capabilities within a single integrated device.Atorney Docket No.: 00406-0003-00304

[0192] Referring to FIG. 49, a perspective view of a deep array 5100 is shown. Deep array 5100 includes a casing 5102 positioned at a proximal end, from which a probe 5145 extends. Probe 5145 is an elongated component that connects casing 5102 to a cannula 5110 located at a distal end of the assembly. Cannula 5110 is depicted as a rectangular structure. Deep array 5100 further includes an inlet 5108A and an outlet 5108B, which are shown as curved tubular elements extending from the assembly. Inlet 5108 and outlet 5108B diverge from one another, with inlet 5108 A curving upward and outlet 5108B extending in a different direction. Dashed arrows indicate the direction of flow through inlet 5108A and outlet 5108B, suggesting fluid communication pathways within deep array 5100. The configuration of deep array 5100 allows for the integration of probe 5145 with cannula 5110 while providing inlet and outlet pathways for fluid delivery or extraction.

[0193] Referring to FIG. 50, a perspective view of a probe assembly configured for neural recording applications is shown. FIG. 50 illustrates A probe 5147 extends diagonally through the view, showing an elongated structure designed for insertion into tissue. Probe 5147 includes a cannula 5110 positioned at the upper right portion of the assembly, which serves as a protective outer housing. A tube 5149 is shown extending from cannula 5110 and continues along the length of probe 5147, Tube 5149 provides structural support and may facilitate fluid delivery or other functions. A sealing agent 5153 is visible at a junction point along probe 5147, positioned where tube 5149 interfaces with other components, providing a seal to maintain integrity of the assembly. At the lower left portion of probe 5147, a recording span 5151 is indicated, representing the region of probe 5147 configured for neural signal acquisition. Recording span 5151 extends along a portion of probe 5147 and is designed to interface with neural tissue for recording electrical activity. The overall configuration demonstrates how the various components are arranged along the longitudinal axis of probe 5147 to enable both structural support through cannula 5110 and tube 5149, sealing functionality through sealing agent 5153, and neural recording capability through recording span 5151.

[0194] Referring to FIG. 51, a perspective view of a probe assembly configured for insertion through a cannula is shown. The assembly includes a probe 5147 extending through a cannula 5110, with a tube 5149 positioned at the proximal end of the assembly. Cannula 5110 features recording sites 5124 arranged in a pattern along its length. Recording sites 5124 may be intentionally positioned along cannula 5110. A sealing agent 5153 is shown at the junction between probe 5147 and cannula 5110, providing a seal at this interface. Probe 5147 extends diagonally through cannula 5110, with tube 5149 oriented at an angle relativeAtorney Docket No.: 00406-0003-00304to cannula 5110. The dashed arrows indicate directional flow or movement paths along probe 5147 within the assembly. Tube 5149 has a circular cross-section visible at its proximal end and includes a small opening or port along its length. This configuration allows probe 5147 to be positioned within cannula 5110 while maintaining a sealed interface through sealing agent 5153.

[0195] Referring to FIG. 52, an isometric view of a probe assembly configured for neural recording applications is shown. The assembly includes a cannula 5110 positioned at the proximal end, which serves as a structural support and interface component. Extending from cannula 5110 is a probe 5147, which comprises an elongated structure designed for insertion into tissue. Probe 5147 includes a tube 5149 that extends along the length of the assembly. Tube 5149 features a recording span 5151 arranged along a portion of tube 5149. Cannula 5110 connects to probe 5147 at an interface region, with tube 5149 continuing distally from this connection point. The overall configuration presents a linear arrangement where the components are aligned along a common longitudinal axis, with recording span 5151 occupying a substantial portion of tube 5149 length.

[0196] Referring to FIG. 53, an isometric view of a cannula assembly configured for neural recording and optical stimulation applications is shown. Cannula 5110 is shown as an elongated tubular structure extending diagonally across the view'. Cannula 5110 provides a housing for internal components used in neural interface applications. A tube 5149 is positioned within or alongside cannula 5110, extending along the length of the assembly, A recording span 5151 is indicated along a portion of tube 5149, representing a region configured for neural signal acquisition. An optical fiber 5155 is shown integrated with the assembly, positioned to enable optical stimulation capabilities in conjunction with the recording functionality. Optical fiber 5155 extends through a portion of cannula 5110 structure. The arrangement of tube 5149, recording span 5151, and optical fiber 5155 within cannula 5110 provides a combined electrophysiological recording and optogenetic stimulation platform suitable for deep brain applications.

[0197] Each of FIGs. 50-53 illustrate an exemplary configuration of a microelectrode array (e.g., deep array) to a micro-dialysis device.

[0198] Referring to FIG. 54, a perspective view' of a deep array 5200 is shown. Deep array 5200 includes a proximal portion 5202 positioned at one end, which comprises a casing 5206. Casing 5206 houses internal components and provides structural support for the device. Extending from proximal portion 5202 is an exposed shank 5208, which forms an elongated portion of deep array 5200. Exposed shank 5208 transitions into a sheathed shank 5210 at theAtorney Docket No.: 00406-0003-00304distal end of the device. Sheathed shank 5210 terminates at contacts 5261, which are positioned at the distal tip of deep array 5200. The overall configuration of deep array 5200 presents an elongated structure with proximal portion 5202 and casing 5206 at one end and sheathed shank 5210 with contacts 5261 at the opposite end, connected by exposed shank 5208.

[0199] Referring to FIGS. 55A-55C, multiple orthogonal views of a guide 5300 are shown. FIG. 55A provides a front view, FIG. 55B provides an isometric view, and FIG. 55C provides a side view of guide 5300. Guide 5300 includes several components, including a micro drive 5363, a frame 5365, a cannula 5308, and contacts 5310. Micro drive 5363 is positioned at an upper portion of guide 5300 and is configured to provide controlled movement. Frame 5365 extends from micro drive 5363 and includes a curved structural element visible in FIGS. 55A and 55B that provides support and positioning capability. Cannula 5308 extends downward from frame 5365 and serves as a conduit or guide pathway. Contacts 5310 are located at a distal end of cannula 5308. The arrangement of micro drive 5363 relative to frame 5365 allows for precise positioning and adjustment of cannula 5308 and contacts 5310. The multiple views shown in FIGS. 55A-55C provide a comprehensive understanding of the three-dimensional configuration of guide 5300 and the spatial relationships between its components.

[0200] Referring to FIG. 56, an isometric view of guide 5300 is shown. Guide 5300 includes several components configured for positioning and operation of a deep array. Micro drive 5363 is positioned at an upper portion of guide 5300, featuring a cylindrical element at its top surface. Micro drive 5363 is connected to a Bengun 5367, which is situated below micro drive 5363 and includes a mounting structure with visible mechanical features. A deep array 5369 extends from Bengun 5367. Frame 5365 extends outward from the assembly in a curved configuration, providing structural support. Cannula 5308 extends downward from the lower portion of guide 5300, forming an elongated tubular element. Contacts 5310 are positioned on the assembly near the junction between Bengun 5367 and cannula 5308. Guide 5300 provides a configuration that integrates micro drive 5363, Bengun 5367, deep array 5369, and cannula 5308 into a unified assembly for positioning and deployment purposes.

[0201] Referring to FIGS. 57A-57C, multiple views of guide 5300 configured for use with deep array 5369 are shown. FIG. 57A shows a front view of guide 5300 w'ith micro drive 5363 positioned at an upper portion of the assembly. Cannula 5308 extends downward from guide 5300, and contacts 5310 extend from the distal end of cannula 5308. FIG. 57B depicts guide 5300 in an operational setting, showing micro drive 5363 mounted on guideAtorney Docket No.: 00406-0003-003045300 with cannula 5308 extending downward. Deep array 5369 is shown positioned within the assembly, with electrical connections visible at micro drive 5363. FIG. 57C presents another view of guide 5300 showing micro drive 5363 at the upper portion, with a shank 5391 extending from the assembly. Cannula 5308 is positioned below guide 5300, and contacts 5310 extend from the distal end of cannula 5308. Guide 5300 provides a mounting structure that accommodates micro drive 5363 for controlled positioning and advancement of deep array 5369 through cannula 5308 during surgical procedures.

[0202] Referring to FIG. 58, a diagram illustrating the anatomical relationship and electrophysiological characteristics of brain structures encountered during a surgical trajectory for deep brain stimulation targeting is shown. The diagram show's a vertical pathway from top to bottom through several brain regions. At the top of the trajectory is the Thalamus, which is characterized by high volume, low amplitude spikes. Below the Thalamus is a Quiet zone representing a region with minimal neural activity’. The distance from the bottom of the Thalamus to the bottom of the subthalamic nucleus (STN) is approximately 10mm. Below' the Quiet zone is the STN, which spans approximately 5mm in vertical extent and is characterized by large spikes with approximately 4x amplitude compared to the Thalamus. At the bottom of the trajectory is the substantia nigra (SN). The diagram includes markers indicating the top and bottom boundaries of the Thalamus and the top and bottom boundaries of the STN to assist in identifying the target location during electrode placement procedures,

[0203] Referring to FIG. 59, a diagram illustrating design configurations for recording spans of a deep array probe is shown. Two probe configurations are shown side by side for comparison. The first configuration on the left shows a single elongated contact element with a 10mm recording span. The second configuration on the right show's a probe design w ith a total span of 10mm that includes proximal contacts to aid in location definition positioned at the top, a central recording span of 5-6mm, and distal contacts to aid in location definition positioned at the bottom. The proximal and distal contacts are depicted as circular elements, while the recording span portions are shown as elongated oval shapes. This comparison illustrates different approaches to distributing recording and location-defining contacts along the probe length while maintaining similar overall dimensions.

[0204] Referring to FIG. 60, orthogonal views of shanks 5471 and 5471' for a deep array device are shown. The figure presents multiple configurations of the shanks with different recording span arrangements and contact distributions. On the left side of the figure, shank 5471 is shown in several views depicting a configuration with 128 micro contacts distributedAtorney Docket No.: 00406-0003-00304along a 10mm recording span. An additional view shows shank 5471 with a 3.175mm recording span. On the right side of the figure, shank 5471' is depicted with a segmented contact arrangement. Shank 5471' includes 10 micro contacts at a distal portion, followed by a 2mm gap, then 108 micro contacts distributed along a 6mm recording span, another 2mm gap, and finally 10 micro contacts at a proximal portion. This configuration provides a distributed recording capability across multiple segments of shank 5471'. The figure demonstrates the flexibility in contact arrangement and recording span configurations available for the deep array shanks, allowing for different recording requirements and target tissue depths. The varying recording spans and contact distributions between shank 5471 and shank 5471' illustrate different design options for neural recording applications.

[0205] Referring to FIG. 61, a diagram of a setup 5500 illustrating the positioning of components relative to a skull 5573 for targeting the subthalamic nucleus STN 5575 is shown. Setup 5500 includes a drive 5563 positioned above skull 5573, with a cannula 5567 extending from drive 5563 through skull 5573 toward STN 5575. Cannula 5567 extends approximately 4cm from drive 5563 to skull 5573. Below skull 5573, the diagram indicates a distance of 2-3cm to a point approximately 4cm from STN 5575, with the total depth from skull 5573 to STN 5575 being approximately 8-10cm. Skull 5573 is shown as a horizontal structure with drive 5563 mounted thereon.

[0206] Referring to FIG. 62, an isometric view of a deep array 5600 configured for DBS mapping is shown. Deep array 5600 includes a housing 5602 positioned at a proximal end of the assembly. Extending from housing 5602 is a sleeve 5608, which provides an outer covering along a portion of the device. A substrate 5610 is visible extending along the length of deep array 5600, running parallel to and adjacent to sleeve 5608. A sheath 5677 extends distally from the assembly, providing additional coverage or protection along the length of the device. A shell 5679 is also shown extending along deep array 5600, positioned in relation to the other elongated components. The elongated configuration of deep array 5600 with its multiple parallel extending elements including sleeve 5608, substrate 5610, sheath 5677, and shell 5679 provides a structure suitable for insertion applications. Housing 5602 serves as a proximal interface point for the assembly.

[0207] Referring to FIGS. 64 and 65, orthogonal side views of a deep array 5700 with associated components are shown. In FIG. 64, deep array 5700 is shown with a casing 5706 positioned at the proximal end. A sheath 5708 extends from casing 5706 along the length of the device. A cannula 5785 is positioned at the distal end of the assembly. A collar 5781 is located along sheath 5708, and a skirt 5783 is positioned adjacent to cannula 5785. FIG. 65Atorney Docket No.: 00406-0003-00304provides another side view of deep array 5700 showing the same components from a different orientation. Casing 5706 remains at the proximal end, with sheath 5708 extending distally. Cannula 5785 and skirt 5783 are visible along the assembly. An exposed shank 5710 extends from the distal end of cannula 5785, representing the portion of deep array 5700 that would be inserted into tissue during use. The arrangement of collar 5781, skirt 5783, and cannula 5785 along sheath 5708 provides structural support and positioning functionality for deep array 5700.

[0208] Referring to FIG. 65, a side view of a skirt assembly 5800 is shown. Skirt assembly 5800 includes a skirt 5883 and a collar 5881. Skirt 5883 extends as an elongated rectangular portion forming the main body of skirt assembly 5800. Collar 5881 is positioned at one end of skirt 5883, appearing as a rectangular section that protrudes from skirt 5883. Collar 5881 provides a connection point or interface region for skirt assembly 5800. Skirt assembly 5800 presents a generally linear profile with collar 5881 extending from the terminal end of skirt 5883.

[0209] Referring to FIGS. 66A-66C, isometric views of a probe assembly 5900 shown from different angles are provided. Probe assembly 5900 includes several components arranged in a configuration suitable for neural recording or stimulation applications, A skirt assembly 5991 is visible in FIG. 66A, positioned adjacent to a probe shank 5983. Probe assembly 5900 incorporates a bengun 5967, which appears as a disc-shaped component with a central mounting feature, Bengun 5967 is shown in all three views, FIGS, 66A, 66B, and 66C, positioned at an intermediate height within the assembly. A cannula 5969 is located below bengun 5967 and is depicted as a cylindrical component with a disc-shaped base. Cannula 5969 provides a pathway or guide structure within probe assembly 5900. The three views collectively demonstrate the spatial arrangement of the components, with FIG 66A showing a front-angled perspective, FIG. 66B presenting a side-angled view, and FIG. 66C displaying another angled perspective that reveals the relationship between bengun 5967 and cannula 5969 relative to the overall probe assembly 5900 structure.

[0210] Referring to FIGS. 67A and 67B, a deep array 6000 configured as a hybrid sEEG device is shown. FIG. 67A illustrates a schematic view of deep array 6000, while FIG. 67B illustrates a corresponding photograph of deep array 6000. Deep array 6000 includes several components configured for neural recording applications. A casing 6002 is positioned at a proximal end of deep array 6000 and houses internal electronics and connection interfaces. Extending from casing 6002 is a contact array 6099, which forms an elongated flexible structure. Contact array 6099 includes a split 6097 at a distal portion, where the arrayAtorney Docket No.: 00406-0003-00304separates into two distinct branches. A stylet 6093 is shown at one end of the structure, providing structural support during insertion procedures. A macro-contact data output 6095 extends from the assembly, facilitating data transmission from the recording contacts to external processing equipment. The configuration of deep array 6000 allows for neural signal acquisition through contact array 6099, with split 6097 enabling recording from multiple tissue regions simultaneously. Macro-contact data output 6095 provides a pathway for transmitting recorded signals from deep array 6000 to associated data acquisition systems.

[0211] Referring to FIGS. 68A and 68B, a deep array 6000A configured as a hybrid stereoelectroencephalography (sEEG) device is shown. FIG. 68A illustrates a side view of deep array 6000A. FIG. 68B illustrates a cross-sectional view of a sheathed shank 6008 A of deep array 6000A. Deep array 6000A includes a casing 6002A positioned at a proximal end of the assembly. Casing 6002A houses internal electronics and connection interfaces for the device. Sheathed shank 6008A extends from casing 6002A, which provides structural support and protection for internal components along its length. Sheathed shank 6008A transitions into a contact array 6099A, which forms an elongated flexible structure extending distally from the assembly. Sheathed shank 6008A includes a split 6097A at a distal portion, where sheathed shank 6008A separates into two distinct branches. A macro-contact data output 6095 A extends from the distal end of the assembly, facilitating data transmission from recording contacts to external processing equipment. The configuration of deep array 6000A allows for neural signal acquisition through contact array 6099A, with split 6097 enabling recording from multiple tissue regions simultaneously.

[0212] Referring to FIG. 68B, a plurality of microwires 6013A may extend longitudinally between outer sheath 6011A of sheathed shank 6008A and inner sheath 6009A. Microwires 6013A may connect the contacts of contact array 6099A at a distal end of the device with the macro-contact data output 6095 A at a proximal end of the device.

[0213] Referring to FIGS. 68C and 68D, a substrate 6001 A configured for hybrid sEEG applications is shown, FIG. 68C illustrates a side view of substrate 6001A, Substrate 6001A extends horizontally across the view and includes several components distributed along its length. A macro contact 6003 A is positioned at a distal end of substrate 6001 A, appearing as a band-like structure. Multiple micro recording sites 6005 A are arranged along the length of substrate 6001A. A micro recording site 6015A is positioned toward a first end of substrate 6001 A. A tip 6016A is located at one end of substrate 6001A, appearing as a cylindrical element. The arrangement of macro contact 6003A and micro recording sites 6005A andAtorney Docket No.: 00406-0003-003046015A along substrate 6001 A provides both macro-level and micro-level recording capabilities at different positions along the length of the device.

[0214] FIG. 68D illustrates a perspective view of a portion of substrate 6001 A showing the arrangement of micro recording sites 6005 A. Substrate 6001 A is depicted as a curved or cylindrical structure with micro recording sites 6005 A distributed across its surface. Micro recording sites 6005 A appear as small circular openings arranged in rows along substrate 6001 A. The perspective view' reveals how micro recording sites 6005 A are positioned on the curved surface of substrate 6001 A, enabling recording from multiple directions around the circumference of substrate 6001 A.

[0215] With continued reference to FIGS. 68A-68D, deep array 6000A may be configured as a hybrid depth electrode for sEEG applications. The hybrid configuration may include both macro recording sites and micro recording sites distributed along the length of the substrate. In some cases, deep array 6000A may include 8 platinum / iridium macro recording sites and 128 electroplated PEDOT micro recording sites. Tire macro recording sites may be configured for local field potential recordings, while the micro recording sites may be configured for single-unit recordings.

[0216] As further shown in FIGS. 68A-68D, deep array 6000A may include a 1.2mm outer diameter polyurethane tubing, an inner lumen for a 0.3mm stylet, and eight platinum / iridium macro output contacts. However, such dimensions are exemplary, and, for example, the outer diameter may be greater than or equal to approximately 200 micrometers. The cross-section reveals a layered construction of deep array 6000A with the various conductors and insulating materials concentrically arranged.

[0217] As further shown in FIGS. 68A-68D, a detail view at scale 10: 1 show's a distal portion of deep array 6000A, featuring eight platinum / iridium macro recording sites positioned along the substrate. Tire drawing indicates specific dimensional relationships between the macro recording sites and the overall structure. Another detail view at scale 75:1 provides a magnified representation of a microfabricated film portion, which includes 128 electroplated PEDOT micro recording sites. Fewer or more micro recording sites may be included on deep array 6000A. This section shows an arrangement of contact points with specific spacing dimensions.

[0218] With continued reference to FIGS. 68A-68D, the notes and specifications section indicates that deep array 6000A may have a weight of 2.1 grams. The microfabricated film may not delaminate from the substrate during expected use. The microfabricated film may be sheathed by a 1.2mm diameter silicone tube or similar material. The platinum / iridium macroAtorney Docket No.: 00406-0003-00304recording sites may be flush with the underlying substrate. Micro contacts may be free of debris and contaminants, uniform and flush without recession at any point along the assembly. Deep array 6000A may be adequately sealed to prevent fluid ingress.

[0219] As further shown in FIGS. 68A-68D, overall length dimensions show deep array 6000A extends approximately 265mm in total length, with recording span 5151 and various functional sections distributed along this length. The drawing provides manufacturing specifications for the hybrid depth electrode configuration. Materials for deep array 6000A may be selected for biocompatibility and MRI compatibility in clinical research and medical diagnostic applications. The hybrid configuration of deep array 6000A with both macro and micro recording capabilities may enable acquisition of neural signals at multiple spatial resolutions during sEEG procedures for mapping brain activity and localizing epileptic foci.

[0220] Referring to FIGS. 69A and 69B, a cable 6100 configured for neural recording applications is shown. Cable 6100 includes macro recording sites 6101, micro recording sites 6103, and insulation 6105 distributed along its length. FIG. 69A show s a side view of cable 6100 w ith macro recording sites 6101 and micro recording sites 6103 distributed along the length. Macro recording sites 6101 are indicated with a recording site pitch of 3.5mm, with a single macro recording span of 2mm, Micro recording sites 6103 have a single micro recording span of 1,5mm.

[0221] FIG. 69B provides an enlarged detailed view of cable 6100, showing the arrangement of macro recording sites 6101, micro recording sites 6103, and insulation 6105. Cable 6100 has a diameter of approximately 150 micrometers, w ith micro recording sites 6103 having a span of approximately 20 micrometers and insulation 6105 having a thickness of approximately 75 micrometers. Macro recording sites 6101 appear as larger band-like structures along cable 6100, while micro recording sites 6103 are shown as smaller dotted patterns positioned between sections of insulation 6105.

[0222] As further shown in FIGS. 69A and 69B, insulation 6105 covers portions of cable 6100 between the recording sites, providing electrical isolation between macro recording sites 6101 and micro recording sites 6103. This configuration allows cable 6100 to capture both macro-level and micro-level neural signals at different spatial resolutions along its length. The arrangement of macro recording sites 6101 and micro recording sites 6103 on cable 6100 may enable simultaneous acquisition of local field potentials through macro recording sites 6101 and single-unit activity through micro recording sites 6103.

[0223] Referring to FIGS. 70A and 70B, a cable 6200 configured for hybrid sEEG applications is shown. Cable 6200 includes macro recording sites 6201, micro recording sitesAtorney Docket No.: 00406-0003-003046203, contacts 6205, and a substrate 6222. FIG. 70A shows a side view' of cable 6200 with macro recording sites 6201 and micro recording sites 6203 visible along the length of cable 6200. Substrate 6222 is indicated at a lower portion of the assembly. Cable 6200 extends horizontally with macro recording sites 6201 positioned in a central region and micro recording sites 6203 located adjacent to macro recording sites 6201.

[0224] FIG. 70B provides a closer perspective view of cable 6200 showing micro recording sites 6203 arranged in a pattern along a surface. Contacts 6205 are visible on a substrate portion of the assembly. Micro recording sites 6203 may be arranged in rows. Cable 6200 connects to the substrate region where contacts 6205 are positioned, facilitating electrical communication between the recording sites and external components.|0225] As further shown in FIGS. 70A and 70B, the hybrid sEEG configuration of cable 6200 may have no platinum / iridium contacts. In this configuration, the flexible cable may be microfabricated to include both macro recording sites 6201 and micro recording sites 6203. The microfabrication of both macro recording sites 6201 and micro recording sites 6203 directly onto the flexible cable may reduce a diameter of the flexible substrate. The reduced diameter may improve quality of neuronal recordings by causing less tissue damage during insertion procedures. The configuration where the flexible cable includes both macro recording sites 6201 and micro recording sites 6203 without separate platinum / iridium contacts may eliminate the need for microwires running through an inner lumen of the sEEG substrate.

[0226] With continued reference to FIGS. 70A and 70B, substrate 6222 may support cable 6200 and provide structural integrity for the hybrid sEEG configuration. Contacts 6205 may provide electrical connections between micro recording sites 6203 and external data acquisition systems. The arrangement of macro recording sites 6201 and micro recording sites 6203 on cable 6200 may enable simultaneous acquisition of macro-level and micro-level neural signals during sEEG procedures. The hybrid configuration of cable 6200 with both macro recording sites 6201 and micro recording sites 6203 microfabricated onto the flexible cable may provide macro and micro recording capabilities while maintaining a reduced diameter compared to configurations using separate platinum / iridium macro contacts.

[0227] Referring to FIGS. 71A and 71B, pass-through sEEG configurations for introducing microelectrode recordings (MER) into sEEG procedures are shown, FIG. 71A illustrates a side view of a deep array 6300. Deep array 6300 includes a casing 6302, an exposed shank 6310, a junction 6397, a data output 6395, and a substrate 6399. Casing 6302 is positioned at a proximal end of deep array 6300 and houses electronic components. CasingAtorney Docket No.: 00406-0003-003046302 is labeled with branding and provides structural support for the assembly. Substrate 6399 connects to junction 6397, which serves as an interface between exposed shank 6310 and casing 6302. Data output 6395 extends from casing 6302, providing a pathway for signal transmission. Data output 6395 appears as a flexible cable with a dashed pattern indicating its length.

[0228] FIG. 71B illustrates a side view of a deep array 6400 in an alternative configuration. Deep array 6400 includes a casing 6402, an exposed shank 6410, a junction 6497, a data output 6495, and a substrate 6499. Exposed shank 6410 extends from substrate 6499. Substrate 6499 connects to junction 6497, which provides an interface point. Data output 6495 extends from junction 6497 in a curved path, leading to casing 6402 positioned at a distance from junction 6497. Casing 6402 is labeled with branding and houses electronic components.

[0229] As further shown in FIG. 71B, in the configuration of deep array 6400, casing 6402 is separated from junction 6497 by the length of data output 6495, allowing for flexible positioning of casing 6402 relative to exposed shank 6410. Data output 6495 displays a dashed pattern indicating its flexible nature and extended length. The configuration of deep array 6400 with casing 6402 separated from junction 6497 by data output 6495 may accommodate various positioning requirements during sEEG procedures.

[0230] With continued reference to FIGS. 71A and 71B, deep array 6300 and deep array 6400 may be configured as pass-through devices for introducing MER into sEEG procedures. Rather than passing a limited number of microwires through a lumen of an sEEG, deep array 6300 or deep array 6400 may be introduced through the same lumen while allowing for precise, high-density recording from a greater number of micro-electrodes at a distal end of the sEEG. The pass-through configuration may overcome limitations of existing microwire bundle approaches where the number of micro-contacts is limited to the number of microw'ires that can fit through an inner lumen of an sEEG.

[0231] As further shown in FIGS, 71 A and 71B, the sEEG component may contain an inner lumen with a cap at a distal end. The cap may be configured to stop a stylet but allow deep array 6300 or deep array 6400 to pass through an end of the probe. This configuration may allow a stylet to enter the lumen and advance the sEEG to a target position, while the cap permits deep array 6300 or deep array 6400 to extend beyond the distal end of the sEEG for recording from target tissue.

[0232] With continued reference to FIGS. 71A and 71B, in some cases, the sEEG may include two inner lumens. A first inner lumen may be configured for the stylet, and a secondAtorney Docket No.: 00406-0003-00304inner lumen may be configured for deep array 6300 or deep array 6400. The dual lumen configuration may enable simultaneous use of the stylet for advancing the sEEG and passage of deep array 6300 or deep array 6400 through a dedicated pathway. The pass-through concept may be combined with the hybrid sEEG approach where the hybrid sEEG is designed to allow for the pass-through feature.

[0233] As further shown in FIGS. 71A and 71B, deep array 6300 and deep array 6400 may be inserted through an anchor bolt secured to a cranial burr hole. The anchor bolt may lock the sEEG in place through compressive loading. The micro-fabricated flex of deep array 6300 or deep array 6400 may be protected from this load by tunneling the flex inside of the sEEG substrate, leaving exposed shank 6310 or exposed shank 6410 exposed for recording, in chronic recordings, data output 6395 or data output 6495 may be left resting on a patient's scalp. The micro-fabricated flexible cable may be protected and provided with adequate strain relief to accommodate handling during chronic recording sessions,

[0234] Referring to FIGS. 72A-72D, exemplary' configurations of a pass-through sEEG deep array are shown. In particular, FIGS. 72A and 72B illustrate a first pass-through sEEG deep array 6500 with associated components. FIGS. 72C and 72D illustrate a second pass- through sEEG deep array 6600 with associated components. Deep arrays 6500, 6600 demonstrate different configurations for providing structural support during insertion procedures while enabling passage of probes through the deep array structure.

[0235] FIG. 72A illustrates a side view of deep array 6500, Deep array 6500 includes a lumen 6509 and a cap 6511. Lumen 6509 extends through deep array 6500 and provides a pathway for components to pass through the structure. Cap 6511 is positioned at multiple locations along deep array 6500, providing termination points or interfaces at ends of the assembly.

[0236] FIG. 72B illustrates a cross-sectional view of deep array 6500. The cross- sectional view shows cap 6511 positioned at an outer region, with lumen 6509 visible as a central passage through deep array 6500. Epoxy 6513 is shown as a backfill material surrounding portions of deep array 6500 structure, providing structural reinforcement within the assembly. The drawing includes dimensional annotations indicating precise measurements for the various components of deep array 6500.

[0237] FIG. 72C illustrates an isometric view of deep array 6600. Deep array 6600 includes an outer lumen 6609, a cap 6611, and a distal portion 6613. Outer lumen 6609 forms an external tubular structure of deep array 6600. Cap 6611 is positioned at a proximal end of the assembly and provides an interface point for deep array 6600. Distal portion 6613 extendsAtorney Docket No.: 00406-0003-00304from a main body of deep array 6600 and is shown at multiple positions in the exploded view, indicating movement or assembly relationships.

[0238] FIG. 72D illustrates a cross-sectional view of deep array 6600 showing the internal arrangement of components. The cross-sectional view depicts a substrate 6313 positioned within the assembly. An inner lumen 6315 is visible within outer lumen 6609, providing a passage through a center of deep array 6600, A layer 6317 is positioned between inner lumen 6315 and outer lumen 6609. Layer 6317 may provide insulation or structural separation between inner lumen 6315 and outer lumen 6609. The dual-lumen configuration of deep array 6600 with inner lumen 6315 and outer lumen 6609 enables both structural support for electrode insertion and passage of additional instrumentation through the device.

[0239] As further shown in FIGS. 72A-72D, a text annotation indicates that deep array 6500 or deep array 6600 can drive the electrode through an anchor bolt while still allowing a 300um probe to pass through. The dual-lumen configuration of deep array 6600 may enable the stylet to provide structural support during advancement of an sEEG electrode while simultaneously permitting a deep array probe to pass through inner lumen 6315 for recording from target tissue. Cap 6511 of deep array 6500 and cap 6611 of deep array 6600 may be configured to stop advancement of the stylet at a predetermined position while allowing the probe to continue through lumen 6509 or inner lumen 6315 respectively.

[0240] With continued reference to FIGS. 72A-72D, the configuration of deep array 6500 with lumen 6509 may accommodate passage of a probe having a diameter of 300um or less. Microwires 6513 may extend along at least a portion of lumen 6509. In some aspects, an epoxy may be used to seal interfaces within deep array 6500 to prevent fluid ingress during use. In some cases, the may be a medical grade epoxy that provides biocompatibility for clinical applications. The dimensional specifications shown for deep array 6500 may be selected to match existing sEEG electrode geometries, enabling deep array 6500 to interface with standard anchor bolts and surgical workflows.

[0241] As further shown in FIGS, 72A-72D, the dual -lumen configuration of deep array 6600 provides separate pathways for different functions. Outer lumen 6609 may accommodate the main body of deep array 6600 and provide structural rigidity during insertion procedures. Inner lumen 6315 may provide a dedicated pathway for the deep array probe to pass through deep array 6600 and extend beyond distal portion 6613 for recording from target tissue. Layer 6317 between inner lumen 6315 and outer lumen 6609 may provide electrical insulation or mechanical separation between the two lumens. In some aspects, layerAtorney Docket No.: 00406-0003-003046317 may include microwires extending longitudinally between outer lumen 6609 and inner lumen 6315.

[0242] With continued reference to FIGS. 72A-72D, distal portion 6613 of deep array 6600 may extend beyond cap 6611 during insertion procedures to advance the sEEG electrode toward a target position. Once the sEEG electrode is positioned, the deep array probe may be advanced through inner lumen 6315 and past distal portion 6613 to reach target recording sites. The dual-lumen configuration of deep array 6600 may enable sequential or simultaneous use of the stylet for electrode advancement and probe passage. In some cases, the dual-lumen configuration may enable the deep array probe to be pre-loaded within inner lumen 6315 prior to insertion, allowing for rapid deployment of the probe once the sEEG electrode reaches the target position.

[0243] Referring to FIG. 73, an sEEG electrode 6700 is shown. Electrode 6700 includes a recording span 6799, a bend portion 6797, and an output cable 6795. Recording span 6799 is positioned at a proximal end of electrode 6700 and extends approximately 70mm, designated as a macro recording length. An inner lumen of approximately 75mm is also indicated in this region. Recording span 6799 has an outer diameter of approximately 0.9mm. Electrode 6700 may be configured such that a deep array may be passed through electrode 6700.

[0244] With continued reference to FIG. 73, electrode 6700 has a working length of approximately 250mm. Bend portion 6797 is located at a transition point where electrode 6700 changes direction, allowing electrode 6700 to accommodate anatomical constraints during implantation. The bent configuration at bend portion 6797 may enable positioning of recording span 6799 within target neural structures while routing output cable 6795 away from an insertion site.

[0245] As further shown in FIG. 73, output cable 6795 extends from bend portion 6797 toward a distal end of electrode 6700 and has an outer diameter of 1.5mm. Output cable 6795 terminates at a macro data output section, which facilitates transmission of recorded neural signals. The overall configuration of electrode 6700 enables positioning of recording elements within target neural structures while routing output cable 6795 away from the insertion site through bend portion 6797.

[0246] With continued reference to FIG, 73, the bent configuration of electrode 6700 at bend portion 6797 may accommodate various anatomical constraints encountered during sEEG implantation procedures. In some cases, bend portion 6797 may enable output cable 6795 to be routed along a path that avoids interference with adjacent structures or otherAtorney Docket No.: 00406-0003-00304implanted devices. The flexibility provided by bend portion 6797 may allow for complex cable routing of output cable 6795 into setups that can be permanently fixed to a patient's scalp and properly encapsulated to prevent degradation due to the recording environment. |0247] As further shown in FIG. 73, recording span 6799 may include micro-recording channels positioned along its length for interfacing with neural tissue. The 70mm macro recording length of recording span 6799 may enable acquisition of neural signals from an extended region of brain tissue along an insertion trajectory. In some cases, recording span 6799 may include both macro recording sites and micro recording sites to provide simultaneous acquisition of local field potentials and single-unit activity at different spatial resolutions.|0248] The configuration of electrode 6700 with recording span 6799, bend portion 6797, and output cable 6795 may be suitable for chronic recording applications where the device remains implanted for extended periods. Output cable 6795 may be left resting on a patient's scalp during chronic recordings, with bend portion 6797 providing strain relief at the transition between recording span 6799 and output cable 6795. The bent configuration may absorb movements without risk of damage to electrode 6700 or displacement of recording span 6799 from target recording sites.

[0249] Referring to FIG. 74A, an exemplary' manufacturing configuration 6800 is shown. Exemplary manufacturing configuration 6800 includes a wafer 6825 having a circular shape, although wafer 6825 may have another shape suitable for manufacturing. Positioned on wafer 6825 are a plurality of flex cables 6827 arranged in a pattern. Flex cables 6827 are oriented in various directions across a surface of w afer 6825, w ith each flex cable 6827 featuring an elongated structure with a rectangular portion at one end. Flex cables 6827 are distributed across wafer 6825 in a configuration that increases (e.g., maximizes) use of available surface area. The arrangement show s flex cables 6827 positioned at different angles and locations on wafer 6825, demonstrating a manufacturing layout for producing multiple flex cables 6827 from a single wafer 6825, For example, flex cables 6827 may be positioned on wafer 6825 with bends, such that the flex cables 6827 wind along wafer 6825. Thus, a length of flex cable 6827 may be produced on a wafer 6825 having a substantially shorter length. In some aspects, each flex cable 6827 may be bent once, twice, three times, four times, or more times. Tire bends may have dimensions such that, once flex cables 6827 are removed from wafer 6825, they may be easily straightened. For example, a radius of curvature of the bends of flex cables 6827 on wafer 6825 may be chosen to provide for a desired final, straight configuration of flex cables 6827Atorney Docket No.: 00406-0003-00304

[0250] With continued reference to FIG. 74A, exemplary manufacturing configuration 6800 demonstrates techniques for manufacturing flexible substrates from wafer 6825. A method of manufacturing a flexible substrate may comprise determining a plurality of cut paths on wafer 6825. Each of the cut paths may be configured to increase (e.g., maximize) real estate on wafer 6825. The method may further comprise cutting along the plurality of cut paths on wafer 6825, resulting in cut pieces that are separable from wafer 6825. Cutting wafer 6825 may include cutting through a flex portion of wafer 6825. The method may further comprise forming the flexible substrate from the cut pieces.

[0251] In some aspects, as briefly discussed above, flex cables 6827 may be patterned in a serpentine fashion on wafer 6825 to maximize wafer real estate during microfabrication. The serpentine patterning allows each flex cable 6827 to occupy a longer effective length while remaining within the confines of wafer 6825. The cut path configuration reduces waste by minimizing unused regions between adjacent flex cables 6827. Following release from wafer 6825, the serpentine-patterned flex cables 6827 are straightened for subsequent assembly operations including bonding to substrates.

[0252] As further shown in FIG. 74A, tire ability to design and fabricate deep arrays of varying sizes and lengths may be constrained by a size of wafer 6825 used during microfabrication. To circumvent this constraint, design techniques may be implemented to allow for lengths far exceeding a diameter of wafer 6825 being processed. The plurality of cut paths may include at least one of a U-turn, a zig-zag, winding, spiraling, mirroring, or stacking configuration. These techniques may optimize cable profiles to maximize real estate on wafer 6825.

[0253] With continued reference to FIG. 74A, wafer 6825 may implement a U-turn design technique to double the length of individual flex cables 6827. The U-turn design technique routes flex cables 6827 back on themselves, effectively doubling the length of each flex cable 6827 that can be produced from wafer 6825. By routing flex cables 6827 in a U-tum pattern, the effective length of each flex cable 6827 may exceed the diameter of wafer 6825 while still fitting within the available surface area.

[0254] As further shown in FIG. 74A, wafer 6825 may implement a spiralized technique where extra flex length is mapped closely to a radius of wafer 6825. The spiralized technique may provide strain relief during assembly when flex cables 6827 are straightened for bonding to substrates. By mapping flex cables 6827 closely to the radius of wafer 6825, the spiralized technique may utilize the largest radius possible given the size of wafer 6825, providing strain relief when flex cables 6827 are straightened during subsequent assembly operations.Atorney Docket No.: 00406-0003-00304

[0255] With continued reference to FIG. 74A, the winding technique may route flex cables 6827 in curved paths across wafer 6825 to extend the length of each flex cable 6827 beyond what would be achievable with straight paths. A mirroring technique may position flex cables 6827 in mirrored arrangements to maximize packing density on wafer 6825. A stacking technique may involve multilayer configurations where flex cables 6827 are arranged in overlapping patterns to increase the number of flex cables 6827 that can be produced from a single wafer 6825.

[0256] As further shown in FIG. 74A, when implementing any of these techniques, wafer 6825 may be configured to optimize flex geometry for density as well as strain relief during assembly. The arrangement of flex cables 6827 on wafer 6825 may balance packing density with the strain relief requirements for subsequent straightening and assembly operations. The plurality of cut paths determined on wafer 6825 may be configured to maximize real estate while maintaining sufficient curvature radii to prevent damage to flex cables 6827 during removal from wafer 6825 and subsequent processing.

[0257] FIG. 74B show s an alternative manufacturing configuration 6800’ of flex cables 6827’ on a wafer 6825’. Manufacturing configuration 6800’ may have any feature of manufacturing configuration 6800 but may have a different arrangement of flex cables 6827’ in order to satisfy different design concerns (e.g., the rectangular portions, dimensions, etc.).

[0258] Referring to FIG. 75, a flex cable 6910 connected to a substrate 6920 is shown. Flex cable 6910 extends from a bulbous portion 6910A at one end toward substrate 6920 at an opposite end. Bulbous portion 6910A is depicted with a cross-hatched pattern indicating a rounded, enlarged structure at a terminus of flex cable 6910. Flex cable 6910 exhibits a curved configuration as flex cable 6910 transitions from bulbous portion 6910A toward substrate 6920. Substrate 6920 is shown with diagonal hatching and features a tapered profile that narrows toward a distal end of substrate 6920. The arrangement demonstrates a connection between flex cable 6910 and substrate 6920, with bulbous portion 6910A positioned at a proximal end of the assembly,

[0259] With continued reference to FIG. 75, the geometry' of flex cable 6910 may be configured to provide strain relief during assembly operations. As described previously with respect to exemplary manufacturing configuration 6800, flex cables 6827 may be arranged on wafer 6825 using various techniques including U-turns to extend the length of individual flex cables beyond the diameter of the w'afer. Bulbous portion 6910A of flex cable 6910 demonstrates a geometry that provides strain relief when flex cable 6910 is straightened during bonding to substrate 6920.Atorney Docket No.: 00406-0003-00304

[0260] As further shown in FIG. 75, the cut path used to form flex cable 6910 may include a radius that is approximately 60% of a width of the flexible substrate. In some cases, a 1.2mm cable may have a 0.75mm radius at a turn corresponding to bulbous portion 6910A. The approximately 60% ratio between the radius and the cable width may balance wafer packing density' with strain relief requirements during assembly. Hie added radius of curvature at bulbous portion 6910A provides strain relief during straightening by simulating a larger radius of curvature while ensuring occupied wafer space remains minimal.

[0261] With continued reference to FIG. 75, the geometry' of bulbous portion 6910A may be configured to minimize strain on flex cable 6910 when flex cable 6910 is straightened and bonded to substrate 6920 during assembly. Since flex cable 6910 is straightened during the wrapping process described previously, the radius at bulbous portion 6910A may affect the strain experienced by flex cable 6910 during this operation. A radius that is too small may introduce strain on flex cable 6910 when attempting to straighten and sheath flex cable 6910 during assembly. Tire 60% ratio between the radius and the cable width at bulbous portion 6910A may provide strain relief w'hile maintaining efficient use of wafer surface area during microfabrication.

[0262] Referring to FIGS, 76A and 76B, fabrication path configurations for probe substrates are shown. FIG. 76A depicts a fabrication path 7000 having a curved portion. Fabrication path 7000 has a curved portion 7051 at a top and a straight portion 7052 extending downward. Curved portion 7051 forms a semicircular or U-shaped configuration at a distal end of fabrication path 7000. Straight portion 7052 has a w'idth dimension labeled as x, while curved portion 7051 has an inner width dimension of 0.6x, indicating that curved portion 7051 is narrower than straight portion 7052.

[0263] FIG. 76B depicts an orthogonal view of a fabri cation path 7100 with a bulbous portion. Fabrication path 7100 has a bulbous portion 7151 at a top and a straight portion 7152 extending downward. Bulbous portion 7151 forms a circular or rounded configuration that is widerthan straight portion 7152. Bulbous portion 7151 has an innerwidth dimension of 2x, while straight portion 7152 has a width dimension labeled as x. Fabrication path 7100 demonstrates a design where bulbous portion 7151 is substantially larger than straight portion 7152, in contrast to fabrication path 7000 where curved portion 7051 is narrower than straight portion 7052. For example, a diameter of bulbous portion 7151 may be greater than a distance between the straight portions.

[0264] As further shown in FIGS. 76A and 76B, fabrication path 7000 and fabrication path 7100 represent different geometric configurations for manufacturing probe substratesAtorney Docket No.: 00406-0003-00304with varying dimensional relationships between their curved or bulbous regions and their straight portions. The cut path used to form the flexible substrate may include a first straight portion, a second straight portion, and a bulbous portion therebetween. In fabrication path 7100, straight portion 7152 may serve as the first straight portion, and a corresponding straight portion on an opposite side of bulbous portion 7151 may serve as the second straight portion, with bulbous portion 7151 positioned therebetween.

[0265] With continued reference to FIGS. 76A and 76B, the fabrication path may include a bulbous U-turn with added radius of curvature at a start of the U-turn providing further strain relief during straightening while minimizing occupied wafer space. Bulbous portion 7151 of fabrication path 7100 demonstrates this bulbous U-turn configuration. The added radius of curvature at bulbous portion 7151 provides strain relief during straightening by simulating a larger radius of curvature while ensuring occupied wafer space remains minimal. The 2x inner width dimension of bulbous portion 7151 compared to the x width dimension of straight portion 7152 demonstrates how the bulbous U-turn configuration provides increased curvature radius for strain relief.

[0266] As further shown in FIGS. 76A and 76B, curved portion 7051 of fabrication path 7000 with the 0.6x inner width dimension may minimize wafer space but may introduce greater strain on the flexible cable when attempting to straighten and sheath the cable during assembly. Bulbous portion 7151 of fabrication path 7100 with the 2x inner width dimension may provide additional strain relief where desired while maintaining efficient wafer packing. The selection between fabrication path 7000 with curved portion 7051 and fabrication path 7100 with bulbous portion 7151 may depend on the balance between wafer packing density and strain relief requirements for a particular application.

[0267] Referring to FIG. 77, a series of fabrication paths 7200 is shown. Fabrication paths 7200 are arranged in a graduated sequence, with each path having a similar overall configuration but varying in height. Each fabrication path 7200 includes a bulbous portion 7251 positioned at an upper end and a straight portion 7252 extending downward from bulbous portion 7251. Bulbous portion 7251 has a rounded, loop-like shape that forms a closed curve at a top of each fabrication path 7200. Straight portion 7252 comprises parallel elongated segments that extend vertically from a base of bulbous portion 7251.

[0268] With continued reference to FIG. 77, fabrication paths 7200 are depicted in increasing sizes from left to right, demonstrating a range of configurations where a height of both bulbous portion 7251 and straight portion 7252 progressively increases across the series. This arrangement illustrates various dimensional options for fabrication paths 7200, whichAtorney Docket No.: 00406-0003-00304may be utilized in manufacturing processes for deep array components. The graduated sequence of fabrication paths 7200 demonstrates how the bulbous U-turn configuration with bulbous portion 7251 may be scaled to accommodate different length requirements while maintaining the strain relief benefits of the bulbous geometry.

[0269] In other examples, each bulbous portion 7251 and straight portion 7252 may have a same size, and bulbous portions 7251 may be positioned as shown such that bulbous portions 7251 are nested next to one another. For example, a distal end (a portion that has the double-backed end) of one bulbous portion 7251 (e.g., a left-most bulbous portion) may be positioned next to a proximal portion of an adjacent bulbous portion 7251 to increase a number of fabrication paths 7200 on a wafer.

[0270] As further shown in FIG. 77, bulbous portion 7251 of each fabrication path 7200 may be stacked on wafer 6825 to maintain a packed wafer configuration. The bulbous U-turn configuration of bulbous portion 7251 provides strain relief during straightening while minimizing occupied wafer space compared to configurations using larger radius curves that would consume more wafer surface area. By utilizing the bulbous geometry at bulbous portion 7251, fabrication paths 7200 may achieve strain relief comparable to larger radius configurations while maintaining efficient packing density on wafer 6825.

[0271] With continued reference to FIG. 77, the graduated sequence of fabrication paths 7200 demonstrates how the cut path configuration may be adapted to produce flexible substrates of varying lengths from a single wafer. Each fabrication path 7200 includes the first straight portion and the second straight portion formed by straight portion 7252, with bulbous portion 7251 positioned therebetween. The parallel elongated segments of straight portion 7252 extending from bulbous portion 7251 may be straightened during assembly operations to form the flexible cable that is bonded to the substrate. The bulbous U-turn at bulbous portion 7251 provides the added radius of curvature that enables straightening of straight portion 7252 without introducing excessive strain on the flexible cable.

[0272] Any of the fabrication paths described above may be combined with any of the other fabrication techniques described herein.

[0273] Referring to FIG. 78, a top view of a deep array 7300 with a tearaway portion is shown. Deep array 7300 includes a recording span 7368, a tearaway 7369, and a backend 7370. Recording span 7368 extends from a left side of deep array 7300 and features a series of circular openings arranged in a linear configuration along i ts length. Recording span 7368 connects to tearaway 7369, which is positioned adjacent to backend 7370. Tearaway 7369 includes additional circular openings arranged in rows. Backend 7370 is depicted as aAtorney Docket No.: 00406-0003-00304rectangular structure located at a right side of deep array 7300, containing multiple circular openings arranged in two horizontal rows. Backend 7370 also includes comer features that appear as small circular elements at upper corners of the rectangular structure.

[0274] With continued reference to FIG. 78, deep array 7300 demonstrates a configuration where recording span 7368 extends outward from backend 7370, with tearaway 7369 serving as an intermediate section between recording span 7368 and backend 7370. The configuration of deep array 7300 provides an elongated form factor with recording span 7368 extending outward from backend 7370.

[0275] As further shown in FIG. 78, tearaway 7369 may be configured as a sacrificial backend that can be bonded to an inspection jig. The sacrificial backend configuration of tearaway 7369 may allow for a quick electrical check for shorts and site impedance prior to bonding the flex to an ASIC. Given that failures may arise during the wrapping process described previously, verifying wrapped electrode site impedance before allocating an ASIC may reduce manufacturing cost by consuming fewer ASICs on failed parts.

[0276] With continued reference to FIG. 78, the microfabricated flex may be wrapped prior to flip-chip bonding with a sacrificial contact feature on backend 7370 to verify wrapped electrode site impedance before allocating an ASIC, In this configuration, tearaway 7369 may include the sacrificial contact feature that enables an operator to verify that the wrapped electrode site impedance is within required specifications before allocating an ASIC for final assembly. After electrical inspection is complete, tearaway 7369 may be separated from recording span 7368 to allow bonding of the flex to the ASIC.

[0277] As further shown in FIG. 78, wafer 6825 may include a fabricated trench on a back side of wafer 6825 that is a same size as the substrate. The substrate may be placed and bonded within the fabricated trench before removing the flex from wafer 6825. Tire fabricated trench may provide alignment and support for the substrate during bonding operations.

[0278] With continued reference to FIG. 78, wafer 6825 may include access holes fabricated for precise epoxy dispensing during assembly. The access holes may enable controlled application of bonding agent to specific locations on the flex or substrate without risk of overflowing epoxy occluding micro-recording sites on recording span 7368.

[0279] A silicon alignment wafer may contain alignment features such as pegs, holes, or trenches for dropping the substrate onto the flex. The alignment features on the silicon alignment wafer may enable precise positioning of the substrate relative to recording spanAtorney Docket No.: 00406-0003-003047368 during assembly operations. In some cases, the alignment features may be fabricated directly onto a carrier wafer for improved substrate alignment and efficient assembly.

[0280] As further shown in FIG. 78, wafer 6825 may be microfabricated to include electrical inspection features to aid in debugging manufacturing issues or inspecting the flex. The electrical inspection features may enable verification of flex integrity prior to bonding to the substrate or ASIC,

[0281] With continued reference to FIG. 78, the flex may include a fabricated trench or ridge to capture or disperse bonding agent that may risk occluding micro-recording sites during assembly. The fabricated trench or ridge may be positioned adjacent to recording span 7368 to prevent epoxy from flowing onto tire micro-recording sites during bonding operations.

[0282] The flex may include a fabricated sacrificial layer or coating such as photoresist over the micro-recording sites. The sacrificial coating may preserve site integrity during the assembly process. Hie sacrificial layer or coating may be wiped or dissolved away prior to final packaging to expose the micro-recording sites for interfacing with neural tissue.

[0283] As further shown in FIG. 78, the flex may be microfabricated as a lattice to promote tissue growth and recovery and probe longevity during chronic implantation. The lattice configuration of the flex may include openings or perforations that allow tissue to grow through the flex structure. The flex portion may include a lattice to promote tissue growth thereon, as described previously with respect to the method of manufacturing a flexible substrate. The lattice structure may improve integration of the probe with surrounding tissue during chronic recording sessions by providing a scaffold for tissue ingrowth.

[0284] Referring to FIG. 79, a wafer 7411 with trenches 7412 formed thereon is shown. Wafer 7411 has a circular disc shape characteristic of semiconductor wafers used in microfabrication processes. Trenches 7412 are arranged in a parallel configuration across a central rectangular region of wafer 7411. Trenches 7412 extend in a diagonal orientation relative to wafer 7411, forming a series of uniformly spaced linear features. The parallel arrangement of trenches 7412 on wafer 7411 may be utilized in the fabrication of components for deep array devices, such as substrates or flex cables. Trenches 7412 occupy a substantial portion of a surface area of wafer 7411 while leaving peripheral regions of wafer 7411 unoccupied.

[0285] With continued reference to FIG. 79, trenches 7412 may be formed on a second side of wafer 7411, such as a backside of wafer 7411. The method of manufacturing aAtorney Docket No.: 00406-0003-00304flexible substrate, as described previously with respect to exemplary manufacturing configuration 6800, may further comprise fabricating a plurality of trenches on the second side of wafer 7411. Each trench of trenches 7412 may be a same size as the substrate. The sizing of trenches 7412 to match the substrate dimensions enables precise alignment and positioning of the substrate within trenches 7412 during assembly operations.

[0286] As further shown in FIG. 79, trenches 7412 may be formed through backside etching of wafer 7411. The backside etching process may create recessed features in wafer 7411 that correspond to the dimensions of the substrate. A substrate (e.g., a core) may be placed within one of trenches 7412 and bonded to the flex before removing the flex from wafer 7411. The recessed geometry of trenches 7412 may hold the substrate in a fixed position during bonding operations, ensuring alignment between the substrate and the recording span of the flex cable.

[0287] With continued reference to FIG. 79, the fabrication of trenches 7412 on the second side of wafer 7411 may facilitate substrate placement and bonding during assembly. By forming trenches 7412 with dimensions matching the substrate, the substrate may be dropped into one of trenches 7412 where the substrate is held in position by the walls of the trench. The flex cable positioned on a first side of wafer 7411 may then be bonded to the substrate (e.g., core) held within the corresponding trench on the second side of wafer 7411. After bonding is complete, the flex cable with the bonded substrate may be removed from wafer 7411.

[0288] As further shown in FIG. 79, the alignment features provided by trenches 7412 may improve assembly efficiency and reduce manufacturing variability. The precise sizing of each trench of trenches 7412 to match the substrate dimensions may eliminate the need for manual alignment during bonding operations. In some cases, trenches 7412 may be fabricated directly onto a carrier wafer for improved substrate alignment and efficient assembly, as described previously with respect to the microfabrication techniques for deep array components.

[0289] The trenches described above may be combined with any of the other manufacturing techniques described herein.

[0290] The wafers described herein may additionally or alternatively include processing steps for hermetic packaging and biocompatibility. A parylene C coating may be deposited on wafer 6825 to provide a conformal barrier layer that protects the microfabricated flex from moisture and biological fluids. The parylene C coating may be applied through chemical vapor deposition to achieve uniform coverage across the recording sites and interconnectAtorney Docket No.: 00406-0003-00304lines. In some cases, a silicone overmold may be applied to portions of the flex cable to provide mechanical protection and strain relief at transition regions. The silicone overmold may be selectively applied to leave recording sites exposed while encapsulating interconnect lines and bond regions. Other hermetic packaging options may include atomic layer deposition of aluminum oxide or titanium oxide barrier layers, or application of medical grade epoxy encapsulation at critical interfaces. The combination of parylene C coating with silicone overmold or other hermetic packaging options may extend the operational lifetime of the deep array in chronic implant applications by preventing degradation of the microfabricated structures due to exposure to the biological environment.

[0291] The sheathed shank may be comprised of a thin-walled 26G stainless-steel hypodermic tube. The thin-walled 26G stainless-steel hypodermic tube may be filed down to a desired length depending on application requirements. The filing procedure may enable customization of the sheathed shank length to match specific recording depths or target tissue geometries.

[0292] The sheathed shank may alternatively be comprised of heat-shrink material. Heat-shrink material may conform to tire underlying substrate and flexible cable when heated, providing a protective covering that closely follows the contours of the wrapped electrode assembly. In some cases, the heat-shrink material may provide electrical insulation for tire interconnect lines running along the length of the sheathed shank.

[0293] The sheathed shank may alternatively be comprised of polyimide tubing.Polyimide tubing may provide a thin-walled protective covering with biocompatibility suitable for neural interface applications. The polyimide material may offer flexibility while maintaining structural integrity during insertion procedures.

[0294] The sheathed shank may alternatively be comprised of glass. Glass materials may provide optical transparency that enables visual inspection of the underlying flexible cable and substrate. In some cases, glass materials may be selected for compatibility with optical stimulation or imaging modalities,

[0295] The sheathed shank may alternatively be comprised of ceramics. Ceramic materials may provide mechanical strength and biocompatibility for chronic implantation applications. The ceramic sheath may offer electrical insulation properties that prevent interference between the recording channels and surrounding tissue.

[0296] The sheathed shank may alternatively be comprised of PTFE materials. PTFE materials may provide a low-friction surface that facilitates insertion through tissue. In some cases, the sheathed shank may be comprised of braided-PTFE materials that combine theAtorney Docket No.: 00406-0003-00304low-friction properties of PTFE with increased mechanical strength from the braided construction.

[0297] The sheathed shank may include a super-thin walled polyimide sheath. The superthin walled poly imide sheath may minimize the overall diameter of the sheathed shank to reduce tissue displacement during insertion. In some cases, preserving the integrity of a targeting brain region by minimizing tissue damage may be desirable, and the super-thin walled polyimide sheath may address this consideration by using the smallest possible sheath that still protects the traces along the length of the shank.

[0298] The super-thin walled polyimide sheath may include precisely etched holes that align exactly to the recording span. The precisely etched holes may provide access for the recording channels to interface with surrounding neural tissue while the remainder of the flexible cable remains protected by the polyimide sheath, The alignment of the precisely etched holes to the recording span may enable signal acquisition through the holes while maintaining protection of the interconnect lines outside the recording span region.

[0299] The super-thin walled polyimide sheath may alternatively include a window that aligns exactly to the recording span. The window may be a larger opening in the polyimide sheath that exposes the entire recording span for interfacing with neural tissue. The precise alignment of the window to the recording span may ensure that all recording channels are accessible for signal acquisition while the interconnect lines remain protected by the polyimide sheath on either side of the window. In some cases, the window configuration may be selected over the precisely etched holes configuration when a continuous exposed recording span is desired for a particular application.

[0300] A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the disclosure. Accordingly, other implementations are within the scope of the following claims.

Claims

Atorney Docket No.: 00406-0003-00304CLAIMSWe claim:

1. A method of manufacturing a portion of a probing device comprising: forming a plurality of cables on a wafer, wherein a length of each cable of the plurality of cables is greater than any dimension of the wafer; andcutting through a flexible portion of the wafer to separate the plurality of cables from the wafer.

2. The method of claim 1, wherein, prior to cutting through the flexible portion of the wafer, the plurality of cables each has a first straight portion, a second straight portion, and a bulbous portion therebetween.

3. The method of claim 2, wherein a diameter of the bulbous portion is greater than a distance between the first straight portion and the second straight portion.

4. The method of claim 3, wherein a proximal end of a first bulbous portion of a first cable of the plurality of cables is adjacent to a distal end of a second bulbous portion of a second cable of the plurality of cables.

5. The method of claim 1, further comprising: positioning a substrate in a trench on a backside of the wafer and bonding the substate to a cable of the plurality of cables cable before separating the cable from the wafer.

6. The method of claim 5, further comprising: etching the trench on the substrate.

7. The method of claim 1, wherein at least two of the plurality of cables are stacked on top of one another prior to cutting through the flexible portion of the wafer.

8. A probing device comprising:a casing;a cable extending from the casing;a substrate having a plurality of recording channels; andAtorney Docket No.: 00406-0003-00304a chip disposed between the cable and the substrate, wherein the chip is configured for mating to a micro-drive.

9. The device of claim 8, wherein the chip is further configured to align the cable and the substrate.

10. The device of claim 8, wherein the cable is a first cable, wherein the device further comprises a second cable, wherein the second cable is configured to connect to the chip.

11. The device of claim 8, wherein the substrate is wrapped with the plurality of recording channels.

12. The device of claim 8, wherein the plurality of recording channels extend proximally and distally along the substrate in a hybrid mapping configuration.

13. The device of claim 8, wherein the substrate is configured for insertion into brain tissue.

14. The device of claim 8, wherein the casing includes a first portion and a second portion, wherein the second portion includes a feature configured to couple the casing to a jig-15. The device of claim 8, wherein at least two PCBs are disposed within the casing, and wherein the at least two PCBs are in a stacked configuration.

16. The device of claim 8, wherein the at least two PCBs share a single shank.

17. A probing device comprising:a stage having a central opening, a top surface, and a bottom surface;a first recording tower extending from the top surface;at least one printed circuit board fixed to a side surface of the first recording tower; andAtorney Docket No.: 00406-0003-00304a plurality of testing probes extending from the at least one printed circuit board and through the central opening, wherein each of the plurality of testing probes is configured for insertion into a brain tissue.

18. The device of claim 17, further comprising a second recording tower extending from the top surface, wherein the second recording tower includes:at least one printed circuit board fixed to a side surface of the second recording tower; anda second plurality of testing probes extend from the at least one printed circuit board of the second recording tower and through the central opening, wherein each of the second plurality of testing probes is configured for insertion into brain tissue.

19. The device of claim 17, wherein the first recording tower and the second recording tower are disposed on opposite sides of the stage.

20. The device of claim 17, further comprising a third recording tower extending from the top surface, wherein the third recording tower includes:at least one printed circuit board fixed to a side surface of the third recording tower; and a third plurality of testing probes extend from the at least one printed circuit board of tire third recording tower and through the central opening, wherein each of the third plurality of testing probes is configured for insertion into a brain tissue.

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