73results about How to "Increased manufacturing flexibility" patented technology

A chassis having systems responsive to a nonmechanical control signals and a simplified body-attachment interface includes preassembled modules to enhance ease and simplicity of chassis assembly. The chassis is preferably configured to minimize the possibility of a preassembled module being incorrectly positioned within the chassis. Methods for advantageously employing preassembled modules to assemble vehicle chassis are also provided.

The anti-fake pesticide-germicide is prepared with boron, saponin, pyrethroid, organophosphorus pesticide and alcohol. After the pesticide-germicide is set into various kinds of dry small mouth bottle with the lid opened for 0.25-2 hr, white snowflake-like crystal will grow around the bottle mouth, and this makes it possible for the user to identify the truth of the pesticide-germicide. Compared with pesticide-germicide of alone pyrethroid and organophosphorus pesticide, the pesticide-germicide of the present invention has greatly raised effect, lowered toxicity, lowered cost and reduced consumption.

The invention provides an apparatus and methods for automatically modifying a computer model of an object to comply with a manufacturing constraint for production of the object. In one embodiment, the invention uses a voxel-based approach to automatically modify an arbitrarily-shaped model at any stage of the design process. For example, a method of the invention automatically modifies a model of a molded object to comply with a draft angle requirement.

A method of resistance spot welding a steel workpiece and an aluminum or aluminum alloy (“aluminum”) workpiece together includes several steps. One step involves providing a workpiece stack-up with a steel workpiece and an aluminum workpiece. Another step involves attaching a cover over a weld face of a welding electrode. The cover is made of a metal material with an electrical resistivity that is greater than an electrical resistivity of a material of the welding electrode. Yet another step involves performing multiple individual resistance spot welds to the workpiece stack-up. The cover abuts the aluminum workpiece while the individual resistance spot welds are performed. And another step involves removing the cover from the welding electrode after the individual spot welds are performed.

An improved light-emitting display having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large trigger voltage is supplied across the micro-component by up to two triggering electrodes and ionization can be maintain by a sustain voltage supplied by up to two sustain electrodes. The display is further divided into a plurality of panels that can be individually addressed in parallel, preferably directly through the back of the panels and can include voltage multiplying circuitry to decrease the power demands for addressing circuitry. Alternative methods of addressing the micro-components include the use of directed light and arrangements of electrodes to address multiple micro-components with a single electrode.

A light emitting diode (LED) light engine includes a solid transparent dome mounted on one or more LED dies to form a base module, a flexible sheath having embedded therein a phosphor that converts light of a first wavelength range to light of a second wavelength range, the sheath being attached to the base module so that the sheath conforms to a light emitting surface of the dome. The sheath emits light of the second wavelength range when the LED is emitting light of the first wavelength range. Further sheaths may be formed each with different phosphors or phosphor blends, and one of the sheaths may be selected to cover the base module depending on the color of light to be produced by the light engine.

A sealed cushion construction for an airbag for protecting the occupants of a vehicle during a collision. The construction may include at least two fabric panels that are connected by a seam that may be composed of an adhesive/sealant material. The seam may include sewing to reinforce the seam. Placement of the sewing within the boundaries of the seam may be designed to provide strength to the seam. The seam may have sewing along 100% of the length of the seam, less than 100% of the length of the seam, or not have any sewing along its length.

A reflector assembly for a lighting apparatus, the reflector assembly comprising two or more reflector modules configured for associating with one or more light sources, each reflector module comprising one or more reflectors for being located adjacent to alight source when the reflector module is associated with the one or more light sources, the one or more reflectors configured to reflect light from the adjacent light source. The reflector modules may further comprising a cover plate defining a plurality of light source apertures for allowing a light source to protrude through the cover plate, at least a first of the one or more light source apertures disposed adjacent to an overhead reflector and at least a second of the one or more light source apertures disposed adjacent to a lateral reflector. The reflector assembly can comprising any number of reflector modules and the reflector modules can be arranged in different configurations to create different light distributions with the same reflector modules.

A manufacturing method of thin film transistors is provided. The manufacturing method includes: providing a substrate; forming a gate electrode; forming a gate insulating layer; forming a patterned oxide semiconductor layer; forming a source electrode and a drain electrode; and executing a localized laser treatment. A laser beam is used to irradiate at least a part of the patterned oxide semiconductor layer in the localized laser treatment. An electrical resistitivity of the patterned oxide semiconductor layer irradiated by the laser beam is lower than an electrical resistitivity of the patterned oxide semiconductor layer without being irradiated by the laser beam.

The invention belongs to the field of filament additive manufacturing, and discloses a polymer multi-material high-flexibility laser additive manufacturing system and a method thereof. The system comprises a first robot arm, a second robot arm, a positioner, a rotational extrusion nozzle in which a plurality of extrusion modules are disposed and a laser, each extrusion module is used for extruding one kind of filament, and the rotational extrusion nozzle is connected with the first robot which drives the rotational extrusion nozzle to move according to a preset trajectory; the laser is connected with the second robot, and is used for emitting a laser to fuse the filament extruded from the rotational extrusion nozzle, and through the cooperative motion of the first robot and the second robot, the extrusion and fusion of the filament are performed synchronously; the positioner serves as a forming mesa, and the rotation of the positioner cooperates with the motions of the two robots. With the present invention, problems such as easy blocking and short service life of the extrusion nozzle in the FDM forming are solved, thereby ensuring high flexibility of the manufacturing system and achieving the extrusion forming of the multi-material filaments.

Computer based systems and methods for designing and manufacturing consumer products, including knit footwear uppers, and the like. The system provides digital controls for the customization of knitted components, including complex multi-structured knitted components. The system simulates deformations of knit structures and allows the user to control and visualize compensations in the structure(s) of the knitted component to better match between an intended knit design and the actual physical knitted component outcome. They system may manufacture/fabricate a knitted component based on the predicted/estimated deformation behavior of the knit.

A semiconductor integrated circuit with high Q inductors and capacitors is disclosed. A semiconductor electrical circuit is formed on a first die, while micro-electromechanical structures having inductance and capacitance are formed on a second die. The second die is attached and electrically connected to the first die as a flip chip.

A light emitting diode illumination device comprises a light-transmitting encapsulant, a transparent core, a light source plate stereoscopic structure and a power supply device. The light-transmitting encapsulant and the transparent core can be made of glass material. The light source plate stereoscopic structure is constituted by a plurality of connecting sub-light source plates. The light source plate stereoscopic structure installed in the light-transmitting encapsulant is connected to the transparent core, and is supported by the transparent core. The sub-light source plate comprises a circuit board body and light-emitting diode dies. The light-emitting diode dies can be installed on one surface of the circuit board body by surface-mount technology. The power supply device is used for supplying power to the sub-light source plates, so that a plurality of sub-light source plates may provide illumination through the light-transmitting encapsulant.

A semiconductor package with improved height uniformity of solder cap bumps therein is disclosed. In one embodiment, the semiconductor package includes a semiconductor substrate comprising a plurality of pads spacedly disposed on a top surface of the substrate, and a passivation layer formed on top of the pads, wherein a plurality of pad openings are created to expose at least a portion of the pads; a plurality of solder cap bumps formed at the pad openings of the passivation layer; and a carrier substrate having a plurality of bond pads electrically connected to the solder caps of the solder cap bumps on the semiconductor substrate. The solder cap bump includes a solder cap on top of a conductive pillar, and a patternable layer can be coated and patterned on a top surface of the conductive pillar to define an area for the solder ball to be deposited. The deposited solder ball can be reflowed to form the solder cap.

The present invention relates to a high frequency surface acoustic wave device, which may be manufactured by the same manufacturing equipment, and with the same material, as those required for manufacturing a low frequency surface acoustic wave device. The disclosed high frequency surface acoustic wave device comprises: a piezoelectric substrate; a high acoustic velocity layer formed on the surface of the piezoelectric substrate whose acoustic velocity of the surface acoustic wave is larger than 5000 m/sec; an input transducing part; and an output transducing part; wherein the input transducing part and the output transducing part are formed in pair on or below the surface of the high acoustic velocity layer. Besides, the high acoustic velocity layer is preferably made of aluminum oxide, and formed on the surface of the piezoelectric substrate by an electron-beam evaporation process. The thickness thereof is preferably between 2 μm and 20 μm.

A negative differential resistance (NDR) transistor includes a gate stack formed from a gate, a barrier layer, and a dielectric layer formed between the gate and barrier layer. To enable the NDR characteristic of the transistor, the barrier layer is configured to dynamically transfer charge carriers to and from the channel region of the transistor (e.g., to a charge storage node between the barrier layer and the dielectric layer), thereby adjusting the threshold voltage of the transistor. An NDR transistor can also be formed with a gap between the edge of the source region and the edge of the gate (stack) to enhance the electric field in the portion of the channel region corresponding to the gap. The enhanced electric field can concentrate the distribution of charge carriers removed from the channel region in the proximity of the source region, thereby enhancing the NDR performance of the transistor.

The invention discloses a factory intelligent early-warning system which comprises the following successively connected modules: a multivariate heterogeneous data fusion processing module which collects monitoring data generated by each system of a factory and performs fusion on mass multivariate heterogeneous data based on xml technology, and performs processing through statistics methods such as sampling and normalization; a machine learning module which performs training learning on data that are generated by the multivariate heterogeneous data fusion processing module and performs continuous adjustment for generating a neural network system model which is related with fault data and fault phenomena and is used for analyzing the multivariate heterogeneous data that are generated in a subsequent production system and performing forecasting; and an information early-warning module which intelligently pushes an analysis result that is generated by the machine learning module to related management personnel for reminding. According to the factory intelligent early-warning system, through directly using a deep learning neural network system which is established according to deep learning technology in analytical forecasting for real-time mass data of the factory, high efficiency and high intelligence are realized, and furthermore factory management by the people is facilitated in an automatic evolution manner.