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Power divider and RF transceiver system

A power divider and loop technology, applied in diversity/multi-antenna systems, transmission systems, space transmit diversity and other directions, can solve problems such as affecting antenna performance, design difficulties, and narrowing of scanning angles.

Active Publication Date: 2017-08-11
WISTRON NEWEB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to connect the signals between different layers, via holes are often used as bridges; however, the transmission of signals between different layers only depends on the via holes passing through the layers. When the position of the via holes is different due to process variation or error When changing, it often causes a frequency shift and reduces the performance of the overall system
Since radar is mostly used in the microwave frequency band, the higher the operating frequency, the longer the distance traveled by the connecting column. When it is close to a quarter wavelength, the problem of impedance matching will become more serious, which will make the design more difficult. Along with this, the antenna gain will also be reduced, which will lead to the dilemma of shorter detection distance and narrower scanning angle.
[0003] Therefore, how to avoid the frequency shift and affect the performance of the array antenna due to the process error of different layers of wiring has become the goal of the industry.

Method used

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  • Power divider and RF transceiver system
  • Power divider and RF transceiver system
  • Power divider and RF transceiver system

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Embodiment Construction

[0034] Please refer to figure 1 , figure 1 It is a schematic diagram of a radio frequency transceiver system 10 according to an embodiment of the present invention. The radio frequency transceiver system 10 may be a microwave transceiver network of a radar system, such as an array antenna for a vehicle, and is not limited thereto. The radio frequency transceiver system 10 is roughly arranged on the same plane, such as the bottom or upper layer of a circuit board, which includes a transmission power distributor 12, a reception power distributor 14, a radio frequency signal processing unit 16, a transmission array antenna 18, and a receiving array Antenna 20 and loop couplers 22, 24, 26. For the transmission operation, the radio frequency signal processing unit 16 converts the differential mode signal to be transmitted into a single-ended signal through the ring coupler 22 and transmits it to an input end IPTx of the transmission power distributor 12; the transmission power distr...

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Abstract

A power divider and a radio frequency transceiver system. The radio frequency transceiver system includes a radio frequency signal processing unit, a transmitting microwave network and a receiving microwave network, wherein the transmitting microwave network includes a transmission power divider to concentrate the main energy of the transmission signal on the central two sub-arrays of the four sub-arrays, And the receiving microwave network includes a receiving power divider so that the main signal energy of a receiving path is provided by a first input end and a second input end, and the main signal energy of another receiving path is provided by the second input end and a second input end. A third input terminal is provided.

Description

Technical field [0001] The present invention relates to a power distributor and a radio frequency transceiver system, in particular to a power distribution capable of effectively increasing the gain of an array antenna, reducing the area of ​​the array, optimizing the antenna radiation pattern, reducing reflection loss, and improving the side beam suppression capability And radio frequency transceiver system. Background technique [0002] The array antenna is an antenna system composed of multiple identical antennas arranged according to a certain rule, and is widely used in radar systems. The common array antenna system is realized by the printed circuit board manufacturing process, and the antenna and the power divider are arranged in different layers of the substrate. In order to connect the signals between different layers, via holes are often used as bridges; however, the signal transmission between different layers only depends on the connecting pillars through the layers....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/40H04B7/06H04B7/08H01Q21/00
Inventor 黄国书陈毅山许政雄萧兴隆
Owner WISTRON NEWEB