Cooling equipment

Abstract

The present invention relates to a cooling device (1) for cooling a component (101), the cooling device comprising: a base plate (2) which can be connected to the component (101) to be cooled in a heat-conducting manner; a deflection region (3); an intermediate region (4) between the base plate (2) and the deflection region (3); and a cooling element (5) which is designed in a zigzag shape and has a plurality of intermediate segments (51) and a plurality of deflection segments (52), wherein the intermediate segments (51) extend from the base plate (2) to the deflection region (3), respectively, wherein the deflection segments (52) form a reversing portion inside the base plate (2) and inside the deflection region (3) and respectively connect the two intermediate segments (51) to each other, wherein the cooling element (5) is filled with a working medium which is present in the cooling element (5) in both gaseous and liquid forms, and wherein the intermediate segment (51) has a plurality of channels (53).

Description

Technical Field

[0001] The invention relates to a cooling device for cooling a component and an electronic apparatus. Background Art

[0002] Typically, power semiconductors in power electronics conduct high currents, which can result in high heat losses. It is often necessary to cool such power semiconductors, for example to avoid damage due to overheating. Liquid cooling or air cooling is usually used for this purpose. Summary of the invention

[0003] In contrast, the cooling device according to the invention offers the advantage of improved cooling of components, wherein overheating of the components is reliably avoided by a particularly reliable and robust construction. This is achieved according to the invention by a cooling device comprising a base plate, which can be connected to the component to be cooled in a heat-conducting manner. In addition, the cooling device has a deflection region and an intermediate region, wherein the intermediate region is arranged between the deflection region and the base plate. In addition, the cooling device comprises a cooling element. The cooling element is designed in a zigzag shape and has a plurality of intermediate segments and a plurality of deflection segments. In this case, a shape having a plurality of reversing portions in a plane is particularly preferably considered a "zigzag shape". For example, a zigzag shape can also be referred to as a serpentine shape.

[0004] The middle sections of the cooling element extend from the base plate to the deflection region. The deflection sections form a reversing section inside the base plate and inside the deflection region. Each deflection section connects two middle sections to each other. That is, the cooling element is arranged in the middle region and extends from the middle region into the base plate or the deflection region in each reversing section.

[0005] The base plate is preferably formed of aluminum to enable good heat conduction and thermal connection of the component and effective heat removal from the component. It is also preferred that the cooling element is also formed of aluminum to enable a cost-effective and well-heat-conducting connection to the base plate, such as a brazed connection.

[0006] In addition, the cooling element is filled with a working medium, which is present in the cooling element in gaseous and liquid form, in other words, in partly gaseous form and partly liquid form. That is, the working medium is present in the cooling element in two phases. In particular, gas bubbles and a liquid column are present simultaneously inside the cooling element. Preferably, the gas bubbles and the liquid column have volumes of similar size at a rated temperature. It is particularly preferred that the gaseous portion of the working medium occupies 30% to 70% of the internal volume space of the cooling element at the rated temperature, wherein the remaining internal volume space is occupied by the liquid portion of the working medium. Depending on the temperature of the cooling device, the volume ratio changes here due to the vaporization or condensation of the working medium.

[0007] The cooling element is preferably tubular. The cooling element is preferably closed. For this purpose, the cooling element preferably has a connecting region, which is preferably located within the deflection region and forms a closed circuit of the cooling element. It is also preferred that the cooling element has a valve, in order to be able to evacuate the cooling element and fill it with a working medium, for example.

[0008] The intermediate section has a plurality of channels, preferably at least 4, preferably at least 8, particularly preferably at least 20 channels. The working medium is located in the interior of the channels. Each channel preferably forms a cavity in which the working medium is accommodated. The channels are preferably arranged parallel to one another and next to one another. In particular, the channels are arranged in a direction perpendicular to the plane in which the cooling element is designed in a meandering manner.

[0009] When heat is supplied to the base plate, that is, when components adjacent to the base plate are heated, the heat is transferred from the base plate to the cooling element together with the working medium located therein. As a result, a phase change and a flow of the working medium inside the cooling element can be generated, thereby transporting heat from the base plate in the direction of the middle area. At the surface of the cooling element, in particular the middle area, the heat is released to the surrounding air by convection. In particular, this results in a particularly irregular, pulsating or oscillating phase change of the working medium. Likewise, in particular, a pulsating or oscillating flow of the working medium is present in the cooling element. The cooling device thus works according to the principle of a pulsating heat pipe.

[0010] In this case, a particularly good cooling effect can be achieved by means of a plurality of channels of the cooling element. Each channel advantageously forms a separate pulsating heat pipe. In particular, no energy supply, for example electrical energy, is required, but rather the cooling device operates as a passive cooling element. As a result, the cooling device provides a particularly effective method for cooling power electronics and can remove waste heat in the range of several kilowatts.

[0011] Preferred improvements of the present invention are described below.

[0012] Preferably, the middle section is surrounded by cooling fins. It is particularly preferred that the entire empty volume space of the middle area is filled with cooling fins. In this case, in particular, the empty areas between the meandering turns of the cooling element are filled with cooling fins. In this case, the cooling fins can have any geometric shape. For example, straight, plate-shaped cooling fins are particularly simple and cost-effective. As an alternative or supplement, the cooling fins preferably have a corrugated, in particular sinusoidal cross-section. It is particularly preferred that, as an alternative or supplement, the cooling fins are formed in the form of so-called offset strip fins, louvered fins, deep corrugated fins or smooth fins. For simple and cost-effective production and a well-heat-conducting connection, the cooling fins are preferably formed from aluminum and are connected to the cooling element, in particular by means of a brazing connection.

[0013] The cooling element is preferably designed as a single piece as a meander-shaped multichannel tube. In particular, the channels thus each extend within the total length of the cooling element. The deflection segment is preferably designed in a U-shaped manner and has a predefined bending radius. The bending radius can in particular have a minimum value, which depends, for example, on the production of the multichannel tube. This results in a cooling element that can be produced particularly simply and cost-effectively and that allows effective heat removal from the base plate. For particularly simple manufacturability, the intermediate segments can be designed parallel to one another.

[0014] It is particularly preferred that the deflection segments arranged inside the base plate and / or inside the deflection region directly adjoin one another. Preferably, the deflection segments are thus in contact with one another, in particular at their outer radius. In other words, the deflection segments are packed as tightly as possible so that the greatest possible number of deflection segments can be accommodated in the base plate for a particularly high cooling power per unit area with a small space requirement. In this case, the intermediate segments can be inclined or bent toward one another, for example, in order to enable a compact arrangement of the deflection segments.

[0015] Preferably, the deflection section on the deflection region side has a larger bending radius than the deflection section on the base plate side. As an alternative or in addition, the lateral spacing between the middle sections is at least partially enlarged. This enlarges the cooling volume available for the cooling fins, that is, in particular the free volume in the middle region, in order to achieve particularly good heat removal and thus a high cooling capacity.

[0016] It is also preferred that each deflection segment of the base plate has a groove. In this case, each base plate-side deflection segment is arranged in a groove. In this case, the radius of the groove is particularly adapted to the outer radius of the deflection segment in order to provide a contact surface that is as large as possible. In this case, the cooling element and the base plate are preferably connected to each other in the region of the groove by means of a material-locked connection. The material-locked connection is preferably a brazed connection. This ensures a particularly simple and cost-effective manufacturability of the cooling device and ensures a good thermally conductive contact between the plate and the cooling element.

[0017] Preferably, each groove of the base plate has an insert. The insert is arranged on the inner side of the deflection segment, in particular at the inner radius, and can be designed in such a way that it forms a flush arrangement with the base plate. Here, the insert preferably has a cross section in the shape of an arc. It is particularly preferred that the insert and the deflection segment and / or the base plate are connected to each other by means of a material-locked connection, preferably a brazed connection. This creates a particularly large number of surfaces that can be used for heat transfer. The insert is preferably formed of aluminum. The insert and the base plate can preferably be formed of the same aluminum alloy or, as an alternative, of different aluminum alloys.

[0018] The cooling element is preferably constructed in a multi-piece manner. Here, each intermediate segment is constructed as a particularly straight pipe, which connects the base plate and the deflection area to each other. Preferably, all intermediate segments are constructed identically so that the cooling device can be manufactured particularly simply and cost-effectively. For example, the intermediate segments can be connected to the base plate and to the deflection area, which is particularly constructed as a plate, respectively by means of a brazing connection. Preferably, the intermediate segments are respectively constructed as straight multi-channel pipes, which are particularly arranged parallel to each other. It is particularly advantageous that the deflection segments are respectively constructed as channels inside the base plate and / or inside the deflection area, which is particularly plate-shaped. Here, the intermediate segments are preferably partially inserted into the corresponding deflection area so as to pass into the deflection area. Such a design, for example, allows the arrangement of the intermediate segments and the deflection segments at right angles to each other. There is no need to comply with the minimum bending radius, so that the intermediate segments can be arranged more closely. In particular, a larger number of intermediate segments can be arranged under the same predefined width of the cooling device, so that particularly effective cooling can be performed.

[0019] It is particularly preferred that each deflection segment has a unique deflection channel, into which all channels of the two intermediate segments connected by the corresponding deflection segment lead. That is, the deflection channel is configured as a cavity, into which all channels of the adjacent intermediate segments lead accordingly. It is particularly preferred that the deflection region is configured in a plate-like manner, in particular in the same manner as the base plate. The base plate and the deflection region are preferably configured in two parts as two plates joined to each other. Here, preferably each intermediate segment of the first plate has a through hole, through which the intermediate segment is inserted. The second plate can preferably have a recess, such as a groove or a blind hole, forming a cavity, into which the channel of the intermediate segment leads. Here, two through holes arranged side by side and the recess connecting the two through holes form a deflection segment accordingly. This results in a particularly simple and cost-effective manufacturability of the cooling device, wherein a particularly large number of intermediate segments can be provided under small dimensions.

[0020] It is also preferred that each deflection segment has a plurality of deflection channels. In this case, each deflection channel connects two channels of two intermediate segments connected by the corresponding deflection segment to one another. Thus, each channel of the cooling element preferably extends through the entire cooling element, wherein each channel forms a separate, in particular closed cavity. Here, the deflection region and the base plate are preferably configured as two-piece plates, in particular as described in the previous paragraph, wherein the deflection segment is configured as a combination of two through holes in the first plate and a recess in the second plate. Here, the recess can have a plurality of partition walls, so that, for example, a plurality of parallel grooves are present in order to form a plurality of channels. As a result, the working medium in the corresponding channel is correspondingly retained in the corresponding channel and undesired pressure compensation is prevented.

[0021] It is particularly preferred that the working medium has a critical temperature that is greater than the maximum operating temperature. Preferably, the working medium has a critical temperature of at least 233 K, preferably at least 273 K, particularly preferably at least 373 K, and in particular a maximum of 533 K. In this case, the temperature of the material at the critical point is regarded as the critical temperature. This ensures that the working medium can be in the interior of the cooling element in the form of two phases within a preferred operating range, in which the working medium is in particular at a temperature of 222 K to 473 K, in particular 273 K to 373 K. Preferably, the working medium is an organic refrigerant used, for example, in vehicle air conditioning, such as in particular 2,3,3,3-tetrafluoropropene (also known as R1234yf), R1233zd (E) or the like. It is particularly preferred that the working medium has a melting point of a maximum of 273 K, preferably a maximum of 233 K, and particularly preferably a maximum of 213 K.

[0022] The cooling device preferably also has a blower which is designed to generate a cooling air flow. The blower is arranged in such a way that the generated cooling air flow is directed toward the cooling fins, that is to say runs along the cooling fins. This results in a particularly effective heat removal from the cooling fins by means of forced convection. The cooling air flow is advantageously perpendicular to the plane in which the meandering shape of the cooling element is defined.

[0023] The cooling fins are preferably designed in such a way that the cooling fin surface increases in the flow direction of the cooling air flow. It is particularly preferred that the cooling fin surface increases linearly in order to compensate for the increasing air temperature when the cooling air flows through the middle region. This allows effective cooling even with a larger number of channels in the middle section, that is, with a larger longitudinal extension. For example, the increase in the cooling fin surface can be achieved by increasing the cooling fin density in the flow direction, in particular by increasing the number of cooling fins per cross-sectional area.

[0024] It is also preferred that the cooling device comprises an air guiding device, which is arranged between the middle area and the deflection area. The air guiding device is designed in such a way that the cooling air flow is guided into the middle area. For example, the air guiding device is designed as a plate. This ensures that the cooling air flow is guided completely into the middle area, so that heat is conducted away from the heat sink there by forced convection. In particular, the air guiding device is used to shield areas of the cooling device that do not contribute to cooling.

[0025] The invention also provides an electronic device comprising the described cooling device. The electronic device also comprises a component to be cooled, in particular a semiconductor component of a motor vehicle, for example. The component to be cooled is connected to a base plate of the cooling device in a thermally conductive manner. The cooling device enables particularly effective and reliable cooling of the component in order to avoid overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be described below with reference to the embodiments in conjunction with the accompanying drawings. In the accompanying drawings, components with the same functions are respectively indicated by the same reference numerals. Here:

[0027] Figure 1 A simplified schematic diagram of an electronic device having a cooling device according to a first embodiment of the present invention is shown;

[0028] Figure 2 Shows Figure 1 Details of cooling equipment;

[0029] Figure 3shows a simplified schematic diagram of a cooling device according to a second embodiment of the present invention;

[0030] Figure 4 shows a simplified schematic diagram of a cooling device according to a third embodiment of the present invention;

[0031] Figure 5 shows a simplified schematic diagram of a cooling device according to a fourth embodiment of the present invention;

[0032] Figure 6 shows a simplified schematic diagram of a cooling device according to a fifth embodiment of the present invention;

[0033] Figure 7 Shows Figure 6 Details of cooling equipment;

[0034] Figure 8 shows details of a cooling device according to a sixth embodiment of the present invention; and

[0035] Fig. 9 A simplified schematic detail view of a cooling device according to a seventh exemplary embodiment of the invention is shown. DETAILED DESCRIPTION

[0036] Figure 1 A simplified schematic diagram of an electronic device 100 according to the invention is shown. The electronic device 100 comprises a semiconductor component 101 with power electronics and a cooling device 1 according to a first exemplary embodiment of the invention. The cooling device 1 is designed to cool the semiconductor component 101. For this purpose, a base plate 2 made of aluminum is connected to the semiconductor component 101 in a thermally conductive manner.

[0037] The cooling device 1 comprises a cooling element 5 which is designed in a meandering manner and has a plurality of central sections 51 and a plurality of deflection sections 52. The cooling element 5 is designed in one piece as a meanderingly bent multi-channel tube.

[0038] Figure 2 Shows Figure 1 Detail, that is, a cross-sectional view of the cooling element 5. Figure 2 As can be seen in FIG. 1 , the cooling element 5 has a flat rectangular cross section and has a total of eight channels 53 separated from each other, which are arranged next to each other in the longitudinal direction A. It should be noted that as an alternative, any number of channels 53 is possible. The longitudinal direction A is Figure 1 , perpendicular to the drawing plane. The channels 53 each have a square cross section, which in particular has a side length of 0.001 m. The channels 53 each extend through the entire cooling element 5 and form cavities that are separated from one another.

[0039] As in Figure 1 As can be seen in the figure, the cooling element 5 extends from the bottom plate 2 upward through the middle area 4 to the deflection area 3. The middle area 4 and the deflection area 3 are preferably filled with air. The middle sections 51 extend from the bottom plate 2 to the deflection area 3, that is, through the middle area 4. Here, the middle sections 51 are straight and arranged parallel to each other. The deflection sections 52 are arranged at the ends of the middle sections 51 inside the deflection area 3 and inside the bottom plate 2 and form a reversing portion. Here, the deflection sections 52 connect the two middle sections 51 to each other.

[0040] The deflecting sections 52 are each U-shaped and have a bending radius 55. The intermediate sections 51 are thus arranged relative to one another at a distance 50 corresponding to the double bending radius 55. On the floor side, the deflecting sections 52 are each arranged in the groove 21, so that on their outer sides there is a planar contact of the deflecting sections 52 with the floor 2.

[0041] On the inner side of the deflection sections 52 there is in each case an arcuate insert 22 which forms a flush arrangement with the base plate 2. As a result, heat can be transferred to the cooling element 5 in a particularly uniform manner with particularly small temperature differences.

[0042] In order to achieve a firm connection and good heat transfer from the base plate 2 to the cooling element 5 , the deflection section 52 , the base plate 2 and the insert 22 are connected to one another by means of a brazed connection 60 .

[0043] Furthermore, the cooling element 5 has a connecting region 58 which is arranged within the deflection region 3 and which provides a closed circuit of the cooling element 5. A valve 59 is arranged within the connecting region 58 which, in the closed state, keeps the cooling element 5 closed and in the open state allows the channels 53 of the cooling element 5 to be evacuated and filled.

[0044] A working medium is present inside the channel 53 of the cooling element 5, which is present in both liquid and gaseous states. When the base plate 2 is heated by the semiconductor component 101, the cooling element 5 and the working medium therein are heated. The heat is transported away from the base plate 2 by a combination of evaporation, condensation, convection heat transport and heat conduction, and the semiconductor component 101 is thereby cooled.

[0045] The heat is transported away from the cooling element 5 by means of cooling fins 6 which are connected in a heat-conducting manner to the middle sections 51. The cooling fins 6 are arranged between the middle sections 51 within the entire free volume of the middle region 4. The cooling device 1 thus operates according to the principle of a pulsating heat pipe.

[0046] Figure 3 A simplified schematic diagram of a cooling device 1 according to a second exemplary embodiment of the invention is shown. The second exemplary embodiment corresponds essentially to Figure 1 and Figure 2 A first exemplary embodiment of the present invention is shown, in which the cooling device 1 additionally has a blower 7 and an air guiding device 8. For a better clarity of the cooling device 1, the air guiding device 8 is only outlined with dashed lines.

[0047] The blower 7 generates a cooling air flow which is directed onto the cooling fins 6. The flow direction 70 of the cooling air flow is parallel to the longitudinal direction A. The air guiding device 8 is designed as a plate and causes the cooling air flow to be guided completely into the central region 4 by shielding the deflection region 3. As a result, heat is particularly well transported away from the cooling fins 6 by the cooling air flow by means of forced convection, so that a particularly high cooling power of the cooling device 1 is achieved.

[0048] Figure 4 1 shows a simplified schematic diagram of a cooling device 1 according to a third exemplary embodiment of the invention. With regard to the alternative arrangement of the cooling element 5, the third exemplary embodiment corresponds essentially to Figure 1 and Figure 2 The first embodiment of Figure 4 In a third exemplary embodiment, the deflection segments 52 are arranged directly adjacent to one another, so that a greater number of deflection segments 52 are arranged in the base plate 2. This allows the cooling capacity per unit of volume space of the cooling device 1 to be increased. In order to enable a more compact arrangement of the deflection segments 52, the central segment 51 is designed to be curved, so that the cooling element 5 has a geometry with a plurality of dumbbell-shaped loops.

[0049] Figure 5 A simplified schematic diagram of a cooling device 1 according to a fourth exemplary embodiment of the present invention is shown. The fourth exemplary embodiment corresponds essentially to Figure 4A third embodiment of the present invention is provided, in which the deflection section 52 on the deflection region side has an enlarged bending radius 55b compared to the deflection section 52 on the base plate side. In addition, the lateral spacing 50 between the middle sections 51 is enlarged in the vicinity of the deflection region 3. To achieve this, the deflection region 3 is widened relative to the base plate 2. These measures thus provide a larger free volume space in the middle region 4, so that more free space is available for the cooling fins 6, so that a particularly high cooling power can be achieved.

[0050] Figure 6 A simplified schematic diagram of a cooling device 1 according to a fifth exemplary embodiment of the present invention is shown. Figure 7 Shows Figure 6 With regard to an alternative design of the cooling element 5 and of the base plate 2 and of the deflection region 3, the fifth exemplary embodiment corresponds essentially to Figure 1 and Figure 2 In the fifth embodiment, the base plate 2 is formed in two parts from two plates 2a, 2b. The deflection region 3 has a similar two-part structure with respect to the first plate 3a and the second plate 3b.

[0051] Furthermore, in the fifth exemplary embodiment, the cooling element 5 is constructed in multiple parts. Here, the cooling element 5 comprises a plurality of individual straight middle sections 51 which are constructed as multi-channel tubes.

[0052] The cooling element 5 is designed, for example, with a single deflection portion around the deflection region 3. Figure 7 . Here, each intermediate segment 51 of the second plate 3b has a through hole 30, through which the intermediate segment 51 is inserted. Adjacent to it, a deflection channel 56 in the form of a groove is constructed inside the first plate 3a. The deflection channel 56 connects two intermediate segments 51 arranged side by side to each other. The deflection channel 56 forms a reversing part of the deflection segment 52. In addition, the deflection channel 56 is constructed in the form of a single cavity, into which all channels 53 of the adjacent intermediate segments 51 lead. In order to make a fluid-tight connection and to ensure good heat conduction, a brazing connection 35 is respectively provided at the contact surface between the first plate 3a and the second plate 3b and between the intermediate segment 51 and the second plate 3b.

[0053] Figure 8 Detail of a cooling device 1 according to a sixth embodiment of the invention is shown. The sixth embodiment corresponds essentially to Figure 6 and Figure 7 A fifth embodiment of the present invention is characterized in that the deflection section 52 has a plurality of deflection channels 56 instead of a single deflection channel. Figure 8 3 shows a top view of the first plate 3a, in which the plurality of deflection channels 56 are each designed as a groove. A partition wall 57 is respectively formed between the individual deflection channels 56. As a result, there is exactly one deflection channel 56 for each channel 53 of the middle segment 51, so that no exchange of working medium takes place between the individual channels 53.

[0054] Fig. 9 1 shows a simplified schematic detail view of a cooling device 1 according to a seventh exemplary embodiment of the invention. With regard to an alternative design of the cooling fins 6, the seventh exemplary embodiment corresponds essentially to Figure 3 The second embodiment. Fig. 9 , views of the cooling fins 6 in different sectional planes along a flow direction 70, which flow direction is in particular perpendicular to the plane of the drawing. In this case, view (a) shows a top view of the cooling fins 6 in an entry plane of the cooling air flow into the region of the cooling device 1 filled with cooling fins 6. View (b) shows the cooling fins 6 in a sectional plane downstream of the geometry shown in view (a) along the flow direction 70, and view (c) shows the cooling fins 6 in a sectional plane downstream of the geometry shown in view (b) along the flow direction 70. As in Fig. 9 As can be seen in the figure, the fin density per unit of volume increases in the flow direction 70. As a result, the fin surface also increases in the flow direction 70. As a result, the fin surface available for convective heat transport in the flow direction 70 increases. As a result, the increased heating of the cooling air flow in the flow direction 70 due to the absorbed heat can be compensated in order to achieve a particularly effective heat removal over the entire volume of the cooling device 1.

Claims

1. A cooling device for cooling a component (101), comprising: - a base plate (2) which can be connected in a heat-conducting manner to a component (101) to be cooled; - Turning area (3); - an intermediate region (4) between the base plate (2) and the deflection region (3); and - a cooling element (5) which is designed in a meandering manner and has a plurality of central sections (51) and a plurality of deflection sections (52), - wherein the intermediate sections (51) extend from the base plate (2) to the deflection area (3), - wherein the deflection segments (52) respectively form a deflection within the base plate (2) and within the deflection region (3) and respectively connect two intermediate segments (51) to one another, - wherein the cooling element (5) is filled with a working medium, the working medium being present in the cooling element (5) both in gaseous and liquid form, and - wherein the middle section (51) has a plurality of channels (53), - wherein the cooling element (5) is designed in one piece as a meander-shaped multi-channel tube, - wherein each deflection section (52) of the base plate (2) has a groove (21) and wherein each base plate-side deflection section (52) is arranged in a groove (21), - wherein each groove (21) of the base plate (2) has an insert (22), which is arranged on the inner side of the deflection section (52) and is designed to be arranged flush with the base plate (2), - and wherein the insert has a cross section that is arcuate in shape.

2. The cooling device according to claim 1, wherein: The middle section (51) is surrounded by cooling fins (6).

3. The cooling device according to claim 1 or 2, wherein: The deflection section (52) is U-shaped and has a predefined bending radius (55).

4. The cooling device according to claim 1 or 2, wherein: The deflection sections (52) arranged within the base plate (2) and / or within the deflection region (3) respectively directly adjoin one another.

5. The cooling device according to claim 2, wherein: The deflection section (52) on the deflection area side has a larger bending radius (55) than the deflection section (52) on the base plate side, and / or the lateral spacing (50) between the intermediate sections (51) is at least partially enlarged in order to enlarge the cooling volume space available for the heat sink (6).

6. The cooling device according to claim 1 or 2, wherein: The working medium has a critical temperature of at least 333 K.

7. The cooling device according to claim 6, wherein: The working medium has a critical temperature of at least 373 K.

8. The cooling device according to claim 6, wherein: The working medium has a critical temperature of at least 433 K.

9. The cooling device according to claim 6, wherein: The working medium has a critical temperature of 473 K at maximum.

10. The cooling device according to claim 2, further comprising a blower (7) which is designed to generate a cooling air flow, wherein: The cooling air flow is directed towards the heat sink (6).

11. The cooling device according to claim 10, wherein: The cooling fins (6) are designed in such a way that the cooling fin surface increases in the flow direction (70) of the cooling air flow.

12. The cooling device according to claim 10 or 11, further comprising an air guiding device (8) which is arranged between the intermediate region (4) and the deflection region (3) and which guides the cooling air flow into the intermediate region (4).

13. Electronic devices, including: - Member (101), and - A cooling device (1) according to any one of claims 1 to 12, - wherein the component (101) is connected to a base plate (2) of the cooling device (1) in a heat-conducting manner.

14. The electronic device according to claim 13, wherein: The component (101) is a semiconductor component.

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