A low heat leakage thin film composite strip line structure for cryogenic packaging and its design method

Abstract

The present invention discloses a low heat leakage thin film composite ribbon line structure and a design method for cryogenic packaging. The low heat leakage thin film composite ribbon line structure for cryogenic packaging of the present invention is composed of a type A lead merged conductive layer, a type A lead conductive layer, a film coating layer, via holes, a type B lead conductive layer, a type B lead merged conductive layer, a bonding wire finger layer, a strengthening layer, a gold layer, and a soldering pad gold plating layer. The present invention systematically expounds the design principles and implementation methods of the low heat leakage thin film composite ribbon line structure, materials, electricity, heat, etc., and obtains a low heat leakage thin film composite ribbon line assembly. The present invention adopts a multi-layer composite structure compatible with the ordinary flexible cable process. On the premise of ensuring performance matching with the detector, low thermal conductivity alloys, multi-layer structure lead merging, and specific surface treatment are used to reduce the heat leakage of the leads and solve the reliability problems brought by high-density leads.

Description

Technical Field

[0001] The present invention relates to the cryogenic packaging technology of infrared detectors, specifically to a low heat leakage thin film composite strip line structure and design method for cryogenic packaging, which is applicable to the low heat leakage lead wire technology of large-scale infrared focal plane detectors in Dewars. It is also applicable to the lead wire technology in the packaging of other infrared detectors such as radiation cooling and thermoelectric refrigeration, and is equally applicable to the low heat leakage lead wire technology between other cryogenic cold platforms and room temperature housings. Background Art

[0002] Two important performance indicators of infrared remote sensing instruments are the field of view and resolution. In the development of high-resolution large-field optical systems, in order to overcome the contradiction between the field of view and resolution, one of the solutions is to adopt high-resolution, ultra-large-scale infrared focal plane detectors. With the extension of the wavelength to the long wave and the improvement of detection sensitivity, ultra-large-scale infrared focal plane detectors must operate at deep low temperatures. Due to the advantages of mechanical refrigeration such as compact structure, small volume, light weight, large refrigeration capacity, short refrigeration time, and large controllable range of refrigeration temperature, most of these detectors adopt mechanical refrigeration methods in space applications. This also makes most of their applications use Dewar packaging to form ultra-large-scale infrared detector Dewar assemblies. Low parasitic heat load is an important technical indicator of Dewar assemblies. Especially when the scale of the detector increases (especially for tiled ultra-large-scale detectors), the solid conduction and radiation heat of the lead wires in the parasitic heat load of the Dewar are important parts.

[0003] There are mainly three types of Dewar packaging lead technologies: (1) Bare metal leads. The number of leads should not be too many. Traditional micro Dewars basically adopt this lead technology. For example, in Chinese Patent 200810038826.1, "A lead structure and method between a cryogenic cold platform and a room temperature outer shell", the metal leads between the cryogenic cold platform and the room temperature outer shell are metal leads made of platinum, manganin, constantan, gold or nickel materials with low thermal conductivity; (2) Traditional copper-based thin film flexible ribbon cables, but they have the disadvantage of relatively large heat leakage. For example, in Chinese Patent 200610118767.X, the lead assembly of a multi-module spliced long linear infrared focal plane detector connects the leads of all sub-modules to their respective corresponding short thin film lead tapes, and then these short thin film lead tapes are simultaneously welded to the first PC printed circuit board. The PC printed circuit board is then led out through a long thin film lead. Finally, the long thin film lead tape is welded to the second PC printed circuit board. The first PC printed circuit board uses double-layer wiring and combines and leads out the leads with the same content of each module. For example, the Atmospheric Infrared Sounder (AIRS) successfully launched by the United States in 2002 (see the report in SPIE VOL.3457 (1998), "Performance of the PV / PC HgCdTe Focal Plane / Dewar Assembly for the Atmospheric Sounder Instrument (AIRS)") uses a Dewar assembly of a 4482-element infrared focal plane detector. After multi-layer wiring of 526 leads of all modules on 99 alumina ceramics, they are all led out through thin film ribbon cables; for example, in Chinese Patent CN201710388016.8, "A packaging structure of a focal plane infrared detector component integrated with a multi-stage thermoelectric cooler", the electrical lead-out of the focal plane module is realized through a flexible ribbon cable, and there is a gold layer with magnetron sputtering treatment on the surface of the flexible ribbon cable; (3) Thin film flexible ribbon cables made of manganin material with low thermal conductivity, and their advantage is small heat leakage. Specifically, see Chinese Patent CN201310326492.9, "A low heat leakage flexible cable", where the materials of the upper conductive layer and the lower conductive layer are manganin alloys. When the lead length is short and the lead resistance is small, it does not affect the working timing and pulse performance of the detector. When the lead is relatively long, the detector sometimes works in an incorrect state, directly affecting the performance of the detector. In addition, there is no elaboration on optimizing and combining the leads of the spliced large-scale detector to reduce the number of leads, and reducing the radiation heat and electromagnetic interference of the flexible ribbon cable. With the continuous increase in the scale of the detector (especially the spliced ultra-large-scale detector), the low heat leakage of the thin film ribbon cable in the Dewar (including reducing the number of leads, solid conduction of the leads and radiation heat leakage of the thin film ribbon cable), not affecting the working point of the detector and electromagnetic compatibility become more important, and a new method must be explored to solve this problem. Summary of the Invention

[0004] The object of the present invention is a low heat leakage thin film composite strip line structure for cryogenic packaging and its design method, which is applicable to the low heat leakage lead wire technology of large-scale infrared focal plane detectors in Dewars, and is also applicable to the lead wire technology in the packaging of other infrared detectors such as radiation cooling and thermoelectric cooling. It is also applicable to the low heat leakage lead wire technology between other cryogenic cold platforms and room temperature enclosures. The present invention solves the problems of low heat leakage in the high-integration packaging of lead wires, matching with the performance of detectors, reducing electromagnetic interference of the environment on the lead wires, environmental adaptability and reliability after the increase of lead wires due to the increase in the scale of infrared detectors.

[0005] A low heat leakage thin film composite strip line structure for cryogenic packaging of the present invention is as shown in the appendix Figure 1 It includes: Class A lead wire combined conductive layer 1, Class A lead wire conductive layer 2, film covering layer 3, via hole 4, Class B lead wire conductive layer 5, Class B lead wire combined conductive layer 6, bonding wire finger layer 7, reinforcing layer 8, gold layer 9, and soldering pad gold plating layer 10.

[0006] The conductive layer materials of the low heat leakage thin film composite strip line structure for cryogenic packaging are selected as follows: 1) The conductive materials of Class A lead wire combined conductive layer 1 and Class A lead wire conductive layer 2 are selected as constantan or manganin; 2) The conductive materials of Class B lead wire conductive layer 5, Class B lead wire combined conductive layer 6 and via hole 4 are selected as copper; 3) The reinforcing layer 8 is selected as polyimide or stainless steel.

[0007] The electrical series connection design method of the conductive layer of the low heat leakage thin film composite strip line structure for cryogenic packaging is as follows:

[0008] 1) The conductive layers of the low heat leakage thin film composite strip line are distributed from top to bottom in the longitudinal section of the strip line as gold layer 9, Class A lead wire combined conductive layer 1, Class A lead wire conductive layer 2, Class B lead wire conductive layer 5, Class B lead wire combined conductive layer 6 and gold layer 9, and the film covering layer 3 is arranged between all conductive layers;

[0009] 2) Connect the signal lead-out ends of the following same functions in multiple detector modules or the same module to the bonding wire finger layer 7 on the left side of the Class A lead wire conductive layer 2 of the low heat leakage thin film composite strip line, and then transmit on the Class A lead wire conductive layer 2 as shown in the appendix Figure 2 It passes through the via hole 4 and communicates with the Class A lead wire combined conductive layer 1, then returns to the Class A lead wire conductive layer 2 through the via hole 4 again, and finally the right end of the Class A lead wire conductive layer 2 is connected to the surface metal of the Class A lead wire combined conductive layer 1 and the soldering pad gold plating layer 10 is formed by electroplating. These signal lead-out ends are as follows: reset pulse (Reset), sampling pulse 1 (Sh1), sampling pulse 2 (Sh2), start pulse (Start), operational amplifier bias voltage (Vbias), clock pulse (Cp) and operational amplifier reference voltage (Ref);

[0010] 3) Connect the following signal lines among the lead-out terminals of multiple detector modules to the bonding alloy finger layer 7 on the left side of the Class A lead conductive layer 2 of the low heat leakage thin film composite tape line, and then transmit on the Class A lead conductive layer 2 as shown in the appendix Figure 3 Finally, the right end of the Class A lead conductive layer 2 is connected to the gold plating layer 10 of the partial welding pad formed by the surface metal and electroplating of the Class A lead combined conductive layer 1 through the via 4. The signal line lead-out terminals are as follows: the pre-integration output (Out1) with single or multiple outputs, the post-integration output (Out2) with single or multiple outputs, and the shift register output (q) selected from multiple modules;

[0011] 4) Connect the following signal lines among the lead-out terminals of multiple detector modules to the bonding alloy finger layer 7 on the left side of the Class A lead conductive layer 2 of the low heat leakage thin film composite tape line, and then transmit on the Class A lead conductive layer 2 as shown in the appendix Figure 4 Finally, the right end of the Class A lead conductive layer 2 is connected to the Class B lead combined conductive layer 5 through the via 4, then output to the Class B lead combined conductive layer 6 through the via 4, and then output to the Class B lead conductive layer 5 through the via 4. Finally, the right end of the Class B lead conductive layer 5 is connected to the gold plating layer 10 of the partial welding pad formed by the surface metal and electroplating of the Class B lead combined conductive layer 6 through the via 4. The detector module lead-out terminals are as follows: digital signal power supply (SignVdd), analog signal power supply (Vdd), digital signal ground wire (gnda), analog signal ground wire (gnd), and chip bias voltage (Vb).

[0012] 5) As shown in the appendix Figure 5 Connect the gold layer (9) of the low heat leakage thin film composite tape line with low temperature packaging, and finally connect to the gold plating layer of the welding pad (10) through the via 4

[0013] The method for the transverse electrical connection design of the conductive layer of a low heat leakage thin film composite tape line structure for low temperature packaging is as follows:

[0014] 1) As shown in the appendix Figure 6 Connect the detector lead-out terminals to the bonding alloy finger layer (7) of the low heat leakage thin film composite tape line for low temperature packaging on the same plane and arrange them on the Class A lead conductive layer 2; for the leads that need to be connected to the Class B lead conductive layer (5), after passing through the bonding alloy finger layer (7) of the Class A lead conductive layer (2), at the position closest to the bonding alloy finger layer (7) within the process tolerance range, connect to the Class B lead conductive layer (5) through the via (4) to reduce the resistance;

[0015] 2) As shown in the appendix Figure 6 Arrange the leads of the Class A lead combined conductive layer 1 and the Class B lead combined conductive layer 6. In the transverse direction, they are perpendicular to the leads on the Class A lead conductive layer 1, and the transverse distribution shall not overlap to facilitate the implementation of the process of the via 4;

[0016] 3) As shown in the appendix Figure 6 For the leads that require multiple vias (4) to implement the leads in the Class A lead merged conductive layer (1) and the Class B lead merged conductive layer (6), they need to be arranged on the side close to the gold bonding finger layer (7);

[0017] The electrical design method of the conductive layer of a low heat leakage thin film composite strip for low temperature packaging is as follows:

[0018] 1) As shown in the appendix Figure 2 As shown, the detector lead-out terminal is connected to the gold bonding finger layer (7) side of the low heat leakage thin film composite strip for low temperature packaging, and then is transmitted on the Class A lead conductive layer (2). It is connected to the Class A lead merged conductive layer (1) through the via (4), and then returns to the Class A lead conductive layer (2) through the via (4) again. Finally, the right end of the Class A lead conductive layer (2) is connected to the lead resistance of the partial welding pad gold plating layer (10) formed by the surface metal and electroplating of the Class A lead merged conductive layer (1). According to the resistivity, cross-sectional area and effective length of the wire, the resistance value should be less than 23 ohms;

[0019] 2) As shown in the appendix Figure 3 As shown, the detector lead-out terminal is connected to the gold bonding finger layer (7) on the left side of the Class A lead conductive layer (2) on the low heat leakage thin film composite strip, and then is transmitted on the Class A lead conductive layer (2). Finally, the right end of the Class A lead conductive layer (2) is connected to the lead resistance of the partial welding pad gold plating layer (10) formed by the surface metal and electroplating of the Class A lead merged conductive layer (1). According to the resistivity, cross-sectional area and effective length of the wire, the resistance value should be less than 23 ohms

[0020] 3) As shown in the appendix Figure 4 As shown, the detector lead-out terminal is connected to the gold bonding finger layer (7) on the left side of the Class A lead conductive layer (2) on the low heat leakage thin film composite strip, and then is transmitted on the Class A lead conductive layer (2). Finally, the right end of the Class A lead conductive layer (2) is connected to the Class B lead conductive layer (5) through the via (4), and then is output to the Class B lead merged conductive layer (6) through the via (4), and then is output to the Class B lead conductive layer (5) through the via (4) again. Finally, the right end of the Class B lead conductive layer (5) is connected to the lead resistance of the partial welding pad gold plating layer (10) formed by the surface metal and electroplating of the Class B lead merged conductive layer (6). According to the resistivity, cross-sectional area and effective length of the wire, its resistance value should be less than 1 ohm;

[0021] 4) As shown in the appendix Figure 5As shown in the figure, the gold layer 9 of the low heat leakage thin film composite strip line for cryogenic packaging is finally connected to the lead resistance of the gold-plated layer 10 of the welding pad. According to the resistivity, cross-sectional area and effective length of the wire, its resistance value is designed to be less than 1 ohm. Moreover, there shall be no gold layer 9 at the places where the low heat leakage thin film composite strip line for cryogenic packaging contacts the cryogenic cold platform and the room temperature housing, ensuring that the gold layer 9 is insulated from the cryogenic cold platform and the room temperature housing.

[0022] The implementation method of a low heat leakage thin film composite strip line for cryogenic packaging is as follows:

[0023] (1) The Class A lead combined layer conductive layer 1 and the Class A lead conductive layer 2 are respectively glued to the front and back sides of the film layer 3. The Class A lead conductive layer 2 and the Class A lead combined conductive layer 1 are connected and conducted through the via hole 4, and the film layer 3 is glued to the lower surface of the Class A lead conductive layer 2;

[0024] (2) The Class B lead conductive layer 5 and the Class B lead combined conductive layer 6 are respectively glued to the front and back sides of the film layer 3. The Class B lead conductive layer 5 and the Class B lead combined conductive layer 6 are connected and conducted through the via hole 4;

[0025] (3) Taking the Class B lead conductive layer 5, the Class B lead combined conductive layer 6 and the film layer 3 that have been glued together as a whole, the Class B lead conductive layer 5 is glued upward to the film layer 3 on the lower surface of the Class A lead conductive layer 2; the film layer 3 is glued to the lower surface of the Class B lead combined conductive layer 6;

[0026] (4) Glue the upper surface of the reinforcement layer 8 to the lower surface of the film layer 3 on the lower surface of the Class B lead combined conductive layer 6;

[0027] (5) The upper surface metal at the left end of the Class A lead conductive layer 2 on the low heat leakage thin film composite strip line is electroplated to form the bonding wire finger layer 7;

[0028] (6) The right end of the Class A lead conductive layer 2 or the Class B lead conductive layer 3 or the gold layer 9 on the low heat leakage thin film composite strip line is connected to the upper surface of the Class A lead combined conductive layer 1 or the lower surface metal of the Class B lead combined conductive layer 6 through the via hole 4 and electroplated to form a partial welding pad gold-plated layer 10;

[0029] (7) The gold layer 9 is grown on the upper surface of the film layer 3 on the upper surface of the Class A lead combined layer 1 and on the lower surface of the film layer 3 on the lower surface of the Class B lead combined layer 6 by magnetron sputtering.

[0030] The above realizes the preparation of a low heat leakage thin film composite strip line for cryogenic packaging.

[0031] The advantages of the present invention are:

[0032] 1) The structural form of the present invention is relatively complex, but it can be matched with the processing technology of ordinary flexible cables;

[0033] 2) Most of the leads of the present invention adopt special alloys with low thermal conductivity. In addition, the leads of multiple spliced ultra-large-scale detectors are combined to reduce the total number of leads. Through these two measures, the solid heat leakage brought by the leads of the detector dewar is effectively reduced, thereby reducing the input power consumption of the Stirling refrigerator.

[0034] 3) The leads that affect the working state of the detector in the present invention adopt traditional copper-based materials, which is beneficial to matching with the detector performance.

[0035] 4) The present invention can solve the reliability problem brought by the high-density leads of the detector dewar. It improves the anti-disturbance ability of the leads under mechanical random vibration, and avoids the failure problems such as disconnection and interconnection of the ordinary leads of the detector dewar under high-frequency vibration.

[0036] 5) A gold layer is locally grown on the outermost layer of the present invention and led out together with the detector signal line, which is beneficial to reducing the noise of the detector assembly, effectively reducing the influence of external electromagnetic interference on the detector signal line, and also reducing the surface radiation heat of the strip line. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of a low-heat-leakage thin-film composite strip line structure for cryogenic packaging;

[0038] In the figure: 1 - A-class lead combined conductive layer

[0039] 2 - A-class lead conductive layer

[0040] 3 - Coating layer

[0041] 4 - Via hole

[0042] 5 - B-class lead conductive layer

[0043] 6 - B-class lead combined conductive layer

[0044] 7 - Bonding alloy finger layer

[0045] 8 - Reinforcing layer

[0046] 9 - Gold layer

[0047] 10 - Welding pad gold plating layer;

[0048] Figure 2 It is a schematic diagram of the longitudinal cross-section electrical connection of the A-class lead conductive layer and the A-class lead combined conductive layer of a low-heat-leakage thin-film composite strip line structure for cryogenic packaging;

[0049] Figure 3 It is a schematic diagram of the longitudinal cross-section electrical connection of the A-class lead conductive layer of a low-heat-leakage thin-film composite strip line structure for cryogenic packaging;

[0050] Figure 4 Schematic diagram of longitudinal cross-section electrical connection of Class B lead conductive layer and Class B lead combined conductive layer of a low heat leakage thin film composite ribbon structure for cryogenic packaging;

[0051] Figure 5 Schematic diagram of longitudinal cross-section electrical connection of gold layer of a low heat leakage thin film composite ribbon structure for cryogenic packaging;

[0052] Figure 6 Schematic diagram of transverse distribution of a low heat leakage thin film composite ribbon structure for cryogenic packaging. Specific embodiments

[0053] The following further details the specific embodiments of the present invention in conjunction with the accompanying drawings:

[0054] A certain aerospace project requires a 6,000-yuan component spliced by 6 1024×2 modules. The 6 detector modules are spliced in a triangular pattern. The leads of the 6 modules are led out from both sides of the detector, and 2 3,000-yuan low heat leakage thin film composite ribbon lines are required. Each 3,000-yuan low heat leakage thin film composite ribbon line realizes the lead-out of the leads of three detector modules. Each 1024×2 module needs 24 lead-out ends, and another 2 pins for the temperature measurement diode, a total of 74 gold bonding fingers for the low heat leakage thin film composite ribbon line for cryogenic packaging are designed. Through the design method of the present invention, 30 gold-plated welding pads are led out after the leads are combined. The other 30 welding pads on the Class A lead conductive layer 2 are arranged in a triangular pattern with a pitch of 1.27 mm, and the row pitch of the two rows is 2.54 mm. To reduce the noise of the detector component, effectively reduce the influence of external electromagnetic interference on the detector signal line, and also reduce the surface radiation heat of the ribbon line, a gold layer 9 is magnetron sputtered on the surface of the ribbon line, and at the same time, the gold layer and the detector leads are led out together to make 2 gold-plated welding pads. And these 2 gold-plated welding pads are both connected to the upper and lower gold layers 9 of the ribbon line. The 2 gold-plated welding pads are respectively distributed on the left and right sides of the 30 gold-plated welding pads for the detector lead-out line.

[0055] Among the 30 leads of the 3,000-yuan low heat leakage thin film composite ribbon line, 5 leads are output on the Class B lead conductive layer. Specifically as follows: 1 lead each for the detector analog power supply and analog ground, with a resistance of 0.8 ohm, 1 lead each for the digital power supply and digital power supply, and another 1 digital ground is added between the drive timing line of the detector and the output of the 3 detector integrations before output and the output before detector integration. The resistance is 1 ohm. The remaining 24 leads are output on the Class A lead conductive layer 2. Due to the position relationship, the resistance after direct wiring is inconsistent. For the leads with possible direct straight wiring resistance, 1 to 4 unequal semi-circular bends are used in front of the gold-plated welding pad to increase the line resistance, and the actual measured resistance is between 18 ohms and 22 ohms.

[0056] For the Class A lead combined conductive layer 1 of the low heat leakage thin film composite ribbon wire with 3000 yuan, and the Class A lead conductive layer 2 uses constantan alloy with the material grade of 4J60, the thickness is 20μm, and the length and width are 200mm×150mm; for the Class B lead combined conductive layer 6 of the low heat leakage thin film composite ribbon wire for low temperature packaging and the Class A lead conductive layer 5 uses rolled copper, the thickness is 18μm, and the length and width are 200mm×150mm; the film covering layer 3 uses epoxy adhesive with the material model of JA751; the reinforcing layer 8 uses polyimide material with a thickness of 0.1mm and the model is SP-3 film of DuPont Company, the via hole 6 uses a Φ0.2mm hole, the low heat leakage thin film composite ribbon wire for low temperature packaging has 106 via holes 4, the metallization layer 7 in the hole is electroplated copper with a plating layer of 15μm, and the gold layer thickness of the magnetron sputtered gold layer 9 is 5μm.

Claims

1. A low heat leakage thin film composite ribbon structure for cryogenic packaging, comprising a type A lead combined conductive layer (1), a type A lead conductive layer (2), a film covering layer (3), a via hole (4), a type B lead conductive layer (5), a type B lead combined conductive layer (6), a bonding wire finger layer (7), a reinforcing layer (8), a gold layer (9), and a soldering pad gold plating layer (10); It is characterized in that: The type A lead combined conductive layer (1) and the type A lead conductive layer (2) are respectively glued to the front and back surfaces of the film covering layer (3). The type A lead conductive layer (2) and the type A lead combined conductive layer (1) are connected and conducted through the via hole (4). The film covering layer (3) is glued to the lower surface of the type A lead conductive layer (2); The type B lead conductive layer (5) and the type B lead combined conductive layer (6) are respectively glued to the front and back surfaces of the film covering layer (3). The type B lead conductive layer (5) and the type B lead combined conductive layer (6) are connected and conducted through the via hole (4); The type B lead conductive layer (5) is glued upward on the film covering layer (3) on the lower surface of the type A lead conductive layer (2); The film covering layer (3) is glued to the lower surface of the type B lead combined conductive layer (6); The upper surface of the reinforcing layer (8) is glued to the lower surface of the film covering layer (3) on the lower surface of the type B lead combined conductive layer (6); The metal on the upper surface of the left end of the type A lead conductive layer (2) on the low heat leakage thin film composite ribbon is formed into a bonding wire finger layer (7) by electroplating; There is a gold layer (9) on the upper surface of the film covering layer (3) on the upper surface of the type A lead combined conductive layer (1) and on the outer surface of the film covering layer (3) on the lower surface of the type B lead combined layer (6). The metal at the right end of the type A lead conductive layer (2) on the low heat leakage thin film composite ribbon is formed into a soldering pad gold plating layer (10) by electroplating.

2. A low heat leakage thin film composite ribbon structure for cryogenic packaging according to claim 1, It is characterized in that: The conductive materials of the type A lead combined conductive layer (1) and the type A lead conductive layer (2) are selected from constantan or manganin.

3. A low heat leakage thin film composite ribbon structure for cryogenic packaging according to claim 1, It is characterized in that: The conductive materials of the type B lead conductive layer (5), the type B lead combined conductive layer (6), and the via hole (4) are selected from copper.

4. A low heat leakage thin film composite ribbon structure for cryogenic packaging according to claim 1, It is characterized in that: The reinforcing layer (8) is selected from polyimide or stainless steel.

5. A longitudinal section electrical connection design method for a low heat leakage thin film composite ribbon structure for cryogenic packaging as claimed in claim 1, It is characterized in that The method steps are as follows: 1) Connect such lead-out terminals in the electrical definitions of multiple detector modules to the bonding alloy finger layer (7) on the left side of the Class A lead conductive layer (2) of the low heat-leakage thin-film composite tape line, and then transmit on the Class A lead conductive layer (2); communicate with the Class A lead combined conductive layer (1) through the via hole (4), and then return to the Class A lead conductive layer (2) through the via hole (4) again. Finally, the right end of the Class A lead conductive layer (2) is connected to the gold-plated layer (10) of the partial bonding pad formed by the metal on the upper surface of the Class A lead combined conductive layer (1) and electroplating; the specific definitions of such lead-out terminals are Reset pulse Reset, sampling pulse 1-Sh1, sampling pulse 2-Sh2, start pulse Start, operational amplifier bias voltage Vbias, clock pulse Cp, and operational amplifier reference voltage Ref. 2) Connect such lead-out terminals in the electrical definitions of the detector module to the bonding alloy finger layer (7) on the left side of the Class A lead conductive layer (2) of the low heat-leakage thin-film composite tape line, and then transmit on the Class A lead conductive layer (2). Finally, the right end of the Class A lead conductive layer (2) is connected to the gold-plated bonding pad layer (10) formed by the metal on the upper surface of the Class A lead combined conductive layer (1) through the via hole (4); the specific definitions of such lead-out terminals are the output before integration Out1, the output after integration Out2, and the shift register output q. 3) Connect such lead-out terminals in the electrical definitions of the detector module to the bonding alloy finger layer (7) on the left side of the Class A lead conductive layer (2) of the low heat-leakage thin-film composite tape line, and then transmit on the Class A lead conductive layer (2). Finally, the right end of the Class A lead conductive layer (2) is connected to the Class B lead conductive layer (5) through the via hole (4), and then output to the Class B lead combined conductive layer (6) through the via hole (4), and then output to the Class B lead conductive layer (5) through the via hole (4) again; finally, the right end of the Class B lead conductive layer (5) is connected to the gold-plated layer (10) of the partial bonding pad formed by the metal on the upper surface of the Class B lead combined conductive layer (6) through the via hole (4); the specific definitions of such lead-out terminals are digital signal power supply SignVdd, analog signal power supply Vdd, digital signal ground gnda, analog signal ground gnd, and chip bias voltage Vb. 4) Connect the gold layer (9) of the low heat-leakage thin-film composite tape line with low-temperature packaging, and finally connect to the gold-plated bonding pad layer (10) through via hole 4.

6. A lateral electrical connection design method for a low heat-leakage thin-film composite tape line structure for low-temperature packaging as described in claim 1, characterized in that the method steps are as follows: 1) The detector lead-out terminals are connected to the bonding alloy finger layer (7) of the low heat-leakage thin-film composite tape line for low-temperature packaging on the same plane and arranged on the Class A lead conductive layer (2); for the leads that need to be connected to the Class B lead conductive layer (5), after passing through the bonding alloy finger layer (7) of the Class A lead conductive layer (2), at the position closest to the bonding alloy finger layer (7) within the process tolerance range, connect to the Class B lead conductive layer (5) through the via hole (4) to reduce the resistance. 2) The leads of the conductive layer for merging Class A leads (1) and the conductive layer for merging Class B leads (6) shall be perpendicular to the leads on the conductive layer of Class A leads (2) in the transverse direction, and their transverse distributions shall not overlap, facilitating the distribution of vias (4). 3) For leads that require multiple vias (4) between the conductive layer for merging Class A leads (1) and the conductive layer for merging Class B leads (6), they shall be arranged on the side close to the gold bonding finger layer (7).

7. An electrical design method for the conductive layer of a low heat leakage thin film composite strip line structure for cryogenic packaging as described in Claim 1, characterized in that the method steps are as follows: 1) The detector lead-out terminal is connected to the gold bonding finger layer (7) of the low heat leakage thin film composite strip line for cryogenic packaging, and then transmitted on the conductive layer of Class A leads (2); it communicates with the conductive layer for merging Class A leads (1) through the via (4), then returns to the conductive layer of Class A leads (2) through the via (4) again, and finally the right end of the conductive layer of Class A leads (2) is connected to the total link lead resistance of the surface metal of the conductive layer for merging Class A leads (1) and the gold-plated layer (10) formed by electroplating on the welding pad through the via (4), which shall be less than 23 ohms. 2) The detector lead-out terminal is connected to the gold bonding finger layer (7) on the left side of the conductive layer of Class A leads (2) on the low heat leakage thin film composite strip line, then transmitted on the conductive layer of Class A leads (2), and finally the right end of the conductive layer of Class A leads (2) is connected to the total link lead resistance of the surface metal of the conductive layer for merging Class A leads (1) and the gold-plated layer (10) formed by electroplating on the welding pad through the via (4), which shall be less than 23 ohms. 3) The detector lead-out terminal is connected to the gold bonding finger layer (7) on the left side of the conductive layer of Class A leads (2) on the low heat leakage thin film composite strip line, then transmitted on the conductive layer of Class A leads (2), and finally the right end of the conductive layer of Class A leads (2) is connected to the conductive layer of Class B leads (5) through the via (4), then output to the conductive layer for merging Class B leads (6) through the via (4), then output to the conductive layer of Class B leads (5) through the via (4) again, and finally the right end of the conductive layer of Class B leads (5) is connected to the total link lead resistance of the surface metal of the conductive layer for merging Class B leads (6) and the partial gold-plated layer (10) formed by electroplating on the welding pad through the via (4), which shall be less than 1 ohm. 4) The lead resistance of the gold layer (9) of the low heat leakage thin film composite strip line for cryogenic packaging connected to the gold-plated layer (10) of the welding pad shall be less than 1 ohm, and there shall be no gold layer (9) at the places where the low heat leakage thin film composite strip line for cryogenic packaging contacts the cryogenic cold platform and the room temperature outer shell to ensure the insulation between the gold layer (9) and the cryogenic cold platform and the room temperature outer shell.

Images