Manufacturing method of light, thin and reinforced floor

Abstract

The embodiment of the application provides a manufacturing method of light and thin reinforced floor, and belongs to the technical field of plate manufacturing. The manufacturing method of light and thin reinforced floor comprises the following steps: providing a mixture; mixing water 100-140 parts, a modifier 3-5 parts, a halogen agent 1-5 parts, a coupling agent 1-5 parts, plant fiber 10-30 parts and wood fiber 30-60 parts in proportion to obtain the mixture; placing the mixture into a mold, and obtaining a base material after static demolding and drying; hot-pressing forming; impregnating balance paper, decorative paper and wear-resistant paper to obtain impregnated balance paper, impregnated decorative paper and impregnated wear-resistant paper, and then hot-pressing forming the impregnated balance paper, the base material, the impregnated decorative paper and the impregnated wear-resistant paper from bottom to top to obtain the reinforced floor. The manufacturing method of light and thin reinforced floor can meet the mechanical properties of the reinforced floor while making the reinforced floor lighter and thinner.

Description

Technical Field

[0001] This application relates to the field of panel manufacturing technology, and more specifically, to a method for manufacturing thin laminate flooring. Background Technology

[0002] Laminate flooring is composed of four layers: a wear layer, a decorative layer, a core material, and a balancing paper. Also known as impregnated paper laminate flooring or engineered wood flooring, qualified laminate flooring uses one or more layers of special impregnated thermosetting amino resin. This impregnated paper laminate flooring is laid on the surface of a particleboard, high-density fiberboard, or other engineered wood substrate, with a balancing moisture-proof layer on the back and a wear layer and decorative layer on the front. It is then hot-pressed and molded. With increasingly diverse consumer demands, choosing laminate flooring requires not only consideration of appearance and practicality, but also a preference for lightweight flooring. However, the current market offerings of thin laminate flooring do not yet meet these consumer requirements.

[0003] The thickness of laminate flooring is also related to its environmental friendliness. Generally speaking, thinner laminate flooring is more environmentally friendly than thicker flooring because it uses less adhesive per unit area. Thicker laminate flooring consumes more raw materials, increasing deforestation. Furthermore, thicker laminate flooring inevitably has a thicker substrate, which correspondingly increases formaldehyde emissions into the indoor environment. In terms of thermal conductivity, under the same conditions, the greater the thickness of the laminate flooring, the greater the heat loss and the worse its thermal conductivity. Therefore, thinner laminate flooring has better thermal conductivity than thicker laminate flooring. Summary of the Invention

[0004] This application provides a method for manufacturing thin and light laminate flooring, which can make laminate flooring thinner and lighter while meeting the mechanical properties of laminate flooring.

[0005] This application provides a method for manufacturing thin and light engineered wood flooring. The method includes the following steps: S1: providing a mixture; mixing 100-140 parts of water, 3-5 parts of modifier, 1-5 parts of halogen agent, 1-5 parts of coupling agent, 10-30 parts of plant fiber, and 30-60 parts of wood fiber in a certain proportion to obtain a mixture; S2: placing the mixture into a mold, allowing it to stand, demold, and dry to obtain a substrate; S3: hot pressing; impregnating balance paper, decorative paper, and wear-resistant paper with resin to obtain impregnated balance paper, impregnated decorative paper, and impregnated wear-resistant paper, and then hot pressing the impregnated balance paper, substrate, impregnated decorative paper, and impregnated wear-resistant paper from bottom to top to obtain engineered wood flooring.

[0006] In this solution, by improving the proportions of the mixture in the substrate, the ratio of plant fiber to wood fiber in the mixture is appropriately increased. This allows the resulting substrate to reduce its thickness while improving its strength and toughness. The thinner substrate still meets the mechanical properties required for load-bearing capacity and expands the application range beyond the limitations of existing board thicknesses. Therefore, the thin and lightweight laminate flooring provided in this solution is more environmentally friendly and lighter than existing laminate flooring technologies. Thicker laminate flooring consumes more raw materials, increasing deforestation, and the thicker the substrate, the higher the formaldehyde release in the indoor environment. From a thermal conductivity perspective, under the same conditions, the greater the thickness of the laminate flooring, the greater the heat loss and the worse the thermal conductivity. Therefore, the thin and lightweight laminate flooring in this solution has better thermal conductivity than thicker laminate flooring.

[0007] In some embodiments, when the mixture is laid into the mold in step S2, it is laid in layers and fiberglass cloth is laid in between.

[0008] In the above technical solution, by adding fiberglass cloth when the mixture is laid into the mold, the fiberglass cloth and the mixture are laid in layers, which can make the substrate stronger and tougher, thus improving the strength and toughness of the substrate.

[0009] In some embodiments, when the mixture is laid into the mold in step S2, a bottom layer of mixture with a thickness of 1-2 mm is laid into the mold, followed by a first layer of fiberglass cloth, a middle layer of mixture with a thickness of 2-3 mm, a second layer of fiberglass cloth, and an upper layer of mixture with a thickness of 1-2 mm.

[0010] In the above technical solution, the mixture is laid in layers. A first layer of glass fiber cloth is laid between the bottom layer and the middle layer of the mixture, and a second layer of glass fiber cloth is laid between the middle layer and the top layer of the mixture. After the double-layer glass fiber cloth is combined with the mixture, the resulting substrate has high strength and stronger toughness, and can better meet the mechanical performance requirements of the substrate.

[0011] In some embodiments, after the mixture is laid into the mold in step S2, the mold is placed in the drying rack and waited for 24 hours. After the mixture solidifies and is demolded, a regular slab is obtained. The regular slab is placed in a drying kiln for drying treatment. The temperature of the drying kiln is set at 60-80℃ and the slab is left to stand for 24 hours to obtain a substrate with a moisture content of 5-7%.

[0012] In some embodiments, after demolding to obtain a slab in step S2, the slab is trimmed and sanded to obtain a regular slab, which is then dried.

[0013] In the above technical solution, since the slab obtained after the mixture in the mold solidifies may have uneven edges, the slab is cut off to obtain a regular slab with the required dimensions for subsequent processing. The regular slab is then sanded on the front and back to obtain the required thickness for subsequent processing. The processing is simple and the forming quality is good.

[0014] In some embodiments, before hot pressing in step S3, melamine adhesive is applied to both the upper and lower surfaces of the substrate, and the substrate is left to stand in a room at 20-30°C for 24 hours before hot pressing.

[0015] In the above technical solution, melamine adhesive is applied to both the upper and lower surfaces of the substrate, and impregnated balance paper and impregnated decorative paper are applied to the upper and lower sides of the substrate, respectively. This improves the bonding between the impregnated balance paper and impregnated decorative paper and the substrate. After the melamine adhesive is left to stand in an indoor environment at 20-30℃ for 24 hours, it allows the melamine adhesive to air dry naturally, resulting in good curing effect and a smoother substrate surface. This reduces the probability of dried flowers appearing on the decorative paper in the obtained laminate flooring, improves the pass rate of the obtained laminate flooring, and enhances the overall integrity of the obtained laminate flooring.

[0016] In some embodiments, when impregnating the balance paper, decorative paper, and abrasion-resistant paper with resin in step S3, the resin impregnation amount of the abrasion-resistant paper is controlled at 2-2.5 times that of the base paper, the resin impregnation amount of the decorative paper is controlled at 1-1.2 times that of the base paper, and the resin impregnation amount of the balance paper is controlled at 1.2-1.8 times that of the base paper. They are respectively immersed in the glue, taken out, and cured to form impregnated balance paper, impregnated decorative paper, and impregnated abrasion-resistant paper with a pre-cured content of 30-60%. During hot pressing, the hot pressing temperature of the hot press is 170-220℃, the hot pressing time is 20-60s, and the pressure is 18-25MPa.

[0017] In some embodiments, in step S3, after the reinforced flooring obtained by hot pressing is cooled for 24 hours, the reinforced flooring is cut into multiple small pieces of wood according to processing needs, and each small piece of wood is placed on a stacking machine for stacking and curing for 5-7 days.

[0018] In the above technical solution, by placing the cut small pieces of wood on a stacking machine to stack them, the phenomenon of bending of the small pieces of wood can be prevented, thereby improving the pass rate.

[0019] In some embodiments, in step S3, the cured small pieces of wood are grooved and shaped, chamfered paint is applied to the small pieces of wood, and water-resistant wax is sprayed onto the cut edges on the sides of the small pieces of wood, with a spraying amount of 15-20 g / m².

[0020] In the above technical solution, since the protection of the four sides of the small wooden board is relatively weak, the protection and water resistance of the four sides of the small wooden board are strengthened by spraying water-resistant wax on the four sides of the small wooden board after the tongue and groove are opened.

[0021] In some embodiments, when slotting the small pieces of wood, plate locks and plate buckles are respectively formed on opposite sides of the small pieces of wood, which interlock with each other. The plate locks and plate buckles interlock with each other, which facilitates the splicing and fixing of two adjacent small pieces of wood.

[0022] The beneficial effects of this solution are as follows: By improving the proportions of the substrate mixture, appropriately increasing the ratio of plant fiber and wood fiber in the mixture, and correspondingly increasing the proportion of modifier, the resulting substrate can be thinner while simultaneously improving its strength and toughness. This ensures that the mechanical properties of the thinner substrate still meet the load-bearing requirements, and also broadens the limitations of existing board thicknesses. Therefore, the thin and lightweight laminate flooring provided in this solution is more environmentally friendly and lighter than current laminate flooring. Thicker laminate flooring consumes more raw materials, increasing deforestation, and the thicker the laminate flooring, the thicker the substrate, which correspondingly increases formaldehyde emissions in the indoor environment. Therefore, from a thermal conductivity perspective, under the same conditions, the greater the thickness of the laminate flooring, the greater the heat loss and the worse the thermal conductivity. Thus, the thin laminate flooring in this solution has better thermal conductivity than thick laminate flooring.

[0023] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of small pieces of wood planks cut from thin reinforced flooring provided in some embodiments of this application;

[0026] Figure 2 This is a schematic diagram of the structure of the plate lock and plate buckle on both sides of the small wooden board provided in some embodiments of this application.

[0027] Icons: 1-Abrasion-resistant paper; 2-Decorative paper; 3-Base material; 4-Balancing paper; 5-Plate lock; 6-Plate buckle. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0031] In the description of the embodiments of this application, it should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in when in use. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0032] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] Example

[0034] This application provides a method for manufacturing thin and light reinforced flooring. Please refer to [link to relevant documentation]. Figure 1 and Figure 2The manufacturing method of thin laminate flooring includes the following steps: S1: Providing a mixture; mixing 100-140 parts of water, 3-5 parts of modifier, 1-5 parts of halogen agent, 1-5 parts of coupling agent, 10-30 parts of plant fiber and 30-60 parts of wood fiber in a certain proportion to obtain a mixture; S2: placing the mixture into a mold, allowing it to stand, demold, and dry to obtain a substrate 3; S3: Hot pressing; impregnating the balance paper 4, decorative paper 2 and wear-resistant paper 1 with resin to obtain impregnated balance paper, impregnated decorative paper and impregnated wear-resistant paper, and then hot pressing the impregnated balance paper, substrate 3, impregnated decorative paper and impregnated wear-resistant paper from bottom to top to obtain laminate flooring.

[0035] In this solution, by improving the proportions of the mixture in the substrate, the ratio of plant fiber to wood fiber in the mixture is appropriately increased. This allows the resulting substrate to reduce its thickness while improving its strength and toughness. The thinner substrate still meets the mechanical properties required for load-bearing capacity and expands the application range beyond the limitations of existing board thicknesses. Therefore, the thin and lightweight laminate flooring provided in this solution is more environmentally friendly and lighter than existing laminate flooring technologies. Thicker laminate flooring consumes more raw materials, increasing deforestation, and the thicker the substrate, the higher the formaldehyde release in the indoor environment. From a thermal conductivity perspective, under the same conditions, the greater the thickness of the laminate flooring, the greater the heat loss and the worse the thermal conductivity. Therefore, the thin and lightweight laminate flooring in this solution has better thermal conductivity than thicker laminate flooring.

[0036] In some embodiments, when the mixture is laid into the mold in step S2, it is laid in layers and fiberglass cloth is included. By adding fiberglass cloth when the mixture is laid into the mold, the fiberglass cloth and the mixture are laid in layers, which can make the substrate stronger and more resilient, thereby improving the strength and toughness of the substrate.

[0037] In some embodiments, when the mixture is laid into the mold in step S2, a bottom layer of mixture with a thickness of 1-2 mm is laid into the mold, followed by a first layer of fiberglass cloth, a middle layer of mixture with a thickness of 2-3 mm, a second layer of fiberglass cloth, and a top layer of mixture with a thickness of 1-2 mm. The mixture is laid in layers, with a first layer of fiberglass cloth between the bottom and middle layers, and a second layer between the middle and top layers. The combination of the double-layer fiberglass cloth and the mixture results in a substrate with high strength and greater toughness, better meeting the mechanical performance requirements of the substrate.

[0038] After the mixture is laid into the mold in step S2, the mold is placed in the drying rack and waited for 24 hours. After the mixture solidifies and is demolded, a regular slab is obtained. The regular slab is placed in a drying kiln for drying treatment. The temperature of the drying kiln is set at 60-80℃ and left to stand for 24 hours to obtain a substrate with a moisture content of 5-7%.

[0039] After demolding to obtain the slab in step S2, the slab is trimmed and sanded to obtain a regular slab, which is then dried. Since the mixture inside the mold may have uneven edges after solidification, the slab is trimmed to obtain a regular slab with dimensions required for subsequent processing. The regular slab is then sanded on both the front and back sides to obtain the required thickness for subsequent processing. The process is simple and produces good forming quality.

[0040] In some embodiments, before hot pressing in step S3, melamine adhesive is applied to both the upper and lower surfaces of the substrate, and the substrate is left to stand at 20-30°C for 24 hours before hot pressing. By applying melamine adhesive to both the upper and lower surfaces of the substrate 3, and impregnating the upper and lower sides with balance paper and decorative paper respectively, the bonding between the impregnating balance paper and decorative paper and the substrate is improved. Allowing the melamine adhesive to stand at 20-30°C for 24 hours allows it to air dry naturally, resulting in good curing and a smoother substrate surface. This reduces the probability of dried flowers appearing on the decorative paper in the resulting laminate flooring, improves the yield rate of the laminate flooring, and enhances the overall integrity of the laminate flooring.

[0041] In some embodiments, when impregnating the balance paper 4, decorative paper 2, and abrasion-resistant paper 1 with resin in step S3, the resin impregnation amount of the abrasion-resistant paper 1 is controlled to be 2-2.5 times that of the original paper, the resin impregnation amount of the decorative paper 2 is controlled to be 1-1.2 times that of the original paper, and the resin impregnation amount of the balance paper 4 is controlled to be 1.2-1.8 times that of the original paper. They are respectively immersed in the glue, taken out, and cured to form impregnated balance paper, impregnated decorative paper, and impregnated abrasion-resistant paper with a pre-curing of 30-60%. During hot pressing, the hot pressing temperature of the hot press is 170-220℃, the hot pressing time is 20-60s, and the pressure is 18-25MPa.

[0042] In some embodiments, in step S3, after the hot-pressed reinforced flooring has cooled for 24 hours, it is cut into multiple small pieces of wood according to processing needs. These small pieces are then stacked on a stacking machine for 5-7 days. Stacking the cut small pieces of wood on the stacking machine prevents bending and improves the yield rate.

[0043] In some embodiments, in step S3, the cured small wooden board is grooved, chamfered paint is applied to the small wooden board, and water-resistant wax is sprayed onto the side cuts at a rate of 15-20 g / m². Since the four sides of the small wooden board have weak protection, water-resistant wax is sprayed onto the four sides after the tongue and groove are opened, thereby strengthening the protection and water resistance of the four sides.

[0044] In some embodiments, such as Figure 2 As shown, when slotting the small wooden board, the opposite sides of the small wooden board are respectively provided with interlocking locks 5 and buckles 6. The interlocking of locks 5 and buckles 6 facilitates the splicing and fixing of adjacent small wooden boards.

[0045] Preparation of finished products

[0046] Example 1:

[0047] Mix 120 parts water, 4 parts modifier, 3 parts halogen agent, 3 parts coupling agent, 20 parts plant fiber, and 40 parts wood fiber in a certain proportion to obtain a mixture.

[0048] The mixture is placed in the bottom layer of the mold with a thickness of 1.5mm. After passing through the conveyor belt, the first layer of fiberglass cloth is laid on top. The middle layer of the mixture has a thickness of 2.5mm. After passing through the next conveyor belt, the second layer of fiberglass cloth is laid on top. The top layer of the mixture has a thickness of 1.5mm. Adding two layers of fiberglass cloth can obtain a substrate with high strength and good toughness.

[0049] The mixture is placed in the drying rack mold and left to solidify for 24 hours. After demolding, the corresponding board blank is obtained. Because the edges of the board will be irregular after solidification, it needs to be punched to remove the burrs and obtain the board with the required size for subsequent processing. Then, the board surface and back are sanded to obtain the thickness required for subsequent processing. During sanding, it is necessary to ensure that the fiberglass cloth is not exposed.

[0050] The sanded boards are placed in a drying kiln for moisture content treatment. The kiln temperature is set at 60-80℃, and after standing for 24 hours, a substrate with a moisture content of 5-7% is obtained. Melamine adhesive is then applied to both sides of the obtained substrate at a rate of 15 g / m². The substrate is then left to stand at 25℃ for 24 hours.

[0051] Impregnated paper preparation process: Impregnated paper includes abrasion-resistant paper, decorative paper, and balancing paper. The resin impregnation amount of abrasion-resistant paper is controlled at 2.5 times that of the base paper, the resin impregnation amount of decorative paper is controlled at 1.2 times that of the base paper, and the resin impregnation amount of balancing paper is controlled at 1.5 times that of the base paper. Then, they are immersed in glue, taken out, and then cured to form impregnated abrasion-resistant paper, impregnated decorative paper, and impregnated balancing paper with a pre-curing degree of 30-60%.

[0052] Impregnated abrasion-resistant paper, impregnated balance paper, and impregnated decorative paper, which have been cut to the appropriate size, are sequentially hot-pressed onto the substrate using a hot press. From top to bottom, they are impregnated abrasion-resistant paper, impregnated decorative paper, substrate, and impregnated balance paper. The hot pressing temperature of the hot press is 185℃, the hot pressing time is 35s, and the pressure is 20MPa.

[0053] After cooling for 24 hours, the boards are cut into small pieces as needed. These small pieces are then stacked on a stacking machine and cured for 5-7 days to prevent warping. After curing, the boards are grooved and chamfered using a four-sided planer and a transverse double-end milling process.

[0054] The obtained small pieces of wood are coated with chamfered paint, and water-resistant wax is sprayed onto the cut edges on the sides at a rate of 15-20 g / m². After cutting the small pieces of wood and opening the tongue and groove, the front and back of the small pieces of wood are covered with heat-pressed decorative, wear-resistant, impregnated paper and balancing paper, which provide some protection. The four sides of the small pieces of wood are relatively weak in protection. By spraying water-resistant wax onto the four sides of the tongue and groove opening, the protection of the four sides and the water resistance time can be strengthened.

[0055] Example 2

[0056] The only difference from Example 1 is that the wood fiber content is increased to 50 parts; otherwise, they are the same.

[0057] Example 3

[0058] The difference from Example 1 lies in the hot pressing parameters. During hot pressing, the hot pressing temperature is 210°C, the hot pressing time is 20s, and the pressure is 25MPa. All other parameters remain unchanged.

[0059] Comparative Example 1 is conventional engineered wood flooring.

[0060] The data comparison of Examples 1-3 and Comparative Example 1 is shown in Table 1.

[0061] Press temperature 185℃ 185℃ 210℃ 170-220℃ Press pressure 20MPa 20MPa 25MPa 18-25MPa Hot pressing time 35s 35s 20s 20-60s water 120 copies 120 copies 120 copies 80-160 copies Modifier 4 copies 4 copies 4 copies 1-3 servings antihalogen agent 3 copies 3 copies 3 copies 1-5 servings Coupling agent 3 copies 3 copies 3 copies 1-5 servings Wood fiber 40 copies 50 copies 40 copies 10-30 servings plant fiber 20 copies 20 copies 20 copies 10-30 servings

[0062] Table 1

[0063] Table 2 compares the test data of Examples 1-3 and Comparative Example 1.

[0064]

[0065]

[0066] Table 2

[0067] Conclusion: By comparing the data in Tables 1 and 2, it can be clearly concluded that the physicochemical properties of Examples 1-3 are all superior to those of the conventional reinforced product in Comparative Example 1.

[0068] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0069] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for manufacturing a thin, lightweight engineered wood floor, characterized in that, Includes the following steps: S1: Provide a mixture; mix 100-140 parts water, 3-5 parts modifier, 1-5 parts halogen agent, 1-5 parts coupling agent, 10-30 parts plant fiber and 30-60 parts wood fiber in a certain proportion to obtain a mixture; S2: Place the mixture into a mold, let it stand, demold, and dry to obtain the base material; S3: Hot pressing; impregnate the balance paper, decorative paper and abrasion paper to obtain impregnated balance paper, impregnated decorative paper and impregnated abrasion paper, and then hot press the impregnated balance paper, the substrate, the impregnated decorative paper and the impregnated abrasion paper from bottom to top to obtain reinforced flooring; In step S2, when the mixture is poured into the mold, it is laid in layers and fiberglass cloth is laid in between. In step S2, when the mixture is poured into the mold, a bottom layer of mixture with a thickness of 1-2 mm is laid, followed by a first layer of fiberglass cloth, a middle layer of mixture with a thickness of 2-3 mm, a second layer of fiberglass cloth, and finally an upper layer of mixture with a thickness of 1-2 mm. After demolding to obtain the slab in step S2, the slab is trimmed and sanded to obtain a regular slab, which is then dried. After the mixture is laid into the mold in step S2, the mold is placed in the drying rack and waited for 24 hours. After the mixture solidifies and is demolded, a regular slab is obtained. The regular slab is placed in a drying kiln for drying treatment. The temperature of the drying kiln is set at 60-80℃ and left to stand for 24 hours to obtain a substrate with a moisture content of 5-7%.

2. The method for manufacturing thin and light engineered wood flooring as described in claim 1, characterized in that, Before hot pressing in step S3, melamine adhesive is applied to both the top and bottom surfaces of the substrate. The substrate is then left to stand at 20-30°C for 24 hours before hot pressing.

3. The method for manufacturing thin and light engineered wood flooring as described in claim 1, characterized in that, In step S3, when impregnating the balance paper, decorative paper, and abrasion-resistant paper with resin, the resin impregnation amount of the abrasion-resistant paper is controlled at 2-2.5 times that of the original paper, the resin impregnation amount of the decorative paper is controlled at 1-1.2 times that of the original paper, and the resin impregnation amount of the balance paper is controlled at 1.2-1.8 times that of the original paper. They are respectively immersed in the glue, taken out, and cured to form impregnated balance paper, impregnated decorative paper, and impregnated abrasion-resistant paper with a pre-curing of 30-60%. During hot pressing, the hot pressing temperature of the hot press is 170-220℃, the hot pressing time is 20-60s, and the pressure is 18-25MPa.

4. The method for manufacturing thin and light engineered wood flooring as described in claim 1, characterized in that, In step S3, the reinforced flooring obtained by hot pressing is cooled for 24 hours, and then cut into multiple small pieces of wood according to processing needs. The small pieces of wood are placed on a stacking machine and stacked for 5-7 days.

5. The method for manufacturing thin and light engineered wood flooring as described in claim 4, characterized in that, In step S3, the cured small wooden boards are grooved and shaped, and chamfered paint is applied to the small wooden boards. Water-resistant wax is sprayed onto the cut edges on the sides of the small wooden boards, with a spraying amount of 15-20g / ㎡.

6. The method for manufacturing thin and light engineered wood flooring as described in claim 5, characterized in that, When slotting a small piece of wood, a lock and a buckle are respectively made on opposite sides of the small piece of wood to interlock with each other.

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