Hot wire architecture and chemical vapor deposition apparatus

Abstract

The application provides a hot wire architecture and a chemical vapor deposition device, and belongs to the field of hot wire chemical vapor deposition. The hot wire architecture provided by the application comprises a hot wire, a first support structure and a second support structure. The first support structure and the second support structure are arranged at intervals along a first direction. The first support structure comprises a plurality of first fixing columns arranged at intervals along a second direction. The second support structure comprises a plurality of second fixing columns arranged at intervals along the second direction. The hot wire is alternately wound around the plurality of first fixing columns and the plurality of second fixing columns along the second direction to form a hot wire array. The hot wire architecture provided by the application greatly simplifies the structure, reduces the demand for electrical contact and power supply, facilitates modular expansion, has high effective utilization rate of the hot wire, relatively low loss, is easy to maintain and replace, reduces the use cost and maintenance cost, and effectively promotes the industrialization process of hot wire CVD diamond film growth.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of hot filament chemical vapor deposition, and particularly relates to a hot filament architecture and a chemical vapor deposition device. BACKGROUND

[0002] Hot Filament Chemical Vapor Deposition (HFCVD) is a technology for preparing diamond thin films, which has the advantages of high deposition rate, high quality of deposited thin films, and wide application range.

[0003] At present, the hot filament architecture of the hot filament chemical vapor deposition device, the traditional hot filament architecture usually adopts multiple tungsten filaments as high-temperature heating elements (i.e., hot filaments), which are connected through a complex contact type tensile parallel arrangement. Specifically, the multiple hot filaments are fixed and electrically contacted at both ends through precise clamps or connection points in a tensile state, and then connected in parallel to the positive and negative poles of the power supply. However, this arrangement requires high requirements for electrical contact and high-current power supply, and the hot filament arrangement in the hot filament architecture is complex and not easy to expand. In the working process, the effective utilization rate of the hot filament is low, and the loss is large. Each time a round of diamond thin film growth is completed, the hot filament needs to be frequently replaced and the electrode needs to be maintained, and the multiple hot filaments are not easy to replace, which greatly affects the continuity and repeatability of thin film growth. In summary, it seriously restricts the industrialization process of hot filament CVD diamond thin film growth.

[0004] In view of the above, it is urgent to design a new hot filament architecture to solve or at least alleviate the above-mentioned defects. SUMMARY

[0005] The present application provides a hot filament architecture and a chemical vapor deposition device, which aims to solve or alleviate at least one of the above-mentioned defects in the prior art.

[0006] The present application first provides a hot filament architecture, which includes a hot filament, a first support structure, and a second support structure. The first support structure and the second support structure are arranged at intervals along a first direction. The first support structure includes a plurality of first fixed columns, and the plurality of first fixed columns are arranged at intervals along a second direction. The second support structure includes a plurality of second fixed columns, and the plurality of second fixed columns are arranged at intervals along the second direction. The hot filament is alternately wound around the plurality of first fixed columns and the plurality of second fixed columns along the second direction to form a hot filament array.

[0007] In some embodiments, at least part of each first fixed column is located between two adjacent second fixed columns in the second direction.

[0008] In some embodiments, a ratio of a size of the interval between two adjacent first fixing columns to a size of the diameter of the first fixing column is 0.5-3; and / or a ratio of a size of the interval between two adjacent second fixing columns to a size of the diameter of the second fixing column is 0.5-3.

[0009] In some embodiments, the first support structure further comprises a first support plate, each first fixing column protrudes from and is connected to the first support plate in the third direction; and the second support structure further comprises a second support plate, the second fixing column protrudes from and is connected to the second support plate in the third direction.

[0010] In some embodiments, the first fixing column comprises a first column body and a first connecting piece, the first column body is provided with a through first connecting hole in the third direction, and the first connecting piece is fixedly connected to the first support plate through the first connecting hole; and / or the second fixing column comprises a second column body and a second connecting piece, the second column body is provided with a through second connecting hole in the third direction, and the second connecting piece is fixedly connected to the second support plate through the second connecting hole.

[0011] In some embodiments, the first fixing column and the second fixing column are made of any one of metal molybdenum, metal tantalum, and insulating ceramic.

[0012] In some embodiments, the hot-wire architecture further comprises a first adjusting assembly connected to the first support structure, for driving the first support structure to move in the first direction to adjust the tension of the hot-wire array; and / or the hot-wire architecture further comprises a second adjusting assembly connected to the second support structure, for driving the second support structure to move in the first direction to adjust the tension of the hot-wire array.

[0013] In some embodiments, the first adjusting assembly comprises a first mounting column and a first elastic piece, the first elastic piece is located between the first mounting column and the first support structure in the first direction and is connected to the first mounting column and the first support structure; and / or the second adjusting assembly comprises a second mounting column and a second elastic piece, the second elastic piece is located between the second mounting column and the second support structure in the first direction and is connected to the second mounting column and the second support structure.

[0014] In some embodiments, the hot-wire architecture further comprises a guide structure, the guide structure is slidingly connected to the first support structure and the second support structure, so that the first support structure and the second support structure can slide relative to the guide structure in the first direction.

[0015] In some embodiments, the guide structure is provided with a first limiting sliding groove and a second limiting sliding groove, the first limiting sliding groove and the second limiting sliding groove are arranged at intervals in the first direction, and the first limiting sliding groove and the second limiting sliding groove extend in the first direction.

[0016] This application also provides a chemical vapor deposition apparatus, including at least two electrode assemblies and at least one hot filament structure as described above; each hot filament array is connected to the two electrode assemblies at both ends in a second direction.

[0017] In some embodiments, each electrode assembly includes an electrode post, a third connector, and an insulating gasket; the electrode post has a third connecting hole extending in a third direction, and the insulating gasket is disposed between the electrode post and the guide structure; the third connector passes through the third connecting hole and the insulating gasket in a third direction and is connected to the guide structure, and the two ends of the hot wire in a second direction are fixedly connected between the corresponding third connector and the third connecting hole.

[0018] Compared with existing technologies, the hot filament architecture and chemical vapor deposition equipment provided in this application have at least the following advantages:

[0019] By optimizing the structure of the hot filament architecture and adopting a single hot filament series stretching arrangement, the hot filament array is formed by alternating winding between the first fixed column of the first support structure and the second fixed column of the second support structure. This greatly reduces the requirements of the hot filament architecture for electrical contacts and power supply. The arrangement of single hot filaments is convenient and facilitates modular expansion. Moreover, during operation, the effective utilization rate of the hot filament is high and the loss is relatively low. It is easy to maintain and replace after each round of diamond film growth, which significantly improves the continuity and repeatability of film growth, while reducing the cost of use and maintenance, effectively promoting the industrialization process of hot filament CVD diamond film growth.

[0020] Other features and advantages of the hot filament architecture and chemical vapor deposition apparatus provided in this application will be further described in the following specific embodiments. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this application or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the hot wire architecture provided in an embodiment of this application;

[0023] Figure 2 A partial structural diagram of the hot wire architecture provided in an embodiment of this application;

[0024] Figure 3 A schematic diagram illustrating the adjustment of the hot wire within the hot wire structure during the high-temperature heating process, provided in an embodiment of this application.

[0025] Figure 4 A schematic diagram of a module of a chemical vapor deposition apparatus provided for an embodiment of the present application.

[0026] Reference signs:

[0027] 100, hot wire architecture;

[0028] 110, hot wire; 111, hot wire array;

[0029] 120, first support structure; 121, first fixing column; 122, first support plate;

[0030] 130, second support structure; 131, second fixing column; 132, second support plate;

[0031] 140, first adjusting assembly; 141, first mounting column; 142, first elastic member;

[0032] 150, second adjusting assembly; 151, second mounting column; 152, second elastic member;

[0033] 160, guide structure; 161, first limiting sliding groove; 162, second limiting sliding groove;

[0034] 10, chemical vapor deposition apparatus; 200, electrode assembly. DETAILED DESCRIPTION

[0035] In order to make the above and other features and advantages of the present application clearer, the present application will be further described below with reference to the drawings. It should be understood that the specific embodiments given herein are intended for explanatory purposes only and are not limiting.

[0036] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without the specific details. In other instances, well-known steps or operations have not been described in detail in order to avoid obscuring the present application.

[0037] In the description of the present application, it needs to be understood that, as the description of the orientation or positional relationship appears, such as the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., if no special description, it is understood that the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and it is not indicated or implied that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the present application.

[0038] In addition, as the features limited with "first", "second" are used for the purpose of description only, it should not be understood as indicating or implying relative importance or implying the number of the indicated technical features. The features limited with "first", "second" can explicitly or implicitly include at least one of the limited features. As the description of "plurality" appears, the general meaning is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise explicitly specified and limited, the terms such as "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0040] In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0041] It should be noted that, as shown in Figure 1 and Figure 2 The first direction in the embodiment of the application refers to the spacing direction of the first support structure 120 and the second support structure 130, that is, the vertical direction of the direction along which the heating wire 110 is alternately wound; The second direction in the embodiment of the application refers to the direction of the heating wire 110 alternately winding the first fixed column 121 and the second fixed column 131, that is, the extension direction of the heating wire array 111, and the second direction is perpendicular to the first direction; The third direction in the embodiment of the application refers to the direction perpendicular to the plane formed by the first direction and the second direction.

[0042] In summary, the total inventive concept of the embodiments of the present application is to provide a hot wire architecture 100. By designing the structure of the hot wire architecture 100, a single hot wire 110 is arranged in series. That is, by providing a first support structure 120 and a second support structure 130 arranged at intervals, a plurality of first fixed columns 121 and a plurality of second fixed columns 131 are designed on the first support structure 120 and the second support structure 130, respectively. The hot wire 110 is alternately wound around the plurality of first fixed columns 121 and the plurality of second fixed columns 131 to form a hot wire array 111. As a result, the hot wire architecture 100 greatly reduces the requirements for electrical contact and power supply. In the working process, the effective utilization rate of the hot wire 110 is high, and the loss is relatively low. At the same time, the structure of the hot wire architecture 100 is simplified, the hot wire 110 is arranged conveniently, the hot wire architecture 100 is easy to modularly expand, and the hot wire architecture 100 is easy to maintain and replace after each round of diamond film growth. The maintenance convenience is effectively improved, so as to improve the continuity and repeatability of the film growth, and reduce the use cost and maintenance cost.

[0043] Based on the above total inventive concept, referring to FIG. 1, Figures 1 to 3 The embodiments of the present application first provide a hot wire architecture 100, which includes a hot wire 110, a first support structure 120, and a second support structure 130. The first support structure 120 and the second support structure 130 are arranged at intervals along a first direction. The first support structure 120 includes a plurality of first fixed columns 121 arranged at intervals along a second direction. The second support structure 130 includes a plurality of second fixed columns 131 arranged at intervals along the second direction. The hot wire 110 is alternately wound around the plurality of first fixed columns 121 and the plurality of second fixed columns 131 along the second direction to form a hot wire array 111.

[0044] It should be noted that the hot wire 110 in the embodiments of the present application is alternately wound around the plurality of first fixed columns 121 and the plurality of second fixed columns 131 along the second direction. For example, the first fixed column 121 arranged at the frontmost position is first wound along the second direction, then the second fixed column 131 arranged at the frontmost position is wound, and then the first fixed column 121 arranged at the second position is wound, and so on, until the last first fixed column 121 and the last second fixed column 131 are wound. This alternating winding method ensures that the hot wire 110 is evenly distributed between the first support structure 120 and the second support structure 130, forming a regular hot wire array 111.

[0045] It can be understood that, compared with the traditional contact type stretching parallel arrangement mode of multiple hot wires 110, the hot wire architecture 100 provided in the embodiment simplifies the circuit structure by the design of the alternately wound hot wire 110, which is directly connected between the first fixed column 121 and the second fixed column 131, so as to reduce the complex contact points and connection points required by the traditional multiple parallel hot wires 110, thereby reducing the requirement for electrical contact. Since the hot wire 110 is uniformly distributed in the array form between the two support structures, the distribution of current in the hot wire 110 is more uniform, avoiding the problem of uneven current distribution that may occur in the traditional parallel structure of the hot wire 110. The uniform current distribution reduces the specific requirements for the power current and reduces the need for large-current power to compensate for the insufficient current in some areas.

[0046] In addition, since the hot wire 110 is distributed in the array form, each section of the hot wire 110 can be fully utilized, avoiding the problem of low utilization rate of some hot wires 110 caused by the large resistance of the connection point resistance that may exist in the traditional parallel structure. That is, under the same power, the embodiment can obtain higher heating efficiency and more stable heating performance, so as to improve the effective utilization rate of the hot wire 110 and reduce the loss of the hot wire 110 during the working process.

[0047] It should be understood that, compared with the traditional design structure, the hot wire architecture 100 in the embodiment is more simplified to facilitate expansion. Specifically, the hot wire architecture 100 in the embodiment is designed with the first support structure 120 and the second support structure 130 arranged at intervals along the first direction, wherein the first support structure 120 includes a plurality of first fixed columns 121, and the second support structure 130 includes a plurality of second fixed columns 131. The plurality of first fixed columns 121 and the plurality of second fixed columns 131 are arranged at intervals along the second direction. Therefore, the single hot wire 110 can be alternately wound along the second direction between the plurality of first fixed columns 121 and the plurality of second fixed columns 131 to form the hot wire array 111. When expanding, only the number of the first fixed column 121 and the second fixed column 131 and the interval between the adjacent two first fixed columns 121 and the two second fixed columns 131 need to be adjusted, so that the expansion of the hot wire array 111 can be realized. The hot wire array 111 can have a larger or smaller coverage area to adapt to different diamond thin film preparation requirements. The hot wire architecture 100 provided in the embodiment is convenient to replace the hot wire 110 after completing a round of diamond thin film growth, without the need for too many complex clamps or connection point fixation. Only the hot wire 110 needs to be directly taken off or wound on the first fixed column 121 and the second fixed column 131, so that the maintenance convenience is higher, and the continuity and repeatability of the thin film growth are improved by the replacement of the hot wire 110.

[0048] In some embodiments, to improve the uniformity of the distribution of the heating wires 110, at least part of each first fixed column 121 is located between two adjacent second fixed columns 131 in the second direction.

[0049] For example, each first fixed column 121 can be located entirely between two adjacent second fixed columns 131 in the second direction, the length of each first fixed column 121 in the second direction is just equal to the distance between the two adjacent second fixed columns 131, and the heating wire array 111 formed is a regular rectangle; or each first fixed column 121 can be located partially between two adjacent second fixed columns 131 in the second direction, and the heating wire array 111 formed is an inclined rectangle.

[0050] It should be understood that in the present embodiment, the arrangement of the heating wires 110 in the heating wire array 111 is mainly affected by the arrangement of the first fixed columns 121 and the second fixed columns 131. The arrangement of the first fixed columns 121 and the second fixed columns 131 provided in the present embodiment ensures that the heating wires 110 can be more uniformly distributed in the entire heating area and cover a wider area when they are alternately wound around the first fixed columns 121 and the second fixed columns 131, avoiding local temperature unevenness, and heat can be more effectively transferred to the target area.

[0051] In an alternative embodiment of the present application, the ratio of the distance between two adjacent first fixed columns 121 to the diameter of the first fixed column 121 is 0.5-3, and the ratio of the distance between two adjacent second fixed columns 131 to the diameter of the second fixed column 131 is 0.5-3.

[0052] It can be understood that the distance between the multiple heating wire segments 110 arranged in the second direction of the heating wire array 111 is mainly affected by the distance between two adjacent first fixed columns 121, the diameter of the first fixed column 121 itself, and the distance between two second fixed columns 131 and the diameter of the second fixed column 131 itself. By designing the ratio of the distance between two adjacent first fixed columns 121 to the diameter of the first fixed column 121 to be within the range of 0.5-3 and the ratio of the distance between two adjacent second fixed columns 131 to the diameter of the second fixed column 131 to be within the range of 0.5-3, the multiple heating wire segments 110 arranged in the second direction of the heating wire array 111 can be more uniformly arranged, so as to ensure that heat can be uniformly distributed in the entire heating area.

[0053] In the preferred embodiments of the present application, the distance between two adjacent first fixing columns 121 is equal to the diameter of the first fixing column 121, i.e., the distance between two adjacent first fixing columns 121 is in a size ratio of 1 to the diameter of the first fixing column 121; the distance between two adjacent second fixing columns 131 is equal to the diameter of the second fixing column 131, i.e., the distance between two adjacent second fixing columns 131 is in a size ratio of 1 to the diameter of the second fixing column 131, and the diameter of the first fixing column 121 is the same as that of the second fixing column 131. This design can make the single hot wire 110 alternately wound on the hot wire array 111 formed by the first fixing column 121 and the second fixing column 131, and the multiple hot wire segments arranged in the second direction in the hot wire array 111 present a periodic arrangement form with the same interval, so as to ensure that the heat can be uniformly distributed in the entire heating area. Since the distance between the hot wire segments is fixed, the temperature of the heating area can be accurately controlled by adjusting the power or current of the hot wire 110, so that the temperature control of the heating area is easier.

[0054] To further improve the stability of the hot wire array 111, in some embodiments of the present application, the first support structure 120 further comprises a first support plate 122, and each first fixing column 121 protrudes from and is connected to the first support plate 122 in the third direction; the second support structure 130 further comprises a second support plate 132, and each second fixing column 131 protrudes from and is connected to the second support plate 132 in the third direction.

[0055] In the embodiments, the first support plate 122 and the second support plate 132 are both rectangular plate-shaped members, the first support plate 122 and the second support plate 132 both extend in the second direction, the multiple first fixing columns 121 protrude from and are connected to the first support plate 122 in the third direction, and the multiple second fixing columns 131 protrude from and are connected to the second support plate 132 in the third direction. Therefore, the multiple first fixing columns 121 and the multiple second fixing columns 131 are respectively supported by the first support plate 122 and the second support plate 132, which not only ensures the stability and positioning accuracy of the first fixing column 121 and the second fixing column 131, but also helps the heat transfer and distribution of the hot wire 110 in the third direction, and significantly improves the stability of the hot wire array 111 formed by the alternately wound hot wires 110.

[0056] To further improve the connection stability of the first fixing column 121 and the second fixing column 131, in some embodiments of the present application, the first fixing column 121 comprises a first column body and a first connecting piece, the first column body is provided with a through first connecting hole in the third direction, and the first connecting piece is fixedly connected to the first support plate 122 through the first connecting hole; the second fixing column 131 comprises a second column body and a second connecting piece, the second column body is provided with a through second connecting hole in the third direction, and the second connecting piece is fixedly connected to the second support plate 132 through the second connecting hole.

[0057] In this embodiment, the first fixed column 121 and the second fixed column 131 adopt the same design concept to improve the connection stability. Taking the first fixed column 121 as an example, the first fixed column 121 includes a first column body and a first connecting piece. The first column body is provided with a through first connecting hole in the third direction. The first connecting piece is fixedly connected with the first support plate 122 through the first connecting hole. For example, the first column body can be a hollow cylinder. The first connecting piece can be a bolt, a rivet or a fixed pin. The first connecting piece is fixedly connected to the first support plate 122 in the third direction through the first column body. The second fixed column 131 adopts this design concept, and details are not repeated. This design can ensure that the first fixed column 121 and the second fixed column 131 are not easy to displace or loosen when subjected to external force, thereby improving the stability of the overall structure. The stable connection of the first fixed column 121 and the first support plate 122, and the second fixed column 131 and the second support plate 132 is achieved respectively. The stability of the hot wire frame structure 100 is greatly improved, and the thermal stability of the hot wire array 111 is also effectively improved.

[0058] In addition, in order to facilitate expansion, the first support plate 122 and the second support plate 132 can be provided with a plurality of positioning holes in advance. These positioning holes can be distributed at different positions in the second direction (i.e. the extension direction of the hot wire array 111) to adapt to the connection of the first connecting piece or the second connecting piece. When expansion is needed, the plurality of positioning holes provided in advance allow the positions of the first connecting piece or the second connecting piece to be quickly selected and positioned according to actual needs, so that the installation and disassembly of the first fixed column 121 and the second fixed column 131 become simple and fast, without the need for complex measurement and positioning work. Since the positioning holes are distributed in the second direction, the number and position of the first connecting piece and the second connecting piece can be flexibly selected according to the size, shape or power requirement of the heating area, so that the configuration of the hot wire frame structure 100 is more flexible and diverse, and more expandable.

[0059] In order to adapt to high-temperature working environment, in some embodiments, the first support plate 122, the second support plate 132, the first fixed column 121 and the second fixed column 131 in the hot wire frame structure 100 are all made of any one of metal molybdenum, metal tantalum and insulating ceramic. Metal molybdenum and metal tantalum, and insulating ceramic have good high-temperature stability and oxidation resistance, and can still maintain good performance in high-temperature environment, and are not easy to deform or damage, thereby improving the safety and reliability of the hot wire frame structure 100.

[0060] The insulating ceramic in this embodiment can be any one of aluminum nitride, aluminum oxide or boron nitride, which has high melting point and excellent insulation performance.

[0061] It should be noted that in the hot wire structure 100 provided in this application embodiment, except for the two ends electrically connected to the electrode assembly 200, the remaining parts of the single hot wire 110 should be directly or indirectly insulated from other components. During long-term operation or in high-temperature environments, electrical contact between the hot wire 110 and other components can lead to damage or performance degradation of the hot wire 110. Insulation design can prevent such electrical contact, thereby extending the service life of the hot wire 110 and improving the stability of the equipment. Furthermore, this insulation design can prevent current leakage caused by contact or short circuit between the hot wire 110 and other components, thereby reducing the energy consumption of the equipment and improving energy utilization efficiency.

[0062] Therefore, if the first fixing post 121 and the second fixing post 131 are made of high-melting-point conductive metals (such as molybdenum or tantalum), then the first support plate 122 and the second support plate 132 should be made of high-melting-point insulating materials (such as insulating ceramics). Alternatively, if the first fixing post 121 and the second fixing post 131 are made of high-melting-point insulating materials, the first support plate 122 and the second support plate 132 can be made of either high-melting-point metals or high-melting-point insulating materials. In general, while meeting the insulation requirements of the hot wire 110, the hot wire structure 100 can be flexibly combined according to the application scenario and cost considerations, making it more scalable.

[0063] Since the hot wire structure 100 needs to operate at high temperatures, the hot wire 110 in this embodiment is preferably made of tantalum wire. Tantalum has an extremely high melting point, reaching 2996°C, which allows the tantalum wire to maintain stable performance at high temperatures and is not easily melted or deformed. Of course, in some embodiments, the hot wire 110 may also be made of materials such as tungsten wire, all of which are suitable for the hot wire structure 100 provided in this embodiment.

[0064] In practical applications, the hot wire array 111 formed by a single hot wire 110 may experience thermal expansion due to heating, causing the hot wire array 111 to loosen and affecting the effective utilization rate of the hot wire 110 and the stability of film growth. Therefore, refer to... Figure 3 As shown, in some embodiments of this application, the hot wire architecture 100 further includes a first adjustment component 140, which is connected to the first support structure 120 and is used to drive the first support structure 120 to move in a first direction to adjust the tension of the hot wire array 111; or the hot wire architecture 100 further includes a second adjustment component 150, which is connected to the second support structure 130 and is used to drive the second support structure 130 to move in a first direction to adjust the tension of the hot wire array 111.

[0065] It should be understood that the first adjusting assembly 140 and the second adjusting assembly 150 can be selected according to different application scenarios, and the configuration of either the first adjusting assembly 140 or the second adjusting assembly 150 can realize the adjustment of the tension of the hot wire array 111 in a high-temperature environment, so that the hot wire array 111 maintains a tensioned state; taking the first adjusting assembly 140 as an example, the first adjusting assembly 140 can be connected with the first support plate 122 to drive the first support plate 122 to move in the first direction, thereby adjusting the tension of the hot wire array 111, so that the hot wire array 111 under high-temperature heating maintains a tensioned state, thereby improving the effective utilization rate of the hot wire 110 and the stability of film growth.

[0066] In the preferred embodiment of the present application, the hot wire architecture 100 further comprises a first adjusting assembly 140 and a second adjusting assembly 150, the first adjusting assembly 140 is connected to the first support structure 120 for driving the first support structure 120 to move in the first direction to adjust the tension of the hot wire array 111, and the second adjusting assembly 150 is connected to the second support structure 130 for driving the second support structure 130 to move in the first direction to adjust the tension of the hot wire array 111. The simultaneous action of the first adjusting assembly 140 and the second adjusting assembly 150 can more accurately and effectively maintain the stability and tension of the hot wire array 111, compensate for the thermal expansion of the hot wire 110 during high-temperature heating, keep the hot wire array 111 in a tight state, and avoid affecting the use effect and the stability of film growth due to relaxation.

[0067] To realize automatic adjustment of the tension of the hot wire array 111 under high-temperature working conditions, the first adjusting assembly 140 comprises a first mounting column 141 and a first elastic member 142, the first elastic member 142 is located between the first mounting column 141 and the first support structure 120 in the first direction and is connected to the first mounting column 141 and the first support structure 120; and / or the second adjusting assembly 150 comprises a second mounting column 151 and a second elastic member 152, the second elastic member 152 is located between the second mounting column 151 and the second support structure 130 in the first direction and is connected to the second mounting column 151 and the second support structure 130.

[0068] It can be understood that the first adjusting assembly 140 in the embodiment comprises a first mounting column 141 and a first elastic member 142, the first elastic member 142 can be a tension spring, and the first elastic member 142 is located between the first mounting column 141 and the first support plate 122 in the first direction and is connected to the first mounting column 141 and the first support plate 122; thus, when the hot wire 110 is thermally expanded due to high temperature, the first support plate 122 is subjected to the contraction deformation of the first elastic member 142, and an acting force (such as a force F1) in the direction of the first mounting column 141 is generated on the hot wire 110 wound on the first fixed column 121. Figure 3As shown, the first elastic element 142 releases a portion of its force when the temperature decreases, thereby maintaining the tension of the hot wire array 111. When the temperature drops, the hot wire 110 contracts, and the first elastic element 142 releases a portion of its force, causing the first support plate 122 to move away from the first mounting post 141, thus maintaining the appropriate tension of the hot wire array 111 and ensuring that the hot wire array 111 remains taut. Similarly, the second adjustment component 150 operates on the same principle as the first adjustment component 140, both using the stretching and releasing of the second elastic element 152 to automatically adjust the tension of the hot wire array 111.

[0069] It should be noted that the number and specific location of the first adjustment component 140 and / or the second adjustment component can be selected according to different application scenarios. For example, one or two first adjustment components 140 can be arranged (e.g., Figure 1 (as shown), three or more; similarly, the second adjustment component 150 can also be arranged in one or two (as shown). Figure 1 (As shown), three or more. It should be understood that, in order to ensure the adjustment effect, the selection of the first elastic element 142 and the second elastic element 152 should be based on the actual working conditions. For example, when the first elastic element 142 and the second elastic element 152 are tension springs, the diameter and number of tension springs can be selected with reference to the diameter of the hot wire 110, as well as the working temperature and the tension at the highest working temperature. The hot wire array 111 is kept straight under sufficient elasticity at high temperature, while also ensuring that it is not overstretched, which may cause the hot wire 110 to break, so as not to affect the service life.

[0070] To prevent the hot filament array 111 from shifting during the application of force by the first elastic element 142 or the second elastic element 152, thus affecting the film growth quality, refer to Figure 3 As shown, in some embodiments of this application, the hot wire architecture 100 further includes a guide structure 160, which is slidably connected to the first support structure 120 and the second support structure 130, so that the first support structure 120 and the second support structure 130 can slide relative to the guide structure 160 in a first direction.

[0071] In this embodiment, the first support plate 122 and the second support plate 132 are slidably connected to the guide structure 160 at their bottoms. The guide structure 160 can restrict the degree of freedom of the first support plate 122 and the second support plate 132 in the second direction, and provide guidance to the first support plate 122 and the second support plate 132 in the second direction. This allows the first support plate 122 and the second support plate 132 to move only in the first direction under the action of the corresponding first elastic member 142 and the second elastic member 152, thereby avoiding the situation where the hot wire array 111 is deflected or tilted due to multi-directional forces during the adjustment process. This greatly improves the performance and reliability of the hot wire array 111 under high-temperature conditions.

[0072] In one embodiment, the guide structure 160 is provided with a first limiting sliding groove 161 and a second limiting sliding groove 162, which are arranged along the first direction and extend along the first direction. For example, the first limiting sliding groove 161 is a long slot extending along the first direction, which is matched in shape and size with the bottom of the first support plate 122 to ensure that the first support plate 122 can smoothly slide therein. The second limiting sliding groove 162 also extends along the first direction and is arranged apart from the first limiting sliding groove 161. The second limiting sliding groove 162 is matched in shape and size with the bottom of the second support plate 132 to ensure that the second support plate 132 can also smoothly slide therein. The first support plate 122 is located in the first limiting sliding groove 161, and the second support plate 132 is located in the second limiting sliding groove 162. Due to the limitation of the first limiting sliding groove 161, the first support plate 122 will not deviate in other directions during sliding. Similarly, due to the limitation of the second limiting sliding groove 162, the second support plate 132 will not deviate in other directions during sliding.

[0073] When the tension of the hot wire array 111 needs to be adjusted, the first elastic member 142 and the second elastic member 152 act on the first support plate 122 and the second support plate 132, respectively, to push them to slide along the first direction in the respective first limiting sliding groove 161 and second limiting sliding groove 162. Due to the limiting effect of the first limiting sliding groove 161 and the second limiting sliding groove 162, the first support plate 122 and the second support plate 132 can only move along the first direction, thereby avoiding the deviation or skew of the hot wire array 111 caused by the multi-directional force during adjustment. Thus, the design of the embodiment not only improves the stability of the hot wire array 111, but also ensures the accuracy and reliability of the adjustment. At the same time, due to the simple design of the guide structure 160, the production cost and maintenance cost are also reduced.

[0074] Reference Figure 4 The embodiment of the present application also provides a chemical vapor deposition equipment 10, which comprises at least two electrode assemblies 200 and at least one hot wire structure 100 as described above. Each hot wire array 111 is connected with two electrode assemblies 200 at both ends in the second direction.

[0075] The chemical vapor deposition equipment 10 provided by the embodiment can have one or multiple hot wire structures 100, each of which is correspondingly provided with two electrode assemblies 200, so that the electrode assemblies 200 can also be two or more than two; the two electrode assemblies 200 corresponding to each hot wire structure 100 can be arranged between the corresponding first support plate 122 and the second support plate 132, and simultaneously located at the two ends of the corresponding hot wire array 111 in the second direction, and the electrode assemblies 200 are mainly used to heat the hot wire array 111 connected thereto.

[0076] In one specific embodiment, as shown in Figure 3 The guiding structure 160 can be a support frame provided with the first limiting sliding groove 161 and the second limiting sliding groove 162, and the electrode assemblies 200 are connected to the guiding structure 160 in the third direction, and the first mounting column 141 and the second mounting column 151 are connected to the guiding structure 160 in the third direction.

[0077] Each electrode assembly 200 includes an electrode column, a third connecting piece, and an insulating gasket; the electrode column protrudes in the third direction and is connected to the guiding structure 160 (see Figure 3 ), the electrode column can be made of metal molybdenum material, the electrode column is provided with a third connecting hole penetrating in the third direction, and the insulating gasket is arranged between the electrode column and the guiding structure 160; the third connecting piece (which can be a bolt) passes through the third connecting hole and the insulating gasket in the third direction and is connected to the guiding structure 160, so as to realize the connection and insulation of the electrode column and the guiding structure 160, and the hot wire 110 is fixedly connected between the corresponding third connecting piece and third connecting hole in the second direction, so as to realize the electrical connection of the hot wire 110 and the electrode assembly 200.

[0078] In some embodiments, the electrode assembly 200 can also directly protrude in the third direction and be connected to the first support plate 122 and / or the second support plate 132, which can realize the stable power supply of the hot wire array 111 and meet the heating requirements of the hot wire array 111.

[0079] In order to ensure the insulation of the hot wire 110, in some optional embodiments of the application, on the basis of the above structure design, the materials of the components can be as follows: the first support plate 122 and the second support plate 132 can be high-melting-point metal or insulating material, the first column and the second column can be high-melting-point insulating material, the first connecting piece and the second connecting piece can be high-melting-point metal material, and the third connecting piece and the insulating gasket can be ceramic material. Through the design of the materials of the components, the above embodiments can effectively ensure that the hot wire 110 is insulated from the components except the two ends.

[0080] On the basis of the above structural design, the first support plate 122 and the second support plate 132 can be high-melting-point metals, the first column and the second column can be high-melting-point metal materials, the first column and the first support plate 122 are connected, and a ceramic gasket is arranged between the first column and the first support plate 122, the second column and the second support plate 132 are connected, and a ceramic gasket is arranged between the second column and the second support plate 132, and the third connecting piece and the insulating gasket can be ceramic materials. The above embodiments can effectively ensure that the hot wire 110 is insulated from the components except the two ends.

[0081] On the basis of the above structural design, the first support plate 122 and the second support plate 132 can be high-melting-point metals, the first column and the second column can be high-melting-point metal materials, the first column and the first support plate 122 are connected, and a ceramic gasket is arranged between the first column and the first support plate 122, the second column and the second support plate 132 are connected, and a ceramic gasket is arranged between the second column and the second support plate 132, and the third connecting piece and the insulating gasket can be ceramic materials. The above embodiments can effectively ensure that the hot wire 110 is insulated from the components except the two ends.

[0082] In summary, the hot wire architecture 100 and the chemical vapor deposition equipment 10 provided by the embodiments of the present application can greatly reduce the demand of the hot wire architecture 100 on electrical contact and power supply by optimizing the structure of the hot wire architecture 100 and adopting the layout mode of single hot wire 110 in series stretching, and the single hot wire 110 is arranged alternately between the first fixed column 121 of the first support structure 120 and the second fixed column 131 of the second support structure 130 to form a hot wire array 111, which is convenient for modular expansion. In the working process, the effective utilization rate of the hot wire 110 is high, the loss is relatively low, the hot wire 110 is easy to maintain and replace after each round of diamond film growth, the continuity and repeatability of the film growth are significantly improved, the use cost and maintenance cost are reduced, and the industrialization process of the hot wire 110 CVD diamond film growth is effectively promoted.

[0083] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A hot wire structure (100), characterized in that, It includes a hot wire (110), a first support structure (120) and a second support structure (130); The first support structure (120) and the second support structure (130) are spaced apart along a first direction; The first support structure (120) includes a plurality of first fixed columns (121), which are spaced apart along a second direction; the second support structure (130) includes a plurality of second fixed columns (131), which are spaced apart along the second direction. The hot wire (110) is alternately wound around a plurality of first fixed posts (121) and a plurality of second fixed posts (131) in sequence along the second direction to form a hot wire array (111) by series stretching. The hot wire (110) is only used to be electrically connected to the electrode assembly (200) at both ends of the hot wire array (111) in the second direction, and the rest is insulated from each component. The hot wire architecture (100) further includes a first adjustment component (140), which is connected to the first support structure (120) and is used to drive the first support structure (120) to move in the first direction to adjust the tension of the hot wire array (111); and / or the hot wire architecture (100) further includes a second adjustment component (150), which is connected to the second support structure (130) and is used to drive the second support structure (130) to move in the first direction to adjust the tension of the hot wire array (111); The first adjustment assembly (140) includes a first mounting post (141) and a first elastic member (142), the first elastic member (142) being located between the first mounting post (141) and the first support structure (120) in the first direction and connected to the first mounting post (141) and the first support structure (120); and / or the second adjustment assembly (150) includes a second mounting post (151) and a second elastic member (152), the second elastic member (152) being located between the second mounting post (151) and the second support structure (130) in the first direction and connected to the second mounting post (151) and the second support structure (130); The hot wire architecture (100) further includes a guide structure (160) which is slidably connected to the first support structure (120) and the second support structure (130) so that the first support structure (120) and the second support structure (130) can slide relative to the guide structure (160) in the first direction.

2. The filament structure (100) according to claim 1, characterized in that, At least a portion of each of the first fixing posts (121) is located between two adjacent second fixing posts (131) in the second direction.

3. The filament structure (100) according to claim 1, characterized in that, The ratio of the distance between two adjacent first fixing posts (121) to the diameter of the first fixing post (121) is 0.5 to 3; and / or The ratio of the distance between two adjacent second fixed posts (131) to the diameter of the second fixed post (131) is 0.5 to 3.

4. The filament structure (100) according to claim 1, characterized in that, The first support structure (120) further includes a first support plate (122), and each of the first fixed columns (121) protrudes from and is connected to the first support plate (122) in a third direction. The second support structure (130) also includes a second support plate (132), and the second fixing column (131) protrudes in a third direction and is connected to the second support plate (132).

5. The filament structure (100) according to claim 4, characterized in that, The first fixed column (121) includes a first column body and a first connector. The first column body has a through first connecting hole in a third direction. The first connector passes through the first connecting hole and is fixedly connected to the first support plate (122); and / or The second fixed column (131) includes a second column body and a second connector. The second column body has a through second connecting hole along a third direction. The second connector passes through the second connecting hole and is fixedly connected to the second support plate (132).

6. The filament structure (100) according to claim 1, characterized in that, Both the first fixing post (121) and the second fixing post (131) are made of any one of molybdenum, tantalum and insulating ceramic.

7. A chemical vapor deposition apparatus (10), characterized in that, It includes at least two electrode assemblies (200) and at least one hot wire structure (100) as described in any one of claims 1 to 6. Each of the hot wire arrays (111) is connected to two of the electrode assemblies (200) at both ends in the second direction.

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