A semiconductor chip multi-head batch glue dispensing device and glue dispensing method

Abstract

The present invention relates to the field of semiconductor chip glue dispensing technology, and in particular to a semiconductor chip multi-head batch glue dispensing device and a glue dispensing method thereof. It comprises a base, two groups of side panels are fixedly connected to the base, and transmission components are arranged on the two groups of side panels; a recovery box is arranged on one side of the base, a liquid storage tank is arranged on the recovery box, a liquid pump is installed on the liquid storage tank, and the liquid outlet of the liquid pump is connected to a plurality of groups of glue dispensing pens; the transmission component comprises a first horizontal plate and a second horizontal plate, and a driving mechanism is arranged on one side of the first horizontal plate; the driving mechanism drives a plurality of groups of glue dispensing pens to move back and forth, and at the same time, the driving mechanism drives the transmission component to move, so that a plurality of groups of glue dispensing pens can reciprocate horizontally on the surface of a corresponding group of semiconductor chips and make intermittent longitudinal movements at the same time, so that the surfaces of the semiconductor chips are evenly glued.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor chip dispensing, and in particular relates to a semiconductor chip multi-head batch dispensing device and a dispensing method thereof. Background Art

[0002] During the production of semiconductor chips, glue dispensing machines are required. Most traditional glue dispensing machines can only dispense glue on one set of semiconductor substrates at a time. In addition, the glue cannot be moved on the surface of the semiconductor chip during the dispensing process, so that the glue cannot be evenly distributed on the surface of the semiconductor chip, affecting the subsequent pasting effect of the semiconductor chip.

[0003] After searching, in the prior art, the publication number: CN220177364U, the publication date: 2023-12-15, discloses a dispensing mechanism for semiconductor chip production, including a processing table and an equipment slot, the processing table is provided with a placement slot inside, the placement slot is rotatably connected to an output rod inside, and a track slot is provided on the outside of the rod body of the output rod. In this application, the semiconductor chip is first placed on the top of the slide frame, and the electric telescopic rod is further started to drive the output plate to descend while driving the clamps on both sides to move to clamp the semiconductor chip. When the clamping force is too large, the clamp drives the slide bar to slide outward, and further compressing the spring can make the clamp have a buffering force, thereby achieving the purpose of positioning semiconductor chips of different sizes and preventing the clamping force from being too large to damage the chip. In addition, by starting the motor, the slider can be moved while driving the hydraulic rod and the dispenser to move to the corresponding position, thereby achieving the purpose of facilitating the adjustment of the dispensing position.

[0004] However, the device still has the following defects: although the slider can be moved by starting the motor and the hydraulic rod and the glue dispenser can be moved to the corresponding position, thereby achieving the purpose of facilitating the adjustment of the glue dispensing position, the device cannot move the glue on the surface of the semiconductor chip during the glue dispensing process, so that the glue cannot be evenly distributed on the surface of the semiconductor chip, affecting the subsequent bonding effect of the semiconductor chip. Summary of the invention

[0005] In view of the above problems, the present invention provides a semiconductor chip multi-head batch glue dispensing device and a glue dispensing method thereof, comprising a base, two sets of side plates are fixedly connected to the base, and the two sets of side plates are provided with transmission components;

[0006] A recovery box is provided on one side of the base, a liquid storage tank is provided on the recovery box, a liquid pump is installed on the liquid storage tank, and a liquid outlet end of the liquid pump is connected to a plurality of groups of glue dispens;

[0007] A limiting mechanism is provided on the base, and a plurality of groups of semiconductor chips are movably connected to the limiting mechanism;

[0008] The transmission assembly comprises a first transverse plate and a second transverse plate, and a driving mechanism is disposed on one side of the first transverse plate;

[0009] By driving a plurality of groups of dispensing pens to move back and forth through a driving mechanism, and at the same time driving a transmission assembly to move through a driving mechanism, a plurality of groups of dispensing pens can respectively dispensing glue back and forth laterally on the surface of a corresponding group of semiconductor chips while making intermittent longitudinal movements, so that the surface of the semiconductor chips is evenly dispensing glue.

[0010] Furthermore, a fixing block is provided on one side wall opposite to the two groups of side panels, an electric push rod is installed on the two groups of fixing blocks, the output ends of the two groups of electric push rods are transmission-connected with a scraper plate, and the limiting mechanism is movably fitted with the scraper plate.

[0011] Furthermore, two groups of limit grooves are provided on the inner side wall of the base, and both groups of limit grooves are movably fitted with the limit mechanism. A guide box is provided on the base, and a guide groove is provided on the guide box. The guide groove is fitted on one side of the limit mechanism, and the guide box is connected to the recovery box.

[0012] Furthermore, two groups of slide grooves are provided on the two groups of side panels, and one group of side panels is provided with a rack groove, the rack groove is arranged between the two groups of slide grooves, and a rack is laid on the bottom end of the inner wall of the rack groove. Two groups of first support shafts are fixedly connected to the bottom end of the second horizontal plate, and two groups of sliding shafts are fixedly connected between the first horizontal plate and the second horizontal plate. A clamping mechanism is slidably connected to the two groups of sliding shafts, and the clamping mechanism is fixedly connected to several groups of glue dispensing pens.

[0013] Furthermore, the bottom end of the first horizontal plate is fixedly connected to a vertical plate, the bottom end of the vertical plate is fixedly connected to a bottom plate, the bottom end of the bottom plate is fixedly connected to two groups of second support shafts, the bottom ends of the two groups of second support shafts are movably fitted with the inner walls of the corresponding two groups of slide grooves, and the bottom ends of the two groups of second support shafts and the first support shaft are both provided with rollers.

[0014] Furthermore, a gear is installed at the bottom end of the base plate, and the gear is meshed with the rack. The side wall of the vertical plate is rotatably connected with an incomplete gear. A through groove is opened on the base plate, and the incomplete gear penetrates the through groove and meshes with the gear. A second linkage shaft is fixedly connected at the center of the incomplete gear, and a belt is sleeved on the second linkage shaft after penetrating the vertical plate. The side wall of the vertical plate is rotatably connected with a driven bevel gear, and the center of the driven bevel gear is fixedly connected with a first linkage shaft, and the other end of the belt is sleeved on the first linkage shaft.

[0015] Furthermore, a transmission groove is provided on the first horizontal plate, and the driving mechanism includes a fixed plate, a motor is installed on the fixed plate, the output end of the motor is connected to a transmission shaft, a turntable is fixedly connected to the transmission shaft, a fixed shaft is provided on the turntable, the top end of the fixed shaft is fixedly connected to a limiting block, the bottom end of the transmission shaft passes through the turntable and is fixedly connected to a driving bevel gear, and the driving bevel gear is meshingly connected to the driven bevel gear.

[0016] Furthermore, the clamping mechanism includes a clamping plate, which is provided with a plurality of groups of clamping grooves, which are respectively fixedly connected to the side walls of a plurality of groups of dispensing pens, and the side wall of the clamping plate is provided with two groups of sliding holes, which are respectively movably fitted with two groups of sliding shafts, and the side wall of the clamping plate is installed with a hinged frame, which is rotatably connected with a linkage rod, and the other end of the linkage rod is provided with a through hole, which is movably fitted with a fixed shaft.

[0017] Furthermore, the limiting mechanism includes a limiting plate, a handle is provided on the limiting plate, both side walls of the limiting plate are fixedly connected to the limiting strip, a plurality of groups of grooves are provided on the limiting plate, connecting grooves are provided between the plurality of groups of grooves, a feed plate is clamped in the plurality of groups of grooves, the feed plate and the bottom end of the semiconductor chip are fitted together, connecting blocks are provided between the plurality of groups of feed plates, the plurality of groups of connecting blocks are movably fitted with the plurality of groups of connecting grooves respectively, a push plate is fixedly connected to one group of feed plates, a push groove is provided on the limiting plate, and the push plate passes through the push groove and extends to the outside of the limiting plate.

[0018] A glue dispensing method for a semiconductor chip multi-head batch glue dispensing device, the glue dispensing method comprising:

[0019] Place the semiconductor chip that needs to be glued on the limiting mechanism for limiting;

[0020] The liquid pump and the driving mechanism are turned on, and the liquid pump draws glue from the liquid storage tank and drips it onto the surface of the semiconductor chip through several groups of glue dispens;

[0021] The driving mechanism drives the dispensing pen to move back and forth horizontally to complete the horizontal reciprocating dispensing operation of each group of semiconductor chips, and at the same time, the dispensing pen moves longitudinally along the surface of the corresponding group of semiconductor chips;

[0022] After the uniform dispensing of the semiconductor chip is completed, the liquid pump and the driving mechanism are turned off;

[0023] Pull out the limiting mechanism, take out the semiconductor chips that have completed the dispensing operation, and then put in the next group of semiconductor chips to continue the dispensing operation.

[0024] The beneficial effects of the present invention are:

[0025] 1. The motor drives the transmission shaft to rotate, so that the turntable and the active bevel gear rotate synchronously. The turntable drives several groups of dispensing pens to move back and forth, so that several groups of dispensing pens perform horizontal reciprocating dispensing operations on the surfaces of a corresponding group of semiconductor chips. The active bevel gear drives the driven bevel gear to rotate, so that the incomplete gear drives the gear to rotate, and at the same time drives the transmission component to move, so that several groups of dispensing pens can move longitudinally for a distance, so that several groups of dispensing pens can reciprocate horizontally on the surfaces of a corresponding group of semiconductor chips and make intermittent longitudinal movements at the same time, so that the surfaces of the semiconductor chips are evenly dispensed with glue, thereby improving the subsequent pasting effect of the semiconductor chips.

[0026] 2. By making several groups of feed plates fit on the bottom of the inner wall of the groove, the semiconductor chips are placed on the feed plates respectively, and the semiconductor chips are limited by the groove so that several groups of semiconductor chips are located directly under several groups of dispensing pens respectively. The glue in the storage tank is extracted by the liquid pump, and flows into several groups of glue guide hoses through the glue outlet pipe, and finally flows out through the dispensing pen to the surface of the semiconductor chip for dispensing. The device can perform batch dispensing operations on multiple groups of semiconductor chips at the same time, effectively improving the dispensing efficiency.

[0027] 3. The scraper is driven by two sets of electric push rods to move and scrape off the excess glue accumulated on the semiconductor chip, so that the glue distribution on the semiconductor chip is more even, and the glue accumulation is avoided to cause the overflow of glue during the pasting process of the semiconductor chip. The scraper drives the excess glue to move to one side of the guide box, and continues to move so that the glue enters the guide box through the guide groove, and finally enters the recovery box for centralized treatment to facilitate the recycling of glue, effectively saving energy.

[0028] 4. Pull out the limit plate by pulling the handle, push the push plate upward, drive the discharge plate to move upward synchronously, and move the semiconductor chip upward to the outside of the groove, so that the semiconductor chip after the dispensing operation is conveniently taken out, and then the next group of semiconductor chips that need to be dispensed are placed in the groove, and the dispensing operation is continued, which effectively reduces the difficulty of replacing semiconductor chips, makes the replacement of semiconductor chips faster, and reduces the workload of workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the main structure of an embodiment of the present invention is shown;

[0031] Figure 2 A schematic diagram of the internal structure of a base according to an embodiment of the present invention is shown;

[0032] Figure 3 The embodiment of the present invention is shown Figure 2 The enlarged schematic diagram at A in the middle;

[0033] Figure 4 A schematic diagram of the structure of a transmission assembly according to an embodiment of the present invention is shown;

[0034] Figure 5 A partial structural schematic diagram of a bottom plate according to an embodiment of the present invention is shown;

[0035] Figure 6 A schematic diagram of the structure of a driving mechanism according to an embodiment of the present invention is shown;

[0036] Figure 7 It shows a schematic structural diagram of a clamping mechanism according to an embodiment of the present invention;

[0037] Figure 8 A schematic structural diagram of a limiting mechanism according to an embodiment of the present invention is shown.

[0038] In the figure: 1, base; 2, side plate; 201, slide groove; 202, rack groove; 203, rack; 3, transmission assembly; 301, first horizontal plate; 302, second horizontal plate; 303, first support shaft; 304, roller; 305, slide shaft; 306, clamping mechanism; 3061, clamping plate; 3062, clamping groove; 3063, slide hole; 3064, hinge frame; 3065, linkage rod; 3066, through hole; 307, vertical plate; 308, bottom plate; 309, second support shaft; 3010, transmission groove; 3011, driven bevel gear; 3012, first linkage shaft; 3013, incomplete gear; 3014, second linkage shaft; 3015, through groove; 3016, gear; 3017, Driving mechanism; 30171, fixed plate; 30172, motor; 30173, transmission shaft; 30174, turntable; 30175, fixed shaft; 30176, limit block; 30177, active bevel gear; 4, recovery box; 5, liquid storage tank; 6, liquid pump; 7, glue outlet pipe; 8, glue guide hose; 9, glue dispensing pen; 10, guide box; 1001, guide groove; 11, fixed block; 12, electric push rod; 13, scraper plate; 14, limit mechanism; 1401, limit plate; 1402, handle; 1403, limit strip; 1404, groove; 1405, connecting groove; 1406, discharge plate; 1407, connecting block; 1408, push plate; 1409, push groove; 15, limit groove. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The embodiment of the present invention provides a semiconductor chip multi-head batch dispensing device, including a base 1; illustratively, as Figure 1 shown.

[0041] Two groups of side panels 2 are fixedly connected to the base 1, and a transmission assembly 3 is arranged on the two groups of side panels 2. A recovery box 4 is arranged on one side of the base 1, and a liquid storage tank 5 is arranged on the recovery box 4. Glue is stored in the liquid storage tank 5, and a liquid pump 6 is installed on the liquid storage tank 5. The liquid inlet end of the liquid pump 6 is connected to the inside of the liquid storage tank 5, and the liquid outlet end of the liquid pump 6 is connected to a glue outlet pipe 7. The glue outlet pipe 7 is connected to a plurality of groups of glue guide hoses 8, and the other ends of the plurality of groups of the glue guide hoses 8 are connected to a glue dispensing pen 9, and the plurality of groups of the glue dispensing pen 9 are installed on the transmission assembly 3;

[0042] Specifically, the glue in the liquid storage tank 5 is extracted by the liquid pump 6, flows into several groups of glue guiding hoses 8 through the glue outlet pipe 7, and finally flows out through the glue dispensing pen 9. The glue dispensing pen 9 is driven by the transmission component 3 to move and perform a uniform glue dispensing operation. The overflowed glue is recovered by the recovery box 4, and the glue can be recycled after treatment.

[0043] For example, Figure 2 and Figure 3 shown.

[0044] A fixing block 11 is provided on one side wall opposite to the two groups of side panels 2, and an electric push rod 12 is installed on the two groups of fixing blocks 11. The output ends of the two groups of electric push rods 12 are transmission-connected with a scraper plate 13. A limiting mechanism 14 is provided on the base 1. A plurality of groups of semiconductor chips are movably connected to the limiting mechanism 14. The plurality of groups of semiconductor chips are respectively arranged directly below the plurality of groups of dispensing pens 9. The limiting mechanism 14 is movably fitted with the scraper plate 13. Two groups of limiting grooves 15 are provided on the inner side wall of the base 1. The two groups of limiting grooves 15 are movably fitted with the limiting mechanism 14. A guide box 10 is provided on the base 1. A guide groove 1001 is provided on the guide box 10. The guide groove 1001 is fitted on one side of the limiting mechanism 14. The guide box 10 is connected with the recovery box 4.

[0045] Two groups of slide grooves 201 are provided on the two groups of side plates 2, and a rack groove 202 is provided on one group of side plates 2. The rack groove 202 is arranged between the two groups of slide grooves 201, and a rack 203 is laid on the bottom end of the inner wall of the rack groove 202;

[0046] Specifically, a plurality of groups of semiconductor chips are limited by a limiting mechanism 14 so that the plurality of groups of semiconductor chips are respectively located directly below a plurality of groups of glue dispensing pens 9, and glue dispensing is performed on the surface of the semiconductor chips by the glue dispensing pens 9. After the glue dispensing is completed, the scraper plate 13 is driven by two groups of electric push rods 12 to move and scrape off the excess glue accumulated on the semiconductor chips, so that the glue distribution on the semiconductor chips is more even, while avoiding the overflow of glue caused by glue accumulation during the pasting process of the semiconductor chips. The scraper plate 13 drives the excess glue to move to one side of the guide box 10, and continues to move so that the glue enters the guide box 10 through the guide groove 1001, and finally enters the recovery box 4 for centralized treatment to facilitate glue recycling.

[0047] For example, Figure 4-6 shown.

[0048] The transmission assembly 3 includes a first horizontal plate 301 and a second horizontal plate 302, two groups of first support shafts 303 are fixedly connected to the bottom end of the second horizontal plate 302, the bottom ends of the two groups of the first support shafts 303 are respectively movably fitted with the inner walls of the corresponding two groups of slide grooves 201, two groups of sliding shafts 305 are fixedly connected between the first horizontal plate 301 and the second horizontal plate 302, and the two groups of the sliding shafts 305 are slidably connected with a clamping mechanism 306, and the clamping mechanism 306 is fixedly connected to a plurality of groups of glue dispensing pens 9;

[0049] The bottom end of the first horizontal plate 301 is fixedly connected to a vertical plate 307, the bottom end of the vertical plate 307 is fixedly connected to a bottom plate 308, the bottom end of the bottom plate 308 is fixedly connected to two groups of second support shafts 309, the bottom ends of the two groups of second support shafts 309 are movably fitted with the inner walls of the corresponding two groups of slide grooves 201, the bottom ends of the two groups of second support shafts 309 and the first support shaft 303 are both provided with rollers 304, the bottom end of the bottom plate 308 is installed with a gear 3016, the gear 3016 is meshed with the rack 203, and the side wall of the vertical plate 307 is rotatably connected There is an incomplete gear 3013, a through slot 3015 is opened on the bottom plate 308, the incomplete gear 3013 passes through the through slot 3015 and is meshed with the gear 3016, a second linkage shaft 3014 is fixedly connected at the center of the incomplete gear 3013, the second linkage shaft 3014 passes through the vertical plate 307 and is sleeved with a belt, the side wall of the vertical plate 307 is rotatably connected with a driven bevel gear 3011, the center of the driven bevel gear 3011 is fixedly connected with a first linkage shaft 3012, and the other end of the belt is sleeved on the first linkage shaft 3012;

[0050] A transmission groove 3010 is provided on the first transverse plate 301, and a driving mechanism 3017 is provided on one side of the first transverse plate 301. The driving mechanism 3017 includes a fixed plate 30171, and a motor 30172 is installed on the fixed plate 30171. The output end of the motor 30172 is connected to a transmission shaft 30173 in a transmission manner, and a rotating disk 30174 is fixedly connected to the transmission shaft 30173. A fixed shaft 30175 is provided on the rotating disk 30174, and the top of the fixed shaft 30175 is fixedly connected to a limiting block 30176. The bottom end of the transmission shaft 30173 passes through the rotating disk 30174 and is fixedly connected to a driving bevel gear 30177, and the driving bevel gear 30177 is meshed and connected with the driven bevel gear 3011;

[0051] Specifically, the motor 30172 drives the transmission shaft 30173 to rotate, so that the turntable 30174 and the active bevel gear 30177 rotate synchronously, so that the driven bevel gear 3011 drives the incomplete gear 3013 to rotate. Every time the incomplete gear 3013 rotates one circle, the gear 3016 rotates a certain angle. Due to the meshing relationship between the gear 3016 and the rack 203, the gear 3016 rotates and drives the transmission component 3 to move. That is, while the incomplete gear 3013 rotates, the transmission component 3 moves intermittently. The two sets of first support shafts 303 and second support shafts 309 are used to make the transmission component 3 more stable during movement.

[0052] The clamping mechanism 306 includes a clamping plate 3061; illustratively, Figure 7 shown.

[0053] The clamping plate 3061 is provided with a plurality of clamping grooves 3062, which are respectively fixedly connected to the side walls of the plurality of dispensing pens 9. The side wall of the clamping plate 3061 is provided with two groups of sliding holes 3063, which are respectively movably fitted with the two groups of sliding shafts 305. The side wall of the clamping plate 3061 is provided with an articulated frame 3064, which is rotatably connected with a linkage rod 3065. The other end of the linkage rod 3065 is provided with a through hole 3066, which is movably fitted with the fixed shaft 30175.

[0054] Specifically, by rotating the turntable 30174, the fixed shaft 30175 drives the linkage rod 3065 to move, thereby driving the clamping plate 3061 to make reciprocating horizontal movements. Every time the turntable 30174 rotates one circle, the clamping plate 3061 makes a period of reciprocating movement, that is, it drives several groups of dispensing pens 9 to make reciprocating movements, so that several groups of dispensing pens 9 respectively perform horizontal reciprocating dispensing operations on the surfaces of a corresponding group of semiconductor chips. Every time the turntable 30174 rotates one circle, the gear 3016 drives the transmission component 3 to move a certain distance, that is, several groups of dispensing pens 9 all move longitudinally for a certain distance, so that several groups of dispensing pens 9 can respectively perform horizontal reciprocating dispensing operations on the surfaces of a corresponding group of semiconductor chips while making intermittent longitudinal movements, so that the surfaces of the semiconductor chips are evenly dispensed with glue.

[0055] The limiting mechanism 14 includes a limiting plate 1401; illustratively, as Figure 8 shown.

[0056] The limit plate 1401 is provided with a handle 1402, and both side walls of the limit plate 1401 are fixedly connected to limit strips 1403, and two groups of limit strips 1403 are movably fitted with two groups of limit grooves 15 respectively. The limit plate 1401 is provided with a plurality of groups of grooves 1404, and connecting grooves 1405 are provided between the plurality of groups of grooves 1404. A discharge plate 1406 is clamped in the plurality of groups of grooves 1404. 1406 and the bottom end of the semiconductor chip are attached to each other, and a connection block 1407 is provided between several groups of the discharge plates 1406, and several groups of the connection blocks 1407 are movably attached to several groups of connection grooves 1405, respectively. A push plate 1408 is fixedly connected to one group of the discharge plates 1406, and a push groove 1409 is opened on the limiting plate 1401, and the push plate 1408 passes through the push groove 1409 and then extends to the outside of the limiting plate 1401;

[0057] Specifically, several groups of discharge plates 1406 are all attached to the bottom end of the inner wall of the groove 1404, and the semiconductor chips are placed on the discharge plates 1406 respectively. The semiconductor chips are limited by the groove 1404. After the dispensing operation is completed, the limit plate 1401 is pulled out by pulling the handle 1402, and the push plate 1408 is pushed to drive the discharge plates 1406 to move upward synchronously, so that the semiconductor chips are moved upward to the outside of the groove 1404, which is convenient for taking out the semiconductor chips after the dispensing operation.

[0058] The semiconductor chip multi-head batch dispensing device proposed by the present invention has the following working principle:

[0059] By making several groups of discharge plates 1406 fit on the bottom end of the inner wall of the groove 1404, the semiconductor chips are placed on the discharge plates 1406 respectively, and the semiconductor chips are limited by the groove 1404, so that the several groups of semiconductor chips are located directly below the several groups of dispensing pens 9 respectively, and the glue in the liquid storage tank 5 is extracted by the liquid pump 6, and flows into the several groups of glue guiding hoses 8 through the glue outlet pipe 7, and finally flows out through the dispensing pens 9 to the surface of the semiconductor chip for dispensing.

[0060] The transmission shaft 30173 is driven to rotate by the motor 30172, so that the turntable 30174 and the active bevel gear 30177 rotate synchronously. The turntable 30174 rotates, so that the fixed shaft 30175 drives the linkage rod 3065 to move, thereby driving the clamping plate 3061 to make reciprocating horizontal movements. Every time the turntable 30174 rotates one circle, the clamping plate 3061 makes a cycle of reciprocating movement, that is, it drives several groups of dispensing pens 9 to make reciprocating movements, so that several groups of dispensing pens 9 perform horizontal reciprocating dispensing operations on the surfaces of a corresponding group of semiconductor chips.

[0061] The active bevel gear 30177 drives the driven bevel gear 3011 to rotate, thereby driving the incomplete gear 3013 to rotate. Every time the incomplete gear 3013 rotates one circle, it drives the gear 3016 to rotate a certain angle. Due to the meshing relationship between the gear 3016 and the rack 203, the gear 3016 rotates and drives the transmission component 3 to move, so that several groups of dispensing pens 9 can move longitudinally for a certain distance, so that several groups of dispensing pens 9 can reciprocate horizontally on the surface of a corresponding group of semiconductor chips and make intermittent longitudinal movements at the same time, so that the surfaces of the semiconductor chips are evenly dispensed with glue.

[0062] The two sets of first support shafts 303 and second support shafts 309 are used to make the transmission component 3 more stable during movement. The rollers 304 are set on the first support shaft 303 and the second support shaft 309 to make the transmission component 3 move more smoothly. When the surfaces of the semiconductor chips are all evenly glued, the transmission component 3 is stopped by turning off the motor 30172. When the glue dispensing operation of the next set of semiconductor chips is carried out, the motor 30172 is rotated in the reverse direction to make the transmission component 3 move in the reverse direction while the surfaces of the semiconductor chips are evenly glued.

[0063] After the glue dispensing is completed, the scraper plate 13 is driven by two sets of electric push rods 12 to move and scrape off the excess glue accumulated on the semiconductor chip, so that the glue distribution on the semiconductor chip is more even, while avoiding the accumulation of glue and causing glue overflow during the pasting process of the semiconductor chip. The scraper plate 13 drives the excess glue to move to one side of the guide box 10, and continues to move so that the glue enters the guide box 10 through the guide groove 1001, and finally enters the recovery box 4 for centralized treatment to facilitate glue recycling.

[0064] After completing the dispensing operation, the limit plate 1401 is pulled out by pulling the handle 1402, and the push plate 1408 is pushed upward, driving the discharge plate 1406 to move upward synchronously, so that the semiconductor chip moves upward to the outside of the groove 1404, so that the semiconductor chip after the dispensing operation is completed is conveniently taken out, and then the next group of semiconductor chips that need to be dispensed are placed in the groove 1404, and the dispensing operation is continued to realize batch dispensing of semiconductor chips.

[0065] Based on the above-mentioned semiconductor chip multi-head batch dispensing device, an embodiment of the present invention further proposes a dispensing method for the dispensing device. Exemplarily, the dispensing method includes:

[0066] The semiconductor chips to be dispensed are placed on a set of grooves on a material placement plate, and the semiconductor chips are limited by the grooves;

[0067] Turn on the liquid pump and the motor, the liquid pump draws glue from the liquid storage tank, and drips it onto the surface of the semiconductor chip through several groups of glue dispens;

[0068] The motor drives the turntable to rotate, so that the linkage rod drives the card plate to move back and forth horizontally, completing the horizontal reciprocating glue dispensing operation of each group of semiconductor chips;

[0069] The motor drives the active bevel gear to rotate, so that the incomplete gear drives the gear to rotate, and drives the transmission component to move, and the dispensing pen moves longitudinally along the surface of a corresponding group of semiconductor chips;

[0070] After the uniform dispensing of the semiconductor chip is completed, the liquid pump and the motor are turned off;

[0071] Turn on the electric push rod to drive the scraper to move the excess glue accumulated on the surface of the semiconductor chip into the guide box through the guide groove, and finally into the recovery box for recycling;

[0072] Pull the handle to pull out the limit plate, push the push plate upward, so that the discharge plate pushes the semiconductor chip out of the groove, takes out the semiconductor chip that has completed the dispensing operation, and then puts in the next group of semiconductor chips to continue the dispensing operation.

[0073] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor chip multi-head batch dispensing device, comprising a base (1), characterized in that: Two sets of side panels (2) are fixedly connected to the base (1), and transmission components (3) are arranged on the two sets of side panels (2); A recovery box (4) is provided on one side of the base (1), a liquid storage tank (5) is provided on the recovery box (4), a liquid pump (6) is installed on the liquid storage tank (5), and a liquid outlet end of the liquid pump (6) is connected to a plurality of groups of glue dispensing pens (9); A limiting mechanism (14) is provided on the base (1), and a plurality of groups of semiconductor chips are movably connected to the limiting mechanism (14); The transmission assembly (3) comprises a first transverse plate (301) and a second transverse plate (302), and a driving mechanism (3017) is provided on one side of the first transverse plate (301); The inner side wall of the base (1) is provided with two groups of limiting grooves (15), and the two groups of limiting grooves (15) are movably fitted with the limiting mechanism (14); a flow guide box (10) is provided on the base (1), and a flow guide groove (1001) is provided on the flow guide box (10), and the flow guide groove (1001) is fitted on one side of the limiting mechanism (14); the flow guide box (10) and the recovery box (4) are connected to each other; Two groups of slide grooves (201) are provided on the two groups of side plates (2), one group of side plates (2) is provided with a rack groove (202), the rack groove (202) is arranged between the two groups of slide grooves (201), the inner wall bottom end of the rack groove (202) is paved with a rack (203), the bottom end of the second horizontal plate (302) is fixedly connected with two groups of first support shafts (303), two groups of sliding shafts (305) are fixedly connected between the first horizontal plate (301) and the second horizontal plate (302), the two groups of sliding shafts (305) are slidably connected with a clamping mechanism (306), and the clamping mechanism (306) is fixedly connected to a plurality of groups of glue dispensing pens (9); The bottom end of the first horizontal plate (301) is fixedly connected to a vertical plate (307), the bottom end of the vertical plate (307) is fixedly connected to a bottom plate (308), the bottom end of the bottom plate (308) is fixedly connected to two groups of second support shafts (309), the bottom ends of the two groups of second support shafts (309) are movably fitted to the inner walls of the corresponding two groups of slide grooves (201), and the bottom ends of the two groups of second support shafts (309) and the first support shaft (303) are both provided with rollers (304); A gear (3016) is installed at the bottom end of the bottom plate (308), the gear (3016) is meshed with the rack (203), an incomplete gear (3013) is rotatably connected to the side wall of the vertical plate (307), a through slot (3015) is provided on the bottom plate (308), the incomplete gear (3013) penetrates the through slot (3015) and is meshed with the gear (3016), a second linkage shaft (3014) is fixedly connected at the center of the incomplete gear (3013), the second linkage shaft (3014) penetrates the vertical plate (307) and is sleeved with a belt, a driven bevel gear (3011) is rotatably connected to the side wall of the vertical plate (307), a first linkage shaft (3012) is fixedly connected at the center of the driven bevel gear (3011), and the other end of the belt is sleeved on the first linkage shaft (3012); The first transverse plate (301) is provided with a transmission groove (3010), the driving mechanism (3017) comprises a fixed plate (30171), a motor (30172) is mounted on the fixed plate (30171), the output end of the motor (30172) is drivingly connected to a transmission shaft (30173), a rotating disk (30174) is fixedly connected to the transmission shaft (30173), a fixed shaft (30175) is provided on the rotating disk (30174), the top end of the fixed shaft (30175) is fixedly connected to a limiting block (30176), the bottom end of the transmission shaft (30173) passes through the rotating disk (30174) and is fixedly connected to a driving bevel gear (30177), and the driving bevel gear (30177) is meshingly connected to the driven bevel gear (3011); By driving a plurality of groups of glue dispensing pens (9) to move back and forth through a driving mechanism (3017), and at the same time driving a transmission assembly (3) to move through a driving mechanism (3017), the plurality of glue dispensing pens (9) can be respectively dispensing glue back and forth laterally on the surfaces of a corresponding group of semiconductor chips while making intermittent longitudinal movements, so that the surfaces of the semiconductor chips are evenly dispensing glue.

2. The semiconductor chip multi-head batch dispensing device according to claim 1, characterized in that: A fixing block (11) is provided on one side wall opposite to the two sets of side panels (2), an electric push rod (12) is installed on the two sets of fixing blocks (11), the output ends of the two sets of electric push rods (12) are drivingly connected to a scraper plate (13), and the limiting mechanism (14) is movably fitted with the scraper plate (13).

3. The semiconductor chip multi-head batch dispensing device according to claim 1, characterized in that: The clamping mechanism (306) comprises a clamping plate (3061), the clamping plate (3061) is provided with a plurality of clamping grooves (3062), the plurality of clamping grooves (3062) are respectively fixedly connected to the side walls of the plurality of glue dispensing pens (9), the side wall of the clamping plate (3061) is provided with two groups of sliding holes (3063), the two groups of sliding holes (3063) are respectively movably fitted with the two groups of sliding shafts (305), the side wall of the clamping plate (3061) is provided with an articulated frame (3064), the articulated frame (3064) is rotatably connected with a linkage rod (3065), the other end of the linkage rod (3065) is provided with a through hole (3066), the through hole (3066) is movably fitted with the fixed shaft (30175).

4. The semiconductor chip multi-head batch dispensing device according to claim 1, characterized in that: The limiting mechanism (14) comprises a limiting plate (1401), the limiting plate (1401) is provided with a handle (1402), both side walls of the limiting plate (1401) are fixedly connected to limiting strips (1403), the limiting plate (1401) is provided with a plurality of groups of grooves (1404), connecting grooves (1405) are provided between the plurality of groups of grooves (1404), and a material discharge plate (1406) is clamped in the plurality of groups of grooves (1404), and the material discharge plate (1406) is clamped in the plurality of groups of grooves (1404). 6) being in contact with the bottom of the semiconductor chip, a connection block (1407) is provided between the plurality of groups of the discharge plates (1406), and the plurality of groups of the connection blocks (1407) are movably contacted with the plurality of groups of the connection grooves (1405), a push plate (1408) is fixedly connected to one group of the discharge plates (1406), a push groove (1409) is provided on the limiting plate (1401), and the push plate (1408) passes through the push groove (1409) and then extends to the outside of the limiting plate (1401).

5. A dispensing method for semiconductor chip multi-head batch dispensing device according to any one of claims 1 to 4, characterized in that: The dispensing method comprises: Place the semiconductor chip that needs to be glued on the limiting mechanism for limiting; The liquid pump and the driving mechanism are turned on, and the liquid pump draws glue from the liquid storage tank and drips it onto the surface of the semiconductor chip through several groups of glue dispens; The driving mechanism drives the dispensing pen to move back and forth horizontally to complete the horizontal reciprocating dispensing operation of each group of semiconductor chips, and at the same time, the dispensing pen moves longitudinally along the surface of the corresponding group of semiconductor chips; After the uniform dispensing of the semiconductor chip is completed, the liquid pump and the driving mechanism are turned off; Pull out the limiting mechanism, take out the semiconductor chips that have completed the dispensing operation, and then put in the next group of semiconductor chips to continue the dispensing operation.

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