A printing device for processing and forming circuit boards

Abstract

The present invention discloses a printing device for processing and forming circuit boards, in the field of circuit board printing technology, including a rotating table and a conveying mechanism for conveying circuit boards, a plurality of evenly distributed printing boxes are fixedly mounted on the upper surface of the rotating table, a steel mesh is vertically slidably mounted on the inner wall of the printing box, a lifting plate for lifting the circuit board and making it fit with the steel mesh is arranged below the printing box, and the printing device also includes a lifting mechanism, a paste supply mechanism and a flattening mechanism. The present invention integrates the circuit board input, steel mesh and circuit board fitting, solder paste conveying, solder paste printing and circuit board output involved in the circuit board printing process into one, realizing the concept of automation and intelligence, and improving the efficiency of the operation without manual intervention, and the device can print multiple groups of circuit boards at the same time, with the effect of uninterrupted automatic printing, and has excellent practicality.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board printing, in particular to a printing device used for processing and forming circuit boards. Background Art

[0002] With the rapid development of science and technology, electronic products are used more and more widely in life. As the large-scale production of electronic products drives the development of the circuit board production industry, solder paste needs to be printed on the circuit board during the production and processing of the circuit board.

[0003] At present, the existing printing methods are mostly to design different steel mesh plates according to the positions of the solder paste to be printed on the circuit board. When printing, the steel mesh with holes is first attached to the circuit board, and then the solder paste is scraped into the holes. After that, the steel mesh is lifted up, and the solder paste will be printed on various printing positions of the circuit board through the steel mesh to complete the printing. However, the existing printing device has a poor degree of automation, and it may be necessary to complete the printing operation based on multiple devices, or to cooperate with manual auxiliary operations, which not only has low operating efficiency but also may affect the processing quality of the circuit board;

[0004] And in the actual printing process, the circuit boards to be printed need to be continuously transported and output toward the printing device, and the printing device may need to be started and stopped back and forth, thereby reducing the printing efficiency, especially when processing and printing multiple sets of circuit boards, the operating efficiency is poor. Summary of the invention

[0005] The purpose of the present invention is to provide a printing device for processing and forming a circuit board, which solves the technical problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a printing device for processing and forming a circuit board, comprising a rotating table and a conveying mechanism for conveying the circuit board, a plurality of evenly distributed printing boxes are fixedly mounted on the upper surface of the rotating table, a steel mesh is vertically slidably mounted on the inner wall of the printing box, a lifting plate for lifting the circuit board and making it fit the steel mesh is arranged below the printing box, and the printing device also comprises:

[0007] A lifting mechanism, the lifting mechanism is arranged on a rotating table, and is used to drive the lifting plate to move vertically while following the rotating table to rotate, so as to make the circuit boards fit with the steel mesh one by one for printing, and to lower the printed circuit boards onto the conveying mechanism;

[0008] A paste supply mechanism, which is arranged on the printing box and is drivingly connected to the lifting mechanism, and is used to intermittently and equally deliver solder paste to the surface of the steel mesh;

[0009] The flattening mechanism is arranged on the printing box and is transmission-connected with the lifting mechanism, and is used for squeezing the solder paste on the surface of the steel mesh.

[0010] Optionally, the lifting mechanism includes:

[0011] A bearing plate, the surface of which is fixedly connected to an eccentric column eccentrically arranged with respect to the center of rotation of the rotating table, the surface of which is fixedly rotatably connected to a sleeve plate, the surface of which is hinged to a plurality of hinged rods, each of which is fixedly rotatably connected to an end of the hinged rod away from the eccentric column, a slider being fixedly connected to the bottom of the slider, and a slide groove for radial sliding of the slider being provided on the surface of the rotating table;

[0012] A second hinged rod is hinged on the side of the sliding block, a vertical moving block is hinged on one end of the second hinged rod away from the eccentric column, and the lifting plate is fixedly connected to the upper surface of the vertical moving block;

[0013] A groove is provided on the upper surface of the rotating platform, a telescopic rod is fixedly installed in the groove, and the top of the telescopic rod is fixedly connected to the lower surface of the vertical moving block.

[0014] Optionally, the paste supply mechanism includes:

[0015] A paste storage box, the paste storage box is fixedly mounted on the printing box and is located above the steel mesh, a roller is rotatably connected to the bottom of the paste storage box, and a notch is provided on the surface of the roller;

[0016] The surface of the printing box is rotatably connected to a rotating shaft through a damping bearing, one end of the rotating shaft passes through the printing box and the paste storage box and is fixedly connected to the end surface of the rotating roller, and the other end of the rotating shaft is rotatably connected to a gear 1 through a one-way bearing;

[0017] The top of the push rod is fixedly connected with a connecting plate 1, and the end of the connecting plate 1 is fixedly connected with a gear row 1 meshing with the gear 1.

[0018] Optionally, the push-flattening mechanism includes:

[0019] A push plate, the push plate is slidably connected to the surface of the steel mesh, a connecting rod is fixedly connected to the side of the push plate, a connecting plate 2 is fixedly connected to the side of the connecting rod, a push plate is also fixedly connected to the top of the push rod, a resist plate is slidably sleeved on the surface of the connecting rod, the side of the resist plate is slidably connected to the side of the printing box, a compression spring is fixedly connected between the resist plate and the connecting plate 2, and an opening is provided on the side of the printing box for the connecting rod to slide vertically through.

[0020] Optionally, a discharge port is provided on a side of the printing box away from the push rod;

[0021] An arc-shaped collecting groove is fixedly mounted on the upper surface of the carrying plate to collect the excess solder paste pushed out by the flattening mechanism.

[0022] Optionally, a trapezoidal correction frame is fixedly connected to the bottom of the printing box;

[0023] The conveying mechanism comprises conveying baffles on both sides, a conveying belt is arranged on the conveying baffle, and a correcting inclined plate is fixedly connected to the upper surface of the conveying baffle.

[0024] Optionally, the rotating table is rotatably mounted on the upper surface of the supporting plate via a rotating base, a motor is fixedly connected to the upper surface of the supporting plate, a gear 2 is fixedly connected to the output shaft of the motor, and an inner gear ring meshing with the gear 2 is fixedly connected to the inner side of the rotating table.

[0025] Optionally, the upper surface of the steel mesh is fixedly connected to a limiting rod, and the top of the limiting rod slides through the printing box and is fixedly connected to a limiting plate.

[0026] Optionally, a support column is fixedly connected to the upper surface of the rotating table, and a side end surface of the support column is fixedly connected to the side surface of the printing box.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The present invention uses a lifting mechanism to make the lifting plate move vertically while rotating with the rotating table, so as to make the circuit board and the steel mesh fit together for printing one by one, and put the printed circuit board onto the conveying mechanism. The lifting mechanism can automatically lift the circuit board to be printed in the working area of ​​the device input by the conveying mechanism to enter the device, and make the circuit board fit together with the steel mesh, so as to realize the preparation process of solder paste printing on the circuit board, and can ensure the close fit between the circuit board and the steel mesh to ensure the processing quality of the solder paste printed on the circuit board through the steel mesh. When the circuit board is printed, it can also return the circuit board to the initial position and be transported out again by the conveying mechanism, so that the lifting mechanism has a complete circuit board printing process and the whole process does not require manual intervention and has a fully automatic effect. The present invention has multiple printing boxes, so that the next circuit board can be printed efficiently without interruption, so as to realize continuous printing of the circuit board, thereby improving the processing efficiency. Compared with the situation in the prior art that the printing equipment may need to be shut down during printing, this method can greatly improve the printing efficiency.

[0029] 2. The present invention intermittently and equally delivers solder paste to the surface of the steel mesh through a paste supply mechanism. The paste supply mechanism enables the slider to slide radially during circular motion based on a lifting mechanism. Based on this concept, the printing device is driven to operate. The present invention can automatically output solder paste toward the steel mesh, and the solder paste output each time has a quantitative effect. The quantitative output of solder paste can avoid the unfavorable situation of solder paste oxidation caused by excessive amount of solder paste being added at a single time due to the unused solder paste being exposed to the air all the time. The present method has an excellent fully automatic form, and there is no need to manually add solder paste when printing the circuit board, thereby improving work efficiency, and there is no need to add a solder paste delivery device. All printing device structures are integrated in the present device, thereby improving practicality.

[0030] 3. The present invention squeezes the solder paste on the surface of the steel mesh through a flattening mechanism, and the flattening mechanism causes the solder paste on the steel mesh to fall from the holes on the steel mesh to achieve the purpose of flattening the solder paste, ensuring that the solder paste fully fills the holes on the steel mesh, avoiding the situation where a small amount of solder paste exists in the holes on the steel mesh, and can ensure the solder paste printing quality of the circuit board. The present application has an excellent automatic solder paste printing effect, and can continuously print multiple circuit boards to be printed to achieve the purpose of continuous and uninterrupted solder paste printing, greatly improving the efficiency of processing and forming operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a front view of the structure of the present invention;

[0032] Figure 2 is a first isometric view of the structure of the present invention;

[0033] Figure 3 is a second isometric view of the structure of the present invention;

[0034] Figure 4 For the present invention Figure 3 A magnified view of the structure at center A;

[0035] Figure 5 The structure of the printing box of the present invention in the initial state is shown in FIG. Figure 1 ;

[0036] Figure 6 The structure of the printing box of the present invention in the initial state is shown in FIG. Figure 2 ;

[0037] Figure 7 For the present invention Figure 6 A magnified view of the structure at B in the middle;

[0038] Figure 8 The structure of the printing box of the present invention in the initial state is shown in FIG. Figure 3 ;

[0039] Fig. 9It is a schematic structural diagram of the printing box of the present invention after being rotated 90 degrees from the initial state.

[0040] In the figure: 1, rotating table; 2, circuit board; 3, conveying mechanism; 4, printing box; 5, steel mesh; 6, lifting plate; 7, bearing plate; 8, eccentric column; 9, sleeve plate; 10, hinged rod 1; 11, push rod; 12, slider; 13, slide groove; 14, hinged rod 2; 15, vertical moving block; 16, telescopic rod; 17, paste storage box; 18, roller; 19, notch; 20, rotating shaft; 21, gear 1; 22, connecting plate 1; 2 3. Gear row one; 24. Push plate; 25. Connecting rod; 26. Connecting plate two; 27. Pushing plate; 28. Butt plate; 29. ​​Compression spring; 30. Discharge port; 31. Arc-shaped collecting trough; 32. Trapezoidal correction frame; 33. Conveying baffle; 34. Conveying belt; 35. Correction inclined plate; 36. Rotating base; 37. Motor; 38. Gear two; 39. Inner gear ring; 40. Limit rod; 41. Limit plate; 42. Support column. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] For example, see Figures 1 to 9 The present invention provides a printing device for processing and forming a circuit board, including a rotating table 1 and a conveying mechanism 3 for conveying a circuit board 2.

[0043] The rotating table 1 is rotatably mounted on the upper surface of the supporting plate 7 through a rotating base 36. A motor 37 is fixedly connected to the upper surface of the supporting plate 7. A gear 2 38 is fixedly connected to the output shaft of the motor 37. An inner gear ring 39 meshing with the gear 2 38 is fixedly connected to the inner side of the rotating table 1.

[0044] In this embodiment: when the device is in operation, the user operates on the control terminal, and the control terminal sends a signal to the control board. The control board operates the rotating part of the motor 37, and the rotating part of the motor 37 drives the gear 2 38 to rotate, and drives the inner ring gear 39 and the rotating table 1 to rotate under the meshing transmission.

[0045] A plurality of evenly distributed printing boxes 4 are fixedly mounted on the upper surface of the rotating table 1 . A supporting column 42 is fixedly connected to the upper surface of the rotating table 1 . The side end surface of the supporting column 42 is fixedly connected to the side surface of the printing box 4 .

[0046] The printing box 4 is supported by the supporting column 42 and is kept in a stable state at all times, so that the printing box 4 can be driven by the rotating table 1 to rotate synchronously.

[0047] A steel mesh 5 is vertically slidably mounted on the inner wall of the printing box 4 . The upper surface of the steel mesh 5 is fixedly connected to a limiting rod 40 . The top of the limiting rod 40 slides through the printing box 4 and is fixedly connected to a limiting plate 41 .

[0048] Through the action of the limiting rod 40, the steel mesh 5 can maintain vertical sliding stability during the process of being lifted up, and due to the action of the limiting plate 41, the steel mesh 5 will not fall or become unstable.

[0049] A lifting plate 6 is provided below the printing box 4 for lifting the circuit board 2 and making it fit with the steel mesh 5. The printing device also includes a lifting mechanism, a paste supply mechanism and a flattening mechanism. The lifting mechanism is provided on the rotating table 1.

[0050] The lifting mechanism includes:

[0051] A carrying plate 7, the surface of which is fixedly connected to an eccentric column 8 eccentrically arranged with respect to the center of rotation of the rotating table 1, a sleeve plate 9 is fixedly connected to the surface of the eccentric column 8 for rotation, a plurality of hinged rods 10 are hingedly connected to the surface of the sleeve plate 9, one end of each hinged rod 10 away from the eccentric column 8 is fixedly connected to a push rod 11 for rotation, a slider 12 is fixedly connected to the bottom of the push rod 11, and a slide groove 13 for radial sliding of the slider 12 is provided on the surface of the rotating table 1;

[0052] The side of the slider 12 is hinged with a hinge rod 14, and the end of the hinge rod 14 away from the eccentric column 8 is hinged with a vertical moving block 15, and the lifting plate 6 is fixedly connected to the upper surface of the vertical moving block 15;

[0053] A groove is formed on the upper surface of the rotating platform 1 , in which a telescopic rod 16 is fixedly installed, and the top of the telescopic rod 16 is fixedly connected to the lower surface of the vertical moving block 15 .

[0054] In this embodiment, based on the rotation of the rotating table 1, the slide groove 13 is driven to rotate synchronously. Due to the sliding relationship between the slide groove 13 and the slider 12, the four sliders 12 are synchronously driven to rotate synchronously, thereby driving the four hinged rods 10 to rotate. Since the opposite ends of the four hinged rods 10 are hinged on the sleeve plate 9, and the sleeve plate 9 and the eccentric column 8 are in a rotational connection relationship, and the rotation center of the rotating table 1 is eccentrically set with the eccentric column 8, the four sliders 12 slide back and forth in the slide groove 13 when the rotating table 1 rotates. Figure 4As shown, under this eccentric motion relationship, the slider 12 on the far left is closest to the rotation center of the rotating table 1, the slider 12 on the far right is farthest from the rotation center of the rotating table 1, and the upper and lower sliders 12 are at a moderate distance from the rotation center of the rotating table 1, so that the device forms a variety of different motion forms when running, corresponding to the entire process of solder paste printing in the processing and forming of the circuit board, and integrates and realizes a plurality of different steps through a special multi-motion form mechanism, which has a high novelty, such as Figure 4 , Figure 5 and Figure 6 As shown, the lifting mechanism corresponding to the slider 12 closest to the rotation center of the rotating table 1 at this time is located. This mechanism corresponds to the circuit board 2 entering the lifting stage. Since the corresponding slider 12 is closest to the rotation center of the rotating table 1 at this time, under the hinged relationship of the hinged rod 14 and the vertical limiting relationship of the telescopic rod 16 to the vertical shift block 15, the vertical shift block 15 is at the lowest point at this time, and then the lifting plate 6 is located below the circuit board 2 at this time. With the rotation of the rotating table 1, that is, the rotation of the slider 12, that is, corresponding to the process of the slider 12 moving radially away from the rotation center of the rotating table 1, the lifting plate 6 The circuit board 2 to be printed is moved upward and lifted. At this time, due to the rotation and upward movement of the lifting plate 6, the circuit board 2 may be offset when being lifted, and then the position of the circuit board 2 is corrected by the trapezoidal correction frame 32, so that the gradually lifted circuit board 2 is completely corresponding to the steel mesh 5, thereby ensuring the printing quality and avoiding the unfavorable situation that the position of the circuit board 2 is offset. At this time, as the circuit board 2 continues to move upward, the circuit board 2 and the steel mesh 5 are approached and finally closely fitted to realize the preparation process before solder paste printing. This part of the movement state corresponds to Figure 1 In the figure, the process of the printing box 4 on the left side rotating to the printing box 4 on the upper side can be defined as the printing box 4 rotating 90°, and when the slider 12 slides in the slide groove 13, the paste supply mechanism is operated, so that the paste supply mechanism outputs solder paste toward the steel mesh 5 to realize the preparation process before solder paste printing. As the printing box 4 continues to rotate, that is, the printing box 4 rotates from 90° to 180°, at this time, due to the continued revolution of the slider 12 and the radial movement along the slide groove 13, the slider 12 finally moves to the position as shown in the figure. Figure 4At the position of the rightmost slider 12, the slider 12 corresponds to the rotation center farthest from the rotating table 1, so that the deflection angle of the hinge rod 2 14 is the largest, and the upward movement of the vertical moving block 15 reaches the maximum. It is worth noting that when the printing box 4 rotates from the starting point to 90°, the circuit board 2 has completed the bonding with the steel mesh 5, and continues to lift the entire circuit board 2 and the steel mesh 5 together. When the printing box 4 rotates from 90° to 180°, when it rotates to 180°, the height of the circuit board 2 and the steel mesh 5 is lifted to the maximum. In the process of overall lifting, the gravity of the structure itself can improve the close fit between the circuit board 2 and the steel mesh 5, thereby ensuring the quality of printing, corresponding to the operation of the push-flattening mechanism, to achieve The solder paste is printed on the circuit board 2 through the openings on the steel mesh 5. When the printing box 4 rotates from 180° to 360°, the circuit board 2 and the steel mesh 5 move down again. When the rotation angle of the printing box 4 exceeds 270°, the circuit board 2 and the steel mesh 5 are separated, and the steel mesh 5 is restricted by the printing box 4 and will not continue to move down and fall. Then, the separated circuit board 2 is driven by the lifting plate 6 and gradually returns to the initial position, thereby completing an overall fully automatic printing operation. When the circuit board 2 returns to the starting point, since the circuit board 2 moves down while rotating, it will not be blocked by the conveying mechanism 3, so that the circuit board 2 after printing is put back on the conveying belt 34.

[0055] Since the bottom of the printing box 4 is fixedly connected with a trapezoidal correction frame 32, the conveying mechanism 3 includes conveying baffles 33 on both sides, and a conveying belt 34 is provided on the conveying baffle 33. The upper surface of the conveying baffle 33 is fixedly connected with a correction inclined plate 35, so that the conveying baffle 33 and the correction inclined plate 35 play a further positioning and correction effect. At this time, the printed circuit board 2 is driven to be conveyed to the left by the reversal of the conveying mechanism 3. Figure 1 As shown, it should be noted that the circuit board 2 to be printed is also transported in by the conveying mechanism 3, and the circuit board 2 to be printed can be stored in the material shell on the vertical material feeding value conveying mechanism 3, which is one of the technical means known to those skilled in the art, that is, the multiple groups of circuit boards 2 placed in the material shell can be pushed down one by one in the form of an electric push rod and dropped into the conveying mechanism 3, and the material feeding and discharging of the circuit board 2 are performed at intervals, so that the loading and unloading of the circuit board 2 can be realized through a conveying mechanism 3, and the printed circuit board 2 is finally received by the end of the conveying mechanism 3, so as to completely realize the entire printing process, and the lifting mechanism has the following effects:

[0056] The conveying mechanism 3 can automatically input the circuit board 2 to be printed in the working area of ​​the device to be lifted to enter the device, and the circuit board 2 is fitted with the steel mesh 5 to realize the preparation process of solder paste printing of the circuit board 2, and can ensure the close fitting of the circuit board 2 and the steel mesh 5 to ensure the processing quality of the solder paste printed on the circuit board 2 through the steel mesh 5. When the circuit board 2 is printed, the circuit board 2 can be returned to the initial position and re-transmitted by the conveying mechanism. Therefore, the lifting mechanism has a complete process of printing the circuit board 2, and the whole process does not require manual intervention, and has a fully automatic effect. It also has four printing boxes 4, so that the next circuit board 2 can be printed uninterruptedly, so as to realize the continuous printing of the circuit board 2 and improve the processing efficiency. Compared with the prior art where the printing equipment may need to be shut down during printing, this method can greatly improve the printing efficiency, and the printing box 4 in this case and the corresponding printing structure arranged thereon can be arranged in more than four groups, thereby greatly improving the printing efficiency for multiple circuit boards 2.

[0057] Example 2: Based on the above example, please refer to Figures 1 to 9 The paste supply mechanism is arranged on the printing box 4 and is transmission-connected with the lifting mechanism, and the paste supply mechanism includes:

[0058] Paste storage box 17, the paste storage box 17 is fixedly mounted on the printing box 4 and is located above the steel mesh 5, the bottom of the paste storage box 17 is rotatably connected to a roller 18, and a notch 19 is provided on the surface of the roller 18;

[0059] The surface of the printing box 4 is rotatably connected with a rotating shaft 20 through a damping bearing, one end of the rotating shaft 20 passes through the printing box 4 and the paste storage box 17 and is fixedly connected to the end surface of the roller 18, and the other end of the rotating shaft 20 is rotatably connected with a gear 21 through a one-way bearing;

[0060] The top of the push rod 11 is fixedly connected with a connecting plate 22 , and the end of the connecting plate 22 is fixedly connected with a gear row 23 meshing with the gear 21 .

[0061] In this embodiment, when the slider 12 slides in the slide groove 13, corresponding to the rotation of the printing box 4 from the initial position to the 90° position, the push rod 11, the connecting plate 12 and the gear row 123 are synchronously driven to move toward the printing box 4, so that the gear row 123 and the gear 121 form a relative motion, thereby driving the gear 121 to rotate. When the gear 121 rotates, the gear 121 rotates clockwise, such as Figure 5The outermost numbered gear 21 shown in the figure corresponds to the unidirectional transmission of the unidirectional shaft, which drives the roller 18 inside to rotate. Initially, the solder paste raw material is stored in the paste storage box 17. As the roller 18 rotates, the solder paste is brought out through the notch 19. When the roller 18 and the notch 19 rotate half a circle, the solder paste can be completely output through the notch 19 and fall on the steel mesh 5 to be printed. This movement process corresponds to the following. Figure 1 In the process of the printing box 4 rotating from the initial position to 90°, as the printing box 4 continues to rotate, the roller 18 and the notch 19 rotate from a half-circle state to a full circle, so that the notch 19 re-enters the paste storage box 17, and is blocked by the inner wall of the paste storage box 17, achieving the effect of quantitative feeding. At the same time, the subsequent operation of the leveling mechanism is also corresponding to this time, so as to avoid the situation where the solder paste continues to be fed when the leveling mechanism is running and affects the operation. When the printing box 4 rotates from 180° to 360°, as shown in FIG. Figure 1 As shown, the upper gear 1 21 starts to reverse, that is, the gear row 1 23 moves from the position farthest from the eccentric column 8 to the direction close to the eccentric column 8, so that the gear 1 21 is converted from the original forward rotation to the reverse rotation. During the reverse rotation, the unidirectionality of the one-way bearing will not transmit power. The one-way bearing of this scheme is only engaged and transmitted when the printing box 4 moves from the initial position to within 180°, and then there is no power to drive the roller 18 to rotate. Then, the damping bearing plays the effect of limiting and hindering the rotation of the roller 18, avoiding the instability and self-rotation of the roller 18, thereby avoiding the secondary unloading of solder paste for the printed circuit board 2 when the printing box 4 rotates from 180° to 360°. This method has the following advantages:

[0062] Based on the lifting mechanism, the slider 12 slides radially during the circular motion. Based on this concept, the printing device is driven to operate, so that the solder paste can be automatically output toward the steel mesh 5, and each output solder paste has a quantitative output effect. The quantitative output of solder paste can avoid the situation where too much solder paste is added at a time, and the solder paste that has not been completely used is always exposed to the air and the solder paste is oxidized, which may affect the production quality of the circuit board 2. In addition, this method is fully automatic and does not require manual addition of solder paste, so the work efficiency is better. There is no need to add a solder paste delivery device. All printing device structures are integrated in this device, so it is more practical.

[0063] Also, see Figures 1 to 9 The push-flat mechanism is arranged on the printing box 4 and is transmission-connected with the lifting mechanism, and the push-flat mechanism includes:

[0064] A push plate 24 is slidably connected to the surface of the steel mesh 5. A connecting rod 25 is fixedly connected to the side of the push plate 24. A connecting plate 26 is fixedly connected to the side of the connecting rod 25. A push plate 27 is also fixedly connected to the top of the push rod 11. A push plate 28 is slidably sleeved on the surface of the connecting rod 25. The side of the push plate 28 is slidably connected to the side of the printing box 4. A compression spring 29 is fixedly connected between the push plate 28 and the connecting plate 26. An opening for the connecting rod 25 to slide vertically through is opened on the side of the printing box 4.

[0065] In this embodiment: when the printing box 4 rotates from the initial position to 90°, at this time, since the push plate 27 and the connecting plate 26 have a certain distance, when the slider 12 moves radially away from each other in the slide groove 13, the push plate 27 does not move excessively. When the printing box 4 starts to rotate from 90° to 180°, at this time, as the slider 12 continues to move radially, the push plate 27 pushes the connecting plate 26 to move toward the printing box 4, and squeezes the compression spring 29 so that the compression spring 29 contracts to form elastic potential energy to ensure the subsequent structural reset. At this time, the push plate 24 moves on the steel mesh 5, and due to the effect of the opening, when the circuit board 2 and the steel mesh 5 are lifted and moved upward, the push plate 24 is always above the steel mesh 5 and the structure will not be stuck. At this time, as the slider 12 moves radially, the push plate 27 pushes the connecting plate 26 to move toward the printing box 4. The movement drives the push plate 24 to move on the steel mesh 5, so that the solder paste thereon falls from the holes on the steel mesh 5 to achieve the purpose of flattening the solder paste, ensuring that the solder paste fully fills the holes on the steel mesh 5 to avoid the situation where a small amount of solder paste exists in the holes on the steel mesh 5, so as to achieve the purpose of printing the solder paste on the circuit board 2, and can ensure the solder paste printing quality of the circuit board, and when the printing box 4 rotates from 180° to 360° due to the radial sliding relationship of the slider 12, the steel mesh 5 can also be scraped twice by the push plate 24 to improve the printing effect of the solder paste. This method has the purpose of automatically flattening the solder paste, so it has an excellent automatic solder paste printing effect, and can continuously print on multiple circuit boards 2 to be printed to achieve the purpose of continuous and uninterrupted solder paste printing, greatly improving the efficiency of processing and forming operations.

[0066] A discharge port 30 is provided on a side of the printing box 4 facing away from the push rod 11;

[0067] An arc-shaped collecting groove 31 is fixedly mounted on the upper surface of the carrying plate 7 to collect the excess solder paste pushed out by the leveling mechanism.

[0068] By setting the discharge port 30, when the push-flattening mechanism is in operation, the excess solder paste can be pushed out of the printing box 4 through the discharge port 30, and the pushed solder paste is received by the arc-shaped collecting groove 31 to avoid contaminating the work surface and the device and to enable the excess solder paste to be reused.

[0069] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A printing device for processing and forming a circuit board, comprising a rotating table (1) and a conveying mechanism (3) for conveying the circuit board (2), characterized in that: A plurality of evenly distributed printing boxes (4) are fixedly mounted on the upper surface of the rotating table (1); a steel mesh (5) is vertically slidably mounted on the inner wall of the printing box (4); a lifting plate (6) for lifting the circuit board (2) and making it fit the steel mesh (5) is arranged below the printing box (4); the printing device further comprises: A lifting mechanism, the lifting mechanism being arranged on the rotating table (1) and being used to drive the lifting plate (6) to move vertically while following the rotation of the rotating table (1), so as to make the circuit boards (2) and the steel mesh (5) fit together for printing one by one, and to lower the printed circuit boards (2) onto the conveying mechanism (3); A paste supply mechanism, the paste supply mechanism being arranged on the printing box (4) and being drivingly connected to the lifting mechanism, and being used for intermittently and equally conveying solder paste to the surface of the steel mesh (5); A pushing mechanism, the pushing mechanism being arranged on the printing box (4) and being in driving connection with the lifting mechanism, and being used for squeezing the solder paste on the surface of the steel mesh (5); The lifting mechanism comprises: A bearing plate (7), wherein an eccentric column (8) eccentrically arranged with respect to the center of rotation of the rotating table (1) is fixedly connected to the surface of the bearing plate (7), a sleeve plate (9) is fixedly rotatably connected to the surface of the eccentric column (8), a plurality of hinged rods (10) are hingedly connected to the surface of the sleeve plate (9), one end of each hinged rod (10) away from the eccentric column (8) is fixedly rotatably connected to a push rod (11), a bottom of the push rod (11) is fixedly connected to a slider (12), and a slide groove (13) for radial sliding of the slider (12) is provided on the surface of the rotating table (1); A second hinged rod (14) is hingedly connected to the side of the slider (12); an end of the second hinged rod (14) away from the eccentric column (8) is hingedly connected to a vertical moving block (15); and the lifting plate (6) is fixedly connected to the upper surface of the vertical moving block (15); The upper surface of the rotating platform (1) is provided with a groove, a telescopic rod (16) is fixedly installed in the groove, and the top of the telescopic rod (16) is fixedly connected to the lower surface of the vertical moving block (15); The paste supply mechanism comprises: a paste storage box (17), the paste storage box (17) being fixedly mounted on the printing box (4) and located above the steel mesh (5); a roller (18) being rotatably connected to the bottom of the paste storage box (17), and a notch (19) being provided on the surface of the roller (18); The surface of the printing box (4) is rotatably connected to a rotating shaft (20) via a damping bearing, one end of the rotating shaft (20) passes through the printing box (4) and the paste storage box (17) and is fixedly connected to the end surface of the rotating roller (18), and the other end of the rotating shaft (20) is rotatably connected to a gear 1 (21) via a one-way bearing; A connecting plate 1 (22) is fixedly connected to the top of the push rod (11), and a tooth row 1 (23) meshing with the gear 1 (21) is fixedly connected to the end of the connecting plate 1 (22).

2. A printing device for circuit board processing and forming according to claim 1, characterized in that: The push-flattening mechanism comprises: A push plate (24), wherein the push plate (24) is slidably connected to the surface of the steel mesh (5), a connecting rod (25) is fixedly connected to the side of the push plate (24), a connecting plate 2 (26) is fixedly connected to the side of the connecting rod (25), a push plate (27) is also fixedly connected to the top of the push rod (11), a support plate (28) is slidably sleeved on the surface of the connecting rod (25), a side of the support plate (28) is slidably connected to the side of the printing box (4), a compression spring (29) is fixedly connected between the support plate (28) and the connecting plate 2 (26), and an opening is provided on the side of the printing box (4) for the connecting rod (25) to slide through vertically.

3. A printing device for circuit board processing and forming according to claim 2, characterized in that: A discharge port (30) is formed on a side of the printing box (4) facing away from the push rod (11); An arc-shaped collecting groove (31) is fixedly mounted on the upper surface of the carrier plate (7) to collect excess solder paste pushed out by the flattening mechanism.

4. A printing device for circuit board processing and forming according to claim 3, characterized in that: A trapezoidal correction frame (32) is fixedly connected to the bottom of the printing box (4); The conveying mechanism (3) comprises conveying baffles (33) on both sides, a conveying belt (34) is provided on the conveying baffle (33), and a correcting inclined plate (35) is fixedly connected to the upper surface of the conveying baffle (33).

5. A printing device for circuit board processing and forming according to claim 1, characterized in that: The rotating platform (1) is rotatably mounted on the upper surface of the supporting plate (7) via a rotating base (36); a motor (37) is fixedly connected to the upper surface of the supporting plate (7); an output shaft of the motor (37) is fixedly connected to a second gear (38); and an inner gear ring (39) meshing with the second gear (38) is fixedly connected to the inner side of the rotating platform (1).

6. A printing device for circuit board processing and forming according to claim 1, characterized in that: The upper surface of the steel mesh (5) is fixedly connected to a limiting rod (40), and the top of the limiting rod (40) slides through the printing box (4) and is fixedly connected to a limiting plate (41).

7. A printing device for circuit board processing and forming according to claim 1, characterized in that: A support column (42) is fixedly connected to the upper surface of the rotating platform (1), and a side end surface of the support column (42) is fixedly connected to a side surface of the printing box (4).

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