Semiconductor packaging structure and packaging method

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure and packaging method.The semiconductor packaging structure comprises a plurality of packaging frames, first base islands and second base islands, the first base islands and the second base islands are connected in the packaging frames, separation gaps are formed between the first base islands and the second base islands, first chips are arranged on the first base islands, and second chips are arranged on the second base islands; the first base island is provided with a first chip, the second base island is provided with a second chip, the first base island is integrally connected with a first pin, a third connection point of the first chip is connected with the first base island through a wire, a first connection point of the first chip is connected with a second pin through a wire, a second connection point of the first chip is connected with the second base island through a wire, and a fourth connection point of the second chip is connected with the first base island through a wire. A fifth connecting point of the second chip is connected with a third pin through a wire, the third pin is fixedly connected to the packaging frame, the second pin is fixedly connected with the first pin or the third pin or the packaging frame, and the first chip and the second chip are separated through the separation gap, so that the first chip and the second chip do not interfere with each other.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging structure and packaging method. Background Art

[0002] Semiconductors generally have metal packaging, ceramic packaging and plastic packaging, among which plastic packaging is more widely used.

[0003] The TO-220F packaged semiconductor includes a second pin, a first pin and a third pin, a total of three pins, and contains a first chip and a second chip, wherein the first chip is connected to the third pin and the first pin, and the second chip is connected to the first pin and the second pin.

[0004] In order to connect and package them, plastic packaging is generally used. There is a plastic packaged TO-220F semiconductor packaging method. In order to prevent multiple chips from interfering with each other, a ceramic sheet will be installed on one of the chips, or on two chips, to isolate the two chips, and then the semiconductor chips will be connected and sealed with plastic, thus completing the semiconductor packaging work.

[0005] However, the installation of ceramic sheets increases the steps of the packaging process, and the ceramic sheets need to be adhered and fixed. The fixing process is prone to displacement, making it unreliable and prone to more defective products, and complicating the semiconductor packaging process. Summary of the invention

[0006] In view of the deficiencies in the prior art, one of the purposes of the present application is to provide a semiconductor packaging structure and packaging method, which eliminates the installation of ceramic sheets and ensures the reliability of semiconductor chips.

[0007] The above-mentioned objective of the present application is achieved through the following technical scheme: a semiconductor packaging structure, comprising a plurality of packaging frames and a first base island and a second base island connected in the packaging frames, a separation gap being provided between the first base island and the second base island, a first chip being arranged on the first base island, a second chip being arranged on the second base island, a first pin being integrally connected to the first base island, a third connection point wire of the first chip being connected to the first base island, a first connection point wire of the first chip being connected to the second pin, a second connection point wire of the first chip being connected to the second base island, a fourth connection point wire of the second chip being connected to the first base island, a fifth connection point wire of the second chip being connected to the third pin, the third pin being fixedly connected to the packaging frame, and the second pin being fixedly connected to the first pin or the third pin or the packaging frame.

[0008] By adopting the above technical solution, the base island in the packaging frame is divided into a first base island and a second base island by a separation gap, the first chip and the second chip are respectively arranged on the first base island and the second base island, and the first chip and the second chip are connected to the first base island and the second base island through wires so that the first chip and the second chip assist each other in working without interfering with each other, and the first chip and the second chip are then connected to the working point through the second pin, the third pin and the first pin to work.

[0009] Furthermore, the second base island semi-surrounds the first base island, and the second base island includes an upper connection position and a side connection position, which are respectively located on the top surface and the side of the first base island, the second connection point is connected to the second base island through the upper connection position, and the second chip is located at the side connection position.

[0010] By adopting the above technical solution, the second connection point is connected to the second base island through the upper connection position, so that the second connection point can be connected to the second base island without bending or tilting, making it more convenient for the second connection point to connect to the second base island.

[0011] Furthermore, a first connecting strip having two ends respectively fixedly connecting the packaging frame and the first base island is provided between the packaging frame and the first base island, and a breakpoint groove is provided on the first connecting strip; a second connecting strip having two ends respectively fixedly connecting the packaging frame and the second base island is provided between the packaging frame and the second base island, and a breakpoint groove is provided on the second connecting strip.

[0012] By adopting the above technical solution and setting the first connecting strip, the second connecting strip and the breaking point, it is more convenient for the user to cut off the connection between the first base island and the second base island and the packaging frame after plastic packaging.

[0013] Furthermore, the two sides of the second pin are fixedly connected to the first pin and the third pin respectively, and cutting marks are provided on both sides of the first pin, both sides of the second pin and both sides of the third pin. The third pin, the first pin and the second pin are fixedly connected to the packaging frame at the breakpoints at one end away from the first base island, and cutting marks are provided at the breakpoints.

[0014] By adopting the above technical solution, the first pin, the second pin and the third pin are fixedly connected together and fixedly connected to the packaging frame, which can prevent the first pin, the second pin and the third pin from detaching from the packaging frame before plastic sealing, making their connection to the packaging frame more stable, and the cutting indentation makes it easy for the user to cut off the connection between the pin and the packaging frame after plastic sealing.

[0015] Furthermore, the two sides of the upper connection position are respectively integrally connected to the packaging frame, the second connecting strip is located at the side connection position, the two sides of the upper connection position are connected to the packaging frame by an upper connecting strip, and the upper connecting strip is provided with a breakpoint groove, and the upper connection position is connected to the packaging frame through the upper connecting strip.

[0016] By adopting the above technical solution, the second connecting strip is located at the side connection position, which makes it more convenient to cut off the connection between the base island and the packaging frame. The upper connecting strip makes the connection between the second base island and the packaging frame more stable, and the breakpoint groove makes it easier to cut off the connection between the base island and the packaging frame after the plastic packaging is completed.

[0017] Furthermore, a plurality of the packaging frames are connected in parallel and integrally for connecting a plurality of semiconductor packaging structures, each packaging frame corresponds to a semiconductor packaging structure, and an identification circle hole is provided between two adjacent packaging frames.

[0018] By adopting the above technical solution, multiple packaging frames connected side by side as a whole can enable multiple semiconductors in the packaging frames to be plastic-sealed at one time, thereby improving production efficiency. The identification holes facilitate users to identify semiconductors in multiple packaging frames connected side by side as a whole.

[0019] Furthermore, two sides of the first pin are fixedly connected to the third pin and the second pin respectively, and cutting indentations are provided on two sides of the first pin, two sides of the second pin and two sides of the third pin.

[0020] By adopting the above technical solution, the semiconductor chip can adapt to different pin interfaces.

[0021] Another object of the present application is to provide a semiconductor packaging method that eliminates the installation of ceramic sheets while ensuring the reliability of semiconductor chips.

[0022] A semiconductor packaging method of the semiconductor packaging structure comprises: Step 1: Draw the semiconductor packaging structure drawing; Step 2: punching out a package frame, a first base island, a second base island, a third pin, a first pin, a second pin, and interconnected connecting strips of the semiconductor package structure according to the drawing of the first step; Step 3: Connect the first chip and the second chip to the first base island and the second base island respectively, and connect corresponding wires; Step 4: Plastic sealing; Step 5: Cut off all connecting strips at the breakpoint groove to separate the packaging frame from the first base island, and separate the packaging frame from the second base island. At the same time, cut off the connection between the two sides of the third pin, the two sides of the first pin, and the two sides of the second pin at the cutting indentation. At the same time, cut off the connection between the tail ends of the third pin, the first pin, and the second pin and the packaging frame.

[0023] Furthermore, the stamping device used for stamping in the second step at least includes a base, a transmission track installed on the base, a stamping machine installed on the base and located above the transmission track, and a positioning device installed on the base and located below the transmission track. A control device for controlling the start and stop of the stamping machine and the positioning device is provided on one side of the base. The positioning device includes a fixed seat, on which a hydraulic cylinder with an output end facing upward is installed, and a baffle extends upward from the output end of the hydraulic cylinder. The control device includes an adjustment module, a detection module and an intermittent start and stop module. The adjustment module is used to adjust the time interval for starting the output end of the hydraulic cylinder. The detection module is used to detect the start and stop status of the hydraulic cylinder and the stamping machine, control the start and stop of the hydraulic cylinder and the stamping machine, and send a start signal to the intermittent start and stop module. The intermittent start and stop module is used to obtain the interval time data of the adjustment module and control the start and stop of the hydraulic cylinder according to the time data after receiving the start signal.

[0024] By adopting the above-mentioned technical scheme, because when the existing stamping device stamps multiple packaging frames connected side by side and as a whole, if multiple packaging frames are stamped at the same time, the multiple packaging frames connected side by side and as a whole will be subjected to greater force and are easy to break, but if the stamping force is reduced, it will be difficult to punch out the grooves required by the packaging frames. If a single packaging frame is stamped, then how to ensure that the packaging frame punched by the punching machine is very accurate each time is a problem. The setting of the control device and the positioning device solves this technical problem. Multiple packaging frames connected side by side and as a whole are placed on the transmission track. When one side of the multiple packaging frames connected side by side and as a whole is about to move above the positioning device, the hydraulic cylinder is started by the control device, and the output end of the hydraulic cylinder extends upward to make the baffle block the packaging frame. At this time, the detection module detects that the hydraulic cylinder is started, and the detection module sends a start signal to the punching machine, and the punching machine punches the packaging frame. The required grooves of the packaging frame are pressed out, and then the punching machine retracts and stops. At this time, the detection module detects that the punching machine has stopped, and the detection module sends a stop signal to the hydraulic cylinder, and at the same time sends a start signal to the intermittent start-stop module. After receiving the stop signal, the hydraulic cylinder retracts the output end so that its packaging frame can be transmitted by the transmission device. At the same time, the intermittent start-stop module controls the hydraulic cylinder to start after a period of time according to the time data (the user sets it according to the speed of the transmission device) after receiving the start signal. After a period of time, the packaging frames with grooves punched out in the multi-row packaging frames move to the top of the hydraulic cylinder output end. At this time, the hydraulic cylinder starts to make the baffle pass through the grooves of the packaging frames with grooves punched out to jam the movement of the multi-row packaging frames. At this time, the punching machine punches the packaging frames of the packaging frames with adjacent grooves punched out in the multi-row packaging frames, thereby achieving the purpose of precise positioning of the punching of a single packaging frame and preventing the punching machine from punching multiple rows of packaging frames incorrectly.

[0025] Furthermore, a sliding groove is provided on the base, and the fixed seat is slidably connected to the base through the sliding groove, and the inner walls on both sides of the sliding groove are provided with mutually staggered plug-in grooves, and the upper surface of the fixed seat is provided with a sliding groove that passes through the fixed seat, and a locking structure is provided in the sliding groove, and the locking structure includes a connecting plate located in the sliding groove, a plug-in plate fixedly connected to the bottom end of the connecting plate, and a supporting spring arranged between the connecting plate and the inner wall of the sliding groove, one end of the supporting spring is fixedly connected to a side of the sliding groove away from the plug-in groove, and the other end is fixedly connected to the connecting plate, and locking structures and sliding grooves are provided on both sides of the fixed seat, and the blocking plate includes a storage plate and a plug-in plate, and plug-in interfaces are provided on both sides of the storage plate, and the plug-in plate is plugged into the storage plate through the plug-in interfaces.

[0026] By adopting the above technical solution, although the setting of the positioning device can prevent the punching machine from punching multiple rows of packaging frames incorrectly, the size of each batch of multiple rows of packaging frames is different, which results in the positioning device being unable to adjust in time when positioning multiple rows of packaging frames of different sizes, reducing the applicability and practicality of the positioning device. The setting of the staggered plug-in slots and the locking structure solves this technical problem. The connecting plates on both sides of the fixed seat are pinched to compress the supporting springs of the connecting plates to make the plug-in plates slide into the plug-in slots, and then the sliding fixed seat is used to adjust the position of the hydraulic steel, so that the baffle can block the multiple rows of packaging frames of different sizes and can also ensure that they can be accurately punched by the punching machine. After adjusting the position of the fixed seat, the connecting plate is released so that the supporting springs press against the connecting plate so that the plug-in plates are inserted into the plug-in slots to fix the fixed seat (because the staggered arrangement The plug-in slot ensures that there is always one plug-in plate on both sides of the fixing seat that can be inserted into the plug-in slot to fix the fixing seat), thus achieving the purpose of improving the applicability and practicality of the positioning device. Although the staggered plug-in slots and the locking structure improve the applicability and practicality of the positioning device, the length of the baffle of the hydraulic cylinder that has changed its position cannot adapt to the length of the slot of the multi-row packaging frame of different sizes, resulting in the baffle being blocked when restricting the multi-row packaging frame. In order to solve this technical problem, the baffle is set as a storage plate and a plug-in plate, so that when the baffle encounters a slot whose length is shorter than the baffle, the plug-in plate is retracted into the storage plate by pushing the plug-in plate, thereby shortening the overall length of the baffle to adapt to the length of the slot of the multi-row packaging frame of different sizes, further improving the applicability and practicality of the positioning device.

[0027] In summary, the present application includes at least one of the following beneficial technical effects.

[0028] 1. By setting the first base island and the second base island, the base island in the packaging frame is divided into the first base island and the second base island through the separation gap, the first chip and the second chip are respectively set on the first base island and the second base island, and the first chip and the second chip are connected to the first base island and the second base island through wires so that the first chip and the second chip assist each other in working without interfering with each other, and the first chip and the second chip are connected to the working point through the second pin, the third pin and the first pin to work, thereby reducing the packaging steps of the ceramic sheet and improving the efficiency of semiconductor packaging.

[0029] 2. Through the setting of the punching device, it is realized that multiple packaging frames connected side by side and as a whole are placed on the transmission track. When one side of the multiple packaging frames connected side by side and as a whole is about to move to the top of the positioning device, the hydraulic cylinder is started by the control device, and the output end of the hydraulic cylinder extends upward to block the packaging frame. At this time, the detection module detects that the hydraulic cylinder is started, and the detection module sends a start signal to the punching machine. The punching machine punches out the groove required for the packaging frame, and then the punching machine retracts and stops. At this time, the detection module detects that the punching machine stops, and the detection module sends a stop signal to the hydraulic cylinder and the intermittent start-stop module. After receiving the stop signal, the hydraulic cylinder retracts the output end to make the packaging frame The frame can be transported by the transmission device. At the same time, after the intermittent start-stop module receives the stop signal of the punching machine, it controls the hydraulic cylinder to start after a period of time according to the time data (the user sets it according to the speed of the transmission device). After a period of time, the packaging frame with a groove punched out in the multi-row packaging frame moves to the top of the hydraulic cylinder output end. At this time, the hydraulic cylinder starts to make the baffle pass through the groove of the packaging frame with a groove punched out to block the movement of the multi-row packaging frame. At this time, the punching machine punches the packaging frame of the packaging frame with adjacent grooves punched out in the multi-row packaging frame, thereby achieving the purpose of accurately positioning the stamping of a single packaging frame and preventing the punching machine from mistakenly stamping multiple rows of packaging frames.

[0030] 3. Through the setting of the staggered plug-in slots and the locking structure, it is achieved that the connecting plates on both sides of the fixed seat are pinched to compress the supporting springs of the connecting plates so that the plug-in plates slide into the plug-in slots, and then the fixed seat is slid to adjust the position of the hydraulic steel, so that the baffle can be accurately punched by the punching machine when blocking multiple rows of packaging frames of different sizes. After adjusting the position of the fixed seat, the connecting plate is loosened to allow the supporting springs to press against the connecting plate so that the plug-in plate is inserted into the plug-in slot to fix the fixed seat (because the staggered plug-in slots ensure that there is always one plug-in plate on both sides of the fixed seat that can be inserted into the plug-in slot to fix the fixed seat), thereby achieving the purpose of improving the applicability and practicality of the positioning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a structural diagram of the semiconductor packaging structure in Example 1; Figure 2 is a structural diagram of a column semiconductor packaging structure of Example 2; Figure 3 is a specific flow chart of the semiconductor packaging method in Example 1; Figure 4 is an overall structural diagram of the punching device in Example 1; Figure 5 is along Figure 4 Sectional view along line AA; Figure 6 yes Figure 5 Enlarged view of part A in the middle; Figure 7 It is a specific flow chart of the control device; Figure 8 It is a three-dimensional structural diagram of the packaging frame, the first base island and the second base island.

[0032] Figure numerals: 1, packaging frame; 10, first base island; 100, first connecting strip; 11, second base island; 110, upper connecting position; 111, side connecting position; 112, second connecting strip; 113, upper connecting strip; 12, separation gap; 13, breakpoint groove; 14, breakpoint; 15, identification circle hole; 16, first pin; 17, second pin; 18, third pin; 2, first chip; 20, third connecting point; 21, first connecting point; 22, second connecting point point; 3, second chip; 30, fourth connection point; 31, fifth connection point; 4, stamping device; 40, base; 400, slide groove; 401, plug-in slot; 41, transmission track; 42, stamping machine; 43, positioning device; 430, fixed seat; 431, hydraulic cylinder; 432, baffle; 4320, storage plate; 4321, plug-in plate; 433, sliding groove; 44, control device; 5, locking structure; 50, connecting plate; 51, plug-in plate; 52, supporting spring. DETAILED DESCRIPTION

[0033] The present application is further described in detail below with reference to the accompanying drawings.

[0034] Example 1, reference Figure 1 A semiconductor packaging structure includes a plurality of packaging frames 1 and a first base island 10 and a second base island 11 connected in the packaging frame 1, a first chip 2 is arranged on the first base island 10, a second chip 3 is arranged on the second base island 11, the first base island 10 is integrally connected with a second pin 17, a connection point of the first chip 2 is connected to the first base island 10 by a wire, a corresponding connection point of the first chip 2 is connected to the first pin 16 by a wire, a corresponding connection point of the first chip 2 is connected to the second base island 11 by a wire, a corresponding connection point of the second chip 3 is connected to the first base island 10 ... second base island 11 by a wire, a corresponding connection point of the second chip 3 is connected to the first base island 10 by a wire, a corresponding connection point of the second chip 3 is connected to the third pin 18 by a wire, the third pin 18 is fixedly connected to the packaging frame 1, and the first pin 16 is connected to the second pin The pin 17 or the third pin 18 or the packaging frame 1 is fixedly connected, and the base island in the packaging frame 1 is divided into a first base island 10 and a second base island 11 by a separation gap 12, and the first chip 2 and the second chip 3 are respectively arranged on the first base island 10 and the second base island 11, and the first chip 2 and the second chip 3 are connected to the first base island 10 and the second base island 11 by wires so that the first chip 2 and the second chip 3 assist each other in working without interfering with each other, and the first chip 2 and the second chip 3 are connected to the working point through the second pin 17, the third pin 18 and the first pin 16 to work, thereby reducing the packaging steps of the ceramic sheet and improving the efficiency of semiconductor packaging.

[0035] In order to make it more convenient for the second connection point 22 to connect to the second base island 11, the second base island 11 is set in this embodiment to semi-surround the first base island 10, and the second base island 11 includes an upper connection position 110 and a side connection position 111, which are respectively located on the top surface and the side of the first base island 10, the second connection point 22 is connected to the second base island 11 through the upper connection position 110, the second chip 3 is located at the side connection position 111, and the second connection point 22 is connected to the second base island 11 through the upper connection position 110, so that the second connection point 22 can be connected to the second base island 11 without bending or tilting, making it more convenient for the second connection point 22 to connect to the second base island 11, and the upper connection position 110 is connected to the second base island 11. The two sides of the connection position 110 are respectively connected to the packaging frame 1 as a whole, and the second connecting strip 112 is located at the side connection position 111. The second connecting strip 112 is located at the side connection position 111, which makes it more convenient to cut off the connection between the base island and the packaging frame 1. The two sides of the upper connection position 110 are connected to the packaging frame 1 by upper connecting strips 113, and the upper connecting strips 113 are provided with breakpoint grooves 13. The upper connection position 110 is connected to the packaging frame 1 through the upper connecting strips 113. The connection between the second base island and the packaging frame 1 is more stable through the upper connecting strips 113. The breakpoint grooves 13 make it easier to cut off the connection between the base island and the packaging frame 1 after the plastic packaging is completed.

[0036] In order to make it more convenient for the user to cut off the connection between the first base island 10 and the second base island 11 and the packaging frame 1 after plastic packaging, in this embodiment, a first connecting strip 100 is provided between the packaging frame 1 and the first base island 10, and a breakpoint groove 13 is provided on the first connecting strip 100; a second connecting strip 112 is provided between the packaging frame 1 and the second base island 11, and a breakpoint groove 13 is provided on the second connecting strip 112. Through the setting of the first connecting strip 100, the second connecting strip 112 and the breakpoint, it is more convenient for the user to cut off the connection between the first base island 10 and the second base island 11 and the packaging frame 1 after plastic packaging, and the second pin 17 is The two sides are fixedly connected to the first pin 16 and the third pin 18 respectively, and the first pin 16, the second pin 17 and the third pin 18 are provided with cutting indentations on both sides. The first pin 16, the second pin 17 and the third pin 18 are fixedly connected to the packaging frame 1 at the breakpoint 14 at one end away from the first base island 10, and the breakpoint 14 is provided with a cutting indentation. The third pin 18, the first pin 16 and the second pin 17 are fixedly connected together and are all fixedly connected to the packaging frame 1, which can prevent the third pin 18, the first pin 16 and the second pin 17 from detaching from the packaging frame 1 before plastic sealing, making their connection to the packaging frame 1 more stably, and the cutting indentation facilitates the user to cut off the connection between the pins and the packaging frame 1 after plastic sealing.

[0037] Multiple packaging frames 1 are connected side by side as a whole and are used to connect multiple semiconductor packaging structures. Each packaging frame 1 corresponds to a semiconductor packaging structure. Multiple packaging frames 1 connected side by side as a whole can enable multiple semiconductors in the packaging frames 1 to be plastic-sealed at one time, thereby improving production efficiency.

[0038] In order to facilitate users to identify semiconductors in a plurality of package frames 1 connected side by side as a whole, in this embodiment, an identification hole 15 is provided between two adjacent package frames 1 .

[0039] Embodiment 2, this embodiment is different from the previous embodiment in that, referring to Figure 2 The two sides of the first pin 16 are fixedly connected to the third pin 18 and the second pin 17 respectively, and the first pin 16, the second pin 17 and the third pin 18 are provided with cutting marks on both sides, so that the semiconductor chip can adapt to different pin interfaces.

[0040] Example 1, reference Figure 3 , a semiconductor packaging method of a semiconductor packaging structure, comprising the following steps: Step 1: Draw the semiconductor packaging structure drawing; Step 2: punch out the packaging frame 1, the first base island 10, the second base island 11, the third pin 18, the first pin 16, the second pin 17 and the interconnected connecting strips of the semiconductor packaging structure according to the drawing of the first step; Step 3: Connect the first chip 2 and the second chip 3 to the first base island 10 and the second base island 11 respectively, and connect corresponding wires; Step 4: Plastic sealing; Step 5: Cut off all connecting strips at the breakpoint groove 13 to separate the packaging frame 1 from the first base island 10, and separate the packaging frame 1 from the second base island 11. At the same time, cut off the connection between the third pin 18, the first pin 16, and the second pin 17 at the cutting indentation, and at the same time cut off the connection between the tail ends of the third pin 18, the first pin 16, and the second pin 17 and the packaging frame 1.

[0041] Because when the existing punching device 4 punches multiple packaging frames 1 connected side by side as a whole, if multiple packaging frames 1 are punched at the same time, the multiple packaging frames 1 connected side by side as a whole will be subjected to greater force and are easy to break, but if the punching force is reduced, it is not easy to punch out the grooves required by the packaging frames 1. If a single packaging frame 1 is punched, how to ensure that the punching machine 42 punches the packaging frame 1 very accurately each time is a problem. In order to solve this technical problem, refer to Figure 4 , Figure 5 , Figure 6 , Figure 7In this embodiment, the punching device 4 used for punching in the second step is configured to include at least a base 40, a transmission track 41 installed on the base 40, a punching machine 42 installed on the base 40 and located above the transmission track 41, and a positioning device 43 installed on the base 40 and located below the transmission track 41. A control device 44 for controlling the start and stop of the punching machine 42 and the positioning device 43 is provided on one side of the base 40. The positioning device 43 includes a fixed seat 430, and a hydraulic cylinder 431 with an output end facing upward is installed on the fixed seat 430. The hydraulic cylinder 431 is provided with a plurality of hydraulic cylinders 431, and the hydraulic cylinder 431 is provided with a plurality of hydraulic cylinders 431. A blocking piece 432 extends upward from the output end of the hydraulic cylinder 431, and the control device 44 includes an adjustment module, a detection module and an intermittent start-stop module. The adjustment module is used to adjust the time interval for starting the output end of the hydraulic cylinder 431, and the detection module is used to detect the start-stop status of the hydraulic cylinder 431 and the punching machine 42, control the start-stop of the hydraulic cylinder 431 and the punching machine 42, and send a start signal to the intermittent start-stop module. The intermittent start-stop module is used to obtain the interval time data of the adjustment module and control the start-stop of the hydraulic cylinder 431 according to the time data after receiving the start signal of the punching machine 42.

[0042] Place multiple packaging frames 1 connected in parallel and integrated onto the transmission track 41. When one side of the multiple packaging frames 1 connected in parallel and integrated is about to move above the positioning device 43, the hydraulic cylinder 431 is started by the control device 44, and the output end of the hydraulic cylinder 431 extends upward so that the blocking piece 432 blocks the packaging frame 1. At this time, the detection module detects that the hydraulic cylinder 431 is started, and the detection module sends a start signal to the punching machine 42. The punching machine 42 punches out the required groove of the packaging frame 1, and then the punching machine 42 retracts and stops. At this time, the detection module detects that the punching machine 42 stops, and the detection module sends a stop signal to the hydraulic cylinder 431, and at the same time sends a start signal to the intermittent start-stop module. After receiving the stop signal, the hydraulic cylinder 431 retracts the output The end enables its packaging frame 1 to be transmitted by the transmission device. At the same time, after receiving the start signal, the intermittent start-stop module controls the hydraulic cylinder 431 to start after a period of time according to the time data (the user sets it according to the speed of the transmission device). After a period of time, the packaging frame 1 with a groove punched out in the multi-row packaging frame 1 moves to the top of the output end of the hydraulic cylinder 431. At this time, the hydraulic cylinder 431 starts to make the blocking piece 432 pass through the groove of the packaging frame 1 with a groove punched out to block the movement of the multi-row packaging frame 1. At this time, the punching machine 42 punches the packaging frame 1 of the adjacent packaging frame 1 with a groove punched out in the multi-row packaging frame 1, thereby achieving the purpose of accurately positioning the punching of a single packaging frame 1 and preventing the punching machine 42 from punching out multiple rows of packaging frames 1 incorrectly.

[0043] Although the setting of the positioning device 43 can prevent the punching machine 42 from mistakenly punching the multi-row packaging frame 1, the size of each batch of multi-row packaging frames 1 is different. This results in that the positioning device 43 cannot be adjusted in time when positioning the multi-row packaging frames 1 of different sizes, which reduces the applicability and practicality of the positioning device 43. In order to solve this technical problem, in this embodiment, a slide groove 400 is provided on the base 40, and the fixed seat 430 is slidably connected to the base 40 through the slide groove 400. The inner walls on both sides of the slide groove 400 are provided with mutually staggered plug-in grooves 401, and the upper surface of the fixed seat 430 is provided with a sliding groove 433 that passes through the fixed seat 430. A locking structure 5 is provided in the sliding groove 433. The locking structure 5 includes a connecting plate 50 located in the sliding groove 433, a plug-in plate 51 fixedly connected to the bottom end of the connecting plate 50, and a support spring 52 arranged between the connecting plate 50 and the inner wall of the sliding groove 433, and one end of the support spring 52 is fixed The locking structure 5 and the sliding groove 433 are arranged on both sides of the fixing seat 430. The connecting plates 50 on both sides of the fixing seat 430 are pinched to compress the supporting springs 52 of the connecting plates 50 so that the plug-in plate 51 slides into the plug-in groove 400 and the fixing seat 430 is then slid to adjust the position of the hydraulic steel so that the baffle can be accurately punched by the punching machine 42 when blocking multiple rows of packaging frames 1 of different sizes. After adjusting the position of the fixing seat 430, the connecting plate 50 is released so that the supporting springs 52 press against the connecting plate 50 so that the plug-in plate 51 is inserted into the plug-in groove 401 to fix the fixing seat 430 (because the staggered plug-in grooves 401 ensure that there is always one plug-in plate 51 on both sides of the fixing seat 430 that can be inserted into the plug-in groove 401 to fix the fixing seat 430). In this way, the purpose of improving the applicability and practicality of the positioning device 43 is achieved.

[0044] Although the staggered plug-in slots 401 and the locking structure 5 improve the applicability and practicality of the positioning device 43, the length of the baffle 432 of the hydraulic cylinder 431 that has changed its position cannot adapt to the length of the slots of the multi-row packaging frames 1 of different sizes, resulting in the baffle 432 being blocked when restricting the multi-row packaging frames 1. In order to solve this technical problem, in this embodiment, the baffle 432 is configured to include a storage sheet 4320 and a plug-in sheet 4321. The baffle 432 includes a storage sheet 4320 and a plug-in sheet 4321, so that when the baffle 432 encounters a slot whose length is shorter than the baffle 432, the plug-in sheet 4321 is pushed to retract into the storage sheet 4320, thereby shortening the overall length of the baffle 432 to adapt to the length of the slots of the multi-row packaging frames 1 of different sizes, further improving the applicability and practicality of the positioning device 43.

[0045] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor packaging structure, characterized in that: The invention comprises a plurality of packaging frames (1) and a first base island (10) and a second base island (11) connected in the packaging frames (1); a separation gap (12) is provided between the first base island (10) and the second base island (11); a first chip (2) is arranged on the first base island (10); a second chip (3) is arranged on the second base island (11); the first base island (10) is integrally connected with a first pin (16); a third connection point (20) of the first chip (2) is connected to the first base island (10) by a wire; and the first chip (2 ) a first connection point (21) is connected to a second pin (17) by a wire, a second connection point (22) of the first chip (2) is connected to a second base island (11) by a wire, a fourth connection point (30) of the second chip (3) is connected to the first base island (10), a fifth connection point (31) of the second chip (3) is connected to a third pin (18) by a wire, the third pin (18) is fixedly connected to the packaging frame (1), and the second pin (17) is fixedly connected to the first pin (16) or the third pin (18) or the packaging frame (1).

2. A semiconductor packaging structure according to claim 1, characterized in that: The second base island (11) semi-surrounds the first base island (10); the second base island (11) comprises an upper connection position (110) and a side connection position (111), which are respectively located on the top surface and the side surface of the first base island (10); the second connection point (22) is connected to the second base island (11) via the upper connection position (110); and the second chip (3) is located at the side connection position (111).

3. The semiconductor packaging structure according to claim 1, characterized in that: A first connecting strip (100) having two ends respectively fixedly connecting the packaging frame (1) and the first base island (10) is provided between the packaging frame (1) and the first base island (10), and a breakpoint groove (13) is provided on the first connecting strip (100); and a second connecting strip (112) having two ends respectively fixedly connecting the packaging frame (1) and the second base island (11) is provided between the packaging frame (1) and the second base island (11), and a breakpoint groove (13) is provided on the second connecting strip (112).

4. The semiconductor packaging structure according to claim 1, characterized in that: The two sides of the second pin (17) are respectively fixedly connected to the first pin (16) and the third pin (18); the two sides of the first pin (16), the two sides of the second pin (17) and the two sides of the third pin (18) are all provided with cutting indentations; the breakpoint (14) at one end of the third pin (18), the first pin (16) and the second pin (17) away from the first base island (10) is fixedly connected to the packaging frame (1), and the breakpoint (14) is provided with a cutting indentation.

5. A semiconductor packaging structure according to claim 2, characterized in that: The two sides of the upper connection position (110) are respectively connected to the packaging frame (1) in one piece, the second connection strip (112) is located at the side connection position (111), the two sides of the upper connection position (110) are connected to the packaging frame (1) by an upper connection strip (113), and the upper connection strip (113) is provided with a breakpoint groove (13), and the upper connection position (110) is connected to the packaging frame (1) via the upper connection strip (113).

6. The semiconductor packaging structure according to claim 1, characterized in that: A plurality of the packaging frames (1) are connected in parallel and integrally for connecting a plurality of semiconductor packaging structures; each packaging frame (1) corresponds to a semiconductor packaging structure; and an identification circle hole (15) is provided between two adjacent packaging frames (1).

7. The semiconductor packaging structure according to claim 1, characterized in that: Both sides of the first pin (16) are fixedly connected to the third pin (18) and the second pin (17) respectively, and both sides of the first pin (16), both sides of the second pin (17) and both sides of the third pin (18) are provided with cutting indentations.

8. A semiconductor packaging method applied to a semiconductor packaging structure according to any one of claims 1 to 7, characterized in that: The following steps are involved: Step 1: Draw the semiconductor packaging structure drawing; Step 2: punching out a packaging frame (1), a first base island (10), a second base island (11), a third pin (18), a first pin (16), a second pin (17) and interconnected connecting strips of the semiconductor packaging structure according to the drawing of the first step; Step 3: Connect the first chip (2) and the second chip (3) to the first base island (10) and the second base island (11) respectively, and connect corresponding wires; Step 4: Plastic sealing; Step 5: Cut off all the connection strips at the breakpoint groove (13) to separate the packaging frame (1) from the first base island (10), and the packaging frame (1) from the second base island (11); at the same time, cut off the connection between the two sides of the third pin (18), the two sides of the first pin (16), and the two sides of the second pin (17) at the cutting indentation; at the same time, cut off the connection between the tail ends of the third pin (18), the first pin (16), and the second pin (17) and the packaging frame (1).

9. The semiconductor packaging method according to claim 8, characterized in that: The punching device (4) used for punching in the second step at least comprises a base (40), a transmission track (41) installed on the base (40), a punching machine (42) installed on the base (40) and located above the transmission track (41), and a positioning device (43) installed on the base (40) and located below the transmission track (41), a control device (44) for controlling the start and stop of the punching machine (42) and the positioning device (43) is provided on one side of the base (40), and the positioning device (43) comprises a fixed seat (430), and a hydraulic cylinder (431) with an output end facing upward is installed on the fixed seat (430) The output end of the hydraulic cylinder (431) is provided with a baffle (432) extending upward, and the control device (44) comprises an adjustment module, a detection module and an intermittent start-stop module. The adjustment module is used to adjust the time interval of starting the output end of the hydraulic cylinder (431). The detection module is used to detect the start-stop state of the hydraulic cylinder (431) and the punching machine (42), control the start-stop of the hydraulic cylinder (431) and the punching machine (42), and send a start signal to the intermittent start-stop module. The intermittent start-stop module is used to obtain the interval time data of the adjustment module and control the start-stop of the hydraulic cylinder (431) according to the time data after receiving the start signal.

10. The semiconductor packaging method of the semiconductor packaging structure according to claim 9, characterized in that: The base (40) is provided with a slide groove (400), the fixed seat (430) is slidably connected to the base (40) through the slide groove (400), the inner walls on both sides of the slide groove (400) are provided with mutually staggered plug-in grooves (401), the upper surface of the fixed seat (430) is provided with a slide groove (433) penetrating the fixed seat (430), the slide groove (433) is provided with a locking structure (5), the locking structure (5) comprises a connecting plate (50) located in the slide groove (433), a plug-in plate (51) fixedly connected to the bottom end of the connecting plate (50), and a plug-in plate (51) arranged on the connecting plate (50). A support spring (52) is provided between the connecting plate (50) and the inner wall of the sliding groove (433), one end of the support spring (52) is fixedly connected to a side of the sliding groove (433) away from the plug-in groove (401), and the other end is fixedly connected to the connecting plate (50), locking structures (5) and sliding grooves (433) are provided on both sides of the fixing seat (430), the blocking piece (432) includes a storage piece (4320) and a plug-in piece (4321), plug-in interfaces are provided on both sides of the storage piece (4320), and the plug-in piece (4321) is plugged into the storage piece (4320) through the plug-in interfaces.

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