Voice coil framework, loudspeaker and electronic equipment

By using voice coil skeletons with high content of sound absorbing particles and adhesives, the weight and high temperature resistance of the voice coil skeleton are solved, the efficiency and heat dissipation performance of the speaker are improved, and the sound quality is achieved.

CN119136135APending Publication Date: 2024-12-13SSI NEW MATERIAL (ZHENJIANG) CO LTD
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Patent Information

Application Number
CN202411258086.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2024-12-13

AI Technical Summary

Technical Problem

The existing voice coil skeleton has weight limitations, which affects the performance and sound quality of the speakers. The commonly used materials are prone to deform and are difficult to meet the requirements of high temperature resistance.

Method used

The sound-absorbing particle material is made into a voice coil skeleton with a content of 85-95%, combined with adhesive, density of 0.2-0.4g/cm3, and porous powder materials such as zeolite molecular sieve, and the axial cross-sectional shape is designed as Z-shaped or L-shaped to increase the bonding area and to contain organic or inorganic adhesives to bind the particles.

Benefits of technology

It reduces the weight of the voice coil skeleton, improves the efficiency and sensitivity of the speaker, improves the heat dissipation performance, and enhances the high temperature resistance of the voice coil skeleton.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a voice coil skeleton, a loudspeaker and an electronic device, the voice coil skeleton comprises sound absorbing particles, and the content of the sound absorbing particles is 85-95% based on the total weight of the voice coil skeleton being 100%. The voice coil framework provided by the invention is made of the sound-absorbing material, so that the weight of the voice coil framework is reduced, namely the vibration mass of the loudspeaker is reduced, and the proportion of the voice coil to the vibration mass of the loudspeaker is increased, thereby improving the overall efficiency and sensitivity of the loudspeaker; in addition, the sound-absorbing material has a large number of holes and pores, so that the heat in the voice coil structure can be quickly led out, and the heat dissipation of the loudspeaker can be improved.
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Description

Technical Field

[0001] The invention relates to a voice coil frame, a loudspeaker and electronic equipment, belonging to the technical field of electronic acoustics, in particular to the technical field of voice coils. Background Art

[0002] Existing dynamic speakers usually consist of three parts:

[0003] ①Vibration system, including diaphragm, voice coil and centering support, etc.;

[0004] ②Magnetic circuit system, including permanent magnets, magnetic plates and field core columns;

[0005] ③ Auxiliary systems, including basin stands, terminal boards, dust covers, etc.

[0006] When an audio current passes through the voice coil in the magnetic field, a magnetic field that changes with the audio current is generated. This magnetic field interacts with the magnetic field of the permanent magnet, causing the voice coil to vibrate along the axial direction and produce sound.

[0007] As the amplitude of the speaker becomes larger and larger, the upper vibration space required by the voice coil becomes larger and larger, and the voice coil cannot be in a better position. At this time, a skeleton needs to be added to the voice coil to move the voice coil into the magnetic field. Or the voice coil wall is too thin and easily deformed. An inner lining needs to be added to the voice coil to keep the shape unchanged. At this time, a voice coil skeleton also needs to be added.

[0008] The voice coil skeleton is the skeleton of the entire voice coil. It is responsible for transmitting the sound source driving force generated by the voice coil to the outside and radiating and diffusing it in the form of mechanical waves. Therefore, the voice coil skeleton is required to be light and rigid. The inner surface of the skeleton should be flat and smooth. After being treated with paint, it must also be resistant to high temperatures. Common materials for voice coil skeletons include kraft paper, aluminum, asbestos paper, etc.

[0009] Therefore, providing a new voice coil frame, loudspeaker and electronic device has become a technical problem that needs to be solved urgently in the field. Summary of the invention

[0010] In order to solve the above shortcomings and deficiencies, the purpose of the present invention is to provide a voice coil frame, a loudspeaker and an electronic device. The present invention improves the performance of products such as loudspeakers and electronic devices by solving the weight limitation of the loudspeaker voice coil frame, and meets the requirements of the whole machine for the sound of the loudspeaker.

[0011] In order to achieve the above objectives, on one hand, the present invention provides a voice coil bobbin, wherein the voice coil bobbin contains sound-absorbing particles, and the content of the sound-absorbing particles is 85-95% based on the total weight of the voice coil bobbin as 100%.

[0012] As a specific embodiment of the voice coil frame of the present invention, the density of the voice coil frame is 0.2-0.4 g / cm 3 .

[0013] As a specific embodiment of the voice coil skeleton described above in the present invention, the sound-absorbing particles include one or a combination of porous powder materials such as zeolite molecular sieve, activated silica, activated carbon, porous calcium carbonate and porous calcium silicate.

[0014] In order to enhance the acoustic enhancement effect of the sound-absorbing material to a greater extent, as a specific embodiment of the voice coil frame described above in the present invention, the zeolite molecular sieve includes one or a combination of MFI structure molecular sieve, FER structure molecular sieve, CHA structure molecular sieve, MEL structure molecular sieve, ION structure molecular sieve, TON structure molecular sieve, MER type molecular sieve, BEA type molecular sieve and MTT structure molecular sieve.

[0015] As a specific embodiment of the voice coil bobbin described above in the present invention, the zeolite molecular sieve is ZSM-5 molecular sieve.

[0016] As a specific embodiment of the voice coil bobbin described above, the particle size of the zeolite molecular sieve is 0.5-10 μm, including micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

[0017] As a specific embodiment of the above-mentioned voice coil bobbin of the present invention, the voice coil bobbin further comprises an adhesive for bonding the sound-absorbing particles, and the absolute dry content of the adhesive is 5-15% based on the total weight of the voice coil bobbin as 100%; the adhesive is an organic adhesive and / or an inorganic adhesive. That is, the material of the voice coil bobbin of the present invention is a sound-absorbing material, wherein the sound-absorbing material comprises sound-absorbing particles and an adhesive for bonding the sound-absorbing particles.

[0018] As a specific embodiment of the voice coil skeleton described above in the present invention, the organic adhesive includes one or a combination of polyacrylate, acrylic copolymer, polyurethane, polystyrene butadiene emulsion, polystyrene acrylate, polystyrene acetate emulsion, polyvinyl acetate emulsion, silicone resin and polybutadiene rubber emulsion.

[0019] As a specific embodiment of the voice coil frame described above in the present invention, the inorganic adhesive includes one or a combination of inorganic silica sol, aluminum sol, iron red sol, phosphate sol, lime, clay, water glass, gypsum, etc.

[0020] As a specific embodiment of the voice coil frame described above in the present invention, the axial cross-section of the voice coil frame is Z-shaped or L-shaped, and the radial cross-section is a rounded rectangle, a circle or a nearly circular shape. The voice coil frame is cylindrical in shape as a whole. For example, when the radial cross-section is a circle, the voice coil frame is cylindrical in shape as a whole. In addition, the Z-shape can be a strict Z-shape, or a Z-shape with two sides connected at right angles. Specifically, Figure 2 The present invention designs the axial cross-section of the voice coil frame to be Z-shaped or L-shaped, etc., which can increase the bonding area between the voice coil frame and the diaphragm, thereby increasing the bonding force of the center glue.

[0021] The present invention does not make specific requirements on the method for making the voice coil frame, and can be reasonably adjusted according to the actual needs of the on-site operation. For example, in some embodiments of the present invention, the sound-absorbing particles and the adhesive can be mixed to prepare a mixed slurry, and then the mixed slurry is molded to obtain the voice coil frame.

[0022] There are many key parameters of a loudspeaker, such as resonance frequency F0, sound pressure level, harmonic distortion (THD), higher-order harmonic distortion (HOHD), etc. Among them, the resonance frequency F0 is one of the most important indicators of a loudspeaker, which represents the level of the low-frequency characteristics of the loudspeaker.

[0023] According to the principle of proton vibration;

[0024] The calculation formula of F0 is shown in the following formula (1):

[0025]

[0026] In formula (1):

[0027] F0 is the resonant frequency of the speaker unit, in Hz;

[0028] M MS is the equivalent mass of the vibration system (including the load mass of the air), in kg;

[0029] C MS is the equivalent compliance of the vibration system, with the unit of m / N.

[0030] Among them, the equivalent mass M of the vibration system MS Including the total weight of the voice coil, voice coil frame, diaphragm, centering support and adhesive glue, and the weight of the voice coil frame accounts for M MS The lower the ratio, the higher the intermediate frequency sensitivity.

[0031] On the other hand, the present invention also provides a loudspeaker, comprising one or more acoustic sensors and one or more housings, wherein the one or more acoustic sensors and the one or more housings are combined to form a loudspeaker back cavity, wherein the voice coil frame of the loudspeaker is the voice coil frame described above.

[0032] As a specific embodiment of the loudspeaker described above in the present invention, when the axial cross-sectional shape of the voice coil skeleton is Z-shaped, the entire outer end surface of any end of the Z-shaped voice coil skeleton is connected to the diaphragm; when the axial cross-sectional shape of the voice coil skeleton is L-shaped, the entire outer end surface of one side of the L-shaped voice coil skeleton is connected to the diaphragm.

[0033] As a specific implementation of the above-mentioned loudspeaker of the present invention, one or more holes are provided on the voice coil frame for heat dissipation.

[0034] As a specific embodiment of the above-mentioned loudspeaker of the present invention, the rear cavity of the loudspeaker is filled with sound-absorbing material. At this time, when the sound-absorbing material is filled in the rear cavity of the loudspeaker, the voice coil skeleton connected to the voice coil and made of the sound-absorbing material is also located in the rear cavity separated by the diaphragm, but it is located inside the loudspeaker unit and does not occupy the conventional rear cavity space, which can be regarded as increasing the filling amount of the sound-absorbing material filled in the rear cavity, thereby achieving a capacity expansion effect.

[0035] The sound-absorbing material filled in the rear cavity of the loudspeaker may be an existing conventional sound-absorbing material, or may be a sound-absorbing material that is the same as the material of the voice coil frame.

[0036] In yet another aspect, the present invention further provides an electronic device, wherein a speaker of the electronic device is the speaker described above.

[0037] As a specific embodiment of the electronic device described above in the present invention, the electronic device includes a smart phone, TWS earphones, headphones, smart glasses, smart watches, VR devices, AR devices, tablet computers or thin and light laptops, etc.

[0038] Compared with the prior art, the beneficial technical effects that can be achieved by the present invention include:

[0039] (1) The voice coil frame provided by the present invention is made of sound-absorbing material, which reduces the weight of the voice coil frame, which is equivalent to reducing the vibration mass of the speaker, that is, the equivalent mass of the vibration system in the above formula (1), and is equivalent to increasing the proportion of the voice coil in the vibration mass of the speaker, thereby improving the overall efficiency and sensitivity of the speaker.

[0040] And (2) the voice coil frame provided by the present invention is made of a sound-absorbing material, which has a large number of holes and pores, and can quickly conduct heat in the voice coil structure, thereby improving the heat dissipation of the speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 This is a SPL (Sound Pressure Level) curve diagram of the first speaker unit and the comparison speaker unit in Test Example 1 of the present invention.

[0043] Figure 2 This is a schematic diagram of the positional relationship between the voice coil skeleton, the diaphragm and the voice coil in the first speaker unit in Application Example 1 of the present invention.

[0044] Figure 3 This is a schematic diagram of the positional relationship between the voice coil skeleton, the diaphragm and the voice coil in the second speaker unit in Application Example 1 of the present invention.

[0045] Figure 4 This is a schematic diagram of the positional relationship between the voice coil skeleton, the diaphragm and the voice coil in the third speaker unit in Application Example 1 of the present invention.

[0046] Figure 5 This is a schematic diagram of the positional relationship between the voice coil skeleton, the diaphragm and the voice coil in the fourth speaker unit in Application Example 1 of the present invention.

[0047] Figure 6 This is a schematic diagram of the positional relationship between the voice coil skeleton, the diaphragm and the voice coil in the fifth speaker unit in Application Example 1 of the present invention.

[0048] Figure 7 This is a schematic diagram of the positional relationship between the voice coil skeleton, the diaphragm and the voice coil in the sixth speaker unit in Application Example 1 of the present invention.

[0049] Description of main figures:

[0050] 1. Diaphragm;

[0051] 2. Voice coil frame;

[0052] 3. Voice coil. DETAILED DESCRIPTION

[0053] It should be noted that the term "comprises" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0054] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "middle", "top" and "bottom" are based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application.

[0055] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0056] In addition, in the description of this application, unless otherwise clearly defined, the terms "disposed", "connected or connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] "Scope" disclosed in the present invention is given in the form of lower limit and upper limit. It can be one or more lower limits, and one or more upper limits respectively. A given range is defined by selecting a lower limit and an upper limit. The selected lower limit and upper limit define the boundaries of a particular range. All ranges defined in this way are combinable, i.e. any lower limit can be combined with any upper limit to form a range. For example, for a specific parameter, a range of 60-120 and 80-110 is listed, and it is understood that a range of 60-110 and 80-120 is also expected. In addition, if the minimum range values ​​listed are 1 and 2, and the maximum range values ​​listed are 3, 4 and 5, then the following ranges can all be expected: 1-3, 1-4, 1-5, 2-3, 2-4 and 2-5.

[0058] In the present invention, unless otherwise specified, the numerical range "ab" represents an abbreviation of any real number combination between a and b, where a and b are real numbers. For example, the numerical range "0-5" means that all real numbers between "0-5" have been listed in the present invention, and "0-5" is just an abbreviation of these numerical combinations.

[0059] In the present invention, unless otherwise specified, all embodiments and preferred embodiments mentioned in the present invention can be combined with each other to form a new technical solution.

[0060] In the present invention, unless otherwise specified, all technical features and preferred features mentioned in the present invention can be combined with each other to form a new technical solution.

[0061] In the present invention, if not specifically stated, the term "two" used in this specification means "at least two".

[0062] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the attached table, drawings and examples. The following described embodiments are some embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention. If the specific conditions are not specified in the embodiments, they are carried out according to the normal conditions or the conditions recommended by the manufacturer. If the manufacturer is not specified in the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0063] Example 1

[0064] This embodiment provides a voice coil frame, wherein the material of the voice coil frame is a sound absorbing material, the sound absorbing material includes sound absorbing particles and an adhesive for bonding the sound absorbing particles, and based on the total weight of the voice coil frame being 100%, the content of the sound absorbing particles is 95% and the absolute dry content of the adhesive is 5%;

[0065] The density of the sound absorbing material, i.e. the voice coil frame, is 0.4 g / cm 3 ;

[0066] The sound-absorbing particles are ZSM-5 molecular sieves with a particle size of 0.5 μm, which include micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm;

[0067] The adhesive is polyacrylate;

[0068] The axial cross-section of the voice coil frame is Z-shaped, and the radial cross-section is a rounded rectangle (ie, a racetrack shape).

[0069] Example 2

[0070] This embodiment provides a voice coil frame, wherein the material of the voice coil frame is a sound absorbing material, the sound absorbing material includes sound absorbing particles and an adhesive for bonding the sound absorbing particles, and based on the total weight of the voice coil frame being 100%, the content of the sound absorbing particles is 93% and the absolute dry content of the adhesive is 7%;

[0071] The density of the sound absorbing material, i.e. the voice coil frame, is 0.34 g / cm 3 ;

[0072] The sound-absorbing particles are FER structure molecular sieves with a particle size of 5 μm, which include micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm;

[0073] The adhesive is polystyrene butadiene emulsion;

[0074] The voice coil frame has an axial cross-section in an L-shape and a radial cross-section in a circular shape.

[0075] Example 3

[0076] This embodiment provides a voice coil frame, wherein the material of the voice coil frame is a sound absorbing material, the sound absorbing material includes sound absorbing particles and an adhesive for bonding the sound absorbing particles, and based on the total weight of the voice coil frame being 100%, the content of the sound absorbing particles is 87% and the absolute dry content of the adhesive is 13%;

[0077] The density of the sound absorbing material, i.e. the voice coil frame, is 0.29 g / cm 3 ;

[0078] The sound-absorbing particles are MEL structure molecular sieves with a particle size of 8 μm, which include micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm;

[0079] The adhesive is inorganic silica sol;

[0080] The voice coil frame has an axial cross-section in an L-shape and a radial cross-section in a nearly circular shape.

[0081] Example 4

[0082] This embodiment provides a voice coil frame, wherein the material of the voice coil frame is a sound absorbing material, the sound absorbing material includes sound absorbing particles and an adhesive for bonding the sound absorbing particles, and based on the total weight of the voice coil frame being 100%, the content of the sound absorbing particles is 85% and the absolute dry content of the adhesive is 15%;

[0083] The density of the sound absorbing material is 0.2 g / cm3 ;

[0084] The sound-absorbing particles are CHA structure molecular sieves with a particle size of 10 μm, which include micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm;

[0085] The adhesive is aluminum sol;

[0086] The voice coil frame has an axial cross-section in an L-shape, and a radial cross-section in a rounded rectangle (ie, a racetrack shape).

[0087] Example 5

[0088] This embodiment provides a voice coil bobbin, which is different from the voice coil bobbin provided in Embodiment 1 only in that the axial cross-sectional shape of the voice coil bobbin is different. The axial cross-sectional shape of the voice coil bobbin in this embodiment is I-shaped.

[0089] Comparative Example 1

[0090] The comparative example provides a voice coil frame, wherein the voice coil frame is made of aluminum alloy, the axial cross-section is Z-shaped, the radial cross-section is a rounded rectangle (i.e., a racetrack shape), and the density is 2.7 g / cm 3 .

[0091] Application Example 1

[0092] This application example provides a series of 0918 speaker units (size is 9mm*18mm), wherein the voice coil frames are respectively provided in Examples 1 to 5, wherein the speaker units provided with the voice coil frames provided in Example 1 are respectively recorded as the first speaker unit and the sixth speaker unit, and the speaker units provided with the voice coil frames provided in Examples 2 to 5 are respectively recorded as the second speaker unit to the fifth speaker unit, and in the first speaker unit to the sixth speaker unit, the schematic diagrams of the positional relationship between the voice coil frame, the diaphragm and the voice coil are respectively as shown in Figure 2-Figure 7 As shown. Figure 2 It can be seen from the figure that the axial cross-section of the voice coil frame 2 is Z-shaped, and the entire outer end surfaces of both ends of the Z-shaped voice coil frame 2 are connected to the diaphragm 1 and the voice coil 3 respectively; Figure 7 It can be seen from the figure that the axial cross-section of the voice coil frame 2 is Z-shaped, the entire top surface (outer end surface) of the upper end of the Z-shaped voice coil frame 2 is connected to the diaphragm 1, and the voice coil 3 is hooked at the lower end of the Z-shaped voice coil frame 2; Figure 3 It can be seen that the axial cross-section of the voice coil frame 2 is L-shaped, the entire top surface (outer end surface) of one side of the L-shaped voice coil frame 2 is connected to the diaphragm 1, and the outer side surface of the other side is connected to the side surface of the voice coil 3; Figure 4It can be seen that the axial cross-section of the voice coil frame 2 is also L-shaped, and the entire top surface (outer end surface) of one side of the L-shaped voice coil frame 2 is connected to the diaphragm 1, and the inner side surface of the other side is connected to the side surface of the voice coil 3; Figure 5 It can be seen that the axial cross-section of the voice coil frame 2 is also L-shaped, and the entire top surface (outer end surface) of one side of the L-shaped voice coil frame 2 is connected to the diaphragm 1, and the bottom end of the other side is connected to the top of the voice coil 3; Figure 6 It can be seen from the figure that the axial cross-section of the voice coil frame 2 is I-shaped, and the entire outer end surfaces at both ends of the I-shaped voice coil frame 2 are connected to the diaphragm 1 and the voice coil 3 respectively.

[0093] The voice coil skeletons provided in Examples 1 to 5 of the present invention can better achieve the technical effect of the lightweight skeleton. Compared with the I-shaped voice coil skeleton used in Example 5, the L-shaped and Z-shaped voice coil skeletons used in Examples 1 to 4 of the present invention can also ensure the connection effect between them and the diaphragm, because the connection surface area between the L-shaped and Z-shaped voice coil skeletons and the diaphragm is larger.

[0094] Comparative application example 1

[0095] This comparative application example provides a 0918 speaker unit (size is 9mm*18mm), wherein the voice coil skeletons are the voice coil skeletons provided in comparative example 1, and are recorded as comparative speaker units.

[0096] Test Example 1

[0097] This test example uses the conventional method in the art (test equipment: soundcheck15.0 electroacoustic test system, test method: 2.83V 10cm baffle test) to measure the SPL (Sound Pressure Level, i.e., sound pressure level or sound pressure level) of the first speaker unit to the fifth speaker unit and the comparison speaker unit respectively. The weight of the voice coil frame, the equivalent mass of the vibration system and the obtained SPL experimental results are shown in Tables 1 and Figure 1 shown.

[0098] Table 1

[0099]

[0100] From Table 1 and Figure 1 It can be seen that compared with the comparative speaker monomer, the first speaker monomer to the fifth speaker monomer respectively use the voice coil skeletons provided by embodiments 1 to 5 of the present invention, and the weight of the voice coil skeletons in the first speaker monomer to the fifth speaker monomer is greatly reduced from 7.13 mg to 1.03 mg, 1.00 mg, 0.94 mg, 0.82 mg and 1.12 mg respectively. Accordingly, M MSIt decreases from 45.04mg to 38.94mg, 38.91mg, 38.85mg, 38.73mg and 39.03mg, which is equivalent to increasing the proportion of the voice coil in the vibration mass of the speaker, thereby improving the overall efficiency and sensitivity of the speaker. Specifically, at the same frequency, the SPL of the first speaker unit to the fifth speaker unit is higher than that of the comparison speaker unit, among which the low frequency (300Hz) SPL increases by 1db, 0.99db, 1.01db, 1.02db and 0.27db respectively, and the high frequency (2kHz) SPL increases by 1.3db, 1.28db, 1.31db, 1.3db and 0.74db respectively. In addition, it can be seen from Table 1 that the performance of the first speaker unit to the fourth speaker unit using the voice coil skeleton provided by Examples 1 to 4 of the present invention is slightly better than that of the fifth speaker unit using the voice coil skeleton provided by Example 5 of the present invention, which may be because the performance of the L-shaped and Z-shaped voice coil skeletons is better than that of the I-shaped voice coil skeleton.

[0101] In summary, compared with the prior art, the embodiments of the present invention can achieve the following beneficial technical effects:

[0102] (1) The voice coil frame provided in the embodiment of the present invention is made of sound-absorbing material, which reduces the weight of the voice coil frame, which is equivalent to reducing the vibration mass of the speaker, that is, the equivalent mass of the vibration system in the above formula (1), and is equivalent to increasing the proportion of the voice coil in the vibration mass of the speaker, thereby improving the overall efficiency and sensitivity of the speaker.

[0103] (2) The axial cross-section of the voice coil bobbin provided in the embodiment of the present invention is Z-shaped or L-shaped, which increases the bonding area between the voice coil bobbin and the diaphragm, thereby increasing the bonding force of the center glue.

[0104] (3) The voice coil frame provided in the embodiment of the present invention is made of a sound-absorbing material. The sound-absorbing material has a large number of holes and pores, which can quickly conduct heat in the voice coil structure, thereby improving the heat dissipation of the speaker.

[0105] The above is only a specific embodiment of the present invention, and cannot be used to limit the scope of the invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the protection scope of the patent of the present invention, should still fall within the scope of this patent. In addition, the technical features of the present invention can be freely combined with each other, with each other and with each other, and with each other.

Claims

1. A voice coil frame, characterized in that: The voice coil frame contains sound-absorbing particles. Based on the total weight of the voice coil frame being 100%, the content of the sound-absorbing particles is 85-95%.

2. The voice coil frame according to claim 1, characterized in that: The density of the voice coil skeleton is 0.2-0.4g / cm 3 .

3. The voice coil frame according to claim 1, characterized in that: The sound-absorbing particles include one or a combination of zeolite molecular sieve, activated silicon dioxide, activated carbon, porous calcium carbonate and porous calcium silicate.

4. The voice coil frame according to claim 3, characterized in that: The zeolite molecular sieve includes one or a combination of MFI structure molecular sieve, FER structure molecular sieve, CHA structure molecular sieve, MEL structure molecular sieve, ION structure molecular sieve, TON structure molecular sieve, MER type molecular sieve, BEA type molecular sieve and MTT structure molecular sieve.

5. The voice coil frame according to claim 4, characterized in that: The zeolite molecular sieve is ZSM-5 molecular sieve.

6. The voice coil frame according to any one of claims 3 to 5, characterized in that: The particle size of the zeolite molecular sieve is 0.5-10 μm, including micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

7. The voice coil frame according to claim 1 or 2, characterized in that: The voice coil frame further comprises an adhesive for bonding the sound absorbing particles together, and the absolute dry content of the adhesive is 5-15% based on the total weight of the voice coil frame as 100%; wherein the adhesive is an organic adhesive and / or an inorganic adhesive.

8. The voice coil frame according to claim 7, characterized in that: The organic adhesive includes one or a combination of polyacrylate, acrylic copolymer, polyurethane, polystyrene butadiene emulsion, polystyrene acrylate, polystyrene acetate emulsion, polyvinyl acetate emulsion, silicone resin and polybutadiene rubber emulsion.

9. The voice coil frame according to claim 7, characterized in that: The inorganic adhesive includes one or a combination of inorganic silica sol, aluminum sol, iron red sol, phosphate sol, lime, clay, water glass, and gypsum.

10. The voice coil frame according to any one of claims 1 to 5, characterized in that: The axial cross-section of the voice coil frame is Z-shaped or L-shaped, and the radial cross-section is a rounded rectangle, a circle or a nearly circle.

11. A speaker, comprising one or more acoustic sensors and one or more housings, wherein the one or more acoustic sensors and the one or more housings are combined to form a speaker back cavity, characterized in that: The voice coil frame of the loudspeaker is the voice coil frame according to any one of claims 1 to 10.

12. The loudspeaker according to claim 11, characterized in that When the axial cross-section of the voice coil frame is Z-shaped, the entire outer end surface of any end of the Z-shaped voice coil frame is connected to the diaphragm; when the axial cross-section of the voice coil frame is L-shaped, the entire outer end surface of one side of the L-shaped voice coil frame is connected to the diaphragm.

13. The loudspeaker according to claim 11 or 12, characterized in that: The rear cavity of the loudspeaker is filled with sound absorbing material.

14. An electronic device, characterized in that: The speaker of the electronic device is the speaker according to any one of claims 11 to 13.

15. The electronic device according to claim 14, characterized in that: The electronic device includes a smart phone, a TWS headset, a head-mounted headset, smart glasses, a smart watch, a VR device, an AR device, a tablet computer or a thin and light laptop computer.

Citation Information

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