Micro LED mass transfer device

Abstract

The Micro LED mass transfer device comprises a supporting frame, and a lower substrate is arranged at the lower end of the interior of the supporting frame; the feeding assemblies are installed on the left side of the supporting frame, the number of the feeding assemblies is three, and the three feeding assemblies are used for driving base films carrying R-type chips, G-type chips and B-type chips to be conveyed and wound; the transfer assembly is mounted on the right side in the support frame and is used for stripping and adsorbing the chips on the base film one by one and transferring and arranging the adsorbed chips on the lower substrate; the detection assembly is configured to detect and identify the chips adsorbed on the transfer assembly; according to the transfer assembly provided by the invention, the chips on the R-type base film, the G-type base film and the B-type base film can be stripped one by one and adsorbed and fixed, so that the chips can be accurately arranged in an RGB manner, the chips can be detected in the transfer process, and the phenomenon that the transferred chips are damaged is avoided.

Description

Technical Field

[0001] The present application relates to the field of Micro LED transfer technology, and in particular to a Micro LED mass transfer device. Background Art

[0002] Micro LED (micro light emitting diode) is a new generation of display technology, which is brighter, more efficient and consumes less power than the existing OLED (organic light emitting diode) technology. Micro LED technology designs LED structures into thin films, miniaturization and arrays, and its size is only about 1 to 10 μm. Micro LED has independent light control, high brightness, low power consumption, ultra-high resolution, ultra-high color saturation, and the self-luminous technical characteristics of Micro LED micro-display devices. It can also achieve flexible and transparent display, etc., and its power consumption is only about 10% of that of LCD panels, and the packaging requirements are low, making it easier to achieve flexible and seamless splicing display. It is a future display with great development potential in the future.

[0003] The Chinese patent with publication number CN 112420894 A and name “Micro LED transfer device and transfer method, display panel” specifically states that the printing device includes: a substrate, which is used to adsorb Micro LEDs; and a release layer located on the surface of the substrate, which is used to separate the substrate and the Micro LEDs under set humidity conditions, so as to improve the problem of local force imbalance in the process of transferring Micro LEDs, resulting in poor transfer effect and affecting product yield, thereby improving the transfer accuracy and product yield of Micro LEDs.

[0004] The prior art of the above patent can also realize the function of transferring Micro LED, but on the one hand, during the transfer process of Micro LED, the above prior art cannot synchronously transfer the three-color R-type, G-type and B-type chips, and the R-type, G-type and B-type chips cannot effectively maintain consistency, which is not conducive to the RGB arrangement of the chip; on the other hand, when the chip is transferred, the chip cannot be quickly picked up and placed, and the chip cannot be detected during the transfer process, resulting in defects in the chip during the picking and placing process, resulting in vacancies after the chip is transferred; based on this, there is still room for improvement on the basis of the existing furniture processing dust removal equipment. Summary of the invention

[0005] In order to accurately realize the functions of accurate adsorption transfer and rapid detection of Micro LEDs, the present application provides a Micro LED mass transfer device.

[0006] The present application provides a Micro LED mass transfer device that adopts the following technical solution:

[0007] A Micro LED mass transfer device includes a support frame, which is in a stepped structure. The interior of the support frame is a hollow structure, and a lower substrate is arranged at the lower end of the interior of the support frame; and a feeding assembly, which is installed on the left side of the support frame, and the number of feeding assemblies is three. The three feeding assemblies are respectively used to drive the base film carrying R-type, G-type and B-type chips to be transported and rolled up; a transfer assembly, which is installed on the right side of the support frame, and the transfer assembly is used to peel off and adsorb the chips on the base film one by one and transfer the adsorbed chips to arrange them on the lower substrate; a detection assembly, which is arranged on the outside of the transfer assembly, the detection assembly is installed on the support frame, and the detection assembly is configured to detect and identify the chips adsorbed on the transfer assembly.

[0008] Furthermore, the feeding assembly includes a conveying roller, a guide roller and a winding roller. The conveying roller is installed on the left side of the support frame, and a guide roller corresponding to the conveying roller is installed inside the support frame. The guide roller is flush with the upper end surface of the conveying roller, and a winding roller is installed between the guide roller and the conveying roller. The base film passes through the conveying roller and the guide roller in sequence and is connected to the winding roller.

[0009] Furthermore, the transfer assembly includes a fixed cylinder, a rotating shaft, a rotating roller, a connecting bracket, a transfer unit and a guide frame. The fixed cylinder is symmetrically arranged inside the support frame, and the fixed cylinder is installed on the side wall of the support frame. The fixed cylinder is penetrated by a rotating shaft, and the rotating shaft is installed on the support frame through a bearing. A rotating roller is arranged on the outside of the fixed cylinder. The middle part of the rotating shaft is connected to the rotating roller through a connecting bracket, and the connecting bracket is located in the gap between the two fixed cylinders. Rectangular grooves are evenly arranged on the outside of the rotating roller, and the transfer unit is installed in the rectangular groove. Guide frames are evenly installed on the outer surface of the fixed cylinder, and the guide frame cooperates with the transfer unit.

[0010] Furthermore, the transfer unit includes a connecting frame, a sliding plate, a push rod, a connecting spring and an adsorption piece. The connecting frame is installed in the rectangular groove, and three groups of sliding grooves opened along the length direction of the connecting frame are arranged on the inner side of the connecting frame. A sliding plate is slidably arranged in the sliding groove, and a plurality of groups of through holes are evenly arranged on the rotating roller. Each group of through holes is staggered. A push rod is slidably arranged in the through hole. The outer side of the push rod is connected to the sliding plate, and the inner side of the push rod is a smooth arc structure. The inner side of the push rod cooperates with the guide frame, and a connecting spring is arranged on the push rod. Installation grooves are evenly arranged on the outer side of the connecting frame, and an adsorption piece is installed in the installation groove, and the inner side of the adsorption piece is installed on the sliding plate.

[0011] Furthermore, the adsorption component includes a connecting rod, an insulating seat, an outer electrode sheet, an inner electrode sheet, a conductive rod and a power connection frame. A connecting rod is installed in the mounting groove, an insulating seat is installed at the end of the connecting rod, an outer electrode sheet is installed on the outer side of the insulating seat, an inner electrode sheet is installed on the inner side of the insulating seat, and conductive rods are symmetrically installed on the insulating seat. The two conductive rods are symmetrical about the axis center of the insulating seat, and the two conductive rods are electrically connected to the outer electrode sheet and the inner electrode sheet respectively. The power connection frame is installed on the side wall of the mounting groove, and the end of the conductive rod is slidably connected to the power connection frame.

[0012] Furthermore, two groups of power connection plates are arranged inside the power connection frame, and the length of the outer power connection plate is smaller than that of the inner power connection plate, and the two groups of power connection plates are electrically connected to the power supply respectively.

[0013] Furthermore, the guide frame is an annular structure, and annular grooves are evenly arranged on the guide frame. The push rod inside each group of through holes slides with an annular groove. The annular groove is provided with a material taking protrusion, an ejection protrusion and a retractable protrusion, and the ejection protrusion is arranged at the lower end of the annular groove.

[0014] Furthermore, the material picking protrusion is arranged on the left side of the annular groove, and the material picking protrusions inside each annular groove on the guide frame are staggered, and the material picking protrusions are used to drive the adsorption part to adsorb the chips carrying R-type, G-type and B-type base films one by one.

[0015] Furthermore, the retractable protrusion is arranged on the right side inside the annular groove, and an adjustable airbag is arranged inside the retractable protrusion.

[0016] Furthermore, the detection assembly includes a detection frame, a photographing unit and a collection frame. The detection frame is installed on a support frame. Grooves are symmetrically arranged on the detection frame. An identification unit is installed in the groove. The identification unit is used to take pictures of the chip after absorption. A detachable collection frame is arranged on the right side of the detection frame.

[0017] In the above technical scheme, the present invention provides a Micro LED mass transfer device. The transfer component provided by the present invention can peel off the chips carrying R-type, G-type and B-type base films one by one and adsorb and fix the chips, so that the chips can be accurately arranged in RGB, and the chips can be inspected during the transfer process to avoid damage to the transferred chips. At the same time, after the transfer is completed, the chips can be quickly detached and released by changing the electrode polarity, which is conducive to the accurate arrangement of the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Figure 1 It is a three-dimensional structural schematic diagram of this application.

[0020] Figure 2 It is a schematic diagram of the partial cutaway structure of the present application.

[0021] Figure 3 It is a schematic diagram of the three-dimensional cross-section structure of this application.

[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of this application.

[0023] Figure 5 It is a three-dimensional structural schematic diagram of the transfer component of this application.

[0024] Figure 6 It is a schematic diagram of the three-dimensional cross-section structure of the transfer component of the present application.

[0025] Figure 7 It is a schematic diagram of the cross-sectional structure of the transfer component of the present application.

[0026] Figure 8 It is a schematic diagram of the cross-sectional structure of the transfer unit of the present application.

[0027] Fig. 9 It is a schematic diagram of the cross-sectional structure of the adsorption component of the present application.

[0028] Fig.10 It is a schematic diagram of the cross-sectional structure of the guide frame of the present application.

[0029] Fig.11 It is a schematic diagram of the chip transfer working status of this application.

[0030] Explanation of the reference numerals: 1. Support frame; 11. Lower substrate; 2. Feeding assembly; 21. Conveying roller; 22. Guide roller; 23. Winding roller; 3. Transfer assembly; 31. Fixed cylinder; 32. Rotating shaft; 33. Rotating roller; 34. Connecting bracket; 35. Transfer unit; 351. Connecting frame; 352. Sliding plate; 353. Ejector rod; 354. Connecting spring; 355. Adsorbent; 3551. Connecting rod; 3552. Insulating seat; 3553. Outer electrode sheet; 3554. Inner electrode sheet; 3555. Conductive rod; 3556. Power connection frame; 36. Guide frame; 361. Material taking protrusion; 362. Ejection protrusion; 363. Retractable protrusion; 4. Detection assembly; 41. Detection frame; 42. Photo unit; 43. Collecting frame. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] See also Figure 1-11A Micro LED mass transfer device provided in an embodiment of the present invention includes a support frame 1, which is a stepped structure. The interior of the support frame 1 is a hollow structure, and a lower substrate 11 is arranged at the lower end of the interior of the support frame 1; and a feeding assembly 2, which is installed on the left side of the support frame 1, and the number of the feeding assemblies 2 is three groups, and the three groups of feeding assemblies 2 are respectively used to drive the base film carrying R-type, G-type and B-type chips to be transported and rolled up; a transfer assembly 3, which is installed on the right side of the support frame 1, and the transfer assembly 3 is used to peel off and adsorb the chips on the base film one by one and transfer and arrange the adsorbed chips on the lower substrate 11; a detection assembly 4, which is arranged on the outside of the transfer assembly 3, and the detection assembly 4 is installed on the support frame 1, and the detection assembly 4 is configured to detect and identify the chips adsorbed on the transfer assembly 3.

[0033] In the above technical scheme, the base films carrying R-type, G-type and B-type chips respectively are connected to three groups of feeding components 2 in sequence. The feeding component 2 drives the base film to move at a uniform speed. When the chip moves to the contact position with the transfer component 3, the transfer component 3 peels off the chip on the base film and adsorbs and fixes the chip. After that, the transfer component 3 drives the chip to move to the inside of the detection component 4. The detection component 4 can take pictures of the adsorbed chips, and then take pictures of damaged chips and empty chips, and upload the pictures to the computer for detection and identification, so as to facilitate the subsequent accurate welding processing of the chips. When the transfer component 3 drives the chips to move to the lower end, the chips are evenly arranged on the lower substrate 11 after being detached from the adsorption.

[0034] It should be noted that if the detection component 4 detects that the chips transferred from the same batch are damaged or have gaps, due to the small size of the Micro LED chips, it is difficult to replace or fill the gaps. Therefore, when it is detected that the chips are damaged or have gaps, all the chips transferred from the same batch are replaced to ensure that all the chips subsequently welded are intact.

[0035] See also Figure 4 As shown, as the preferred technical solution of this embodiment, the feeding assembly 2 includes a conveying roller 21, a guide roller 22 and a winding roller 23. The conveying roller 21 is installed on the left side of the support frame 1, and a guide roller 22 corresponding to the conveying roller 21 is installed inside the support frame 1. The guide roller 22 is flush with the upper end surface of the conveying roller 21, and a winding roller 23 is installed between the guide roller 22 and the conveying roller 21. The base film passes through the conveying roller 21 and the guide roller 22 in sequence and then is connected to the winding roller 23.

[0036] In the above technical scheme, the base films carrying R-type, G-type and B-type chips respectively are connected to the winding roller 23 after passing through the conveying roller 21 and the guide roller 22 in turn. When the chip moves to the right side of the guide roller 22, the transfer component 3 can accurately adsorb the chip so that the chip can be peeled off the base film, which is conducive to the adsorption and accurate positioning of the chips one by one.

[0037] Continue reading Figure 5-7 As shown, as the preferred technical solution of this embodiment, the transfer assembly 3 includes a fixed cylinder 31, a rotating shaft 32, a rotating roller 33, a connecting bracket 34, a transfer unit 35 and a guide frame 36. The support frame 1 is symmetrically provided with a fixed cylinder 31 inside, and the fixed cylinder 31 is installed on the side wall of the support frame 1. A rotating shaft 32 is arranged through the fixed cylinder 31, and the rotating shaft 32 is installed on the support frame 1 through a bearing. A rotating roller 33 is arranged on the outside of the fixed cylinder 31, and the middle part of the rotating shaft 32 is connected to the rotating roller 33 through a connecting bracket 34. The connecting bracket 34 is located in the gap between the two fixed cylinders 31, and rectangular grooves are evenly arranged on the outside of the rotating roller 33, and the transfer unit 35 is installed in the rectangular groove. Guide frames 36 are evenly installed on the outer surface of the fixed cylinder 31, and the guide frames 36 cooperate with the transfer unit 35.

[0038] In the above technical solution, the rotating shaft 32 is connected to the output shaft of the motor. The rotating shaft 32 drives the rotating roller 33 to rotate at a uniform speed through the connecting bracket 34. The rotating roller 33 rotates clockwise. When the transfer unit 35 on the rotating roller 33 rotates to the position corresponding to the guide roller 22, the guide frame 36 drives the transfer unit 35 to adsorb and peel off the chip on the base film, thereby realizing the function of adsorbing and fixing the chips one by one.

[0039] Continue reading Figure 8 As shown, as a preferred technical solution of this embodiment, the transfer unit 35 includes a connecting frame 351, a sliding plate 352, a push rod 353, a connecting spring 354 and an adsorption member 355, the connecting frame 351 is installed in the rectangular groove, three groups of sliding grooves opened along the length direction of the connecting frame 351 are arranged on the inner side of the connecting frame 351, the sliding plate 352 is slidably arranged in the sliding groove, a plurality of groups of through holes are evenly arranged on the rotating roller 33, each group of through holes is staggered, a push rod 353 is slidably arranged in the through hole, the outer side of the push rod 353 is connected to the sliding plate 352, the inner side of the push rod 353 is a smooth arc structure, the inner side of the push rod 353 cooperates with the guide frame 36, a connecting spring 354 is arranged on the push rod 353, the outer side of the connecting frame 351 is evenly arranged with installation grooves, the adsorption member 355 is installed in the installation groove, and the inner side of the adsorption member 355 is installed on the sliding plate 352.

[0040] In the above technical solution, when the rotating roller 33 drives the connecting frame 351 to rotate to the position corresponding to the guide roller 22, the guide frame 36 drives the adsorption component 355 to move outward through the top rod 353, so that the adsorption component 355 can be aligned with the chip on the base film and adsorb the chip, so that the chip can be accurately peeled off from the base film. When the adsorption component 355 moves to the lower end of the rotating roller 33 after taking the material, the guide frame 36 drives the adsorption component 355 to move outward, and the adsorption component 355 stops adsorbing the chip, so that the chip can be accurately transferred to the lower substrate 11.

[0041] See also Fig.11 As shown, during the material taking process, the adsorbents 355 in the three groups of chutes are pushed out one by one, that is, when the adsorbents 355 gradually rotate with the rotating roller 33, the adsorbents 355 in the outermost chutes on the connecting frame 351 are pushed out first, so that the adsorbents 355 contact, adsorb and reset the base film carrying the R-type chip, and then the adsorbents 355 in the middle chutes of the connecting frame 351 are pushed out again, so that the adsorbents 355 contact, adsorb and reset the base film carrying the G-type chip. Attach and reset, finally, the adsorption piece 355 inside the innermost slide groove on the connecting frame 351 is pushed outward, so that the adsorption piece 355 contacts, adsorbs and resets the base film carrying the B-type chip, so that the three-color RGB chips are arranged in sequence on the outer side of the same connecting frame 351; when in the discharge process, the adsorption pieces 355 inside the three groups of slide grooves are ejected at the same time, so that the three-color RGB chips can be transferred to the lower substrate 11 at the same time, and the spacing between the three-color RGB chips remains consistent, realizing the RGB arrangement of the chips.

[0042] See also Fig. 9 As shown, as a preferred technical solution of this embodiment, the adsorption member 355 includes a connecting rod 3551, an insulating seat 3552, an outer electrode sheet 3553, an inner electrode sheet 3554, a conductive rod 3555 and a power connection frame 3556, the connecting rod 3551 is installed in the installation groove, the insulating seat 3552 is installed at the end of the connecting rod 3551, the outer electrode sheet 3553 is installed on the outer side of the insulating seat 3552, the inner electrode sheet 3554 is installed on the inner side of the insulating seat 3552, the conductive rods 3555 are symmetrically installed on the insulating seat 3552, the two conductive rods 3555 are symmetrical about the axis center of the insulating seat 3552, and the two conductive rods 3555 are electrically connected to the outer electrode sheet 3553 and the inner electrode sheet 3554 respectively, the power connection frame 3556 is installed on the side wall of the installation groove, and the end of the conductive rod 3555 is slidably connected to the power connection frame 3556.

[0043] In the above technical solution, a flexible protective layer is provided on the outside of the outer electrode sheet 3553. When the chip on the base film is taken, the conductive rod 3555 slides on the inside of the power receiving frame 3556, that is, the guide frame 36 drives the connecting rod 3551 to move outward for a distance through the top rod 353. At this time, the conductive rod 3555 drives the outer electrode sheet 3553 to connect with the positive pole of the power supply, and the conductive rod 3555 drives the inner electrode sheet 3554 to connect with the negative pole of the power supply, so that the outer electrode sheet 3553 has a positive charge and the inner electrode sheet 3554 has a negative charge. Thus, electrostatic force is generated. When the outer electrode sheet 3553 contacts the chip, the chip is adsorbed on the end of the outer electrode sheet 3553 by electrostatic adsorption, and the flexible protective layer plays a role of buffering and protection.

[0044] When the adsorbed chip needs to be transferred to the lower substrate 11, at this time, the conductive rod 3555 slides on the outside of the power receiving frame 3556, that is, the guide frame 36 drives the connecting rod 3551 to move outward to the farthest end through the top rod 353, and the conductive rod 3555 drives the outer electrode sheet 3553 to connect with the negative pole of the power supply, and the conductive rod 3555 drives the inner electrode sheet 3554 to connect with the positive pole of the power supply, so that the outer electrode sheet 3553 has a negative charge and the inner electrode sheet 3554 has a positive charge. The function of accurate chip transfer can be achieved by switching the polarity of the electrodes.

[0045] See also Fig. 9 As shown, as a preferred technical solution of this embodiment, two groups of power connection plates are arranged on the inner side of the power connection frame 3556, and the length of the outer power connection plate is smaller than that of the inner power connection plate. The two groups of power connection plates are electrically connected to the power supply respectively, and the electrical properties of the two groups of power connection plates located on the same side are opposite.

[0046] In the above technical solution, when the chip is being taken out, the conductive rod 3555 contacts the contact piece on the inner side of the power connection rack 3556. When the chip is being unloaded, the conductive rod 3555 contacts the contact piece on the outer side of the power connection rack 3556, thereby realizing the switching of the electrode polarity, facilitating the electrostatic adsorption of the chip and accurate separation and transfer.

[0047] See also Fig.10 As shown, as the preferred technical solution of this embodiment, the guide frame 36 is annular in structure, annular grooves are evenly arranged on the guide frame 36, the ejector rod 353 inside each group of through holes is slidably matched with an annular groove, and a material taking protrusion 361, an ejection protrusion 362 and a retractable protrusion 363 are arranged in the annular groove, and the ejection protrusion 362 is arranged at the lower end of the annular groove.

[0048] In the above technical solution, the inner side of the push rod 353 is slidably arranged inside the annular groove. When the push rod 353 picks up the chip, the push rod 353 first contacts the picking protrusion 361, and the picking protrusion 361 drives the adsorption part 355 to move outward through the push rod 353, so that the adsorption part 355 can accurately adsorb and fix the chip. When the rod 353 releases the chip, the push rod 353 contacts the ejection protrusion 362, and the picking protrusion 361 drives the adsorption part 355 to move outward through the push rod 353, and the adsorption part 355 accurately transfers and arranges the chip on the lower substrate 11.

[0049] It should be noted that when the push rod 353 contacts the material taking protrusion 361, the push rod 353 drives the connecting rod 3551 to move outward. At this time, the conductive rod 3555 contacts the power connection piece on the inner side of the power connection frame 3556. When the push rod 353 contacts the ejection protrusion 362, at this time, the conductive rod 3555 contacts the power connection piece on the outer side of the power connection frame 3556, that is, the movement stroke of the push rod 353 on the ejection protrusion 362 is greater than the stroke of the push rod 353 on the material taking protrusion 361. By accurately switching the electrode polarity during the chip taking and placing process, the function of accurately transferring the chip can be achieved.

[0050] It should also be noted that, after the adsorbed chip is detected and identified, if the chip is damaged or vacant, the retractable protrusion 363 will contact the ejector pin 353 to remove the damaged chip.

[0051] See also Fig.10 As shown, as the preferred technical solution of this embodiment, the material picking protrusion 361 is arranged on the left side of the annular groove, and the material picking protrusion 361 inside each annular groove on the guide frame 36 is staggered. The material picking protrusion 361 is used to drive the adsorption part 355 to adsorb the chips carrying the R-type, G-type and B-type base films one by one.

[0052] In the above technical solution, since the three-color RGB chips are arranged on different base films, when the chips need to be arranged according to RGB, the chips on different base films need to be sucked one by one first. Therefore, the material picking protrusions 361 need to be staggered so that the material picking protrusions 361 can lift the adsorption parts 355 one by one, so that the adsorption parts 355 can adsorb the chips on the R-type, G-type and B-type base films one by one. After the chips are adsorbed, the chips can be installed on the rotating roller 33 for RGB arrangement.

[0053] See also Fig.10 As shown, as a preferred technical solution of this embodiment, the retractable protrusion 363 is arranged on the right side inside the annular groove, and an adjustable airbag is arranged inside the retractable protrusion 363.

[0054] In the above technical solution, when the detection component 4 detects the chip that has been adsorbed and transferred, if the detection component 4 detects that the chip is broken or vacant, at this time, gas is injected into the adjustable airbag, and the retractable protrusion 363 can contact the inner side of the push rod 353. When the damaged or vacant chip moves to the position corresponding to the retractable protrusion 363, the retractable protrusion 363 pushes out the adsorption part 355 through the push rod 353, so that the damaged chip is ejected.

[0055] See also Figure 4 As shown, as a preferred technical solution of this embodiment, the detection component 4 includes a detection frame 41, a photographing unit 42 and a collection frame 43. The detection frame 41 is installed on the support frame 1. The detection frame 41 is symmetrically provided with grooves, and an identification unit 42 is installed in the groove. The identification unit 42 is used to take pictures of the chip after absorption. A detachable collection frame 43 is arranged on the right side of the detection frame 41.

[0056] In the above technical solution, when the chip rotates to the inner side of the detection rack 41, the photographing unit 42 can take a picture of the chip and upload the photographed picture to the computer for detection and identification. If the chip is damaged or missing, when the chip moves to the position corresponding to the retractable protrusion 363, the retractable protrusion 363 drives the chip to be ejected outward through the ejector rod 353, so that the chip can fall completely on the collection rack 43.

[0057] It should be noted that the chips inside the collection rack 43 are not completely damaged, and therefore the chips inside the collection rack 43 can be reused.

[0058] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A Micro LED mass transfer device, It is characterized in that include: The support frame (1) has a stepped structure, the interior of the support frame (1) is a hollow structure, and a lower base plate (11) is arranged at the lower end of the interior of the support frame (1); as well as A feeding assembly (2) is installed on the left side of the support frame (1). The number of the feeding assemblies (2) is three. The three feeding assemblies (2) are respectively used to drive the base film carrying the R-type, G-type and B-type chips to be transported and rolled; A transfer assembly (3) is installed on the right side of the support frame (1), and the transfer assembly (3) is used to peel off and adsorb the chips on the base film one by one and transfer and arrange the adsorbed chips on the lower substrate (11); The detection component (4) is arranged outside the transfer component (3). The detection component (4) is installed on the support frame (1). The detection component (4) is configured to detect and identify the chip adsorbed on the transfer component (3).

2. The Micro LED mass transfer device according to claim 1, Features: The feeding assembly (2) comprises a conveying roller (21), a guide roller (22) and a winding roller (23); the conveying roller (21) is installed on the left side of the support frame (1); a guide roller (22) corresponding to the conveying roller (21) is installed inside the support frame (1); the guide roller (22) is flush with the upper end surface of the conveying roller (21); a winding roller (23) is installed between the guide roller (22) and the conveying roller (21); the base film passes through the conveying roller (21) and the guide roller (22) in sequence and then is connected to the winding roller (23).

3. The Micro LED mass transfer device according to claim 2, Features: The transfer assembly (3) comprises a fixed cylinder (31), a rotating shaft (32), a rotating roller (33), a connecting bracket (34), a transfer unit (35) and a guide frame (36). The support frame (1) is symmetrically provided with a fixed cylinder (31), the fixed cylinder (31) is mounted on the side wall of the support frame (1), a rotating shaft (32) is arranged through the fixed cylinder (31), the rotating shaft (32) is mounted on the support frame (1) through a bearing, a rotating roller (33) is arranged on the outside of the fixed cylinder (31), the middle part of the rotating shaft (32) is connected to the rotating roller (33) through a connecting bracket (34), the connecting bracket (34) is located in the gap between the two fixed cylinders (31), rectangular grooves are evenly arranged on the outside of the rotating roller (33), the transfer unit (35) is installed in the rectangular groove, and a guide frame (36) is evenly installed on the outer surface of the fixed cylinder (31), and the guide frame (36) cooperates with the transfer unit (35).

4. The Micro LED mass transfer device according to claim 3, Features: The transfer unit (35) comprises a connecting frame (351), a sliding plate (352), a push rod (353), a connecting spring (354) and an adsorption member (355). The connecting frame (351) is installed in the rectangular groove. The inner side of the connecting frame (351) is provided with three groups of slide grooves opened along the length direction of the connecting frame (351). The sliding plate (352) is slidably arranged in the slide groove. A plurality of groups of through holes are evenly arranged on the rotating roller (33), and each group of through holes is staggered. A push rod (353) is slidably arranged in the through hole, the outer side of the push rod (353) is connected to the sliding plate (352), the inner side of the push rod (353) is a smooth arc structure, the inner side of the push rod (353) is matched with the guide frame (36), a connecting spring (354) is arranged on the push rod (353), and mounting grooves are evenly arranged on the outer side of the connecting frame (351), an adsorption member (355) is installed in the mounting groove, and the inner side of the adsorption member (355) is installed on the sliding plate (352).

5. The Micro LED mass transfer device according to claim 4, Features: The adsorption member (355) comprises a connecting rod (3551), an insulating seat (3552), an outer electrode sheet (3553), an inner electrode sheet (3554), a conductive rod (3555) and a power connection frame (3556); the connecting rod (3551) is installed in the installation groove, the insulating seat (3552) is installed at the end of the connecting rod (3551), the outer electrode sheet (3553) is installed on the outer side of the insulating seat (3552), and the inner electrode sheet (3554) is installed on the inner side of the insulating seat (3552). The electrode sheet (3554) is provided with a conductive rod (3555) symmetrically mounted on the insulating seat (3552), the two conductive rods (3555) are symmetrical about the axis center of the insulating seat (3552), and the two conductive rods (3555) are electrically connected to the outer electrode sheet (3553) and the inner electrode sheet (3554) respectively, and a power connection frame (3556) is mounted on the side wall of the mounting groove, and the ends of the conductive rods (3555) are slidably connected to the power connection frame (3556).

6. The Micro LED mass transfer device according to claim 5, Features: Two groups of power connection plates are arranged inside the power connection frame (3556), and the length of the outer power connection plate is smaller than that of the inner power connection plate. The two groups of power connection plates are electrically connected to the power supply respectively.

7. The Micro LED mass transfer device according to claim 6, Features: The guide frame (36) is an annular structure, and annular grooves are evenly arranged on the guide frame (36). The ejector rod (353) inside each group of through holes is slidably matched with an annular groove. A material taking protrusion (361), an ejection protrusion (362) and a retractable protrusion (363) are arranged in the annular groove, and the ejection protrusion (362) is arranged at the lower end of the annular groove.

8. The Micro LED mass transfer device according to claim 7, Features: The material picking protrusion (361) is arranged on the left side of the annular groove, and the material picking protrusion (361) inside each annular groove on the guide frame (36) is staggered. The material picking protrusion (361) is used to drive the adsorption component (355) to adsorb the chips carried on the R-type, G-type and B-type base films one by one.

9. The Micro LED mass transfer device according to claim 8, Features: The retractable protrusion (363) is arranged on the right side inside the annular groove, and an adjustable air bag is arranged inside the retractable protrusion (363).

10. The Micro LED mass transfer device according to claim 9, Features: The detection assembly (4) comprises a detection frame (41), a photographing unit (42) and a collection frame (43); the detection frame (41) is mounted on the support frame (1); grooves are symmetrically arranged on the detection frame (41); an identification unit (42) is installed in the groove; the identification unit (42) is used to take a photograph of the chip after absorption; a detachable collection frame (43) is arranged on the right side of the detection frame (41).

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