Ultra-wideband multi-channel space power combiner
By using wedge-shaped pallets and balanced fin-line structures in multiple space power synthesizers, combined with trapezoidal matching and fold-line impedance converters, the problem that power synthesizers in the prior art is difficult to take into account high linearity, broadband and miniaturization. It achieves high efficiency, low reflection coefficient and good heat dissipation effects.
Patent Information
- Application Number
- CN202411574317.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2024-12-17
AI Technical Summary
The existing multi-channel power synthesizers are difficult to take into account high linearity, ultra-wideband, miniaturization and good heat dissipation while having high power and high efficiency. They have large structural sizes and poor heat dissipation, and have high assembly accuracy requirements, which makes them easy to install. Deviation affects performance.
Multiple wedge trays are used to form an extra-large coaxial medium transmission line. Each wedge tray has a balanced fin line that couples microwave energy from the coaxial medium, and uses the amplitude and phase consistency of the coaxial medium transmission line to ensure high efficiency and High linearity, energy is coupled to solid-state power amplifiers through balanced fin structures, combined with trapezoidal matching structures and fold-line impedance converters, reducing reflection coefficients and increasing bandwidth.
A multi-channel space power synthesizer with low reflection coefficient, small size, and high broadband is realized, which improves the performance of the overall structure, reduces insertion loss, and enhances the heat dissipation performance.
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Figure CN119153919A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of microwave technology, and in particular to an ultra-wideband multi-path spatial power synthesizer. Background Art
[0002] RF power amplifiers are the core components of microwave circuits. With the continuous advancement of electronic technology, the demand for high power, high efficiency, and wide bandwidth is increasing. In addition, with the continuous development of system integration, the system has also put forward new requirements for the miniaturization and lightweight of each component. In high-power applications, traveling wave tubes have the characteristics of high power and ultra-wideband. However, the shortcomings of traveling wave tubes such as large size, heavy weight, nonlinearity, and vacuum conditions make them unable to meet the requirements of modern microwave circuits.
[0003] Solid-state power amplifier (SSPA) has the advantages of small size, low cost, and good stability. However, the output power of a single SSPA is limited. Therefore, people have proposed power synthesis schemes such as die power synthesis, circuit power synthesis, space power synthesis, and hybrid power synthesis.
[0004] The space power synthesis structure uses the principle of in-phase coherence in space to achieve the purpose of power synthesis. The typical space power synthesis technology replaces the power distribution / synthesis network with space electromagnetic waves to form a high-power output.
[0005] In the prior art, there is a multi-channel spatial power combiner designed using coaxial waveguides, which has high power and high efficiency in the frequency range of 6-18GHz, and the insertion loss of the entire synthesis network is small. However, the size of the entire structure is large, the heat dissipation is poor, and the assembly accuracy requirements are high. Once a deviation occurs during the installation process, the final performance will be greatly affected. Summary of the invention
[0006] The purpose of the present invention is to provide an ultra-wideband multi-channel spatial power synthesizer, which can achieve high power and high efficiency while taking into account the advantages of high linearity, ultra-wideband, miniaturization and good heat dissipation.
[0007] To achieve the above object, the present invention provides the following technical solutions:
[0008] An ultra-wideband multi-channel spatial power synthesizer comprises: an input extended coaxial structure, an output extended coaxial structure, a connecting shaft, a wedge-shaped tray, a balanced fin line PCB and a feed PCB, wherein two ends of the connecting shaft are respectively connected to the input extended coaxial structure and the output extended coaxial structure, a plurality of wedge-shaped trays are distributed along a circumferential direction and are sequentially connected to form a coaxial medium transmission line, two ends of the plurality of wedge-shaped trays are respectively connected to the input extended coaxial structure and the output extended coaxial structure, a receiving groove is provided on one side of each wedge-shaped tray, the receiving groove is used to place the balanced fin line PCB and the feed PCB, two ends of the balanced fin line PCB are respectively provided with a trapezoidal matching structure, a tapered coupling groove, a slot line microstrip coupler and an impedance transformer are symmetrically provided on the balanced fin line PCB, the tapered coupling groove, the slot line microstrip coupler and the impedance transformer are mutually connected to form a section of balanced fin line, the impedance transformer is a fold line impedance transformer, two sections of the balanced fin line are connected by a microstrip, and a solid-state power amplifier is placed on the microstrip.
[0009] In some embodiments, a gap is left between the balanced fin line PCB and the accommodating groove, and both ends of each wedge-shaped tray are provided with U-shaped grooves with notches facing away from each other, and a plurality of metal columns are provided on the accommodating groove and on both sides of the notch of the U-shaped groove.
[0010] In some embodiments, the input extended coaxial structure comprises: an input extended coaxial structure outer conductor and an input extended coaxial structure inner conductor, one end of the input extended coaxial structure inner conductor is provided with an SMA connecting shaft, and the other end is provided with an input end inner connecting hole and an input end positioning ring, one end of the connecting shaft is connected to the input end inner connecting hole, one end of each of the wedge-shaped trays is provided with an input end arc groove, and each of the input end arc grooves constitutes an input end positioning groove that cooperates with the input end positioning ring, one end of the input extended coaxial structure outer conductor is provided with an SMA connecting hole, and the other end is provided with an input end outer connecting hole and an input end outer positioning hole, one end of each of the wedge-shaped trays is provided with a wedge-shaped tray input end connecting hole corresponding to the input end outer connecting hole, and is also provided with a wedge-shaped tray input end positioning pin that cooperates with the input end outer positioning hole;
[0011] The output extended coaxial structure includes: an output extended coaxial structure outer conductor and an output extended coaxial structure inner conductor, one end of the output extended coaxial structure inner conductor is provided with an N type connecting shaft, and the other end is provided with an output end inner connecting hole and an output end positioning ring, the other end of the connecting shaft is connected to the output end inner connecting hole, the other end of each wedge-shaped tray is provided with an output end arc groove, and each output end arc groove constitutes an output end positioning groove that cooperates with the output end positioning ring, one end of the output extended coaxial structure outer conductor is provided with an N type connecting hole, and the other end is provided with an output end outer connecting hole and an output end outer positioning hole, the other end of each wedge-shaped tray is provided with a wedge-shaped tray output end connecting hole corresponding to the output end outer connecting hole, and is also provided with a wedge-shaped tray output end positioning pin that cooperates with the output end outer positioning hole.
[0012] In some embodiments, a gap is left between the outer conductor of the input extended coaxial structure and the inner conductor of the input extended coaxial structure, a gap is left between the outer conductor of the output extended coaxial structure and the inner conductor of the output extended coaxial structure, the inner diameters of the tapered inner holes of the outer conductor of the input extended coaxial structure and the outer conductor of the output extended coaxial structure are both linearly gradient, and the outer diameters of the tapered structures of the inner conductor of the input extended coaxial structure and the inner conductor of the output extended coaxial structure are both Klopfenstein tapered linear gradient.
[0013] In some embodiments, a balanced fin line PCB connection hole and a feeding PCB connection hole are provided on the accommodating groove, and a balanced fin line PCB positioning column is also provided on the accommodating groove.
[0014] In some embodiments, a PA cavity and a feed PCB cavity are provided on the other side of each of the wedge-shaped trays away from the accommodating groove, and the feed PCB cavity on one of the two adjacent wedge-shaped trays corresponds to a position for placing the feed PCB on the accommodating groove on the other wedge-shaped tray.
[0015] In some embodiments, one end of the feeding PCB cavity is connected to the PA cavity, and the other end is exposed from the arc-shaped outer wall of the wedge-shaped tray, and one end of the accommodating groove is also exposed from the arc-shaped outer wall of the wedge-shaped tray.
[0016] In some embodiments, each of the wedge-shaped trays is provided with at least one wedge-shaped tray positioning pin hole on one side and at least one wedge-shaped tray positioning pin on the other side, and two adjacent wedge-shaped trays are connected by the wedge-shaped tray positioning pin holes and the wedge-shaped tray positioning pins that match one by one.
[0017] In some embodiments, the balanced fin line PCB is provided with a wedge tray positioning through hole, a first metal through hole and a wedge tray connecting through hole, the wedge tray positioning through hole is used to avoid the wedge tray positioning pin, the first metal through hole is provided to avoid the metal column, and the wedge tray connecting through hole is used to avoid the connecting piece connecting adjacent wedge trays; the balanced fin line PCB is also provided with a balanced fin line PCB connecting through hole and a balanced fin line PCB positioning through hole.
[0018] In some embodiments, the ultra-wideband multi-channel spatial power synthesizer also includes a pressure block structure, the pressure block structure includes an upper pressure block and a lower pressure block, the lower surface of the upper pressure block is formed with a lower arc-shaped groove, the upper surface of the lower pressure block is formed with an upper arc-shaped groove, the upper pressure block and the lower pressure block are clamped to each of the wedge-shaped trays through the lower arc-shaped groove and the upper arc-shaped groove, and the upper pressure block and the lower pressure block are detachably connected by fasteners.
[0019] An ultra-wideband multi-channel spatial power synthesizer comprises: an input extended coaxial structure, an output extended coaxial structure, a connecting shaft, a wedge-shaped tray, a balanced fin line PCB and a feed PCB, wherein two ends of the connecting shaft are respectively connected to the input extended coaxial structure and the output extended coaxial structure;
[0020] The wedge-shaped tray includes a wedge-shaped tray A and a wedge-shaped tray B. There are multiple wedge-shaped trays. The multiple wedge-shaped trays A and the multiple wedge-shaped trays B are distributed along the circumferential direction and are alternately connected in sequence to form a coaxial medium transmission line. The two ends of the multiple wedge-shaped trays A and the multiple wedge-shaped trays B are respectively connected to the input extended coaxial structure and the output extended coaxial structure. The balanced fin line PCB and the feed PCB are arranged between the wedge-shaped tray A and the wedge-shaped tray B.
[0021] Compared with the prior art, the above technical solution has at least the following advantages:
[0022] The present invention provides an ultra-wideband multi-channel spatial power synthesizer, which uses a plurality of wedge-shaped trays to form an ultra-large coaxial dielectric transmission line, each wedge-shaped tray is provided with a balanced fin line to couple the microwave energy from the coaxial dielectric, and utilizes the amplitude consistency and phase consistency of the microwave energy in the coaxial dielectric transmission line to ensure high efficiency and high linearity of the synthesis, and utilizes the balanced fin line structure to couple the energy in the coaxial dielectric transmission line to the SSPA, which has the advantages of low reflection coefficient, small size and high bandwidth. Moreover, the two ends of the balanced fin line PCB are respectively provided with a trapezoidal matching structure, and the reflection coefficient of the synthesizer at 10-18GHz can be reduced through the trapezoidal matching structure, thereby improving the bandwidth of the entire structure. In addition, through the zigzag impedance transformer, it is possible to achieve performance comparable to that of the impedance transformer based on the cosine square function, and has the advantages of a small reflection coefficient and a large bandwidth. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0024] Figure 1 An exploded diagram of an ultra-wideband multi-channel spatial power combiner provided by the present invention;
[0025] Figure 2 A front view of an ultra-wideband multi-channel spatial power synthesizer provided by the present invention;
[0026] Figure 3 A right view of an ultra-wideband multi-channel spatial power synthesizer provided by the present invention;
[0027] Figure 4 It is the internal connection relationship diagram of the space power synthesizer;
[0028] Figure 5 This is a schematic diagram of the input extension coaxial structure of the present invention;
[0029] Figure 6 This is a schematic diagram of the output extension coaxial structure of the present invention;
[0030] Figure 7 It is a front structural schematic diagram of a wedge-shaped tray A;
[0031] Figure 8 It is a schematic diagram of the back structure of the wedge-shaped tray A;
[0032] Fig. 9 It is a front structural schematic diagram of a wedge-shaped tray B;
[0033] Fig.10 It is a schematic diagram of the back structure of the wedge-shaped tray B;
[0034] Fig.11 It is a schematic diagram of the design process of the impedance converter in the present invention;
[0035] Fig.12 It is a structural schematic diagram of a balanced fin line PCB A;
[0036] Fig.13 It is a structural schematic diagram of a balanced fin line PCB B;
[0037] Fig.14 It is a schematic diagram of the matching structure of the wedge-shaped tray A, the balanced fin line PCB A and the feed PCB;
[0038] Fig.15 It is a schematic diagram of the matching structure of the wedge-shaped tray B, the balanced fin line PCB B and the feed PCB;
[0039] Fig.16 A single-path impedance transformation link diagram provided in one embodiment of the present invention;
[0040] Fig.17 A comparison diagram of simulation results of different impedance converter structures in the present invention;
[0041] Fig.18 It is a comparison curve of the simulation results of the trapezoidal matching structure in the balanced fin-line PCB structure;
[0042] Fig.19 It is a simulation comparison curve of the gap size between the balanced fin line PCB structure and the wedge-shaped tray;
[0043] Fig. 20 The comparison curve diagram of the simulation results of the periodically arranged metal columns on the wedge-shaped tray;
[0044] Fig.21 This is the final frequency response curve of the spatial power combiner proposed in the present invention.
[0045] The reference numerals are as follows:
[0046] Input extended coaxial structure 1, output extended coaxial structure 2, connecting shaft 3, wedge tray 4, wedge tray 4A, wedge tray 4B, balanced fin line PCB 5, feed PCB 6, pressing block structure 7;
[0047] Input extended coaxial structure outer conductor 8, input extended coaxial structure inner conductor 9, SMA connecting shaft 10, input end inner connecting hole 11, input end positioning ring 12, SMA connecting hole 13, input end outer connecting hole 14, input end outer positioning hole 15;
[0048] Output extended coaxial structure outer conductor 16, output extended coaxial structure inner conductor 17, N Type connecting shaft 18, output end inner connecting hole 19, output end positioning ring 20, N Type connecting hole 21, output end outer connecting hole 22, output end outer positioning hole 23;
[0049] Press block connection hole 24, PA cavity 25, feed PCB cavity 26, arc groove 27, wedge tray input end positioning pin 28, wedge tray input end connection hole 29, wedge tray connection hole A30, wedge tray positioning pin hole 31, wedge tray positioning pin 32, balanced fin line PCB connection hole 33, feed PCB connection hole 34, balanced fin line PCB positioning column 35, metal column 36, wedge tray connection hole B37, trapezoidal matching structure 38, tapered coupling groove 39, slot line microstrip coupler 40, impedance transformer 41, wedge tray connection through hole A42, wedge tray positioning through hole 43, balanced fin line PCB connection through hole 44, balanced fin line PCB positioning through hole 45, first metal through hole 46, SSPA feed line 47, second metal through hole 48, wedge tray connection through hole B49. DETAILED DESCRIPTION
[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0051] An ultra-wideband multi-channel spatial power synthesizer provided in an embodiment of the present invention includes: an input extended coaxial structure 1, an output extended coaxial structure 2, a connecting shaft 3, a wedge-shaped tray 4, a balanced fin line PCB 5 and a feeding PCB 6, wherein two ends of the connecting shaft 3 are respectively connected to the input extended coaxial structure 1 and the output extended coaxial structure 2, a plurality of wedge-shaped trays 4 are distributed along a circumferential direction and are sequentially connected to form a coaxial medium transmission line, and two ends of the plurality of wedge-shaped trays 4 are respectively connected to the input extended coaxial structure 1 and the output extended coaxial structure 2.
[0052] For example Figure 1An ultra-wideband multi-channel spatial power synthesizer shown includes an input extended coaxial structure 1, an output extended coaxial structure 2, a connecting shaft 3, multiple wedge-shaped trays 4, multiple balanced fin line PCBs 5 and multiple feed PCBs 6 and a pressing block structure 7. The two ends of the connecting shaft 3 are respectively connected to the input extended coaxial structure 1 and the output extended coaxial structure 2. The multiple wedge-shaped trays 4 are distributed along the circumferential direction and connected in sequence to form a coaxial medium transmission line. The pressing block structure 7 is tightly embraced on the outer circumference of the multiple wedge-shaped trays 4. One end of the multiple wedge-shaped trays 4 is connected to the input extended coaxial structure 1 through a fastener, and the other end is connected to the output extended coaxial structure 2 through a fastener. The angle between the two side surfaces of each wedge-shaped tray 4 is the same. The coaxial dielectric transmission line includes multiple groups of wedge trays, each group of wedges includes a wedge tray A and a wedge tray B, and multiple wedge trays A and multiple wedge trays B are evenly distributed along the circumferential direction to form a cylindrical structure. The connecting shaft is located inside the cylindrical structure, and the pressure block structure is arranged on the outer circumference of the cylindrical structure. The adjacent wedge trays A and wedge trays B can be connected together by fasteners. A balanced fin line PCB5 and a feed PCB6 are respectively provided between the wedge tray A and the wedge tray B. For example, the coaxial dielectric transmission line includes eight groups of wedge trays 4, each group of wedges includes a wedge tray A and a wedge tray B, and the two ends of the multiple wedge trays 4 are respectively connected to the input extended coaxial structure 1 and the output extended coaxial structure 2.
[0053] In order to facilitate the installation of the balanced fin line PCB5 and the feed PCB6, a receiving groove is provided on one side of each wedge-shaped tray 4, and the receiving groove is used to place the balanced fin line PCB5 and the feed PCB6. Trapezoidal matching structures 38 are provided at both ends of the balanced fin line PCB5. The trapezoidal matching structure 38 can reduce the reflection coefficient of the synthesizer at 10-18GHz, thereby improving the bandwidth of the entire structure. The balanced fin line PCB5 is also symmetrically provided with a conical coupling groove 39, a slot line microstrip coupler 40 and an impedance transformer 41. The conical coupling groove 39, the slot line microstrip coupler 40 and the impedance transformer 41 are interconnected to form a section of balanced fin line. The balanced fin line is a type of Vivaldi antenna, wherein the impedance transformer 41 is a zigzag impedance transformer. Through the zigzag impedance transformer, performance comparable to that of an impedance transformer based on a cosine square function can be achieved, and the advantages of a small reflection coefficient and a large bandwidth can be achieved. The two sections of balanced fin lines are connected by a microstrip, and the microstrip is used to place a solid-state power amplifier, which is hereinafter referred to as SSPA. The present invention adopts a plurality of wedge-shaped trays 4 to form an ultra-large coaxial dielectric transmission line. Each wedge-shaped tray 4 is provided with a balanced fin line for coupling microwave energy from the coaxial dielectric. The amplitude consistency and phase consistency of the microwave energy in the coaxial dielectric transmission line are utilized to ensure high efficiency and high linearity of the synthesis. The energy in the coaxial dielectric transmission line is coupled to the SSPA using a balanced fin line structure. The invention has the advantages of low reflection coefficient, small size and high bandwidth.
[0054] In the specific working process, the input signal is transmitted from the input extended coaxial structure 1 and propagates in the TEM (Transverse Electric and Magnetic Field) mode. The signal is received by a specified number of balanced fin lines in the super-large coaxial dielectric transmission line. The received signal is fed into the SSPA, and after amplification, it is transmitted to the coaxial dielectric transmission line by the balanced fin line in the same way, and then propagated to the output in the TEM mode by the output extended coaxial structure 2. Since the coaxial dielectric transmission line of the present invention includes a plurality of wedge-shaped trays, and a balanced fin line PCB is provided between adjacent wedge-shaped trays, the input signal power can be evenly distributed to the plurality of balanced fin line PCBs, and each balanced fin line PCB structure has an SSPA, and each SSPA amplifies the distributed input signal power, and then outputs it after being synthesized at the output end to increase the output power.
[0055] In some embodiments, the input extension coaxial structure 1 and the output extension coaxial structure 2 are coaxial extenders with impedance conversion function. The input impedance of the input extension coaxial structure 1 is preferably 50Ω, and the output impedance is preferably 30Ω. Figure 5As shown, the input extended coaxial structure 1 includes: an input extended coaxial structure outer conductor 8 and an input extended coaxial structure inner conductor 9, one end of the input extended coaxial structure inner conductor 9 is provided with an SMA connecting shaft 10, and the other end is provided with an input end inner connecting hole 11 and an input end positioning ring, one end of the connecting shaft 3 is connected to the input end inner connecting hole 11, and the input end inner connecting hole 11 is preferably a threaded hole, and both ends of each wedge-shaped tray 4 are provided with an arc groove 27, one end of which is provided with an input end arc groove, and the other end is provided with an output end arc groove, and each input end arc groove constitutes an input end positioning groove that cooperates with the input end positioning ring, and one end of the input extended coaxial structure outer conductor 8 is provided with an SMA connecting hole 13, and the SMA connecting hole is preferably a threaded hole; as shown Figure 2 and Figure 5 As shown, the other end of the input extended coaxial structure outer conductor 8 is provided with an input end external connection hole 14 and an input end external positioning hole 15. The input end external connection hole 14 is preferably a threaded hole. One end of each wedge-shaped tray 4 is provided with a wedge-shaped tray input end connection hole 29 corresponding to the input end external connection hole 14. The wedge-shaped tray input end connection hole 29 is preferably a threaded hole. The wedge-shaped tray 4 can be threadedly connected to the input extended coaxial structure outer conductor 8. One end of each wedge-shaped tray 4 is also provided with a wedge-shaped tray input end positioning pin 28 that cooperates with the input end external positioning hole 15. Among them, the axes of the SMA connecting shaft 10 and the SMA connecting hole 13 are coaxial with the center line of the input extended coaxial structure 1, and are used to connect with the SMA connector; the axes of the input end inner connecting hole 11 and the input end positioning ring 12 are coaxial with the center line of the input extended coaxial structure 1, and the input end inner connecting hole 11 is used to connect with the connecting shaft 3; the input extended coaxial structure outer conductor 8 is provided with a plurality of input end outer connecting holes and input end outer positioning holes 15 uniformly distributed along the circumferential direction, and the axes of the plurality of input end outer connecting holes 14 and the plurality of input end outer positioning holes 15 distributed in the circumferential direction are coaxial with the center line of the input extended coaxial structure 1, and the input extended coaxial structure outer conductor 8 is connected to the extended coaxial medium transmission line composed of a plurality of wedge-shaped trays 4 distributed along the circumferential direction through the input end outer connecting holes and the input end outer positioning holes 15.
[0056] like Figure 6 As shown, the input impedance of the output extended coaxial structure 2 is preferably 30Ω, and it is connected to the extended coaxial medium transmission line composed of multiple wedge-shaped trays 4, and the output impedance is 50Ω. The output extended coaxial structure 2 is connected to the N-type connector, wherein the output extended coaxial structure 2 includes: an output extended coaxial structure outer conductor 16 and an output extended coaxial structure inner conductor 17, and one end of the output extended coaxial structure inner conductor 17 is provided with an N-type connecting shaft 18; Figure 4As shown, the other end of the inner conductor 17 of the output extended coaxial structure is provided with an output end inner connecting hole 19 and an output end positioning ring 20, the other end of the connecting shaft 3 is connected to the output end inner connecting hole 19, the output end inner connecting hole 19 is preferably a threaded hole, each output end arc groove constitutes an output end positioning groove that cooperates with the output end positioning ring 20, one end of the outer conductor 16 of the output extended coaxial structure is provided with an N Type connecting hole 21, the N Type connecting hole 21 is preferably a threaded hole, the axis of the N type connecting shaft 18 and the N Type connecting hole 21 is coaxial with the center line of the output extended coaxial structure 2, and is used to connect with an N type connector; as shown Figure 2 and Figure 6 As shown, the other end of the output extended coaxial structure outer conductor 16 is provided with an output end external connection hole 22 and an output end external positioning hole 23, and the other end of each wedge-shaped tray 4 is provided with a wedge-shaped tray output end connection hole corresponding to the output end external connection hole 22, and the output end external connection hole 22 and the wedge-shaped tray output end connection hole are preferably threaded holes, and the other end of each wedge-shaped tray 4 is also provided with a wedge-shaped tray output end positioning pin that cooperates with the output end external positioning hole 23.
[0057] In some embodiments, Figure 2 , Figure 5 and Figure 6 As shown, the inner conductor outer diameter and the outer conductor inner diameter of the input extended coaxial structure 1 and the output extended coaxial structure 2 are designed using the small reflection theory. A gap is left between the input extended coaxial structure outer conductor 8 and the input extended coaxial structure inner conductor 9, and a gap is left between the output extended coaxial structure outer conductor 16 and the output extended coaxial structure inner conductor 17. For ease of manufacturing, the inner diameters of the tapered inner holes of the input extended coaxial structure outer conductor 8 and the output extended coaxial structure outer conductor 16 are linearly gradient, and the outer diameters of the tapered structures of the input extended coaxial structure inner conductor 9 and the output extended coaxial structure inner conductor 17 are Klopfenstein tapered linear gradient, so that the entire structure has a smaller size on the basis of a low reflection coefficient.
[0058] In some embodiments, in order to facilitate the combination of the wedge-shaped trays 4, at least one wedge-shaped tray positioning pin hole 31 is provided on one side of each wedge-shaped tray 4, and at least one wedge-shaped tray positioning pin 32 is provided on the other side, and two adjacent wedge-shaped trays 4 are connected through the wedge-shaped tray positioning pin holes 31 and the wedge-shaped tray positioning pins 32 that match one by one. Figure 7 As shown, the wedge-shaped tray 4A is provided with a plurality of wedge-shaped tray connection holes A30 penetrating the wedge-shaped tray 4A, and the front side of the wedge-shaped tray 4A is provided with a plurality of wedge-shaped tray positioning pin holes 31; Figure 8 As shown, the reverse side of the wedge-shaped tray 4A is provided with a plurality of wedge-shaped tray positioning pins 32; Fig. 9 and Fig.10As shown, the front side of the wedge-shaped tray 4B is provided with a plurality of wedge-shaped tray connecting holes B37 penetrating the wedge-shaped tray 4B, the wedge-shaped tray connecting holes A30 and the wedge-shaped tray connecting holes B37 are staggered and preferably countersunk holes, wherein the wedge-shaped tray 4B is provided with a fastening hole A corresponding to the wedge-shaped tray connecting hole A30, and similarly the wedge-shaped tray 4A is provided with a fastening hole B corresponding to the wedge-shaped tray connecting hole B37. When connecting, the wedge-shaped tray 4A, the wedge-shaped tray 4B and the wedge-shaped tray 4A are taken as examples for explanation, wherein one of the wedge-shaped trays 4A is connected to the wedge-shaped tray connecting hole A30 and the fastening hole A on the wedge-shaped tray 4B by screws, and the other wedge-shaped tray 4A is connected to the fastening hole B and the wedge-shaped tray connecting hole B37 on the wedge-shaped tray 4B by another screw, thereby realizing the connection between the three.
[0059] In some embodiments, the design of the impedance transformer will affect the size and performance of the power combiner, such as Fig.11 As shown, the present invention compares the traditional impedance converter and the impedance converter based on the cosine square function, combines the advantages of both, and proposes a simplified zigzag impedance converter on this basis.
[0060] In some embodiments, in order to achieve the coordination between the wedge-shaped tray 4 structure and the balanced fin line PCB 5, the balanced fin line PCB 5 is also set in pairs, divided into a balanced fin line PCB 5A and a balanced fin line PCB 5B. Figure 12-Figure 15 As shown, the balanced fin line needs a dielectric substrate as support. In order to reduce the length of the balanced fin line, the present invention adopts a dielectric substrate with a high dielectric constant. However, the introduction of the dielectric substrate changes the internal impedance of the extended coaxial dielectric transmission line, and brings impedance discontinuity between the output impedance of the input extended coaxial structure 1 and the impedance of the tapered coupling slot 39, and between the input impedance of the output extended coaxial structure 2 and the impedance of the tapered coupling slot 39. The present invention eliminates the impedance discontinuity by setting a trapezoidal matching structure 38 at both ends of the balanced fin line PCB5. The tapered coupling slot 39 will receive the signal in the coaxial dielectric transmission line or transmit the signal amplified by the SSPA. The slot line microstrip coupler 40 will couple the energy between the slot line and the microstrip. The energy conversion occurs at the 90-degree intersection line of the slot line and the microstrip, and the bandwidth of the entire coupling structure is expanded through the fan-shaped structure on the slot line and the microstrip.
[0061] In some embodiments, in order to facilitate the connection between the balanced fin line PCB5 and the feed PCB6, the receiving groove of the wedge-shaped tray 4 is provided with a balanced fin line PCB5 connection hole and a feed PCB6 connection hole, and the balanced fin line PCB connection hole 33 and the feed PCB connection hole 34 are preferably threaded holes, and the receiving groove is also provided with a balanced fin line PCB positioning column 35. A PA (English name: Power Amplifier, Chinese name: Power Amplifier, referred to as PA) cavity 25 and a feed PCB cavity 26 are provided on the other side away from the receiving groove of each wedge-shaped tray 4, which are used to place SSPA, monitoring circuits and capacitors. The eight pairs of mutually dual wedge-shaped tray 4 structures constitute the coaxial dielectric transmission line of the entire structure, and the power division, amplification and synthesis of the RF signal are all realized inside. The feed PCB cavity 26 on one of the two adjacent wedge-shaped trays 4 corresponds to the position on the receiving groove on the other wedge-shaped tray 4 for placing the feed PCB6, so as to form a chamber for accommodating the feed PCB6.
[0062] In some embodiments, one end of the feeding PCB cavity 26 is connected to the PA cavity 25, and the other end is exposed from the arc-shaped outer wall of the wedge-shaped tray 4, and one end of the accommodating groove is also exposed from the arc-shaped outer wall of the wedge-shaped tray 4, that is, the feeding port of the SSPA is transferred to the edge of the structure, thereby improving the heat dissipation performance. In addition, since the feeding port is far away from the RF part and a cavity is set for fixing the power amplifier, the radiation loss and interference to other circuits are reduced.
[0063] In some embodiments, a gap is left between the balanced fin line PCB 5 and the accommodating groove to facilitate manufacturing and assembly. Figure 3 As shown, the distance between the balanced fin line PCB 5 and the side wall of the receiving groove is g2, and the distance between the balanced fin line PCB 5 and the surface of one of the wedge-shaped trays 4 is g1. Both ends of each wedge-shaped tray 4 are respectively provided with U-shaped grooves with notches facing away from each other, and a plurality of metal pillars 36 are respectively provided on the receiving groove and on both sides of the notches of the U-shaped groove, wherein the plurality of metal pillars 36 are preferably arranged in a periodic array, and the metal pillars 36 can compensate for the adverse effects caused by the above-mentioned gap.
[0064] In some embodiments, the balanced fin line PCB5 is provided with a wedge tray positioning through hole 43, a first metal through hole 46 and a wedge tray connecting through hole. The wedge tray positioning through hole 43 is used to avoid the wedge tray positioning pin 32, the first metal through hole 46 is provided to avoid the metal column 36, and the wedge tray connecting through hole is used to avoid the connecting piece connecting the adjacent wedge trays 4, and the connecting piece is preferably a screw. Among them, the balanced fin line PCB5A is provided with a wedge tray connecting through hole A42, and the balanced fin line PCB5B is provided with a wedge tray connecting through hole B49. Secondly, in order to realize the connection and positioning of the balanced fin line PCB5 and the wedge tray 4, the balanced fin line PCB5 is also provided with a balanced fin line PCB connecting through hole 44 and a balanced fin line PCB positioning through hole 45. In addition, the balanced fin line PCB5 is also provided with a periodically arranged second metal through hole 48 to prevent the occurrence of oscillation. The SSPA feeder 47 at the upper end of the balanced fin line PCB5 is used to connect the SSPA with the feeding PCB6.
[0065] In some embodiments, Figure 1 and Figure 2 As shown, the pressing block structure 7 includes an upper pressing block and a lower pressing block. A lower arc-shaped groove is formed on the lower surface of the upper pressing block, and an upper arc-shaped groove is formed on the upper surface of the lower pressing block. The upper pressing block and the lower pressing block are tightly held on each wedge-shaped tray 4 through the lower arc-shaped groove and the upper arc-shaped groove to ensure the reliability and precision of the structure. The upper pressing block and the lower pressing block are provided with a pressing block connecting hole 24 extending in the vertical direction. The upper pressing block and the lower pressing block are detachably connected by a fastener, and the fastener is preferably a screw, such as Figure 2 As shown, the length of the pressure block structure 7 in the axial direction is smaller than the length of the wedge-shaped tray 4 in the axial direction.
[0066] Please refer to Fig.16 , Fig.16 The figure is a single impedance transformation link diagram of a 16-way spatial power synthesizer. The spatial power synthesizer can be equivalent to an impedance link converter, in which the matching performance of each impedance link determines the synthesis efficiency, bandwidth and insertion loss of the final synthesizer. Among them, the input impedance of each synthesis unit is 50×16=800Ω, and the output impedance of the input extended coaxial structure 1 is 30×16=480Ω; the 16-way tapered coupler is located in the extended coaxial medium, which is used to receive the electromagnetic energy in the extended coaxial, and its input and output impedances are 480Ω and 80Ω respectively. The 80Ω set here is mainly determined by the dielectric constant and manufacturing tolerance of the balanced fin line PCB5 medium substrate; the tapered coupler cannot be directly connected to the solid-state power amplifier, so a slotted microstrip coupler 40 and an impedance converter are also provided on the impedance link to convert the 80Ω impedance into a 50Ω impedance; the impedance of the entire link is symmetrically set with the solid-state power amplifier as the center.
[0067] Please refer to Fig.17 , Fig.17 It is a comparison curve of simulation results of different impedance transformer structures. It can be seen from the figure that, in the case of the same extended coaxial medium size, the reflection coefficient of the traditional impedance transformer is large, and the extended coaxial medium size needs to be extended to reduce the reflection coefficient. The impedance transformer based on the cosine square function is based on the small reflection theory, so the reflection coefficient is small and the bandwidth is large. In order to simplify the design and facilitate manufacturing, the zigzag impedance transformer proposed in the present invention can achieve performance comparable to that of the impedance transformer based on the cosine square function.
[0068] Please refer to Fig.18 , Fig.18 3 is a comparison curve of simulation results of the trapezoidal matching structure 38 in the balanced fin line PCB5 structure. As can be seen from the figure, the synthesizer without the trapezoidal matching structure 38 has a poor reflection coefficient in the high frequency part of 10-18 GHz, resulting in a small bandwidth of the entire structure, while the introduction of the trapezoidal matching structure 38 reduces the reflection coefficient in the high frequency part of 10-18 GHz, thereby improving the bandwidth of the entire structure.
[0069] Please refer to Fig.19 and Fig. 20 , Fig.19 20 are respectively the simulation comparison curves of the gap size between the balanced fin line PCB5 structure and the wedge tray 4 and the performance simulation comparison curves of the periodically arranged metal columns on the wedge tray 4. The present invention requires a large amount of assembly, so it is necessary to consider the impact of tolerance and assembly errors in the actual processing process. The present invention introduces a gap structure in design and compensates for the adverse effects caused by it by setting periodically arranged metal columns. Fig.19 It can be seen that the introduced gap structure will produce oscillations in the high frequency part of 10-18 GHz, and the larger the gap, the stronger the oscillations. The present invention eliminates these oscillations through the periodically arranged metal column structure; Fig. 20 It can be seen that by comparing the simulation results of the structure with periodic metal pillars and the structure without periodic metal pillars, loading periodic metal pillars on the wedge-shaped tray 4 will significantly improve the impact of the gap, so that the final reflection coefficient and insertion loss meet the design requirements.
[0070] Fig.21 It is the frequency response curve of the present invention. As can be seen from the figure, the multi-channel spatial power synthesizer proposed by the present invention has the characteristics of ultra-wideband and low insertion loss. In the range of 6-16GHz, the reflection coefficient is less than -15dB, the minimum insertion loss is 0.42dB, and the maximum insertion loss is 1.1dB.
[0071] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.
[0072] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0073] The above is a detailed introduction to an ultra-wideband multi-channel spatial power synthesizer provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.
Claims
1. An ultra-wideband multi-channel spatial power synthesizer, characterized in that: include: An input extended coaxial structure, an output extended coaxial structure, a connecting shaft, a wedge-shaped tray, a balanced fin line PCB and a feed PCB, wherein the two ends of the connecting shaft are respectively connected to the input extended coaxial structure and the output extended coaxial structure, a plurality of wedge-shaped trays are distributed along the circumferential direction and are sequentially connected to form a coaxial medium transmission line, the two ends of the plurality of wedge-shaped trays are respectively connected to the input extended coaxial structure and the output extended coaxial structure, a receiving groove is provided on one side of each of the wedge-shaped trays, the receiving groove is used to place the balanced fin line PCB and the feed PCB, a trapezoidal matching structure is respectively provided at the two ends of the balanced fin line PCB, a conical coupling groove, a slot line microstrip coupler and an impedance transformer are also symmetrically provided on the balanced fin line PCB, the conical coupling groove, the slot line microstrip coupler and the impedance transformer are connected to each other to form a section of balanced fin line, the impedance transformer is a fold line impedance transformer, two sections of the balanced fin line are connected by a microstrip, and the microstrip is used to place a solid-state power amplifier.
2. The ultra-wideband multi-channel spatial power synthesizer according to claim 1, characterized in that: A gap is left between the balanced fin line PCB and the accommodating groove, and both ends of each wedge-shaped tray are respectively provided with U-shaped grooves with notches facing away from each other, and a plurality of metal columns are respectively provided on the accommodating groove and on both sides of the notch of the U-shaped groove.
3. The ultra-wideband multi-channel spatial power synthesizer according to claim 2, characterized in that: The input extended coaxial structure comprises: an input extended coaxial structure outer conductor and an input extended coaxial structure inner conductor, one end of the input extended coaxial structure inner conductor is provided with an SMA connecting shaft, and the other end is provided with an input end inner connecting hole and an input end positioning ring, one end of the connecting shaft is connected to the input end inner connecting hole, one end of each of the wedge-shaped trays is provided with an input end arc groove, and each of the input end arc grooves constitutes an input end positioning groove that cooperates with the input end positioning ring, one end of the input extended coaxial structure outer conductor is provided with an SMA connecting hole, and the other end is provided with an input end outer connecting hole and an input end outer positioning hole, one end of each of the wedge-shaped trays is provided with a wedge-shaped tray input end connecting hole corresponding to the input end outer connecting hole, and is also provided with a wedge-shaped tray input end positioning pin that cooperates with the input end outer positioning hole; The output extended coaxial structure includes: an output extended coaxial structure outer conductor and an output extended coaxial structure inner conductor, one end of the output extended coaxial structure inner conductor is provided with an N type connecting shaft, and the other end is provided with an output end inner connecting hole and an output end positioning ring, the other end of the connecting shaft is connected to the output end inner connecting hole, the other end of each wedge-shaped tray is provided with an output end arc groove, and each output end arc groove constitutes an output end positioning groove that cooperates with the output end positioning ring, one end of the output extended coaxial structure outer conductor is provided with an N type connecting hole, and the other end is provided with an output end outer connecting hole and an output end outer positioning hole, the other end of each wedge-shaped tray is provided with a wedge-shaped tray output end connecting hole corresponding to the output end outer connecting hole, and is also provided with a wedge-shaped tray output end positioning pin that cooperates with the output end outer positioning hole.
4. The ultra-wideband multi-channel spatial power synthesizer according to claim 3, characterized in that: A gap is left between the outer conductor of the input extended coaxial structure and the inner conductor of the input extended coaxial structure, a gap is left between the outer conductor of the output extended coaxial structure and the inner conductor of the output extended coaxial structure, the inner diameters of the tapered inner holes of the outer conductor of the input extended coaxial structure and the outer conductor of the output extended coaxial structure are both linearly gradient, and the outer diameters of the tapered structures of the inner conductor of the input extended coaxial structure and the inner conductor of the output extended coaxial structure are both Klopfenstein tapered linear gradient.
5. The ultra-wideband multi-channel spatial power combiner according to claim 4, characterized in that: A balanced fin line PCB connection hole and a feeding PCB connection hole are provided on the accommodating groove, and a balanced fin line PCB positioning column is also provided on the accommodating groove.
6. The ultra-wideband multi-channel spatial power combiner according to claim 5, characterized in that: A PA cavity and a feed PCB cavity are provided on the other side of each wedge-shaped tray away from the accommodating groove, and the feed PCB cavity on one of the two adjacent wedge-shaped trays corresponds to the position for placing the feed PCB on the accommodating groove on the other wedge-shaped tray.
7. The ultra-wideband multi-channel spatial power combiner according to claim 6, characterized in that: One end of the feeding PCB cavity is connected to the PA cavity, and the other end is exposed from the arc-shaped outer wall of the wedge-shaped tray. One end of the accommodating groove is also exposed from the arc-shaped outer wall of the wedge-shaped tray.
8. The ultra-wideband multi-channel spatial power combiner according to claim 7, characterized in that: Each of the wedge-shaped trays is provided with at least one wedge-shaped tray positioning pin hole on one side and at least one wedge-shaped tray positioning pin on the other side. Two adjacent wedge-shaped trays are connected through the wedge-shaped tray positioning pin holes and the wedge-shaped tray positioning pins that match one by one.
9. The ultra-wideband multi-channel spatial power combiner according to claim 8, characterized in that: The balanced fin line PCB is provided with a wedge tray positioning through hole, a first metal through hole and a wedge tray connecting through hole. The wedge tray positioning through hole is used to avoid the wedge tray positioning pin, the first metal through hole is used to avoid the metal column, and the wedge tray connecting through hole is used to avoid the connecting piece connecting adjacent wedge trays; the balanced fin line PCB is also provided with a balanced fin line PCB connecting through hole and a balanced fin line PCB positioning through hole.
10. The ultra-wideband multi-channel spatial power combiner according to any one of claims 1 to 9, characterized in that: The ultra-wideband multi-channel spatial power synthesizer also includes a pressure block structure, which includes an upper pressure block and a lower pressure block. The lower surface of the upper pressure block is formed with a lower arc-shaped groove, and the upper surface of the lower pressure block is formed with an upper arc-shaped groove. The upper pressure block and the lower pressure block are tightly clamped to each of the wedge-shaped trays through the lower arc-shaped groove and the upper arc-shaped groove, and the upper pressure block and the lower pressure block are detachably connected by fasteners.
11. An ultra-wideband multi-channel spatial power synthesizer, characterized in that: include: An input extended coaxial structure, an output extended coaxial structure, a connecting shaft, a wedge-shaped tray, a balanced fin line PCB and a feed PCB, wherein two ends of the connecting shaft are respectively connected to the input extended coaxial structure and the output extended coaxial structure; The wedge-shaped tray includes a wedge-shaped tray A and a wedge-shaped tray B. There are multiple wedge-shaped trays. The multiple wedge-shaped trays A and the multiple wedge-shaped trays B are distributed along the circumferential direction and are alternately connected in sequence to form a coaxial medium transmission line. The two ends of the multiple wedge-shaped trays A and the multiple wedge-shaped trays B are respectively connected to the input extended coaxial structure and the output extended coaxial structure. The balanced fin line PCB and the feed PCB are arranged between the wedge-shaped tray A and the wedge-shaped tray B.
