Compact thermotank
By designing a compact constant temperature box in the radar receiver system, using the temperature regulation components of the TEC semiconductor refrigeration plate and the shovel tooth structure, the thermal noise problem of the radar receiver system in high temperature environments is solved, and the measurement accuracy and device performance are improved. The accuracy of space saving and temperature control is achieved.
Patent Information
- Application Number
- CN202411395721.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2025-01-10
AI Technical Summary
The existing radar receiver system has severe thermal noise in high temperature environments, resulting in a reduced measurement accuracy. The traditional cooling method occupies a large space and inaccurate temperature control, which affects the device life.
A compact constant temperature box is designed, using a temperature regulating component with a TEC semiconductor refrigeration sheet and a spatula structure, combining a small fan for efficient heat dissipation, and optimizing the box structure with aluminum alloy material and seal design to provide a stable low temperature environment.
It effectively reduces the temperature noise of the receiver, improves sensitivity and measurement accuracy, reduces the device size, enhances radar performance, and improves the waterproof and heat dissipation efficiency of the box.
Smart Images

Figure CN119291611A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of radar equipment, and in particular to a compact constant temperature box. Background Art
[0002] Radar is an electronic device that uses electromagnetic waves to detect targets. Its working principle is: the radar generates a radio frequency signal through a transmitter, which is radiated into space through the radar transmitting antenna. When the electromagnetic wave encounters a target, it is reflected, and the echo signal passes through the radar receiving antenna and reaches the receiver. After being processed by the receiver, it is sent to the signal processor for processing to obtain parameters such as the target's distance, direction, speed and shape.
[0003] Under the influence of various factors, the echo signal received by the radar is often extremely weak, so the high sensitivity of the receiver system is crucial, and the receiver thermal noise is one of the main factors affecting the receiver sensitivity. Reducing the receiver thermal noise is conducive to improving the receiver measurement accuracy. The thermal noise of electronic components is mainly generated by the disordered and irregular movement of electronic components in a high temperature environment. In a low temperature environment, the irregular movement ability of electronic components is weakened, the thermal noise is reduced, and the thermal noise decreases proportionally with the decrease of ambient temperature. Therefore, reducing the temperature of electronic components can effectively reduce the receiver thermal noise, thereby improving the test accuracy and accuracy of the equipment. In addition, drastic changes in temperature will also cause the amplifier gain in the receiver to decrease, thereby affecting the measurement accuracy of the entire receiver system. In order to reduce the impact of temperature on the receiver, the existing method is often to place the radar receiver in a cabinet where the radar is stored, and then set a fan in the cabinet to accelerate the circulation of air inside the cabinet through the fan to achieve cooling. This cooling method occupies a large space and has poor temperature control accuracy. The receiver has high operating environment standards. Slight deviations in temperature can easily cause inaccurate signal reception by the receiver, which may even damage the device itself in the long run, greatly reducing the service life of the device. Summary of the invention
[0004] In order to overcome the above technical problems, the object of the present invention is to provide a compact constant temperature box.
[0005] The purpose of the present invention can be achieved through the following technical solutions:
[0006] A compact thermostat.
[0007] It comprises a thermostat body, the top of which is movably provided with a top cover plate, and the bottom of which is provided with a temperature adjustment component;
[0008] Among them, the temperature control component includes a protective cover body arranged at the bottom of the constant temperature box body, a TEC semiconductor refrigeration plate arranged inside the protective cover body, a hot end portion arranged at the bottom of the TEC semiconductor refrigeration plate, and a cold end portion arranged at the top of the TEC semiconductor refrigeration plate, and both the hot end portion and the cold end portion are integrated shovel-tooth structures, a plurality of groups of cold end fans distributed at intervals are arranged at the top of the cold end portion, and a plurality of groups of hot end fans distributed at intervals are arranged at both ends of the hot end portion.
[0009] As a further solution of the present invention: a sealing strip is provided on the contact surface between the thermostatic box body and the top cover plate, and a waterproof flange structure is provided at the junction of the thermostatic box body and the top cover plate.
[0010] As a further solution of the present invention: the thermostat body and the top cover plate are both thin-walled structures, the thermostat body is processed by aluminum alloy sheet metal welding technology, and the top cover plate is processed by aluminum alloy sheet metal as a whole.
[0011] As a further solution of the present invention: the bottom of the thermostat body is designed with a flange surface, the flange surface is fixedly connected to the protective cover body by screws, and the contact surface between the thermostat body and the protective cover body is provided with a heat insulating sealing pad.
[0012] As a further solution of the present invention: a plurality of groups of buckles for fixing the top cover plate are arranged on the outer side of the thermostatic box body.
[0013] As a further solution of the present invention: an embedded component matching the temperature control component is arranged inside the thermostatic box body, and the embedded component includes: a front end side panel and a rear end side panel symmetrically arranged front and back and a reinforcing partition panel arranged between the front end side panel and the rear end side panel, a bottom panel is arranged at the bottom of the front end side panel and the rear end side panel, and a plurality of slots are arranged on the front end side panel, the rear end side panel, the reinforcing partition panel and the bottom panel.
[0014] As a further solution of the present invention: a plurality of heat dissipation holes matching the hot end blower are provided at both ends of the protective cover body, and isolation grille windows are provided inside the heat dissipation holes.
[0015] As a further solution of the present invention: the side wall of the thermostatic box body is provided with several groups of radio frequency adapters, low frequency connectors and high frequency connectors matching the radar receiver.
[0016] As a further solution of the present invention: the inner walls of the thermostatic box body and the top cover plate are provided with a heat-insulating layer, and the heat-insulating layer is a heat-insulating material with a low heat transfer coefficient.
[0017] As a further solution of the present invention: a temperature control sensor for monitoring the temperature is arranged inside the thermostatic box body, and the temperature control sensor is electrically connected to the TEC semiconductor refrigeration chip.
[0018] Beneficial effects of the present invention:
[0019] 1. In the present invention, a constant temperature working environment is provided for the receiver by means of a temperature adjustment component arranged inside the thermostatic box body, thereby reducing the temperature noise of the receiver, improving the sensitivity, enhancing the overall performance of the radar, and being beneficial to improving the radar detection effect;
[0020] 2. In the present invention, the temperature control component is installed at the bottom of the thermostatic box body, which effectively utilizes the bottom space of the box body. The temperature control component and the bottom cover of the box body are integrated into one during design, avoiding secondary transfer, which is beneficial to improving the overall waterproof sealing performance of the box body and optimizing the overall shape design of the thermostatic box.
[0021] 3. In the present invention, the temperature control component adopts a high heat flux density heat dissipation method, and a TEC semiconductor refrigeration plate is installed in a small area. Through the integrated shovel tooth structure design of the hot end and the cold end, the area is increased by 50% compared with the traditional radiator, which effectively improves the heat dissipation efficiency. In addition, the TEC semiconductor refrigeration plate and the side blowing heat dissipation method of the fan with small size, large air volume and large air pressure axis are adopted, which greatly reduces the space size of the device.
[0022] 4. In the present invention, the thermostat body and the top cover are made of aluminum alloy, which is easy to process and has a low density, which is beneficial to reducing weight and facilitating installation and maintenance. In addition, the aluminum alloy has excellent anti-corrosion and mechanical properties. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The present invention will be further described below in conjunction with the accompanying drawings.
[0024] Figure 1 It is a three-dimensional schematic diagram of the whole device of the present invention;
[0025] Figure 2 It is a three-dimensional schematic diagram of the top cover plate in the present invention;
[0026] Figure 3 It is a schematic diagram of the overall structure of the device in the present invention;
[0027] Figure 4 It is a three-dimensional schematic diagram of the embedded components in the present invention;
[0028] Figure 5 It is a three-dimensional schematic diagram of the temperature control component in the present invention.
[0029] In the figure: 1. Constant temperature box body; 2. Top cover plate; 3. Embedded components; 31. Front side panel; 32. Rear side panel; 33. Reinforced partition; 34. Bottom plate; 4. Temperature control component; 41. Protective cover body; 42. TEC semiconductor refrigeration plate; 43. Hot end; 44. Cold end; 45. Cold end fan; 46. Hot end fan; 47. Heat dissipation hole; 48. Isolation grille window; 5. RF adapter; 6. Low frequency connector; 7. High frequency connector; 8. Insulation layer. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0031] like Figure 1-5 As shown, a compact thermostat,
[0032] The thermostat body 1 comprises a thermostat body 1, a top cover plate 2 is movably provided on the top of the thermostat body 1, a temperature regulating component 4 is provided on the bottom of the thermostat body 1, a sealing strip is provided on the contact surface between the thermostat body 1 and the top cover plate 2, a waterproof flange structure is provided at the joint of the thermostat body 1 and the top cover plate 2, the thermostat body 1 and the top cover plate 2 are both thin-walled structures, the thermostat body 1 adopts an aluminum alloy sheet metal welding process, the top cover plate 2 as a whole adopts an aluminum alloy plate as a whole processing process, a flange surface is designed at the bottom of the thermostat body 1, the flange surface is fixedly connected with the protective cover body 41 by screws, and a heat-insulating sealing pad is provided on the contact surface between the thermostat body 1 and the protective cover body 41. In order to obtain a larger internal space, the thermostat body 1 and the top cover plate 2 both adopt a thin-walled structure, the top cover plate 2 is integrally processed and formed by an aluminum alloy plate, and the surface of the contact part with the thermostat body 1 is finely processed to ensure the sealing after closing; the top cover plate 2 is connected to the thermostat body 1 by a stainless steel hinge, and is tightened by a stainless steel buckle when closed. The contact surface is installed with a sealing strip to prevent rainwater and moisture from entering the interior of the thermostat body 1. The thermostat body 1 is formed by a sheet metal welding process of an aluminum alloy plate. It is locally thickened at the installation hole position to avoid the installation hole from being opened, which is beneficial to the overall sealing of the box. A flange surface is designed in the length direction of the box body to fix the thermostat body 1 and the installation bracket. A hydrophobic flange is designed at the contact position between the thermostat body 1 and the top cover plate 2 to increase the rainproof performance of the top cover plate 2. When a small amount of rainwater enters the joint surface, the rainwater can The water is blocked by the flange and discharged through the drain groove; the thermostat body 1 and the thermostat assembly 4 are connected by flanges, and the flange on the side of the thermostat body 1 adopts an inwardly flanged structure, the installation hole is inside the thermostat body 1, the thermostat body 1 side is a through hole, and the thermostat assembly 4 side is a threaded hole. A sealing strip is installed on the contact surface of the two, and the sealing strip is pressed after tightening. When the thermostat assembly 4 and the thermostat body 1 are installed, the joint surface of the two is designed with a heat-insulating sealing pad, which can prevent rainwater from entering the box body and prevent heat conduction at the hot and cold ends;
[0033] The temperature control component 4 includes a protective cover body 41 arranged at the bottom of the thermostat body 1, a TEC semiconductor refrigeration sheet 42 arranged inside the protective cover body 41, a hot end 43 arranged at the bottom of the TEC semiconductor refrigeration sheet 42, and a cold end 44 arranged at the top of the TEC semiconductor refrigeration sheet 42, and the hot end 43 and the cold end 44 are both integrated shovel-tooth structures. Due to the small volume of the thermostat body 1, the traditional compression refrigeration system cannot be used. For this purpose, the semiconductor refrigeration technology is introduced, which is made by using the Peltier effect of semiconductor materials. The Peltier effect refers to the effect that when a direct current passes through two semiconductors, When a galvanic couple is composed of bulk materials, one end of the galvanic couple absorbs heat and the other end releases heat. The core of semiconductor refrigeration technology is TEC cooling sheet. TEC has the characteristics of large cooling capacity and small size. Its smallest unit is composed of a pair of N-type and P-type semiconductors plus connecting electrodes. The connecting electrodes form a cold end and a hot end. When the current direction is reversed, it will cause the cold and hot ends of TEC to switch, so that TEC can both cool and heat. The temperature control component 4 is an air-to-air refrigeration system with TEC semiconductor cooling sheet 42 as the core component, which realizes heat transfer by controlling the current, and has dual cooling and heating functions. The heat exchanger 43 and the cold end 44 are mainly used for heat exchange. A large number of heat dissipation fins are distributed on their surfaces. The heat dissipation fins of the hot end 43 and the cold end 44 are processed by the skiving process. The skived fin heat sink has a higher heat dissipation fin density, which can increase the heat dissipation area per unit volume and improve the heat dissipation performance of the product. The thickness of the teeth of the skived fin heat sink can be 1.0 to 1.5 mm, which can make the radiator lighter. The teeth of the skived fin heat sink are skived on the prototype material, so the heat dissipation efficiency is not damaged, the heat dissipation resistance is smaller, and the heat dissipation efficiency is improved. There is no risk of loosening or falling off, which improves the reliability of the operation of the machine and equipment. Several groups of cold-end fans 45 are arranged at intervals on the top of the cold end 44, and several groups of hot-end fans 46 are arranged at both ends of the hot end 43. Cold air is discharged from the middle of the device and hot air is discharged from both ends. Five groups of axial flow fans with large air volume, high air pressure and qualified protection level are installed on both sides of the hot end 43. Because the temperature control component 4 works in an open-air environment, the protection level of the axial flow fan should not be lower than IP66. The temperature control component 4 is installed with TEC semiconductor refrigeration plate 42, which is selected comprehensively according to the cooling capacity requirements, power supply specifications, and the sizes of the cold end and the hot end.
[0034] In this embodiment, specifically, a plurality of groups of buckles for fixing the top cover plate 2 are provided on the outer side of the thermostatic box body 1, which not only ensures the sealing performance but also saves the time for disassembling and assembling the top cover plate during debugging and maintenance.
[0035] In this embodiment, specifically, the interior of the thermostat body 1 is provided with an embedded component 3 matching the temperature control component 4, and the embedded component 3 includes: a front side panel 31 and a rear side panel 32 symmetrically arranged front and rear, and a reinforcing partition 33 arranged between the front side panel 31 and the rear side panel 32, a bottom panel 34 is arranged at the bottom of the front side panel 31 and the rear side panel 32, and a plurality of slots are arranged on the front side panel 31, the rear side panel 32, the reinforcing partition 33 and the bottom panel 34, and the front side panel 31, the rear side panel 32 and the reinforcing partition 33 are fixed to each other using countersunk stainless steel screws, and the screws are installed. A proper amount of thread glue should be applied to ensure the reliability of the embedded component 3. Guide grooves are designed on the front side panel 31 and the rear side panel 32 to provide guidance when the receiver module is installed. A blind-mate connector is installed on the bottom plate 34. The reinforced partition 33 mainly plays a reinforcing role. All structural parts are made of aluminum alloy to minimize the weight of the product. The embedded component 3 is fixed to the box body with ears on both sides. 8 groups of fixing holes are reserved on the ears. The embedded component 3 is mainly used to install electronic equipment in the constant temperature box body 1. The specific structure of the embedded component 3 can be designed according to the outer dimensions of the electronic equipment.
[0036] In this embodiment, specifically, a plurality of heat dissipation holes 47 matching the hot end blower 46 are provided at both ends of the protective cover body 41, and an isolation grille window 48 is provided inside the heat dissipation hole 47. The heat dissipation holes 47 facilitate exhaust of the hot end blower 46, and the isolation grille window 48 can effectively prevent foreign matter from damaging the hot end blower 46.
[0037] In the present embodiment, specifically, the side wall of the thermostatic box body 1 is provided with several groups of RF adapters 5, low-frequency connectors 6 and high-frequency connectors 7 matching the radar receiver. The RF adapters 5, low-frequency connectors 6 and high-frequency connectors 7 installed on the side wall of the thermostatic box body 1 are all of the type with self-sealing structure, fixed to the box body with stainless steel screws, and the fixing holes are blind holes. The main function of the RF adapter 5 is to realize the conversion of different connector interfaces. The adapter is made of aluminum alloy, and the inner cavity is silver-plated after processing. The adapter is fixed to the box body with screws, and a sealing ring is installed on the contact surface to ensure the sealing of the box body.
[0038] In the present embodiment, specifically, the inner walls of the thermostatic box body 1 and the top cover plate 2 are fitted with an insulation layer 8, and the insulation layer 8 is an insulation material with a low heat transfer coefficient. The insulation material can block the transfer of heat between the air inside and outside the box, thereby ensuring that the air temperature inside the box reaches the constant temperature requirement. The insulation material can be made of rubber-plastic material with high thermal insulation performance. The material is soft and easy to cut, and is particularly suitable for insulation treatment of small spaces and irregular spaces.
[0039] In this embodiment, specifically, a temperature control sensor for monitoring temperature is provided inside the thermostatic box body 1, and the temperature control sensor is electrically connected to the TEC semiconductor refrigeration plate 42. The temperature of the internal space of the thermostatic box body 1 is monitored in real time through the temperature control sensor, thereby the TEC semiconductor refrigeration plate 42 can be timely controlled.
[0040] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.
Claims
1. A compact thermostatic box, characterized in that: It comprises a thermostatic box body (1), a top cover plate (2) is movably provided on the top of the thermostatic box body (1), and a temperature adjustment component (4) is provided on the bottom of the thermostatic box body (1); The temperature control component (4) comprises a protective cover body (41) arranged at the bottom of the thermostatic box body (1), a TEC semiconductor refrigeration plate (42) arranged inside the protective cover body (41), a hot end (43) arranged at the bottom of the TEC semiconductor refrigeration plate (42), and a cold end (44) arranged at the top of the TEC semiconductor refrigeration plate (42), wherein the hot end (43) and the cold end (44) are both integrated shovel-tooth structures, a plurality of groups of cold end fans (45) arranged at intervals at the top of the cold end (44), and a plurality of groups of hot end fans (46) arranged at intervals at both ends of the hot end (43).
2. A compact thermostatic box according to claim 1, characterized in that: A sealing strip is provided on the contact surface between the thermostatic box body (1) and the top cover plate (2), and a waterproof flange structure is provided at the joint between the thermostatic box body (1) and the top cover plate (2).
3. A compact thermostatic box according to claim 1, characterized in that: The thermostatic box body (1) and the top cover plate (2) are both thin-walled structures; the thermostatic box body (1) is made by an aluminum alloy sheet metal welding process, and the top cover plate (2) is made by an aluminum alloy sheet metal integral processing process.
4. A compact thermostatic box according to claim 1, characterized in that: The bottom of the thermostat body (1) is designed with a flange surface, and the flange surface is fixedly connected to the protective cover body (41) by screws, and the contact surface between the thermostat body (1) and the protective cover body (41) is provided with a heat insulating sealing pad.
5. A compact thermostatic box according to claim 4, characterized in that: The outer side of the thermostatic box body (1) is provided with a plurality of groups of buckles for fixing the top cover plate (2).
6. A compact thermostatic box according to claim 1, characterized in that: An embedded component (3) matching the temperature regulating component (4) is arranged inside the thermostatic box body (1), and the embedded component (3) comprises: a front side plate (31) and a rear side plate (32) symmetrically arranged front and rear, and a reinforcing partition plate (33) arranged between the front side plate (31) and the rear side plate (32), a bottom plate (34) is arranged at the bottom of the front side plate (31) and the rear side plate (32), and a plurality of slots are arranged on the front side plate (31), the rear side plate (32), the reinforcing partition plate (33) and the bottom plate (34).
7. A compact thermostatic box according to claim 6, characterized in that: A plurality of groups of heat dissipation holes (47) matching the hot end blower (46) are provided at both ends of the protective cover body (41), and isolation grille windows (48) are provided inside the heat dissipation holes (47).
8. A compact thermostatic box according to claim 1, characterized in that: The side wall of the thermostatic box body (1) is provided with a plurality of groups of radio frequency adapters (5), low-frequency connectors (6) and high-frequency connectors (7) that match the radar receiver.
9. A compact thermostatic box according to claim 1, characterized in that: The inner walls of the thermostatic box body (1) and the top cover plate (2) are fitted with a thermal insulation layer (8), and the thermal insulation layer (8) is a thermal insulation material with a low heat transfer coefficient.
10. A compact thermostatic box according to claim 1, characterized in that: A temperature control sensor for monitoring temperature is arranged inside the thermostatic box body (1), and the temperature control sensor is electrically connected to the TEC semiconductor refrigeration sheet (42).
Citation Information
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