A lead frame with an inductive self-lowering base island

Abstract

The present invention relates to the field of integrated circuit technology, and in particular to a lead frame with an inductive self-lowering base island. The lead frame comprises a lead frame body, the top of which is provided with an upper protective mechanism; the bottom of which is provided with a lower protective mechanism. When the chip of the lead frame of the present invention is working, the internal temperature rises, and the elastic support sheet and the deformable support sheet expand due to heat. Since the expansion coefficient of the elastic support sheet is greater than the expansion coefficient of the deformable support sheet, the elongation of the elastic support sheet is large, and the deformable support sheet is located at the bottom of a section of the parabolic elastic support sheet away from the base island, the section of the elastic support sheet away from the base island will bend downward, thereby driving the base island to descend, avoiding the concentration of thermal stress on the chip, so that the lead frame can sense the self-lowering base island when the working temperature rises, and automatically reset the base island when the working temperature drops, thereby improving the working stability and the environmental adaptability.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuits, and in particular relates to a lead frame with an inductive self-lowering base island. Background Art

[0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect to external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] After searching, in the prior art, the Chinese patent announcement number: CN117153804A, announcement date: 2023-12-01, discloses a lead frame with a positioning mechanism that is convenient for use, including a lead frame, a positioning mechanism and a protective layer, the positioning mechanism is fixedly connected to the center position of the upper surface of the lead frame, and the protective layer is compounded on the outer wall of the lead frame; the positioning mechanism includes a chip box, a guide column, a push-out assembly, a card slot, a cover plate, a movable cavity, a contact, a limit groove, a spring and a plug rod, the chip box is fixedly connected to the center position of the upper surface of the lead frame, the inner side of the chip box is rectangular, and the inner cavity of the chip box can store chips; the number of guide columns is several, and they are equidistantly installed around the inside of the chip box. The invention has a chip positioning function, which is convenient for the installation and removal of chips, the downtime of the integrated circuit is short, the maintenance cost is low, the life of the lead frame is extended, and the integrated circuit has high stability in use.

[0004] However, the lead frame still has the following defects:

[0005] There is usually a height difference between the base island and the pin of the lead frame. The purpose is to optimize the heat conduction path, reduce thermal stress concentration, and improve resistance to thermal fatigue. However, the height difference between the base island and the pin is usually fixed. When working for a long time, there will still be a problem of heat accumulation, which will cause thermal fatigue of the chip and reduce the stability of operation. Summary of the invention

[0006] In view of the above problems, the present invention provides a lead frame with an inductive self-lowering base island, comprising a lead frame body, an upper protection mechanism is provided on the top of the lead frame body; a lower protection mechanism is provided on the bottom of the lead frame body;

[0007] The lead frame body comprises an outer support frame and an inner support frame; the outer walls of the four sides of the outer support frame are provided with a plurality of groups of special-shaped pins at equal intervals; the inner walls of the two sides of the inner support frame are symmetrically provided with a plurality of groups of elastic support sheets at equal intervals;

[0008] The ends of the several groups of elastic support sheets away from the inner support frame are connected to the base island; each group of the elastic support sheets is parabolic, and a deformable support sheet is provided at the bottom of the side away from the base island;

[0009] The deformable support sheet is attached to the bottom of the elastic support sheet. When the operating temperature rises, the elastic support sheet will bend toward one side of the deformable support sheet, thereby driving the base island to descend and avoiding heat concentration on the chip.

[0010] Furthermore, the upper protective mechanism and the lower protective mechanism are snap-connected together; a plurality of first connecting plates are evenly spaced at the four side edges of the top of the outer support frame; a plurality of second connecting plates are evenly spaced at the four side edges of the top of the inner support frame; a plurality of connecting ribs are provided between the inner wall of the outer support frame and the outer wall of the inner support frame.

[0011] Furthermore, the two ends of each group of the connecting ribs are respectively connected to a corresponding group of first connecting plates and second connecting plates; each group of the special-shaped tube pins is connected to a corresponding group of first connecting plates; and each group of the special-shaped tube pins is provided with a curved section and a straight section.

[0012] Furthermore, the upper protective mechanism includes two groups of supporting shells; two groups of opening and closing covers are symmetrically slidably connected between the two groups of supporting shells; a group of opening and closing fasteners are respectively provided at the edges of the tops of the two groups of opening and closing covers; a group of first heat sinks are provided on the side wall of each group of supporting shells away from the closing covers; and a plurality of first pin grooves are evenly spaced at the bottom edges of each group of supporting shells.

[0013] Furthermore, a plurality of first heat conducting plates are evenly spaced on the inner wall of one side of the bottom of each group of the supporting shells; each group of the first heat conducting plates is connected to a corresponding group of first heat sinks; a group of second heat sinks is provided on a side wall of each group of the opening and closing covers away from the supporting shells; and a plurality of second pin slots are evenly spaced at the bottom edge of each group of the opening and closing covers.

[0014] Furthermore, a plurality of groups of second heat conducting plates are evenly spaced on the inner wall of one side of the bottom of each group of the opening and closing covers; each group of the second heat conducting plates is connected to a corresponding group of second heat sinks; the first heat conducting plates and the second heat conducting plates are both curved, and the inclined surfaces are parallel to the inclined surfaces of the curved sections of the corresponding group of special-shaped pins; and four groups of first supporting components are symmetrically arranged on the bottom of the two groups of the opening and closing covers.

[0015] Furthermore, the lower protection mechanism includes a protection shell; a plurality of groups of third pin grooves are evenly spaced at the four side edges of the top of the protection shell; and four groups of second support components are distributed in a rectangular array on the bottom inner wall of the protection shell.

[0016] Furthermore, the second support assembly has the same structure as the first support assembly; four groups of protection plates are arranged in a circular array on the bottom inner wall of the protective shell; each group of the protection plates is L-shaped and has a number of heat dissipation holes evenly distributed thereon.

[0017] Furthermore, the second supporting assembly includes a first sealing tube; the bottom of the first sealing tube is connected to the bottom inner wall of the protective shell; a second sealing tube is movably sleeved on the inner wall of the first sealing tube; a magnetic block is provided at the top of the second sealing tube; and an insulating gasket is provided at the top of the magnetic block.

[0018] Furthermore, a buffer spring is provided in the first sealing tube; the bottom of the buffer spring is connected to the bottom inner wall of the protective shell; the top of the buffer spring movably passes through the second sealing tube and is connected to the bottom of the magnetic suction block.

[0019] The beneficial effects of the present invention are:

[0020] 1. When the chip is working, the internal temperature rises, and the elastic support sheet and the deformable support sheet expand due to the heat. Since the expansion coefficient of the elastic support sheet is greater than the expansion coefficient of the deformable support sheet, the elongation of the elastic support sheet is large, and the deformable support sheet is located at the bottom of a section of the parabolic elastic support sheet away from the base island. Therefore, the section of the elastic support sheet away from the base island will bend downward, thereby driving the base island to descend, avoiding the concentration of thermal stress on the chip, so that the lead frame can sense the increase in working temperature and automatically lower the base island, and automatically reset the base island when the working temperature drops, thereby improving working stability and environmental adaptability.

[0021] 2. The straight sections of several groups of special-shaped pins respectively pass through the corresponding first pin groove, the second pin groove and the third pin groove, and the inclined surfaces of the bent sections of several groups of special-shaped pins are respectively close to the corresponding first heat conductive sheet and the second heat conductive sheet, so that the special-shaped pins of the lead frame are easier to dissipate heat. At the same time, when the special-shaped pins of the lead frame are damaged at the connection part with the outside, the straight sections of the special-shaped pins can be stretched outward and re-welded, which improves the heat dissipation effect of the lead frame and the use effect.

[0022] 3. Since the first support assembly and the second support assembly have the same structure, when the upper protection mechanism and the lower protection mechanism are engaged to protect the lead frame body, several groups of magnetic blocks are adsorbed under the action of magnetism and are pressed against the top and bottom of the outer support frame through corresponding insulating gaskets. When the lead frame is subjected to external force, several groups of buffer springs can buffer the impact force, and the stable air pressure in the first sealing tube and the second sealing tube can be used to avoid the buffer spring from rebounding back and forth, thereby improving the protection effect of the lead frame.

[0023] 4. When the operating temperature rises, the lead frame senses the temperature increase and drives the chip down between the four sets of protection plates through the base island. When the lead frame is acted upon by external force, when the upper protection mechanism is acted upon by external force, the external force cannot act directly on the chip, thereby protecting the chip and increasing the service life of the chip.

[0024] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic structural diagram of a lead frame according to an embodiment of the present invention is shown;

[0027] Figure 2 shows an exploded schematic diagram of a lead frame according to an embodiment of the present invention;

[0028] Figure 3 A schematic structural diagram of a lead frame body according to an embodiment of the present invention is shown;

[0029] Figure 4 A schematic bottom view of the structure of a lead frame body according to an embodiment of the present invention is shown;

[0030] Figure 5 The embodiment of the present invention is shown Figure 4 An enlarged schematic diagram of point A;

[0031] Figure 6 It shows a schematic structural diagram of an upper protection mechanism according to an embodiment of the present invention;

[0032] Figure 7 A bottom view structural diagram of an upper protection mechanism according to an embodiment of the present invention is shown;

[0033] Figure 8 It shows a schematic structural diagram of a lower protection mechanism according to an embodiment of the present invention;

[0034] Fig. 9 A cross-sectional schematic diagram of a second supporting assembly according to an embodiment of the present invention is shown.

[0035] In the figure: 1, lead frame body; 2, upper protection mechanism; 3, lower protection mechanism; 101, outer support frame; 102, inner support frame; 103, first connecting piece; 104, second connecting piece; 105, connecting rib; 106, special-shaped pin; 107, elastic supporting piece; 108, base island; 109, deformable supporting piece; 201, supporting shell; 202, opening and closing cover; 203, opening and closing fastener; 204, first heat sink; 205, first Pin slot; 206, second heat sink; 207, second pin slot; 208, first heat conductive sheet; 209, second heat conductive sheet; 210, first support assembly; 301, protective shell; 302, third pin slot; 303, second support assembly; 304, protective plate; 305, heat dissipation hole; 3031, first sealing tube; 3032, second sealing tube; 3033, magnetic block; 3034, insulating gasket; 3035, buffer spring. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The embodiment of the present invention provides a lead frame with an inductive self-degrading base island, comprising a lead frame body 1. For example, Figure 1 and Figure 2 As shown, an upper protection mechanism 2 is provided at the top of the lead frame body 1; a lower protection mechanism 3 is provided at the bottom of the lead frame body 1; and the upper protection mechanism 2 and the lower protection mechanism 3 are snap-connected together.

[0038] For example, Figure 3 , Figure 4 and Figure 5As shown, the lead frame body 1 includes an outer support frame 101 and an inner support frame 102; a plurality of first connecting pieces 103 are provided at equal intervals at the four side edges of the top of the outer support frame 101; a plurality of second connecting pieces 104 are provided at equal intervals at the four side edges of the top of the inner support frame 102; a plurality of connecting ribs 105 are provided between the inner wall of the outer support frame 101 and the outer wall of the inner support frame 102; the two ends of each group of connecting ribs 105 are connected to a corresponding group of first connecting pieces 103 and second connecting pieces 104 respectively; a plurality of connecting ribs 105 are provided at equal intervals on the four side outer walls of the outer support frame 101 A group of special-shaped pins 106; each group of the special-shaped pins 106 is connected to a corresponding group of first connecting pieces 103; each group of the special-shaped pins 106 is provided with a curved section and a straight section, and a number of groups of elastic support sheets 107 are symmetrically and evenly spaced on the inner walls of both sides of the inner support frame 102; a base island 108 is connected to one end of the several groups of elastic support sheets 107 away from the inner support frame 102; each group of the elastic support sheets 107 is parabolic, and a deformable support sheet 109 is provided at the bottom of the side away from the base island 108; the deformable support sheet 109 is made of a material with an expansion coefficient smaller than that of the elastic support sheet 107.

[0039] During the packaging process, the chip is pasted and fixed on the top of the base island 108 and connected to a plurality of groups of second connecting pieces 104, and then the upper protection mechanism 2 and the lower protection mechanism 3 are clamped to protect the lead frame body 1, and the straight sections of the plurality of groups of special-shaped pins 106 extend through and extend to the outside of the upper protection mechanism 2 and the lower protection mechanism 3. When the chip is working, the internal temperature rises, and the elastic support sheet 107 and the deformable support sheet 109 expand due to heat. Since the expansion coefficient of the elastic support sheet 107 is greater than the expansion coefficient of the deformable support sheet 109, the elongation of the elastic support sheet 107 is large, and the deformable support sheet 109 is located at the bottom of a section of the parabolic elastic support sheet 107 away from the base island 108, the section of the elastic support sheet 107 away from the base island 108 will bend downward, thereby driving the base island 108 to descend, avoiding the concentration of thermal stress on the chip, so that the lead frame can sense the increase in working temperature and automatically lower the base island 108, and automatically reset the base island 108 when the working temperature drops, thereby improving the working stability and the environmental adaptability.

[0040] For example, Figure 6 and Figure 7As shown, the upper protection mechanism 2 includes two groups of support shells 201; two groups of opening and closing covers 202 are symmetrically slidably connected between the two groups of support shells 201; a group of opening and closing fasteners 203 are respectively provided at the edges of the tops of the two groups of opening and closing covers 202; a group of first heat sinks 204 are provided on the side wall of each group of support shells 201 away from the closing covers 202; a plurality of groups of first pin grooves 205 are evenly spaced at the bottom edge of each group of support shells 201; a plurality of groups of first heat conducting sheets 208 are evenly spaced on the inner wall of the bottom side of each group of support shells 201; each group of the first heat conducting sheets 208 is connected to the corresponding group of first heat sinks 204 04 connection; a group of second heat sinks 206 are provided on a side wall of each group of the opening and closing covers 202 away from the supporting shell 201; a plurality of groups of second pin grooves 207 are evenly spaced at the bottom edge of each group of the opening and closing covers 202; a plurality of groups of second heat conducting plates 209 are evenly spaced on the inner wall of one side of the bottom of each group of the opening and closing covers 202; each group of the second heat conducting plates 209 is connected to a corresponding group of second heat sinks 206; the first heat conducting plates 208 and the second heat conducting plates 209 are both curved, and the inclined surfaces are parallel to the inclined surfaces of the curved sections of the corresponding group of special-shaped pins 106; four groups of first support components 210 are symmetrically provided at the bottom of the two groups of the opening and closing covers 202.

[0041] For example, Figure 8 As shown, the lower protection mechanism 3 includes a protection shell 301; a plurality of third pin grooves 302 are evenly spaced at the edges of the four sides of the top of the protection shell 301; four second support assemblies 303 are distributed in a rectangular array on the bottom inner wall of the protection shell 301; the second support assembly 303 has the same structure as the first support assembly 210; four protection plates 304 are distributed in a circular array on the bottom inner wall of the protection shell 301; each group of protection plates 304 is L-shaped, and a plurality of heat dissipation holes 305 are evenly distributed.

[0042] The upper protection mechanism 2 and the lower protection mechanism 3 are clamped to protect the lead frame body 1, and the straight sections of the plurality of groups of special-shaped pins 106 are respectively passed through the corresponding first pin groove 205, the second pin groove 207 and the third pin groove 302, and the inclined surfaces of the curved sections of the plurality of groups of special-shaped pins 106 are respectively close to the corresponding first heat conducting sheet 208 and the second heat conducting sheet 209, so that the special-shaped pins 106 of the lead frame are easier to dissipate heat. At the same time, when the special-shaped pins 106 of the lead frame are damaged at the connection part with the outside, the straight sections of the special-shaped pins 106 can be stretched outward and re-welded, which improves the heat dissipation effect of the lead frame and the use effect. When the working temperature rises, the lead frame senses the temperature rise, and drives the chip to drop between the four groups of protection plates 304 through the base island 108, so that when the lead frame is acted upon by external force, when the upper protection mechanism 2 is acted upon by external force, the external force cannot directly act on the chip, thereby forming protection for the chip and improving the service life of the chip. When the lead frame needs to be repaired, the two sets of opening and closing fasteners 203 can be unfastened and then the two sets of opening and closing covers 202 can be unfolded to both sides, thereby completely exposing the connection structure of the lead frame body 1, facilitating maintenance work and improving the maintenance convenience of the lead frame.

[0043] For example, Fig. 9 As shown, the second supporting assembly 303 includes a first sealing tube 3031; the bottom of the first sealing tube 3031 is connected to the bottom inner wall of the protective shell 301; a second sealing tube 3032 is movably sleeved on the inner wall of the first sealing tube 3031; a magnetic block 3033 is provided at the top of the second sealing tube 3032; an insulating gasket 3034 is provided at the top of the magnetic block 3033; a buffer spring 3035 is provided in the first sealing tube 3031; the bottom of the buffer spring 3035 is connected to the bottom inner wall of the protective shell 301; the top of the buffer spring 3035 movably passes through the second sealing tube 3032 and is connected to the bottom of the magnetic block 3033.

[0044] Since the first support component 210 and the second support component 303 have the same structure, when the upper protection mechanism 2 and the lower protection mechanism 3 are engaged to protect the lead frame body 1, several groups of magnetic blocks 3033 are adsorbed under the action of magnetism and are pressed against the top and bottom of the outer support frame 101 through corresponding insulating gaskets 3034. When the lead frame is subjected to external force, several groups of buffer springs 3035 can buffer the impact force, and the stable air pressure in the first sealing tube 3031 and the second sealing tube 3032 can be used to avoid the buffer spring 3035 from rebounding back and forth, thereby improving the protection effect of the lead frame.

[0045] When the chip is working, the internal temperature rises, and the elastic support sheet 107 and the deformable support sheet 109 expand due to the heat. Since the expansion coefficient of the elastic support sheet 107 is greater than the expansion coefficient of the deformable support sheet 109, the elongation of the elastic support sheet 107 is large, and the deformable support sheet 109 is located at the bottom of a section of the parabolic elastic support sheet 107 away from the base island 108. Therefore, the section of the elastic support sheet 107 away from the base island 108 will bend downward, thereby driving the base island 108 to descend, avoiding the concentration of thermal stress on the chip, so that the lead frame can sense the increase in operating temperature and automatically lower the base island 108, and automatically reset the base island 108 when the operating temperature drops, thereby improving the working stability and environmental adaptability.

[0046] The straight sections of several groups of special-shaped pins 106 respectively pass through the corresponding first pin groove 205, the second pin groove 207 and the third pin groove 302, and the inclined surfaces of the curved sections of several groups of special-shaped pins 106 are respectively close to the corresponding first heat conductive sheet 208 and the second heat conductive sheet 209, so that the special-shaped pins 106 of the lead frame are easier to dissipate heat. At the same time, when the connection part of the special-shaped pins 106 of the lead frame with the outside is damaged, the straight section of the special-shaped pin 106 can be stretched outward and re-welded, which improves the heat dissipation effect of the lead frame and the use effect.

[0047] Since the first support component 210 and the second support component 303 have the same structure, when the upper protection mechanism 2 and the lower protection mechanism 3 are engaged to protect the lead frame body 1, several groups of magnetic blocks 3033 are adsorbed under the action of magnetism and are pressed against the top and bottom of the outer support frame 101 through corresponding insulating gaskets 3034. When the lead frame is subjected to external force, several groups of buffer springs 3035 can buffer the impact force, and the stable air pressure in the first sealing tube 3031 and the second sealing tube 3032 can be used to avoid the buffer spring 3035 from rebounding back and forth, thereby improving the protection effect of the lead frame.

[0048] When the operating temperature rises, the lead frame senses the temperature increase and drives the chip down between the four sets of protection plates 304 through the base island 108, so that when the lead frame is acted upon by external force, when the upper protection mechanism 2 is acted upon by external force, the external force cannot directly act on the chip, thereby protecting the chip and increasing the service life of the chip.

[0049] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A lead frame with an inductive self-degrading base island, comprising a lead frame body (1), characterized in that: An upper protection mechanism (2) is provided at the top of the lead frame body (1); and a lower protection mechanism (3) is provided at the bottom of the lead frame body (1); The lead frame body (1) comprises an outer support frame (101) and an inner support frame (102); a plurality of groups of special-shaped pins (106) are provided at equal intervals on the four outer walls of the outer support frame (101); a plurality of groups of elastic support sheets (107) are symmetrically provided at equal intervals on the inner walls of the two sides of the inner support frame (102); The ends of the plurality of groups of elastic support sheets (107) away from the inner support frame (102) are connected to a base island (108); each group of the elastic support sheets (107) is parabolic in shape, and a deformable support sheet (109) is provided at the bottom of the side away from the base island (108); The deformable support sheet (109) is attached to the bottom of the elastic support sheet (107). Since the expansion coefficient of the elastic support sheet (107) is greater than the expansion coefficient of the deformable support sheet (109), when the operating temperature rises, the elastic support sheet (107) will bend towards one side of the deformable support sheet (109), thereby driving the base island (108) to descend, thereby preventing heat from being concentrated on the chip.

2. A lead frame with an inductive self-lowering base island according to claim 1, characterized in that: The upper protection mechanism (2) and the lower protection mechanism (3) are snap-connected together; a plurality of groups of first connecting pieces (103) are provided at equal intervals at the four side edges of the top of the outer support frame (101); a plurality of groups of second connecting pieces (104) are provided at equal intervals at the four side edges of the top of the inner support frame (102); and a plurality of groups of connecting ribs (105) are provided between the inner wall of the outer support frame (101) and the outer wall of the inner support frame (102).

3. A lead frame with an inductive self-lowering base island according to claim 2, characterized in that: The two ends of each group of connecting ribs (105) are respectively connected to a corresponding group of first connecting plates (103) and second connecting plates (104); each group of special-shaped tube pins (106) is connected to a corresponding group of first connecting plates (103); and each group of special-shaped tube pins (106) is provided with a curved section and a straight section.

4. The lead frame with an inductive self-lowering base island according to claim 1, characterized in that: The upper protection mechanism (2) comprises two groups of supporting shells (201); two groups of opening and closing covers (202) are symmetrically slidably connected between the two groups of supporting shells (201); a group of opening and closing fasteners (203) are respectively provided at the top opposite side edges of the two groups of opening and closing covers (202); a group of first heat sinks (204) are provided on a side wall of each group of supporting shells (201) away from the closing cover (202); and a plurality of groups of first pin grooves (205) are evenly spaced at the bottom edge of each group of supporting shells (201).

5. The lead frame with an inductive self-lowering base island according to claim 4, characterized in that: A plurality of groups of first heat conducting plates (208) are evenly spaced on the inner wall of one side of the bottom of each group of the supporting shells (201); each group of the first heat conducting plates (208) is connected to a corresponding group of first heat sinks (204); a group of second heat sinks (206) are provided on a side wall of each group of the opening and closing covers (202) away from the supporting shells (201); and a plurality of groups of second pin slots (207) are evenly spaced at the bottom edge of each group of the opening and closing covers (202).

6. The lead frame with an inductive self-lowering base island according to claim 5, characterized in that: A plurality of groups of second heat conducting plates (209) are evenly spaced on the inner wall of one side of the bottom of each group of the opening and closing covers (202); each group of the second heat conducting plates (209) is connected to a corresponding group of second heat sinks (206); the first heat conducting plates (208) and the second heat conducting plates (209) are both curved, and the inclined surfaces are parallel to the inclined surfaces of the curved sections of the corresponding group of special-shaped pins (106); and four groups of first support components (210) are symmetrically provided at the bottom of the two groups of the opening and closing covers (202).

7. The lead frame with an inductive self-lowering base island according to claim 1, characterized in that: The lower protection mechanism (3) comprises a protection shell (301); a plurality of groups of third pin grooves (302) are provided at equal intervals on the four side edges of the top of the protection shell (301); and four groups of second support components (303) are distributed in a rectangular array on the bottom inner wall of the protection shell (301).

8. The lead frame with an inductive self-lowering base island according to claim 7, characterized in that: The second support assembly (303) has the same structure as the first support assembly (210); four groups of protection plates (304) are arranged in a circular array on the bottom inner wall of the protection shell (301); each group of the protection plates (304) is L-shaped and has a plurality of groups of heat dissipation holes (305) evenly distributed thereon.

9. The lead frame with an inductive self-lowering base island according to claim 8, characterized in that: The second supporting assembly (303) comprises a first sealing tube (3031); the bottom of the first sealing tube (3031) is connected to the bottom inner wall of the protective shell (301); a second sealing tube (3032) is movably sleeved on the inner wall of the first sealing tube (3031); a magnetic block (3033) is provided at the top of the second sealing tube (3032); and an insulating gasket (3034) is provided at the top of the magnetic block (3033).

10. The lead frame with an inductive self-lowering base island according to claim 9, characterized in that: A buffer spring (3035) is provided in the first sealing tube (3031); the bottom of the buffer spring (3035) is connected to the bottom inner wall of the protective shell (301); the top of the buffer spring (3035) movably passes through the second sealing tube (3032) and is connected to the bottom of the magnetic attraction block (3033).

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