Component supply device and component supply method

Abstract

The invention provides a component supply device and the like capable of suppressing reduction of productivity. A component supply device (100) is provided with: a tray supply unit (110) for supplying a tray (300) on which a component and a release paper (310) covering the component are placed; a paper pickup unit (130) that picks up the release paper (310) on the tray (300) supplied from the tray supply unit (110); and a tray transport unit (180) that receives the tray (300) on which the release paper (310) is placed from the tray supply unit (110), and transports the tray (300) to a position at which the feed paper pickup unit (130) picks up the release paper (310) on the tray (300). The tray (300) from which the release paper (310) has been picked up is conveyed to a position at which a component pickup unit (190) that supplies the component to the component mounting device (200) picks up the component placed on the tray (300).

Description

Technical Field

[0001] The present invention relates to a component supplying device and a component supplying method for supplying components to a component mounting device for mounting components on a substrate. Background Art

[0002] Conventionally, there is a component supply device for supplying components to a component mounting device for mounting components on a substrate (for example, refer to Patent Document 1). Patent Document 1 discloses a component supply device for supplying a plurality of components stored in a tray to a component mounting portion. The component supply device disclosed in Patent Document 1 includes a tray storage portion for storing trays, and a tray transfer portion for transferring the tray stored in the tray storage portion to a component supply position for supplying components to the component mounting portion.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-119390 Summary of the invention

[0006] Problems to be solved by the invention

[0007] A plurality of trays are stacked and arranged in the tray storage unit disclosed in Patent Document 1. Here, a release paper is placed on the trays arranged in the tray storage unit so as to cover the components so that the components placed on the trays do not come into contact with other trays or the like.

[0008] In the past, the separator paper placed on the tray was removed by an operator. However, in such a method, the labor cost of the operator who needs to remove the separator paper increases, or there is a case where the component cannot be used due to an operation error such as turning over the tray. In other words, in such a method, the cost of supplying components to the component mounting device becomes high, so the productivity of the component mounting system that produces the substrate on which the components are mounted, including the component supply device and the component mounting device, may decrease.

[0009] The present invention provides a component supply device and the like capable of suppressing a decrease in productivity.

[0010] Solutions to Solve Problems

[0011] A component supply device according to one embodiment of the present invention comprises: a tray supply unit that supplies a tray carrying components and isolation paper covering the components; a paper picking unit that picks up the isolation paper on the tray supplied from the tray supply unit; and a tray conveying unit that receives the tray carrying the isolation paper from the tray supply unit, conveys the tray to a position where the paper picking unit picks up the isolation paper on the tray, and conveys the tray with the isolation paper picked up to a position where the component picking unit picks up the components placed on the tray, and the component picking unit supplies the components to a component mounting device.

[0012] A component supply method according to one embodiment of the present invention is a component supply method performed by a component supply device having a tray supply unit, a paper picking unit and a tray conveying unit, wherein the component supply method comprises the following steps: the tray supply unit supplies a tray carrying components and isolation paper covering the components to the tray conveying unit, the tray conveying unit conveys the tray to a position where the paper picking unit picks up the isolation paper on the tray, the paper picking unit picks up the isolation paper on the tray, the tray conveying unit conveys the tray with the isolation paper picked up to a position where the component picking unit picks up the components placed on the tray, and the component picking unit supplies the components to a component mounting device.

[0013] Effects of the Invention

[0014] According to the present invention, it is possible to provide a component supply device and the like that can suppress a decrease in productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view showing the component mounting system according to the embodiment.

[0016] Figure 2 It is a perspective view showing the component supply device according to the embodiment.

[0017] Figure 3 It is a block diagram showing the functional structure of the component supply device according to the embodiment.

[0018] Figure 4 It is a side view showing a specific structure of a paper pickup unit according to the embodiment.

[0019] Figure 5 It is a plan view for explaining the positional relationship of each device included in the component supply device according to the embodiment.

[0020] Figure 6 It is a diagram showing a first example of the processing procedure of the component supply device according to the embodiment.

[0021] Figure 7 It is a diagram showing a second example of the processing procedure of the component supply device according to the embodiment.

[0022] Figure 8 This is a flowchart showing the processing procedure of the component supply device according to the embodiment.

[0023] Description of Reference Numerals

[0024] 10: component installation system; 100: component supply device; 110: tray supply unit; 120: sensor unit; 130: paper picking unit; 131: suction nozzle; 132: support body; 133: lifting mechanism; 140: conveying unit; 150: tray table; 160: recovery unit; 170: control device; 171: detection unit; 172: control unit; 173: storage unit; 180: tray conveying unit; 190: component picking unit; 200: component installation device; 220: component placement table; 230: component installation unit; 240: substrate table; 250: substrate conveying unit; 300, 301, 302: tray; 310: isolation paper; 400: substrate. DETAILED DESCRIPTION

[0025] Hereinafter, the embodiments of the present invention will be described in detail using the accompanying drawings. It should be noted that the embodiments described below all illustrate a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, configurations of constituent elements, connection methods, steps, and the order of steps shown in the following embodiments are examples and are not intended to limit the present invention. Therefore, the constituent elements of the following embodiments that are not recorded in the independent technical solutions are described as arbitrary constituent elements.

[0026] In addition, each figure is a schematic diagram, and does not necessarily illustrate strictly. In addition, in each figure, the same reference numeral is attached|subjected to the same structural member.

[0027] In addition, in this specification, unless otherwise specified, ordinal numbers such as “first” and “second” do not mean the number or order of components, but are used to avoid confusion between the same kind of components and to distinguish them.

[0028] In addition, in this specification, the vertical direction is referred to as the Z-axis direction or the up-down direction, a direction of a plane perpendicular to the vertical direction is referred to as the Y-axis direction or the depth direction, and the direction perpendicular to the Y-axis direction in the perpendicular plane is referred to as the X-axis direction, the left-right direction, or the lateral direction. In addition, in this specification, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In addition, in this specification, the positive side of the Y-axis direction is the back side or back, and the negative side of the Y-axis direction is the front side or front. In addition, in this specification, the positive side of the X-axis direction is the right side or right, and the negative side of the X-axis direction is the left side or left.

[0029] (Implementation Method)

[0030] [structure]

[0031] First, the structure of the component supply device according to the embodiment will be described.

[0032] Figure 1 It is a top view which shows the component mounting system 10 which concerns on embodiment. Figure 2 It is a perspective view showing the component supply device 100 according to the embodiment. Figure 3 1 is a block diagram showing the functional structure of the component supply device 100 according to the embodiment. Figure 1 as well as Figure 2 In the figure, illustration of a computer for controlling each device included in the component mounting system 10, such as the control device 170, is omitted.

[0033] The component mounting system 10 is a system for producing a mounting substrate on which components are mounted by mounting components on a substrate 400 .

[0034] As the substrate 400 , a film-shaped flexible substrate formed of a resin or the like is exemplified. In addition, the substrate 400 may be a rigid substrate such as a glass substrate.

[0035] As components bonded to the substrate 400 via the ACF slice, electronic components such as IC (Integrated Circuit), TCP (Tape Carrier Package), and FPC (Flexible Printed Circuits) are exemplified.

[0036] The component mounting system 10 includes a component mounting device 200 and a component supply device 100. For example, the component mounting system 10 includes an ACF (Anisotropic Conductive Film) pasting device (not shown) located upstream of the component mounting device 200 and a final pressure bonding device located downstream of the component mounting device 200.

[0037] The ACF attaching device receives the substrate 400 carried in from the loader and attaches the ACF as an adhesive member to the electrode portion of the substrate 400. The ACF attaching device is realized by, for example, a conveying mechanism for conveying the substrate 400 and an attaching mechanism for attaching the ACF to the substrate 400.

[0038] The component mounting device 200 is a mounting device for mounting components on the substrate 400. Specifically, the component mounting device 200 temporarily presses the components to the substrate 400. More specifically, the component mounting device 200 temporarily presses the components supplied from the component supply device 100 to the portion of the substrate 400 carried in from the ACF pasting device to which the ACF is pasted.

[0039] The component mounting device 200 includes a component placement table 220 , a component mounting section 230 , a substrate stage 240 , and a substrate conveying section 250 .

[0040] The component placement table 220 is a table on which components picked up by the component pickup unit 190 and supplied from the component supply device 100 are placed. Specifically, components that were placed on the tray 300 and picked up by the component pickup unit 190 are placed on the component placement table 220 .

[0041] The component mounting section 230 is a device that picks up a component mounted on the component mounting table 220 and mounts (more specifically, temporarily press-bonds) the picked-up component on the substrate 400 mounted on the substrate stage 240 .

[0042] The component mounting portion 230 is realized by, for example, a pickup head for picking up a component and mounting it on the substrate 400, a camera for determining the placement position of the component on the substrate 400, and a support table for supporting the end of the substrate 400 from below. It should be noted that the method for holding the component of the pickup head is not particularly limited, but in the case of this embodiment, as a method for the pickup head to pick up the component, a method for holding the component by vacuum adsorption is adopted. In addition, for example, the pickup head is configured on a head transfer mechanism composed of, for example, a combination of a linear guide and a linear motor, so that it can move.

[0043] The substrate stage 240 is a stage on which the substrate 400 carried in by the substrate conveying unit 250 is placed.

[0044] The substrate transporting unit 250 is a device that carries the substrate 400 from the ACF pasting device to the substrate stage 240 and carries the substrate 400 with components installed to the formal crimping device. The substrate transporting unit 250 is implemented, for example, by a suction nozzle that absorbs and holds the substrate 400 and a suction nozzle transfer mechanism that moves the suction nozzle. It should be noted that the method of holding the substrate 400 based on the suction nozzle is not particularly limited, but in this embodiment, as a method of holding the substrate 400 by the suction nozzle, a method of holding the substrate by vacuum adsorption is adopted. In addition, for example, the suction nozzle transfer mechanism is composed of, for example, a combination of a direct-acting guide and a linear motor.

[0045] The final crimping device is a device that performs a final crimping operation of final crimping (i.e., hot crimping) the component temporarily crimped to the substrate by the component mounting device 200 to the substrate. In this way, the electrode portion formed on the substrate and the component are electrically connected via the ACF. In other words, through this final crimping, the component is mounted on the substrate, thereby producing a mounted substrate.

[0046] In addition, each device of the component mounting system 10, such as the component mounting device 200, the ACF pasting device, and the formal crimping device, is controlled by a computer. The computer is implemented, for example, by a communication interface for communicating with these devices, a non-volatile memory storing a program, a volatile memory as a temporary storage area for executing the program, an input / output port for sending and receiving signals, and a processor for executing the program. The communication interface can be a connector for connecting a communication line for wired communication, or a wireless communication circuit for wireless communication. In addition, the computer can be implemented by a single computer together with the control device 170 of the component supply device 100, or by a computer different from the control device 170.

[0047] The component supply device 100 is a device for supplying components to the component mounting device 200. Specifically, the component supply device 100 supplies components to the component mounting device 200 by placing the components on the component placement table 220 using the component pickup unit 190. One or more components are placed on the tray 300, and the one or more components are sequentially picked up by the component pickup unit 190. It should be noted that the type and quantity of components placed on the tray 300 are not particularly limited.

[0048] The component supply device 100 includes a tray supply unit 110 , a sensor unit 120 , a paper pickup unit 130 , a tray conveying unit 180 , a component pickup unit 190 , a collection unit 160 , and a control device 170 .

[0049] The tray supply unit 110 is a device that supplies a tray 300 on which components and a release paper 310 covering the components are placed. In the present embodiment, the tray supply unit 110 supplies the tray 300 to the tray conveying unit 180. Specifically, the tray supply unit 110 supplies the tray 300 by placing the tray 300 on the tray stage 150 provided in the tray conveying unit 180.

[0050] In addition, the tray 300 from which the components have been picked up and which has become empty is returned to the tray supply unit 110 .

[0051] The tray supply unit 110 is implemented by a storage warehouse (tray storage warehouse) for storing the trays 300. In the storage warehouse, for example, a plurality of trays 300 each carrying a release paper 310 are arranged in an overlapping state. The lower part of the storage warehouse is an openable and closable door. The trays 300 are delivered by opening and closing the door.

[0052] It should be noted that the mechanism for causing the tray supply unit 110 and the tray stage 150 to transfer the tray 300 may be provided in the tray supply unit 110 or in the tray transport unit 180 .

[0053] The sensor unit 120 is a sensor for detecting the presence or absence of the release paper 310 on the tray 300. In the present embodiment, the sensor unit 120 is a camera that photographs the tray 300 from above. The type of sensor used as the sensor unit 120 is not particularly limited as long as it can detect the presence or absence of the release paper 310 on the tray 300, and can be implemented by a sensor that emits light and detects the reflected light of the light at an object.

[0054] It should be noted that, in the following description, the sensor unit 120 is described as a camera.

[0055] The paper pickup unit 130 is a device that picks up the release paper 310 on the tray 300 supplied from the tray supply unit 110 .

[0056] Figure 4 It is a side view showing a specific structure of the paper pickup unit 130 according to the embodiment.

[0057] The paper pickup unit 130 includes, for example, one or more suction nozzles 131 , a support body 132 , and a lifting mechanism 133 .

[0058] The suction nozzle 131 is a nozzle that sucks and holds the release paper 310. The paper pickup unit 130 picks up the release paper 310 on the tray 300 by, for example, performing suction from the suction nozzle 131 while the suction nozzle 131 is kept away from the release paper 310. In the present embodiment, as a method for the suction nozzle 131 to hold the release paper 310, a method of holding the substrate by vacuum adsorption is adopted. It should be noted that the method for holding the release paper 310 by the suction nozzle 131 is not particularly limited. The suction by the suction nozzle 131 may also be started in a state where the suction nozzle 131 is in contact with the release paper 310.

[0059] In this embodiment, the paper pickup unit 130 includes four suction nozzles so as to be able to suck the four corners of the rectangular release paper 310. The number of suction nozzles 131 included in the paper pickup unit 130 may be one or more than two, and is not particularly limited.

[0060] The support body 132 is a support body for supporting one or more suction nozzles. The support body 132 supports the one or more suction nozzles 131 so that the lower surfaces of the one or more suction nozzles 131 (that is, the positions where the release paper 310 is sucked) are at the same height.

[0061] The lifting mechanism 133 is a device that lifts up and down the support body 132 to lift up and down the one or more suction nozzles 131. For example, the lifting mechanism 133 is realized by a cylinder for moving up and down, an air supply source for driving the cylinder, and a valve.

[0062] It should be noted that the structure for moving the suction nozzle 131 is not particularly limited and can be achieved by a motor or the like.

[0063] The tray transport unit 180 is a device that transports the tray 300 . The tray transport unit 180 includes a transport unit 140 and a tray stage 150 .

[0064] The conveying unit 140 is a conveying mechanism for conveying the tray 300 placed on the tray stage 150 by moving the tray stage 150. In the present embodiment, the conveying unit 140 moves the tray stage 150 in the X-axis direction and the Y-axis direction. The conveying unit 140 is realized by, for example, a linear guide and a linear motor.

[0065] The tray stage 150 is a stage on which the tray 300 is placed. In the present embodiment, two trays 300 can be arranged side by side in the X-axis direction on the tray stage 150. The number of trays arranged on the tray stage 150 may be one or more, and is not particularly limited.

[0066] For example, the tray transport unit 180 receives the tray 300 on which the release paper 310 is placed from the tray supply unit 110, and transports the tray 300 to a position where the paper supply pickup unit 130 picks up the release paper 310 on the tray 300. In the present embodiment, the tray transport unit 180 moves the tray stage 150 below the tray supply unit 110, and receives the tray 300 on which the release paper 310 is placed from the tray supply unit 110. In addition, for example, the transport unit 140 transports the tray 300 on which the release paper 310 is placed to a position where the component pickup unit 190 that supplies components to the component mounting device 200 picks up the components placed on the tray 300. Thus, the component supply device 100 supplies the components to the component mounting device 200. In addition, when the components are picked up and the tray 300 becomes empty, the tray transport unit 180 moves the tray stage 150 below the tray supply unit 110, and returns the tray 300 to the tray supply unit 110.

[0067] Figure 5 It is a plan view for explaining the positional relationship between the devices included in the component supply device 100 according to the embodiment. Figure 5 FIG. 1 shows the positional relationship between the tray supply unit 110, the sensor unit 120, and the paper pickup unit 130, and the tray stage 150 and the collection unit 160. The conveying unit 140 moves the tray stage 150 and the collection unit 160 to the desired position according to the operation performed by the component supply device 100. Figure 5 (a)~ Figure 5 It should be noted that the tray stage 150 and the collection unit 160 move below the tray supply unit 110, the sensor unit 120 and the paper pickup unit 130, but Figure 5 In the figure, the Y-axis direction is staggered for the sake of convenience. Figure 5 In FIG. 1 , two trays placed on the tray stage 150 are denoted by reference numerals in a manner that distinguishes them as tray 301 and tray 302. Figure 5 In the figure, the separation paper 310 on the trays 301 and 302 is omitted.

[0068] For example, the tray supply unit 110, the sensor unit 120, and the paper pickup unit 130 cannot move in the X-axis direction and the Y-axis direction. Therefore, the conveying unit 140 moves the tray stage 150 so that the tray supply unit 110 can transfer the trays 301 and 302 to the tray stage 150, or the sensor unit 120 can capture the trays 301 and 302 placed on the tray stage 150, or the paper pickup unit 130 can pick up the release paper 310 placed on the trays 301 and 302 placed on the tray stage 150.

[0069] Figure 5The position of the tray stage 150 shown in (a) is the position when the tray supply unit 110 and the tray stage 150 transfer the trays 301 and 302 .

[0070] Figure 5 The position of the tray stage 150 shown in (b) is the position when the components placed on the tray 302 are picked up by the component pickup unit 190 .

[0071] Figure 5 The position of the tray stage 150 shown in (c) is the position when the components placed on the tray 301 are picked up by the component pickup unit 190 .

[0072] Figure 5 The position of the tray stage 150 shown in (d) is the position when the sensor unit 120 captures an image of the tray 302 in order to detect the presence or absence of the release paper 310 on the tray 302 .

[0073] Figure 5 The position of the tray stage 150 shown in (e) is the position when the sensor unit 120 captures an image of the tray 301 in order to detect the presence or absence of the release paper 310 on the tray 301 .

[0074] Figure 5 The position of the tray stage 150 shown in (f) is the position when the release paper 310 on the tray 302 is picked up by the paper pickup unit 130 .

[0075] Figure 5 The position of the tray stage 150 shown in (g) is the position when the release paper 310 on the tray 301 is picked up by the paper pickup unit 130 .

[0076] Figure 5 The position of the recovery unit 160 shown in (h) is the position when the paper pickup unit 130 holds the release paper 310 and discards the release paper 310 to the recovery unit 160 .

[0077] Here, for example, when the release paper 310 is placed on the tray 300, the tray transport unit 180 transports the tray 300 at a first speed, and when the release paper 310 is not placed on the tray 300, the tray transport unit 180 transports the tray 300 at a second speed that is faster than the first speed. Specifically, when the release paper 310 is placed on the tray 300, the tray transport unit 180 moves the tray stage 150 at a first speed, and when the release paper 310 is not placed on the tray 300, the tray transport unit 180 moves the tray stage 150 at a second speed that is faster than the first speed. It should be noted that the first speed and the second speed are not particularly limited as long as the second speed is faster than the first speed.

[0078] The recovery unit 160 is a mechanism for recovering the release paper 310 picked up by the paper pickup unit 130. In the present embodiment, the recovery unit 160 is a box body with an upper opening. The release paper 310 picked up by the paper pickup unit 130 is discarded in the recovery unit 160 in a manner of being accommodated in the recovery unit 160. In addition, the recovery unit 160 is arranged in the conveying unit 140 and can be moved by the conveying unit 140. In the present embodiment, the recovery unit 160 is arranged in an X-axis direction with the tray stage 150 (specifically, arranged on the X-axis positive direction side of the tray stage), and moves in the X-axis direction together with the tray stage 150.

[0079] It should be noted that the recovery unit 160 can be implemented by an inclined surface for receiving the release paper 310 picked up by the paper pickup unit 130, and a box connected to the inclined surface for receiving the release paper 310 flowing through the inclined surface. In this case, for example, the inclined surface moves by means of the conveying unit 140, and the box is fixedly arranged at a specific location.

[0080] The component pickup unit 190 is a mechanism that picks up the components placed on the tray 300 supplied from the component supply device 100 and places them on the component placement table 220. The component pickup unit 190 is realized by, for example, a pickup head that picks up the components and a moving mechanism that moves the pickup head. The moving mechanism is realized by, for example, a linear guide and a linear motor.

[0081] The method of holding the components by the component pickup unit 190 is not particularly limited, but in the present embodiment, as a method of picking up components by the component pickup unit 190 , a method of holding the components by vacuum adsorption is adopted.

[0082] The control device 170 is a computer that controls each device of the component supply device 100. Specifically, the control device 170 controls the tray supply unit 110, the sensor unit 120, the paper pickup unit 130, the tray conveying unit 180, and the component pickup unit 190 to make these devices perform various actions. The control device 170 is implemented by, for example, a communication interface for communicating with these devices, a non-volatile memory storing a program, a volatile memory as a temporary storage area for executing the program, an input / output port for sending and receiving signals, and a processor for executing the program. The communication interface may be a connector for connecting a communication line for wired communication, or a wireless communication circuit for wireless communication.

[0083] The control device 170 includes a detection unit 171 , a control unit 172 , and a storage unit 173 .

[0084] The detection unit 171 is a processing unit that detects the presence of the release paper 310 on the tray 300 based on the detection result of the sensor unit 120. For example, the detection unit 171 determines whether the release paper 310 is on the tray 300 based on the image captured by the sensor unit 120.

[0085] The control unit 172 is a processing unit that controls the operation and operation timing of each device included in the component supply device 100 , such as the tray supply unit 110 , the sensor unit 120 , the paper pickup unit 130 , the tray conveying unit 180 , and the component pickup unit 190 .

[0086] The processing units such as the detection unit 171 and the control unit 172 are realized by, for example, a processor, a memory, and a control program stored in the memory and executed by the processor.

[0087] The storage unit 173 is a storage device that stores various data such as the size and shape of each of the tray 300 and the release paper 310, the operation of each device, the timing of the operation, the control program executed by the processing unit, and the information used by the detection unit 171 to detect the release paper 310. The storage unit 173 is implemented by, for example, a flash memory, an HDD (Hard Disk Drive), etc.

[0088] [Processing steps]

[0089] Next, the processing procedure of the component supply device 100 according to the embodiment will be described in detail.

[0090] Figure 6 It is a diagram showing a first example of the processing procedure of the component supply device 100 according to the embodiment. Figure 7 It is a diagram showing a second example of the processing procedure of the component supply device 100 according to the embodiment.

[0091] It should be noted that in Figure 6 as well as Figure 7 In FIG. 1 , the position of the tray stage 150 is indicated by ○. Figure 6 as well as Figure 7 The tray supply position shown is Figure 5 The position of the tray stage 150 shown in (a). Figure 6 as well as Figure 7 The second part pick-up position shown is Figure 5 The position of the tray stage 150 shown in (b). Figure 6 as well as Figure 7 The first part pick-up position shown is Figure 5 The position of the tray stage 150 shown in (c). Figure 6 as well as Figure 7 The paper recycling location shown is Figure 5The position of the recovery unit 160 shown in (h). Figure 6 as well as Figure 7 The second camera position shown is Figure 5 The position of the tray stage 150 shown in (d). Figure 6 as well as Figure 7 The first camera position shown is Figure 5 The position of the tray stage 150 shown in (e). Figure 6 as well as Figure 7 The second paper pick-up position shown is Figure 5 The position of the tray stage 150 shown in (f). In addition, Figure 6 as well as Figure 7 The first paper pick-up position shown is Figure 5 The position of the tray stage 150 is shown in (g).

[0092] In addition, for example, Figure 6 as well as Figure 7 The first tray shown is tray 301 and the second tray is tray 302 .

[0093] In addition, the empty tray refers to the tray 301 or 302 on which all components are picked up and no components are placed.

[0094] In addition, Figure 6 as well as Figure 7 In the "Presence or absence of paper" item, the state where the release paper 310 is placed on the trays 301 and 302 is indicated as "Presence or absence of paper", and the state where the release paper 310 is not placed on the trays 301 and 302 is indicated as "No" in the "Presence or absence of paper" item. Figure 6 as well as Figure 7 In the drawings, the release paper 310 is simply described as paper.

[0095] <First example>

[0096] First, a first example of the processing procedure of the component supply device 100 will be described.

[0097] like Figure 6 As shown, first, the conveying unit 140 moves the tray stage 150 to the tray supply position. Here, the tray stage 150 receives the first tray and the second tray from the tray supply unit 110 (S101).

[0098] Next, the conveying unit 140 moves the tray stage 150 to the second camera position ( S102 ).

[0099] Next, the sensor unit 120 captures an image of the second tray, and the detection unit 171 determines (confirms) the presence or absence of the release paper 310 on the second tray based on the image capture result of the sensor unit 120 (S103). If the release paper 310 is not detected, the process proceeds to step S108.

[0100] When the release paper 310 is detected, the conveying unit 140 moves the tray stage 150 to the second paper pickup position ( S104 ).

[0101] Next, the paper pickup unit 130 picks up the release paper 310 on the second tray ( S105 ).

[0102] Next, the conveying unit 140 moves the tray stage 150 to the paper collecting position to move the collecting unit 160 below the paper pickup unit 130 ( S106 ).

[0103] Next, the paper pickup unit 130 discards the picked-up release paper 310 to the collection unit 160 ( S107 ).

[0104] Next, the conveying unit 140 moves the tray stage 150 to the first camera position ( S108 ).

[0105] Next, the sensor unit 120 captures an image of the first tray, and the detection unit 171 determines (confirms) the presence or absence of the release paper 310 on the first tray based on the image capture result of the sensor unit 120 (S109). If the release paper 310 is not detected, the process proceeds to step S114.

[0106] When the release paper 310 is detected, the conveying unit 140 moves the tray stage 150 to the first paper pickup position ( S110 ).

[0107] Next, the paper pickup unit 130 picks up the release paper 310 on the first tray ( S111 ).

[0108] Next, the conveying unit 140 moves the collecting unit 160 to the paper collecting position (below the paper pickup unit 130 in the present embodiment) ( S112 ).

[0109] Next, the paper pickup unit 130 discards the picked-up release paper 310 to the collection unit 160 (S113).

[0110] Next, the conveying unit 140 moves the tray stage 150 to the second component pickup position ( S114 ).

[0111] Next, the component pickup unit 190 picks up the component placed on the second tray (S115). The picked-up component is placed on the component placement table 220. The component placed on the component placement table 220 is picked up by the component mounting device 200 and placed on the substrate 400. By repeating this process, one or more components placed on the second tray are sequentially placed on the substrate 400.

[0112] Here, when the second tray becomes an empty tray, the conveying unit 140 moves the tray stage 150 to the first component pickup position ( S116 ).

[0113] Next, the component pickup unit 190 picks up the component placed on the first tray (S117). The picked-up component is placed on the component placement table 220. The component placed on the component placement table 220 is picked up by the component mounting device 200 and placed on the substrate 400. By repeating this process, one or more components placed on the first tray are sequentially placed on the substrate 400.

[0114] Here, when the first tray becomes an empty tray, the conveying unit 140 moves the tray stage 150 to the tray supply position ( S118 ).

[0115] Next, the tray stage 150 returns the first tray and the second tray, which are empty trays, to the tray supply unit 110 (S119).

[0116] For example, by repeating steps S101 to S119 , components are repeatedly supplied to the component mounting device 200 .

[0117] Here, in step S102 to step S110, the release paper 310 is placed on at least one of the first tray and the second tray placed on the tray stage 150. Therefore, in step S102 to step S110, the conveying unit 140 moves the tray stage 150 at the first speed, that is, slowly.

[0118] On the other hand, in steps S112 to S118, the release paper 310 is not placed on either the first tray or the second tray placed on the tray stage 150. Therefore, in steps S112 to S118, the conveying unit 140 moves the tray stage 150 at the second speed, that is, at a faster speed.

[0119] It should be noted that the execution order of steps S102 to S107 and steps S108 to S113 may also be opposite to the above.

[0120] In addition, the execution order of step S114 and step S115 and step S116 and step S117 may be opposite to that described above.

[0121] <Second example>

[0122] Next, a second example of the processing steps of the component supply device 100 is described. In the first example, when both the first tray and the second tray become empty trays, the conveying unit 140 returns both the first tray and the second tray together and receives new first tray and second tray. Here, in the component mounting device 200, when the loading of components on a certain substrate 400 is completed, the substrate 400 is moved out downstream, and a new substrate 400 without components mounted thereon is moved in. When the substrate 400 is being transported, the components cannot be loaded on the substrate 400. Therefore, in the second example, the tray conveying unit 180 returns the empty tray and receives a new tray when the substrate 400 is being transported.

[0123] In the second example, first, similar to the first example, execute Figure 6 That is, the second tray becomes an empty tray, and the components placed on the first tray are picked up by the component picking unit 190 one by one.

[0124] Here, for example, after the placement of components on the substrate 400 is completed, the substrate 400 is unloaded and a new substrate 400 is loaded in the component mounting device 200. In this case, regardless of whether the first tray is an empty tray, the second tray is collected. Specifically, Figure 7 As shown, the conveying unit 140 moves the tray stage 150 to the tray supply position (S201). Next, the tray stage 150 returns the second tray, which is an empty tray, to the tray supply unit 110 (S202).

[0125] Here, for example, when the loading of a new substrate 400 is completed in the component mounting device 200 , the conveying unit 140 moves the tray stage 150 to the first component pickup position even if a new second tray is not received ( S203 ).

[0126] Next, the component pickup unit 190 picks up the components placed on the first tray ( S204 ).

[0127] Here, for example, after the placement of the components on the substrate 400 is completed, the substrate 400 is unloaded and a new substrate 400 is loaded again in the component mounting device 200. In this case, the conveying unit 140 moves the tray stage 150 to the tray supply position (S205). In addition, the tray stage 150 receives a new second tray from the tray supply unit 110 (S206).

[0128] Here, for example, when a new substrate 400 has been loaded into the component mounting device 200 again, even if the pickup of the release paper 310 on the new second tray has not been completed, the conveying unit 140 moves the tray stage 150 to the first component pickup position ( S207 ).

[0129] Next, the component pickup unit 190 picks up the components placed on the first tray ( S208 ).

[0130] Here, for example, the loading of the components on the substrate 400 is completed, and the substrate 400 is unloaded and a new substrate 400 is loaded in the component mounting device 200 again. In this case, the conveying unit 140 performs an action of recovering the release paper 310 on the second tray (paper recovery action) (S209). Specifically, steps S209a to S209f are performed in the same manner as steps S102 to S107. First, the conveying unit 140 moves the tray stage 150 to the second camera position (S209a), and then the sensor unit 120 photographs the second tray, and the detection unit 171 determines (confirms) the presence or absence of the release paper 310 on the second tray based on the photographing result of the sensor unit 120 (S209b). When the release paper 310 is not detected here, the process moves to step S210. When the separator paper 310 is detected, the conveying unit 140 moves the tray stage 150 to the second paper pickup position (S209c), and the paper pickup unit 130 picks up the separator paper 310 on the second tray (S209d). Then, the conveying unit 140 moves the collection unit 160 to the paper collection position (S209e), and the paper pickup unit 130 discards the collected separator paper 310 to the collection unit 160 (S209f).

[0131] Through the above-mentioned processing, in the second example, when the substrate 400 is transported by the component mounting device 200, the second pallet is supplied from the pallet supply unit 110 to the pallet transport unit 180 and the isolation paper 310 on the supplied pallet 300 is properly discarded, thereby preparing the pallet in a manner that allows the component picking unit 190 to pick up the component placed on the second pallet.

[0132] Next, the conveying unit 140 moves the tray stage 150 to the first component pickup position ( S210 ).

[0133] Next, the component pickup unit 190 picks up the component placed on the first tray ( S211 ). The picked-up component is placed on the component placement table 220 . The component placed on the component placement table 220 is picked up by the component mounting device 200 and placed on the substrate 400 .

[0134] Here, when the first tray becomes an empty tray, the conveying unit 140 moves the tray stage 150 to the second component pickup position ( S212 ).

[0135] Next, the component pickup unit 190 picks up the component placed on the second tray ( S213 ). The picked-up component is placed on the component placement table 220 . The component placed on the component placement table 220 is picked up by the component mounting device 200 and placed on the substrate 400 .

[0136] Here, for example, when the placement of components on the substrate 400 is completed, the substrate 400 is unloaded and a new substrate 400 is loaded again in the component mounting device 200. In this case, the conveying unit 140 moves the tray stage 150 to the tray supply position (S214). Then, the tray stage 150 returns the first tray, which becomes an empty tray, to the tray supply unit 110 (S215).

[0137] Here, for example, when the loading of a new substrate 400 is completed in the component mounting device 200 , the conveying unit 140 moves the tray stage 150 to the second component pickup position even if a new first tray is not received ( S216 ).

[0138] Next, the component pickup unit 190 picks up the components placed on the second tray ( S217 ).

[0139] Here, for example, when the placement of components on the substrate 400 is completed, the substrate 400 is unloaded and a new substrate 400 is loaded again in the component mounting device 200. In this case, the conveying unit 140 moves the tray stage 150 to the tray supply position (S218). In addition, the tray stage 150 receives a new first tray from the tray supply unit 110 (S219).

[0140] Here, for example, when a new substrate 400 is loaded again in the component mounting device 200, even if the pickup of the release paper 310 on the new first tray is not completed, the conveying unit 140 moves the tray stage 150 to the second component pickup position (S220).

[0141] Next, the component pickup unit 190 picks up the components placed on the second tray ( S221 ).

[0142] Here, for example, the loading of the components on the substrate 400 is completed, and the substrate 400 is unloaded and a new substrate 400 is loaded in the component mounting device 200 again. In this case, the conveying unit 140 performs an action of recovering the release paper 310 on the first tray (paper recovery action) (S222). Specifically, steps S222a to S222f are performed in the same manner as steps S108 to S113. First, the conveying unit 140 moves the tray stage 150 to the first camera position (S222a), and then the sensor unit 120 photographs the first tray, and the detection unit 171 determines (confirms) the presence or absence of the release paper 310 on the first tray based on the photographing result of the sensor unit 120 (S222b). When the release paper 310 is not detected here, move to step S114. When the release paper 310 is detected, the conveying unit 140 moves the tray stage 150 to the first paper pickup position (S222c), and the paper pickup unit 130 picks up the release paper 310 on the first tray (S222d). Then, the conveying unit 140 moves the collection unit 160 to the paper collection position (S222e), and the paper pickup unit 130 discards the picked-up release paper 310 to the collection unit 160 (S222f).

[0143] Then, for example, by repeating step S114 to step S222 , components are repeatedly supplied to the component mounting device 200 .

[0144] Here, in steps 206 to S209c and steps 219 to S222c, the release paper 310 is placed on at least one of the first tray and the second tray placed on the tray stage 150. Therefore, in these steps, the conveying unit 140 moves the tray stage 150 at the first speed, that is, slowly.

[0145] On the other hand, in steps 201 to S205, steps 209e to S218, and steps S222d to S222f, the release paper 310 is not placed on either the first tray or the second tray placed on the tray stage 150. Therefore, in these steps, the conveying unit 140 moves the tray stage 150 at the second speed, that is, faster.

[0146] <Conclusion>

[0147] Figure 8 1 is a flowchart showing the processing procedure of the component supply device 100 according to the embodiment.

[0148] First, the tray supply unit 110 supplies the tray 300 on which the components and the release paper 310 covering the components are placed to the tray conveyor 180 ( S10 ). Specifically, the tray supply unit 110 places the tray 300 on the tray stage 150 , and the tray conveyor 180 receives the tray 300 from the tray supply unit 110 .

[0149] Next, the tray transport unit 180 transports the tray 300 to a position where the paper pickup unit 130 picks up the release paper 310 on the tray 300 ( S20 ).

[0150] Next, the paper pickup unit 130 picks up the release paper 310 on the tray 300 ( S30 ).

[0151] Next, the tray transport unit 180 transports the tray 300 on which the release paper 310 has been picked up to a position (component pickup position) where the component pickup unit 190 picks up components placed on the tray 300 ( S40 ).

[0152] Components placed on the tray 300 conveyed to the component pickup position are sequentially picked up by the component pickup unit 190. The tray 300 that has become empty without components is conveyed to the tray supply unit 110 by, for example, the tray conveying unit 180 and is recovered in the tray supply unit 110.

[0153] These operations are performed by, for example, the control unit 172 controlling each device.

[0154] (Effects, etc.)

[0155] Hereinafter, the technology obtained based on the disclosure of this specification is exemplified, and the effects etc. obtained based on the exemplified technology are described.

[0156] Technology 1 is a component supply device 100, which includes: a tray supply unit 110, which supplies a tray 300 carrying components and isolation paper 310 covering the components; a paper picking unit 130, which picks up the isolation paper 310 on the tray 300 supplied from the tray supply unit 110; and a tray conveying unit 180, which receives the tray 300 carrying the isolation paper 310 from the tray supply unit 110, conveys the tray 300 to a position where the paper supply picking unit 130 picks up the isolation paper 310 on the tray 300, and conveys the tray 300 with the isolation paper 310 picked up to a position where the component picking unit 190 picks up the components placed on the tray 300, and the component picking unit 190 supplies the components to the component mounting device 200.

[0157] In the past, the separator paper 310 placed on the tray 300 was removed by an operator. However, in such a method, there is a situation where labor costs increase or operational errors such as turning over the tray 300 occur, resulting in the parts being unusable. Therefore, the component supply device 100 removes the separator paper 310 on the tray 300 by picking up the separator paper 310 on the tray 300 using the paper pickup unit 130. In other words, according to the component supply device 100, the separator paper 310 on the tray 300 can be automatically removed. Therefore, according to the component supply device 100, the labor costs involved in the operator removing the separator paper 310 can be suppressed, and the loss of parts caused by the operator's operational errors can be suppressed. Therefore, the cost of supplying parts to the component mounting device 200 can be suppressed, and thus the reduction in productivity of the component mounting system 10 can be suppressed.

[0158] In the second technique, based on the component supply device 100 described in the first technique, the paper pickup unit 130 includes a suction nozzle 131 , and the release paper 310 on the tray 300 is picked up by suction from the suction nozzle 131 while the suction nozzle 131 is kept away from the release paper 310 .

[0159] Thus, the paper pickup unit 130 (more specifically, the suction nozzle 131 included in the paper pickup unit 130) can pick up the release paper 310 by suction without contacting the components placed on the tray 300. Therefore, it is possible to prevent the paper pickup unit 130 from causing damage such as scratches to the components placed on the tray 300 when picking up the release paper 310.

[0160] Technology 3 is based on the component supply device 100 described in Technology 1 or 2. When the tray 300 is loaded with isolation paper 310, the tray conveying unit 180 conveys the tray 300 at a first speed. When the tray 300 is not loaded with isolation paper 310, the tray conveying unit 180 conveys the tray 300 at a second speed faster than the first speed.

[0161] That is, when the release paper 310 is placed on the tray 300, the tray stage 150 on which the tray 300 is placed moves slowly, and when the release paper 310 is not placed on the tray 300, the tray stage 150 on which the tray 300 is placed moves quickly. Thus, when the release paper 310 is placed on the tray 300, it is possible to suppress the release paper 310 from scattering during the transportation of the tray 300. In addition, when the release paper 310 is not placed on the tray 300, the tray 300 can be transported quickly, so that the time involved in the transportation of the tray 300 can be shortened.

[0162] The fourth technique is the component supply device 100 described in any one of the first to third techniques, and the component supply device 100 includes a recovery unit 160 that recovers the release paper 310 picked up by the paper pickup unit 130 .

[0163] Thereby, the release papers 310 can be collected uniformly and efficiently.

[0164] Technology 5 is a component supply method, which is a component supply method performed by a component supply device 100 having a tray supply unit 110, a paper picking unit 130 and a tray conveying unit 180, wherein the component supply method has the following steps: the tray supply unit 110 supplies a tray 300 carrying components and a separation paper 310 covering the components to the conveying unit 140, the tray conveying unit 180 conveys the tray 300 to a position where the paper supply picking unit 130 picks up the separation paper 310 on the tray 300, the paper picking unit 130 picks up the separation paper 310 on the tray 300, the tray conveying unit 180 conveys the tray 300 with the separation paper 310 picked up to a position where the component picking unit 190 picks up the components placed on the tray 300, and the component picking unit 190 supplies the components to the component mounting device 200.

[0165] This achieves the same effects as those of the component supply device 100 .

[0166] It should be noted that these general or specific solutions can be implemented by systems, methods, integrated circuits, computer programs, or computer-readable recording media such as CD-ROMs, or by any combination of systems, methods, integrated circuits, computer programs, and recording media. For example, the present invention can also be implemented as a control device having a control unit 172, which causes the tray supply unit 110 to supply a tray 300 carrying a component and a release paper 310 covering the component to the tray conveying unit 180, causes the tray conveying unit 180 to convey the tray 300 to a position where the paper supply pickup unit 130 picks up the release paper 310 on the tray 300, causes the paper pickup unit 130 to pick up the release paper 310 on the tray 300, and causes the tray conveying unit 180 to convey the tray 300 with the release paper 310 picked up to a position where the component pickup unit 190 for supplying the component to the component mounting device 200 picks up the component placed on the tray 300. In addition, the present invention can also be implemented as a control method for executing the above-mentioned processing steps executed by the control unit 172. In addition, the present invention may be implemented as a program that causes a computer to execute the control method. For example, in addition, the present invention may be implemented as a non-transitory recording medium that stores the program and is readable by a computer.

[0167] (Other embodiments)

[0168] As mentioned above, although the component supply device and the like according to the present embodiment have been described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments.

[0169] For example, all or part of the components of the processing unit of the component supply device may be formed by dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may also be realized by a program execution unit such as a CPU (Central Prosessing Unit) or a processor reading and executing a software program recorded in a recording medium such as a HDD or a semiconductor memory.

[0170] Furthermore, the components of the processing unit of the component supply device may be composed of one or more electronic circuits. The one or more electronic circuits may be general-purpose circuits or dedicated circuits.

[0171] In one or more electronic circuits, for example, semiconductor devices, ICs or LSIs (Large Scale Integration) may be included. ICs or LSIs may be integrated into one chip or into multiple chips. Although they are referred to as ICs or LSIs, the names may vary depending on the degree of integration, and may also be referred to as system LSIs, VLSIs (Very Large Scale Integration) or ULSIs (Ultra Large Scale Integration). In addition, FPGAs (Field Programmable Gate Arrays) programmed after LSI manufacturing can also be used for the same purpose.

[0172] It should be noted that the present invention can be implemented not only as a component supply device, but also as a program including the processes performed by the components of the component supply device as steps, and a computer-readable DVD (Digital Versatile Disc) or other recording medium having the program recorded thereon. In other words, the above-mentioned general or specific scheme can be implemented by a system, a device, an integrated circuit, a computer program, or a computer-readable non-temporary recording medium, or by any combination of a system, a device, an integrated circuit, a computer program, and a recording medium.

[0173] Furthermore, various modifications that can be conceived by those skilled in the art to the embodiments and any combinations of components and functions in the embodiments without departing from the gist of the present disclosure are also included in the present invention.

[0174] Industrial Applicability

[0175] The present invention can be utilized in a component supplying device for supplying components to a component mounting device for mounting components on a substrate.

Claims

1. A component supply device, comprising: a tray supplying unit for supplying a tray on which components and a release paper covering the components are placed; a paper picking-up unit that picks up the release paper on the tray supplied from the tray supply unit; and A tray conveying unit receives the tray carrying the isolation paper from the tray supply unit, conveys the tray to a position where the paper picking unit picks up the isolation paper on the tray, and conveys the tray with the isolation paper picked up to a position where a component picking unit picks up the component placed on the tray, and the component picking unit supplies the component to a component mounting device.

2. The component supply device according to claim 1, wherein: The paper pickup unit includes a suction nozzle, and picks up the release paper on the tray by performing suction from the suction nozzle in a state where the suction nozzle is kept away from the release paper.

3. The component supply device according to claim 1 or 2, wherein: When the release paper is placed on the tray, the tray transport unit transports the tray at a first speed. When the release paper is not placed on the tray, the tray transport unit transports the tray at a second speed that is faster than the first speed.

4. The component supply device according to claim 1 or 2, wherein: The component supply device includes a recovery unit that recovers the release paper picked up by the paper pickup unit.

5. A component supply method, which is performed by a component supply device having a tray supply unit, a paper pickup unit, and a tray conveying unit, wherein: The component supply method comprises the following steps: The tray supply unit supplies a tray on which components and release paper covering the components are placed to the tray conveying unit. The tray conveying unit conveys the tray to a position where the paper picking unit picks up the release paper on the tray. The paper picking unit picks up the release paper on the tray. The tray transporting unit transports the tray on which the release paper is picked up to a position where a component picking unit picks up the component placed on the tray, and the component picking unit supplies the component to a component mounting device.

Images