Polyaryletherketone resin containing imide side group and preparation method of polyaryletherketone resin

By introducing imide side-group structure into polyaryletherketone resin and combining the characteristics of polyimide, the problem of how to improve the performance of polyaryletherketone materials is solved, and high performance, heat resistance and applicability are achieved. promote.

CN119390967AInactive Publication Date: 2025-02-07山东君昊高性能聚合物有限公司 +1

Patent Information

Application Number
CN202411516988.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-29
Publication Date
2025-02-07
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

How to combine polyaryletherketone resin with polyimide to obtain new materials with better performance and meet the needs of high-performance, electronic and optical materials.

Method used

By introducing an imide structure into the amino group-containing diphenol monomer, a variety of polyaryletherketone materials containing pendant imide groups were designed and synthesized, and these materials were prepared by salt formation and polycondensation reaction.

Benefits of technology

The obtained polyaryletherketone resin containing pendant imide has excellent heat resistance and better overall performance, and is suitable for the application of composite materials and new energy materials.

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Abstract

The invention relates to the technical field of polymer synthesis, in particular to polyaryletherketone resin containing imide side groups and a preparation method of the polyaryletherketone resin. By introducing an imide structure into aryl diphenol containing amino, a plurality of polyaryletherketone resins containing imide side groups are designed and synthesized, and are used for meeting various application requirements, such as high-performance materials, electronic materials, optical materials and the like; meanwhile, the performance of the polyaryletherketone material is also improved, so that the polyaryletherketone material is more suitable for various application environments.
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Description

Technical Field

[0001] The invention relates to the technical field of polymer synthesis, and in particular to a polyaryletherketone resin containing imide side groups and a preparation method thereof. Background Art

[0002] Polyarylether is a kind of heat-resistant polymer material with excellent comprehensive performance, including polyaryletherketone and polyarylethersulfone, which have the advantages of high heat resistance, high mechanical properties and chemical stability, excellent film-forming performance and low dielectric constant. In particular, polyaryletherketone resin can still maintain good electrical insulation and small dielectric constant and dielectric loss under a wide range of temperature and high frequency, and is an ideal insulating material. Polyimide (PI) refers to an aromatic heterocyclic polymer containing an imide ring on the molecular chain segment. The molecular chain not only has a stable imide heterocyclic structure, but also contains a stable aromatic ring structure. It is a semi-trapezoidal ring chain polymer that exhibits many special properties. As a special engineering plastic, polyimide has been widely used in aerospace, microelectronics, nano, liquid crystal, separation membrane, laser and other fields. How to combine the two to obtain a new material with better performance is the technical problem to be solved by the present invention. Summary of the invention

[0003] In order to solve the above technical problems, a polyaryletherketone resin containing imide side groups and a preparation method thereof are provided. The present invention introduces an imide structure into an amino-containing diphenol monomer to design and synthesize a variety of polyaryletherketone materials containing imide side groups, which are used to meet various application requirements, such as high-performance materials, electronic materials, and optical materials; at the same time, the performance of the polyaryletherketone material is improved, making it more suitable for various application environments.

[0004] In order to achieve the above objectives, the present invention is implemented by the following technical solutions:

[0005] A polyaryletherketone resin containing an imide side group has a chemical structure of the following formula I or formula II:

[0006]

[0007]

[0008] In Formula I or Formula II, x=1 or 2, and There is no X group (i.e., a biphenyl structure), or the X group is one of the following groups:

[0009]

[0010] in It represents the bond connecting the left and right benzene rings with imide side groups.

[0011] Furthermore, n represents the degree of polymerization, and the polyaryletherketone resin containing imide side groups has a number average molecular weight of 10,000 to 30,000 g / mol, a weight average molecular weight of 30,000 to 60,000 g / mol, and a PDI in the range of 1-3.

[0012] The preparation method of the polyaryletherketone resin containing imide side groups comprises the following steps:

[0013] Under a protective atmosphere and with stirring, an imide-containing aromatic bisphenol monomer, a difluoroaryl ketone monomer, a salt-forming agent, and an azeotroping agent are dissolved in a reaction solvent, and a salt-forming reaction is first performed, and the azeotropes are removed after azeotropy, and then the temperature is raised to perform a polycondensation reaction, and a polymer is precipitated out by a poor solvent to obtain a polyaryletherketone resin containing an imide side group;

[0014] The chemical structure of the imide-containing aromatic bisphenol monomer is one of the following:

[0015]

[0016] There is no X group, or the X group is one of the following groups:

[0017]

[0018] in It represents the bond connecting the left and right benzene rings with imide side groups.

[0019] Furthermore, the difluoroaryl ketone monomer is selected from one or more of 4,4'-difluorobenzophenone and 4,4'-difluorotriphenyldione; the salt-forming agent is anhydrous sodium carbonate and / or anhydrous potassium carbonate; the reaction solvent is selected from one of N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), and N-methylpyrrolidone (NMP); and the azeotropic agent is one of benzene, toluene, and xylene.

[0020] Further, the molar number of the difluoroaryl ketone monomer is 0.98 to 1.02 times the molar number of the imide-containing aromatic bisphenol monomer;

[0021] The amount of the salt-forming agent used is 1.02 to 1.3 times the molar number of the imide-containing aromatic bisphenol monomer used;

[0022] The amount of the reaction solvent used is such that the mass fraction of the total material in the entire reaction system is 20%-35%.

[0023] Further, after the addition of the imide-containing aromatic bisphenol monomer, the difluoro aromatic ketone monomer, the salt-forming agent, the entrainer and the reaction solvent is completed, the temperature is first raised to 60-80° C. and stirred until the solid material is dissolved, and then the temperature is raised to carry out the subsequent reaction;

[0024] The temperature of the salt-forming reaction is 120-140°C, the reaction time is 1-2h, and the water in the system is removed by azeotropy; the temperature of the polycondensation reaction is 160-180°C, and the reaction time is 4-12h;

[0025] The poor solvent used for the precipitation is water or an alcohol solvent, and the precipitated product can be washed repeatedly and then dried.

[0026] Furthermore, the imide-containing aromatic bisphenol monomer is obtained by the following method:

[0027] Under protective atmosphere and stirring, amino-containing aromatic diphenol and monoanhydride compound are put into an organic solvent, and after being uniformly dissolved, they are pre-reacted at room temperature; then acetic anhydride is added to continue the reaction at room temperature; then triethylamine or pyridine is added to continue the reaction, and after the reaction is completed, a precipitate is precipitated in a poor solvent, and the precipitate is repeatedly washed and recrystallized to obtain an aromatic diphenol monomer containing imide.

[0028] Furthermore, the amino-containing aromatic diphenol has the following structure:

[0029]

[0030] There is no X group, or the X group is one of the following groups:

[0031]

[0032] in It represents the bond connecting the left and right benzene rings with imide side groups.

[0033] Preferably, the amino-containing aromatic diphenol is selected from 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (CAS No.: 83558-87-6), bis(3-amino-4-hydroxyphenyl)sulfone (CAS No.: 7545-50-8), 2,2-bis(3-amino-4-hydroxyphenyl)propane (CAS No.: 1220-78-6), 3,3'-dihydroxybenzidine (CAS No.: 2373-98-0), and 9,9-bis(3-amino-4-hydroxyphenyl)fluorene (CAS No.: 20638-07-7);

[0034] The monoanhydride compound is selected from one of phthalic anhydride (CAS No.: 85-44-9) and 1,8-naphthalic anhydride (CAS No.: 81-84-5);

[0035] The organic solvent is selected from one of N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP) or m-cresol (m-Cresol).

[0036] Furthermore, the molar number of the monoanhydride compound is 2.1 to 2.5 times the molar number of the amino-containing aromatic diphenol; the amount of the organic solvent is such that the solid content of the system material accounts for 20wt%-35wt%;

[0037] The usage ratio of the acetic anhydride to the monoanhydride compound is 7-8 mL:0.1 mol;

[0038] The usage ratio of the triethylamine or the pyridine to the monoanhydride compound is 7-8 mL:0.1 mol.

[0039] Further, the pre-reaction time is 4-8 hours; the reaction time after adding the acetic anhydride is 0.5-1 hour; after adding the triethylamine, the reaction is continued at room temperature for 0.5-1 hour, or after adding the pyridine, the temperature is raised to 80-120° C. and the reaction is continued for 0.5-1 hour;

[0040] The washed and dried precipitate was recrystallized using a mixture of ethyl acetate and toluene.

[0041] Beneficial technical effects:

[0042] By introducing imide ring side chains into polyaryletherketone, the polymer has both polyarylether and imide characteristic structures and has better performance; the improved polyaryletherketone material with imide side groups has excellent heat resistance; by introducing larger side chains, the free volume of the polymer is increased, and the polymer is further functionalized so that it can be applied to composite materials and new energy materials to meet various application needs, such as high-performance materials, electronic materials and optical materials; at the same time, the performance of the polyaryletherketone material is also improved, making it more suitable for various application environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 The stress-strain curves of the polyaryletherketone resins containing imide side groups of different chemical structures prepared in Examples 1 to 4 are shown. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present invention will be described clearly and completely below in combination with the embodiments of the present invention and the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. All other embodiments obtained by ordinary technicians in this field without creative work based on the embodiments of the present invention are within the scope of protection of the present invention.

[0045] Unless otherwise specifically stated, the numerical value set forth in these embodiments does not limit the scope of the present invention. The technology and method known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology and method should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values.

[0046] The experimental methods in the following examples without specifying specific conditions are usually measured in accordance with national standards; if there is no corresponding national standard, they are carried out in accordance with general standard requirements or general methods.

[0047] Note: Diphenol monomer and bisphenol monomer have the same meaning, that is, both have two hydroxyl groups.

[0048] Example 1

[0049] A method for preparing a polyaryletherketone resin containing imide side groups is as follows:

[0050] (1) Synthesis of bisphenol AF containing imide

[0051]

[0052] In a 1000mL three-necked flask equipped with a reflux condenser, a nitrogen inlet and outlet, and an electric stirrer, 322gDMF, 73.25g (0.2mol) 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, and 65.17g (0.44mol) phthalic anhydride were added in sequence. Stir and dissolve at room temperature and react for 6h. Then 31mL acetic anhydride was added and stirring continued for 1h. Then 31mL triethylamine was added and stirring continued for 1h. After the reactants were cooled to room temperature, they were poured into a poor solvent such as pure water, and the obtained precipitate was repeatedly washed with pure water. After the product was dried, it was recrystallized with a mixture of ethyl acetate / toluene. After filtering and drying the crystallized product, the imide-containing aromatic bisphenol monomer a, imide-containing bisphenol AF, was obtained. The yield was 73%.

[0053] Bisphenol AF containing imide 1 H NMR:δH(DMSO-d6 ,400MHz)10.45(s,2H,OH),7.85-7.95(m,8H,Ar-H),7.40(s,2H,Ar-H),7.20-7.25(d,2H,Ar-H),7.05-7.10(d,2H,Ar-H).

[0054] FTIR of bisphenol AF containing imide (cm -1 ):3390(-OH),1785(imide,C=O),1716(imide,C=O),1387(CN),1253(CF 3 ).

[0055] The DSC Tm of imide-containing bisphenol AF is 192-194°C.

[0056] (2) Synthesis of bisphenol AF type polyaryletherketone containing imide side groups

[0057]

[0058] In a 1000 mL three-necked flask equipped with a mechanical stirrer, a nitrogen inlet and outlet, a water separator and a reflux condenser, 62.65 g (0.1 mol) of diphenol monomer a (bisphenol AF containing imide in step 1), 21.82 g (0.1 mol) of 4,4'-difluorobenzophenone, 18.0 g (0.13 mol) of anhydrous K 2 CO 3 , 235 g DMF and 25 mL toluene. 2 In an atmosphere, stir at 60°C until the solid material is completely dissolved. After stirring and heating at 140°C for 2 hours, the generated water and toluene are azeotroped, and the azeotrope is removed through a water separator. Then, at 160°C, continue to stir and carry out polymerization reaction for 7 hours to obtain a viscous mixed solution; pour the viscous mixed solution into a mixed solution of 600mL ethanol and water (volume ratio 1:1) to precipitate the polymer; soak it in hot ethanol aqueous solution (ethanol to water volume ratio 1:2, temperature 80°C) for 30 minutes, repeat three times, filter and dry to obtain bisphenol AF type polyaryletherketone containing imide side groups.

[0059] Example 2

[0060] A method for preparing a polyaryletherketone resin containing imide side groups is as follows:

[0061] (1) Synthesis of imide-containing biphenol

[0062]

[0063] In a 1000mL three-necked flask equipped with a reflux condenser, a nitrogen inlet and outlet, and an electric stirrer, 335g NMP, 64.87g (0.3mol) 3,3'-dihydroxybenzidine, and 97.76g (0.66mol) phthalic anhydride were added in sequence. Stir and dissolve at room temperature and react for 8h. Then add 48mL acetic anhydride and continue stirring for 1h. Then add 48mL triethylamine and continue stirring for 1h. After the reactants are cooled to room temperature, pour them into a poor solvent such as pure water, and the obtained precipitate is repeatedly washed with pure water. After the product is dried, it is recrystallized with a mixture of ethyl acetate / toluene. After filtering and drying the crystallized product, the imide-containing aromatic bisphenol monomer b-imide-containing biphenol is obtained. The yield is 73%.

[0064] Imido-containing biphenol 1 H NMR:δH(DMSO-d 6 ,400MHz)10.10(s,2H,OH),7.90-8.0(m,8H,Ar-H),7.35(d,2H,Ar-H),7.20(s,2H,Ar-H),7.15(d,2H,Ar-H).

[0065] FTIR of diphenol containing imide (cm -1 ):3318(-OH),1779,1760(imide,C=O),1715,1703(imide,C=O),1382(CN).

[0066] The DSC:Tm of the imide-containing biphenol is 340°C.

[0067] (2) Synthesis of biphenyl poly(aryletherketone) containing imide side groups

[0068]

[0069] In a 1000 mL three-necked flask equipped with a mechanical stirrer, a nitrogen inlet and outlet, a water separator and a reflux condenser, 71.47 g (0.15 mol) of diphenol monomer b (the imide-containing biphenol in step 1), 32.73 g (0.15 mol) of 4,4'-difluorobenzophenone, and 26.95 g (0.2 mol) of anhydrous K 2 CO 3 , 245 g DMAc and 25 mL toluene. 2Under the atmosphere, stir at 60°C until the solid material is completely dissolved. After stirring and heating at 140°C for 2h, the generated water and toluene are azeotroped, and the azeotrope is removed through a water separator. Then, at 170°C, continue to stir and carry out the polymerization reaction for 6h to obtain a viscous mixed solution; pour the viscous mixed solution into a mixed solution of 600mL ethanol and water (volume ratio 1:1) to precipitate the polymer; soak it in hot ethanol aqueous solution (ethanol to water volume ratio 1:1, temperature 80°C) for 30min, repeat three times, filter and dry to obtain a biphenyl-type polyaryletherketone containing imide side groups.

[0070] Example 3

[0071] A method for preparing a polyaryletherketone resin containing imide side groups is as follows:

[0072] (1) Synthesis of bisphenol sulfone containing imide

[0073]

[0074] In a 1000mL three-necked flask equipped with a reflux condenser, a nitrogen inlet and outlet, and an electric stirrer, 335g DMAc, 84.09g (0.3mol) bis(3-amino-4-hydroxyphenyl) sulfone, and 97.76g (0.66mol) phthalic anhydride were added in sequence. Stir and dissolve at room temperature and react for 6h. Then add 50mL acetic anhydride and continue stirring for 1h. Then add 50mL triethylamine and continue stirring for 1h. After the reactants are cooled to room temperature, pour them into a poor solvent such as pure water, and the obtained precipitate is repeatedly washed with pure water. After the product is dried, it is recrystallized with an ethyl acetate / toluene mixture. After filtering and drying the crystallized product, the imide-containing aromatic bisphenol monomer c-imide-containing bisphenol sulfone is obtained. The yield is 70%.

[0075] Bisphenol sulfone containing imide 1 H NMR:δH(DMSO-d 6 ,400MHz)10.65(s,2H,OH),8.0-8.10(m,8H,Ar-H),7.45(d,2H,Ar-H),7.30(s,2H,Ar-H),7.35(d,2H,Ar-H).

[0076] The DSC:Tm of imide-containing bisphenol sulfone is 320°C.

[0077] (2) Synthesis of poly(aryl ether ketone sulfone) containing imide side groups

[0078]

[0079] In a 1000 mL three-necked flask equipped with a mechanical stirrer, nitrogen inlet and outlet, water separator and reflux condenser, 81.08 g (0.15 mol) of diphenol monomer c (the imide-containing bisphenol sulfone in step 1), 32.73 g (0.15 mol) of 4,4'-difluorobenzophenone, 26.95 g (0.2 mol) of anhydrous K 2 CO 3 , 320 g NMP and 25 mL toluene. 2 Under the atmosphere, stir at 60°C until the solid material is completely dissolved. After stirring and heating at 140°C for 2h, the generated water and toluene are azeotroped, and the azeotrope is removed through a water separator. Then, at 180°C, continue to stir and carry out the polymerization reaction for 6h to obtain a viscous mixed solution; pour the viscous mixed solution into a mixed solution of 600mL ethanol and water (volume ratio 1:1) to precipitate the polymer; soak it in hot ethanol aqueous solution (ethanol to water volume ratio 1:1, temperature 80°C) for 30min, repeat three times, filter and dry to obtain polyaryletherketonesulfone containing imide side groups.

[0080] Example 4

[0081] A method for preparing a polyaryletherketone resin containing imide side groups is as follows:

[0082] (1) Synthesis of bisphenol fluorene containing imide

[0083]

[0084] In a 1000mL three-necked flask equipped with a reflux condenser, a nitrogen inlet and outlet, and an electric stirrer, 345g NMP, 95.11g (0.25mol) 9,9-bis (3-amino-4-hydroxyphenyl) fluorene, and 109.00g (0.55mol) 1,8-naphthalene dicarboxylic anhydride were added in sequence. Stir and dissolve at room temperature and react for 6h. Then add 40mL acetic anhydride and continue stirring for 1h. Then add 40mL pyridine and continue stirring for 1h. After the reactants are cooled to room temperature, pour them into a poor solvent such as pure water, and the obtained precipitate is repeatedly washed with pure water. After the product is dried, it is recrystallized with a mixture of ethyl acetate / toluene. After filtering and drying the crystallized product, the imide-containing aromatic bisphenol monomer d-imide-containing bisphenol fluorene is obtained. The yield is 70%.

[0085] Bisphenol fluorene containing imide 1 H NMR:δH(DMSO-d 6,400MHz)10.15(s,2H,OH),7.8-7.9(m,8H,Ar-H),7.15(d,2H,Ar-H),7.05(s,2H,Ar-H),7.1 0(d,2H,Ar-H),7.10(m,2H,Ar-H),7.35(m,2H,Ar-H),7.55(d,2H,Ar-H),7.85(d,2H,Ar-H).

[0086] The DSC Tm of imide-containing bisphenol fluorene is 353°C.

[0087] (2) Synthesis of poly(aryletherketonefluorene) containing imide side groups

[0088]

[0089] In a 1000 mL three-necked flask equipped with a mechanical stirrer, nitrogen inlet and outlet, water separator and reflux condenser, 74.08 g (0.10 mol) of bisphenol fluorene monomer d (bisphenol fluorene containing imide in step 1), 21.82 g (0.10 mol) of 4,4'-difluorobenzophenone, 17.97 g (0.13 mol) of anhydrous K 2 CO 3 , 225 g NMP and 25 mL toluene. 2 Under the atmosphere, stir at 60°C until the solid material is completely dissolved. After stirring and heating at 140°C for 2h, the generated water and toluene are azeotroped, and the azeotrope is removed through a water separator. Then, at 180°C, continue to stir and carry out the polymerization reaction for 7h to obtain a viscous mixed solution; pour the viscous mixed solution into a mixed solution of 600mL ethanol and water (volume ratio 1:1) to precipitate the polymer; soak it in hot ethanol aqueous solution (ethanol to water volume ratio 1:1, temperature 80°C) for 30min, repeat three times, filter and dry to obtain polyaryletherketone containing imide side groups.

[0090] Test Case

[0091] 1. NMR test: The structure of the compound was determined using an AVANCE III 400M NMR spectrometer produced by Bruker, Germany. 4 mg of the compound was dissolved in deuterated dimethyl sulfoxide (DMSO-d6) and tested at room temperature. The test results of each case resin are as above.

[0092] 2. GPC test: The molecular weight of the polymer was measured by gel permeation chromatography (GPC). A Waters 515 HPLC pump was used in combination with two Styragel columns (Waters HR4E and HR5E) and a Waters 2414 refractive index detector. Polystyrene standards were used for calibration. The eluent was DMF and the flow rate was 1.0 mL min-1 The polymer sample (25 mg) was dissolved in DMF (4 mL) and filtered through a 0.45 μm polytetrafluoroethylene syringe filter, and the molecular weight and molecular weight distribution of the copolymer were tested at room temperature. The test results of each case resin are shown in Table 1.

[0093] 3. Solubility test: Take 0.1g polymer sample and dissolve it in 1mL organic solvent (10wt%). "+++" means it is soluble at room temperature, "++" means it is soluble under heating conditions, and "-" means it is not soluble at room temperature and / or when the solution is heated to 60°C. The test results of each case resin are shown in Table 2.

[0094] 4. TGA test: The TG 209F3 thermogravimetric differential scanning calorimeter produced by Netzsch of Germany was used in a nitrogen or air atmosphere at 20℃min -1 The temperature was raised from 50°C to 800°C at a heating rate of . Before testing, the polymer was placed in a vacuum oven at 100°C and dried for 6 hours. The test results of each case resin are shown in Table 3.

[0095] 5. DSC test: Take 8-16 mg powder sample, measure it by differential scanning calorimeter, set the heating rate to 20℃ / min, test temperature within 40℃ to 400℃, cycle the heating program twice, and take the second heating curve. The test results of each case resin are shown in Table 3.

[0096] Table 1 Molecular weight and distribution of polymers

[0097] Resin samples <![CDATA[M n ×10 4 (g / mol)]]> <![CDATA[M w ×10 4 (g / mol)]]> PDI Example 1 2.58 5.70 2.21 Example 2 2.73 5.95 2.18 Example 3 1.92 4.49 2.34 Example 4 1.59 3.90 2.45

[0098] Table 2 Solubility properties of polymers

[0099] Resin samples DMF DMAc NMP DMSO <![CDATA[CHCl 3 ]]> THF Ethanol Example 1 ++ ++ ++ ++ +++ +++ - Example 2 ++ ++ ++ ++ +++ +++ - Example 3 ++ ++ ++ ++ +++ +++ - Example 4 ++ ++ ++ ++ +++ +++ -

[0100] Table 3 Thermal properties of polymers

[0101]

[0102] Table 4 Mechanical properties of polymers

[0103]

[0104] It can be seen from Tables 1 to 4 that the polyaryletherketone resins containing imide side groups of the present invention have good mechanical properties and solvent solubility, and excellent heat resistance.

[0105] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A polyaryletherketone resin containing imide side groups, characterized in that: It has the chemical structure of Formula I or Formula II: In formula I or II, x=1 or 2, and There is no X group, or the X group is one of the following groups: in It represents the bond connecting the left and right benzene rings with imide side groups.

2. A polyaryletherketone resin containing imide side groups according to claim 1, characterized in that: n represents the degree of polymerization. The number average molecular weight of the polyaryletherketone resin containing imide side groups is 10,000 to 30,000 g / mol, the weight average molecular weight is 30,000 to 60,000 g / mol, and the PDI is in the range of 1-3.

3. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 1 or 2, characterized in that: The steps include: Under a protective atmosphere and with stirring, an imide-containing aromatic bisphenol monomer, a difluoroaryl ketone monomer, a salt-forming agent, and an azeotroping agent are dissolved in a reaction solvent, and a salt-forming reaction is first performed, and the azeotropes are removed after azeotropy, and then the temperature is raised to perform a polycondensation reaction, and a polymer is precipitated out by a poor solvent to obtain a polyaryletherketone resin containing an imide side group; The chemical structure of the imide-containing aromatic bisphenol monomer is one of the following: There is no X group, or the X group is one of the following groups: in It represents the bond connecting the left and right benzene rings with imide side groups.

4. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 3, characterized in that: The difluoroaryl ketone monomer is selected from one or more of 4,4'-difluorobenzophenone and 4,4'-difluorotriphenyldione; The salt-forming agent is anhydrous sodium carbonate and / or anhydrous potassium carbonate; The reaction solvent is selected from one of N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, and N-methylpyrrolidone; The azeotropic agent is one of benzene, toluene and xylene.

5. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 3, characterized in that: The molar number of the difluoroaryl ketone monomer is 0.98 to 1.02 times the molar number of the imide-containing aromatic bisphenol monomer; The amount of the salt-forming agent used is 1.02 to 1.3 times the molar number of the imide-containing aromatic bisphenol monomer used; The amount of the reaction solvent used is such that the mass fraction of the total material in the entire reaction system is 20%-35%.

6. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 3, characterized in that: After the addition of the imide-containing aromatic bisphenol monomer, difluoroaryl ketone monomer, salt-forming agent, entrainer and reaction solvent is completed, the temperature is first raised to 60-80° C. and stirred until the solid material is dissolved, and then the temperature is raised to carry out subsequent reactions; The temperature of the salt-forming reaction is 120-140° C., the reaction time is 1-2 hours, and the water in the system is removed by azeotropy; The polycondensation reaction temperature is 160-180°C and the reaction time is 4-12h; The poor solvent used for the precipitation is water or an alcohol solvent, and the precipitated product can be washed repeatedly and then dried.

7. The method for preparing a polyaryletherketone resin containing imide side groups according to any one of claims 3 to 6, characterized in that: The imide-containing aromatic bisphenol monomer is obtained by the following method: Under a protective atmosphere and under stirring, an amino-containing aromatic diphenol and a monoanhydride compound are put into an organic solvent, and after being uniformly dissolved, a pre-reaction is first performed at room temperature; then acetic anhydride is added to continue the reaction at room temperature; then triethylamine or pyridine is added to continue the reaction, and after the reaction is completed, a precipitate is precipitated in a poor solvent, and the precipitate is repeatedly washed and recrystallized to obtain an aromatic diphenol monomer containing an imide; The amino-containing aromatic diphenol has the following structure: There is no X group, or the X group is one of the following groups: in It represents the bond connecting the left and right benzene rings with imide side groups.

8. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 7, characterized in that: The amino-containing aromatic diphenol is selected from 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, bis(3-amino-4-hydroxyphenyl)sulfone, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dihydroxybenzidine, and 9,9-bis(3-amino-4-hydroxyphenyl)fluorene; The monoanhydride compound is selected from one of phthalic anhydride and 1,8-naphthalic anhydride; The organic solvent is selected from one of N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, N-methylpyrrolidone and m-cresol.

9. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 7, characterized in that: The molar number of the monoanhydride compound is 2.1 to 2.5 times the molar number of the amino-containing aromatic diphenol; The amount of the organic solvent is such that the solid content of the system material is 20wt%-35wt%; The usage ratio of the acetic anhydride to the monoanhydride compound is 7-8 mL:0.1 mol; The usage ratio of the triethylamine or the pyridine to the monoanhydride compound is 7-8 mL:0.1 mol.

10. The method for preparing a polyaryletherketone resin containing imide side groups according to claim 7, characterized in that: The pre-reaction time is 4-8h; The reaction time after adding the acetic anhydride is 0.5-1h; After adding the triethylamine, the reaction is continued at room temperature for 0.5-1h, or after adding the pyridine, the temperature is raised to 80-120°C and the reaction is continued for 0.5-1h; The washed and dried precipitate was recrystallized using a mixture of ethyl acetate and toluene.

Citation Information

Patent Citations

  • Polyaryletherketones Containing Phthalimide Side Groups and Their Synthetic Methods

    CN102276824A

  • Polyarylether materials containing imide side groups and preparation method therefor

    CN105348512A

  • Monomer containing imide structure, fluorinated polyaryletherketone as well as preparation method and application of fluorinated polyaryletherketone

    CN116969877A

  • Polyarlyl ether ketone polymer blends

    US20070066765A1

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