A cooling method and device for a shape memory alloy driver

Abstract

The present invention discloses a cooling method and device for a shape memory alloy actuator. Liquid metal is placed directly below the heat dissipation part of the SMA actuator. An electric field force is applied to the liquid metal, causing the liquid metal to generate a surface tension gradient from bottom to top, thereby causing the surface of the liquid metal to overcome gravity and gather upward and contact the part of the SMA actuator to be dissipated. The electric field force in the liquid metal is eliminated, causing the surface of the liquid metal to return to its original state and separate from the part of the SMA actuator that completes heat dissipation. The liquid metal is used as a cooling medium to quickly absorb and conduct heat generated by the SMA actuator. A surface tension gradient is formed by applying an electric field force to the liquid metal, triggering an electric reduction effect, causing the liquid metal to become spherical under the action of the surface tension difference and contact the surface of the SMA actuator, thereby enhancing the heat transfer efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling devices, and in particular to a cooling method and device for a shape memory alloy driver. Background Art

[0002] Intelligent robotics, a cutting-edge discipline in the new technological revolution, combines technologies from multiple disciplines, including precision mechanics, optics, materials science, electronics, automatic control, and artificial intelligence. It has been widely applied in various fields, including industry, aerospace, military, exploration, rescue, healthcare, and public welfare. Shape memory alloy (SMA), a new intelligent material with a high power-to-weight ratio and lightweight, can produce significant deformation and tensile forces through electrothermal phase transitions, finding widespread application in intelligent robotics. However, the design of SMA drive systems faces technical bottlenecks such as low operating frequency, poor controllability, and an inability to maintain force.

[0003] Existing SMA actuators mostly use electric current heating and rely on natural cooling or forced air cooling for heat dissipation. However, this existing cooling method has limited cooling efficiency and often fails to dissipate heat in a timely manner, making it difficult for the actuator to achieve high-frequency motion and limiting the dynamic response performance of the SMA. Furthermore, while liquid cooling solutions have improved heat dissipation efficiency to a certain extent, the bulky size and low integration of such cooling devices make them difficult to fit into compact system environments, limiting their practical application in space-constrained and compact applications. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to solve the problem of low cooling efficiency of the shape memory alloy driver in the prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a cooling method for a shape memory alloy actuator, comprising the following steps:

[0006] S1: Place liquid metal just below the heat sink of the SMA actuator;

[0007] S2: applying an electric field force to the liquid metal so that the liquid metal generates a surface tension gradient from bottom to top, thereby causing the surface of the liquid metal to overcome gravity and gather upward and contact the portion of the SMA actuator to be cooled;

[0008] S3: Eliminate the electric field force in the liquid metal, so that the liquid metal surface returns to its original state and separates from the part of the SMA actuator that completes the heat dissipation.

[0009] In order to solve the above technical problems, the present invention also provides a cooling device for a shape memory alloy actuator, which is used to cool the SMA actuator, including a liquid storage container, a negative electrode wire and a positive electrode wire. The liquid storage container is provided with a liquid storage tank, which is used to store liquid metal and an anti-oxidation liquid. The anti-oxidation liquid is suspended on the liquid metal; the positive electrode wire is directly inserted into the anti-oxidation liquid, and the negative electrode wire is immersed in the liquid metal. The negative electrode wire is located directly below the SMA actuator.

[0010] The beneficial effects of the present invention are as follows: the cooling method and device for a shape memory alloy actuator provided by the present invention have the characteristics of high heat dissipation efficiency. Liquid metal is used as a cooling medium. Due to its excellent thermal conductivity, it can quickly absorb and conduct heat generated by the SMA actuator, thereby achieving rapid heat dissipation. By applying an electric field force to the liquid metal, a surface tension gradient is formed, triggering an electro-reduction effect, causing the liquid metal to become spherical due to the surface tension difference and contact the surface of the SMA actuator, thereby enhancing the heat transfer efficiency. Under the action of the electric field force, the liquid metal surface overcomes gravity and gathers upward and directly contacts the portion of the SMA actuator to be dissipated. This direct contact maximizes the heat exchange area and improves the heat dissipation efficiency. The protrusions of the liquid metal can be actively controlled according to the temperature changes of the SMA actuator to achieve adaptive heat dissipation, ensuring that the optimal heat dissipation effect is maintained under different operating conditions, reducing the performance degradation of the SMA actuator due to heat accumulation, improving its dynamic response performance and operating frequency, and enabling it to adapt to more complex operating conditions. In addition, the cooling device has a compact design and is suitable for integration into space-constrained environments while maintaining efficient heat dissipation performance, making it suitable for various compact system environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a flow chart of a cooling method for a shape memory alloy actuator according to a first embodiment of the present invention;

[0012] Figure 2 This is a schematic structural diagram of a cooling device for a shape memory alloy actuator according to a second embodiment of the present invention;

[0013] Figure 3 This is a schematic structural diagram of a cooling device for a shape memory alloy actuator according to a third embodiment of the present invention.

[0014] Description of labels:

[0015] 1. Liquid storage container; 11. Liquid storage tank; 2. First fixed platform; 3. Second fixed platform; 4. Mounting seat; 41. Positioning slot; 42. Static flow slot; 5. Cathode wire; 51. First cathode; 52. Second cathode; 6. SMA driver; 61. Guide slide bar; 62. Guide slide block; 63. First shape memory alloy spring; 64. Second shape memory alloy spring; 65. First shape memory alloy wire; 66. Second shape memory alloy wire. DETAILED DESCRIPTION

[0016] To illustrate the technical content, achieved objectives and effects of the present invention in detail, the following description is given in conjunction with the embodiments and accompanying drawings.

[0017] Please refer to Figures 1 to 3 , a cooling method for a shape memory alloy actuator, comprising the following steps,

[0018] S1: Place liquid metal just below the heat sink of the SMA actuator;

[0019] S2: applying an electric field force to the liquid metal so that the liquid metal generates a surface tension gradient from bottom to top, thereby causing the surface of the liquid metal to overcome gravity and gather upward and contact the portion of the SMA actuator to be cooled;

[0020] S3: Eliminate the electric field force in the liquid metal, so that the liquid metal surface returns to its original state and separates from the part of the SMA actuator that completes the heat dissipation.

[0021] Furthermore, the liquid metal is pure gallium, gallium-indium alloy or gallium-indium-tin alloy.

[0022] From the above description, it can be seen that pure gallium, gallium-indium alloy or gallium-indium-tin alloy is selected as the liquid metal. These materials not only have good thermal conductivity, but also have low melting points and high boiling points, which enables the cooling device to operate in a wide temperature range, thereby improving the applicability and reliability of the system.

[0023] A cooling device for a shape memory alloy actuator, used to implement the above-mentioned shape memory alloy actuator cooling method, includes a liquid storage container 1, a negative electrode wire 5, and a positive electrode wire (not shown in the figure). The liquid storage container 1 is provided with a liquid storage tank 11, which is used to store liquid metal and an anti-oxidation solution. The positive electrode wire is directly inserted into the anti-oxidation solution in the liquid storage container. The negative electrode wire 5 is divided into two groups, one of which is a first negative electrode 51 and the other is a second negative electrode 52. The first negative electrode 51 and the second negative electrode 52 are respectively in contact with the left and right groups of liquid metal (three drops each) and are connected to the negative electrode of the power supply via a selector switch.

[0024] As can be seen from the above description, the beneficial effects of the present invention are as follows: using liquid metal as a cooling medium, due to its excellent thermal conductivity, it can quickly absorb and conduct the heat generated by the SMA actuator 6, thereby achieving rapid heat dissipation; by applying power to the positive and negative wires 5 through a power supply, a surface tension gradient is formed in the liquid metal, triggering an electro-reduction effect, causing the liquid metal to become spherical under the action of the surface tension difference and contact the surface of the SMA actuator, thereby enhancing the heat transfer efficiency; the design of the positive and negative wires 5 causes the surface of the liquid metal to be reduced, forming protrusions that directly contact the SMA actuator 6. This direct contact maximizes the heat exchange area and improves the heat dissipation efficiency; the protrusions of the liquid metal can be actively controlled according to the temperature changes of the SMA actuator 6 to achieve adaptive heat dissipation, ensuring that the optimal heat dissipation effect is maintained under different operating conditions, reducing the performance degradation of the SMA actuator 6 due to heat accumulation, improving its dynamic response performance and operating frequency, and enabling it to adapt to more complex operating conditions; and the cooling device has a compact design, suitable for integration into space-constrained environments, while maintaining efficient heat dissipation performance, and is suitable for various compact system environments.

[0025] Furthermore, it also includes a fixing base, which is installed on the liquid storage container 1 and is used to install the SMA driver 6.

[0026] As can be seen from the above description, by installing a fixing base on the liquid storage container 1 to fix the SMA actuator 6, the stability and structural integrity of the entire cooling system are enhanced. This design ensures precise alignment between the actuator and the cooling medium, thereby improving heat transfer efficiency.

[0027] Furthermore, the fixing seat can be detachably mounted on the liquid storage container 1 .

[0028] As can be seen from the above description, the detachable design of the fixing base provides great convenience, making the installation and maintenance of the SMA actuator 6 simpler and faster. This modular design also allows for quick replacement or upgrade of the actuator, improving the flexibility and maintenance efficiency of the system.

[0029] Furthermore, it also includes a mounting seat 4 , which is installed in the liquid storage tank 11 of the liquid storage container 1 , and the negative electrode wire 5 is installed on the mounting seat 4 .

[0030] As can be seen from the above description, the addition of a mounting base 4 within the liquid reservoir 11 for securing the negative lead 5 not only ensures stable positioning of the lead but also facilitates maintenance and replacement of the lead. This design optimizes the layout of the lead, helps improve the uniformity of current distribution, and thus enhances heat dissipation efficiency.

[0031] Furthermore, a positioning groove 41 and a static flow groove 42 are provided on the top of the mounting seat 4 . The positioning groove 41 is located in the static flow groove 42 . The liquid metal is filled in the static flow groove 42 . The negative electrode wire 5 is installed in the positioning groove 41 .

[0032] As can be seen from the above description, a positioning groove 41 and a static flow groove 42 are designed on the top of the mounting base 4, wherein the positioning groove 41 is used to fix the negative electrode wire 5. This design ensures the precise positioning of the wire and optimizes the current distribution, thereby improving the uniformity of the liquid metal flow and the heat dissipation efficiency; the static flow groove 42 is used to prevent the liquid metal near the negative electrode wire 5 from flowing when no power is supplied.

[0033] Furthermore, the positioning groove 41 is circular or polygonal in shape.

[0034] As can be seen from the above description, the positioning groove 41 can be circular or polygonal. This diversified design enables the cooling device to adapt to different installation requirements and spatial layouts, thereby improving the design flexibility.

[0035] Furthermore, the mounting base 4 can be detachably mounted on the liquid storage container 1 .

[0036] As can be seen from the above description, the detachable design of the mounting base 4 also provides convenience for maintenance and replacement, reduces maintenance costs in long-term operation, and allows the wire layout to be adjusted as needed to optimize heat dissipation performance.

[0037] Furthermore, the negative electrode wire 5 is divided into a first negative electrode 51 and a second negative electrode 52 , and the first negative electrode 51 and the second negative electrode 52 are in contact with the left and right groups of liquid metal respectively, and are connected to the negative electrode of the power supply through a selection switch.

[0038] As can be seen from the above description, by providing multiple negative conductors and connecting the negative conductor 5 to the negative pole of the power supply through an optional switch, this design optimizes the current distribution and the protrusion groups of the liquid metal, achieving active, controllable, more uniform and efficient heat dissipation.

[0039] Furthermore, the liquid storage container 1 is made of acrylic material.

[0040] From the above description, it can be seen that the use of acrylic material as the liquid storage container 1 provides good chemical stability and transparency, allowing the state of the liquid metal to be visually observed, while ensuring the durability and impact resistance of the container, making it suitable for various working environments.

[0041] Please refer to Figure 1 , Embodiment 1 of the present invention is: a cooling method for a shape memory alloy actuator, comprising the following steps,

[0042] S1: Place liquid metal just below the heat sink of the SMA actuator;

[0043] S2: applying an electric field force to the liquid metal so that the liquid metal generates a surface tension gradient from bottom to top, thereby causing the surface of the liquid metal to overcome gravity and gather upward and contact the portion of the SMA actuator to be cooled;

[0044] S3: Eliminate the electric field force in the liquid metal, so that the liquid metal surface returns to its original state and separates from the part of the SMA actuator that completes the heat dissipation.

[0045] Furthermore, the liquid metal is pure gallium, gallium-indium alloy or gallium-indium-tin alloy.

[0046] From the above description, it can be seen that pure gallium, gallium-indium alloy or gallium-indium-tin alloy is selected as the liquid metal. These materials not only have good thermal conductivity, but also have low melting points and high boiling points, which enables the cooling device to operate in a wide temperature range, thereby improving the applicability and reliability of the system.

[0047] Please refer to Figure 2 A second embodiment of the present invention is a cooling device for a shape memory alloy actuator, which is used to implement the cooling method for the shape memory alloy actuator described in the first embodiment to cool the SMA actuator 6. The cooling device for the shape memory alloy actuator includes a liquid storage container 1, a negative electrode wire 5, and a positive electrode wire (not shown). The liquid storage container 1 is provided with a liquid storage tank 11, which is used to hold liquid metal and an anti-oxidation solution. The positive electrode wire is directly inserted into the liquid storage container. The negative electrode wire 5 is divided into a first negative electrode 51 and a second negative electrode 52, and is respectively in contact with two groups of liquid metal (three drops each) on the left and right, and is connected to the negative electrode of the power supply via a selector switch. Specifically, an electric field strength is applied to the liquid metal via the positive electrode wire and the negative electrode wire 5, utilizing the electric reduction effect, so that the liquid metal becomes spherical due to the surface tension difference and contacts the surface of the SMA actuator. When power is applied to the positive and negative conductors 5, the current flowing through the conductors and the liquid metal creates surface tension, creating protrusions on the liquid metal surface that directly contact the SMA actuator 6 to dissipate heat. This electroreduction-based cooling mechanism offers a more compact and efficient heat dissipation solution than traditional cooling methods, such as air or water cooling. It is particularly well-suited for applications with limited space or specific requirements for heat dissipation efficiency. By precisely controlling the current and conductor layout, the flow of liquid metal and the formation of protrusions can be finely tuned, further optimizing heat dissipation performance.

[0048] Preferably, the cooling device for the shape memory alloy actuator further includes a fixing base and a mounting base 4. The fixing base is mounted on the liquid reservoir 1 and is used to mount the SMA actuator 6. This enhances the stability and structural integrity of the entire cooling system. This design ensures precise alignment between the actuator and the cooling medium, thereby improving heat transfer efficiency. The mounting base 4 is mounted within the liquid reservoir 11 of the liquid reservoir 1, and the positive and negative conductors 5 are both mounted on the mounting base 4. The mounting base 4 not only ensures stable positioning of the conductors but also facilitates maintenance and replacement of the conductors. This design optimizes the layout of the conductors, helps to improve the uniformity of current distribution, and thus enhances heat dissipation efficiency. Specifically, the fixing base and the mounting base 4 are detachably mounted on the liquid reservoir 1. The detachable design of the fixing base provides great convenience, making the installation and maintenance of the SMA actuator 6 simpler and faster. This modular design also allows for quick replacement or upgrade of the actuator, improving system flexibility and maintenance efficiency. The detachable design of the mounting base 4 also facilitates maintenance and replacement, reducing maintenance costs during long-term operation, while allowing the conductor layout to be adjusted as needed to optimize heat dissipation performance.

[0049] Preferably, a positioning groove 41 and a static flow groove 42 are provided on the top of the mounting seat 4, wherein the positioning groove 41 is located in the static flow groove 42, wherein the liquid metal is filled in the static flow groove 42, and the negative electrode wire 5 is installed in the positioning groove 41. It can be understood that the top of the mounting seat 4 is designed with a positioning groove 41 and a static flow groove 42, wherein the positioning groove 41 is used to fix the negative electrode wire 5. This design ensures the precise positioning of the wire and optimizes the current distribution, thereby improving the uniformity of the liquid metal flow and the heat dissipation efficiency; the static flow groove 42 is used to prevent the liquid metal near the negative electrode wire 5 from flowing when no power is supplied. Optionally, the positioning groove 41 is circular or polygonal in shape. This diversified design enables the cooling device to adapt to different installation requirements and spatial layouts, thereby improving the flexibility of the design.

[0050] Optionally, the liquid metal is pure gallium, gallium-indium alloy or gallium-indium-tin alloy. These materials not only have good thermal conductivity, but also have low melting points and high boiling points, so that the cooling device can operate in a wide temperature range, thereby improving the applicability and reliability of the system. Also optionally, the material of the liquid storage container 1 is acrylic material. Using acrylic material as the liquid storage container 1 provides good chemical stability and transparency, so that the state of the liquid metal can be visually observed, while ensuring the durability and impact resistance of the container, and is suitable for various working environments.

[0051] In this embodiment, a first fixed platform 2 and a second fixed platform 3 are provided at opposite ends of the fixed seat, and the shape memory alloy driver (i.e., SMA driver 6) includes a first shape memory alloy spring 63, a second shape memory alloy spring 64, a guide slide 61 and a guide slider 62. The two ends of the guide slide 61 are connected to the first fixed platform 2 and the second fixed platform 3, and the guide slider 62 is slidably mounted on the guide slide 61; the two ends of the first shape memory alloy spring 63 are respectively mounted on the first fixed platform 2, and the middle part of the first shape memory alloy spring 63 is connected to the guide slider 62; the two ends of the second shape memory alloy spring 64 are respectively mounted on the second fixed platform 3, and the middle part of the second shape memory alloy spring 64 is connected to the guide slider 62; the first shape memory alloy spring 63 and the second shape memory alloy spring 64 are both located directly above the liquid metal. When the first shape memory alloy spring 63 is powered on and the second shape memory alloy spring 64 is powered off, the first shape memory alloy spring 63 generates an electrothermal resistance effect and contracts rapidly after phase change. At this time, the guide slider 62 slides on the guide slide bar 61 toward the direction close to the first fixed platform 2, and the second shape memory alloy spring 64 is in a stretched state. At this time, the first shape memory alloy spring 63 is powered off and the second shape memory alloy spring 64 is powered on. The second shape memory alloy spring 64 contracts and drives the guide slider 62 to move toward the direction close to the second fixed platform 3. The first shape memory alloy spring 6 3 is stretched, and at the same time, the negative electrode wire located directly below the stretched first shape memory alloy spring 63 is energized, so that an upward bulge is formed on the surface of the liquid metal to wrap the first shape memory alloy spring 63, thereby transferring the heat generated by the first shape memory alloy spring 63 to the liquid metal for heat dissipation; similarly, when the second shape memory alloy spring 64 is stretched, the liquid metal located below it is energized, so that an upward bulge is formed on the surface of the liquid metal to wrap the second shape memory alloy spring 64, thereby transferring the heat generated by the second shape memory alloy spring 64 to the liquid metal for heat dissipation.

[0052] Please refer to Figure 3, Embodiment 3 of the present invention is a further improvement based on Embodiment 2. The difference between Embodiment 3 and Embodiment 2 is that: the shape memory alloy driver (i.e., SMA driver 6) in this embodiment includes a first shape memory alloy wire 65, a second shape memory alloy wire 66, a guide slide 61 and a guide slider 62, the two ends of the guide slide 61 are connected to the first fixed platform 2 and the second fixed platform 3, and the guide slider 62 is slidably mounted on the guide slide 61; the two ends of the first shape memory alloy wire 65 are respectively mounted on the first fixed platform 2, and the middle part of the first shape memory alloy wire 65 is connected to the guide slider 62; the two ends of the second shape memory alloy wire 66 are respectively mounted on the second fixed platform 3, and the middle part of the second shape memory alloy wire 66 is connected to the guide slider 62; the first shape memory alloy wire 65 and the second shape memory alloy wire 66 are both located directly above the liquid metal. When the first shape memory alloy wire 65 is powered on and the second shape memory alloy wire 66 is powered off, the first shape memory alloy wire 65 generates an electrothermal resistance effect and contracts rapidly after phase change. At this time, the guide slider 62 slides on the guide slide bar 61 toward the direction close to the first fixed platform 2, and the second shape memory alloy wire 66 is in a stretched state. At this time, the first shape memory alloy wire 65 is powered off and the second shape memory alloy wire 66 is powered on. The second shape memory alloy wire 66 contracts and drives the guide slider 62 to move toward the second fixed platform 3. The first shape memory alloy wire 65 When the first shape memory alloy wire 65 is stretched, the negative electrode wire located directly below the stretched first shape memory alloy wire 65 is energized at the same time, so that an upward bulge is formed on the surface of the liquid metal to wrap the first shape memory alloy wire 65, thereby transferring the heat generated by the first shape memory alloy wire 65 to the liquid metal for heat dissipation; similarly, when the second shape memory alloy wire 66 is stretched, the negative electrode wire located below it is energized, so that an upward bulge is formed on the surface of the liquid metal to wrap the second shape memory alloy wire 66, thereby transferring the heat generated by the second shape memory alloy wire 66 to the liquid metal for heat dissipation.

[0053] In summary, the cooling method and device for a shape memory alloy actuator provided by the present invention have the characteristics of high heat dissipation efficiency and high integration. Liquid metal is used as a cooling medium. Due to its excellent thermal conductivity, it can quickly absorb and conduct the heat generated by the SMA actuator, thereby achieving rapid heat dissipation. By applying electricity to the positive and negative wires, a surface tension gradient is formed, triggering an electro-reduction effect, causing the liquid metal to become spherical under the action of the surface tension difference and contact the surface of the SMA actuator, thereby enhancing the heat transfer efficiency. The design of the positive and negative wires causes the surface of the liquid metal to be reduced, forming protrusions that directly contact the SMA actuator. This direct contact maximizes the heat exchange area and improves the heat dissipation efficiency. The protrusions of the liquid metal can be actively controlled according to the temperature changes of the SMA actuator to achieve adaptive heat dissipation, ensuring that the optimal heat dissipation effect can be maintained under different operating conditions, reducing the performance degradation of the SMA actuator due to heat accumulation, improving its dynamic response performance and operating frequency, and enabling it to adapt to more complex operating conditions. In addition, the cooling device has a compact design and is suitable for integration into space-constrained environments while maintaining efficient heat dissipation performance, making it suitable for various compact system environments.

[0054] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's description and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A cooling device for a shape memory alloy actuator, characterized in that: The cooling device comprises a liquid storage container, a negative electrode wire and a positive electrode wire. The liquid storage container is provided with a liquid storage tank for storing liquid metal and an anti-oxidation liquid. The anti-oxidation liquid is suspended on the liquid metal to prevent the liquid metal from being oxidized during long-term use, thereby extending the service life of the liquid metal and ensuring the stability and reliability of the cooling device. The positive electrode wire is directly inserted into the anti-oxidation liquid, and the negative electrode wire is immersed in the liquid metal. The negative electrode wire is located directly below the SMA driver. The cooling device also comprises a mounting seat, which is mounted in the liquid storage tank of the liquid storage container, and the negative electrode wire is mounted on the mounting seat. A positioning groove is provided on the top of the mounting seat, and the negative electrode wire is mounted in the positioning groove. A static flow groove is also provided on the top of the mounting seat, the positioning groove is located in the static flow groove, and the liquid metal is filled in the static flow groove; the negative electrode wire is divided into a first negative electrode and a second negative electrode, the first negative electrode and the second negative electrode are in contact with the left and right groups of liquid metal respectively, and are connected to the negative electrode of the power supply through a selection switch; an electric field strength is applied to the liquid metal through the positive electrode wire and the negative electrode wire, and the electric reduction effect is utilized, so that the liquid metal becomes spherical under the action of the surface tension difference and contacts the surface of the SMA driver; when the positive electrode wire and the negative electrode wire are energized, since the current passes through the wire and the liquid metal, a protrusion will be formed on the surface of the liquid metal due to the action of surface tension, which directly contacts the SMA driver for heat dissipation.

2. The cooling device for a shape memory alloy actuator according to claim 1, characterized in that: It also includes a fixing base, which is installed on the liquid storage container and is used to install the SMA driver.

3. The cooling device for the shape memory alloy actuator according to claim 2, characterized in that: The fixing seat is detachably mounted on the liquid storage container.

4. The cooling device for a shape memory alloy actuator according to claim 1, characterized in that: The shape of the positioning groove is circular or polygonal.

5. The cooling device for a shape memory alloy actuator according to claim 1, characterized in that: The mounting seat can be detachably mounted on the liquid storage container.

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