Multi-probe measuring device and measuring method thereof

Abstract

The invention provides a multi-probe measuring device and a measuring method thereof, and the multi-probe measuring device comprises a plurality of types of probes, each type of probe comprises four probes; a plurality of measuring circuits, wherein each measuring circuit is connected with one type of probe; the measurement circuit measures a measurement object by using the corresponding probes, and the measurement circuit is configured to: select two of the probes as current carrying pins to inject current, and the other two of the probes as voltage metering pins to measure voltage; and the processing module is used for calculating parameters of the measured object according to the current and the voltage. According to different measurement objects, suitable types of probes and measurement circuits are selected, parameters of the measurement objects are obtained, the universality of the measurement device is improved, and the measurement speed is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor detection, and in particular to a multi-probe measuring device and a measuring method thereof. Background Art

[0002] The four-probe measuring instrument is a special instrument for measuring the resistivity and sheet resistance of semiconductor materials. It is used to measure the resistivity of rod-shaped and block-shaped semiconductor materials (including thick and thin slices) and the sheet resistance of the diffusion layer, ion implantation layer, and epitaxial layer on the silicon wafer. The instrument has the characteristics of high measurement accuracy, high sensitivity, good stability, wide measurement range, compact structure, and the measurement results are directly displayed in digital form, which is easy to use.

[0003] However, due to the different surface properties of different measurement objects, different types of probes need to be matched, such as special probes for substrate measurement, probes for measuring metals, probes for high-impedance surfaces (such as low implantation dose, shallow junctions, doped polysilicon), and general probes for ion implantation, doped polysilicon, silicide, epitaxy and diffusion.

[0004] Since a four-probe measuring instrument is only used with one type of probe, different four-probe measuring instruments need to be replaced or the probes need to be replaced when measuring different measurement objects, which affects work efficiency.

[0005] Therefore, improving the versatility of the measuring instrument and improving the working efficiency of the measuring instrument are the focus of those skilled in the art. Summary of the invention

[0006] The purpose of the present invention is to provide a multi-probe measuring device and a measuring method thereof, which can improve the versatility of the measuring device and improve the measuring efficiency.

[0007] In order to achieve the above object, the present invention provides a multi-probe measuring device, comprising:

[0008] Various types of probes, each type of probe includes 4 probes;

[0009] A plurality of measurement circuits, each of the measurement circuits being connected to a type of probe;

[0010] The measuring circuit measures the measuring object by using the corresponding probe, and the measuring circuit is configured to:

[0011] Select two of the probes as current carrying pins to inject current, and the other two of the probes as voltage measuring pins to measure voltage;

[0012] A processing module is used to calculate the parameters of the measurement object according to the current and the voltage.

[0013] In an optional solution, the four probes of each type of the probe are arranged in a straight line.

[0014] In an optional solution, the spacing between adjacent probes of the probe is the same.

[0015] In an optional solution, the types of the measurement objects include: substrate wafers, epitaxial wafers, metal wafers, diffusion wafers, ion implantation wafers or gettering wafers; and the multiple types of probes are respectively used to measure different types of the measurement objects.

[0016] The present invention also provides a measurement method of a multi-probe measurement device. Based on the multi-probe measurement device, the method comprises:

[0017] Select the corresponding type of probe according to the type of measurement object;

[0018] Based on the selected probe, establishing electrical contact between the probe tip of the probe and the measurement object;

[0019] Select two probes as current carrying pins to inject current and the other two probes as voltage measuring pins to measure voltage;

[0020] The parameters of the measurement object are obtained through a processing module.

[0021] The present invention also provides another multi-probe measuring device, comprising:

[0022] Multiple types of probes, each type of probe includes at least 5 probes;

[0023] A plurality of measurement circuits, each of the measurement circuits being connected to one type of the probe;

[0024] The measuring circuit measures the measuring object by using the corresponding probe, and the measuring circuit is configured to:

[0025] Select two of the probes as current carrying pins to inject current, and select the remaining plurality of the probes as voltage measuring pins to measure a plurality of voltages simultaneously;

[0026] A processing module is configured to obtain a voltage distribution curve based on the multiple voltages, and calculate a parameter of the measurement object according to the current and the voltage distribution curve.

[0027] In an optional solution, the probes of each type of the probe are arranged in a straight line.

[0028] In an optional solution, the spacings between adjacent probes of the probe are the same or different.

[0029] In an optional solution, the probes of all the probes are arranged in a straight line or multiple parallel straight lines or in a "M" shape.

[0030] The present invention also provides another measurement method of a multi-probe measurement device. Based on the above multi-probe measurement device, the method comprises:

[0031] Select the corresponding type of probe according to the type of measurement object;

[0032] Based on the selected probe, establishing electrical contact between the probe tip of the probe and the measurement object;

[0033] Select two probes as current carrying pins to inject current, and select the remaining multiple probes as voltage measuring pins to measure multiple voltages simultaneously;

[0034] The parameters of the measurement object are obtained through a processing module.

[0035] The beneficial effects of the present invention are:

[0036] The present invention integrates multiple types of probes into one measuring device, selects suitable types of probes and measuring circuits according to different measuring objects, obtains parameters of the measuring objects, improves the versatility of the measuring device, and improves the measuring efficiency;

[0037] Furthermore, the probe may have four probes, and after multiple measurements, the parameters of the measured object are obtained in a conventional manner. The probe may have five or more probes, so that multiple voltages can be obtained simultaneously, the measurement accuracy is improved, and the measurement time can be saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which like reference numerals generally represent like components.

[0039] Figure 1 Schematic diagram of the structure of a multi-probe measuring device in one embodiment of the present invention.

[0040] Figure 2 FIG. 4 is a schematic structural diagram of a multi-probe measuring device in another embodiment of the present invention. DETAILED DESCRIPTION

[0041] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description and drawings, the advantages and features of the present invention will become clearer. However, it should be noted that the concept of the technical solution of the present invention can be implemented in a variety of different forms and is not limited to the specific embodiments described herein. The drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0042] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0043] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0044] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0045] Example 1

[0046] Reference Figure 1 , this embodiment provides a multi-probe measurement device, including:

[0047] Various types of probes, each type of probe includes 4 probes;

[0048] A plurality of measurement circuits, each of the measurement circuits being connected to a type of probe;

[0049] The measuring circuit measures the measuring object by using the corresponding probe, and the measuring circuit is configured to:

[0050] Select two of the probes as current carrying pins to inject current, and the other two of the probes as voltage measuring pins to measure voltage;

[0051] A processing module is used to calculate the parameters of the measurement object according to the current and the voltage.

[0052] Specifically, the measuring device integrates various types of probes ( Figure 1 Three types of probes are shown, each dotted box is a type of probe. The loads of different types of probes are different. Different types of probes are used to measure different types of measurement objects. Through the measurement device integrated with multiple types of probes, it can adapt to multiple measurement objects and improve the adaptability of the measurement device. Each type of probe includes 4 probes, which are arranged in a straight line, and the spacing between adjacent probes is the same. It should be noted that the distance between probes of different types of probes is set according to needs.

[0053] In this embodiment, the types of measurement objects include: substrate wafers, epitaxial wafers, metal wafers, diffusion wafers, ion implantation wafers or gettering wafers; and various types of probes are used to measure different types of measurement objects. Refer to Table 1 for parameters and applications of different types of probes.

[0054] Table 1

[0055]

[0056] Each measuring circuit is connected to a type of probe. The measuring circuit includes a power supply circuit, a constant current source circuit and a voltage detection circuit. The measuring circuit uses the corresponding probes to measure the measuring object. During the measurement: two of the probes are selected as current carrying pins to inject current, and the other two probes are selected as voltage measuring pins to measure voltage; the processing module calculates the parameters of the measuring object (such as resistivity, block resistance) according to the current and the voltage, and the processing module may include a display screen to display the parameters on the display screen.

[0057] Example 2

[0058] This embodiment provides a measurement method of a multi-probe measurement device, based on the multi-probe measurement device described in Embodiment 1, the method includes:

[0059] Select the corresponding type of probe according to the type of measurement object;

[0060] Based on the selected probe, establishing electrical contact between the probe tip of the probe and the measurement object;

[0061] Select two probes as current carrying pins to inject current and the other two probes as voltage measuring pins to measure voltage;

[0062] The parameters of the measurement object are obtained through a processing module.

[0063] Specifically, the object to be measured is placed on the measuring stand platform, and the corresponding type of probe is selected according to the type of the object to be measured; appropriate pressure is applied to make the four probes form an ohmic connection with the surface of the object to be measured, and a small current is passed through two of the probes with a constant current source. The voltage detection circuit measures the voltage between the other two probes, and the processing module calculates the sheet resistance or resistivity value through the current and voltage values, and then displays it. During the measurement process, by changing the magnitude of the current, the relationship between the voltage and the current is obtained, and then a more accurate parameter value is obtained. In order to detect the characteristics of different positions of the measured object, it is usually necessary to measure different positions of the measured object.

[0064] Embodiment 1 and Embodiment 2 integrate multiple types of probes into one measuring device. According to different measuring objects, suitable types of probes and measuring circuits are selected to obtain parameters of the measuring object, thereby improving the versatility of the measuring device and the measuring efficiency.

[0065] Example 3

[0066] This embodiment provides a multi-probe measurement device, including:

[0067] Multiple types of probes, each type of probe includes at least 5 probes;

[0068] A plurality of measurement circuits, each of the measurement circuits being connected to one type of the probe;

[0069] The measuring circuit measures the measuring object by using the corresponding probe, and the measuring circuit is configured to:

[0070] Select two of the probes as current carrying pins to inject current, and select the remaining plurality of the probes as voltage measuring pins to measure a plurality of voltages simultaneously;

[0071] A processing module is configured to obtain a voltage distribution curve based on the multiple voltages, and calculate a parameter of the measurement object according to the current and the voltage distribution curve.

[0072] The difference between this embodiment and embodiment 1 is that each type of probe in this embodiment includes at least 5 probes, the probes of each type of probe are arranged in a straight line, and the intervals between adjacent probes of the probe are the same or different. Figure 2 Three types of probes are shown, one type of probe in each dotted box. The measurement circuit is configured (for example, using a multiplexer to select any two probes as current carrying pins, coupling the two current carrying pins to a current source, and coupling the remaining probes to multiple voltmeters. This coupling allows the voltage to be measured simultaneously at multiple voltmeters when current is injected, thereby effectively performing multiple measurements in parallel, such as 5 probes, 2 of which are current carrying pins, and 3 probes can be combined in pairs to measure 3 voltage values ​​simultaneously. By effectively performing multiple measurements in parallel, the measurement time can be shortened, the measurement error caused by the vibration of the probe spacing can be reduced, and the life of the probe can be further extended (due to the reduced contact time).

[0073] The types of measurement objects and parameters of various types of probes in this embodiment refer to those in Embodiment 1.

[0074] Example 4

[0075] This embodiment provides a measurement method of a multi-probe measurement device, based on the multi-probe measurement device described in Embodiment 3, the method includes:

[0076] Select the corresponding type of probe according to the type of measurement object;

[0077] Based on the selected probe, establishing electrical contact between the probe tip of the probe and the measurement object;

[0078] Select two probes as current carrying pins to inject current, and select the remaining multiple probes as voltage measuring pins to measure multiple voltages simultaneously;

[0079] The parameters of the measurement object are obtained through a processing module.

[0080] Specifically, a measurement object is placed on a measurement stand platform, and a corresponding type of probe is selected according to the type of the measurement object; appropriate pressure is applied to form an ohmic connection between the probe and the surface of the measurement object, a small current is passed through two of the probes using a constant current source, and a voltage detection circuit measures the voltage between the other multiple probes. The method measures the voltage at multiple voltmeters simultaneously when the current is injected, thereby effectively performing multiple measurements in parallel, which can shorten the measurement time, reduce the measurement error caused by the vibration of the probe interval, and further extend the life of the probe.

[0081] The number of probes of the probes of Embodiment 3 and Embodiment 4 is more than 5, so that multiple voltages can be obtained simultaneously, the measurement accuracy is improved, and the measurement time can be saved.

[0082] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A multi-probe measuring device, characterized in that: include: Various types of probes, each type of probe includes 4 probes; A plurality of measurement circuits, each of the measurement circuits being connected to a type of probe; The measuring circuit measures the measuring object by using the corresponding probe, and the measuring circuit is configured to: Select two of the probes as current carrying pins to inject current, and the other two of the probes as voltage measuring pins to measure voltage; A processing module is used to calculate the parameters of the measurement object according to the current and the voltage.

2. The multi-probe measuring device according to claim 1, characterized in that: The four probes of each type of the probe are arranged in a straight line.

3. The multi-probe measuring device according to claim 2, characterized in that: The intervals between adjacent probes of the probe head are the same.

4. The multi-probe measuring device according to claim 1, characterized in that: The types of the measurement objects include: substrate wafers, epitaxial wafers, metal wafers, diffusion wafers, ion implantation wafers or gettering wafers; the multiple types of probes are respectively used to measure different types of the measurement objects.

5. A multi-probe measuring device, characterized in that: include: Multiple types of probes, each type of probe includes at least 5 probes; A plurality of measurement circuits, each of the measurement circuits being connected to one type of the probe; The measuring circuit measures the measuring object by using the corresponding probe, and the measuring circuit is configured to: Select two of the probes as current carrying pins to inject current, and select the remaining plurality of the probes as voltage measuring pins to measure a plurality of voltages simultaneously; A processing module is configured to obtain a voltage distribution curve based on the multiple voltages, and calculate a parameter of the measurement object according to the current and the voltage distribution curve.

6. The multi-probe measuring device according to claim 5, characterized in that: The probes of each type of the probe head are arranged in a straight line.

7. The multi-probe measuring device according to claim 6, characterized in that: The intervals between adjacent probes of the probe head are the same or different.

8. The multi-probe measuring device according to claim 6, characterized in that: The probes of all the probes are arranged in a straight line or multiple parallel straight lines or in a "M" shape.

9. A measurement method of a multi-probe measurement device, characterized in that: Based on the multi-probe measurement device according to any one of claims 1 to 4, the method comprises: Select the corresponding type of probe according to the type of measurement object; Based on the selected probe, establishing electrical contact between the probe tip of the probe and the measurement object; Select two probes as current carrying pins to inject current and the other two probes as voltage measuring pins to measure voltage; The parameters of the measurement object are obtained through a processing module.

10. A measurement method using a multi-probe measurement device, characterized in that: Based on the multi-probe measurement device according to any one of claims 5 to 8, the method comprises: Select the corresponding type of probe according to the type of measurement object; Based on the selected probe, establishing electrical contact between the probe tip of the probe and the measurement object; Select two probes as current carrying pins to inject current, and select the remaining multiple probes as voltage measuring pins to measure multiple voltages simultaneously; The parameters of the measurement object are obtained through a processing module.

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