Electric heating anti-icing multilayer structure based on copper-clad PI film and graphene

Abstract

The invention relates to an electric heating anti-icing multi-layer structure based on a copper-clad PI film and graphene. The electric heating anti-icing multi-layer structure sequentially comprises a surface insulating layer, an adhesive film layer, a graphene heating layer, an adhesive film layer and a surface insulating layer, and the graphene heating layer is provided with a copper-clad PI film layer. The method comprises the following steps: etching a copper foil on a polyimide film to obtain an etched copper electrode film; the preparation method comprises the following steps: uniformly dispersing graphene and polyimide resin through vacuum stirring, coating the surface of a polyimide electrode film with the graphene and polyimide resin through a tape casting method, and performing high-temperature curing to obtain a graphene heating layer with smooth appearance and uniform sheet resistance; and molding the heating layer and the composite material through an autoclave to obtain the wing-shaped electric heating anti-icing assembly.

Description

Technical Field

[0001] The present invention relates to the field of electrothermal anti-icing, and in particular to an electrothermal anti-icing multilayer structure based on a copper-clad PI film and graphene. Background Art

[0002] Aircraft flying at high altitudes may encounter large, supercooled water droplets, which can cause ice to form on wing surfaces, engine inlet leading edges, and other locations, compromising flight safety. Installing electric heating anti-icing components in required areas of the aircraft is currently a primary method for achieving de-icing, offering the advantages of low power consumption and controllable heating power.

[0003] Traditional metal electric heating components are heavy and have poor wave transmission performance, which is not conducive to the development trend of high maneuverability and high stealth aircraft. At present, research on using graphene heating materials to replace traditional metal electric heating anti-icing components is widely carried out. Compared with metal materials, graphene heating materials have the following advantages: (1) surface heating characteristics. After the component is partially punctured, as long as there are graphene interconnected pathways, it can continue to work, thereby improving the attack resistance of the aircraft anti-icing component; (2) good wave transmission performance, which is conducive to improving the stealth performance of the aircraft; (3) light weight, which is conducive to reducing the weight of the aircraft and improving maneuverability. Summary of the Invention

[0004] The purpose of the present invention is to overcome the many shortcomings of existing metal heating anti-icing components and provide an electric heating anti-icing component using a graphene-etched copper polyimide electrode film and a preparation method thereof, so as to fully utilize the uniform heating characteristics of graphene and copper electrodes to exert a deicing effect.

[0005] The technical solution of the present invention is:

[0006] An electric thermal anti-icing multilayer structure based on copper-clad PI film and graphene is provided, wherein the layers of the electric thermal anti-icing multilayer structure are a surface insulation layer, an adhesive film layer, a graphene heating layer, an adhesive film layer and a surface insulation layer in sequence; and the graphene heating layer has a copper-clad PI film layer.

[0007] Furthermore, the copper-clad PI film layer is a polyimide film with electrodes that is integrated on a polyimide base film by electroplating.

[0008] Furthermore, the graphene heating layer has a two-layer structure, one layer is a graphene layer, and the other layer is a copper-clad PI film layer or a polyimide film with electrodes.

[0009] Furthermore, the electrodes are arranged longitudinally and / or transversely, and can also be arranged at equal intervals, thereby improving the heating efficiency after power is applied.

[0010] Furthermore, the adhesive film layer is formed of multiple layers of prepreg, which can cover the entire graphene heating layer. It has good ductility and contacts and fits with the wing.

[0011] Furthermore, the preparation process of the copper-clad PI film layer is:

[0012] Step 1: forming a copper polyimide electrode film on the copper-plated polyimide film by etching;

[0013] Step 2: Ultrasonic stirring is used to uniformly disperse the graphene conductive filler in the polyimide resin to form a uniform mixed slurry;

[0014] Step 3: Pour the mixed slurry into a vacuum mixer and stir under vacuum;

[0015] Step 4: Fix the copper polyimide electrode film on the coating machine, start the coating machine and lower the scraper, pour the mixed slurry into the coating area, and the scraper limits the thickness as it moves to form a uniform slurry layer;

[0016] Step 5: heating and curing the copper polyimide electrode film coated with the slurry;

[0017] Step 6: Lay the film layer prepreg, heating layer, and film layer prepreg in the airfoil mold in sequence, and weld the wires to lead out;

[0018] Step 7: Lay a surface insulation layer or skin on the film layer to prepare an airfoil-shaped electric heating anti-icing component.

[0019] A copper electrode is etched on the polyimide base film. Graphene is evenly mixed in the polyimide resin and then coated on the surface of the etched copper polyimide electrode film by a tape casting method. The electrode heating layer is prepared by high-temperature curing.

[0020] The anti-icing and deicing system based on the graphene heating film described in the present invention has a heating layer whose raw material is prepared by dispersing graphene in a polyimide resin. After the raw material is dispersed, it is coated on a polyimide base film with electrodes and then cured at high temperature to form a heating layer.

[0021] The advantages of the present invention are: the present invention achieves good adhesion between the resin and the base film by coating a graphene heating layer on the surface of the PI electroplated with copper electrodes, which can effectively reduce the influence of the electrode on the surface shape of the heating film, maintain flatness, and can prepare wing-shaped electric heating anti-icing samples. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural principle diagram of the present invention;

[0023] Figure 2 It is a partial structural principle diagram of the present invention;

[0024] Among them: 1 - film layer, 2 - graphene heating layer, 3 - copper-clad PI film layer, 4 - surface insulation layer or skin. DETAILED DESCRIPTION

[0025] The disclosed examples will be described more fully with reference to the accompanying drawings, in which some (but not all) of the disclosed examples are shown. In fact, many different examples can be described and these examples should not be construed as limited to the examples set forth herein. Instead, these examples are described so that this disclosure will be thorough and complete and will fully convey the scope of the disclosure to those skilled in the art.

[0026] An electric thermal anti-icing multilayer structure based on copper-clad PI film and graphene is provided, wherein the layers of the electric thermal anti-icing multilayer structure are a surface insulation layer, an adhesive film layer, a graphene heating layer, an adhesive film layer and a surface insulation layer in sequence; and the graphene heating layer has a copper-clad PI film layer.

[0027] The copper-clad PI film layer is a polyimide film with electrodes that is integrated on a polyimide base film by electroplating.

[0028] The graphene heating layer has a two-layer structure, one layer is a graphene layer, and the other layer is a copper-clad PI film layer or a polyimide film with electrodes.

[0029] The electrodes are arranged longitudinally and / or transversely, and can also be arranged at equal intervals, thereby improving the heating efficiency after power is applied.

[0030] The adhesive film layer is formed by multi-layer prepreg and can cover the entire graphene heating layer. It has good ductility and contacts and fits with the wing.

[0031] The preparation process of the copper-clad PI film layer is as follows:

[0032] Step 1: forming a copper polyimide electrode film on the copper-plated polyimide film by etching;

[0033] Step 2: Ultrasonic stirring is used to uniformly disperse the graphene conductive filler in the polyimide resin to form a uniform mixed slurry;

[0034] Step 3: Pour the mixed slurry into a vacuum mixer and stir under vacuum;

[0035] Step 4: Fix the copper polyimide electrode film on the coating machine, start the coating machine and lower the scraper, pour the mixed slurry into the coating area, and the scraper limits the thickness as it moves to form a uniform slurry layer;

[0036] Step 5: heating and curing the copper polyimide electrode film coated with the slurry;

[0037] Step 6: Lay the film layer prepreg, heating layer, and film layer prepreg in the airfoil mold in sequence, and weld the wires to lead out;

[0038] Step 7: Lay a surface insulation layer or skin on the film layer to prepare an airfoil-shaped electric heating anti-icing component.

[0039] A copper electrode is etched on the polyimide base film. Graphene is evenly mixed in the polyimide resin and then coated on the surface of the etched copper polyimide electrode film by a tape casting method. The electrode heating layer is prepared by high-temperature curing.

[0040] The description of various advantageous arrangements has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the examples disclosed. Many modifications and variations will be apparent to those skilled in the art. In addition, different advantageous examples may describe different advantages compared to other advantageous examples. The selected example or examples are chosen and described to best illustrate the principles of the examples, their practical application, and to enable those skilled in the art to understand the disclosure with various examples with various modifications suitable for the particular use contemplated.

Claims

1. An electrothermal anti-icing multilayer structure based on copper-clad PI film and graphene, characterized in that: The layers of the electrothermal anti-icing multilayer structure are, in sequence, a surface insulating layer, an adhesive film layer, a graphene heating layer, an adhesive film layer and a surface insulating layer; and the graphene heating layer has a copper-clad PI film layer.

2. The electrothermal anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The copper-clad PI film layer is a polyimide film with electrodes that is integrated on a polyimide base film by electroplating.

3. The electric heating anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The graphene heating layer is a two-layer structure, one layer is a graphene layer, and the other layer is a copper-clad PI film layer or a polyimide film with electrodes.

4. The electrothermal anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The number of electrodes is plural.

5. The electric heating anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The electrodes are arranged longitudinally and / or transversely.

6. The electrothermal anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The electrodes are arranged at equal intervals.

7. The electric heating anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The adhesive film layer is formed of multiple layers of prepreg, which can cover the entire graphene heating layer, has good ductility, and is in contact with and fits the wing.

8. The electrothermal anti-icing multilayer structure based on copper-clad PI film and graphene as claimed in claim 1, characterized in that: The preparation process of the copper-clad PI film layer is as follows: Step 1, forming a copper polyimide electrode film on the copper-plated polyimide film by etching; Step 2: Ultrasonic stirring is used to evenly disperse the graphene conductive filler in the polyimide resin to form a uniform mixed slurry; Step 3, pouring the mixed slurry into a vacuum mixer, and stirring under vacuum; Step 4: fix the copper polyimide electrode film on the coating machine, start the coating machine and lower the scraper, pour the mixed slurry into the coating area, and the scraper limits the thickness to form a slurry layer with uniform thickness as it moves; Step 5, heating and curing the copper polyimide electrode film coated with the slurry; Step 6: Lay the adhesive film layer prepreg, the heating layer, and the adhesive film layer prepreg in the airfoil mold in sequence, and weld the wires to lead out; Step 7: Lay a surface insulation layer or skin on the film layer to prepare an airfoil-shaped electric heating anti-icing component.

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