High-stability epoxy sealing material and preparation method thereof

Abstract

The invention relates to the technical field of sealing materials, in particular to a high-stability epoxy sealing material and a preparation method thereof. The epoxy sealing material comprises the following raw materials in parts by weight: 80-100 parts of epoxy resin, 5-30 parts of filler and 35-52 parts of curing agent. Wherein the epoxy resin is at least one of glycidyl amine type epoxy resin, alicyclic epoxy resin, bisphenol A type epoxy resin or fatty acid type epoxy resin. The invention aims to improve the thermal properties and electrical properties of the epoxy sealing material from the aspects of filler design and modification and material curing process optimization, so that the epoxy sealing material obtained by selecting and modifying the epoxy resin and matching the filler with the curing agent has good temperature resistance and dielectric properties, and can be applied to the field of sealing materials. And the device can be applied to machining under different working conditions and is wide in application range.

Description

Technical Field

[0001] The invention relates to the technical field of sealing materials, and in particular to a high-stability epoxy sealing material and a preparation method thereof. Background Art

[0002] Electronic packaging materials are widely used in the packaging field because of their good electrical and thermal properties. However, with the miniaturization and high-power development trend of electronic devices, higher requirements are also placed on electronic packaging materials. The size of electronic devices and logic circuits continues to shrink, and the operating frequency increases, which leads to an increase in the heat generated per unit volume during operation, resulting in cracking and debonding of packaging materials, which in turn accelerates the aging of materials and greatly affects the working efficiency and life of electrical devices. In addition, with the increase in the power density of electronic devices, more stringent requirements are placed on the dielectric properties of packaging materials. Therefore, the development of electronic packaging materials with both high heat resistance and excellent electrical properties is one of the research focuses in the packaging field.

[0003] As a major matrix of electronic packaging materials, epoxy resin has been continuously improving in terms of bonding strength, insulation and mechanical properties, and has therefore been favored by the industry. At present, the main methods used to improve the electrical and thermal properties of epoxy resin-based packaging materials include adding different types of fillers, modifying the surface of fillers, optimizing the curing process of materials, etc. These methods have shown a certain effect on improving the comprehensive performance of packaging materials. However, how to maintain the good electrical properties of epoxy resin-based packaging materials while making them have high heat resistance and stability requires continuous in-depth exploration. Summary of the invention

[0004] The purpose of the present invention is to solve the above-mentioned deficiencies of the prior art and to provide a highly stable epoxy sealing material and a preparation method thereof, aiming to improve the thermal and electrical properties of the epoxy sealing material by jointly improving the filler design and modification, and optimizing the curing process of the material.

[0005] The purpose of the present invention is achieved through the following technical scheme: The present invention provides a high-stability epoxy sealing material, comprising the following raw materials in parts by weight: 80-100 parts of epoxy resin, 5-30 parts of filler, and 35-52 parts of curing agent.

[0006] Furthermore, the epoxy resin is at least one of a glycidylamine epoxy resin, a bisphenol A epoxy resin, an alicyclic epoxy resin or a fatty acid epoxy resin. As a preferred embodiment of the present invention, the epoxy resin is a composition of a bisphenol A epoxy resin, a glycidylamine epoxy resin, and (alicyclic epoxy resin or fatty acid epoxy resin) in a mass ratio of 10:1:1-2. Among them, the bisphenol A epoxy resin is F51, the glycidylamine epoxy resin is AG80, and the alicyclic epoxy resin is TD585.

[0007] Furthermore, it also includes 0-20 parts of modified epoxy resin. In the present invention, the preparation method of the modified epoxy resin includes the following steps:

[0008] S1. Add isopropyl alcohol, hexyl orthosilicate, silane coupling agent and organotin catalyst into a reaction container and mix them evenly, then heat to 60-65° C., dropwise add hydrochloric acid aqueous solution, and react at constant temperature for 3-5 hours;

[0009] S2. After the reaction is completed, the mixture is cooled to room temperature, and the reaction product of step S1 is transferred to a rotary evaporator, and bisphenol E epoxy resin is added to perform vacuum rotary evaporation to obtain the modified epoxy resin.

[0010] Furthermore, in step S1, the mass ratio of isopropyl alcohol, hexyl orthosilicate and silane coupling agent is 1:1:(10-15). In step S2, the reaction product of step S1 is 0.5-2% of the mass of bisphenol E epoxy resin.

[0011] Furthermore, the filler includes a first filler, and the first filler is at least one of silicon carbide, boron nitride and aluminum nitride.

[0012] Furthermore, the surface modification treatment method of the first filler comprises the following steps: (1) placing the first filler in isopropanol and ultrasonically oscillating it uniformly, then adding NaOH solution, heating it at a constant temperature of 120-130° C. for 24-48 hours, washing it with deionized water, and drying it for later use; (2) taking a silane coupling agent and adding it to deionized water, adjusting the solution to be weakly acidic, after ultrasonic oscillation, adding the first filler obtained in step (1), and ultrasonically oscillating it at 80-95° C. for 20-24 hours, so as to obtain the first filler after the surface modification treatment.

[0013] In the present invention, the addition of the first filler can effectively improve the thermal conductivity of the epoxy sealing material, and as the content of the first filler increases, it forms a thermal conductive network in the epoxy resin matrix, which can significantly improve the thermal conductivity and dielectric properties of the epoxy sealing material. The surface modification of the first filler by the above-mentioned treatment method can make it evenly dispersed in the epoxy resin matrix, reducing problems such as stress concentration caused by differences in interface compatibility.

[0014] Furthermore, the filler also includes a second filler, and the second filler is bismaleic polyimide or phenolphthalein polyaryletherketone.

[0015] Furthermore, the mass ratio of the first filler to the second filler is (0.5-2): 1. The present invention can significantly improve the thermal and dielectric properties of the epoxy sealing material by combining the first filler with the second filler, and the introduction of the second filler can compensate for the interface problems caused by the first filler.

[0016] Furthermore, the curing agent is at least one of diaminodiphenyl sulfone, imidazole compounds, polyetheramine curing agents or phenolic amine curing agents.

[0017] Furthermore, the phenolic amine curing agent includes the following preparation steps: adding polyformaldehyde to diethylenetriamine to fully dissolve to obtain a mixed solution, then dissolving 4-tert-butylcatechol in anhydrous ethanol, adding the mixed solution thereto, keeping warm and refluxing for 4-4.5 hours, and then distilling under reduced pressure to obtain the curing agent.

[0018] Furthermore, the mass ratio of the paraformaldehyde, diethylenetriamine and 4-tert-butylcatechol is 1:(4-4.15):(5.5-5.6).

[0019] In the present invention, the phenolic amine curing agent obtained by the above preparation method can significantly improve the bonding performance of the epoxy sealing material, and improve the durability and weather resistance of the epoxy sealing material in a humid and high temperature environment. As a preferred embodiment of the present invention, the curing agent is prepared by combining an imidazole compound with a phenolic amine curing agent. By combining the imidazole compound with the phenolic amine curing agent, the epoxy sealing material can be cured in a wider temperature range, has good adaptability and high flexibility, and thus meets the use requirements under different working conditions.

[0020] Furthermore, the epoxy sealing material also includes any one or more of a coupling agent, a toughening agent, a flame retardant, a defoamer, a release agent, and a colorant. Among them, the coupling agent includes but is not limited to a silane coupling agent, the toughening agent is preferably but not limited to a silicone resin, a nitrile rubber, the flame retardant is preferably but not limited to a metal hydroxide, a phosphate, a zinc borate or a combination thereof, the defoamer is preferably but not limited to a silicone defoamer, a mineral oil defoamer or a polyether defoamer, the release agent is preferably but not limited to polyethylene wax, fatty acid wax, amide wax or a combination thereof, and the colorant is preferably but not limited to carbon black, titanium dioxide, etc. The aforementioned components can be flexibly added or adjusted according to actual application requirements, and the mass of one or more combinations of the aforementioned components is 0.1-3% of the total amount of the epoxy resin.

[0021] The present invention also provides a method for preparing the above-mentioned high-stability epoxy sealing material, comprising the following steps: adding epoxy resin into a mixer, heating and stirring until completely melted, then adding filler to the completely melted resin, continuing to stir until completely mixed, and then adding a curing agent and mixing evenly to obtain the epoxy sealing material.

[0022] The beneficial effects of the present invention are:

[0023] (1) The present invention uses epoxy resin, filler and curing agent as main raw materials, and the obtained epoxy sealing material has good temperature resistance and electrical properties, and can be used for processing under different working conditions, and has a wide range of applications.

[0024] (2) The present invention introduces nano-silicon oxide so that it is well dispersed in the epoxy resin system to form a stable network structure, and a synergistic effect occurs, thereby significantly improving the flexibility and temperature stability of the modified epoxy resin.

[0025] (3) The present invention can significantly improve the temperature resistance and dielectric properties of the epoxy sealing material by combining the first filler and the second filler, and can compensate for the interface problems caused by the first filler by introducing the second filler, thereby improving the toughness and weather resistance of the epoxy sealing material.

[0026] (4) The present invention can achieve controllable curing of epoxy sealing materials within a wide temperature range through a combination of specific curing agents, and can be adjusted and used according to the actual needs of different working conditions, with high flexibility and wide applicability. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with embodiments, and the contents mentioned in the implementation modes are not intended to limit the present invention.

[0028] Example 1

[0029] This embodiment provides a high-stability epoxy sealing material, which includes the following raw materials in parts by weight: 80 parts of epoxy resin, 13 parts of filler, and 37 parts of curing agent.

[0030] Furthermore, the epoxy resin is a composition of bisphenol A epoxy resin, glycidylamine epoxy resin, and fatty acid epoxy resin in a mass ratio of 10:1:1. The bisphenol A epoxy resin is F51, and the glycidylamine epoxy resin is AG80.

[0031] Furthermore, the filler includes a first filler, which is composed of boron nitride with a particle size of 5 μm and aluminum nitride with a particle size of 10 μm in a mass ratio of 2:1.

[0032] Furthermore, the surface modification treatment method of the first filler comprises the following steps: (1) placing the first filler in isopropanol at a mass-to-volume ratio of 1:20 and ultrasonically oscillating it evenly overnight, then adding 200 g / L NaOH solution, heating it at a constant temperature of 125° C. for 24 hours, washing it with deionized water, and drying it for later use; (2) taking 0.5% of silane coupling agent KH-560 and adding it to deionized water, adjusting the solution to weak acidity, ultrasonically oscillating it, adding the first filler obtained in step (1), and ultrasonically oscillating it at 85° C. for 20 hours to obtain the first filler after the surface modification treatment.

[0033] Furthermore, the curing agent is prepared by mixing 2-methylimidazole and phenolic amine curing agent in a mass ratio of 3:1. The phenolic amine curing agent comprises the following preparation steps: adding paraformaldehyde to diethylenetriamine and fully dissolving it at 60°C to obtain a mixed solution, then dissolving 4-tert-butylcatechol in anhydrous ethanol, adding the mixed solution thereto, keeping the mixture at reflux for 4.5 hours, and then distilling under reduced pressure for 2 hours to obtain the curing agent.

[0034] Furthermore, the mass ratio of the paraformaldehyde, diethylenetriamine and 4-tert-butylcatechol is 1:4.1:5.55.

[0035] The preparation method of the above-mentioned high-stability epoxy sealing material in this embodiment includes the following steps: adding epoxy resin into a mixer, heating and stirring at 100°C until completely melted, then adding filler to the completely melted resin, lowering the temperature to 80°C and continuing to stir until completely mixed, and then adding a curing agent and mixing evenly to obtain the epoxy sealing material.

[0036] Example 2

[0037] This embodiment provides a high-stability epoxy sealing material, which includes the following raw materials in parts by weight: 90 parts of epoxy resin, 20 parts of filler, and 40 parts of curing agent.

[0038] Furthermore, the epoxy resin is a composition of bisphenol A epoxy resin, glycidylamine epoxy resin, and alicyclic epoxy resin in a mass ratio of 10:1:1.5, wherein the bisphenol A epoxy resin is F51, the glycidylamine epoxy resin is AG80, and the alicyclic epoxy resin is TD585.

[0039] Furthermore, it also includes 9 parts of modified epoxy resin. In the present invention, the preparation method of the modified epoxy resin includes the following steps:

[0040] S1. Add isopropyl alcohol, hexyl orthosilicate, silane coupling agent KH-560 and stannous octoate into a reaction container and mix well. Then heat to 60° C., dropwise add hydrochloric acid aqueous solution, and react at constant temperature for 4 hours.

[0041] S2. After the reaction is completed, the mixture is cooled to room temperature, and the reaction product of step S1 is transferred to a rotary evaporator. Bisphenol E epoxy resin E51 is added and vacuum rotary evaporation is performed to obtain the modified epoxy resin.

[0042] Furthermore, in step S1, the mass ratio of isopropyl alcohol, hexyl orthosilicate, and silane coupling agent KH-560 is 1:1:12. In step S2, the reaction product of step S1 is 0.8% of the mass of bisphenol E epoxy resin E51.

[0043] Furthermore, the filler includes a first filler, which is composed of boron nitride with a particle size of 5 μm and aluminum nitride with a particle size of 10 μm in a mass ratio of 2:1.

[0044] Furthermore, the surface modification treatment method of the first filler includes the following steps: (1) placing the first filler in isopropanol at a mass volume ratio of 1:20 and ultrasonically oscillating it uniformly, then adding 200g / L NaOH solution, heating it at a constant temperature of 125°C for 48h, washing it with deionized water, and drying it for later use; (2) taking 0.5% silane coupling agent KH-560 and adding it to deionized water, adjusting the solution to weak acidity, after ultrasonic oscillation, adding the first filler obtained in step (1), and ultrasonically oscillating it at 90°C for 24h to obtain the first filler after the surface modification treatment.

[0045] Furthermore, the curing agent is prepared by mixing 2-methylimidazole and phenolic amine curing agent in a mass ratio of 3:1. Paraformaldehyde is added to diethylenetriamine and fully dissolved at 60°C to obtain a mixed solution, then 4-tert-butylcatechol is dissolved in anhydrous ethanol, the mixed solution is added thereto, the mixture is kept warm and refluxed for 45 hours, and then the curing agent is obtained after reduced pressure distillation for 2 hours.

[0046] Furthermore, the mass ratio of the paraformaldehyde, diethylenetriamine and 4-tert-butylcatechol is 1:4.1:5.55.

[0047] The preparation method of the above-mentioned high-stability epoxy sealing material in this embodiment includes the following steps: adding epoxy resin into a mixer, heating and stirring at 100°C until completely melted, then adding filler to the completely melted resin, lowering the temperature to 80°C and continuing to stir until completely mixed, and then adding a curing agent and mixing evenly to obtain the epoxy sealing material.

[0048] Example 3

[0049] This embodiment provides a high-stability epoxy sealing material, which includes the following raw materials in parts by weight: 90 parts of epoxy resin, 25 parts of filler, and 42 parts of curing agent.

[0050] Furthermore, the epoxy resin is a composition of bisphenol A epoxy resin, glycidylamine epoxy resin, and alicyclic epoxy resin in a mass ratio of 10:1:1.5, wherein the bisphenol A epoxy resin is F51, the glycidylamine epoxy resin is AG80, and the alicyclic epoxy resin is TD585.

[0051] Furthermore, it also includes 15 parts of modified epoxy resin. In the present invention, the preparation method of the modified epoxy resin includes the following steps:

[0052] S1. Add isopropyl alcohol, hexyl orthosilicate, silane coupling agent KH-560 and stannous octoate into a reaction container and mix them evenly. Then heat to 65° C., dropwise add hydrochloric acid aqueous solution, and react at constant temperature for 4 hours.

[0053] S2. After the reaction is completed, the mixture is cooled to room temperature, and the reaction product of step S1 is transferred to a rotary evaporator. Bisphenol E epoxy resin E51 is added and vacuum rotary evaporation is performed to obtain the modified epoxy resin.

[0054] Furthermore, in step S1, the mass ratio of isopropyl alcohol, hexyl orthosilicate, and silane coupling agent KH-560 is 1:1:15. In step S2, the reaction product of step S1 is 1.2% of the mass of bisphenol E epoxy resin.

[0055] Furthermore, the filler includes a first filler, which is composed of boron nitride with a particle size of 5 μm and aluminum nitride with a particle size of 10 μm in a mass ratio of 2:1.

[0056] Furthermore, the surface modification treatment method of the first filler includes the following steps: (1) placing the first filler in isopropanol at a mass volume ratio of 1:20 and ultrasonically oscillating it uniformly, then adding 200g / L NaOH solution, heating it at a constant temperature of 125°C for 48h, washing it with deionized water, and drying it for later use; (2) taking 0.5% silane coupling agent KH-560 and adding it to deionized water, adjusting the solution to weak acidity, after ultrasonic oscillation, adding the first filler obtained in step (1), and ultrasonically oscillating it at 90°C for 24h to obtain the first filler after the surface modification treatment.

[0057] Furthermore, the filler also includes a second filler, and the second filler is bismaleic polyimide. The mass ratio of the first filler to the second filler is 1:1.

[0058] Furthermore, the curing agent is prepared by mixing 2-methylimidazole and phenolic amine curing agent in a mass ratio of 3:1. The phenolic amine curing agent comprises the following preparation steps: adding paraformaldehyde to diethylenetriamine and fully dissolving it at 60°C to obtain a mixed solution, then dissolving 4-tert-butylcatechol in anhydrous ethanol, adding the mixed solution thereto, keeping the mixture at reflux for 4.5 hours, and then distilling under reduced pressure for 2 hours to obtain the curing agent.

[0059] Furthermore, the mass ratio of the paraformaldehyde, diethylenetriamine and 4-tert-butylcatechol is 1:4.15:5.55.

[0060] The preparation method of the above-mentioned high-stability epoxy sealing material in this embodiment includes the following steps: adding epoxy resin into a mixer, heating and stirring at 100°C until completely melted, then adding filler to the completely melted resin, lowering the temperature to 80°C and continuing to stir until completely mixed, and then adding a curing agent and mixing evenly to obtain the epoxy sealing material.

[0061] Example 4

[0062] This embodiment provides a high-stability epoxy sealing material, which includes the following raw materials in parts by weight: 100 parts of epoxy resin, 30 parts of filler, and 50 parts of curing agent.

[0063] Furthermore, the epoxy resin is a composition of bisphenol A epoxy resin, glycidylamine epoxy resin, and alicyclic epoxy resin in a mass ratio of 10:1:1.5, wherein the bisphenol A epoxy resin is F51, the glycidylamine epoxy resin is AG80, and the alicyclic epoxy resin is TD585.

[0064] Furthermore, it also includes 18 parts of modified epoxy resin. In the present invention, the preparation method of the modified epoxy resin includes the following steps:

[0065] S1. Add isopropyl alcohol, hexyl orthosilicate, silane coupling agent KH-560 and stannous octoate into a reaction container and mix well. Then heat to 60° C., dropwise add hydrochloric acid aqueous solution, and react at constant temperature for 5 hours.

[0066] S2. After the reaction is completed, the mixture is cooled to room temperature, and the reaction product of step S1 is transferred to a rotary evaporator. Bisphenol E epoxy resin E51 is added and vacuum rotary evaporation is performed to obtain the modified epoxy resin.

[0067] Furthermore, in step S1, the mass ratio of isopropyl alcohol, hexyl orthosilicate, and silane coupling agent KH-560 is 1:1:13. In step S2, the reaction product of step S1 is 1% of the mass of bisphenol E epoxy resin.

[0068] Furthermore, the filler includes a first filler, which is composed of boron nitride with a particle size of 5 μm and aluminum nitride with a particle size of 10 μm in a mass ratio of 2:1.

[0069] Furthermore, the surface modification treatment method of the first filler includes the following steps: (1) placing the first filler in isopropanol for ultrasonic vibration, adding NaOH solution, heating at a constant temperature of 120° C. for 48 hours, washing with deionized water, and drying for standby use; (2) taking 0.5% silane coupling agent KH-560 and adding it to deionized water, adjusting the solution to weak acidity, after ultrasonic vibration, adding the standby first filler obtained in step (1), and ultrasonically vibrating at 85° C. to obtain the first filler after the surface modification treatment.

[0070] Furthermore, the filler also includes a second filler, the second filler is phenolphthalein polyaryletherketone, and the mass ratio of the first filler to the second filler is 1.4:1.

[0071] Furthermore, the curing agent is prepared by mixing 2-methylimidazole and phenolic amine curing agent in a mass ratio of 3:1. The phenolic amine curing agent comprises the following preparation steps: adding paraformaldehyde to diethylenetriamine and fully dissolving it at 60°C to obtain a mixed solution, then dissolving 4-tert-butylcatechol in anhydrous ethanol, adding the mixed solution thereto, keeping the mixture at reflux for 4.5 hours, and then distilling under reduced pressure for 2 hours to obtain the curing agent.

[0072] Furthermore, the mass ratio of the paraformaldehyde, diethylenetriamine and 4-tert-butylcatechol is 1:4.1:5.5.

[0073] Furthermore, the epoxy sealing material also includes 10 parts of a flame retardant and 2 parts of a colorant, the flame retardant is zinc borate, and the colorant is carbon black.

[0074] The preparation method of the above-mentioned high-stability epoxy sealing material in this embodiment includes the following steps: adding epoxy resin into a mixer, heating and stirring at 100°C until completely melted, then adding filler to the completely melted resin, lowering the temperature to 80°C and continuing to stir until completely mixed, and then adding a curing agent and mixing evenly to obtain the epoxy sealing material.

[0075] Comparative Example 1

[0076] The difference between this comparative example and Example 1 is that this comparative example uses an equal amount of epoxy resin E51 to replace the epoxy resin in Example 3.

[0077] Comparative Example 2

[0078] The difference between this comparative example and Example 1 is that silicon dioxide is used in this example to replace the filler in Example 3.

[0079] Comparative Example 3

[0080] The difference between this comparative example and Example 1 is that the curing agent T31 is used in this comparative example instead of the curing agent in Example 3.

[0081] In the present invention, the epoxy sealing materials prepared in the above-mentioned Examples 1-4 and Comparative Examples 1-3 are tested for performance as follows:

[0082] The Shore hardness was tested on the front hardness of the cured samples using a Shore hardness tester type D. Each group of samples was tested 5 times and the average value was taken. The samples were obtained by curing the glue obtained in the corresponding embodiment at 180°C for 2 hours in a mold;

[0083] The dielectric properties were measured using an Alpha-A broadband dielectric spectrum analyzer, with a sample size of 9mm*9mm*100μm, a test frequency range of 100-106Hz, an electrode diameter of 9mm, and a test temperature of 50°C.

[0084] The glass transition temperature Tg was tested using a TA company dynamic thermomechanical analyzer (DMAQ800) in double cantilever mode, with a heating rate of 3 °C / min, a temperature range of RT-300 °C, and a frequency of 1 Hz;

[0085] The thermal conductivity was tested using the LFA447 laser thermal conductivity tester from Netzsch, Germany. The sample diameter was 12.7 mm and the thickness was 1 mm. The test mold needed to be sprayed on the sample surface for testing.

[0086] The test results are shown in the following table.

[0087]

[0088] From the data in the above table, it can be seen that the epoxy sealing materials prepared in Examples 1-4 of the present invention have a moderate hardness in the range of 80-84A; a dielectric constant in the range of 3.8-4.1, having good dielectric properties; and a thermal conductivity in the range of 0.21-0.24 W·m -1 ·K -1Between, indicating that, the glass transition temperature is between 218-230 ℃, indicating that it has excellent heat resistance. By comparing Example 3 with Comparative Example 1, it can be seen that the present invention uses a combination of bisphenol A epoxy resin, glycidylamine epoxy resin, alicyclic epoxy resin and modified epoxy resin as the main raw materials, so that the flexibility and rigidity of the epoxy resin matrix are balanced, the temperature resistance stability is good and the insulation is good. On this basis, the addition of fillers further improves the thermal properties of the epoxy sealing material while maintaining its good mechanical properties; further, by comparing Comparative Example 3 with Example 3, it can be seen that the present invention makes the epoxy sealing material have a wide temperature curing range through the clever combination of curing agents, can be flexibly applied to different working conditions, and maintain good processing performance and comprehensive performance.

[0089] The above specific embodiments are further explanations of the technical solutions and beneficial effects of the present invention, and are not limitations of the implementation methods. For those skilled in the art, any obvious replacements that do not depart from the concept of the present invention are within the protection scope of the present invention.

Claims

1. A high-stability epoxy sealing material, characterized in that: The invention comprises the following raw materials in parts by weight: 80-100 parts of epoxy resin, 5-30 parts of filler and 35-52 parts of curing agent.

2. The high-stability epoxy sealing material according to claim 1, characterized in that: The epoxy resin is at least one of a glycidylamine epoxy resin, an alicyclic epoxy resin, a bisphenol A epoxy resin or a fatty acid epoxy resin.

3. The high-stability epoxy sealing material according to claim 1, characterized in that: Also includes 0-20 parts of modified epoxy resin.

4. The high-stability epoxy sealing material according to claim 1, characterized in that: The filler includes a first filler, and the first filler is at least one of silicon carbide, boron nitride and aluminum nitride.

5. The high-stability epoxy sealing material according to claim 1, characterized in that: The surface modification treatment method of the first filler comprises the following steps: (1) placing the first filler in isopropanol for uniform ultrasonic vibration, then adding NaOH solution, heating at a constant temperature of 120-130° C. for 24-48 hours, washing with deionized water, and drying for standby use; (2) adding a silane coupling agent to deionized water, adjusting the solution to weak acidity, ultrasonically vibrating, adding the standby first filler obtained in step (1), and ultrasonically vibrating at 80-95° C. to obtain the first filler after surface modification treatment.

6. The high-stability epoxy sealing material according to claim 1, characterized in that: The filler also includes a second filler, and the second filler is bismaleic polyimide or phenolphthalein polyaryletherketone.

7. The high-stability epoxy sealing material according to claim 1, characterized in that: The curing agent is at least one of diaminodiphenyl sulfone, imidazole compound, polyetheramine curing agent or phenolic amine curing agent.

8. The high-stability epoxy sealing material according to claim 7, characterized in that: The phenolic amine curing agent comprises the following preparation steps: adding polyformaldehyde to diethylenetriamine to fully dissolve to obtain a mixed solution, then dissolving 4-tert-butylcatechol in anhydrous ethanol, adding the mixed solution thereto, keeping warm and refluxing for 4-4.5 hours, and then performing reduced pressure distillation to obtain the curing agent.

9. The high-stability epoxy sealing material according to claim 1, characterized in that: The epoxy sealing material further comprises any one or more of a coupling agent, a toughening agent, a flame retardant, a defoaming agent, a release agent, and a colorant.

10. The method for preparing a high-stability epoxy sealing material according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: adding epoxy resin into a mixer, heating and stirring until completely melted, then adding filler into the completely melted resin, continuing to stir until completely mixed, and then adding curing agent and mixing evenly to obtain the epoxy sealing material.

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