Electroplating device

Abstract

The electroplating device comprises a central flow pipe which is arranged in an anode in a penetrating mode, one end of the central flow pipe is an anode electroplating liquid inlet, the other end of the central flow pipe extends out of the surface of the anode and is connected with a plurality of branch flow pipes extending towards the edge of the anode, and each branch flow pipe is provided with a plurality of spraying holes; the anode electroplating liquid is supplied to the anode surface through the injection holes of the branch flow pipes. Anode electroplating liquid can be drained to the surface of the anode, oxide generated on the surface of the anode is flushed away in time through impact force of the liquid, and therefore it is guaranteed that loop impedance is unchanged, and loop voltage is prevented from rising; and the flowability and the flow uniformity of the anode electroplating liquid are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to an electroplating device. Background Art

[0002] In the electroplating process, the metal block acts as the anode and the substrate is immersed in the electroplating solution. An electric field is generated on the anode surface. Under the action of the electric field, the metal is gradually deposited on the substrate surface. Figure 1 As shown, in the electroplating equipment, the anode chamber includes a low-position liquid inlet 100 and a high-position liquid outlet 200. During the electroplating process, the electroplating solution flows in from the liquid inlet 100 and spreads out in the gap between the anode plate and the bottom surface of the chamber; then, part of the electroplating solution flows upward through the central hole 300 of the anode plate, and the rest flows upward along the surrounding walls, and finally converges and flows to the high-position liquid outlet 200.

[0003] However, the flow rate in the cavity of this structure is slow and the flow field is uneven, especially the flow rate of the electroplating solution on the anode surface is very low. Since the constant current mode is used in electroplating, when the amount of electroplating is too large within a certain period of time, the oxides generated on the anode surface accumulate and cannot be washed away in time, resulting in a larger loop impedance, and the voltage of the entire loop increases and begins to alarm, so that the equipment is put into standby mode, and even the cavity needs to be manually dismantled for cleaning, which affects the electroplating rate. Summary of the invention

[0004] The object of the present invention is to provide an electroplating device for solving the problem in the prior art that oxide accumulation on the anode surface leads to increased loop impedance.

[0005] To achieve the above-mentioned object and other related objects, the present invention provides an electroplating device, comprising:

[0006] A central flow tube is arranged in the anode, one end of which is the anode plating liquid inlet, and the other end extends out of the anode surface and is connected to a plurality of branch flow tubes extending toward the edge of the anode, each branch flow tube being provided with a plurality of injection holes;

[0007] The anode plating solution is supplied to the anode surface through the injection holes of the branch flow pipe.

[0008] Furthermore, the multiple injection holes on each branch flow pipe face toward the anode surface.

[0009] Furthermore, the opening directions of the plurality of injection holes on each branch flow pipe are inclined relative to the vertical direction.

[0010] Furthermore, the plurality of injection holes on each branch flow pipe are divided into two groups, and the opening directions of the two groups of injection holes are different.

[0011] Furthermore, the opening directions of the two groups of injection holes are symmetrical with respect to the vertical direction.

[0012] Furthermore, the opening directions of every two adjacent injection holes on each branch flow pipe are different.

[0013] Furthermore, the opening directions of every two adjacent injection holes are symmetrical with respect to the vertical direction.

[0014] Furthermore, the diameters or densities of the multiple injection holes on each branch flow pipe are the same.

[0015] Furthermore, the diameters or densities of the multiple injection holes on each branch flow pipe are different.

[0016] Furthermore, the diameter or density of the multiple injection holes on each branch flow pipe gradually increases from the center to the edge along the radial direction of the anode.

[0017] Furthermore, one end of each branch flow tube away from the central flow tube is of closed design.

[0018] Furthermore, it also includes:

[0019] An anode plating solution inlet is arranged at the bottom of the anode chamber;

[0020] The anode plate covers the anode plating solution inlet and is used to support the anode; the anode plate is provided with a center hole, which is connected to the anode plating solution inlet.

[0021] Furthermore, a sealing ring is provided between the anode plate and the bottom surface of the anode chamber.

[0022] As described above, the present invention provides an electroplating device having the following beneficial effects: a central flow tube and a branch flow tube are added in the anode cavity to drain the anode plating solution to the anode surface, and the impact force of the liquid is used to promptly flush away the oxides produced on the anode surface, thereby ensuring that the loop impedance remains unchanged and avoiding an increase in the loop voltage; and through the design of multiple branch flow tubes, the fluidity of the anode plating solution and the uniformity of the flow rate are increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of an electroplating apparatus is shown;

[0024] Figure 2 Shown is a cross-sectional view of an electroplating device of the present invention;

[0025] Figure 3 Another cross-sectional view of the electroplating device of the present invention is shown;

[0026] Figure 4 Display as Figure 3 A partial enlarged view of the circled portion of the electroplating device;

[0027] Figure 5Shown is a schematic diagram of some components of the electroplating device of the present invention. DETAILED DESCRIPTION

[0028] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0029] It should be noted that the illustrations provided in this embodiment are only schematic illustrations of the basic concept of the present invention. Although the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation can be changed arbitrarily, and the component layout form may also be more complicated. In addition, the parts with the same reference numerals in multiple drawings represent the same or equivalent parts or components.

[0030] like Figure 2 , Figure 3 As shown, this embodiment provides an electroplating device, including an electroplating chamber for containing an electroplating solution, wherein the interior of the electroplating chamber is divided into an anode chamber 11 and a cathode chamber 12 , and the anode chamber 11 and the cathode chamber 12 are separated by a membrane 13 fixed on a membrane frame 14 .

[0031] The membrane 13 is a cationic membrane for copper, nickel, and tin electroplating. In addition, the membrane 13 can also be a proton exchange membrane or a conventional membrane covered with a fabric structure suitable for alloy electroplating. The membrane 13 is fixed on a membrane frame 14. The membrane frame 14 is a rigid perforated or mesh frame.

[0032] The anode chamber 11 contains an anode 111 and an anode plate 112. The anode 111 is connected to an independently controlled power supply channel (not shown in the figure) through the anode plate 112. The electroplating current or voltage is independently applied to the anode 111 by the power supply channel. The power supply channel is connected to a power supply, which can be a DC power supply or a pulse power supply. The anode 111 is made of a soluble material, such as copper, nickel, and tin. The anode 111 can be a columnar body. Figure 4 As shown, a liquid inlet 113 is provided at the bottom of the anode chamber 11 to provide an anode plating solution to the anode 111. Figure 3 As shown, a liquid outlet 114 is also provided on the top of the side wall of the anode chamber 11 for discharging the electroplating solution, decomposition products and particles in the anode chamber 11 .

[0033] like Figure 3As shown, the membrane frame 14 is tilted between the anode chamber 11 and the cathode chamber 12, that is, the membrane frame 14 is not parallel to the bottom surface of the anode chamber 11, but has a certain angle. A liquid outlet 114 is set at the highest position of the side wall of the anode chamber 11 to discharge bubbles.

[0034] The anode plate 112 is disposed at the bottom of the anode chamber 11, and the anode 111 is disposed on the anode plate 112. Specifically, the anode 111 is fixed to the anode plate 112 by a fixing member 119. The anode plate 112 may be circular, and a central hole 116 is provided at the center of the circle, and the anode plating solution flows through the central hole 116. The anode plate 112 is made of an insoluble material, such as titanium or a metal oxide thereof. Figure 4 As shown, a sealing ring 115 is provided between the anode plate 112 and the bottom surface of the anode chamber 11, so that the anode plate 112 and the bottom surface of the chamber are in sealed contact, and the anode plating solution is prevented from flowing upward through the gap between the anode plate 112 and the surrounding of the chamber, thereby draining the anode plating solution to the central hole 116 of the anode plate 112. In some embodiments, a sealing gasket can be added between the anode plate 112 and the sealing ring 115, and the sealing effect is better when combined with the sealing ring.

[0035] like Figure 3 and Figure 5 As shown, a central flow tube 117 is also provided in the anode chamber 11, one end of which is a first end 1171 and the other end is a second end 1172. The first end 1171 is used as an anode plating liquid inlet and is connected to the central hole 116 of the anode plate 112, and the second end 1172 is connected to a plurality of branch flow tubes 118 extending toward the edge. The central flow tube 117 is inserted into the anode 111, and the second end 1172 extends out of the anode surface 1111. The length of the branch flow tube 118 is less than the radius of the anode 111, and the end thereof away from the central flow tube 117 is of a closed design.

[0036] like Figure 5As shown, the branch flow tube 118 is a circular tube, and a plurality of injection holes 1181 are provided on one side of each branch flow tube 118 facing the anode surface 1111, for supplying the anode plating solution to the anode surface 1111. In other embodiments, the branch flow tube 118 may also be a square tube or other shapes. The diameters of the plurality of injection holes 1181 on each branch flow tube 118 may be the same or different. As the radius of the anode increases, the area of ​​the anode surface 1111 increases, and more flow is required to flush. Therefore, in some embodiments, the diameter of the injection hole 1181 gradually increases from the center to the edge of the anode 111. In another way, the density of the injection holes 1181 on each branch flow tube 118 may be the same or different. In some embodiments, the density of the injection holes 1181 gradually increases from the center to the edge of the anode 111. According to one embodiment, the opening direction of each injection hole 1181 is inclined relative to the vertical direction to avoid the anode plating solution from being sprayed to the same place and causing impact. These plurality of injection holes 1181 on each branch flow tube 118 can be divided into two groups. The opening directions of the two groups of injection holes 1181 are different. In some embodiments, the opening directions of the two groups of injection holes 1181 are symmetrical in the vertical direction. Alternatively, the opening directions of every two adjacent injection holes 1181 on each branch flow tube 118 are different. In some embodiments, the opening directions of every two adjacent injection holes 1181 are symmetrical in the vertical direction. In some embodiments, Figure 5 The second end 1172 of the central flow tube 117 is connected to four branch flow tubes 118 for evenly distributing the flow, and the angles between adjacent branch flow tubes 118 are all 90 degrees. During the electroplating process, the anode 111 is continuously consumed, so that the distance from the anode surface 1111 to the branch flow tubes 118 gradually increases, so that the impact force of the anode plating liquid sprayed onto the anode surface 1111 increases, thereby washing away the oxides accumulated on the anode surface 1111.

[0037] Through the design of the central flow tube 117 and the branch flow tube 118, the anode plating liquid is drained to the anode surface 1111, and the impact force of the liquid is used to promptly flush away the oxides produced on the anode surface 1111, thereby ensuring that the loop impedance remains basically unchanged, avoiding equipment standby caused by voltage increase alarm, and improving the electroplating rate; moreover, a plurality of branch flow tubes 118 are provided to increase the fluidity of the anode plating liquid and the uniformity of the flow rate.

[0038] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An electroplating device, comprising an electroplating chamber, wherein the electroplating chamber comprises an anode, characterized in that: include: A central flow tube is arranged in the anode, one end of which is the anode plating liquid inlet, and the other end extends out of the anode surface and is connected to a plurality of branch flow tubes extending toward the edge of the anode, each branch flow tube being provided with a plurality of injection holes; The anode plating solution is supplied to the anode surface through the injection holes of the branch flow pipe.

2. The electroplating device according to claim 1, characterized in that: The plurality of injection holes on each branch flow pipe faces the anode surface.

3. The electroplating device according to claim 2, characterized in that: The opening directions of the plurality of injection holes on each branch flow pipe are inclined relative to the vertical direction.

4. The electroplating device according to claim 3, characterized in that: The multiple injection holes on each branch flow pipe are divided into two groups, and the opening directions of the two groups of injection holes are different.

5. The electroplating device according to claim 4, characterized in that: The opening directions of the two groups of injection holes are symmetrical with respect to the vertical direction.

6. The electroplating device according to claim 3, characterized in that: The opening directions of every two adjacent injection holes on each branch flow pipe are different.

7. The electroplating device according to claim 6, characterized in that: The opening directions of every two adjacent injection holes are symmetrical with respect to the vertical direction.

8. The electroplating device according to claim 1, characterized in that: The diameters or densities of the multiple injection holes on each branch flow pipe are the same.

9. The electroplating device according to claim 1, characterized in that: The diameters or densities of the multiple injection holes on each branch flow pipe are different.

10. The electroplating device according to claim 9, characterized in that: The diameters or densities of the multiple injection holes on each branch flow tube gradually increase from the center to the edge along the radial direction of the anode.

11. The electroplating device according to claim 1, characterized in that: One end of each branch flow tube away from the central flow tube is of closed design.

12. The electroplating device according to claim 1, characterized in that: Also includes: An anode plating solution inlet is arranged at the bottom of the anode chamber; The anode plate covers the anode plating solution inlet and is used to support the anode; the anode plate is provided with a center hole, which is connected to the anode plating solution inlet.

13. The electroplating device according to claim 12, characterized in that: A sealing ring is arranged between the anode plate and the bottom surface of the anode chamber.

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