LED lighting equipment

Abstract

The invention discloses LED lighting equipment which is characterized in that the LED lighting equipment comprises a heat exchange unit, the heat exchange unit comprises a base and a plurality of heat dissipation fins connected to the base, and the heat dissipation fins are parallel to one another; the light-emitting unit is connected with the heat exchange unit and forms a heat conduction path, and heat generated by the light-emitting unit is conducted on the heat dissipation fins from bottom to top; the light-emitting unit comprises a base plate and a light-emitting body, the base plate is fixed with the base, the base plate comprises a mounting surface, the light-emitting body is arranged on the mounting surface, and a convection opening is formed in the base; the shell is connected to the heat exchange unit, and the shell comprises a cavity; and the power supply is arranged in the cavity and is electrically connected with the light-emitting unit.

Description

[0001] This invention application was submitted to the China Patent Office on May 8, 2020, with application number

[0002] 202010379756.7, Divisional application with the invention title “LED lighting device” Technical Field

[0003] The invention relates to LED lighting equipment and belongs to the field of lighting. Background Art

[0004] LED lights are widely used in many lighting fields because of their advantages of energy saving, high efficiency, environmental protection, and long life. As energy-saving green light sources, the heat dissipation problem of high-power LEDs has received increasing attention. Since excessive temperature will cause the luminous efficiency to decay, if the waste heat generated by the operation of high-power LEDs cannot be effectively dissipated, it will directly have a fatal impact on the life of the LEDs. Therefore, in recent years, solving the heat dissipation problem of high-power LEDs has become an important research and development topic for many stakeholders.

[0005] In some applications, LED lamps are installed horizontally. When the LED lamps use certain lamp holders, the weight of the LED lamps is limited, and the weight distribution is also limited (unreasonable weight distribution will increase the stress on the lamp holder), that is, the weight and weight distribution of the LED lamp power supply, heat sink and lamp tube components are limited. For some high-power LED lamps, such as those with a power of more than 100W, the luminous flux reaches more than 10,000 lumens, that is, the heat sink needs to dissipate the heat generated by the LED lamp that produces at least 10,000 lumens within its weight limit and weight distribution limit.

[0006] In some applications, LED lights need to be used with lamps. When installing LED lights into lamps, the excessive volume of the LED lights (mainly the volume of the heat sink) will affect the installation of the LED lights, especially the heat sink is easy to bump into the lamp, which may damage the lamp and affect the normal use of the lamp. In addition, the excessive volume of the LED lights will affect the packaging and transportation of the product.

[0007] Most of the heat dissipation components of current LED lamps are designed with fans, heat pipes, heat sinks, or a combination thereof to dissipate the heat energy generated by LED lamps through heat conduction, convection and / or radiation. In the case of passive heat dissipation (without fans), the overall heat dissipation effect depends on the thermal conductivity and heat dissipation area of ​​the heat sink material. Under the condition of the same thermal conductivity, no matter what kind of heat sink is used, it can only rely on convection and radiation to dissipate heat, and the heat dissipation capacity of these two methods is proportional to the heat dissipation area of ​​the heat sink itself. Therefore, under the premise that the heat sink has a weight limit, how to improve the heat dissipation efficiency of the heat sink is a way to improve the quality of LED lamps and reduce the cost of the entire LED lamp.

[0008] For some high-power LED lamps, such as those with a power of more than 100W, the heat dissipation of the power supply is equally important. If the heat generated by the power supply cannot be dissipated in time when the LED lamp is working, it will affect the life of some electronic components (especially components with high heat sensitivity, such as capacitors), thereby affecting the life of the entire lamp. In the prior art, one of the factors limiting high-power LED lamps is the heat dissipation of the power supply. The power supply of LED lamps in the prior art has no effective heat dissipation design. In addition, there is no effective thermal management between the heat sink and the power supply in the prior art, which will cause the heat of the heat sink and the heat of the power supply to affect each other.

[0009] In view of the above problems, the present invention and its embodiments are proposed below. Summary of the invention

[0010] The main technical problem solved by the embodiments of the present invention is to provide an LED lighting device to solve the above problems.

[0011] An embodiment of the present invention provides an LED lighting device, characterized by comprising:

[0012] A heat exchange unit, the heat exchange unit comprising a base and a plurality of heat dissipation fins connected to the base, the heat dissipation fins being parallel to each other;

[0013] A light-emitting unit, wherein the light-emitting unit is connected to the heat exchange unit and forms a heat conduction path, and the heat generated by the light-emitting unit is conducted from bottom to top on the heat dissipation fins;

[0014] The light-emitting unit comprises a substrate and a light-emitting body, the substrate is fixed to the base, the substrate comprises a mounting surface, the light-emitting body is arranged on the mounting surface, and a convection opening is arranged on the base;

[0015] A shell, the shell is connected to the heat exchange unit, and the shell includes a cavity;

[0016] A power source is disposed in the cavity and electrically connected to the light emitting unit.

[0017] In an embodiment of the present invention, the heat dissipation fins are extended along the width direction of the LED lighting device and distributed along the length direction of the LED lighting device.

[0018] In one embodiment of the present invention, a light output unit is further included. The light output unit is disposed outside the light emitting unit. At least part of the light generated by the light emitting unit is emitted into the light output unit and then emitted out of the light output unit.

[0019] In one embodiment of the present invention, the light output unit is fixed to the heat exchange unit via a snap-fit ​​device.

[0020] In one embodiment of the present invention, the mounting surface is arranged parallel to the length direction of the LED lighting device.

[0021] In one embodiment of the present invention, the power supply includes a power board and electronic components, and the electronic components are arranged on the power board.

[0022] In one embodiment of the present invention, the substrate is an aluminum substrate, the base of the heat exchange unit is aluminum, and the substrate and the heat exchange unit have the same expansion and contraction rate.

[0023] In one embodiment of the present invention, the light output unit is configured with an optical device, and the optical device is configured with reflection, refraction and / or scattering functions.

[0024] In one embodiment of the present invention, a lens is disposed on the light-emitting body, and the lens is disposed on a single light-emitting body.

[0025] In one embodiment of the present invention, a lens is disposed on the light-emitting body, and a single lens corresponds to a plurality of the light-emitting bodies.

[0026] The beneficial effects of the present invention are: compared with the prior art, the present invention includes any one of the following effects or any combination thereof:

[0027] (1) By setting the center of gravity position relationship between the second part and the third part, when the weight of the entire LED lighting device is determined (the weight of the entire LED lighting device is limited to 1kg to 1.7kg), the moment borne by the lamp head can be reduced, while ensuring that the second part and the third part have sufficient weight to set components and perform heat dissipation design.

[0028] (2) The weight of the second part includes the weight of the power supply element (power supply) and the components for dissipating heat for the power supply element, and the weight of the third part includes the weight of the light-emitting unit and the components for dissipating heat for the light-emitting unit. The length setting of the second part II is used to provide a longitudinal space for accommodating the power supply element (power supply), and the length setting of the third part is used to provide a longitudinal space for arranging the light-emitting body and a longitudinal space for dissipating heat components. Through the design of the torque, the power supply, light emission or heat dissipation function of each part is guaranteed under the premise of ensuring that the torque of the lamp holder does not exceed the range that the lamp holder can withstand.

[0029] (3) By setting the thermal conductivity of the first area, the second area and the third area, when the LED lighting device is working, the heat generated by the power supply can be quickly dissipated to the outside of the LED lighting device by heat conduction.

[0030] (4) The light output design of the first light output area and the second light output area can solve the glare problem caused by local strong light in the light output unit, making the light output more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the main structure of an LED lighting device in one embodiment;

[0032] Figure 2 is a schematic diagram of a lamp holder module in an embodiment;

[0033] Figure 3 yes Figure 1 Bottom view of

[0034] Figure 4 yes Figure 3 Schematic diagram without the light output unit;

[0035] Figure 5 yes Figure 1 A schematic diagram of a cross-sectional structure of an LED lighting device;

[0036] Figure 6 is a schematic structural diagram of an LED lighting device in an embodiment;

[0037] Figure 7 yes Figure 6 A schematic diagram of the structure of the LED lighting device in FIG. 1 , showing that it is at an angle to the horizontal plane;

[0038] Figure 8 is a schematic structural diagram of an LED lighting device in an embodiment;

[0039] Fig. 9 yes Figure 8 Bottom view without the light output unit;

[0040] Fig.10is a schematic cross-sectional structural diagram of the second part in one embodiment;

[0041] Fig.11 is a schematic diagram of the three-dimensional structure of the second component in one embodiment;

[0042] Fig.12 is a schematic diagram of the three-dimensional structure of the first component in one embodiment;

[0043] Fig.13 are various shapes of heat sink fins in some embodiments;

[0044] Fig.14 yes Figure 1 A schematic diagram of a three-dimensional structure of an LED lighting device without a light output unit;

[0045] Fig.15 yes Fig.14 An enlarged schematic diagram of A in FIG.

[0046] Fig.16A yes Figure 1 A schematic diagram of the three-dimensional structure of the light output unit;

[0047] Fig. 16B yes Figure 1 A schematic diagram of the three-dimensional structure of the heat exchange unit;

[0048] Fig.17 is a schematic diagram of the cooperation between the heat mitigation unit and the light emitting unit in one embodiment;

[0049] Fig.18 yes Fig.17 The enlarged view of point B in FIG.

[0050] Fig.19 yes Fig.17 The enlarged view of point C in FIG.

[0051] Figure 20 to Figure 23 is a schematic diagram of an installation of a base plate mounted to a heat exchange unit in one embodiment;

[0052] Fig.24 is a schematic diagram of cooperation between a substrate and a heat exchange unit in another embodiment, showing a state where the first wall and the second wall are not bent;

[0053] Fig.25 yes Fig.24 A schematic diagram of the cooperation between the substrate and the heat exchange unit in FIG. 1 shows that the first wall and the second wall are bent and press the substrate;

[0054] Fig.26 yes Figure 1 A schematic diagram of a top view structure;

[0055] Fig. 27 yes Figure 1 A front view of the substrate in FIG.

[0056] Fig.28 yes Fig. 27 The rear view shows the state of applying thermal conductive adhesive;

[0057] Fig.29 is a schematic diagram of a heat exchange unit in another embodiment, showing that a glue overflow groove is provided on the base;

[0058] Fig.30 is a schematic diagram of a substrate in another embodiment, showing that a glue overflow groove is provided on the substrate;

[0059] Fig.31 is a schematic diagram of the main structure of the LED lighting device in other embodiments, showing that the heat exchange unit is in a retracted state;

[0060] Fig.32 yes Fig.31 A rear view structural diagram of ;

[0061] Fig.33 yes Fig.32 A schematic diagram of the structure without the light output unit;

[0062] Fig.34 yes Fig.31 A schematic cross-sectional structure diagram of ;

[0063] Fig.35 yes Fig.31 A schematic diagram of the main structure of the LED lighting device in FIG. 1 , showing the heat exchange unit in an unfolded state;

[0064] Fig.36 yes Fig.31 LED lighting equipment in the stereo Figure 1 ;

[0065] Fig.37 yes Fig.31 LED lighting equipment in the stereo Figure 2 ;

[0066] Fig.38 yes Fig.31 A schematic diagram of the LED lighting device without the components on the third part;

[0067] Fig.39 yes Fig.38 The enlarged view of D;

[0068] Fig.40 yes Fig.31 A schematic diagram of the LED lighting device in which components on the first part and the second part are removed;

[0069] Fig.41 yes Fig.31 The LED lighting device in the figure is a three-dimensional structural schematic diagram of a first heat sink;

[0070] Fig.42 is a schematic diagram of a substrate in some embodiments;

[0071] Fig.43 is a schematic diagram of a substrate in some embodiments;

[0072] Fig.44A is a diagram of the arrangement of electronic components of a power supply in a lamp housing in one embodiment;

[0073] Fig.44B is a diagram of the arrangement of electronic components of a power supply within a lamp housing in some embodiments;

[0074] Fig.44C is a diagram of the arrangement of electronic components of a power supply within a lamp housing in some embodiments;

[0075] Fig.45 is a schematic diagram of the three-dimensional structure of an LED lighting device in an embodiment;

[0076] Fig.46 is a schematic cross-sectional view of an LED lighting device in an embodiment Figure 1 ;

[0077] Fig.47 is a schematic cross-sectional view of an LED lighting device in an embodiment Figure 2 ;

[0078] Fig.48 is a schematic cross-sectional view of an LED lighting device in an embodiment Figure 3 . DETAILED DESCRIPTION

[0079] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood. The directions such as "axial direction", "above", "below", etc. in the following text are all for the purpose of more clearly indicating the structural position relationship, and are not limitations on the present invention. In the present invention, the "vertical", "horizontal" and "parallel" are defined as: including the situation of ±10% based on the standard definition. For example, vertical usually refers to an angle of 90 degrees relative to the reference line, but in the present invention, vertical refers to the situation within 80 to 100 degrees. In addition, the use and use status of the LED lighting lamp described in the present invention refer to the use situation of the LED lamp with the lamp head installed in the horizontal direction. If there are other exceptions, they will be explained separately.

[0080] See also Figure 1 In one embodiment of the present invention, there is provided an LED lighting device, which comprises a first part I, a second part II and a third part III. Figure 1 As shown, the first part I, the second part II and the third part III are divided by dotted lines, wherein the first part I, the second part II and the third part III are arranged in sequence.

[0081] See also Figure 1 and Figure 2 The first part I is mainly used to connect to an external power supply device (such as a lamp holder), wherein the first part I includes a lamp holder module 7, the lamp holder module 7 includes at least a lamp holder 71, and the lamp holder 71 has an external thread for connecting to an external lamp holder. It can be understood that the lamp holder module 7 can also have a lamp holder adapter 711, which can have an external thread 712 and an internal thread 713 of an external lamp holder.

[0082] See also Figure 1 , Figure 4 and Figure 5 The second part II is mainly used to set the electronic components of the LED lighting device, wherein the second part II includes a housing 3 and a power supply 4. The housing 3 defines the outer dimensions of the first part I, and a cavity 301 is defined in the housing 3, so that the power supply 4 can be set in the cavity 301. Fig.10 The power supply 4 may include a power board 41 and an electronic component 42, wherein the electronic component 42 is disposed on the power board 41. The power board 41 is perpendicular or substantially perpendicular to the first direction X.

[0083] See also Figure 1 , Figure 3 , Figure 4 and Figure 5 The third part III is mainly used to provide heat dissipation (heat dissipation for the light output unit 5) and light output functions of the LED lighting device. The third part III is provided with a heat exchange unit 1, a light emitting unit 2 and a light output unit 5. The light emitting unit 2 is connected to the heat exchange unit 1 and forms a heat conduction path of the third part III. When the LED lighting device is working, the heat generated by the light emitting unit 2 can be transferred to the heat exchange unit 1 by heat conduction, and the heat is dissipated by the heat exchange unit 1. The power supply 4 is electrically connected to the light emitting unit 2 to provide power to the light emitting unit 2. The light output unit 5 is covered outside the light emitting unit 2. When the LED lighting device is working, at least part of the light generated by the light emitting unit 2 is injected into the light output unit 5, and then emitted from the light output unit 5 and projected to the outside of the LED lighting device. The light output unit 5 can be configured with an optical device, and the optical device can be configured with a degree of reflection, refraction and / or scattering to provide any suitable combination of reflection, refraction and / or scattering. In addition, the optical device can also be configured to increase the luminous flux passing through the light output unit 5.

[0084] See also Figure 1 The first part I and the second part II are bounded by the connection surface between the lamp holder module 7 and the shell 3 (the connection surface in the length direction of the lighting device). Specifically, the axial end surface 7101 of the lamp holder 71 can be used as the connection surface. The second part II and the third part III are bounded by the connection surface between the shell 3 and the heat exchange unit 1 (the connection surface in the length direction of the lighting device). The end surface 301 of the shell 3 in the length direction of the LED lamp can be used as the connection surface.

[0085] It should be specially noted here that in the present embodiment, although the first part I, the second part II and the third part III are sequentially arranged along the length extension direction of the LED lighting device, in other embodiments, according to different design requirements of the LED lighting device, the first to third parts can be arranged overlappingly in different directions, and the present invention is not limited to this.

[0086] See also Figure 1 , Figure 4 and Figure 5 , the lamp head 71 is extended along a first direction X (the length direction of the LED lamp). The light-emitting unit 2 includes a light-emitting body 21 and a substrate 22, and the substrate 22 provides a mounting surface 221, and the light-emitting body 21 is mounted on the mounting surface 221. The mounting surface 221 is arranged parallel to the first direction X. From the perspective of use, when the LED lighting device is installed horizontally (the first direction X and the mounting surface 221 are both parallel to the horizontal plane), the light-emitting unit 2 of the LED lighting device provides downward light output, so that the area below the LED lighting device is illuminated. That is to say, the LED lighting device in this embodiment is installed horizontally. In addition, when the LED lighting device is installed horizontally, the first direction X or the mounting surface 221 can also form an acute angle with the horizontal plane, and the acute angle is less than 45 degrees, so as to mainly provide downward light output. The LED lighting device can be used for outdoor lighting, such as road lighting (street lights), and can also be used indoors, using wall installation (installed on the wall), such as warehouses, parking lots, sports fields, etc. The “light emitting body” referred to in all embodiments of the present invention may be a light source with LED (light emitting diode) as the main body, including but not limited to LED lamp beads, LED light strips or LED filaments.

[0087] In some applications, there may be a weight limit for the entire LED lighting device. For example, when the LED lighting device adopts an E39 lamp holder, the maximum weight of the LED lighting device is limited to within 1.7 kilograms. In one embodiment, when the LED lighting device is installed horizontally and the weight distribution of each part is limited, the LED lighting device is provided with no more than 150 watts of electrical energy, the light-emitting unit 2 (specifically, the light-emitting body 21 provided in the light-emitting unit 2) is lit, and the LED lighting device emits a luminous flux of at least 15,000 lumens. Further, when 140 watts of electrical energy is provided, the LED lighting device emits a luminous flux of at least 15,000 lumens, 16,000 lumens, 17,000 lumens, 18,000 lumens, 19,000 lumens, 20,000 lumens or more (less than 40,000 lumens). In one embodiment, the weight of the heat exchange unit 1 is limited to no more than 0.9 kg, and when the LED lighting device is lit, it can emit at least 15,000 lumens, 16,000 lumens, 17,000 lumens, 18,000 lumens, 19,000 lumens, 20,000 lumens or more lumens of light (less than 40,000 lumens). That is, the heat exchange unit 1 can dissipate the heat generated by the LED lighting device that generates at least 15,000 lumens under a weight limit of no more than 0.9 kg. In one embodiment, the weight of the heat exchange unit 1 is limited to 0.8 kg or less, and when the LED lighting device is lit, it can emit at least 20,000 lumens of light. In the above example, due to the overall weight limit, the total luminous flux emitted by the LED lighting device is less than 40,000 lumens. In one embodiment, when the LED lighting device is installed horizontally and the weight distribution of each part is limited, the LED lighting device is provided with no more than 110 watts of electric energy, the light-emitting unit 2 (specifically, the light-emitting body 21 provided in the light-emitting unit 2) is lit, and the LED lighting device emits a luminous flux of at least 15,000 lumens (no more than 24,000 lumens). In one embodiment, when the LED lighting device is installed horizontally and the weight distribution of each part is limited, the LED lighting device is provided with no more than 80 watts of electric energy, the light-emitting unit 2 (specifically, the light-emitting body 21 provided in the light-emitting unit 2) is lit, and the LED lighting device emits a luminous flux of at least 12,000 lumens (no more than 20,000 lumens). In one embodiment, when the LED lighting device is installed horizontally and the weight distribution of each part is limited, the LED lighting device is provided with no more than 60 watts of electric energy, the light-emitting unit 2 (specifically, the light-emitting body 21 provided in the light-emitting unit 2) is lit, and the LED lighting device emits a luminous flux of at least 9,000 lumens (no more than 18,000 lumens).In one embodiment, when the LED lighting device is installed horizontally and the weight distribution of each part is limited, the LED lighting device is provided with no more than 40 watts of electric energy, the light-emitting unit 2 (specifically, the light-emitting body 21 provided in the light-emitting unit 2) is lit, and the LED lighting device emits a luminous flux of at least 6000 lumens (no more than 15000 lumens). In one embodiment, when the LED lighting device is installed horizontally and the weight distribution of each part is limited, the LED lighting device is provided with no more than 20 watts of electric energy, the light-emitting unit 2 (specifically, the light-emitting body 21 provided in the light-emitting unit 2) is lit, and the LED lighting device emits a luminous flux of at least 3000 lumens (no more than 10000 lumens). In addition, the LED lighting devices in the above embodiments all meet the lifespan of 50,000 hours when the working environment temperature is -20 degrees to 70 degrees.

[0088] See also Figure 1 and Figure 5 , when designing the weight distribution and length of the first part I, the second part II and the third part III, the moment of the lamp holder 71 needs to be considered.

[0089] When the weight of the LED lighting device is fixed (the weight is a certain value or within a certain range, such as a weight between 1kg and 1.7kg), the center of gravity of the LED lighting device will affect the torque borne by the lamp holder 71. Figure 1 and Figure 5 In one embodiment, the length of the LED lighting device is L, the straight-line distance from the end of the lamp holder 71 to the plane where the center of gravity of the LED lighting device is located (the plane is perpendicular to the axis of the lamp holder of the LED lighting device) is a, and the length L of the LED lighting device and the straight-line distance a from the end of the lamp holder 71 to the plane where the center of gravity of the LED lighting device is located satisfy the following relationship: a / L=0.2~0.45. Preferably, the length L of the LED lighting device and the straight-line distance a from the end of the lamp holder 71 to the plane where the center of gravity of the LED lighting device is located satisfy the following relationship: a / L=0.2~0.4. When the above relationship is satisfied, the torque borne by the lamp holder 71 can be reduced when the weight of the entire LED lighting device is determined (the weight of the entire LED lighting device is limited to 1kg~1.7kg), while ensuring that the second part II and the third part III have sufficient weight to set components and perform heat dissipation design.

[0090] See also Figure 1 and Figure 5 , the distance b from the start of the second part II to the plane where the center of gravity of the LED lighting device is located (the plane is perpendicular to the axis of the lamp holder of the LED lighting device) satisfies the following relationship:

[0091] (L2+L3) / 5 <b<3(L2+L3) / 7

[0092] Wherein, L2 is the length of the second part II;

[0093] L3 is the length of the third part III.

[0094] In order to ensure that the LED lighting device has sufficient heat dissipation area and reduce the influence of torque on the connection part (such as lamp holder 71) when the LED is installed horizontally, in one embodiment, an asymmetric design can be made for the form of the heat exchange unit 1 (different designs of the heat exchange unit 1 all satisfy the following formula). Figure 1 and Figure 6 , after the LED lighting equipment is installed horizontally, the moment F after the lamp holder 71 is installed is F=d1*g*W1+(d2+d3)*g*W2;

[0095] Wherein, d1 is the distance from the first part I to the plane where the center of gravity of the second part is located (the plane is perpendicular to the axial direction of the lamp holder);

[0096] g is 9.8N / kg;

[0097] W1 is the weight of the second part II;

[0098] d2 is the length of the second part II;

[0099] d3 is the distance from the plane where the center of gravity of the second part II to the third part III is located (the plane is perpendicular to the axial direction of the lamp holder);

[0100] W2 is the weight of the third part III.

[0101] When the total weight of the LED lighting device is determined (or the weight of the entire lamp is limited, such as 1kg to 1.7kg), the torque of the lamp holder 71 satisfies the following conditions:

[0102] 1NM <d1*g*W1+(d2+d3)*g*W2<2NM

[0103] In this embodiment, the weight of the second part II includes the weight of the power supply element (power supply 4) and the weight of the components for dissipating heat for the power supply element, and the weight of the third part III includes the weight of the light-emitting unit 2 and the weight of the components for dissipating heat for the light-emitting unit 2. The length of the second part II is set to provide a longitudinal space for accommodating the power supply element (power supply 4), and the length of the third part III is set to provide a longitudinal space for arranging the light-emitting body 21 and a longitudinal space for dissipating heat components. The above design ensures the power supply, light emission or heat dissipation functions of each part under the premise of ensuring that the torque of the lamp holder 71 does not exceed the range that the lamp holder 71 can withstand.

[0104] In other embodiments, the torque of the lamp holder 71 satisfies the following conditions:

[0105] 1NM <d1*g*W1+(d2+d3)*g*W2<1.6NM

[0106] See also Figure 7 After the LED lighting device is installed, it has an angle with the horizontal plane (the axial direction of the lamp holder 71 has an acute angle less than 45 degrees with the horizontal plane). At this time, the moment F of the lamp holder 71 = d1*g*W 1* cosA+(d2+d3)*g*W 2* cosA.

[0107] A is the angle between the axial direction of the lamp holder 71 and the horizontal plane.

[0108] When the total weight of the LED lighting device is determined (or the weight of the entire lamp is limited, such as 1kg to 1.7kg), the torque of the lamp holder 71 must also meet the following conditions:

[0109] 1NM <d1*g*W1cosA+(d2+d3)*g*W2cosA<2NM

[0110] In other embodiments, 1NM <d1*g*W1cosA+(d2+d3)*g*W2cosA<1.6NM。

[0111] In the above embodiment of the design torque, the overall length of the LED lighting device is less than 350 mm and greater than 200 mm. When the lamp holder 71 adopts a fixed model, such as an E39 lamp holder (whose length is about 40 mm), the sum of the lengths of the second part II and the third part III is less than 310 mm and greater than 160 mm. Furthermore, the sum of the lengths of the second part II and the third part III is less than 260 mm and greater than 180 mm.

[0112] See also Fig.10 , the power supply 4 maintains a distance from the end face of the lamp housing 32 (the end face is arranged at one end of the lamp housing 32 close to the third part III) to prevent the heat generated by the third part III (light-emitting unit 2) during operation from being conducted to the power supply 4, or to prevent the heat generated by the power supply 4 and the heat generated by the third part III from affecting each other. Specifically, the power board 41 of the power supply 4 maintains a distance from the end face of the lamp housing 32. There is air in the distance to form a better thermal isolation. Specifically, a protrusion 3201 can be arranged in the lamp housing 32, so that the power board 41 can be supported on the protrusion 3201, so that the power board 41 maintains a distance from the end face of the lamp housing 32. In addition, due to the setting of the distance, the center of gravity of the second part II can be further adjusted to ultimately reduce the torque of the lamp holder 71.

[0113] In this embodiment, since the LED lamp is installed horizontally, considering the load-bearing capacity of the lamp holder 71, when the weight of the LED lamp is relatively determined, the magnitude of the torque mainly depends on the lever arm, that is, the weight distribution of the entire lamp. After comprehensively considering the load-bearing capacity of the lamp holder 71 and the heat dissipation of the light-emitting unit 2 and the power supply 4, in this embodiment, the second part II is the part closer to the lamp holder 71, and the weight of the second part II of the LED lamp is configured to account for more than 30% of the weight of the entire lamp. Preferably, the weight of the second part II of the LED lamp is configured to account for more than 35% of the weight of the entire lamp. More preferably, the weight of the second part II of the LED lighting device is configured to account for 35% to 50% of the weight of the entire lamp, so that the second part II has more weight that can be used for heat dissipation, and this part of the weight is relatively close to the first part I, so its lever arm is shorter than that of the first part I. The weight of the third part III does not exceed 60% of the weight of the whole lamp. Preferably, the weight of the third part III does not exceed 55% of the weight of the whole lamp. More preferably, the weight of the third part III accounts for 50% to 55% of the weight of the whole lamp. In this way, on the one hand, the heat dissipation of the light-emitting unit 2 can be met, and on the other hand, the weight of the third part III is controlled, which is conducive to controlling the torque.

[0114] When designing the weight distribution of the first part I, the second part II and the third part III, the length of the second part II does not exceed 25% of the overall length of the LED lamp to control the lever arm of the second part II (controlling the lever arm length is conducive to controlling the torque of the second part II relative to the lamp head 71). Preferably, the length of the second part II does not exceed 20% of the overall length of the LED lamp. More preferably, the length of the second part II accounts for 15% to 25% of the overall length of the LED lamp, thereby providing sufficient space to accommodate the power supply 4 while controlling the torque. The length of the third part III does not exceed 70% of the overall length of the LED lamp, and preferably, the length of the third part III accounts for 60% to 70% of the overall length of the LED lamp, so that the torque of the third part III and the heat dissipation capacity are balanced (the longer the length of the third part III, the more reasonable the setting of the heat exchange unit 1, and the more space for heat dissipation, and the shorter the length of the third part III, the smaller the torque of the third part III).

[0115] [Part I]

[0116] See also Figure 1 In one embodiment, the lamp holder module 7 of the first part I provides an electrical connection port for connecting an external power supply end with an LED lighting device. The lamp holder module 7 may include a lamp holder 71, which is configured to be connected to a matching lamp holder, and the lamp holder 71 has an external thread for connecting to an external lamp holder.

[0117] The lamp holder 71 can be arranged along the first direction X, for example, extending in the length direction of the LED lighting device. The lamp holder 71 can be arranged according to the specific application scenario of the LED lighting fixture. The lamp holder 71 can be an E-type lamp holder, for example, an E39 or E40 lamp holder, where E represents an Edison screw bulb, i.e., a bulb with a thread that can be screwed into a lamp holder, and 39 / 40 refers to the nominal diameter of the bulb thread. E39 is a US standard specification, and E40 is a European standard specification. The material can include nickel-plated copper, aluminum alloy, etc.

[0118] It is clear that when the LED lighting device is used in other specific application scenarios, the lamp holder 71 can also be other types of lamp holders, such as plug-in lamp holder GU10, etc., where G indicates that the lamp holder type is plug-in, U indicates that the lamp holder part is U-shaped, and the number behind it indicates that the center distance of the lamp pin holes is 10mm. Alternatively, the lamp holder 71 can also be a snap-on type.

[0119] The lamp holder module 7 may also include Figure 2 The lamp adapter 711 shown has an external thread 712 for connecting to an external lamp holder, and an internal thread 713. The lamp adapter 711 can provide a connection between the second part II and the first part I, and the lamp adapter 711 can also be designed to facilitate the adaptation between different lamp holders and lamp holders. For example, the lamp adapter 711 can be used to install an E27 lamp holder on an E40 lamp holder.

[0120] [Part 2 Ⅱ]

[0121] See also Figure 1 and 5 In one embodiment, the housing 3 of the second part II is used to accommodate the power supply 4 and defines the external dimensions of the second part II. The housing 3 is also connected to the lamp holder module 7 and the heat exchange unit 1, respectively. Considering the insulation creepage distance requirements, the housing 3 is usually made of plastic. In other embodiments, the housing 3 may also be made of metal, but the electrical isolation between the housing 3 and the power supply 4 must be ensured. The housing 3 defines a cavity 301, and the power supply 4 is disposed in the cavity 101.

[0122] When the LED lighting device is working, the power supply 4 will generate heat. Therefore, the second part II is provided with a heat dissipation device to dissipate the heat of the power supply 4 to dissipate the heat generated when the power supply 4 is working and prevent the power supply 4 from overheating.

[0123] Fig.10 It is a partial cross-sectional view showing the cross-sectional structure of the second part II. Figure 1 and Fig.10As shown, in one embodiment, the second part II has a first area 302, a second area 303 and a third area 304, wherein the third area 304 is an area outside the housing 3, and the power source 4 forms a heat conduction path with the first area 302 through the second area 303, and the thermal conductivity of the first area 302 and the second area 303 is greater than the thermal conductivity of the third area 304. Thus, when the LED lighting device is working, the heat generated by the power source 4 can be quickly dissipated to the outside of the LED lighting device by heat conduction. Specifically, the thermal conductivity of the first area 302 is more than 8 times that of the third area 304, preferably, the thermal conductivity of the first area 302 is 9-15 times that of the third area 304. The thermal conductivity of the second area 303 is more than 5 times that of the third area 304, preferably, the thermal conductivity of the second area 303 is 6 to 9 times that of the third area 304. The specific thermal conductivity of the first area 302 is between 0.2 and 0.5, and the specific thermal conductivity of the second area 303 is between 0.1 and 0.3. Preferably, the specific thermal conductivity of the first region 302 is between 0.25 and 0.35, the specific thermal conductivity of the second region 303 is between 0.15 and 0.25, and the specific thermal conductivity of the third region 304 is between 0.02 and 0.05.

[0124] The thermal conductivity of each region mentioned above should be understood as the average thermal conductivity value of the materials included in each region.

[0125] The second area 303 in the disclosure of this embodiment is provided with a heat-conducting material 305, and the power supply 4 forms a heat-conducting path with the first area 302 through the heat-conducting material 305 of the second area 303. Exemplarily, the heat-conducting material 305 may be a heat-conducting glue. That is to say, the second part II mentioned above is provided with a heat dissipation device, and the heat dissipation device may be the heat-conducting material 305 of the second area 302. In other embodiments, the heat dissipation device may also appear in other forms. For example, when the heat generated by the power supply 4 is dissipated by convection in the shell 3, the heat dissipation device may be a hole opened on the shell 3. For another example, the heat dissipation device may be a fan to accelerate the convection heat dissipation of the power supply 4. For another example, the heat dissipation device may be a radiation layer, and the radiation layer may be provided on the surface of the power supply 4 or the surface of the shell 3 to accelerate the heat generated by the power supply to dissipate in the form of radiation.

[0126] In this embodiment, the power supply 4 includes a heating element, which is an electronic element that generates relatively high heat when the LED lighting device is working, such as a resistor, a transformer, an inductor, an IC, a transistor, etc. According to the basic principle of heat conduction, the factors affecting heat conduction mainly include the thermal conductivity of the thermal conductive material 305, the heat conductive cross-sectional area of ​​the thermal conductive material 305 and the thickness of the thermal conductive material 305 (the distance from the heating unit to the first area 302, taking the distance of the nearest point), among which, when the thermal conductive material 305 is determined, the main factors affecting heat conduction are the latter two. Assuming that the heat generated by the heating element is conducted to the first area 302 along the shortest path (the shorter the heat transfer path, the better the heat transfer effect), the heat conduction formula is Q=λAΔT / d;

[0127] Wherein, Q is the heat flow through the heat-conducting material 305; λ is the thermal conductivity of the heat-conducting material 305; A is the contact area between the heat-generating unit and the heat-conducting material 305; ΔT is the temperature difference on the heat-conducting path (the difference between the temperature of the heat-generating element and the temperature of the heat-conducting material 305 at the end of the heat-conducting path); d is the shortest distance from the heat-generating element to the first region 302. The heat-generating element in this embodiment is a transformer, an inductor, an IC (control circuit), a transistor or a resistor, etc.

[0128] In order to dissipate the heat generated by the heating element as quickly as possible, when setting the heat-conducting material 305, the area (value of A) on the surface of the heating element to which the heat-conducting material 305 is attached should be as large as possible. In one embodiment, in order to ensure that the heat generated by the heating element during operation is dissipated as quickly as possible through the heat conduction of the heat-conducting material 305, at least 80% of the surface area of ​​the heating element exposed to the outside (excluding the contact surface when installed with the power board) is attached to the heat-conducting material. In one embodiment, at least 90% of the surface area of ​​the heating element exposed to the outside (excluding the contact surface when installed with the power board) is attached to the heat-conducting material. In one embodiment, at least 95% of the surface area of ​​the heating element exposed to the outside (excluding the contact surface when installed with the power board) is attached to the heat-conducting material 305. In one embodiment, at least 80%, 90% or 95% of the surface area of ​​any heating element exposed to the outside (excluding the contact surface when installed with the power board) is attached to the heat-conducting material 305. In this way, the heat flow bottleneck on the heat conduction path can be avoided as much as possible.

[0129] In order to conduct the heat generated by the heating element to the first area 302 as quickly as possible, the shortest distance from the heating element to the first area 302 can also be designed accordingly to improve the heat conduction efficiency. Specifically, the width dimension of the second part II in this embodiment is W (the cross-sectional shape of the second part II here may be circular, polygonal or other irregular shapes, and the width dimension refers to the shortest distance between any two points on the cross-sectional contour line of the second part II, and the line between the two points passes through the axis of the lamp holder 71), and the shortest distance from the heating element to the boundary of the second part II (the first area 302) in the width direction of the second part II is d (the shortest distance from the center of the heating element to the boundary of the second part II). In order to conduct the heat of the heating element to the first area 302 as quickly as possible, the shortest distance d from the heating element to the boundary of the second part II (the first area 302) and the width dimension L of the second part II satisfy the following relationship:

[0130] d≤5 / 11W

[0131] In other embodiments, the shortest distance d of the heating element to the boundary of the second part II (the first area 302) in the width direction of the second part II and the width dimension W of the second part II satisfy the following relationship:

[0132] d≤4 / 11W

[0133] In addition, in order to meet the creepage distance requirements, the heating element should maintain a certain distance from the boundary of the second part II. Therefore, in general, the shortest distance d from the heating element to the boundary of the second part II (the first area 302) in the width direction of the second part II and the width dimension W of the second part II satisfy the following relationship:

[0134] 1 / 20W≤d≤4 / 11W

[0135] In one embodiment, W is in the range of 50 to 150 mm. In one embodiment, W is in the range of 55 to 130 mm.

[0136] The heating element mentioned above may be a transformer, an inductor, an IC (control circuit), a transistor or a resistor, etc.

[0137] Thermal resistance is the resistance in the process of heat transfer, which indicates the temperature difference caused by unit heat flow. When the heat generated by a heating element is transferred to the third area 304 via the shortest path in the width direction of the second part II, it passes through the second area 303 and the first area 302 in sequence, and its total thermal resistance R is the thermal resistance R1 of the first area 302 plus the thermal resistance R2 of the second area 303.

[0138] Among them, the thermal resistance R2 of the second area 303 is R2=d2 / λ2A2; wherein d2 is the shortest distance from the heating element to the interface of the second area 303 (the connecting surface between the first area 302 and the second area 303) in the width direction of the second part II; λ2 is the thermal conductivity of the second area 303, and A2 is the contact area between the heating element and the second area 303 (thermal conductive material 305).

[0139] Among them, the thermal resistance R1 of the first region 302 is R1=d1 / λ1A1; wherein d1 is the shortest distance from the second region 303 to the outer side surface of the first region 302 (the thickness of the first region 302); λ1 is the thermal conductivity of the first region 302, and A1 is the surface area of ​​the first region.

[0140] The heat of the second region 303 is mainly conducted to the first region 302, while the heat of the first region 302 is mainly radiated to the third region 304. The heat of the heating element needs to be conducted to the second region 303 more urgently. Therefore, in this embodiment, the thermal resistance R2 of the second region 303 is set to be smaller than the thermal resistance R1 of the first region 302, that is, d2 / λ2A2<d1 / λ1A1.

[0141] In one embodiment, in order to reduce the thermal resistance R2 of the second area 303, the shortest distance from the heating element to the interface of the second area 303 (the connecting surface between the first area 302 and the second area 303) in the width direction of the second part II and the area of ​​the heating element surface to which the thermally conductive material 305 is attached can adopt the aforementioned thermal design, that is, d2 satisfies the following relationship: 1 / 20W≤d2≤4 / 11W; at least 80%, 90% or 95% of the surface area of ​​the heating element exposed to the outside (excluding the contact surface when installed with the power board) is attached with the thermally conductive material 305.

[0142] In one embodiment, the electronic component 42 of the power supply 4 includes an electrolytic capacitor 421. The life of the electrolytic capacitor 421 depends on the set ambient temperature. Therefore, the location or method of setting the electrolytic capacitor 421 will affect its life. Fig.44A In one embodiment, the electrolytic capacitor 421 is disposed on the opposite outer side of the power board 41, and the electrolytic capacitor 421 is directly thermally connected to the first area 302 through the heat conductive material 305, that is, there are no other electronic components, especially heating components, on the shortest path from the electrolytic capacitor 421 to the first area 302, thereby ensuring that the electrolytic capacitor has better heat conduction. In one embodiment, the shortest distance d3 from the electrolytic capacitor 421 to the first area 302 satisfies the following relationship: d3≤5 / 11W. In another embodiment, the shortest distance d3 from the electrolytic capacitor 421 to the first area 302 satisfies the following relationship: d3≤4 / 11W.

[0143] Wherein W is the width dimension of the second part II (the cross-sectional shape of the second part II here may be circular, polygonal or other irregular shapes, and the width dimension refers to the shortest distance between any two points on the cross-sectional contour line of the second part II, and the line between the two points passes through the axis line of the lamp holder 71), and d3 is the shortest distance from the electrolytic capacitor 421 to the first area 302 in the width direction of the second part II (the shortest distance from the center of the electrolytic capacitor 421 to the first area 302).

[0144] In one embodiment, in order to reduce the distributed capacitance between the electronic components and meet the heat dissipation requirements at the same time, the positions of the electronic components on the power board 41 may also be designed accordingly. Fig.44A As shown, the power board 41 has a first surface 4101, and electronic components are arranged on the first surface 4101. A first plane 4102 and a second plane 4103 are arranged on the first surface 4101, wherein the electronic components on the first surface 4101 are all arranged on the second plane 4103, and the second plane 4103 is an annular area, that is, the electronic components are distributed in an annular area and arranged around the first plane 4102, so that the distance between the electronic components (between non-adjacent electronic components) can be relatively increased, thereby reducing the distributed capacitance.

[0145] The first plane 4102 is provided with a heat-conducting material 305. Therefore, part of the heat generated by the electronic component when working can be dissipated through the heat-conducting material 305 on the first plane 4102, further improving the heat dissipation effect. In this embodiment, the electronic component includes a heating element (such as a transformer, an inductor, a transistor, a resistor, etc.). To improve the heat dissipation efficiency, at least a part of the heating element can correspond to the first plane 4102 (at least one side of the heating element directly corresponds to the heat-conducting material 305 on the first plane 4102).

[0146] Among the electronic components, the transistor 422 is a component that generates more heat when working. For this reason, the transistor 422 can be set in the area corresponding to the first plane 4102 on the second plane 4103, so that the heat generated by the transistor 422 when working can be quickly dissipated through the thermal conductive material 305 of the first plane 4102. In addition, the transistor 422 can also be set on the relative periphery of the second plane 4103 so that the transistor 422 has a relatively short heat dissipation path (to the outside of the shell). Further, when there are multiple transistors 422 (at least two), some of the transistors 422 are set on the second plane 4103 corresponding to the first plane 4102, and the other part of the transistors 422 are set on the relative periphery of the second plane 4103, so that the multiple transistors 422 are reasonably arranged to ensure the heat dissipation effect. When other elements are arranged between the transistor 422 and the first plane 4102, but the side area of ​​the transistor 422 facing the first plane 4102 blocked by the other elements does not exceed half of the side area of ​​the transistor 422 facing the first plane 4102, the transistor 422 is still considered to correspond to the first plane 4102.

[0147] like Fig.44A and Fig.44B As shown, the first plane 4102 is formed by a circle of electronic components located at the middle position closest to the power board 41 .

[0148] The area of ​​the first plane 4102 is set to at least account for 1 / 20 of the total area of ​​the first surface 4101 to reduce distributed capacitance and improve heat dissipation. In addition, due to the limitation of the internal space of the housing, the area of ​​the first plane 4102 does not exceed 1 / 10 of the total area of ​​the first surface 4101.

[0149] like Fig.44C As shown, in some embodiments, a hole 41021 may be opened at the first plane 4102, so that when the thermal conductive material is poured, it can fully contact the power board 41 and penetrate the power board 41 through the hole 41021, thereby further improving the heat dissipation effect. On the other hand, the thermal conductive material penetrates the power board 41 and can also reinforce the power board 41.

[0150] like Figure 1 , Figure 5 , Fig.10 and Fig.44AAs described above, after the heat-conducting material 305 is arranged in the housing 3, a part of the heat-conducting material 305 is filled in the corresponding part of the first plane 4102 (above the first plane 4102), thereby forming a first heat-conducting part, and a part of the heat-conducting material 305 is filled in the area between the power supply 4 and the inner wall of the housing 3 (the gap between the electronic component and the inner wall of the housing 3), thereby forming a second heat-conducting part. The first heat-conducting part and the second heat-conducting part are separated by the electronic component, so that the first heat-conducting part and the second heat-conducting part have different heat conduction paths, so that the heat generated by the electronic component located outside the second plane 4103 and the electronic component located inside the second plane 4103 during operation is conducted through different paths, so as to improve the heat dissipation effect.

[0151] See also Fig.10 , Fig.11 and Fig.12 The housing 3 includes a first component 32 and a second component 33, wherein the lamp holder 71 is fixedly connected to the first component 32. Specifically, the outer surface of the first component 32 has a structure matching the inner thread 713 of the lamp holder 71 (such as an outer thread provided on the outer surface of the first component 32). The first component 32 and the second component 33 are rotatably connected. Therefore, when the lamp holder 71 is installed to the lamp holder, the light emitting direction of the LED lamp can be adjusted by rotating the second component 33.

[0152] Specifically, the first component 32 has an annular recess 321, and the second component 33 has a convex portion 331. The convex portion 331 cooperates with the annular recess 321, and the two can rotate, thereby finally realizing a rotatable connection between the first component 32 and the second component 33. In other embodiments, the first component 32 and the second component 33 can also be rotated by other structures in the prior art, for example, the first component 32 is set as a convex portion, and the second component 33 is set as an annular recess.

[0153] The first component 32 may further include a first stopper 322, and the second component 33 may further include a second stopper 332, and the first stopper 322 matches the second stopper 332. Specifically, when the first component 32 and the second component 33 rotate relative to each other until the first stopper 322 and the second stopper 332 abut against each other, the further rotation of the first component 32 and the second component 33 can be limited to prevent excessive rotation from affecting or even breaking the internal connecting wire. In one embodiment, due to the setting of the first stopper 322 and the second stopper 332, the relative rotation angle between the first component 32 and the second component 33 ranges from 0 to 355 degrees. In one embodiment, the relative rotation angle between the first component 32 and the second component 33 ranges from 0 to 350 degrees. The relative rotation angle between the first component 32 and the second component 33 ranges from 0 to 340 degrees. The above rotation angle limitation can be achieved by setting the thickness of the first stopper 322 and the second stopper 332 in the circumferential direction (i.e., the angle occupied). In one embodiment, the first stop portion 322 is triangular and the second stop portion 332 is L-shaped, but it is understandable that the shapes of the first and second stop protrusions are not limited, as long as they can interact with each other to block movement during rotation. In other embodiments, the first component 32 and the second component 33 can also achieve rotation through other structures in the prior art, which will not be repeated here.

[0154] The second component 33 includes a plurality of rods 333, which are evenly distributed along a circumference, with a spacing between adjacent rods 333, and the protrusions 331 are formed on the rods 333. The spacing between adjacent rods 333 facilitates elastic deformation of the rods 333 and facilitates insertion of the rods 333 into the first component 32.

[0155] A plurality of teeth 323 are provided along a circumference on the first component 32, and the teeth 323 may be continuous or spaced. A damping portion 334 is provided on the second component 33, and the damping portion 334 is correspondingly matched with the teeth 323. The damping portion 334 may be formed on the second stopper 332, that is, a part of the second stopper 332 is used to match with the teeth 323, and the other part is matched with the first stopper 322. Through the cooperation of the damping portion 334 and the teeth 323, the texture of the first component 32 when rotating relative to the second component 33 can be improved. In addition, through the cooperation of the damping portion 334 and the teeth 323, the first component 32 and the second component 33 are prevented from being loosened or even rotating unnecessarily without external force.

[0156] [Part III]

[0157] See also Figure 1 , Figure 4 and Fig. 9In one embodiment, the heat exchange unit 1 provided in the third part III is connected to the light emitting unit 2 and forms a heat conduction path. When the LED lighting device is working, the heat generated by the light emitting unit 2 can be transferred to the heat exchange unit 1 by heat conduction, and the heat is dissipated by the heat exchange unit 1.

[0158] The heat exchange unit 1 is formed as an integrated component, which includes a heat dissipation fin 101 and a base 102, and the heat dissipation fin 101 is connected to the base 102. The heat dissipation fin 101 provides a heat dissipation area to dissipate the heat generated by the light emitting body 21 (for example, the lamp bead of the LED lighting device) when working, to prevent the light emitting body 21 from overheating (the temperature exceeds the normal working range of the light emitting body 21, such as the temperature exceeds 120 degrees), thereby affecting the life of the light emitting body 21.

[0159] The heat sink fins 101 are extended along a second direction Y, wherein the second direction Y is the width direction of the LED lighting device, which is perpendicular to the aforementioned first direction X. When the heat sink fins 101 are arranged along the second direction Y, they have a relatively short length (compared to the heat sink fins 101 arranged along the first direction X). Therefore, when a convection channel is formed between two adjacent heat sink fins 101, assuming that the air convects along the width direction of the LED lighting device, it has a relatively short convection path, which is conducive to quickly dissipating the heat at the heat sink fins 101. In this embodiment, the heat sink fins 101 are arranged in parallel, and the heat sink fins 101 are evenly distributed in the first direction X.

[0160] The weight of the heat exchange unit 1 is evenly or substantially evenly distributed in the first direction X. In one embodiment, in the X direction, the weight ratio of a section of the heat exchange unit 1 randomly cut out to another section of the heat exchange unit 1 randomly cut out with the same length is 1:0.8-1.2 (the two sections of the heat exchange unit include the same or substantially the same number of heat dissipation fins 101).

[0161] The spacing between the heat dissipation fins 101 is 8 to 30 mm. In one embodiment, the spacing between the heat dissipation fins 101 is 8 to 15 mm. The spacing value can be determined based on radiation and convection during heat dissipation.

[0162] In order to ensure that the LED lighting device has sufficient heat dissipation area and reduce the influence of torque on the connection part (such as the lamp holder) when the LED is installed horizontally, an asymmetric design can be made for the form of the heat exchange unit. Of any two heat dissipation fins 101 in the first direction X, the heat dissipation fin 101 closer to the lamp holder 71 has more heat dissipation area (the heat dissipation fin 101 closer to the lamp holder 71 is relatively higher, so it can have more heat dissipation area).

[0163] In one embodiment, the heat sink 101 has a first part and a second part in its height direction, the first part is arranged close to the base 102, the second part is arranged far from the base 102, and the cross-sectional thickness of any position of the first part is greater than the cross-sectional thickness of any position of the second part. In one embodiment, the heat sink 101 is divided into two parts of the same height, namely the first part and the second part. Since the lower part of the heat sink 101 is mainly used to conduct the heat generated by the light-emitting unit 2 when it is working, and the upper part is mainly used to radiate the heat to the surrounding air, based on this, the cross-sectional thickness of the part of the heat sink 101 close to the heat sink substrate (namely the first part) is larger, and the cross-sectional thickness of the heat sink fin part far from the heat sink substrate (namely the second part) is smaller. Therefore, the first part can ensure that the heat generated by the light-emitting unit 2 when it is working is conducted to the heat sink fin, and the second part can reduce the weight of the entire heat sink fin 101 under the premise of ensuring heat radiation. In general, the above-mentioned setting method can not only achieve a good heat dissipation effect, but also reduce the weight of the entire LED lighting device.

[0164] The heat generated by the light-emitting unit 2 when working is conducted to the heat sink fins 101. The heat is conducted from bottom to top on the heat sink fins 101 (assuming that the LED lighting device is installed horizontally). During this period, part of the heat is conducted to the surrounding air by radiation during the conduction process on the heat sink fins 101. In other words, the higher it goes, the less heat is conducted by the heat sink fins 101. Fourier's law of thermal conduction is as follows: Q = -λAdT / dx, where λ is the thermal conductivity and A is the area of ​​the thermal conduction cross section in m 2 , dT / dx is the temperature gradient in the direction of heat flow, in K / m.

[0165] In one embodiment, assuming that λ is a certain value (when the material of the heat sink fin 101 is determined, the value of λ remains unchanged), the heat flux Q mainly depends on the area of ​​the heat conduction cross section and the temperature gradient in the heat flow direction. In one embodiment, when the change in temperature gradient is ignored, the heat flux Q mainly depends on the area of ​​the heat conduction cross section. Since heat is radiated during the heat conduction process on the heat sink fin 101, the further back in the heat flow direction of the heat sink fin 101, the less heat there is. Therefore, the thickness of the heat sink fin 101 can also be adjusted accordingly (assuming that the width of the heat sink fin 101 is a certain value, the deviation of the width dimension in the height direction of the heat sink fin 101 is less than 30%) to further reduce the torque of the lamp holder 71 while ensuring heat dissipation. See. Figure 1 and Figure 3 In one embodiment, the heat sink fins 101 are provided with a plurality of groups. Here, only the thickness of one group of heat sink fins 101 is used for illustration. A coordinate system is established, with the thickness direction of the bottom of the heat sink fins 101 as the X-axis and the height direction of the heat sink fins 101 as the Y-axis. The thickness and height of the heat sink fins 101 satisfy the following formula:

[0166] y=ax+K

[0167] Wherein, y is the height of the heat sink fin 101; a is a constant, and a is a negative number; x is the thickness of the heat sink fin 101; and K is a constant.

[0168] When a is a negative number, as the height value y of the heat sink 101 increases, the thickness value x of the heat sink 101 decreases. In this way, on the one hand, due to the radiation heat dissipation of the heat sink 101, the thickness of the heat sink 101 decreases as it goes up, and the heat conduction requirement can still be met. On the other hand, the reduction in thickness of the heat sink 101 as it goes up can reduce its weight, thereby reducing the torque of the lamp holder 71 to provide a more relaxed weight design.

[0169] In one embodiment, the value of a is between -40 and -100, and the value of K is between 80 and 150. The units of the values ​​of x and y are both millimeters.

[0170] In one embodiment, the value of a is between -50 and -90, and the value of K is between 100 and 140.

[0171] In one embodiment, the heat sink fins 101 are of the same design, and the number of the heat sink fins 101 is n. In general, the total thickness (the sum of the thicknesses of all the heat sink fins 101) and the height of the heat sink fins 101 satisfy the following formula:

[0172] sn=(yK)n / a

[0173] Wherein, y is the height of the heat sink fin 101 ; a is a constant, and a is a negative number; x is the thickness of the heat sink fin 101 ; K is a constant; and x*n is the total thickness of the heat sink fin 101 .

[0174] In one embodiment, the cross-sectional area of ​​the heat sink fin 101 is equal to the thickness multiplied by the width. Assuming that the width L of the heat sink fin 101 is a certain value (the width of the heat sink fin 101 is a constant value, which means that the deviation of the width dimension in the height direction of the heat sink fin 101 is less than 30%), the thickness and height of the heat sink fin 101 satisfy the following formula:

[0175] y=ax+K, that is, x=(yK) / a

[0176] That is, the cross-sectional area of ​​the heat sink fin Lx = (yK) L / a

[0177] Wherein, y is the height of the heat sink fin 101; a is a constant, and a is a negative number; x is the thickness of the heat sink fin 101; and K is a constant.

[0178] When a is a negative number, as the height value y of the heat sink 101 increases, the cross-sectional area of ​​the heat sink 101 decreases. In this way, on the one hand, due to the radiation heat dissipation of the heat sink 101, the cross-sectional area of ​​the heat sink 101 decreases when it goes up, and the heat conduction requirement can still be met. On the other hand, the reduction in the cross-sectional area of ​​the heat sink 101 when it goes up can reduce its weight, thereby reducing the torque of the lamp holder 71 to provide a more relaxed weight design.

[0179] In one embodiment, the total cross-sectional area of ​​the heat sink fins 101 (the sum of the cross-sectional areas of all the heat sink fins 101) is equal to the total thickness value of the heat sink fins 101 multiplied by the width value, and for all the heat sink fins 101, assuming that the width value L of the heat sink fins 101 is a certain value (here, the width value of the heat sink fins 101 is a constant value, which means that the deviation of the width dimension in the height direction of the heat sink fins 101 is less than 30%), then the total cross-sectional area of ​​the heat sink fins 101 satisfies the following formula:

[0180] nLx=(yK)nL / a

[0181] n is the number of heat dissipation fins 101 .

[0182] When a is a negative number, as the height value y of the heat sink 101 increases, the total cross-sectional area of ​​the heat sink 101 decreases. In this way, on the one hand, due to the radiation heat dissipation of the heat sink 101, the cross-sectional area of ​​the heat sink 101 decreases as it moves upward, and the heat conduction requirement can still be met. On the other hand, the reduction in the cross-sectional area of ​​the heat sink 101 as it moves upward can reduce its weight, thereby reducing the torque of the lamp holder 71, so as to provide a more relaxed weight design.

[0183] In the above embodiment, when considering the thickness of the heat dissipation fin 101 , the chamfered or rounded corners of the ends of the heat dissipation fin 101 need to be excluded.

[0184] In one embodiment, the heat dissipation area (in cm) of the heat dissipation fins 101 of the LED lighting device 2 ) to the power (in W) of the LED lighting device is less than 28. In one embodiment, the weight of the heat exchange unit 1 is 0.6, 0.7, 0.8 or 0.9 kg. Under this weight limit, the above-mentioned heat dissipation area, thickness of the heat dissipation fins 101, etc. are designed.

[0185] In one embodiment, the heat dissipation area of ​​a single heat dissipation fin 101 is approximately the side area of ​​the heat dissipation fin 101 plus the area of ​​the thickness of the heat dissipation fin 101 (the area of ​​the top surface of the heat dissipation fin 101 is relatively small, so the area of ​​the top surface can be basically omitted), which is expressed by the following formula:

[0186] S=S1+S2;S1=2hLn

[0187] Among them, h is the height of the heat sink fin 101, L is the length of the heat sink fin 101 (if the side of the heat sink fin 101 is an irregular shape, the length here may refer to the average length of the heat sink fin 101), S is the total heat sink area of ​​the single heat sink fin 101, S1 is the side area of ​​the heat sink fin 101, S2 is the area of ​​the thickness surface of the heat sink fin 101, and n is the number of heat sink fins.

[0188] The thickness surface of the heat sink fin 101 is a trapezoid, and its area is approximately equal to the thickness of the bottom of the heat sink fin 101 plus the thickness of the top multiplied by the height of the heat sink fin 101. Combined with the thickness and height formula of the heat sink fin 101 y=ax+K, it can be known that the thickness of the bottom is the x value when y is 0, and the thickness of the top is the x value when y is h. The formula of the thickness surface of the heat sink fin 101 is expressed as follows:

[0189] S2=[-K / a+(hK) / a]hn

[0190] Therefore, S=2hLn+[-K / a+(hK) / a]hn=2hLn+[(h-2K) / a]hn

[0191] In this embodiment, in order to ensure that the radiation efficiency of the heat sink 101 can meet the heat dissipation of the LED lighting device and control the weight of the heat exchange unit 1, the heat dissipation area S (in CM) of the heat sink 101 of the LED lighting device is 2 ) to the power P (in W) of the LED lighting device is less than 28 and greater than 18, that is, 18<S / P<28, that is, 18<2hLn / P+[(h-2K) / a]hn / p<28. Under this ratio, the luminous efficiency of the LED lighting device can reach at least 125 lumens per watt.

[0192] In one embodiment, the weight of the heat sink 101 needs to be controlled to control the torque of the lamp holder 71. In one embodiment, the weight of the heat sink 101 is less than 0.4, 0.5, 0.6, 0.7, 0.8 or 0.9 kg, that is, under the above weight limit, the thickness and heat dissipation area of ​​the heat sink 101 must meet the above formula.

[0193] like Fig.13As shown, in some embodiments, the shape of the heat sink fin 101 can be selected from a combination of one or more of square, fan, arc, curve, etc.; the shape of the heat sink fin 101 can also be selected from a convex shape with a high middle and low sides, or a concave shape with a low middle and high sides; at least one heat sink fin 101 can be a continuous whole structure or a combination of multiple discontinuous small heat sink fins; a guide groove and / or through hole can be provided on the surface of at least one heat sink fin 101 to enhance the disturbance effect of the fluid and strengthen the heat transfer effect. Fig.19 , (a)-(d) are schematic diagrams of several optional shapes of heat sink fins according to the contents of this embodiment, and (e)-(h) are schematic diagrams showing shapes having flow holes and guide grooves thereon.

[0194] In one embodiment, in order to improve the emissivity or emissivity of the heat sink fins (increase the emissivity of the surface of the heat sink fins), the surface of the heat sink fins can also be treated accordingly. For example, a heat sink unit for improving the emissivity of the surface of the heat sink fins is set on the surface of the heat sink fins. The heat sink unit can be paint or radiation heat sink paint (mainly using silicon carbide or nanocarbon, etc.) to improve the efficiency of radiation heat dissipation, so as to quickly dissipate the heat of the heat sink fins. In addition, the heat sink unit can also be a porous aluminum oxide layer with a nanostructure formed on the surface of the heat sink fins by anodizing in an electrolyte, so that a layer of aluminum oxide nanopores can be formed on the surface of the heat sink fins, and the heat dissipation capacity of the heat sink is enhanced without increasing the number of heat sink fins. Finally, the heat sink unit can also be coated with a layer of graphene on the surface of the heat sink fins. Graphene is a two-dimensional carbon nanomaterial composed of carbon atoms in a hexagonal honeycomb lattice, with excellent optical, electrical, and mechanical properties, and a thermal conductivity of up to 5300W / mk, so it is very suitable for helping LED lighting equipment to dissipate heat. In one embodiment, after the heat dissipation unit is disposed on the surface of the heat dissipation fin, the emissivity of the surface is greater than 0.7, thereby improving the heat radiation efficiency of the surface of the heat dissipation fin.

[0195] like Figure 1 , Figure 4 and Fig.14 As shown, in one embodiment, the substrate 22 is fixed to the base 102 of the heat exchange unit 1 and forms a heat conduction path. In order to improve the heat dissipation effect, a hole 2201 is provided on the substrate 22. When in use, the two sides of the substrate 22 are connected through the hole 2201, which is beneficial to the convection heat dissipation of the heat exchange unit 1. Correspondingly, a convection opening 1021 corresponding to the hole 2201 is provided on the base 102 of the heat exchange unit 1. In other embodiments, if the heat dissipation performance can meet the heat dissipation of the LED lighting device, the above-mentioned hole 2201 may not be provided on the substrate 22.

[0196] like Figure 1 , Figure 4 and Figure 5 As shown, in one embodiment, the light-emitting body 21 is disposed on the substrate 22 and is electrically connected to the power source 4. In one embodiment, the light-emitting bodies 21 can be connected in parallel, in series, or in series-parallel. In one embodiment, the substrate 22 is an aluminum substrate, and its main material component is aluminum. The base 102 of the heat exchange unit 1 is made of aluminum. When the substrate 22 and the heat exchange unit 1 are made of the same material, the two have the same or approximately the same expansion and contraction rate. That is to say, when the LED lighting device is used for a long time, the substrate 22 and the heat exchange unit 1 will not have different expansion and contraction rates due to repeated alternation of hot and cold, so as to prevent loosening.

[0197] like Figure 8 and Fig. 9 As shown, in one embodiment, there are multiple light-emitting bodies 21 and they are arranged on the substrate 22. The third part III is divided into a first area and a second area by a plane A (the plane is perpendicular to the axial direction of the lamp holder 71) (the length dimension of the first area or the second area in the length direction of the LED lighting device is more than 30% of the total length of the third part III to exclude the influence of certain extreme cases, such as the first area is the area at the end of the third part III where no light-emitting body 21 is arranged). The number of light-emitting bodies 21 included in the first area is X1, and the number of light-emitting bodies 21 included in the second area is X2. The heat dissipation area of ​​the heat dissipation fins 11 included in the first area is Y1, and the heat dissipation area of ​​the heat dissipation fins 101 included in the second area is Y2. The relationship between the heat dissipation area and the number of light-emitting bodies 21 satisfies the following conditions:

[0198] X1 / X2: Y1 / Y2=0.8~1.2

[0199] The above ratio is between 0.8 and 1.2, which can ensure that the luminous body 21 has a corresponding and sufficient heat dissipation area for heat dissipation. In particular, when there are differences in the distribution of the luminous bodies 21 or the distribution of the heat dissipation area, it can prevent the above differences from being too large and affecting the heat dissipation of some luminous bodies 21.

[0200] like Figure 8 and Fig. 9As shown, in one embodiment, there are multiple light-emitting bodies 21 and they are arranged on the substrate 22. The third part III is divided into a first area and a second area by a plane A (the plane is perpendicular to the axial direction of the lamp holder 71) (the length dimension of the first area or the second area in the length direction of the LED lighting device is more than 30% of the total length of the third part III, so as to exclude the influence of certain extreme cases, such as the first area is the area where the light-emitting body 21 is not arranged at the end of the third part III). The total luminous flux of the first area is N1, and the number of light-emitting bodies 21 included in the second area is N2. The heat dissipation area of ​​the heat dissipation fins 11 included in the first area is Y1, and the heat dissipation area of ​​the heat dissipation fins 101 included in the second area is Y2. The relationship between the heat dissipation area and the number of light-emitting bodies 21 satisfies the following conditions:

[0201] N1 / N2: Y1 / Y2=0.8~1.2

[0202] The above ratio is between 0.8 and 1.2, which can ensure that when a certain luminous flux is emitted, there is a corresponding and sufficient heat dissipation area for heat dissipation. In particular, when there is a difference in the distribution of the luminous flux in the first area and the second area or a difference in the distribution of the heat dissipation area, the above difference can be prevented from being too large to affect the heat dissipation.

[0203] In one embodiment, the substrate 22 may be a PCB hard board, or a FPC soft board, or an aluminum substrate. The substrate 22 may exemplarily have a control circuit to further control the light emitting body 21 to achieve various desired functions.

[0204] like Fig.14 , Fig.15 , Fig.16A , Fig. 16B and Fig.17 As shown, in one embodiment, the housing 3 and the heat exchange unit 1 are connected via a fixing unit 6. Specifically, the fixing unit 6 includes a first component 61, a second component 62 and a positioning unit 63. The first component 61 and the second component 62 are slidably connected. The first component 61 can be arranged on the lamp housing 3, and the second component 62 can be arranged on the heat exchange unit 1. In other embodiments, the first component 61 can be arranged on the heat exchanger, and the second component 62 can be arranged on the lamp housing 3. The first component 61 can be configured as a slide groove, and the second component 62 can be configured as a guide rail.

[0205] The positioning unit 63 is used to fix the first component 61 and the second component 62 relatively when the first component 61 and the second component 62 cooperate with each other. At this time, the heat exchange unit 1 and the housing 3 are relatively fixed. Specifically, the first component 61 and the second component 62 are correspondingly provided with positioning grooves 611 and 621, and the positioning unit 63 is matched in the positioning grooves 611 and 612 to limit the mutual sliding of the first component 61 and the second component 62. In one embodiment, the positioning unit 63 is provided on the light output unit 5.

[0206] In one embodiment, the light output unit 5 is provided with a fastening device. In one embodiment, the fastening device is a buckle 51, and the light output unit 5 is fixed to the heat exchange unit 1 by the buckle, thereby completing the fixation of the light output unit 5. In other embodiments, the light output unit 5 can also be fixed to the heat exchange unit 1 by using structures in the prior art such as a snap connection or a threaded connection.

[0207] In one embodiment, the light output unit 5 may be additionally configured with an optical device, and the optical device may be configured with a degree of reflection, refraction and / or scattering to provide any suitable combination of reflection, refraction and / or scattering, such as using a reflecting device, a diffusing device, etc. In one embodiment, the optical device may also be configured to increase the light flux passing through the light output unit 5, such as using an anti-reflection film. In one embodiment, the optical device may also be configured to adjust the light type, such as using a lens, a reflecting device, etc.

[0208] like Fig.17 , which shows a schematic diagram of the cooperation between the heat sink fins 101 and the light emitters 21. On the plane where the light emitters 21 are located, the distance from any light emitter 21 to the adjacent heat sink fins 101 (when the heat sink fins 101 are projected onto the plane where the light emitters 21 are located, the distance from the light emitter 21 to the aforementioned light emitter 21) is greater than the distance between the light emitter 21 and any other light emitter 21. In terms of the heat conduction path, the heat generated by the light emitter 21 can be conducted to the adjacent heat sink fins 101 faster, thereby reducing the influence of the heat generated by the light emitter 21 on other light emitters 21.

[0209] See also Fig.45 and Fig.46 In one embodiment, the light output unit 5 includes a first light emitting area 52 and a second light emitting area 53, the first light emitting area 52 is configured to receive light (unreflected light) directly emitted by the light emitting body 21 when it is working, and at least part of the light directly emitted by the light emitting body 21 is emitted from the first light emitting area 52, while the second light emitting area 53 only receives the reflected light, and at least part of the reflected light is emitted from the second light emitting area 53.

[0210] In one embodiment, the LED lighting device is provided with a reflecting device, and at least a portion of the light generated by the light emitting body 21 when working is reflected once or multiple times by the reflecting device and then emitted from the second light emitting area 53. Among them, the total luminous flux emitted by the second light emitting area 53 accounts for 0.01% to 40% of the total luminous flux emitted by the light emitting body 21. In some embodiments, the total luminous flux emitted by the second light emitting area 53 accounts for 1% to 10% of the total luminous flux emitted by the light emitting body 21. In this way, the glare problem caused by local strong light in the light output unit 5 can be solved, making the light output more uniform. In one embodiment, the average illuminance on the second light emitting area 53 is at least 0.01% of the average illuminance on the first light emitting area 52, and not more than 35%. In some embodiments, the average illuminance on the second light emitting area 53 is at least 1% to 20% of the average illuminance on the first light emitting area 52.

[0211] In one embodiment, the reflective device includes a first reflective surface 521, and the first reflective surface 521 is configured to reflect at least a portion of the light directly emitted by the light emitter 21. In one embodiment, the reflective device includes a second reflective surface 223, and the second reflective surface 223 is configured to reflect the light reflected back by the first reflective surface 521, and reflect at least a portion of the light reflected back by the first reflective surface 521 to the second light exit area 53.

[0212] In one embodiment, the first reflective surface 521 is disposed on the inner surface of the first light exiting area 52. The first reflective surface 521 may be coated on the inner surface of the first light exiting area 52 so as to transmit a portion of the light and reflect a portion of the light. In other embodiments, the first reflective surface 521 may also be directly the inner surface of the first light exiting area 52, and the first reflective surface 521 has the functions of transmission and reflection due to the material properties of the first light exiting area 52. In the above embodiments, the ratio of the luminous flux reflected from the first reflective surface 521 to the luminous flux transmitted from the first reflective surface 521 is between 0.003 and 0.1. If the first reflective surface 521 has the functions of transmission and reflection due to the material properties of the first light exiting area 52, the refractive index of the first light exiting area 52 is configured to be between 1.4 and 1.7, so that the light transmittance and reflection performance of the first reflective surface 521 reach a better value.

[0213] In one embodiment, the second reflective surface 223 is disposed on the surface of the substrate 22 of the light emitting unit 2. Specifically, a reflective layer is coated on the surface of the substrate 22 to form the second reflective surface 223. The second reflective surface 223 can be a material with a reflective function in the prior art, which is not listed here.

[0214] In one embodiment, the total light transmittance of the LED lighting device (the ratio of the light transmitted by the light output unit 5 to the light emitted by the light emitter 21) is greater than 90%. In one embodiment, the total light transmittance of the LED lighting device (the ratio of the light transmitted by the light output unit 5 to the light emitted by the light emitter 21) is greater than 93%. In one embodiment, the light efficiency of the LED lighting device is greater than 130 lumens per watt.

[0215] In one embodiment, in order to improve the light transmittance of the LED lighting device, an anti-reflection coating can be provided on the light output unit 5 to reduce the reflection of light when it hits the light output unit 5, thereby improving the light transmittance, so that the light efficiency of the LED lighting device can reach at least 135 lumens per watt.

[0216] like Fig.47 As shown, the first light-emitting area 52 and the second light-emitting area 53 are specifically divided as follows: the light-emitting angle of the light-emitting body 21 is a, and the area where the light directly emitted by the light-emitting body 21 is projected onto the light output unit 5 is the first light-emitting area 52, and the other area on the light output unit 5 where light is emitted is the second light-emitting area 52.

[0217] like Fig.48 As mentioned above, in one embodiment, an anti-reflection film 54 is provided on the inner surface of the light output unit 5 so that the light transmittance of the LED lighting device reaches more than 95%. The light generated by the light emitter 21 when working passes through the first medium (which can be the air between the light emitter 21 and the light output unit 5), the anti-reflection film 54 and the light output unit 5 in sequence. In this embodiment, the refractive index of the first medium is n1, the refractive index of the light output unit 5 is n2, and the refractive index of the anti-reflection film 54 is n, wherein the refractive index of the anti-reflection film 54 meets the following formula:

[0218]

[0219] In one embodiment, the thickness of the anti-reflection film 54 is d, and the thickness d=(2k+1)L / 4, wherein k is a natural number, and L is the wavelength of light in the anti-reflection film 54 .

[0220] In one embodiment, the light output unit 5 is made of a light-transmitting material, such as glass, plastic, etc. In one embodiment, the light output unit 5 is an integrated structure or a structure formed by splicing multiple pieces.

[0221] In one embodiment, the light output unit 5 has a hole corresponding to the hole 2201 on the substrate 22 .

[0222] In one embodiment, the cross-sectional shape of the light output unit 5 is wavy, arc-shaped or straight. When the wavy or arc-shaped is adopted, the light output unit 5 can have better strength.

[0223] The heat generated by the light-emitting unit when working needs to be transferred to the heat exchange unit as quickly as possible and dissipated by the heat exchange unit. When the heat of the light-emitting unit is transferred to the heat exchange unit, one of the factors affecting the transfer speed is the thermal resistance between the light-emitting unit and the heat exchange unit.

[0224] In one embodiment, in order to reduce the thermal resistance between the light-emitting unit 2 and the heat exchange unit 1, it is necessary to increase the contact area between the light-emitting unit 2 (the substrate 22 of the light-emitting unit 2) and the heat exchange unit 1. Specifically, a thermally conductive adhesive is provided between the light-emitting unit 2 and the heat exchange unit 1. The thermally conductive adhesive may be specifically made of thermally conductive silicone grease or other similar materials. By providing the thermally conductive adhesive, the gap between the light-emitting unit 2 and the heat exchange unit 1 can be filled, thereby achieving the purpose of increasing the contact area between the light-emitting unit 2 and the heat exchange unit 1, so that the thermal resistance between the light-emitting unit 2 and the heat exchange unit 1 is reduced. Usually, the thermally conductive adhesive is first applied to the light-emitting unit 2, and then the light-emitting unit 2 is connected to the heat exchange unit 1. In other embodiments, the thermally conductive adhesive may also be first applied to the heat exchange unit 1.

[0225] like Fig. 16B , 17, Fig.18 and Fig.19 As shown, in one embodiment, a fixing structure for fixing the light emitting unit 2 is provided on the heat exchange unit 1. Specifically, the heat exchange unit 1 includes a fixing unit 12, and the fixing unit 12 is fixed to the outer edge of the substrate 22 of the light emitting unit 2 in cooperation.

[0226] The heat exchange unit 1 includes a base 102, and the fixing unit 12 includes a first fixing unit 121 and a second fixing unit 122, which are arranged in the length direction of the heat exchange unit 1 and fixed on the base 13. The first fixing unit 121 and the second fixing unit 122 are arranged on the other side of the base 102 relative to the heat dissipation fins 101. The first fixing unit 121 and the second fixing unit 122 are respectively matched with the two ends of the base 22 in the length direction.

[0227] The first fixing unit 121 includes a first groove portion 1211, and the second fixing unit 122 includes a second groove portion 1221. The opening directions of the first groove portion 1211 and the second groove portion 1221 are arranged opposite to each other. One end of the substrate 22 in the length direction is inserted into the first groove portion 1211, and the other end of the substrate 22 in the length direction is inserted into the second groove portion 1221.

[0228] Furthermore, a first wall 1212 is provided on the first fixing unit 121, and the first groove 1211 is formed between the first wall 1212 and the base 13. A second wall 1222 is provided on the second fixing unit 122, and the second groove 1221 is formed between the second wall 1222 and the base 13. When the two ends of the substrate 22 are respectively inserted into the first groove 1211 and the second groove 1221, force is applied to the first wall 1212 and the second wall 1222, so that the first wall 1212 and the second wall 1222 are deformed and pressed against the surface of the substrate 22 respectively, so that the substrate 22 is fixed relative to the base 13 ( Fig.23 The first wall 1212 and the second wall 1222 are shown to be deformed and pressed against the surface of the substrate 22 respectively).

[0229] The end of one side of the substrate 22 abuts against the bottom 12211 of the second groove 1221, thereby controlling the installation position of the substrate 22 and ensuring the consistency of the installation position of the substrate 22 of different LED lighting devices. The other side of the substrate 22 maintains a gap with the bottom 12111 of the first groove 1211. The setting of the gap can prevent the substrate 22 from being squeezed and deformed by the base 13. Specifically, the substrate 22 and the base 13 may have different shrinkage rates due to different materials. After a long period of alternating cold and hot, the substrate 22 may be squeezed by the base 13 in the length direction, causing the substrate 22 to bulge. The setting of the gap can effectively avoid this situation.

[0230] The thickness of the first wall 1212 gradually decreases in the direction close to the second wall 1222. This makes the first wall 1212 more susceptible to deformation at its outer side. Correspondingly, the second wall 1222 can also be arranged in the same manner, that is, the thickness of the second wall 1222 gradually decreases in the direction close to the first wall 1212.

[0231] In one embodiment, both ends of the base plate 22 are inserted into the first groove 1211 and the second groove 1221 (not shown) in the lateral direction at the same time. At this time, the first groove 1211 and the second groove 1221 provide a structure similar to a slide groove and a guide rail, and are installed and configured with the base plate 22. In this way, the installation method of the base plate 22 is relatively simple.

[0232] See also FIG. 16B to FIG. 23 In one embodiment, in order to prevent the thermal conductive adhesive pre-coated on the back of the substrate 22 from overflowing during the installation process, the substrate 22 can be installed in different ways. Specifically, the substrate 22 is directly attached to the base 13 from above the base 13, and the two ends of the substrate 22 are respectively inserted into the first groove 1211 and the second groove 1221.

[0233] See also Fig.18In one embodiment, the first wall 1212 has a first state (before the first wall 1212 is deformed by force). In the first state, the inner surface of the first wall 1212 is set as an inclined surface 12121, and the distance between the inclined surface 12121 and the base 13 gradually decreases in the direction toward the second wall 1222, so that the opening of the first groove 1211 is expanded, so as to facilitate the substrate 22 to be directly inserted into the first groove 1211 obliquely above the base 13 (the substrate 22 and the base 13 maintain an angle). In this embodiment, the distance from the bottom 12111 of the first groove 1211 to the end of the second wall 1222 is greater than the length of the substrate 22. Therefore, when one end of the substrate 22 is inserted into the first groove 1211 and its end is against the bottom 12111 of the first groove 1211, the substrate 22 can be directly attached to the base 13 downward. Then, translate the base 13 so that one end of the base 13 rests against the bottom 12211 of the second groove 1221. At this time, the end of the first wall 1212 and the end of the second wall 1222 correspond to the substrate 22 in the thickness direction of the substrate 22. Finally, the substrate 22 can be pressed by the first wall 1212 and the second wall 1222.

[0234] See also FIG. 16B to FIG. 23 The method for installing the substrate 22 in this embodiment includes the following steps:

[0235] A substrate 22 is provided, and a thermal conductive adhesive is disposed on the surface of the substrate 22;

[0236] A base 13 is provided;

[0237] Insert one end of the substrate 22 in the longitudinal direction obliquely into the first groove 1211 (refer to Fig. 20 );

[0238] The substrate 22 is attached to the base 13 (refer to Fig.21 );

[0239] The substrate 22 is translated so that one end of the substrate 22 abuts against the bottom 12211 of the second groove 1221 (refer to Fig. 22 );

[0240] Apply force to the first wall 1212 and the second wall 1222, so that the first wall 1212 and the second wall 1222 are pressed against the surface of the substrate 22 (refer to Fig.23 ).

[0241] See also Fig.24 and Fig.25In another embodiment, the first wall 1212 and the second wall 1222 may adopt different shapes. Specifically, the first wall 1212 and the second wall 1222 are both arranged perpendicular to the surface of the base 13 before deformation, and the distance between the first wall 1212 and the second wall 1222 is greater than or slightly greater than the length of the substrate 22 (specifically, the difference between the distance between the first wall 1212 and the second wall 1222 and the length of the substrate 22 is 0 to 3 mm), so that the substrate 22 can be directly placed between the first wall 1212 and the second wall 1222 from above the base 13. Fig.25 Then, the first wall 1212 and the second wall 1222 are bent so that the first wall 1212 and the second wall 1222 are pressed tightly against the substrate 22. The method for installing the substrate 22 in this embodiment includes the following steps:

[0242] A substrate 22 is provided, and a thermal conductive adhesive is disposed on the surface of the substrate 22;

[0243] A base 13 is provided, and a first wall 1212 and a second wall 1222 are provided on the base 13;

[0244] The substrate 22 is attached to the base 13 in the thickness direction thereof;

[0245] Force is applied to the first wall 1212 and the second wall 1222 , so that the first wall 1212 and the second wall 1222 are pressed against the surface of the substrate 22 , respectively.

[0246] like Fig.26 and Fig. 27 As shown, in one embodiment, the heat exchange unit 1 can further fix the substrate 22 and the heat exchange unit 1. For example, they are further connected by bolts or rivets. Specifically, a connection hole 116 is set on the base 102 between the heat dissipation fins 101 for connection. At this time, holes need to be opened on the substrate 22 corresponding to the connection holes 116, which will not be repeated here.

[0247] To further prevent the problem of thermal conductive adhesive overflow when the substrate and the base are attached, the position of the thermal conductive adhesive can be designed accordingly. FIG. 16B to FIG. 19 ,and Figure 27 to Figure 28In one embodiment, when the thermal conductive adhesive 23 is applied to the other side of the substrate 22 opposite to the light emitting body 21, the thermal conductive adhesive 23 maintains a distance from the outer edge of the substrate 22. Therefore, when the substrate 22 is attached to the base 13, the thermal conductive adhesive 23 has a certain outward flow space to prevent the thermal conductive adhesive from overflowing. In one embodiment, after the substrate 22 is attached and installed on the base 13, the thermal conductive adhesive 23 maintains a distance from the outer edge of the substrate 22, and the distance value ranges from 0 to 10 mm. In one embodiment, the main impact of the overflow of the adhesive is that the thermal conductive adhesive overflows from both sides in the width direction of the substrate 22, affecting the aesthetics, while the two sides in the length direction of the base 22 are stuck in the first groove 1211 and the second groove 1221, so even if the thermal conductive adhesive overflows, it is blocked by the first groove 1211 and the second groove 1221. Therefore, when setting the thermal conductive adhesive, after the substrate 22 and the base 13 are installed, it is set to keep a distance from the thermal conductive adhesive to both sides in the width direction of the substrate 22, and the distance value ranges from 0 to 10 mm. Preferably, the spacing value ranges from 0 to 5 mm.

[0248] In order to avoid the problem of thermal conductive glue overflow, other overflow structures can be set. Fig.28 and Fig.29 As shown, in another embodiment, a first receiving groove 131 is provided on the base 13. When the substrate 22 is installed on the base 13, the first receiving groove 131 corresponds to the outer edge of the substrate 22 and does not exceed the outer boundary of the substrate 22. The cross-sectional shape of the first receiving groove 131 can be set to be square, arc or triangle. Therefore, when the substrate 22 and the base 13 are installed, the thermal conductive adhesive can flow to the first receiving groove 131 to prevent excess thermal conductive adhesive from overflowing. Fig.30 As shown, in other embodiments, the substrate 22 may be provided with a similar structure. Specifically, a second receiving groove 222 may be provided on the surface of the substrate 22 relative to the base. The second receiving groove 222 may be provided on both sides of the width direction of the substrate 22. Similarly, the cross-sectional shape of the second receiving groove 222 may be provided in a square, arc or triangle shape. In other embodiments, the design of the first receiving groove 131 and the second receiving groove 222 may be adopted at the same time.

[0249] like Fig. 27 and Fig.28 As shown, in one embodiment, when the light-emitting unit 2 is working, its heat source is mainly generated from the light-emitting body 21, and the light-emitting body 21 is set in a setting area 221 of the substrate 22 (the setting area 221 includes a connecting wire for electrically connecting the light-emitting body 21). In order to ensure that the substrate 22 is in the contact area of ​​the light-emitting body 21 in the base 13, thermal conductive adhesive can be applied to the other side of the substrate 22 relative to the light-emitting body 21, and the position of the thermal conductive adhesive 23 corresponds to the position of the setting area 221 (at least 70% of the setting position of the thermal conductive adhesive 23 corresponds to the position of the setting area, which means that the position of the thermal conductive adhesive 23 corresponds to the position of the setting area 221).

[0250] In other embodiments, the heat exchange unit 1 may also adopt a split structure. Fig.31 , Fig.32 , Fig.33 , Fig.34 and Fig.25 As shown, in one embodiment, the heat exchange unit 1 includes a first heat sink 11 and a second heat sink 12. The basic structure of the first heat sink 11 and the second heat sink 12 is roughly the same as the heat exchange unit 1 of the integrated structure of the above-mentioned embodiment. The first heat sink 11 and the second heat sink 12 are arranged in the second direction Y. In the second direction Y, the first heat sink 11 and the second heat sink 12 have different relative positions, so that the heat exchange unit 1 has a folded state and an unfolded state. The heat exchange unit 1 can switch between the folded state and the unfolded state. The heat exchange unit 1 has a width dimension A in the folded state, and the heat exchange unit 1 has a width dimension B in the unfolded state. The width dimension A of the heat exchange unit 1 in the folded state is smaller than the width dimension B of the heat exchange unit 1 in the unfolded state. When the heat exchange unit 1 is in the folded state, the heat exchange unit 1 has a smaller volume (or a smaller width dimension), which is conducive to the packaging, transportation and installation of LED lighting equipment. From the installation perspective, when the LED lighting device needs to be installed in a lamp for use, when the heat exchange unit 1 is in a folded state, it is more convenient for the LED lighting device to be installed in the lamp in a rotating manner, so that the heat exchange unit 1 is not easy to collide with the lamp and cause damage to the lamp. When the heat exchange unit 1 is in an unfolded state, it has a larger area or space that can be used for heat dissipation, which is more conducive to the heat dissipation of the LED lighting device. From the use perspective, when installing, the heat exchange unit 1 can be folded first, which is convenient for installation. After the installation is completed, the heat exchange unit 1 can be unfolded to facilitate the heat dissipation of the LED lighting device. The second direction Y in this embodiment is the width direction of the LED lamp when it is in use. In other embodiments, the second direction Y can be a different direction, such as the second direction Y is at a certain angle to the substrate 22, and the second direction Y is along a circumference.

[0251] like Fig.31 and Fig.35 As shown, in this embodiment, the ratio of the width dimension B of the heat exchange unit 1 in the unfolded state to the width dimension A of the heat exchange unit 1 in the folded state is not less than 1.1 and not greater than 2. Preferably, the ratio of the width dimension B of the heat exchange unit 1 in the unfolded state to the width dimension A of the heat exchange unit 1 in the folded state is not less than 1.2 and not greater than 1.8. In this way, the heat exchange unit 1 obtains sufficient adjustment space. So that the heat exchange unit 1 has sufficient adjustment space.

[0252] like Fig.31As shown, the first heat sink 11 includes a first heat sink fin 111, and the second heat sink 12 includes a second heat sink fin 121. In the folded state, the first heat sink fin 111 and the second heat sink fin 121 at least partially overlap in the first direction X. In the expanded state, the first heat sink fin 111 and the second heat sink fin 121 do not overlap in the first direction X, or the size of the overlapping portion of the first heat sink fin 111 and the second heat sink fin 121 in the first direction X is smaller than that in the folded state. In one embodiment, the first heat sink fin 111 and the second heat sink fin 121 have a spacing in the first direction X, so that the first heat sink fin 111 and the second heat sink fin 121 do not contact each other regardless of the folded state or the expanded state, so as to avoid mutual heat influence. In this embodiment, the first heat sink fin 111 and the second heat sink fin 121 are arranged in parallel or approximately in parallel.

[0253] The spacing between the first heat sink fins 111 is 8 to 25 mm, with a preferred value of 8 to 15 mm. The spacing can be determined based on radiation and convection during heat dissipation. The spacing between the second heat sink fins 121 can be the same as the spacing between the first heat sink fins 111. This not only satisfies the heat dissipation requirements while controlling the weight, but also makes it easier for the heat exchange unit 1 to switch between the folded state and the unfolded state without mutual abutment and friction between the first heat sink fins 111 and the second heat sink fins 121. Of course, within the design range where no mutual abutment and friction occur between the first heat sink fins 111 and the second heat sink fins 121, the spacing between the second heat sink fins 121 can be set to be different from the spacing between the first heat sink fins 111.

[0254] like Figures 31 to 40As shown, in order to realize the folded state and the unfolded state of the heat exchange unit 1, an adjustment unit 8 is specifically included. The adjustment unit 8 can be directly arranged on the surface of the shell 3 facing the heat exchange unit 1, and is integrally formed with the shell 3, or it can be formed in other ways and then fixed on the shell 3. The adjustment unit 8 includes a slide rail 81, a first positioning unit 82, a second positioning unit 83 and an elastic component 84. The slide rail 81 is extended along the second direction Y. The first heat sink 11 and the second heat sink 12 are both provided with corresponding components to match the slide rail 81, so that the first heat sink 11 and the second heat sink 12 can be directional moved along the slide rail 81 (second direction Y). Specifically, the first heat sink 11 is provided with a first element 112 to match the slide rail 81, and the second heat sink 12 is provided with a second element 122 to match the slide rail 81. The number of slide rails 81 can be set in multiple groups to provide stability of the connection. For example, a long slide rail with a longer length is provided on one side of the end of the housing 3 in the thickness direction of the LED lighting device, which is shared by the first element 112 of the first heat sink 11 and the second element 122 of the second heat sink 12, while two short slide rails with shorter lengths are provided on the other side of the end of the housing 3 in the thickness direction of the LED lighting device, respectively matching the first element 112 of the first heat sink 11 and the second element 122 of the second heat sink 12. It is understandable that the slide rails can also be provided in any other number. Exemplarily, two short slide rails are provided at the upper and lower ends of the housing 3 to respectively match the first element 112 of the first heat sink 11 and the second element 122 of the second heat sink 12, etc.

[0255] The first positioning unit 82 and the second positioning unit 83 are used to limit the sliding stroke of the first heat sink 11 and the second heat sink 12, that is, the maintenance of the folded state and the unfolded state is achieved by the first positioning unit 82 and the second positioning unit 83 respectively. When the heat exchange unit 1 is in the folded state, the first positioning unit 82 positions and fixes the first heat sink 11 and the second heat sink 12, and when the heat exchange unit 1 is in the unfolded state, the second positioning unit 83 positions the first heat sink 11 and the second heat sink 12 to limit the unfolded size of the first heat sink 11 and the second heat sink 12. When the heat exchange unit 1 is in the folded state, the elastic component 84 is arranged on the heat exchange unit 1 and exerts force on the first heat sink 11 and the second heat sink 12 with its elastic potential energy at the same time. When the first positioning unit 82 is released to position and fix the first heat sink 11 and the second heat sink 12, the first heat sink 11 and the second heat sink 12 will automatically unfold, and the unfolded size of the first heat sink 11 and the second heat sink 12 is limited by the second positioning unit 83.

[0256] The first positioning unit 82 includes a first buckling portion 821, a second buckling portion 822, an elastic arm portion 823 and a pressing portion 824. The first buckling portion 821, the second buckling portion 822 and the pressing portion 824 are all fixed to the elastic arm portion 823, and the elastic arm portion 823 is fixed to the housing 3. The first heat sink 11 has a first recess 113, and the first recess 113 matches the first buckling portion 821. The second heat sink 12 has a second recess 123, and the second recess 123 matches the second buckling portion 822. When in the folded state, the first snap-fitting portion 821 is snapped into the first recess 113, and the second snap-fitting portion 822 is snapped into the second recess 123. When the pressing portion 824 is pressed, the elastic arm portion 823 changes the positions of the first snap-fitting portion 821 and the second snap-fitting portion 822 through its elastic deformation, so that the first snap-fitting portion 821 and the second snap-fitting portion 822 are disengaged from the first recess 113 and the second recess 123. At this time, the first heat sink 11 and the second heat sink 12 are automatically unfolded by the action of the elastic component 84.

[0257] The second positioning unit 83 includes a first positioning portion 831 and a second positioning portion 832, both of which are arranged on the housing 3, a first positioning hole 114 is provided on the first heat sink 11, and a second positioning hole 124 is provided on the second heat sink 12, the first positioning portion 831 matches the first positioning hole 114, and the second positioning portion 832 matches the second positioning hole 124, thereby limiting the positions of the first heat sink 11 and the second heat sink 12 when they are deployed. The first positioning portion 831 and the second positioning portion 832 both protrude from the end surface of the housing 3 when there is no external force. In other embodiments, the first positioning portion 831 and the second positioning portion 832 may be arranged on the heat exchange unit 1, and the first positioning hole 114 and the second positioning hole 124 may be arranged on the housing 3.

[0258] The first positioning portion 831 and the second positioning portion 832 of the second positioning unit 83 respectively include an elastic arm 8311, 8321. When the first heat sink 11 and the second heat sink 12 are assembled to the shell 3, as the first element 112 and the second element 122 of the first heat sink 11 and the second heat sink 12 move along the slide rail 81 from the two sides of the shell 3 to the central axis, the elastic arms 8311, 8312 of the first positioning portion 831 and the second positioning portion 832 are first pressed down and then pop up in the first positioning hole 114 of the first heat sink 11 and the second positioning hole 124 of the second heat sink 12, respectively, to achieve the limiting fixation of the first heat sink 11 and the second heat sink 12.

[0259] In other embodiments, the heat exchange unit 1 may be switched between the folded state and the expanded state by applying non-elastic potential energy to the first heat sink 11 and the second heat sink 12 , for example, by directly applying external force.

[0260] like Figures 36 to 40 As shown, a third positioning unit 85 can also be provided on the shell 3, and a first positioning groove 1121 and a second positioning groove 1221 are respectively provided on the first element 112 and the second element 122 to match it. When the heat exchange unit is in a folded state, the third positioning unit 85 abuts against the first positioning groove 1121 and the second positioning groove 1221 respectively, thereby limiting the first heat sink 11 and the second heat sink 12 from continuing to move toward each other in the folded state.

[0261] Specifically, the third positioning unit 85 is provided on the elastic arm portion 823, and optionally, the third positioning unit 85 is a raised structure. In one embodiment, the third positioning unit 85 is formed into a cylindrical shape. A first positioning groove 1121 is provided at a position corresponding to the third positioning unit 85 on the first element 112 of the first heat sink 11, and the first positioning groove 1121 is set to a shape matching the third positioning unit 85. When the third positioning unit 85 is cylindrical, the first positioning groove 1121 is set to a semicircular groove. Similarly, a second positioning groove 1221 is provided at a position corresponding to the third positioning unit 85 on the second element 122 of the second heat sink 12, and the second positioning groove 1221 is also set to a shape matching the third positioning unit 85. When the third positioning unit 85 is set to a cylindrical shape, the second positioning groove 1221 is set to a semicircular groove. Based on this design, when the heat exchange unit 1 is in the folded state, the cylindrical protrusion of the third positioning unit 85 abuts against the first positioning groove 1121 and the second positioning groove 1221 respectively, thereby further limiting the first heat sink 11 and the second heat sink 12 from continuing to move toward each other in the folded state.

[0262] In another embodiment, the third positioning unit 85 may also be formed into any other raised shape, such as an ellipse, a square, a diamond, a sphere, any polygon, etc., as long as it can satisfy the limiting function, and the number may be 1, 2 or more.

[0263] In another embodiment, the third positioning unit 85 may be disposed at another suitable position on the shell 3 other than the elastic arm portion 823 , preferably on the central axis of the surface of the shell 3 facing the heat exchange unit 1 .

[0264] In another embodiment, the third positioning unit 85 may also be provided with positioning components (not shown) at corresponding positions on the first element 112 of the first heat sink 11 and the second element 122 of the second heat sink 12 to further limit the first heat sink 11 and the second heat sink 12 from continuing to move toward each other in the folded state. For example, a protrusion is provided at the corresponding position of the first element 112 and the second element 122. When the heat exchange unit is in the folded state, the protrusion of the first element 112 abuts against the corresponding protrusion of the second element 122, thereby further limiting the first heat sink 11 and the second heat sink 12 from continuing to move toward each other in the folded state. The protrusion may be formed into any suitable protrusion shape, as long as it can satisfy the function of limiting, and the number may also be 1, 2 or more.

[0265] like Figure 33 to Figure 37 As shown, in one embodiment, in order to increase the stability of the relative sliding of the first heat sink 11 and the second heat sink 12, and further reduce the problem of the first heat sink 11 and the second heat sink 12 tilting relative to each other when unfolded, a corresponding guide structure can be designed. Specifically, guide holes 115, 125 are respectively provided on the first heat sink 11 and the second heat sink 12, and then a positioning shaft is passed through the guide holes 115, 125, so as to improve the stability of the first heat sink 11 and the second heat sink 12 when sliding relative to each other, and avoid the first heat sink 11 and the second heat sink 12 tilting relative to each other when unfolded. In one embodiment, the guide holes 115, 125 are provided at the ends of the first heat sink fin 111 and the second heat sink fin 121 close to the light-emitting unit 2. In one embodiment, the elastic component 84 can be provided in one of the guide holes, and the elastic potential energy of the first heat sink 11 and the second heat sink 12 is applied by the positioning component (such as a protrusion) on the positioning shaft. In one embodiment, a guide hole is only provided on any one of the first heat sink 11 and the second heat sink 12, and a positioning shaft is provided at a position corresponding to the guide hole on the other heat sink, so that the stability of the first heat sink 11 and the second heat sink 12 during relative sliding is improved by inserting the guide positioning shaft into the guide hole, thereby avoiding the first heat sink 11 and the second heat sink 12 from tilting against each other when unfolded.

[0266] In one embodiment, at least one guide hole 115, 125 is provided on each heat sink. In one embodiment, a plurality of guide holes 115, 125 may be provided in the length direction of the heat exchange unit 1, for example, one guide hole 115, 125 is provided at one end of the heat exchange unit 1 close to the housing 3 and one guide hole 115, 125 is provided at one end of the heat exchange unit 1 far from the housing 3.

[0267] like Figure 32 to Figure 35As shown, in one embodiment, a first heat dissipation fin 111 of the first heat dissipation element 11 is provided with a spacer 1111, so that, on the one hand, a connection hole 116 can be provided at the spacer 1111, and on the other hand, the convection at the spacer 1111 can be increased. The setting of the connection hole 116 is used to fix the substrate 22 to prevent the substrate 22 from bulging, thereby reducing the contact area between the substrate 22 and the heat exchange unit 1, and finally reducing the heat conduction efficiency. Specifically, through the setting of the connection hole 116, bolts, rivets, etc. can be used to pass through the connection hole 116 to achieve the connection between the substrate 22 and the heat exchange unit 1. Due to the positional relationship between the first heat dissipation fin 111 and the second heat dissipation fin 121, the connection hole 126 on the second heat dissipation fin 121 is located between the two second heat dissipation fins 121, so there is no need to set the connection hole 116. In other embodiments, the connection hole 116 can be adjusted without setting the spacer, so that the connection hole 116 of the first heat dissipation element 11 and the connection hole 126 on the second heat dissipation element 12 are different in position in the first direction X.

[0268] like Figure 32 to Figure 35 As shown, in one embodiment, when the heat exchange unit 1 has a first heat sink 11 and a second heat sink 12, two groups of light emitting units 2 and two groups of light output units 5 are correspondingly provided. Specifically, the first heat sink 11 includes a first base 117, the second heat sink 12 includes a second base 127, and the two groups of light emitting units 2 are respectively provided on the first base 117 and the second base 127. The two groups of light output units 5 are respectively covered on the two groups of light emitting units 2.

[0269] like Figures 32 to 41 As shown, a slot 128 is provided at a position corresponding to the guide hole 115 or 125 on either the first base 117 or the second base 127. Fig.17 In the disclosure of this embodiment, the slot 128 is provided on the second heat dissipation substrate 127. When the positioning shaft is inserted into the guide holes 115, 125, an external stamping device stamps the positioning shaft through the slot 128 to fix the positioning shaft. In addition, when the slot 128 is provided, the substrate 22 is easier to process.

[0270] like Fig.33 As shown, in one embodiment, when the heat exchange unit 1 is in the unfolded state, the distance between the two groups of light-emitting units 2 (specifically referring to the substrates 22 of the two groups of light-emitting units 2) increases accordingly, so that the light output range of the LED lighting device is larger.

[0271] like Fig.33 As shown, in one embodiment, both groups of substrates 22 are provided with holes 2211. When in use, the two sides of the substrates 22 are connected through the holes 2211, which is beneficial to the convection heat dissipation of the heat exchange unit 1. The number of holes 2211 on each group of substrates 22 can be set to one or more.

[0272] like Fig.42 As shown, in one embodiment, the two groups of substrates 22 can also be configured to form an angle C with each other to adjust the light output angle of the LED lighting device. Specifically, the light output angle of the LED lighting device increases accordingly. In one embodiment, the angle C between the two groups of substrates can be between 120 degrees and 170 degrees, thereby obtaining a larger light output range. In short, the setting of the angle C formed by the two groups of substrates 22 can ensure the brightness below the LED lighting device and the overall light output angle of the LED lighting device.

[0273] like Fig.43 As shown, in one embodiment, a lens may be further provided to increase the light output angle of the LED lighting device. Specifically, a lens 201 may be further provided on the light emitter 21 to increase the light output angle of the LED lighting device. Exemplarily, the lens 201 may be provided on a single light emitter 21. It is clear that the lens 3211 may also be provided on multiple light emitters 21, that is, a single lens 201 corresponds to multiple light emitters 21 (not shown).

[0274] The light emitting module 3200 is connected to the heat exchange module 3100 to form a heat conduction path. When the LED lighting device is working, the heat generated by the light emitting module 3200 can be transferred to the heat exchange module 3100 by heat conduction and dissipated by the heat exchange module 3100.

[0275] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents possessed by such claims. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to be a waiver of the subject matter, nor should it be considered that the inventors did not consider the subject matter to be part of the disclosed inventive subject matter.

Claims

1. An LED lighting device, characterized in that: include: A heat exchange unit, the heat exchange unit comprising a base and a plurality of heat dissipation fins connected to the base, the heat dissipation fins being parallel to each other; A light-emitting unit, wherein the light-emitting unit is connected to the heat exchange unit and forms a heat conduction path, and the heat generated by the light-emitting unit is conducted from bottom to top on the heat dissipation fins; The light-emitting unit comprises a substrate and a light-emitting body, the substrate is fixed to the base, the substrate comprises a mounting surface, the light-emitting body is arranged on the mounting surface, and a convection opening is arranged on the base; A shell, the shell is connected to the heat exchange unit, and the shell includes a cavity; A power source is disposed in the cavity and electrically connected to the light emitting unit.

2. The LED lighting device according to claim 1, characterized in that: The heat dissipation fins are extended along the width direction of the LED lighting device and distributed along the length direction of the LED lighting device.

3. The LED lighting device according to claim 2, characterized in that: The invention also comprises a light output unit, wherein the light output unit is covered outside the light emitting unit, and at least a part of the light generated by the light emitting unit is emitted into the light output unit and then emitted out of the light output unit.

4. The LED lighting device according to claim 3, characterized in that: The light output unit is fixed to the heat exchange unit through a snap-fit ​​device.

5. The LED lighting device according to claim 1, characterized in that: The mounting surface is arranged in parallel along the length direction of the LED lighting device.

6. The LED lighting device according to claim 1, characterized in that: The power supply includes a power board and electronic components, and the electronic components are arranged on the power board.

7. The LED lighting device according to claim 1, characterized in that: The substrate is an aluminum substrate, the base of the heat exchange unit is aluminum, and the substrate and the heat exchange unit have the same expansion and contraction rate.

8. The LED lighting device according to claim 1, characterized in that: The light output unit is provided with an optical device, which is provided with a reflection, refraction and / or scattering function.

9. The LED lighting device according to claim 1, characterized in that: A lens is arranged on the light-emitting body, and the lens is arranged on a single light-emitting body.

10. The LED lighting device according to claim 1, characterized in that: A lens is arranged on the light-emitting body, and a single lens corresponds to a plurality of the light-emitting bodies.

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