High-reliability flip chip packaging structure and manufacturing method

Abstract

The invention relates to the technical field of flip chip packaging, and discloses a high-reliability flip chip packaging structure and a manufacturing method, the high-reliability flip chip packaging structure comprises a workbench, and the top of the workbench is fixedly provided with a control end. According to the invention, a plurality of modules are electrically connected and installed through the circuit board by the control end, then the data of temperature, current and voltage is received through the data receiving module, and then the data is analyzed through the data analysis module, so that the device is convenient to adjust, and the device is convenient to use. Then, the device can be automatically inverted and packaged conveniently through the automatic operation module, workers can remotely operate the device conveniently through the remote control module, an alarm is sent out conveniently through the alarm module when the temperature is too high, and then the device is stopped emergently through the stop module after the alarm module sends out the alarm; therefore, through the cooperative use of a plurality of modules, the intelligence of the device and the working efficiency of flip-chip packaging work are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of flip chip packaging, in particular to a high-reliability flip chip packaging structure and a manufacturing method. Background Art

[0002] A high-reliability flip-chip packaging structure is an advanced semiconductor packaging technology. It directly welds the Opside of the chip to the substrate, rather than welding the bottom of the IC to the substrate in traditional packaging. The advantage of this packaging structure is that it improves the thermal conductivity and signal integrity between the chip and the substrate, while reducing the delay of the signal during transmission. When flip-chip packaging is performed on the chip, the chip needs to be fixed, then manually flipped and flipped, and then the flipped chip is installed and packaged uniformly, thereby reducing the efficiency of chip flipping. For this purpose, a high-reliability flip-chip packaging structure and a manufacturing method are proposed. However, in the process of implementing the present invention, the inventor found that there are at least the following problems in the prior art that have not been solved: To solve: 1. After the chip is flipped and limited, the packaging work is performed manually, so that the packaging quality is inconsistent when the chip is packaged manually, thereby reducing the quality and intelligence of the device packaging work; 2. When the chip is flipped and packaged, the chip needs to be fixed, then manually flipped and flipped, and then the flipped chip is installed and packaged uniformly, thereby reducing the efficiency of the chip flipping; 3. When the chip is flipped, the chip is directly welded to the substrate, but when the chip is installed, the chip installation position may be different, which is easy to affect the quality of the chip packaging, and when the chip is packaged, the temperature may be too high to cause chip damage, thereby affecting the chip packaging work. To this end, the present invention designs a high-reliability flip chip packaging structure and manufacturing method. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings existing in the prior art, such as: after the chip is flipped and limited, the packaging work is performed manually, so that when the chip is manually packaged, the packaging quality is inconsistent, thereby reducing the quality and intelligence of the device packaging work, and when the chip is flipped and packaged, the chip needs to be fixed, and then manually flipped and flipped, and then the flipped chip is installed and uniformly packaged, thereby reducing the efficiency of the chip flipping, and when the chip is flipped, the chip is directly welded to the substrate, but when the chip is installed, it may cause the chip installation position to be different, which is easy to affect the quality of the chip packaging, and when the chip is packaged, the temperature may be too high to cause chip damage, thereby affecting the chip packaging work. To this end, the present invention designs a high-reliability flip chip packaging structure and a manufacturing method.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a high-reliability flip chip packaging structure, comprising a workbench, a control end is fixedly installed on the top of the workbench, a processing box is fixedly installed on one side of the control end, a material storage box is fixedly installed on the bottom of the workbench, a heat dissipation pipe is installed through the other side of the processing box, an electric slide rail is fixedly installed on the top of the processing box, a limited position seat is fixedly installed on the bottom of the processing box, a data receiving module is fixedly installed on one end of the control end, a data analysis module is fixedly installed on the bottom of the data receiving module, an automatic operation module is fixedly installed on the bottom of the data analysis module, a remote control module is fixedly installed on the other side of the automatic operation module, an alarm module is fixedly installed on the top of the remote control module, and a stop module is fixedly installed on the top of the alarm module;

[0005] An electric telescopic rod is fixedly installed at the bottom of the electric slide rail, a threaded rod is movably installed at the bottom of the electric telescopic rod, a storage rack is fixedly installed at the bottom of the threaded rod, rotating motors are fixedly installed on both sides of the storage rack, a card plate is fixedly installed between the rotating motors, card slots are fixedly provided at both ends of the card plate, and a first spray gun is fixedly installed at the bottom of the card plate;

[0006] An adjustment seat is fixedly installed on one side of the processing box, a displacement motor is fixedly installed on the top of the adjustment seat, a rotating rod is fixedly installed on the output end of the displacement motor, a moving sleeve is sleeved on the surface of the rotating rod, a spirit level is fixedly installed on the other side of the moving sleeve, and an infrared temperature detector is fixedly installed on the bottom of the spirit level.

[0007] Preferably, a display is fixedly mounted on the top of the control end, and a monitor is mounted on one side of the display via a wire.

[0008] Preferably, a box door is movably mounted on the surface of the processing box via a hinge, an observation panel is fixedly mounted on the surface of the box door, and a handle is fixedly mounted on the other side of the observation panel.

[0009] Preferably, a support frame is fixedly installed at the bottom of the workbench, a baffle plate is fixedly installed between the support frames, a bottom plate is fixedly installed at the bottom of the support frame, and bolts are equidistantly installed on the top of the bottom plate.

[0010] Preferably, a box cover is movably installed on the top of the storage box, a stirring motor is fixedly installed on the top of the box cover, a stirring rod is fixedly installed on the output end of the stirring motor, stirring blades are equidistantly installed on both sides of the stirring rod, and a micro pump is fixedly installed on the bottom end of the storage box.

[0011] Preferably, a fixing seat is sleeved on the surface of the heat dissipation pipe, a fixing bolt is installed through the other side of the fixing seat, an activated carbon net is movably installed between the two ends inside the heat dissipation pipe, and a radiator is fixedly installed on the other side inside the heat dissipation pipe.

[0012] Preferably, a deodorizing net is movably mounted on one side of the activated carbon net, and an adsorption net is movably mounted on one side of the deodorizing net.

[0013] Preferably, a dual-axis motor is fixedly mounted on the bottom end of the limiting seat, and a heating seat is fixedly mounted on the top of the limiting seat.

[0014] Preferably, screw rods are fixedly installed on both sides of the dual-axis motor, bearings are fixedly installed on both sides of the screw rods, a thread sleeve is sleeved on the surface of the screw rods, a clamping plate is fixedly installed on the top of the thread sleeve, and a second spray gun is fixedly installed on the opposite side of the clamping plate.

[0015] A method for manufacturing a high-reliability flip chip packaging structure comprises the following steps:

[0016] S1. Support the workbench through the support frame, then fix the support frame through the bottom plate and bolts, install the electric telescopic rod through the electric slide rail, and then movably install the electric telescopic rod through the built-in threaded sleeve and the threaded rod, then install the storage rack through the threaded rod, and then install the rotating motor through the storage rack, and then install the card plate through the rotating motor, and then set the card slot through the card plate, and then install the first spray gun through the card plate, and then clamp the chip through the card slot, and then drive the chip to flip through the rotating motor, and then flip the chip through the electric telescopic rod, install the dual-axis motor through the limit seat, and then heat the base through the heating seat, drive the screw rod to rotate through the dual-axis motor, and then drive the clamping plate to clamp the substrate through the screw sleeve, and then package the chip through the second spray gun;

[0017] S2, close the processing box through the box door, then open the box door through the handle, install the adjustment seat through the processing box, then install the displacement motor through the adjustment seat, then install the rotating rod through the displacement motor, then install the moving sleeve through the rotating rod, then install the level meter and the infrared temperature detector through the moving sleeve, then use the displacement motor and the rotating rod to drive the moving sleeve to move up and down, then use the level meter to detect whether the flip chip installation is balanced, then use the infrared temperature detector to detect whether the temperature during packaging exceeds the set standard, close the storage box through the box cover, then drive the stirring rod to rotate through the stirring motor, then drive the stirring blade to stir the packaging raw materials through the stirring rod, then use the micro pump to facilitate the transportation of the raw materials, install the heat dissipation pipeline through the fixed seat, then install the fixed seat through the fixing bolt, then use the radiator to dissipate heat in the box, then use the activated carbon net to adsorb the odor generated during the packaging process, and use the deodorizing net and the adsorption net to deodorize and purify the air in the box;

[0018] S3. Through the control end, multiple modules are electrically connected and installed through the circuit board. The working conditions inside the processing box can be viewed through the monitor and then through the display. Then, the temperature, current and voltage data are received through the data receiving module. Then, the data is analyzed through the data analysis module to facilitate the adjustment of the device. Then, the automatic operation module facilitates automatic flipping and packaging of the device. Then, the remote control module facilitates remote operation by the staff. Then, the alarm module facilitates the alarm when the temperature is too high. Then, the stop module makes the device stop urgently after the alarm module sounds the alarm.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention has a data receiving module fixedly installed at one end of the control end, so that the control end can electrically connect and install multiple modules through a circuit board, then receive the temperature, current and voltage data through the data receiving module, then analyze the data through the data analysis module to facilitate the adjustment of the device, then facilitate the automatic flipping and packaging of the device through the automatic operation module, then facilitate the remote operation of the staff through the remote control module, then facilitate the alarm when the temperature is too high through the alarm module, and then stop the device urgently after the alarm module sounds the alarm through the stop module to reduce damage to the chip, thereby improving the intelligence of the device and the work efficiency of the flip-chip packaging work through the coordinated use of multiple modules.

[0021] 2. The present invention has an electric telescopic rod fixedly installed at the bottom of the electric slide rail, so that the electric telescopic rod can be installed through the electric slide rail, and then the electric telescopic rod is movably installed through the built-in threaded sleeve and the threaded rod, and then the storage rack is installed through the threaded rod, and then the rotating motor is installed through the storage rack, and then the card plate is installed through the rotating motor, and then the card slot is set through the card plate, and then the first spray gun is installed through the card plate, and then the chip is clamped through the card slot, and then the chip is turned over by the rotating motor, and then the chip is flipped through the electric telescopic rod, so that the whole process is done by machine, thereby avoiding the problem of uneven work quality of manual chip flipping and improving the work efficiency of chip flipping.

[0022] 3. The present invention fixes an adjustment seat on one side of the processing box, so that the adjustment seat can be installed through the processing box, and then the displacement motor is installed through the adjustment seat, and then the rotating rod is installed through the displacement motor, and then the movable sleeve is installed through the rotating rod, and then the level meter and the infrared temperature detector are installed through the movable sleeve, and then the displacement motor and the rotating rod are used together to drive the movable sleeve to move up and down, and then the level meter is used to detect whether the installation of the flip chip is balanced, and then the infrared temperature detector is used to detect whether the temperature of the package exceeds the set standard, thereby improving the quality and safety of the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional diagram of the high-reliability flip-chip packaging structure proposed by the present invention;

[0024] Figure 2 A schematic diagram of the structure of the high-reliability flip-chip packaging structure proposed by the present invention;

[0025] Figure 3 A schematic diagram of the local structure of the control end of the high-reliability flip-chip packaging structure proposed by the present invention;

[0026] Figure 4 A schematic diagram of the partial structure of the electric slide rail of the high-reliability flip chip packaging structure proposed by the present invention;

[0027] Figure 5 A schematic diagram of the local structure of a processing box of a high-reliability flip-chip packaging structure proposed by the present invention;

[0028] Figure 6 A partial three-dimensional diagram of a workbench of the high-reliability flip-chip packaging structure proposed by the present invention;

[0029] Figure 7 A schematic diagram of the local structure of the limit seat of the high-reliability flip chip packaging structure proposed by the present invention;

[0030] Figure 8 A schematic diagram of the partial structure of a material storage box of a high-reliability flip chip packaging structure proposed by the present invention;

[0031] Fig. 9 This is a schematic diagram of the partial structure of the heat dissipation pipeline of the high-reliability flip-chip packaging structure proposed by the present invention.

[0032] In the figure: 1, workbench; 101, support frame; 102, baffle plate; 103, bottom plate; 104, bolt; 2, processing box; 201, box door; 202, observation board; 203, handle; 204, adjustment seat; 205, displacement motor; 206, rotating rod; 207, moving sleeve; 208, level; 209, infrared temperature detector; 3, storage box; 301, box cover; 302, stirring motor; 303, stirring rod; 304, stirring blade; 305, micro pump; 4, control end; 401, display; 402, monitor; 403, data receiving module; 404, data analysis module; 405, automatic dynamic operation module; 406, remote control module; 407, alarm module; 408, stop module; 5, heat dissipation duct; 501, fixing seat; 502, fixing bolt; 503, radiator; 504, activated carbon net; 505, deodorizing net; 506, adsorption net; 6, electric slide rail; 601, electric telescopic rod; 602, threaded rod; 603, storage rack; 604, rotating motor; 605, card plate; 606, card slot; 607, first spray gun; 7, limit seat; 701, dual-axis motor; 702, screw rod; 703, wire sleeve; 704, splint; 705, second spray gun; 706, heating seat; 707, bearing. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] like Figure 1-Figure 9As shown, the present invention provides a high-reliability flip chip packaging structure and a manufacturing method, comprising a workbench 1, a control terminal 4 is fixedly installed on the top of the workbench 1, a processing box 2 is fixedly installed on one side of the control terminal 4, a material storage box 3 is fixedly installed on the bottom of the workbench 1, a heat dissipation pipe 5 is installed through the other side of the processing box 2, an electric slide rail 6 is fixedly installed on the top of the processing box 2, a limited position seat 7 is fixedly installed on the bottom of the processing box 2, a data receiving module 403 is fixedly installed on one end of the control terminal 4, a data analysis module 404 is fixedly installed on the bottom of the data receiving module 403, an automatic operation module 405 is fixedly installed on the bottom of the data analysis module 404, a remote control module 406 is fixedly installed on the other side of the automatic operation module 405, an alarm module 407 is fixedly installed on the top of the remote control module 406, and a stop module 408 is fixedly installed on the top of the alarm module 407;

[0035] An electric telescopic rod 601 is fixedly installed at the bottom of the electric slide rail 6, a threaded rod 602 is movably installed at the bottom of the electric telescopic rod 601, a storage rack 603 is fixedly installed at the bottom of the threaded rod 602, a rotating motor 604 is fixedly installed on both sides of the storage rack 603, a card plate 605 is fixedly installed between the rotating motors 604, card slots 606 are fixedly provided at both ends of the card plate 605, and a first spray gun 607 is fixedly installed at the bottom of the card plate 605;

[0036] An adjustment seat 204 is fixedly installed on one side inside the processing box 2, a displacement motor 205 is fixedly installed on the top of the adjustment seat 204, a rotating rod 206 is fixedly installed on the output end of the displacement motor 205, a movable sleeve 207 is sleeved on the surface of the rotating rod 206, a spirit level 208 is fixedly installed on the other side of the movable sleeve 207, and an infrared temperature detector 209 is fixedly installed on the bottom of the spirit level 208.

[0037] When the device is working, the control terminal 4 is used to electrically connect and install multiple modules through the circuit board, and then the temperature, current and voltage data are received through the data receiving module 403, and then the data is analyzed through the data analysis module 404 to facilitate the adjustment of the device, and then the automatic operation module 405 facilitates the automatic flipping and packaging of the device, and then the remote control module 406 facilitates the staff to perform remote operation, and then the alarm module 407 is used to facilitate the alarm when the temperature is too high, and then the stop module 408 stops the device urgently after the alarm module 407 sounds an alarm, reducing damage to the chip, so that the intelligence of the device and the working efficiency of the flip packaging work are improved through the coordinated use of multiple modules. The data receiving module 403 is usually used to receive data sent by an external device and transmit it to the corresponding processing module The blocks are processed, the data analysis module 404 is usually used to process the data set and extract useful information from it. These modules provide various functions, such as data cleaning, conversion, visualization, and modeling. The automatic operation module 405 usually refers to a set of programs or scripts that can be automatically executed in the software or system without human intervention. Such modules are widely used in automated testing and server management scenarios. The automatic operation module 405 can help improve efficiency and reduce human errors. The data receiving module 403 is electrically connected to the data analysis module 404 through a circuit board, the data analysis module 404 is electrically connected to the automatic operation module 405 through a circuit board, the automatic operation module 405 is electrically connected to the remote control module 406 through a circuit board, the remote control module 406 is electrically connected to the alarm module 407 through a circuit board, and the alarm module 407 is electrically connected to the stop module 408 through a circuit board.

[0038] The electric telescopic rod 601 is installed through the electric slide rail 6, and then the electric telescopic rod 601 is movably installed with the threaded rod 602 through the built-in threaded sleeve, and then the storage rack 603 is installed through the threaded rod 602, and then the rotary motor 604 is installed through the storage rack 603, and then the card plate 605 is installed through the rotary motor 604, and then the card slot 606 is set through the card plate 605, and then the first spray gun 607 is installed through the card plate 605, and then the chip is clamped through the card slot 606, and then the chip is turned over by the rotary motor 604, and then the chip is flipped by the electric telescopic rod 601, so that the whole process is machine-operated, thereby avoiding the problem of different work quality of manual chip flipping, and improving the work efficiency of chip flipping;

[0039] The adjustment seat 204 is installed through the processing box 2, and then the displacement motor 205 is installed through the adjustment seat 204, and then the rotation rod 206 is installed through the displacement motor 205, and then the movable sleeve 207 is installed through the rotation rod 206, and then the level 208 and the infrared temperature detector 209 are installed through the movable sleeve 207, and then the displacement motor 205 and the rotation rod 206 are used together to drive the movable sleeve 207 to move up and down, and then the level 208 is used to detect whether the flip chip installation is balanced, and then the infrared temperature detector 209 is used to detect whether the temperature of the package exceeds the set standard, thereby improving the quality and safety of the package;

[0040] A display 401 is fixedly mounted on the top of the control terminal 4, and a monitor 402 is mounted on one side of the display 401 via a wire;

[0041] It should be noted that when the device is working, the working conditions inside the processing box 2 can be viewed through the monitor 402, and then can be viewed through the display 401;

[0042] The surface of the processing box 2 is movably provided with a box door 201 through a hinge, the surface of the box door 201 is fixedly provided with an observation panel 202, and the other side of the observation panel 202 is fixedly provided with a handle 203;

[0043] It should be noted that the processing box 2 is closed by the box door 201, and then the box situation is conveniently checked through the observation plate 202 without opening the box door 201, and then the box door 201 is conveniently opened through the handle 203;

[0044] Among them, a support frame 101 is fixedly installed at the bottom of the workbench 1, a baffle plate 102 is fixedly installed between the support frames 101, a bottom plate 103 is fixedly installed at the bottom of the support frame 101, and bolts 104 are equidistantly installed on the top of the bottom plate 103;

[0045] It should be noted that the workbench 1 is supported by the support frame 101, and then the support frame 101 is stabilized by the backing plate 102, and then the support frame 101 is fixed by the bottom plate 103 and the bolts 104;

[0046] Among them, a box cover 301 is movably installed on the top of the storage box 3, a stirring motor 302 is fixedly installed on the top of the box cover 301, a stirring rod 303 is fixedly installed on the output end of the stirring motor 302, stirring blades 304 are equidistantly installed on both sides of the stirring rod 303, and a micro pump 305 is fixedly installed at the bottom end of the storage box 3;

[0047] It should be noted that the material storage box 3 is closed by the box cover 301, and then the stirring motor 302 drives the stirring rod 303 to rotate, and then the stirring rod 303 drives the stirring blade 304 to stir the packaging raw material to prevent the packaging raw material from solidifying and being unfavorable to the packaging effect, and then the micro pump 305 is used to facilitate the transportation of the raw material;

[0048] The surface of the heat dissipation pipe 5 is sleeved with a fixing seat 501, and a fixing bolt 502 is installed through the other side of the fixing seat 501. An activated carbon net 504 is movably installed between the two ends of the heat dissipation pipe 5, and a radiator 503 is fixedly installed on the other side of the heat dissipation pipe 5.

[0049] It should be noted that the heat dissipation pipe 5 is installed through the fixing seat 501, and then the fixing seat 501 is installed through the fixing bolt 502, and then the heat inside the box is dissipated through the radiator 503, and then the odor generated during the packaging process is adsorbed through the activated carbon net 504.

[0050] A deodorizing net 505 is movably mounted on one side of the activated carbon net 504, and an adsorption net 506 is movably mounted on one side of the deodorizing net 505;

[0051] It should be noted that, by using the deodorizing net 505 and the adsorption net 506 in coordination, the air in the box is deodorized and purified.

[0052] Among them, a dual-axis motor 701 is fixedly installed at the bottom end of the limiting seat 7, and a heating seat 706 is fixedly installed at the top of the limiting seat 7.

[0053] It should be noted that the dual-axis motor 701 is installed through the limiting seat 7, and then the base is heated by the heating seat 706 to facilitate the packaging.

[0054] Among them, screw rods 702 are fixedly installed on both sides of the dual-axis motor 701, bearings 707 are fixedly installed on both sides of the screw rod 702, a thread sleeve 703 is sleeved on the surface of the screw rod 702, a clamping plate 704 is fixedly installed on the top of the thread sleeve 703, and a second spray gun 705 is fixedly installed on the opposite surface of the clamping plate 704;

[0055] It should be noted that the double-axis motor 701 drives the screw rod 702 to rotate, and then the thread sleeve 703 drives the clamping plate 704 to clamp the substrate, and then the second spray gun 705 is used to package the chip.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high reliability flip chip packaging structure, comprising a workbench (1), characterized in that: A control terminal (4) is fixedly mounted on the top of the workbench (1), a processing box (2) is fixedly mounted on one side of the control terminal (4), a material storage box (3) is fixedly mounted on the bottom of the workbench (1), a heat dissipation pipe (5) is installed through the other side of the processing box (2), an electric slide rail (6) is fixedly mounted on the top of the processing box (2), a limit seat (7) is fixedly mounted on the bottom of the processing box (2), a data receiving module (403) is fixedly mounted on one end of the control terminal (4), a data analysis module (404) is fixedly mounted on the bottom of the data receiving module (403), an automatic operation module (405) is fixedly mounted on the bottom of the data analysis module (404), a remote control module (406) is fixedly mounted on the other side of the automatic operation module (405), an alarm module (407) is fixedly mounted on the top of the remote control module (406), and a stop module (408) is fixedly mounted on the top of the alarm module (407); An electric telescopic rod (601) is fixedly installed at the bottom of the electric slide rail (6), a threaded rod (602) is movably installed at the bottom of the electric telescopic rod (601), a storage rack (603) is fixedly installed at the bottom of the threaded rod (602), rotating motors (604) are fixedly installed on both sides of the storage rack (603), a card plate (605) is fixedly installed between the rotating motors (604), card slots (606) are fixedly provided at both ends of the card plate (605), and a first spray gun (607) is fixedly installed at the bottom of the card plate (605); An adjustment seat (204) is fixedly mounted on one side of the processing box (2), a displacement motor (205) is fixedly mounted on the top of the adjustment seat (204), a rotating rod (206) is fixedly mounted on the output end of the displacement motor (205), a moving sleeve (207) is sleeved on the surface of the rotating rod (206), a level (208) is fixedly mounted on the other side of the moving sleeve (207), and an infrared temperature detector (209) is fixedly mounted on the bottom of the level (208).

2. The high reliability flip chip packaging structure according to claim 1, characterized in that: A display (401) is fixedly mounted on the top of the control terminal (4), and a monitor (402) is mounted on one side of the display (401) via a wire.

3. The high reliability flip chip packaging structure according to claim 1, characterized in that: A box door (201) is movably mounted on the surface of the processing box (2) via a hinge, an observation panel (202) is fixedly mounted on the surface of the box door (201), and a handle (203) is fixedly mounted on the other side of the observation panel (202).

4. The high reliability flip chip packaging structure according to claim 1, characterized in that: A support frame (101) is fixedly installed at the bottom of the workbench (1), a baffle plate (102) is fixedly installed between the support frames (101), a bottom plate (103) is fixedly installed at the bottom of the support frame (101), and bolts (104) are equidistantly installed on the top of the bottom plate (103).

5. The high reliability flip chip packaging structure according to claim 1, characterized in that: A box cover (301) is movably mounted on the top of the material storage box (3), a stirring motor (302) is fixedly mounted on the top of the box cover (301), a stirring rod (303) is fixedly mounted on the output end of the stirring motor (302), stirring blades (304) are equidistantly mounted on both sides of the stirring rod (303), and a micro pump (305) is fixedly mounted on the bottom end of the material storage box (3).

6. The high reliability flip chip packaging structure according to claim 1, characterized in that: A fixing seat (501) is sleeved on the surface of the heat dissipation pipe (5), a fixing bolt (502) is installed through the other side of the fixing seat (501), an activated carbon net (504) is movably installed between the two ends inside the heat dissipation pipe (5), and a radiator (503) is fixedly installed on the other side inside the heat dissipation pipe (5).

7. The high reliability flip chip packaging structure according to claim 6, characterized in that: A deodorizing net (505) is movably mounted on one side of the activated carbon net (504), and an adsorption net (506) is movably mounted on one side of the deodorizing net (505).

8. The high reliability flip chip packaging structure according to claim 1, characterized in that: A dual-axis motor (701) is fixedly mounted on the bottom end of the limiting seat (7), and a heating seat (706) is fixedly mounted on the top of the limiting seat (7).

9. The high reliability flip chip packaging structure according to claim 8, characterized in that: A screw rod (702) is fixedly mounted on both sides of the dual-axis motor (701), bearings (707) are fixedly mounted on both sides of the screw rod (702), a thread sleeve (703) is sleeved on the surface of the screw rod (702), a clamping plate (704) is fixedly mounted on the top of the thread sleeve (703), and a second spray gun (705) is fixedly mounted on the opposite surface of the clamping plate (704).

10. A method for manufacturing a high-reliability flip chip packaging structure, based on the high-reliability flip chip packaging structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, the workbench (1) is supported by a support frame (101), and then the support frame (101) is fixed by a bottom plate (103) and a bolt (104), the electric telescopic rod (601) is installed by an electric slide rail (6), and then the electric telescopic rod (601) is movably installed through a built-in threaded sleeve and a threaded rod (602), and then the storage rack (603) is installed through the threaded rod (602), and then the rotating motor (604) is installed through the storage rack (603), and then the card plate (605) is installed through the rotating motor (604), and then the card slot (605) is installed through the card plate (605). 06), then the first spray gun (607) is installed through the clamping plate (605), then the chip is clamped through the clamping slot (606), then the chip is turned over by the rotating motor (604), then the chip is flipped through the electric telescopic rod (601), the double-axis motor (701) is installed through the limit seat (7), then the substrate is auxiliary heated by the heating seat (706), the screw rod (702) is driven to rotate by the double-axis motor (701), then the clamping plate (704) is driven to clamp the substrate through the thread sleeve (703), and then the chip is packaged by the second spray gun (705); S2, the processing box (2) is closed through the box door (201), and then the box door (201) is opened through the handle (203), and the adjustment seat (204) is installed through the processing box (2), and then the displacement motor (205) is installed through the adjustment seat (204), and then the rotating rod (206) is installed through the displacement motor (205), and then the moving sleeve (207) is installed through the rotating rod (206), and then the level (208) and the infrared temperature detector (209) are installed through the moving sleeve (207), and then the displacement motor (205) and the rotating rod (206) are used together to drive the moving sleeve (207) to move up and down, and then the level (208) is used to detect whether the flip chip is installed balanced, and then the infrared temperature detector is used to detect whether the flip chip is installed balanced. (209) Detect whether the temperature during packaging exceeds the set standard, close the storage box (3) through the box cover (301), then drive the stirring rod (303) to rotate through the stirring motor (302), then drive the stirring blade (304) to stir the packaging raw materials through the stirring rod (303), then conveniently transport the raw materials through the micro pump (305), install the heat dissipation pipeline (5) through the fixing seat (501), then install the fixing seat (501) through the fixing bolt (502), then use the radiator (503) to dissipate heat in the box, then use the activated carbon net (504) to absorb the odor generated during the packaging process, and use the deodorizing net (505) and the adsorption net (506) to deodorize and purify the air in the box; S3, through the control end (4) through the circuit board to electrically connect and install multiple modules, through the monitor (402) can be used to view the working conditions inside the processing box (2), and then through the display (401) can be viewed, then through the data receiving module (403) to receive the temperature, current and voltage data, then through the data analysis module (404) to analyze the data, convenient for adjusting the device, then through the automatic operation module (405) to facilitate automatic flipping and packaging of the device, then through the remote control module (406) to facilitate remote operation by the staff, then through the alarm module (407) to facilitate the alarm when the temperature is too high, then through the stop module (408) after the alarm module (407) sounds the alarm, the device is stopped urgently.

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