RGB LED and preparation method thereof

Abstract

The invention relates to the technical field of photoelectricity, in particular to an RGB LED, a preparation method of the RGB LED and the RGB LED, the RGB LED comprises a substrate, the substrate is provided with a first chip, a second chip and a third chip which are sequentially stacked from bottom to top in the vertical direction, the center of the first chip, the center of the second chip and the center of the third chip coincide, and the first chip, the second chip and the third chip are sequentially stacked from bottom to top. Each of the first chip, the second chip and the third chip comprises one of a red light chip, a green light chip and a blue light chip. According to the RGB LED provided by the invention, the light-emitting center overlap ratio of the red light chip, the green light chip and the blue light chip can be improved.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic technology, and in particular to an RGB LED and a preparation method thereof. Background Art

[0002] Conventional RGB LED for display is composed of a bracket, red light chip, green light chip, blue light chip, wire and silicone. The red light chip, green light chip and blue light chip are distributed at the bottom of the bracket at the same time. The light-emitting centers of the three-color chips are located in different positions. When applied to the display screen, image deviation will occur and the display accuracy is low. It is not suitable for high-definition image display. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an RGB LED and a preparation method thereof, which improves the coincidence of the luminous centers of red, green and blue light chips.

[0004] In order to solve the above technical problems, the present invention provides an RGB LED, including a substrate, on which a first chip, a second chip and a third chip are stacked in sequence from bottom to top in a vertical direction, the centers of the first chip, the second chip and the third chip coincide, and the first chip, the second chip and the third chip each include one of a red light chip, a green light chip and a blue light chip.

[0005] In some embodiments, the size of the first chip is smaller than the size of the second chip and smaller than the size of the third chip.

[0006] In some embodiments, the size of the first chip is smaller than the distance between electrodes of the second chip;

[0007] The size of the second chip is smaller than the distance between electrodes of the third chip.

[0008] In some embodiments, in some embodiments, the RGB LED further comprises a first soldering column, a second soldering column, and a third soldering column;

[0009] The first welding column is arranged below the first chip, one end of the first welding column is electrically connected to the electrode of the first chip, and the other end of the first welding column is electrically connected to the substrate;

[0010] The second welding column is arranged below the second chip, one end of the second welding column is electrically connected to the electrode of the second chip, and the other end of the second welding column is electrically connected to the substrate;

[0011] The third welding column is arranged below the third chip, one end of the third welding column is electrically connected to the electrode of the third chip, and the other end of the third welding column is electrically connected to the substrate;

[0012] The height of the first welding column is less than the height of the second welding column and less than the height of the third welding column.

[0013] In some embodiments, the height of the first welding column + the height of the first chip = the height of the second welding column ± (1 mm to 10 mm);

[0014] The height of the second bonding column+the height of the second chip=the height of the third bonding column±(1 mm to 10 mm).

[0015] In some embodiments, the number of the first welding columns matches the number of electrodes of the first chip, and the first welding columns are electrically connected to the electrodes of the first chip through solder paste or silver glue;

[0016] The number of the second welding columns matches the number of electrodes of the second chip, and the second welding columns are electrically connected to the electrodes of the second chip through solder paste or silver glue;

[0017] The number of the third welding columns matches the number of electrodes of the third chip, and the third welding columns are electrically connected to the electrodes of the third chip through solder paste or silver glue.

[0018] In some embodiments, the RGB LED further includes a transparent silicone layer, and the transparent silicone layer wraps around the first chip, the second chip, the third chip, and the first welding column, the second welding column, and the third welding column.

[0019] In some embodiments, the first chip and the second chip are connected by adhesive glue;

[0020] The second chip and the third chip are connected by adhesive.

[0021] In order to solve the above problem, the present invention further provides a method for preparing an RGB LED, wherein the method for preparing an RGB LED is used to prepare the RGB LED according to any one of claims 1 to 8, and comprises the following steps:

[0022] providing a substrate;

[0023] A first chip, a second chip and a third chip are sequentially prepared on the substrate and stacked in sequence from bottom to top along the vertical direction, wherein the centers of the first chip, the second chip and the third chip coincide with each other, and the first chip, the second chip and the third chip each comprise one of a red light chip, a green light chip and a blue light chip.

[0024] In some embodiments, the step of sequentially preparing a first chip, a second chip, and a third chip stacked sequentially from bottom to top along a vertical direction on the substrate includes:

[0025] Fixing a first welding column, a second welding column and a third welding column on the substrate;

[0026] welding the first chip on the first welding column;

[0027] welding the second chip on the second welding column;

[0028] welding the third chip on the third welding column;

[0029] The height of the first welding column is less than the height of the second welding column and less than the height of the third welding column.

[0030] The implementation of the present invention has the following beneficial effects:

[0031] In the RGB LED provided by the present invention, the first chip, the second chip and the third chip are stacked in sequence from bottom to top along the vertical direction, and the centers of the first chip, the second chip and the third chip coincide, and the first chip, the second chip and the third chip all include one of a red light chip, a green light chip and a blue light chip. Among them, the light emitted from the inside of the first chip can be emitted from the top and four sides, and the light emitted from the inside of the second chip and the third chip can be emitted from the six sides of the chip. The light emission centers of the first chip, the second chip and the third chip coincide, and a straight line of alternating three colors can be accurately displayed, the display screen has a good picture effect, and the picture display accuracy is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the structure of the RGB LED provided by the present invention;

[0033] Figure 2 A schematic structural diagram of a semi-finished product obtained in step (1) of the method for preparing an RGB LED provided by the present invention;

[0034] Figure 3 A top view of the semi-finished product obtained in step (1) of the method for preparing an RGB LED provided by the present invention;

[0035] Figure 4 A schematic structural diagram of a semi-finished product obtained in step (2) of the method for preparing an RGB LED provided by the present invention;

[0036] Figure 5 A schematic structural diagram of the semi-finished product obtained in step (3) of the method for preparing an RGB LED provided by the present invention;

[0037] Figure 6 A schematic structural diagram of a semi-finished product obtained in step (4) of the method for preparing an RGB LED provided by the present invention;

[0038] Figure 7This is a schematic structural diagram of the semi-finished product obtained in step (5) of the method for preparing RGB LED provided by the present invention. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0044] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0045] In the present invention, "preferred" and "better" are only used to describe implementation methods or embodiments with better effects, and it should be understood that they do not constitute a limitation on the scope of protection of the present invention. In the present invention, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features. In the present invention, when involving numerical ranges, unless otherwise specified, the two endpoints of the numerical range are included.

[0046] To solve the above problems, the present invention provides an RGB LED, such as Figure 1 As shown, it includes a substrate 300, on which a first chip 110, a second chip 120 and a third chip 130 are stacked in sequence from bottom to top in a vertical direction, the centers of the first chip 110, the second chip 120 and the third chip 130 coincide, and the first chip 110, the second chip 120 and the third chip 130 each include one of a red light chip, a green light chip and a blue light chip.

[0047] The light emitted from the first chip 110 of the present invention can be emitted from the top and four sides, and the light emitted from the second chip 120 and the third chip 130 can be emitted from the six sides of the chip. The light-emitting centers of the first chip 110, the second chip 120 and the third chip 130 coincide, and straight lines of three alternating colors can be accurately displayed, the display screen has a good picture effect, and the picture display accuracy is improved.

[0048] Specifically, the first chip 110 includes one of a red light chip, a green light chip and a blue light chip, the second chip 120 includes one of a red light chip, a green light chip and a blue light chip, and the third chip 130 includes one of a red light chip, a green light chip and a blue light chip. The first chip 110, the second chip 120 and the third chip 130 cover three types of chips: a red light chip, a green light chip and a blue light chip.

[0049] In the prior art, the red light chip, green light chip and blue light chip are distributed on the same horizontal plane at the bottom of the bracket, resulting in the light emitting positions of the three chips not being in a straight line, which will cause image offset, low display accuracy and is not suitable for high-definition image display. The present invention stacks the red light chip, green light chip and blue light chip in the vertical direction, and the light emitting centers of the three overlap and are all located at the center of the LED, so that the light emitting centers of the red light, blue light and green light are located in the same straight line, thereby solving the above problem.

[0050] In some embodiments, the size of the first chip 110 is smaller than the size of the second chip 120 and smaller than the size of the third chip 130, so that the three chips can be stacked vertically. In some embodiments, the first chip 110, the second chip 120 and the third chip 130 are all flip chips. If the first chip 110, the second chip 120 and the third chip 130 are of the same size, it is impossible to connect to the substrate 300 while stacking them vertically. When the sizes of the three chips are set to decrease from top to bottom, space is left to connect to the substrate 300 while stacking them vertically. Preferably, the size of the first chip 110 is smaller than the distance between the electrodes of the second chip 120; the size of the second chip 120 is smaller than the distance between the electrodes of the third chip 130.

[0051] In some embodiments, the first chip 110, the second chip 120, and the third chip 130 are shaped as a direction, and each includes four electrodes, two positive electrodes and two negative electrodes; in some embodiments, the first chip 110 and the second chip 120 are connected by adhesive glue; the second chip 120 and the third chip 130 are connected by adhesive glue; the adhesive glue is a transparent thermal conductive glue, which improves the connection strength between the chips and improves the reliability of the device. In some embodiments, the first chip 110 includes a DBR reflective layer, and the second chip 120 and the third chip 130 do not include a DBR reflective layer, which can improve the reflectivity of light, thereby improving the brightness of the LED.

[0052] In some embodiments, the RGB LED further includes a first welding column 210, a second welding column 220, and a third welding column 230; the first welding column 210 is disposed below the first chip 110, one end of the first welding column 210 is electrically connected to the electrode of the first chip 110, and the other end of the first welding column 210 is electrically connected to the substrate 300; the second welding column 220 is disposed below the second chip 120, one end of the second welding column 220 is electrically connected to the electrode of the second chip 120, and the other end of the second welding column 220 is electrically connected to the substrate 300; the third welding column 230 is disposed below the third chip 1 30, one end of the third welding column 230 is electrically connected to the electrode of the third chip 130, and the other end of the third welding column 230 is electrically connected to the substrate 300; the height of the first welding column 210 is less than the height of the second welding column 220 and less than the height of the third welding column 230; preferably, the height of the first welding column 210 + the height of the first chip 110 = the height of the second welding column 220 ± (1mm to 10mm); the height of the second welding column 220 + the height of the second chip 120 = the height of the third welding column 230 ± (1mm to 10mm). In this way, the first chip 110, the second chip 120 and the third chip 130 can be closely connected in the vertical direction, which can not only save space but also make the light emission more concentrated.

[0053] In some embodiments, the number of the first welding columns 210 matches the number of electrodes of the first chip 110, and the first welding columns 210 are electrically connected to the electrodes of the first chip 110 through solder paste or silver glue; the number of the second welding columns 220 matches the number of electrodes of the second chip 120, and the second welding columns 220 are electrically connected to the electrodes of the second chip 120 through solder paste or silver glue; the number of the third welding columns 230 matches the number of electrodes of the third chip 130, and the third welding columns 230 are electrically connected to the electrodes of the third chip 130 through solder paste or silver glue. Preferably, as Figure 3 As shown, the number of the first welding column 210, the second welding column 220 and the third welding column 230 are all 4, and the four first welding columns 210, the four second welding columns 220 and the four third welding columns 230 are arranged in a square, and the position of the first welding column 210 matches the position of the electrode of the first chip 110, the position of the second welding column 220 matches the position of the electrode of the second chip 120, and the position of the third welding column 230 matches the position of the electrode of the third chip 130. The first welding column 210, the second welding column 220 and the third welding column 230 are independent of each other, and each chip can be driven independently.

[0054] In some embodiments, the RGB LED further includes a transparent silicone layer 400 , which wraps around the first chip 110 , the second chip 120 , the third chip 130 , and the first soldering column 210 , the second soldering column 220 , and the third soldering column 230 .

[0055] At the same time, the present invention also provides a method for preparing an RGB LED, comprising the following steps:

[0056] Providing a substrate 300;

[0057] A first chip 110, a second chip 120 and a third chip 130 are sequentially prepared on the substrate 300 and stacked in sequence from bottom to top in a vertical direction. The centers of the first chip 110, the second chip 120 and the third chip 130 coincide with each other. The first chip 110, the second chip 120 and the third chip 130 each include one of a red light chip, a green light chip and a blue light chip.

[0058] In some embodiments, the first chip 110, the second chip 120 and the third chip 130 are sequentially prepared on the substrate 300 and stacked from bottom to top in a vertical direction, including:

[0059] A first welding column 210, a second welding column 220 and a third welding column 230 are fixed on the substrate 300;

[0060] welding the first chip 110 on the first welding column 210;

[0061] welding the second chip 120 on the second welding column 220;

[0062] Soldering the third chip 130 on the third soldering column 230;

[0063] The height of the first welding column 210 is less than the height of the second welding column 220 and less than the height of the third welding column 230. Preferably, the height of the first welding column 210 + the height of the first chip 110 = the height of the second welding column 220 ± (1 mm to 10 mm); the height of the second welding column 220 + the height of the second chip 120 = the height of the third welding column 230 ± (1 mm to 10 mm). In this way, the first chip 110, the second chip 120 and the third chip 130 can be closely connected in the vertical direction, which can not only save space but also make the light emission more concentrated.

[0064] In some embodiments, the method for preparing the RGB LED specifically comprises the following steps:

[0065] (1) Figure 2 and Figure 3 As described above, the first welding column 210, the second welding column 220, and the third welding column 230 are fixed on the substrate 300;

[0066] (2) Figure 4 As described above, solder paste is coated on the first soldering column 210, and the first chip 110 is placed on the first soldering column 210, so that the electrode of the first chip 110 contacts the first soldering column 210, and then the solder paste is heated to melt and then solidify, so that the electrode of the first chip 110 is soldered to the first soldering column 210;

[0067] (3) Figure 5 As described, solder paste is coated on the second soldering column 220, adhesive is coated on the upper surface of the first chip 110, and the second chip 120 is placed so that the electrode of the second chip 120 contacts the first soldering column 210, and the lower surface of the second chip 120 contacts the upper surface of the first chip 110, and then the solder paste is heated to melt and then solidify, so that the electrode of the second chip 120 is welded to the second soldering column 220, and the lower surface of the second chip 120 is bonded to the upper surface of the first chip 110;

[0068] (4) Figure 6 As described, solder paste is coated on the third welding column 230, adhesive is coated on the second chip 120, and the third chip 130 is placed so that the electrode of the third chip 130 contacts the third welding column 230, and the lower surface of the third chip 130 contacts the upper surface of the second chip 120; the solder paste is then heated to melt and then solidify, so that the electrode of the third chip 130 is welded to the third welding column 230, and the lower surface of the third chip 130 is bonded to the upper surface of the second chip 120;

[0069] (5) Figure 7 The method further comprises molding a layer of transparent encapsulating adhesive on the semi-finished product obtained in step (4);

[0070] (6) Cut the semi-finished product obtained in step (5) into single LEDs to complete the LED production.

[0071] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0072] The above is a preferred embodiment of the invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the invention. These improvements and modifications are also considered to be within the scope of protection of the invention.

Claims

1. An RGB LED, characterized in that: The invention comprises a substrate, on which a first chip, a second chip and a third chip are stacked in sequence from bottom to top in a vertical direction, the centers of the first chip, the second chip and the third chip coincide, and the first chip, the second chip and the third chip each comprise one of a red light chip, a green light chip and a blue light chip.

2. The RGB LED according to claim 1, characterized in that: The size of the first chip is smaller than the size of the second chip and smaller than the size of the third chip.

3. The RGB LED according to claim 1, characterized in that The size of the first chip is smaller than the distance between the electrodes of the second chip; The size of the second chip is smaller than the distance between electrodes of the third chip.

4. The RGB LED according to claim 1, characterized in that The RGB LED further comprises a first welding column, a second welding column and a third welding column; The first welding column is arranged below the first chip, one end of the first welding column is electrically connected to the electrode of the first chip, and the other end of the first welding column is electrically connected to the substrate; The second welding column is arranged below the second chip, one end of the second welding column is electrically connected to the electrode of the second chip, and the other end of the second welding column is electrically connected to the substrate; The third welding column is arranged below the third chip, one end of the third welding column is electrically connected to the electrode of the third chip, and the other end of the third welding column is electrically connected to the substrate; The height of the first welding column is less than the height of the second welding column and less than the height of the third welding column.

5. The RGB LED according to claim 4, characterized in that: The height of the first welding column + the height of the first chip = the height of the second welding column ± (1 mm to 10 mm); The height of the second bonding column+the height of the second chip=the height of the third bonding column±(1 mm to 10 mm).

6. The RGB LED according to claim 4, characterized in that: The number of the first welding columns matches the number of electrodes of the first chip, and the first welding columns are electrically connected to the electrodes of the first chip through solder paste or silver glue; The number of the second welding columns matches the number of electrodes of the second chip, and the second welding columns are electrically connected to the electrodes of the second chip through solder paste or silver glue; The number of the third welding columns matches the number of electrodes of the third chip, and the third welding columns are electrically connected to the electrodes of the third chip through solder paste or silver glue.

7. The RGB LED according to claim 1, characterized in that: The RGB LED further includes a transparent silicone layer, which wraps around the first chip, the second chip, the third chip and the first welding column, the second welding column and the third welding column.

8. The RGB LED according to claim 1, wherein: The first chip and the second chip are connected by adhesive; The second chip and the third chip are connected by adhesive.

9. A method for preparing an RGB LED, characterized in that: The method for preparing the RGB LED is used to prepare the RGB LED according to any one of claims 1 to 8, comprising the following steps: providing a substrate; A first chip, a second chip and a third chip are sequentially prepared on the substrate and stacked in sequence from bottom to top along the vertical direction, wherein the centers of the first chip, the second chip and the third chip coincide with each other, and the first chip, the second chip and the third chip each comprise one of a red light chip, a green light chip and a blue light chip.

10. The method for preparing an RGB LED according to claim 9, wherein: The method of sequentially preparing a first chip, a second chip, and a third chip stacked sequentially from bottom to top along a vertical direction on the substrate comprises: Fixing a first welding column, a second welding column and a third welding column on the substrate; welding the first chip on the first welding column; welding the second chip on the second welding column; welding the third chip on the third welding column; The height of the first welding column is less than the height of the second welding column and less than the height of the third welding column.

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