Multifunctional MCU automatic detection system

By designing a multifunctional MCU automatic detection system, including functional environment adjustment module and computer analysis module, the problem of the existing MCU detection system lacking environmental adaptive adjustment is solved, and the comprehensive detection of MCU under different environmental conditions is realized, and the functionality and scope of application of the detection system are improved.

CN119596100APending Publication Date: 2025-03-11SHANGHAI JUNSHUO YINGDA ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411578158.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-07
Publication Date
2025-03-11

AI Technical Summary

Technical Problem

The existing MCU detection system lacks effective environmental adaptive adjustment and cannot accurately simulate extreme conditions, resulting in a reduction in the functionality and scope of application of the MCU automatic detection system.

Method used

A multifunctional MCU automatic detection system is designed, which includes an MCU system testing platform, a functional environment adjustment module and a computer analysis module. The functional environment regulation module simulates different environmental conditions through the temperature regulator, humidity regulator, vibration generator and radiation generator, and the computer analysis module detects and analyzes through the test parameter program and the test environment function verification program.

Benefits of technology

It realizes comprehensive inspection of MCU under different environmental conditions, ensures stable operation of MCU within a wide temperature range, improves the functionality and scope of application of the detection system, reduces production costs and improves manufacturing efficiency.

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Abstract

The invention belongs to the technical field of electronic engineering, and particularly relates to a multifunctional MCU automatic detection system, the detection system is used for MCU multi-item detection, the multifunctional MCU automatic detection system comprises an MCU system test platform, a functional environment adjusting module and a computer analysis module, the MCU system test platform is composed of a logic analyzer, an oscilloscope, a placement table and an adapter, and the logic analyzer is connected with the oscilloscope. The oscilloscope is electrically connected with the tested MCU through the adapter, stable connection between the MCU and the MCU system test platform is ensured, the functional environment adjusting module is composed of a temperature regulator, a humidity regulator, a vibration generator and a radiation generator, and more accurate and reliable environment simulation is achieved. The computer analysis module is composed of a test parameter program and a test environment function verification program, control steps are simplified, the automation effect of equipment is improved, the test environment function verification program is used for function detection of the tested MCU in different test environments, and high quality and reliability of products are guaranteed.
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Description

Technical Field

[0001] The invention belongs to the technical field of electronic engineering, and in particular relates to a multifunctional MCU automatic detection system. Background Art

[0002] MCU is an integrated circuit chip that includes functions such as processor core, memory, input and output interfaces and other peripheral controllers. They are widely used in various embedded systems and smart devices, such as home appliances, automotive electronics, industrial control, communication equipment, etc. The purpose of MCU testing is to ensure the performance and stability of MCU under various working conditions and meet the needs of specific applications.

[0003] MCU detection system is an automated test system used to detect and diagnose the performance and functions of microcontroller units (MCUs). MCU is the core component in embedded systems and is responsible for controlling and processing data from various peripherals and sensors. MCU detection system can perform comprehensive performance tests on MCUs to ensure their reliability and stability under different working conditions. This system usually includes several main parts: test hardware: including test boards, interface circuits, power supplies, etc., used to connect and drive the MCU to be tested; test software: used to write and execute test cases, collect and analyze test data; communication interface: used to exchange data with the MCU to be tested, such as I2C, SPI, UART, etc.; control system: used to control the test process, such as the control of environmental parameters such as temperature, voltage, and frequency.

[0004] The MCU detection system has several main functions: performance testing: evaluating the MCU's computing power, memory read and write speed, peripheral control and other functions; functional testing: checking whether the various functional modules of the MCU are working properly, such as ADC, DAC, timer, etc.; fault diagnosis: identifying potential problems and causes of failures of the MCU through test result analysis; automated testing: achieving fully automatic testing of the MCU to be tested by writing test scripts, thereby improving test efficiency and accuracy.

[0005] MCU testing is an important part of ensuring the quality and reliability of MCU products. It is crucial to ensure the functional performance, quality standards and long-term reliability of MCU products. In this process, a series of precise testing links are used to verify whether the MCU can meet the design specifications, thereby ensuring that it can run stably and reliably in applications in various embedded systems. In embedded systems, MCU assumes the core responsibility of controlling and managing other hardware components. It needs to process various sensor data, perform complex logical operations, control peripherals, and communicate with external devices. Therefore, a tiny defect or error may cause the performance of the entire system to deteriorate or even cause catastrophic failure.

[0006] With the increasing reliability requirements for embedded systems in the fields of Internet of Things, automotive electronics, industrial automation, etc., MCU detection is particularly important. However, the existing MCU detection system lacks effective environmental adaptability adjustment for MCU detection. As the scope of MCU use becomes more and more extensive, it may not work properly under extremely high or low temperature conditions. The MCU chip needs to be able to operate stably in a wide temperature range. In a high humidity environment, the MCU may fail or its performance may degrade. If the environmental adaptability is insufficient, it means that the test conditions may be different from the actual use environment. The test system cannot accurately simulate these conditions, and it is impossible to discover the performance problems of the MCU in a specific environment, resulting in reduced functionality of the MCU automatic detection system and a reduction in the scope of application of the system. Summary of the invention

[0007] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a multifunctional MCU automatic detection system, aiming to solve the technical problems in the prior art that the MCU detection system lacks effective environmental adaptability adjustment, is not conducive to the promotion of the use scope of the MCU, the test system is difficult to accurately simulate extreme conditions, and the actual use environment testing of the MCU is insufficient, and the functionality and applicability of the MCU automatic detection system are reduced.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a multifunctional MCU automatic detection system, which is used for multiple MCU detections, and the multifunctional MCU automatic detection system includes an MCU system test platform, a functional environment adjustment module and a computer analysis module, the MCU system test platform is composed of a logic analyzer, an oscilloscope, a placement table and an adapter, and the MCU system test platform fixes the MCU under test through the placement table, the oscilloscope is electrically connected to the MCU under test through the adapter, and the oscilloscope is electrically connected to the logic analyzer, the functional environment adjustment module is composed of a temperature regulator, a humidity regulator, a vibration generator and a radiation generator, and the functional environment adjustment The module is fixed in the working area of ​​the MCU system test platform. The computer analysis module consists of a test parameter program and a test environment function verification program. The computer analysis module sets the test objectives and steps through the test parameter program. The test environment function verification program is used for function detection of the tested MCU under different test environments. By utilizing the modular design of the multifunctional MCU automatic detection system, the system can flexibly adapt to the specific needs of different workshops or manufacturers, realize sub-type manufacturing and technical integration, and the modular configuration allows rapid assembly according to the actual test requirements of the MCU when needed, making the MCU multifunctional detection convenient, while effectively reducing production costs and improving manufacturing efficiency. rate. When testing the MCU, the operator first needs to place the MCU on a dedicated placement table and fix it to ensure its stability during the test. The regulated power supply is then activated to supply the power required by the MCU to ensure its normal operation. The use of the adapter ensures a stable connection between the MCU and the MCU system test platform. The operator needs to set specific test parameters in the test software, including test targets and steps. The functional environment adjustment module is used to simulate various conditions that the MCU may encounter in the actual use environment, such as temperature, humidity, vibration and radiation. During the test, the equipment will collect the performance of the MCU in different environments in real time. The oscilloscope is used to display the electrical performance data of the MCU and provide intuitive waveform analysis, while the logic analyzer is used to analyze the logical state and behavior of the MCU and determine whether the data of the MCU in the test environment is accurate. The data provided by these instruments provide operators with in-depth insights to help them detect the performance of the MCU under various conditions. Finally, the test environment functional verification program will summarize all analysis results and conduct a comprehensive evaluation of the overall performance of the MCU. By conducting such comprehensive and accurate detection of the MCU, it is ensured that the MCU meets the predetermined performance standards, thereby ensuring the high quality and reliability of the product, greatly increasing the functionality of the multi-functional MCU automatic detection system, and improving the scope of application of the system.

[0009] Furthermore, a communication interface is provided on the inner wall of the placement table of the MCU system test platform. The communication interface is provided with I2C, SPI and UART models. The communication interface contacts and is electrically connected to the MCU, and the communication interface is electrically connected to the adapter. In the preliminary stage of the test process, professional testers will carefully place the microcontroller unit (MCU) on a specially designed test bench or positioning frame. This operation needs to ensure that the position and direction of the MCU are correct so that the subsequent test process can proceed smoothly. The staff will select a suitable communication interface module to establish a connection with the MCU according to the specific model and specifications of the MCU to be tested. Once the suitable interface is selected, the staff will activate the communication link of the MCU through corresponding wiring and configuration work. The setting of different types of communication interfaces is to ensure the accuracy and stability of data transmission. By providing multiple communication interfaces, the test platform can test multiple types of MCUs simultaneously or sequentially, which can greatly improve the test efficiency, shorten the time to market, adapt the test platform to the test needs of various MCUs, and improve the applicability and functionality of the test platform. In the case of high-demand testing, where high data transmission stability is required, choosing the right communication interface can improve the accuracy of the test. When problems arise, multiple communication interfaces can provide more diagnostic paths to help engineers locate the problem more quickly and speed up the troubleshooting process. Finally, a test platform with multiple types of communication interfaces can be more easily upgraded to support new MCU models, maintaining good foresight and compatibility.

[0010] Furthermore, a detachably connected isolation cover is provided above the working area of ​​the MCU system test platform, and the inner wall of the isolation cover is coated with water-based paint, the water-based paint is added with spherical hollow ceramic microbeads, and the spherical hollow ceramic microbeads are made of aluminum silicate material, and the inner wall of the spherical hollow ceramic microbeads is filled with air. When performing temperature simulation, the tester must ensure that the ambient temperature around the MCU under test is stable, so as to accurately control and simulate the temperature conditions that the MCU may encounter in actual operation. In order to prevent the laboratory ambient temperature fluctuation from interfering with the test results, a series of heat insulation measures will be taken. The tester applies a layer of specially prepared water-based paint on the inner wall of the test isolation cover. This water-based paint adds a heat insulation coating of spherical hollow ceramic microbeads. Hollow ceramic microbeads are tiny ceramic spheres with cavities inside. This structure gives them excellent thermal insulation properties. When these microbeads are evenly dispersed in water-based paint and applied to form a film, they can effectively reduce the conduction of heat through the coating, thereby playing a role in thermal insulation. Even when the external ambient temperature changes, it can ensure that the temperature of the environment where the MCU under test is located remains stable, so as to achieve more accurate and reliable temperature simulation. In addition, the use of this thermal insulation coating can also help reduce the energy consumption of the environmental control system, because better insulation means that energy input can be reduced while maintaining the same temperature difference. It also helps to shorten the temperature adjustment time of the test environment and improve the efficiency of the entire test process.

[0011] Furthermore, the particle size of the spherical hollow ceramic microbeads is 6-10um. The smaller particle size helps to reduce the total weight of the final material, which is very beneficial for the application of lightweight equipment. The use of such microbeads can reduce the use of other materials, thereby helping to reduce environmental impact. The fine particle size enables the hollow ceramic microbeads to be evenly dispersed in the coating or composite material, thereby effectively reducing the thermal conductivity of the material. This means that the speed of heat transfer through the material is slowed down, improving the thermal insulation effect. The temperature resistance of hollow ceramic microbeads of this particle size can reach 1700℃, which is suitable for thermal insulation protection in high temperature environments. In addition to thermal insulation performance, this microbead also has good sound insulation effect, which can absorb and reduce noise transmission.

[0012] Furthermore, the isolation cover is made of radiation-proof lead steel material. When the radiation generator starts to release radiation to the MCU under test, the radiation-proof lead steel isolation cover prevents the radiation from affecting the staff through its efficient blocking ability. Lead steel contains a high proportion of lead, and lead is one of the non-radioactive elements with the largest atomic weight and has a very high density. When radiation, especially gamma rays, comes into contact with lead, the high density of lead enables it to effectively block these radiations and reduce their ability to penetrate materials. Although the protective effect of lead is very good, the price of lead is actually not expensive, making it the preferred material for many radiation protection applications. When considering the trade-offs between application scenarios, radiation blocking capabilities and material costs, lead is often regarded as an economical and affordable choice, preferably improving equipment safety while reducing production costs.

[0013] Furthermore, the accuracy requirement of the temperature regulator is ±1.5°C, and the adjustment test temperature range is -40°C to 150°C, covering the temperature application range of most MCUs and improving the functionality of the device.

[0014] Furthermore, the resolution of the humidity regulator is at least 8 bits, and the adjustment test humidity range is 20% to 90% RH, covering the humidity application range of most MCUs, thereby improving the functionality of the device.

[0015] Furthermore, the adjustment test vibration range of the vibration generator is 5 Hz to 6500 Hz, covering the vibration application range of most MCUs, thereby improving the functionality of the device.

[0016] Furthermore, the radiation generator has an adjustable test radiation range of 9kHz to 18GHz, covering the radiation application range of most MCUs and improving the functionality of the device.

[0017] Furthermore, the test parameter program is set by the user for the test target, and the test environment function verification program is electrically connected to the MCU system test platform and the functional environment adjustment module. After the user sets the test target, the test parameter program sets parameters and test processes through the test target, simplifies the control steps, and improves the equipment automation effect. The test environment function verification program integrates the results of the MCU system test platform and the functional environment adjustment module, and feeds back the status and detection status of the MCU under test to the staff.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. In the prior art, with the increasing requirements for the reliability of embedded systems in the fields of Internet of Things, automotive electronics, industrial automation, etc., MCU detection is particularly important. However, the existing MCU detection system lacks effective environmental adaptability adjustment for MCU detection. As the scope of MCU use becomes wider and wider, it may not work properly under extremely high or low temperature conditions. The MCU chip needs to be able to operate stably in a wide temperature range. In a high humidity environment, the MCU may fail or its performance may degrade. If the environmental adaptability is insufficient, it means that the test conditions may be different from the actual use environment. The test system cannot accurately simulate these conditions, and it is impossible to find the performance problems of the MCU in a specific environment, resulting in reduced functionality of the MCU automatic detection system and reduced scope of application of the system. In the present invention, through the modular design of the multifunctional MCU automatic detection system, the system flexibly adapts to the specific needs of different workshops or manufacturers, realizes sub-type manufacturing and technical integration, and the modular configuration allows rapid assembly according to the actual test requirements of the MCU when needed, making the MCU multifunctional detection convenient, while effectively reducing production costs and improving manufacturing efficiency. When performing MCU testing, the operator first needs to place the MCU on a dedicated placement table The adapter ensures a stable connection between the MCU and the MCU system test platform. The operator needs to set specific test parameters in the test software, including test objectives and steps. The functional environment adjustment module is used to simulate various conditions that the MCU may encounter in the actual use environment, such as temperature, humidity, vibration and radiation. During the test, the equipment will collect the performance of the MCU in different environments in real time. The oscilloscope is used to display the electrical performance data of the MCU and provide intuitive waveform analysis, while the logic analyzer is used to analyze the logical state and behavior of the MCU and determine whether the data of the MCU in the test environment is accurate. The data provided by these instruments provide operators with in-depth insights to help them detect the performance of the MCU under various conditions. Finally, the test environment functional verification program will summarize all analysis results and conduct a comprehensive evaluation of the overall performance of the MCU. By conducting such comprehensive and accurate detection of the MCU, it is ensured that the MCU meets the predetermined performance standards, thereby ensuring the high quality and reliability of the product, greatly increasing the functionality of the multi-functional MCU automatic detection system, and improving the scope of application of the system.

[0020] 2. The existing MCU system test platform has a single communication interface model, while the new MCU supports multiple communication protocols. A single communication interface model cannot meet the test requirements of these different protocols at the same time, resulting in the test platform being unable to communicate effectively with the new MCU and, in turn, unable to perform comprehensive functional verification. As the market demand for new MCUs continues to grow, MCU technology is also evolving rapidly. A test platform with a single interface model is difficult to support new test standards or protocols through simple upgrades, which may require large-scale hardware replacement, increasing maintenance costs and time delays. As MCU design develops toward higher data processing speeds and more complex integrated functions, the demand for high-speed, high-stability communication interfaces increases. If the communication interface of the test platform cannot match the performance indicators of the MCU, then the actual working performance of the MCU cannot be accurately evaluated, thus affecting the reliability of the overall test results. To address this problem, the present invention adopts the setting of multiple communication interfaces. In the initial stage of the test process, professional testers will carefully place the microcontroller unit (MCU) on a specially designed test bench or positioning frame. This operation needs to ensure that the position and direction of the MCU are correct so that the subsequent test process can proceed smoothly. The staff will select the appropriate communication interface module to establish a connection with the MCU based on the specific model and specifications of the MCU to be tested. Once the appropriate interface is selected, the staff will activate the communication link of the MCU through the corresponding wiring and configuration work. Through a variety of different The same model of communication interface is set to ensure the accuracy and stability of data transmission. By providing multiple communication interfaces, the test platform can test multiple models of MCU simultaneously or sequentially, which can greatly improve the test efficiency, shorten the time to market, and adapt the test platform to the test needs of various MCUs. It improves the applicability and functionality of the test platform. In the case of high-demand testing, where high data transmission stability is required, choosing the right communication interface can improve the accuracy of the test. When problems arise, multiple communication interfaces can provide more diagnostic paths to help engineers locate the problem more quickly and speed up the troubleshooting process. Finally, a test platform with multiple communication interfaces can be more easily upgraded to support new MCU models, maintaining good foresight and compatibility.

[0021] 3. In the present invention, when performing temperature simulation, the tester must ensure that the ambient temperature around the MCU under test is stable, so as to accurately control and simulate the temperature conditions that the MCU may encounter in actual operation. In order to prevent the laboratory environment temperature fluctuation from interfering with the test results, a series of thermal insulation measures will be taken. The tester applies a layer of specially prepared water-based paint on the inner wall of the test isolation cover. This water-based paint adds a thermal insulation coating of spherical hollow ceramic microbeads. The spherical hollow ceramic microbeads are tiny ceramic spheres with cavities inside. This structure gives it excellent thermal insulation properties. When these microbeads are evenly dispersed in the water-based paint and applied to form a film, they can effectively reduce the conduction of heat through the coating film, thereby playing a role in thermal insulation. Even when the external ambient temperature changes, it can ensure that the temperature of the environment where the MCU under test is located remains stable, so as to achieve more accurate and reliable temperature simulation. In addition, the use of this thermal insulation coating also helps to reduce the energy consumption of the environmental control system, because better thermal insulation means that energy input can be reduced while maintaining the same temperature difference. It also helps to shorten the temperature adjustment time of the test environment and improve the efficiency of the entire test process.

[0022] 4. In the present invention, the smaller particle size helps to reduce the total weight of the final material, which is very beneficial for the application of lightweight equipment. The use of such microbeads can reduce the use of other materials, thereby helping to reduce environmental impact. The fine particle size enables the hollow ceramic microbeads to be evenly dispersed in the coating or composite material, thereby effectively reducing the thermal conductivity of the material. This means that the speed of heat transfer through the material is slowed down, improving the thermal insulation effect. The temperature resistance of hollow ceramic microbeads of this particle size can reach 1700°C, which is suitable for thermal insulation protection in high temperature environments. In addition to thermal insulation performance, this microbead also has good sound insulation effect, which can absorb and reduce noise transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 It is a schematic diagram of the multifunctional MCU automatic detection system of the present invention. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] Embodiment 1:

[0027] See also Figure 1 , this embodiment provides the following technical solutions: a multifunctional MCU automatic detection system, which is used for multiple MCU detections. The detection system includes an MCU system test platform, a functional environment adjustment module and a computer analysis module. The MCU system test platform consists of a logic analyzer, an oscilloscope, a placement table and an adapter, and the MCU system test platform fixes the MCU under test through the placement table, the oscilloscope is electrically connected to the MCU under test through the adapter, and the oscilloscope is electrically connected to the logic analyzer, the functional environment adjustment module consists of a temperature regulator, a humidity regulator, a vibration generator and a radiation generator, and the functional environment adjustment module is fixed in the working area of ​​the MCU system test platform, the computer analysis module consists of a test parameter program and a test environment function verification program, the computer analysis module sets the test target and steps through the test parameter program, and the test environment function verification program is used for the function detection of the MCU under test under different test environments. When performing MCU testing, the operator first needs to place the MCU on a dedicated placement table And fix it to ensure its stability during the test. The voltage-regulated power supply is then activated to supply the power required by the MCU to ensure its normal operation. The use of the adapter ensures a stable connection between the MCU and the MCU system test platform. The operator needs to set specific test parameters in the test software, including test objectives and steps. The functional environment adjustment module is used to simulate various conditions that the MCU may encounter in the actual use environment, such as temperature, humidity, vibration and radiation. During the test, the equipment will collect the performance of the MCU in different environments in real time. The oscilloscope is used to display the electrical performance data of the MCU and provide intuitive waveform analysis, while the logic analyzer is used to analyze the logical state and behavior of the MCU and determine whether the data of the MCU under the test environment is accurate. The data provided by these instruments provide operators with in-depth insights to help them detect the performance of the MCU under various conditions. Finally, the test environment functional verification program will summarize all analysis results and conduct a comprehensive evaluation of the overall performance of the MCU.

[0028] Embodiment 2:

[0029] In the initial stage of the test process, professional testers will carefully place the microcontroller unit (MCU) on a specially designed test bench or positioning frame. This operation needs to ensure that the position and orientation of the MCU are correct so that the subsequent test process can proceed smoothly. The staff will select the appropriate communication interface module to establish a connection with the MCU based on the specific model and specifications of the MCU to be tested. Once the appropriate interface is selected, the staff will activate the communication link of the MCU through the corresponding wiring and configuration work, and ensure the accuracy and stability of data transmission through the setting of multiple different types of communication interfaces. In the case of high-demand testing, where high data transmission stability is required, selecting the appropriate communication interface can improve the accuracy of the test. When problems occur, multiple communication interfaces can provide more diagnostic paths to help engineers locate the problem more quickly.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Multifunctional MCU automatic detection system, which is used for multiple MCU detections, and features: The multifunctional MCU automatic detection system includes an MCU system test platform, a functional environment adjustment module and a computer analysis module. The MCU system test platform is composed of a logic analyzer, an oscilloscope, a placement table and an adapter, and the MCU system test platform fixes the MCU under test through the placement table. The oscilloscope is electrically connected to the MCU under test through the adapter, and the oscilloscope is electrically connected to the logic analyzer. The functional environment adjustment module is composed of a temperature regulator, a humidity regulator, a vibration generator and a radiation generator, and the functional environment adjustment module is fixed in the working area of ​​the MCU system test platform. The computer analysis module is composed of a test parameter program and a test environment function verification program. The computer analysis module sets test targets and steps through the test parameter program, and the test environment function verification program is used for functional detection of the MCU under test under different test environments.

2. The multifunctional MCU automatic detection system according to claim 1, characterized in that: A communication interface is provided on the inner wall of the placement table of the MCU system test platform. The communication interface has I2C, SPI and UART models. The communication interface contacts and is electrically connected to the MCU, and the communication interface is electrically connected to the adapter.

3. The multifunctional MCU automatic detection system according to claim 1, characterized in that: A detachably connected isolation cover is provided above the working area of ​​the MCU system test platform, and the inner wall of the isolation cover is coated with water-based paint, the water-based paint is added with spherical hollow ceramic microbeads, and the spherical hollow ceramic microbeads are made of aluminum silicate material, and the inner wall of the spherical hollow ceramic microbeads is filled with air.

4. The multifunctional MCU automatic detection system according to claim 3 is characterized in that: The particle size of the spherical hollow ceramic microbeads is 6-10 um.

5. The multifunctional MCU automatic detection system according to claim 3 is characterized in that: The isolation cover is made of radiation-proof lead steel material.

6. The multifunctional MCU automatic detection system according to claim 1, characterized in that: The temperature regulator has an accuracy requirement of ±1.5°C and an adjustable test temperature range of -40°C to 150°C.

7. The multifunctional MCU automatic detection system according to claim 1, characterized in that: The humidity regulator has a resolution of at least 8 bits and adjusts the test humidity range to be 20% to 90% RH.

8. The multifunctional MCU automatic detection system according to claim 1, characterized in that: The vibration generator has an adjustment test vibration range of 5 Hz to 6500 Hz.

9. The multifunctional MCU automatic detection system according to claim 1, characterized in that: The radiation generator has an adjusted test radiation range of 9 kHz to 18 GHz.

10. The multifunctional MCU automatic detection system according to claim 1, characterized in that: The test parameter program is set by the user to set the test target, and the test environment function verification program is electrically connected to the MCU system test platform and the functional environment adjustment module.