Laser cutting method for large-scale polycrystalline diamond

By selecting laser light sources with smaller wavelengths and a scientifically designed cutting process, combined with the use of UV solidified glue, the problems of insufficient flatness, large cutting losses and serious degumming during laser cutting are solved, and high efficiency and low loss cutting effect are achieved, reducing production costs.

CN119635004APending Publication Date: 2025-03-18ZHENGZHOU ZHONGNAN JETE SUPERABRASIVES
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Patent Information

Application Number
CN202411171654.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-26
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

During the laser cutting process, large-scale polycrystalline diamond blocks have problems such as insufficient flatness, difficulty in controlling cutting losses, and serious degumming and blocking, resulting in long post-polishing time, large material waste and high processing costs.

Method used

Using a laser light source with a smaller wavelength, a scientifically designed cutting process, including first-cut sweeping and sample rotation cutting, monitor and control the cutting loss to about 0.10 mm, and the sample surface is coated with UV solidification glue before cutting, ensuring that the laser frequency is within the range of 6-8 Hz.

Benefits of technology

It significantly improves cutting quality, reduces cutting losses, material collapse and degumming, reduces post-polishing time and material waste, reduces processing costs, and improves the cutting efficiency of polycrystalline diamond.

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Abstract

The invention discloses a laser cutting method for large-scale polycrystalline diamond, which relates to the technical field of superhard material processing, and comprises the following steps: S1, light source selection: selecting a laser light source with smaller wavelength; s2, a cutting method: first-knife flattening: carrying out first-time cutting on the end surface of the sample by using a laser cutting machine; rotating and cutting the sample, namely rotating the sample by 180 degrees through the rotating function of the laser cutting machine after the sample is swung to be flat, and then cutting for the second time and normally cutting to obtain a high-flatness slice; s3, cutting loss control is conducted, specifically, gap loss is monitored in the cutting process and controlled to be about 0.10 mm; and S4, degumming and block collapse control: before cutting, coating glue on the surface of the sample, irradiating under ultraviolet light, and after cutting is finished, immersing the sample into hot water for degumming. According to the laser cutting method for the large-scale polycrystalline diamond, the cutting quality can be remarkably improved by reasonably selecting a light source, scientifically designing a cutting process and adopting efficient auxiliary materials.
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