Bionic adhesion and sensing integrated structure facing rough surface and manufacturing method

Abstract

The invention discloses a rough surface-oriented bionic adhesion / sensing integrated structure and a manufacturing method thereof. The rough surface-oriented bionic adhesion / sensing integrated structure comprises a bottom-layer bionic mushroom-shaped array structure and a top-layer inclined supporting micro-column array structure which are bonded through a flexible connecting layer, the top layer inclined supporting micro-column array structure and the bottom layer bionic mushroom-shaped array structure are attached to the upper layer flexible regionalization electrode and the lower layer flexible regionalization electrode respectively, and the top layer inclined supporting micro-column array structure, the upper layer flexible regionalization electrode and the lower layer flexible regionalization electrode form the flexible capacitive pressure sensor. The method comprises the following steps: firstly, manufacturing a top-layer inclined support micro-column array structure and a bottom-layer bionic mushroom-shaped array structure, then manufacturing flexible regionalized electrodes, and respectively attaching the flexible regionalized electrodes to the bottom-layer bionic mushroom-shaped array structure and the top-layer inclined support micro-column array structure; and finally, bonding the bottom bionic mushroom-shaped array structure and the top inclined supporting micro-column array structure through a flexible connecting layer. The method adapts to rough surfaces, realizes stable adhesion, monitors the contact state of the interface in real time and senses the morphology of the contact interface.

Description

Technical Field

[0001] The invention belongs to the technical field of bionic adhesion in micro-nano manufacturing technology, and specifically relates to a bionic adhesion and sensing integrated structure facing a rough surface and a manufacturing method. Background Art

[0002] In nature, geckos can crawl freely in complex environments due to their unique foot adhesion properties, which far exceeds traditional pressure-sensitive adhesives, inspiring the development of bionic adhesive structures. Bionic adhesive structures have the characteristics of strong adhesion, good stability, strong adaptability to materials and morphology, and will not cause damage or pollution to the surface of the contacted object. Compared with the application of traditional adhesion technology, they have significant advantages and have become an important support for the development of bionic wall-climbing robots, non-destructive precision transportation in space environments / ultra-clean environments, and biomedical diagnosis.

[0003] However, bionic adhesion structures still face multiple challenges in practical engineering applications. First, traditional bionic adhesion structures perform well on smooth surfaces, but on rough surfaces, the adhesion strength drops sharply due to the reduced contact area, which limits the application of adhesion structures in actual engineering environments. Secondly, the control of pre-pressure is crucial to the performance of the adhesion structure. Too low or too high pre-pressure will affect the adhesion effect. In order to control the pre-pressure, the adhesion structure needs to have the function of detecting external pressure. Third, during the bonding process, the adhesion structure needs to fit closely to the contact surface to maintain a good adhesion effect, so real-time adhesion state detection is very important to ensure good adhesion performance. Finally, the adhesion structure with surface morphology sensing function can replace interface morphology monitoring equipment such as cameras and probes in engineering applications, so as to flexibly adapt to engineering needs of various scales and fields.

[0004] However, the various adhesion structures proposed so far (Lee HJ, Baik S, Hwang GW, et al. An Electronically Perceptive Bioinspired Soft Wet-Adhesion Actuator with Carbon Nanotube-Based Strain Sensors [J]. ACS Nano, 2021, 15 (9): 14137-14148; Barnefske L, Rundel F, Moh K, et al. Tuning the Release Force of Microfibrillar Adhesives by Geometric Design [J]. Advanced Materials Interfaces, 2022, 9 (33): 8.) mostly increase the contact area without evaluating the adhesion state, thereby obtaining good adhesion performance on rough surfaces. If smart adhesion methods can be introduced on rough surfaces, it will be beneficial to promote the development of bionic adhesion structures.However, the existing adhesive structures with sensing functions (Ghosh A, Yoon C, Ongaro F, et al. Stimuli-Responsive Soft Untethered Grippers for Drug Delivery and Robotic Surgery [J]. Frontiers in Mechanical Engineering, 2017, 3; Zhou JS, Chen S, Wang ZA Soft-Robotic Gripper With Enhanced Object Adaptation and Grasping Reliability [J]. Ieee Robotics and Automation Letters, 2017, 2 (4): 2287-2293.) usually use the adhesion function to support the sensing function, that is, sensors with adhesion function; for a few other structures, even the sensing function supports the adhesion function (Frey ST, Haque A, Tutika R, et al. Octopus-inspired adhesive skins for intelligent and rapidly switchable underwater adhesion [J]. Science Advances, 2022, 8 (28): 9; Liu HR, Tian HM, Wang DR, et al. Electrically active smart adhesive for a perching-and-takeoff robot [J]. Science Advances, 2023, 9 (43): 13.), it is also difficult to achieve contact interface morphology perception, and it does not focus on improving the adhesion performance of rough surfaces. Therefore, if an integrated adhesion / sensing bonding method can be introduced in bonding applications for rough surfaces, it will be beneficial to promote the development of bionic adhesion structures. Summary of the invention

[0005] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a bionic adhesion and sensing integrated structure and manufacturing method for rough surfaces, which adopts a layered bionic design, not only enhancing the adhesion ability of the rough surface, but also integrating a flexible capacitive sensor to realize real-time monitoring of the interface contact state and contact interface morphology perception function.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A bionic adhesion and sensing integrated structure for rough surfaces, comprising a bottom bionic mushroom-shaped array structure 4, which is bonded to a top inclined support micro-column array structure 2 via a flexible connection layer 3; an upper flexible regionalized electrode 1-1 is bonded to the top inclined support micro-column array structure 2, and a lower flexible regionalized electrode 1-2 is bonded to the bottom bionic mushroom-shaped array structure 4; the top inclined support micro-column array structure 2 and two opposite upper flexible regionalized electrodes 1-1 and lower flexible regionalized electrodes 1-2 form a flexible capacitive pressure sensor for collecting interface contact signals.

[0008] The bottom bionic mushroom-shaped array structure 4, the flexible connection layer 3, and the top inclined support micro-column array structure 2 are made of elastomeric polymers such as silicone, polydimethylsiloxane or polyurethane; the upper flexible regionalized electrode 1-1 and the lower flexible regionalized electrode 1-2 are multi-layer composite structures, which are insulating materials of SiO2, insulating films of polyimide film or polyester film composited with Cr and Au conductive metals.

[0009] A method for manufacturing a biomimetic adhesion / sensing integrated structure facing a rough surface comprises the following steps:

[0010] The first step is to prepare the top-layer inclined support micro-pillar array structure 2: a first photoresist 7 with a thickness of micrometer level is spin-coated on the surface of the first substrate 8, and the first UV light 9 is transmitted through the first mask 6 at a certain angle to realize the top photolithography of the first photoresist 7; the first photoresist 7 of the exposed part is removed by the development technology, and the inverse structure of the top-layer inclined support micro-pillar array structure 2 is realized on the first photoresist 7; the first polymer elastomer is injection-molded to the inverse structure of the top-layer inclined support micro-pillar array structure 2, and then the top-layer inclined support micro-pillar array structure 2 is manufactured by the spin coating process;

[0011] The second step is to prepare the bottom bionic mushroom-shaped array structure 4: a second photoresist 10 with a thickness of micrometer level is spin-coated on the surface of the second substrate 13, and a top second UV light 12-1 is used to transmit through the second mask 11 to realize top photolithography of the second photoresist 10 by double-sided exposure technology, and a bottom third UV light 12-2 is directly irradiated on the second substrate 13 to realize bottom photolithography of the second photoresist 10; the second photoresist 10 of the exposed part is removed by developing technology, and the inverse structure of the bottom bionic mushroom-shaped array structure 4 is realized on the second photoresist 10; the bottom bionic mushroom-shaped array structure 4 is manufactured by injection molding the second polymer elastomer to the inverse structure of the bottom bionic mushroom-shaped array structure 4, and then by spin coating process;

[0012] The third step is to prepare the flexible regionalized electrode 1: sputter or evaporate a metal and an insulating material with a thickness of nanometer level on one side of the insulating film, and also sputter or evaporate a layer of insulating material with a thickness of nanometer level on the other side of the insulating film, and then use laser cutting to divide the area to realize the preparation of the flexible regionalized electrode 1;

[0013] The fourth step is to bond the flexible regionalized electrode 1 to the top-layer inclined support micro-pillar array structure 2 and the bottom-layer bionic mushroom-shaped array structure 4: a layer of a third polymer elastomer with a thickness of micrometer level is prepared on the upper surface of the top-layer inclined support micro-pillar array structure 2 by a spin coating process, and both sides of the prepared flexible regionalized electrode 1 are treated with oxygen plasma, and then pressed on the upper surface of the top-layer inclined support micro-pillar array structure 2 in a gradually bonding manner to form an upper-layer flexible regionalized electrode 1-1; after waiting for the third polymer elastomer to solidify, a spin coating process is used on the bottom-layer bionic mushroom-shaped array structure 4. A layer of fourth polymer elastomer with a thickness of micrometer level is prepared on the upper surface of the bionic mushroom-shaped array structure 4 as a flexible connecting layer 3, and after both sides of the flexible regionalized electrode 1 are treated with oxygen plasma, it is pressed on the uncured fourth polymer elastomer in a gradually fitting manner to form a lower flexible regionalized electrode 1-2; before curing, the top layer of inclined supporting microcolumn array structure 2 is lightly placed on the surface of the uncured fourth polymer elastomer, and then pressure is evenly applied to the top layer of inclined supporting microcolumn array structure 2 to ensure that it can contact and bond successfully with the bottom bionic mushroom-shaped array structure 4 after curing.

[0014] In the first step, the first substrate 8 is a rigid substrate of a glass slide or a Si wafer, the first photoresist 7 is a photoresist negative of SU-82050 or SU-8 series, the certain angle is 0° to 90°, and the first polymer elastomer is an elastomeric polymer of silicone, polydimethylsiloxane or polyurethane.

[0015] In the second step, the second substrate 13 is a rigid substrate of a glass slide or a Si wafer, the second photoresist 10 is a photoresist of AZ 4620 or AZ series or EPG series, and the second polymer elastomer is an elastomer polymer of silica gel, polydimethylsiloxane or polyurethane;

[0016] In the third step, the insulating film is an insulating film of a polyimide film or a polyester film, the metal is a conductive metal of Cr and Au, and the insulating material is an insulating material of SiO2.

[0017] In the fourth step, the third polymer elastomer and the fourth polymer elastomer are elastomeric polymers of silicone, polydimethylsiloxane or polyurethane.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The top-layer inclined support micro-column array structure and the bottom-layer bionic mushroom-shaped array structure of the present invention solve the problem of decreased adhesion force on rough surfaces due to the limitation of effective contact area. The bottom-layer bionic mushroom-shaped array structure and the top-layer inclined support micro-column array structure are connected by a bendable flexible connection layer. This elastic support structure will deform when encountering a rough surface, thereby reducing the rigidity of the contact interface and increasing the contact area between the adhesion structure and the target surface, thereby improving the adaptability to the rough surface. In addition, the top-layer inclined support micro-column array structure can also be used as a part of a capacitive sensor. Relative upper-layer flexible regionalized electrodes and lower-layer flexible regionalized electrodes are designed on both sides of the top-layer inclined support micro-column array structure to form a flexible capacitive sensor, which realizes the function of detecting the contact state of the adhesion interface. The sensor array formed after the sensor unit is regionalized can feedback the force conditions of different contact areas, thereby realizing the function of sensing the morphology of the contact interface of the target object.

[0020] The present invention is a bionic adhesion / sensing integrated structure facing a rough surface with interface contact state monitoring and interface morphology sensing functions. It combines a flexible capacitive pressure sensor structure with a bionic adhesion structure, thereby achieving the addition of interface contact state monitoring and interface morphology sensing functions while enhancing adhesion performance. It has great application prospects in the fields of intelligent manipulators, aviation detection, industrial detection, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1-1 It is a schematic diagram of the integrated structure of adhesion and sensing of the present invention.

[0022] Figure 1-2 It is a schematic diagram of the deformation of the integrated adhesion and sensing structure of the present invention during the adhesion process when contacting a rough surface.

[0023] Figure 2-1 This is a schematic diagram of preparing a first photoresist layer on a first substrate and performing photolithography at a certain angle with a first UV light when preparing a top-layer inclined support micro-pillar array structure.

[0024] Figure 2-2 Schematic diagram of the inverted structure of the top layer inclined support micro-pillar array prepared by the first photoresist.

[0025] Figure 2-3 Schematic diagram of the top-layer inclined support micropillar array structure prepared by molding process.

[0026] Figure 3-1 The schematic diagram is of preparing a second photoresist layer on a second substrate and performing photolithography using a double-sided exposure technique when preparing the bottom bionic mushroom-shaped array structure.

[0027] Figure 3-2Schematic diagram of the bottom layer bionic mushroom-shaped array inversion structure prepared on the second photoresist.

[0028] Figure 3-3 Schematic diagram of the bottom bionic mushroom-shaped array structure prepared by molding process.

[0029] Figure 4 Schematic diagram of flexible regionalized electrodes.

[0030] Figure 5-1 Schematic diagram of the bonding of the upper flexible regionalized electrode and the top inclined support micro-pillar array structure.

[0031] Figure 5-2 Schematic diagram of spin coating a fourth polymer elastomer as a flexible connecting layer on the bottom bionic mushroom-shaped array structure and attaching the lower flexible regionalized electrode. DETAILED DESCRIPTION

[0032] The present invention will be described in detail below with reference to the embodiments and drawings.

[0033] Reference Figure 1-1 A bionic adhesion and sensing integrated structure for rough surfaces, including a bottom bionic mushroom-shaped array structure 4 with high-strength adhesion performance, the bottom bionic mushroom-shaped array structure 4 is bonded to a top inclined support micro-column array structure 2 through a flexible connection layer 3, thereby improving the surface adaptability of the adhesion structure surface to the rough surface; an upper flexible regionalized electrode 1-1 is bonded to the top inclined support micro-column array structure 2, and a lower flexible regionalized electrode 1-2 is bonded to the bottom bionic mushroom-shaped array structure 4; the top inclined support micro-column array structure 2 and two opposite upper flexible regionalized electrodes 1-1 and lower flexible regionalized electrodes 1-2 constitute a flexible capacitive pressure sensor for collecting interface contact signals.

[0034] The bottom bionic mushroom-shaped array structure 4, the flexible connection layer 3, and the top inclined support micro-column array structure 2 are made of elastomeric polymers such as silicone, polydimethylsiloxane or polyurethane; the upper flexible regionalized electrode 1-1 and the lower flexible regionalized electrode 1-2 are multi-layer composite structures, which are insulating materials such as SiO2, insulating films such as polyimide films or polyester films, and conductive metals such as Cr and Au.

[0035] The working principle of a biomimetic adhesion / sensing integrated structure facing a rough surface is:

[0036] Reference Figure 1-2When the bottom bionic mushroom-shaped array structure 4 with high-strength adhesion performance contacts a rough surface, the top inclined supporting micro-pillar array structure 2 is deformed and the flexible connection layer 3 is bent for shape compensation, which reduces the interface contact stiffness and increases the contact area, thereby improving the adhesion performance facing the rough surface; the top inclined supporting micro-pillar array structure 2 is deformed by external force, causing the distance between the electrodes of the upper flexible regionalized electrode 1-1 and the lower flexible regionalized electrode 1-2 to change, resulting in a capacitance change, thereby reflecting the interface contact situation, and realizing the contact interface morphology sensing function after processing the electrode capacitance signals of different regions.

[0037] A method for manufacturing a biomimetic adhesion / sensing integrated structure facing a rough surface comprises the following steps:

[0038] The first step is to prepare the top layer inclined support micro-pillar array structure 2: a first photoresist 7 with a thickness of micrometer level is spin-coated on the surface of the first substrate 8, and the first UV light 9 passes through the first mask 6 at a certain angle to realize the top lithography of the first photoresist 7, such as Figure 2-1 As shown; using the development technology, remove the exposed portion of the first photoresist 7, the top layer of the first photoresist 7 to achieve the inverted structure of the tilted support microcolumn array structure 2, such as Figure 2-2 As shown; by injection molding the first polymer elastomer into the inverse structure of the top layer inclined support micro-pillar array structure 2, and then by spin coating process, the top layer inclined support micro-pillar array structure 2 is manufactured, as shown Figure 2-3 As shown;

[0039] The first substrate 8 is a rigid substrate such as a glass slide or a Si wafer, the first photoresist 7 is a negative photoresist such as SU-82050 or SU-8 series, the certain angle is 0° to 90°, and the first polymer elastomer is an elastomeric polymer such as silicone, polydimethylsiloxane or polyurethane;

[0040] The second step is to prepare the bottom bionic mushroom-shaped array structure 4: a second photoresist 10 with a thickness of micrometer level is spin-coated on the surface of the second substrate 13, and a top second UV light 12-1 is used to transmit the second mask 11 to realize the top photolithography of the second photoresist 10, and a bottom third UV light 12-2 is directly irradiated on the second substrate 13 to realize the bottom photolithography of the second photoresist 10, such as Figure 3-1 Using development technology, remove the exposed portion of the second photoresist 10, the second photoresist 10 to achieve the bottom layer of the bionic mushroom-shaped array structure 4 of the inverse structure, such as Figure 3-2 By injection molding the second polymer elastomer into the inverse structure of the bottom bionic mushroom-shaped array structure 4, and then by spin coating process, the bottom bionic mushroom-shaped array structure 4 is manufactured, as shown Figure 3-3 As shown;

[0041] The second substrate 13 is a rigid substrate such as a glass slide or a Si wafer, the second photoresist 10 is a photoresist such as AZ 4620 or AZ series, EPG series, etc., and the second polymer elastomer is an elastomeric polymer such as silicone, polydimethylsiloxane or polyurethane;

[0042] The third step is to prepare the flexible regionalized electrode 1: sputter or evaporate a metal and an insulating material with a thickness of nanometer level on one side of the insulating film, and also sputter or evaporate a layer of insulating material with a thickness of nanometer level on the other side of the insulating film, and then use laser cutting to divide the area to realize the preparation of the flexible regionalized electrode 1. In this embodiment, the flexible regionalized electrode 1 is as follows Figure 4 As shown;

[0043] The insulating film is an insulating film such as a polyimide film or a polyester film, the metal is a conductive metal such as Cr and Au, and the insulating material is an insulating material such as SiO2;

[0044] The fourth step is to bond the flexible regionalized electrode 1 with the top-layer inclined support micro-pillar array structure 2 and the bottom-layer bionic mushroom-shaped array structure 4: a layer of a third polymer elastomer with a thickness of micrometer level is prepared on the upper surface of the top-layer inclined support micro-pillar array structure 2 by spin coating process, and both sides of the prepared flexible regionalized electrode 1 are treated with oxygen plasma, and then pressed on the upper surface of the top-layer inclined support micro-pillar array structure 2 in a gradually bonding manner to form an upper flexible regionalized electrode 1-1, as shown in FIG. Figure 5-1 As shown; after waiting for the third polymer elastomer to cure, a layer of a fourth polymer elastomer with a thickness of micrometer level is prepared on the upper surface of the bottom bionic mushroom-shaped array structure 4 by spin coating process as a flexible connection layer 3, and both sides of the flexible regionalized electrode 1 are treated with oxygen plasma, and then pressed on the uncured fourth polymer elastomer in a gradually fitting manner, as shown Figure 5-2 As shown, a lower flexible regionalized electrode 1-2 is formed; before curing, the top layer of inclined support micro-pillar array structure 2 is lightly placed on the surface of the uncured fourth polymer elastomer, and then pressure is evenly applied to the top layer of inclined support micro-pillar array structure 2 to ensure that it can contact and bond successfully with the bottom layer of bionic mushroom-shaped array structure 4 after curing, as shown in FIG1 after bonding;

[0045] The third polymer elastomer and the fourth polymer elastomer are elastomeric polymers such as silicone, polydimethylsiloxane or polyurethane.

[0046] The present invention provides a bionic adhesion / sensing integrated structure for rough surfaces, which has the functions of interface contact state monitoring and interface morphology sensing, and overcomes the problem that traditional bionic adhesion structures are not suitable for rough surfaces and cannot detect the adhesion state of the contact interface.

Claims

1. A bionic adhesion and sensing integrated structure facing a rough surface, characterized in that: It comprises a bottom bionic mushroom-shaped array structure (4), wherein the bottom bionic mushroom-shaped array structure (4) is bonded to a top inclined support micro-column array structure (2) via a flexible connection layer (3); An upper flexible regionalized electrode (1-1) is bonded to a top layer inclined support micro-column array structure (2), and a lower flexible regionalized electrode (1-2) is bonded to a bottom layer bionic mushroom-shaped array structure (4). The top layer inclined support micro-column array structure (2) and two opposite upper flexible regionalized electrodes (1-1) and lower flexible regionalized electrodes (1-2) form a flexible capacitive pressure sensor for collecting interface contact signals.

2. The bionic adhesion and sensing integrated structure facing a rough surface according to claim 1, characterized in that: The bottom bionic mushroom-shaped array structure (4), the flexible connection layer (3), and the top inclined support micro-pillar array structure (2) are made of elastomeric polymers such as silicone, polydimethylsiloxane or polyurethane; the upper flexible regionalized electrode (1-1) and the lower flexible regionalized electrode (1-2) are multi-layer composite structures, which are insulating materials such as SiO2, insulating films such as polyimide films or polyester films, and conductive metals such as Cr and Au.

3. The method for manufacturing a biomimetic adhesion / sensing integrated structure facing a rough surface as claimed in claim 1, characterized in that: The following steps are involved: The first step is to prepare the top-layer inclined support micro-pillar array structure (2): a first photoresist (7) with a thickness of micrometer level is spin-coated on the surface of the first substrate (8), and a first UV light (9) is transmitted through the first mask (6) at a certain angle to realize top photolithography of the first photoresist (7); the first photoresist (7) of the exposed part is removed by developing technology, and the inverse structure of the top-layer inclined support micro-pillar array structure (2) is realized on the first photoresist (7); the first polymer elastomer is injection-molded onto the inverse structure of the top-layer inclined support micro-pillar array structure (2), and then the top-layer inclined support micro-pillar array structure (2) is manufactured by spin coating process; The second step is to prepare the bottom bionic mushroom-shaped array structure (4): a layer of second photoresist (10) with a thickness of micrometer level is spin-coated on the surface of the second substrate (13), and a top second UV light (12-1) is used to transmit the second mask (11) to realize top photolithography of the second photoresist (10) by double-sided exposure technology, and a bottom third UV light (12-2) is directly irradiated on the second substrate (13) to realize bottom photolithography of the second photoresist (10); the exposed part of the second photoresist (10) is removed by developing technology, and the inverse structure of the bottom bionic mushroom-shaped array structure (4) is realized on the second photoresist (10); the bottom bionic mushroom-shaped array structure (4) is manufactured by injection molding the second polymer elastomer onto the inverse structure of the bottom bionic mushroom-shaped array structure (4), and then by spin coating process; The third step is to prepare the flexible regionalized electrode (1): sputter or evaporate a metal and an insulating material with a thickness of nanometer level on one side of the insulating film, and also sputter or evaporate a layer of insulating material with a thickness of nanometer level on the other side of the insulating film, and then use laser cutting to divide the area, so as to prepare the flexible regionalized electrode (1); The fourth step is to bond the flexible regionalized electrode (1) to the top-layer inclined support micro-pillar array structure (2) and the bottom-layer bionic mushroom-shaped array structure (4): a layer of a third polymer elastomer with a thickness of micrometers is prepared on the upper surface of the top-layer inclined support micro-pillar array structure (2) by a spin coating process, and both sides of the prepared flexible regionalized electrode (1) are treated with oxygen plasma, and then pressed on the upper surface of the top-layer inclined support micro-pillar array structure (2) in a gradually bonding manner to form an upper-layer flexible regionalized electrode (1-1); after waiting for the third polymer elastomer to solidify, a spin coating process is used to bond the bottom-layer bionic mushroom-shaped array structure (4) to the top-layer inclined support micro-pillar array structure (2). A layer of a fourth polymer elastomer with a thickness of micrometers is prepared on the upper surface of the bionic mushroom-shaped array structure (4) as a flexible connecting layer (3), and after both sides of the flexible regionalized electrode (1) are treated with oxygen plasma, it is pressed onto the uncured fourth polymer elastomer in a gradually fitting manner to form a lower flexible regionalized electrode (1-2); before curing, the top layer of the inclined support micro-pillar array structure (2) is lightly placed on the surface of the uncured fourth polymer elastomer, and then pressure is evenly applied to the top layer of the inclined support micro-pillar array structure (2) to ensure that it can contact and bond successfully with the bottom layer of the bionic mushroom-shaped array structure (4) after curing.

4. The method according to claim 3, characterized in that: In the first step, the first substrate (8) is a rigid substrate of a glass slide or a Si wafer, the first photoresist (7) is a photoresist negative of SU-82050 or SU-8 series, the certain angle is 0° to 90°, and the first polymer elastomer is an elastomeric polymer of silicone, polydimethylsiloxane or polyurethane.

5. The method according to claim 3, characterized in that: In the second step, the second substrate (13) is a rigid substrate such as a glass slide or a Si wafer, the second photoresist (10) is AZ 4620 or AZ series or EPG series photoresist, and the second polymer elastomer is an elastomer polymer such as silicone, polydimethylsiloxane or polyurethane.

6. The method according to claim 3, characterized in that: In the third step, the insulating film is an insulating film of a polyimide film or a polyester film, the metal is a conductive metal of Cr and Au, and the insulating material is an insulating material of SiO2.

7. The method according to claim 3, characterized in that: In the fourth step, the third polymer elastomer and the fourth polymer elastomer are elastomeric polymers of silicone, polydimethylsiloxane or polyurethane.

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