Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a light emitting device layer, a first light shielding layer, a packaging layer and a second light shielding layer. The light-emitting device layer comprises a plurality of LED chips arranged on one side of the substrate, each LED chip comprises a light-emitting body, a first electrode and a second electrode, the first electrode and the second electrode are arranged on the light-emitting body, and the first electrode and the second electrode are connected to the substrate; the first shading layer is arranged on the side, provided with the light-emitting device layer, of the substrate and provided with a first opening allowing the LED chip to be exposed. The packaging layer covers the first shading layer, and part of the packaging layer is filled between the first electrode and the second electrode; the second shading layer is arranged on the side, away from the substrate, of the packaging layer. The second shading layer is provided with a second opening for exposing the LED chip. The performance of the display panel can be improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] With the continuous development of display technology, sub-millimeter light-emitting diodes Mini LED or micro light-emitting diodes (MicroLight Emitting Diode, Micro LED) are gradually being used in the display field due to their small size, high luminous efficiency and low energy consumption.

[0003] At present, how to improve the performance of Mini LED or Micro LED display panels has become an urgent problem that needs to be solved. Summary of the invention

[0004] The purpose of the present application is to provide a display panel, a method for manufacturing a display panel and a display device, which can improve the performance of the display panel.

[0005] In a first aspect, the present application provides a display panel, which includes a substrate, a light-emitting device layer, a first shading layer, a packaging layer, and a second shading layer; the light-emitting device layer includes a plurality of LED chips arranged on one side of the substrate, the LED chip includes a light-emitting body and a first electrode and a second electrode respectively arranged on the light-emitting body, the first electrode and the second electrode are respectively connected to the substrate; the first shading layer is arranged on a side of the substrate having the light-emitting device layer, and is provided with a first opening for exposing the LED chip; the packaging layer covers the first shading layer, and part of the packaging layer is filled between the first electrode and the second electrode; the second shading layer is arranged on a side of the packaging layer away from the substrate, and is provided with a second opening for exposing the LED chip.

[0006] In some embodiments, a first binding electrode and a second binding electrode are disposed on the substrate, the first electrode is electrically connected to the first binding electrode, and the second electrode is electrically connected to the second binding electrode.

[0007] In some embodiments, the first light shielding layer or the second light shielding layer contacts the LED chip in a direction parallel to the substrate;

[0008] Preferably, the first light shielding layer is not in contact with the first electrode and the second electrode, and the second light shielding layer is disposed around the circumference of the light emitting body;

[0009] Alternatively, the first light shielding layer is disposed around the circumference of the first electrode and the circumference of the second electrode, and the second light shielding layer does not contact the light emitting body.

[0010] In some embodiments, the height of the encapsulation layer is less than the height of the light emitting device layer;

[0011] Preferably, the height difference between the surface of the light emitting device layer away from the substrate and the surface of the encapsulation layer away from the substrate is H, and H satisfies the following condition: 1um≤H≤20um;

[0012] Preferably, a surface of the second light-shielding layer facing away from the substrate is flush with a surface of the light-emitting device layer facing away from the substrate.

[0013] In some embodiments, the height of the first light shielding layer is L1, and L1 satisfies the following conditions: 1um≤H≤10um;

[0014] Preferably, the height of the second light-shielding layer is L2, and L2 satisfies the following condition: 1um≤H≤20um.

[0015] In some embodiments, the display panel further includes a protective layer, which is disposed on a side of the second light shielding layer and the light emitting device layer away from the substrate, and the protective layer covers the light emitting device layer and the second light shielding layer;

[0016] Preferably, the protection layer is multiplexed as an optical path conversion layer.

[0017] In some embodiments, at least part of the material of the encapsulation layer includes a reflective material;

[0018] Preferably, the encapsulation layer includes a reflective portion and an encapsulation portion, the reflective portion includes a reflective material, the orthographic projection of the LED chip on the substrate is located within the orthographic projection of the reflective portion on the substrate, and the encapsulation portion is arranged around the circumference of the reflective portion.

[0019] In some embodiments, the light emitting body includes a quantum well layer, and a surface of the light reflecting portion facing away from the substrate is higher than a surface of the quantum well layer facing away from the substrate.

[0020] A second aspect of the present application provides a method for preparing a display panel, comprising the following steps:

[0021] A first light shielding layer and a light emitting device layer are formed on one side of the substrate; wherein the light emitting device layer includes a plurality of LED chips arranged on one side of the substrate, the LED chip includes a light emitting body and a first electrode and a second electrode respectively arranged on the light emitting body, the first electrode and the second electrode are respectively connected to the substrate; the first light shielding layer is provided with a first opening for exposing the LED chip;

[0022] An encapsulation layer is formed on one side of the first light shielding layer; wherein the encapsulation layer covers the first light shielding layer, and a portion of the encapsulation layer is filled between the first electrode and the second electrode;

[0023] A second light shielding layer is formed on the side of the packaging layer facing away from the substrate; wherein the second light shielding layer is provided with a second opening for exposing the LED chip.

[0024] A third aspect of the present application provides a display device, comprising a display panel according to any of the above embodiments, or a display panel prepared by the above preparation method.

[0025] The embodiment of the present application provides a display panel, a method for preparing a display panel, and a display device. The display panel of the embodiment of the present application includes not only encapsulating the LED chip through the encapsulation layer, but also setting two light shielding layers, wherein the first light shielding layer is set on the side of the substrate with the light-emitting device layer, and is provided with a first opening for exposing the LED chip, and the second light shielding layer is set on the side of the encapsulation layer away from the substrate, and is provided with a second opening for exposing the LED chip. Through the cooperation of the encapsulation layer, the first light shielding layer and the second light shielding layer, cross-color and color mixing between adjacent LED chips are prevented, and the first light shielding layer and the second light shielding layer can increase the black state of the screen body, improve the contrast of the display panel, and thus improve the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic cross-sectional view of a display panel provided in some embodiments of the present application;

[0028] Figure 2 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0029] Figure 3 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0030] Figure 4 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0031] Figure 5 A flow chart of a method for preparing a display panel provided in some embodiments of the present application;

[0032] Figure 6 and Figure 7 This is a schematic diagram of the process structure of a method for preparing a display panel according to some embodiments of the present application.

[0033] The figures are as follows:

[0034] 100, display panel; 10, substrate; 11, first binding electrode; 12, second binding electrode; 20, light-emitting device layer; 21, LED chip; 211, light-emitting body; 212, first electrode; 213, second electrode; 30, encapsulation layer; 31, reflective portion; 32, encapsulation portion; 41, first shading layer; 411, first opening; 42, second shading layer; 421, second opening; 50, protective layer. DETAILED DESCRIPTION

[0035] The following detailed description and drawings of the embodiments of the present application are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

[0036] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inside", "outside", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but is within the allowable error range. "Parallel" is not strictly parallel, but is within the allowable error range.

[0037] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0038] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0039] Since Mini LED chips and Micro LED chips are polyhedral light-emitting bodies, when adjacent Mini LED chips or Micro LED chips are lit, they will interfere with each other, resulting in problems such as cross-color, color mixing, and poor contrast, which will reduce the performance of the display panel.

[0040] An embodiment of the present application provides a display panel, which may be a Mini LED display panel or a Micro LED display panel.

[0041] like Figure 1 As shown, the first aspect of the present application provides a display panel 100, which includes a substrate 10, a light-emitting device layer 20, a first shading layer 41, an encapsulation layer 30 and a second shading layer 42; the light-emitting device layer 20 includes a plurality of LED chips 21 arranged on one side of the substrate 10, the LED chip 21 includes a light-emitting body 211 and a first electrode 212 and a second electrode 213 respectively arranged on the light-emitting body 211, and the first electrode 212 and the second electrode 213 are respectively connected to the substrate 10; the first shading layer 41 is arranged on a side of the substrate 10 having the light-emitting device layer 20, and is provided with a first opening 411 for exposing the LED chip 21; the encapsulation layer 30 covers the first shading layer 41, and part of the encapsulation layer 30 is filled between the first electrode 212 and the second electrode 213; the second shading layer 42 is arranged on a side of the encapsulation layer 30 away from the substrate 10, and is provided with a second opening 421 for exposing the LED chip 21.

[0042] Among them, the substrate 10 includes a substrate and a driving circuit layer arranged on the substrate. The substrate can be a hard substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC) or cellulose acetate propionate (CAP). A driving circuit for controlling the light emission of the LED chip 21 is arranged in the driving circuit layer. The driving circuit layer is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the LED chip 21 can be formed. There are many implementation methods for its specific circuit structure, which will not be repeated here.

[0043] The first electrode 212 and the second electrode 213 can be bonded to the substrate 10 by a tinning process, and one of the first electrode 212 and the electrode serves as the anode of the LED chip 21, and the other serves as the cathode of the LED chip 21. A plurality of LED chips 21 with different luminous colors can form a pixel unit, and a plurality of pixel units can be arranged in an array.

[0044] The first light-shielding layer 41 and the second light-shielding layer 42 can be a black matrix (BM) or other black ink, etc. The first light-shielding layer 41 can be prepared first, and then the resin colloid material is filled into the LED chip 21 through a molding process, and the encapsulation layer 30 is formed by pressing and curing, and then the second light-shielding layer 42 is prepared. The above-mentioned resin colloid material can be a transparent colloid material or a white reflective material, which does not affect the light emission of the light-emitting body 211 and can reduce the phenomenon of light effect damage. In addition, the encapsulation layer 30 not only covers the first light-shielding layer 41 and fills between adjacent LED chips 21, but also fills between the first electrode 212 and the second electrode 213, which can improve the encapsulation protection effect of the LED chip 21.

[0045] The display panel 100 of the embodiment of the present application includes not only encapsulating the LED chip 21 through the encapsulation layer 30, but also setting two layers of shading layers, wherein the first shading layer 41 is arranged on one side of the substrate 10, and is provided with a first opening 411 for exposing the LED chip 21, and the second shading layer 42 is arranged on the side of the encapsulation layer 30 away from the substrate 10, and the second shading layer 42 is provided with a second opening 421 for exposing the LED chip 21. Through the cooperation of the encapsulation layer 30, the first shading layer 41 and the second shading layer 42, cross-color and color mixing between adjacent LED chips 21 are prevented, and the first shading layer 41 and the second shading layer 42 can increase the black state of the screen, improve the contrast of the display panel 100, and thus improve the performance of the display panel 100.

[0046] In some embodiments, a first binding electrode 11 and a second binding electrode 12 are disposed on the substrate 10 , the first electrode 212 is electrically connected to the first binding electrode 11 , and the second electrode 213 is electrically connected to the second binding electrode 12 .

[0047] The substrate 10 includes a substrate and a driving circuit layer arranged on one side of the substrate. The driving circuit layer includes a plurality of thin film transistors. The first binding electrode 11 is electrically connected to the thin film transistors. A common electrode is arranged on the driving circuit layer. The second binding electrode 12 is electrically connected to the common electrode.

[0048] The LED chip 21 is electrically connected to the corresponding driving circuit, which at least includes a thin film transistor, the source or drain of the thin film transistor is electrically connected to the first binding electrode 11, and the first binding electrode 11 is electrically connected to the first electrode 212 of the corresponding LED chip 21. The common electrode is electrically connected to the second binding electrode 12, and the second binding electrode 12 is electrically connected to the second electrode 213 of the LED chip 21, and the common electrode is used to provide a negative electrode potential for the second electrode 213.

[0049] The first binding electrode 11 and the second binding electrode 12 are arranged in the same layer. When installing the LED chip 21, the substrate 10 containing the first binding electrode 11 and the second binding electrode 12 can be prepared by an array process, and then the first light shielding layer 41 can be prepared, and then the first electrode 212 of the LED chip 21 is bonded to the first binding electrode 11, and the second electrode 213 of the LED chip 21 is bonded to the second binding electrode 12; or the first electrode 212 of the LED chip 21 is bonded to the first binding electrode 11, and the second electrode 213 of the LED chip 21 is bonded to the second binding electrode 12, and then the first light shielding layer 41 is prepared.

[0050] In some embodiments, the first shading layer 41 or the second shading layer 42 contacts the LED chip 21 in a direction parallel to the substrate 10, which can better shield light, further prevent cross-color and color mixing between adjacent LED chips 21, further increase the black state of the screen, and improve the contrast of the display panel 100, thereby further improving the performance of the display panel 100.

[0051] Specifically, Figure 1 As shown, in some embodiments, the first light shielding layer 41 is not in contact with the first electrode 212 and the second electrode 213 , and the second light shielding layer 42 is disposed around the circumference of the light emitting body 211 .

[0052] The orthographic projection of the LED chip 21 on the substrate 10 is located within the range of the orthographic projection of the first opening 411 on the substrate 10. First, a first light shielding layer 41 is formed on the substrate 10 by a photolithography process, and then the LED chip 21 is installed. After the encapsulation layer 30 is prepared, a second light shielding layer 42 is formed by an IJP (Inkjet-printed) process. Since the area of ​​the first opening 411 is slightly larger than the area of ​​the cross section of the LED chip 21 along a direction parallel to the substrate 10, the bonding operation of the LED chip 21 can be facilitated. The second light shielding layer 42 contacts the light-emitting body 211 of the LED chip 21, and is arranged around the circumference of the light-emitting body 211, which can better prevent cross-color and color mixing between adjacent LED chips 21, and increase the black state of the screen. Moreover, the first light shielding layer 41 of the embodiment of the present application can be prepared by a photolithography process, which is more convenient for process implementation.

[0053] Or, if Figure 2 As shown, in other embodiments, the first light shielding layer 41 is disposed around the circumference of the first electrode 212 and the circumference of the second electrode 213 , respectively, and the second light shielding layer 42 is not in contact with the light emitting body 211 .

[0054] The first light shielding layer 41 is in contact with the first electrode 212 and the second electrode 213, respectively, and is disposed around the circumference of the first electrode 212 and the circumference of the second electrode 213. First, the LED chip 21 can be mounted on the substrate 10, and then the first light shielding layer 41 is formed by an IJP (Inkjet-printed) process, and then the encapsulation layer 30 is prepared, and then the second light shielding layer 42 is formed by a photolithography process. The orthographic projection of the LED chip 21 on the substrate 10 is located within the range of the orthographic projection of the second opening 421 on the substrate 10.

[0055] In some embodiments, the height of the encapsulation layer 30 is less than the height of the light emitting device layer 20 .

[0056] Through the molding process, the resin colloid material is filled into the LED chip 21, and after the glue is pressed and cured to form the packaging layer 30, the height of the packaging layer 30 is higher than the height of the light-emitting device layer 20. The thickness of the packaging layer 30 is then thinned through processes such as grinding and plasma ashing, so that the height of the packaging layer 30 is smaller than the height of the light-emitting device layer 20, which facilitates the preparation of the second shading layer 42 on the packaging layer 30 to prevent the second shading layer 42 from covering the light-emitting body 211 and affecting the light output of the light-emitting body 211.

[0057] In some embodiments, the height difference between the surface of the light emitting device layer 20 facing away from the substrate 10 and the surface of the packaging layer 30 facing away from the substrate 10 is H, and H satisfies the following condition: 1um≤H≤20um. This can ensure the packaging effect of the packaging layer 30 on the LED chip 21 and provide sufficient space for the second light shielding layer 42.

[0058] In some embodiments, the surface of the second light shielding layer 42 facing away from the substrate 10 is flush with the surface of the light emitting device layer 20 facing away from the substrate 10. The second light shielding layer 42 just fills the height difference between the encapsulation layer 30 and the light emitting device layer 20, which not only ensures the thickness of the second light shielding layer 42, but also does not cover the light emitting body 211, and does not affect the light emission of the light emitting body 211.

[0059] In some embodiments, the height of the first light shielding layer 41 is L1, and L1 satisfies the following condition: 1um≤H≤10um. The thickness of the first light shielding layer 41 is moderate, which does not occupy the setting space of the encapsulation layer 30 and can ensure the light shielding effect of the first light shielding layer 41.

[0060] In some embodiments, the height of the second light shielding layer 42 is L2, and L2 satisfies the following condition: 1 um≤H≤20 um. The thickness of the second light shielding layer 42 is moderate, and the light shielding effect of the second light shielding layer 42 can be ensured.

[0061] like Figure 3As shown, in some embodiments, the display panel 100 further includes a protective layer 50 , which is disposed on the second light shielding layer 42 and the side of the light emitting device layer 20 facing away from the substrate 10 , and the protective layer 50 covers the light emitting device layer 20 and the second light shielding layer 42 .

[0062] The protective layer 50 can be formed by using optical adhesive, which does not affect the light emission of the LED chip 21 and can protect the LED chip 21 and the second light shielding layer 42 .

[0063] In some embodiments, the protective layer 50 is reused as a light path conversion layer, that is, the protective layer 50 can be stacked by optical adhesive layers with high refractive index and low refractive index to form a microlens array, thereby improving the light extraction efficiency of the LED chip 21.

[0064] In some embodiments, at least a portion of the material of the encapsulation layer 30 includes a reflective material.

[0065] The reflective material is a white reflective material such as titanium oxide, aluminum oxide, zirconium oxide, etc. The reflective material has a high reflectivity and can reflect light back to the light-emitting area of ​​the LED chip 21, thereby increasing the light output efficiency. The packaging layer 30 can be made entirely of reflective material, or some areas can be made of reflective material and other areas can be made of transparent material.

[0066] like Figure 4 As shown, in some embodiments, the packaging layer 30 includes a reflective portion 31 and a packaging portion 32, the reflective portion 31 includes a reflective material, the orthographic projection of the LED chip 21 on the substrate 10 is located within the orthographic projection of the reflective portion 31 on the substrate 10, and the packaging portion 32 is arranged around the circumference of the reflective portion 31.

[0067] The reflective portion 31 can be made of white reflective materials such as titanium oxide, aluminum oxide, zirconium oxide, etc., and the packaging portion 32 can be made of a transparent resin colloid material. The reflective portion 31 encapsulates each LED chip 21, and adjacent LED chips 21 are encapsulated by the packaging portion 32. By arranging the orthographic projection of the LED chip 21 on the substrate 10 within the orthographic projection of the reflective portion 31 on the substrate 10, the light output efficiency can be better increased. The embodiment of the present application combines the reflective portion 31 with the packaging portion 32, which can not only improve the light output efficiency, but also reduce costs.

[0068] In some embodiments, the light emitting body 211 includes a quantum well layer, and a surface of the light reflecting portion 31 facing away from the substrate 10 is higher than a surface of the quantum well layer facing away from the substrate 10 .

[0069] The quantum well layer is the most important part of the LED chip 21, which contains a semiconductor layer with energy level restrictions. When electrons and holes enter the quantum well layer, they can combine and release energy to generate light. Of course, in addition to the quantum well layer, the light-emitting body 211 can also include a waveguide layer to guide and control the generated light to ensure that the light can propagate throughout the chip.

[0070] like Figure 5 As shown, the second aspect of the present application provides a method for preparing a display panel 100, comprising the following steps:

[0071] like Figure 6 As shown, S10 , a first light shielding layer 41 and a light emitting device layer 20 are formed on one side of the substrate 10 .

[0072] Among them, the light-emitting device layer 20 includes a plurality of LED chips 21 arranged on one side of the substrate 10, the LED chip 21 includes a light-emitting body 211 and a first electrode 212 and a second electrode 213 respectively arranged on the light-emitting body 211, the first electrode 212 and the second electrode 213 are respectively connected to the substrate 10; the first light-shielding layer 41 has a first opening 411 for exposing the LED chip 21.

[0073] The first light shielding layer 41 may be formed on the substrate 10 by a photolithography process before the LED core is installed, or the LED chip 21 may be installed on the substrate 10 first and then the first light shielding layer 41 may be formed by an IJP (Inkjet-printed) process.

[0074] like Figure 7 As shown, S20 , forming an encapsulation layer 30 on one side of the first light shielding layer 41 .

[0075] The encapsulation layer 30 covers the first light shielding layer 41 , and a portion of the encapsulation layer 30 is filled between the first electrode 212 and the second electrode 213 .

[0076] The LED chip 21 can be filled with resin colloid material through a molding process, and after being pressed and cured to form a packaging layer 30, the thickness of the packaging layer 30 can be thinned by grinding, plasma ashing and other processes, so that the height of the packaging layer 30 is smaller than the height of the light-emitting device layer 20.

[0077] like Figure 1 As shown, S30 , a second light shielding layer 42 is formed on a side of the encapsulation layer 30 facing away from the substrate 10 .

[0078] The second light shielding layer 42 defines a second opening 421 for exposing the LED chip 21 .

[0079] The first light-shielding layer 41 can be firstly formed on the substrate 10 by a photolithography process, and then the encapsulation layer 30 is prepared, and then the second light-shielding layer 42 is formed by an IJP (Inkjet-printed) process; or the first light-shielding layer 41 can be firstly formed by an IJP (Inkjet-printed) process, and then the encapsulation layer 30 is prepared, and then the second light-shielding layer 42 is formed by a photolithography process.

[0080] In a third aspect, the present application provides a display device, including the display panel 100 of any of the above embodiments, or the display panel 100 prepared by the above preparation method. Since the display device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0081] The display device may be any device with a display function, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or an automated machine.

[0082] Although the embodiments disclosed in this application are as above, the contents described are only embodiments adopted for facilitating the understanding of this application and are not intended to limit the present invention. Any technician in the technical field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of protection of this application shall still be subject to the scope defined in the attached claims.

[0083] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A light emitting device layer, comprising a plurality of LED chips arranged on one side of the substrate, wherein the LED chip comprises a light emitting body and a first electrode and a second electrode respectively arranged on the light emitting body, wherein the first electrode and the second electrode are respectively connected to the substrate; A first light shielding layer is disposed on a side of the substrate having the light emitting device layer and is provided with a first opening for exposing the LED chip; an encapsulation layer, covering the first light shielding layer, and a portion of the encapsulation layer is filled between the first electrode and the second electrode; The second light shielding layer is arranged on a side of the packaging layer away from the substrate, and the second light shielding layer is provided with a second opening for exposing the LED chip.

2. The display panel according to claim 1, characterized in that: A first binding electrode and a second binding electrode are disposed on the substrate, the first electrode is electrically connected to the first binding electrode, and the second electrode is electrically connected to the second binding electrode.

3. The display panel according to claim 1, characterized in that: The first light shielding layer or the second light shielding layer is in contact with the LED chip in a direction parallel to the substrate; Preferably, the first light shielding layer is not in contact with the first electrode and the second electrode, and the second light shielding layer is disposed around the circumference of the light emitting body; Alternatively, the first light shielding layer is disposed around the circumference of the first electrode and the circumference of the second electrode, respectively, and the second light shielding layer is not in contact with the light emitting body.

4. The display panel according to claim 1, characterized in that: The height of the encapsulation layer is smaller than the height of the light-emitting device layer; Preferably, a height difference between a surface of the light-emitting device layer away from the substrate and a surface of the encapsulation layer away from the substrate is H, and H satisfies the following condition: 1um≤H≤20um; Preferably, a surface of the second light-shielding layer facing away from the substrate is flush with a surface of the light-emitting device layer facing away from the substrate.

5. The display panel according to claim 1, characterized in that: The height of the first light shielding layer is L1, and L1 satisfies the following conditions: 1um≤H≤10um; Preferably, the height of the second light-shielding layer is L2, and L2 satisfies the following condition: 1um≤H≤20um.

6. The display panel according to claim 1, characterized in that: The display panel further includes a protective layer, which is arranged on a side of the second light shielding layer and the light emitting device layer away from the substrate, and the protective layer covers the light emitting device layer and the second light shielding layer; Preferably, the protection layer is multiplexed as an optical path conversion layer.

7. The display panel according to claim 1, characterized in that: At least part of the material of the encapsulation layer includes a reflective material; Preferably, the encapsulation layer includes a reflective portion and an encapsulation portion, the reflective portion includes a reflective material, the orthographic projection of the LED chip on the substrate is located within the orthographic projection of the reflective portion on the substrate, and the encapsulation portion is arranged around the circumference of the reflective portion.

8. The display panel according to claim 7, characterized in that: The light-emitting body includes a quantum well layer, and a surface of the light-reflecting portion facing away from the substrate is higher than a surface of the quantum well layer facing away from the substrate.

9. A method for preparing a display panel, characterized in that: The following steps are involved: A first light shielding layer and a light emitting device layer are formed on one side of the substrate; wherein the light emitting device layer includes a plurality of LED chips arranged on one side of the substrate, the LED chip includes a light emitting body and a first electrode and a second electrode respectively arranged on the light emitting body, the first electrode and the second electrode are respectively connected to the substrate; the first light shielding layer is provided with a first opening for exposing the LED chip; An encapsulation layer is formed on one side of the first light shielding layer; wherein the encapsulation layer covers the first light shielding layer, and a portion of the encapsulation layer is filled between the first electrode and the second electrode; A second light shielding layer is formed on a side of the packaging layer away from the substrate; wherein the second light shielding layer is provided with a second opening for exposing the LED chip.

10. A display device, characterized in that: It comprises the display panel according to any one of claims 1 to 8, or the display panel prepared by the preparation method according to claim 9.

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