Dustproof case with external heat dissipation structure and use method thereof

Abstract

The invention discloses a dustproof case with an external heat dissipation structure and a using method thereof.The dustproof case comprises a case body, a cooling module, a GPU heat dissipation module and a CPU heat dissipation module, the front side of the case body is provided with a first cooling bin, the top of the case body is provided with a second cooling bin, and meanwhile the rear portion of the case body is provided with a wire arrangement bin; according to the invention, high-heat components such as a CPU and a power supply element on a mainboard are covered by the CPU heat dissipation module which is designed in a large area, and high-heat components such as a chip and a power supply element of a GPU are covered by the GPU heat dissipation module, so that most heat generated when computer hardware is used can be quickly transferred to a cooling liquid; according to the computer case, the external first cooling bar and the external second cooling bar are matched with the two cooling modules, cooling can be conducted outside the computer case, therefore, external air does not need to enter the computer case to participate in heat dissipation, and the efficiency that external dust enters the computer case body is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the technical field related to computer chassis, and in particular to a dustproof chassis with an external heat dissipation structure and a use method thereof. Background Art

[0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations and logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and automatically and quickly process massive data. When in use, the computer needs to be used in conjunction with a chassis, which is used to fix and install the required hardware and can provide heat dissipation function. Reference publication number: "CN210294965U", the "universal sheet metal chassis" announced, includes a chassis body, the front of the chassis body is fixedly connected with a U-shaped slide rail, the inner wall of the U-shaped slide rail is movably connected to the surface of the square plate, the back of the square plate is movably connected to the front of the chassis body, the front of the chassis body is respectively provided with a through groove and an annular groove, the back of the square plate is fixedly connected with a sealing gasket, the surface of the sealing gasket is movably connected to the inner wall of the annular groove, the front of the U-shaped slide rail is fixedly connected with a square box, the inner wall of the square box is movably connected to the surface of the card block, and the front of the card block and the front of the inner wall of the square box are respectively fixedly connected to the two ends of the spring.

[0003] Existing computer chassis usually have a simple structure. In order to ensure heat dissipation efficiency, airflow will continue to exchange between the inside and outside of the chassis during use. Therefore, dust and debris in the air will follow the airflow into the chassis and adhere to the computer hardware under the action of static electricity. Therefore, in some scenarios, the service life of the computer hardware will be reduced. At the same time, some computer chassis will increase the density of dustproof nets or reduce the area of ​​air inlets to achieve dust-proof effects, but this will greatly reduce the air flow and affect the heat dissipation effect. It is not suitable for high-performance computers with high power consumption, so there are disadvantages when using it. Summary of the invention

[0004] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a dustproof chassis with an external heat dissipation structure and a method of using the same, so as to solve the problem mentioned in the above background that the existing chassis usually has a simple structure and cannot take into account both the dustproof effect and the heat dissipation requirements of a high-performance platform.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions: A dustproof case with an external heat dissipation structure and a method of using the same, comprising a case body, a cooling module, a GPU heat dissipation module and a CPU heat dissipation module, wherein a first cooling bin is provided at the front side of the case body, a second cooling bin is provided at the top of the case body, and a wire management bin is provided at the rear of the case body; Furthermore, a partition is installed inside the chassis body, and a power supply compartment is provided at the bottom of the chassis body; a mounting frame is installed on one side of the partition, and two clamping rings are symmetrically installed on the mounting frame, and both clamping rings are engaged with the water storage tank; a wire groove is opened at the bottom of one side of the interior of the chassis body, and the wire groove is connected with the interior of the power supply compartment; Furthermore, a circulating water pump is provided below the water storage tank, and the circulating water pump is installed at the inner bottom of the chassis body; the water inlet end of the circulating water pump is connected to the bottom pipe of the water storage tank, and the water outlet end of the circulating water pump is connected to the water inlet end pipe of the first cold row, and the water outlet end of the first cold row is connected to the water inlet end pipe of the water distributor; the water distributor is installed with a regulating valve, and the regulating valve is provided in multiple numbers; Furthermore, the GPU cooling modules are provided in a plurality, and the water inlet end of each GPU cooling module is connected to a regulating valve pipeline respectively; the water inlet end of the CPU cooling module is connected to a regulating valve pipeline; Furthermore, a first panel is installed on an upper portion of one side of the chassis body, a second panel is installed on an upper portion of another side of the chassis body, and a third panel is installed on a lower portion of one side of the chassis body; Furthermore, a cover plate is installed at the rear of the chassis body, and the connection between the cover plate and the chassis body is a rotational connection; a fastening screw is installed in the middle of one side of the cover plate, and the fastening screw is threadedly connected to the chassis body; a dustproof groove is provided at the bottom of the cover plate.

[0006] Furthermore, a third heat sink fin is disposed on the upper side of the inner wall of the chassis body, and a fourth heat sink fin is disposed on the lower side of the inner wall of the chassis body, and a plurality of the third heat sink fins and the fourth heat sink fins are both distributed in a matrix.

[0007] Furthermore, a first partition chamber is provided on one side of the first cooling chamber, and a first air inlet is provided on one side of the first partition chamber, and the first air inlet is connected to the interior of the first cooling chamber; a first heat dissipation fin is provided on the inner wall of the first cooling chamber, and a first radiator is installed inside the first cooling chamber.

[0008] Furthermore, a second partition chamber is provided on one side of the second cooling chamber, and a second air inlet is provided on one side of the second partition chamber, and the second air inlet is connected to the interior of the second cooling chamber; a second heat sink fin is provided on the inner wall of the second cooling chamber, and a second cold row is installed inside the second cooling chamber; Furthermore, a plurality of the first heat dissipation fins and the second heat dissipation fins are arranged in a matrix arrangement.

[0009] Furthermore, the cooling module includes a fixed frame, an air outlet groove, a mounting groove, an air guide, a centrifugal fan and a dustproof plate; a plurality of air guides are arranged at equal intervals, and the air outlet end of the air guide is connected to the air outlet groove, and a centrifugal fan is installed inside each air guide.

[0010] Furthermore, the water outlet ends of the GPU cooling module and the CPU cooling module are both connected to the joint pipe, and the joint is connected to the water inlet end of the second radiator, and the water outlet end of the second radiator is connected to the top pipe of the water storage tank.

[0011] Furthermore, the method for using the dustproof chassis with an external heat dissipation structure is as follows: Step 1: Select a CPU cooling module and a GPU cooling module of appropriate size according to the size of the motherboard and graphics card PCB to be used, and install the CPU cooling module and the GPU cooling module on the motherboard and graphics card PCB respectively; Step 2: Connect the water inlet ends of the CPU cooling module and the GPU cooling module to the corresponding regulating valves through pipes, and connect the water outlet ends of the CPU cooling module and the GPU cooling module to the joints, and then inject an appropriate amount of coolant into the water storage tank; Step 3: Install the power supply into the power supply compartment through the installation port on the bottom side of the chassis body, and guide the power cord at the tail of the power supply into the inside of the chassis body through the cable groove. Finally, connect the power cord to the motherboard, hard disk and graphics card respectively; Step 4: Guide the cables used to connect the AC power, peripherals and display devices through the dustproof groove and into the cable management compartment. After correctly connecting the cables to the motherboard and the corresponding graphics card, close the cover and tighten the cover with the screws. Step 5: Start the computer, the circulating water pump and the cooling module, so that the coolant circulates between the first cooling row, the second cooling row, the water storage tank, the water distributor, the GPU cooling module and the CPU cooling module, and keeps working for a period of time to eliminate bubbles in the pipes; The airflow generated by the two cooling modules cools the coolant inside the first cold row and the second cold row during the process of passing through the first cold row and the second cold row; Step 6: During the circulation of the coolant, the hot water discharged from the drainage ends of the GPU cooling module and the CPU cooling module is centrally injected into the second cold row through the joint, and is cooled once while passing through the second cold row. The cooled coolant then flows back to the water storage tank. The circulating water pump then draws the coolant out of the water storage tank and injects it into the first cold row for secondary cooling, and then injects it into the water distributor. It is then injected into the GPU cooling module and the CPU cooling module respectively through the regulating valve to ensure that the coolant entering the GPU cooling module and the CPU cooling module is kept at the lowest temperature.

[0012] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that: 1. In the present invention, a first cooling chamber and a second cooling chamber are provided, and the chassis as a whole adopts liquid cooling to dissipate heat. A CPU heat dissipation module with a large-area design covers high-heat components such as the CPU and power supply components on the mainboard, and a GPU heat dissipation module covers high-heat components such as the GPU chip and power supply components, thereby ensuring that most of the heat generated by the computer hardware during use can be quickly transferred to the coolant. The first external cold row and the second cold row cooperate with the two cooling modules to dissipate heat outside the chassis, so that external air does not need to enter the interior of the chassis to participate in heat dissipation, which greatly reduces the efficiency of external dust entering the interior of the chassis body.

[0013] 2. In the present invention, a first heat sink fin, a second heat sink fin, a third heat sink fin and a fourth heat sink fin are provided. When in use, some electronic components that are not covered by the heat sink module will also dissipate heat, which will gradually increase the air temperature inside the chassis body. The third heat sink fin and the fourth heat sink fin can increase the contact area between the chassis body and the internal air, which is convenient for quickly transferring heat to the corresponding first heat sink fin and second heat sink fin. Due to the internal space design of the first cooling bin and the second cooling bin, the wind blown out by the cooling module will first pass through the first heat sink fin and the second heat sink fin, thereby accelerating the heat dissipation speed of the first heat sink and the second heat sink fin, thereby indirectly cooling the interior of the chassis body and improving the heat dissipation efficiency.

[0014] 3. In the present invention, a water distributor and a regulating valve are provided. The cooling water circuit design of the traditional computer case usually adopts a series connection between each joint. When this water circuit design is used on a multi-CPU or multi-GPU solution platform, the temperature of the water will rise rapidly when passing between the CPU and the GPU, so the heat dissipation capacity will be gradually reduced, resulting in differences in the operating temperature of the CPU and GPU at different positions. At the same time, when the temperature of a single CPU or GPU is too high, the speed of the fan and the water pump will increase, resulting in increased noise. The present invention adopts a parallel connection to connect each GPU cooling module and the CPU cooling module. After being cooled twice by the second radiator and the first radiator, the coolant will be concentrated into the water distributor, and then injected into different GPU cooling modules and CPU cooling modules through regulating valves, ensuring that the temperature of the coolant contacted by each independent CPU and GPU chip remains consistent, and ensuring that the heat dissipation efficiency received by each chip remains relatively consistent. At the same time, each regulating valve can independently control the flow of the coolant. When a single CPU or GPU causes high temperature due to different loads, the heat dissipation capacity can be balanced by adjusting the flow of the corresponding regulating valve, ensuring that the cooling module can maintain a uniform speed for a relatively long time during operation, reducing the generation of noise.

[0015] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 The present invention Figure 1 Bottom view of Figure 3 The present invention Figure 1 Rear view of Figure 4 It is a three-dimensional structural schematic diagram of the chassis body in the present invention; Figure 5 The present invention Figure 4 Bottom view of Figure 6 The present invention Figure 4 Side view of Figure 7 The present invention Figure 6 Side view of Figure 8 The present invention Figure 7 Bottom view of Fig. 9 It is a schematic diagram of the three-dimensional structure of the second radiator in the present invention; Fig.10 The present invention Fig. 9 Side view of Fig.11 is an exploded view of the cooling module in the present invention; Fig.12 The present invention Fig.11 Rear view of Fig.13 The present invention Fig.12 Side view of Fig.14 It is a schematic diagram of the workflow of the present invention.

[0017] The reference numerals are as follows: 1. Chassis body, 2. First cooling chamber, 3. First partition chamber, 4. First air inlet, 5. First heat sink fin, 6. First radiator, 7. Second cooling chamber, 8. Second partition chamber, 9. Second air inlet, 10. Second heat sink fin, 11. Cooling module, 1101. Fixed frame, 1102. Air outlet slot, 1103. Mounting slot, 1104. Air guide, 1105. Centrifugal fan, 1106. Dust plate, 12. Second radiator, 13. Partition , 14. Power supply compartment, 15. Wire trough, 16. Cover plate, 17. Fastening screws, 18. Dustproof groove, 19. Mounting bracket, 20. Water storage tank, 21. Snap ring, 22. Circulating water pump, 23. Water distributor, 24. Regulating valve, 25. GPU cooling module, 26. CPU cooling module, 27. Connector, 28. Third cooling fin, 29. Fourth cooling fin, 30. First panel, 31. Second panel, 32. Third panel, 33. Cable management compartment. DETAILED DESCRIPTION

[0018] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0019] In order to enable those skilled in the art to better understand the present application, the following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0020] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, it includes a chassis body 1, a cooling module 11, a GPU cooling module 25 and a CPU cooling module 26. The front side of the chassis body 1 is provided with a first cooling chamber 2, and the top of the chassis body 1 is provided with a second cooling chamber 7, and the rear part of the chassis body 1 is provided with a wire management chamber 33; a partition 13 is installed inside the chassis body 1, and a power supply chamber 14 is provided at the bottom of the chassis body 1; a mounting frame 19 is installed on one side of the partition 13, and two clamping rings 21 are symmetrically installed on the mounting frame 19, and the two clamping rings 21 are both engaged and connected with the water storage tank 20; a wire groove 15 is opened at the bottom of one side of the interior of the chassis body 1, and the wire groove 15 is connected with the interior of the power supply chamber 14; a circulating water pump 22 is provided below the water storage tank 20, and the circulating water pump 22 is installed at the inner bottom of the chassis body 1; the water inlet end of the circulating water pump 22 is connected to the bottom pipe of the water storage tank 20, and the water outlet end of the circulating water pump 22 is connected to the bottom pipe of the water storage tank 20 The water inlet end of the first cold row 6 is connected by a pipeline, and the water outlet end of the first cold row 6 is connected by a pipeline to the water inlet end of the water distributor 23. The water distributor 23 is provided with a regulating valve 24, and there are several regulating valves 24; there are several GPU cooling modules 25, and the water inlet end of each GPU cooling module 25 is respectively connected to a regulating valve 24 pipeline; the water inlet end of the CPU cooling module 26 is connected to a regulating valve 24 pipeline; a first panel 30 is installed on the upper part of one side of the chassis body 1, and a second panel 31 is installed on the upper part of the other side of the chassis body 1, and a third panel 32 is installed on the lower part of one side of the chassis body 1; a cover plate 16 is installed on the rear part of the chassis body 1, and the connection mode of the cover plate 16 and the chassis body 1 is a rotational connection; a fastening screw 17 is installed in the middle part of one side of the cover plate 16, and the fastening screw 17 is threadedly connected to the chassis body 1; a dustproof groove 18 is provided at the lower part of the cover plate 16.

[0021] To be more specific, the chassis body 1 is made of metal as a whole, which has a good heat transfer effect. Corresponding holes are opened on the rear side of the bottom of the chassis body 1 to facilitate the installation of the power supply into the power supply compartment 14, and a grille-type air inlet is provided at the corresponding position of the bottom of the chassis body 1 to facilitate air to enter the power supply to complete heat exchange.

[0022] As a further explanation of this embodiment, the first panel 30, the second panel 31 and the third panel 32 are all made of metal and are fixed to the chassis body 1 with screws. When in use, they are used to cover the opening parts on the sides of the chassis body 1 and the power supply compartment 14; when in use, the cables need to pass through the dustproof groove 18 from the outside, and then enter the cable management compartment 33 to connect with the motherboard or GPU. A snap-fit ​​rubber sleeve is provided on the dustproof groove 18 to fill the gaps between the cables passing through the dustproof groove 18, thereby reducing the rate at which external dust enters the cable management compartment 33.

[0023] Please refer to Fig. 9 and Fig.10 As shown, in this embodiment, a third heat dissipation fin 28 is provided on the upper side of the inner wall of the chassis body 1, and a fourth heat dissipation fin 29 is provided on the lower side of the inner wall of the chassis body 1, and a plurality of the third heat dissipation fins 28 and the fourth heat dissipation fins 29 are distributed in a matrix.

[0024] More specifically, the third heat dissipation fins 28 and the fourth heat dissipation fins 29 are made of the same metal material as the chassis body 1 .

[0025] As a further illustration of this embodiment, the third heat dissipation fins 28 and the fourth heat dissipation fins 29 are used to increase the contact area between the chassis body 1 and the internal air, thereby improving the heat conduction efficiency of the chassis body 1 .

[0026] Please refer to Fig. 9 and Fig.10 As shown, in the present embodiment, a first partition chamber 3 is provided on one side of the first cooling chamber 2, and a first air inlet 4 is provided on one side of the first partition chamber 3, and the first air inlet 4 is communicated with the interior of the first cooling chamber 2; a first heat sink fin 5 is provided on the inner wall of the first cooling chamber 2, and a first radiator 6 is installed inside the first cooling chamber 2.

[0027] More specifically, the first partition chamber 3 is used to fix the cooling module 11 . After installation, the air outlet groove 1102 of the cooling module 11 is snap-connected with the first air inlet 4 to ensure that the airflow enters the first cooling chamber 2 only through the first air inlet 4 .

[0028] As a further explanation of this embodiment, the air entering the first cooling chamber 2 will first pass through the first heat sink fins 5 to cool the chassis body 1, and then the airflow will pass through the second cooling radiator 12 to cool the coolant flowing inside the second cooling radiator 12.

[0029] Please refer to Fig. 9 and Fig.10 As shown, in the present embodiment, a second partition chamber 8 is provided on one side of the second cooling chamber 7, and a second air inlet 9 is provided on one side of the second partition chamber 8, and the second air inlet 9 is communicated with the interior of the second cooling chamber 7; second heat sink fins 10 are provided on the inner wall of the second cooling chamber 7, and a second cold row 12 is installed inside the second cooling chamber 7; a plurality of the first heat sink fins 5 and the second heat sink fins 10 are distributed in a matrix.

[0030] More specifically, the second partition chamber 8 is used to fix the cooling module 11 . After installation, the air outlet groove 1102 of the cooling module 11 is snap-connected with the second air inlet 9 to ensure that the airflow enters the second cooling chamber 7 only through the second air inlet 9 .

[0031] As a further explanation of this embodiment, the air entering the second cooling chamber 7 will first pass through the second heat sink fins 10 to cool the chassis body 1, and then the airflow will pass through the first cooling row 6 to cool the coolant flowing inside the first cooling row 6.

[0032] Please refer to Fig.11 , Fig.12 and Fig.13 As shown, in this embodiment, the cooling module 11 includes a fixed frame 1101, an air outlet groove 1102, a mounting groove 1103, an air guide 1104, a centrifugal fan 1105 and a dustproof plate 1106; a plurality of air guides 1104 are arranged at equal intervals, and the air outlet end of the air guide 1104 is connected to the air outlet groove 1102, and a centrifugal fan 1105 is installed inside each air guide 1104.

[0033] More specifically, each centrifugal fan 1105 is provided with a grille-type opening on the dustproof plate 1106 to facilitate air flow and has the ability to block large debris.

[0034] As a further illustration of this embodiment, multiple centrifugal fans 1105 cooperate with the air guide 1104 to accelerate the air flow through the air outlet slot 1102, and then inject the air flow into the first cooling bin 2 and the second cooling bin 7.

[0035] Please refer to Figure 4 , Figure 5 , Figure 6 and Fig.13 As shown, in this embodiment, the water outlet ends of the GPU cooling module 25 and the CPU cooling module 26 are both connected to the joint 27 pipe, and the joint 27 is connected to the water inlet end of the second radiator 12, and the water outlet end of the second radiator 12 is connected to the top pipe of the water storage tank 20.

[0036] More specifically, the cooled coolant will be centrally injected into the water distributor 23 , and then injected into the corresponding CPU cooling module 26 or GPU cooling module 25 through each regulating valve 24 .

[0037] As a further illustration of this embodiment, each regulating valve 24 can be automatically controlled through a BIOS setup program.

[0038] Please refer to Fig.14 As shown, in this embodiment, the method for using the dustproof chassis with an external heat dissipation structure is characterized by: Step 1: Select a CPU heat dissipation module 26 and a GPU heat dissipation module 25 of appropriate size according to the size of the motherboard and the graphics card PCB to be used, and respectively combine and install the CPU heat dissipation module 26 and the GPU heat dissipation module 25 with the motherboard and the graphics card PCB; Step 2: Connect the water inlet ends of the CPU cooling module 26 and the GPU cooling module 25 to the corresponding regulating valves 24 through pipes, and connect the water outlet ends of the CPU cooling module 26 and the GPU cooling module 25 to the joint 27, and then inject a proper amount of coolant into the water storage tank 20; Step 3: Install the power supply into the power supply compartment 14 through the installation opening at the bottom side of the chassis body 1, and guide the power cord at the tail of the power supply into the inside of the chassis body 1 through the wire groove 15, and finally connect the power cord to the motherboard, hard disk and graphics card respectively; Step 4: Guide the cables used to connect the mains, peripherals and display devices through the dustproof slot 18 and into the cable management compartment 33 in sequence, and then correctly connect the cables to the motherboard and the corresponding graphics card, close the cover 16, and lock the cover 16 by tightening the screws 17; Step 5: Start the computer, the circulating water pump 22 and the cooling module 11, so that the coolant circulates among the first cooling row 6, the second cooling row 12, the water storage tank 20, the water distributor 23, the GPU cooling module 25 and the CPU cooling module 26, and keeps working for a period of time to eliminate bubbles in the pipeline; The airflow generated by the two cooling modules 11 cools the coolant inside the first cold row 6 and the second cold row 12 during the process of passing through the first cold row 6 and the second cold row 12; Step six: During the circulation of the coolant, the hot water discharged from the drainage ends of the GPU cooling module 25 and the CPU cooling module 26 is centrally injected into the second cooling row 12 through the joint, and is cooled once in the process of passing through the second cooling row 12, and then the cooled coolant flows back to the water storage tank 20; then the circulating water pump 22 draws the coolant in the water storage tank 20 and injects it into the first cooling row 6 for secondary cooling, and then injects it into the water separator 23, and then injects it into the GPU cooling module 25 and the CPU cooling module 26 respectively through the regulating valve 24, ensuring that the coolant entering the GPU cooling module 25 and the CPU cooling module 26 is maintained at the lowest temperature.

[0039] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A dustproof chassis with an external heat dissipation structure, characterized in that: The invention comprises a chassis body (1), a cooling module (11), a GPU cooling module (25) and a CPU cooling module (26); the front side of the chassis body (1) is provided with a first cooling chamber (2), the top of the chassis body (1) is provided with a second cooling chamber (7), and the rear part of the chassis body (1) is provided with a cable management chamber (33); A partition (13) is installed inside the chassis body (1), and a power supply compartment (14) is provided at the bottom of the chassis body (1); a mounting frame (19) is installed on one side of the partition (13), and two snap rings (21) are symmetrically installed on the mounting frame (19), and both snap rings (21) are snap-connected to the water storage tank (20); a wire groove (15) is provided at the bottom of one side of the interior of the chassis body (1), and the wire groove (15) is connected to the inside of the power supply compartment (14); A circulating water pump (22) is provided below the water storage tank (20), and the circulating water pump (22) is installed at the inner bottom of the chassis body (1); the water inlet end of the circulating water pump (22) is connected to the bottom pipeline of the water storage tank (20), and the water outlet end of the circulating water pump (22) is connected to the water inlet end pipeline of the first cold row (6), and the water outlet end of the first cold row (6) is connected to the water inlet end pipeline of the water distributor (23); the water distributor (23) is installed with a regulating valve (24), and a plurality of regulating valves (24) are provided; There are a plurality of GPU cooling modules (25), and the water inlet end of each GPU cooling module (25) is connected to a regulating valve (24) pipeline; the water inlet end of the CPU cooling module (26) is connected to a regulating valve (24) pipeline; A first panel (30) is installed on the upper part of one side of the chassis body (1), a second panel (31) is installed on the upper part of the other side of the chassis body (1), and a third panel (32) is installed on the lower part of one side of the chassis body (1); A cover plate (16) is installed at the rear of the chassis body (1), and the cover plate (16) is connected to the chassis body (1) in a rotational manner; a fastening screw (17) is installed in the middle of one side of the cover plate (16), and the fastening screw (17) is threadedly connected to the chassis body (1); and a dustproof groove (18) is provided at the bottom of the cover plate (16).

2. The dustproof chassis with an external heat dissipation structure according to claim 1, characterized in that: A third heat dissipation fin (28) is provided on the upper side of the inner wall of the chassis body (1), and a fourth heat dissipation fin (29) is provided on the lower side of the inner wall of the chassis body (1), and a plurality of the third heat dissipation fins (28) and the fourth heat dissipation fins (29) are both distributed in a matrix.

3. The dustproof chassis with an external heat dissipation structure according to claim 1, characterized in that: A first partition chamber (3) is provided on one side of the first cooling chamber (2), and a first air inlet (4) is provided on one side of the first partition chamber (3), and the first air inlet (4) is communicated with the interior of the first cooling chamber (2); first heat sink fins (5) are provided on the inner wall of the first cooling chamber (2), and a first radiator (6) is installed inside the first cooling chamber (2).

4. The dustproof chassis with an external heat dissipation structure according to claim 1, characterized in that: A second partition chamber (8) is provided on one side of the second cooling chamber (7), and a second air inlet (9) is provided on one side of the second partition chamber (8), and the second air inlet (9) is communicated with the interior of the second cooling chamber (7); second heat sink fins (10) are provided on the inner wall of the second cooling chamber (7), and a second cooling row (12) is installed inside the second cooling chamber (7); A plurality of the first heat dissipation fins (5) and the second heat dissipation fins (10) are arranged in a matrix arrangement.

5. The dustproof chassis with an external heat dissipation structure according to claim 1, characterized in that: The cooling module (11) comprises a fixing frame (1101), an air outlet groove (1102), a mounting groove (1103), an air guide (1104), a centrifugal fan (1105) and a dustproof plate (1106); a plurality of air guides (1104) are arranged at equal intervals, and the air outlet end of the air guide (1104) is connected to the air outlet groove (1102), and a centrifugal fan (1105) is installed inside each air guide (1104).

6. The dustproof chassis with an external heat dissipation structure according to claim 1, characterized in that: The water outlet ends of the GPU cooling module (25) and the CPU cooling module (26) are both connected to the joint (27) pipe, and the joint (27) is connected to the water inlet end of the second cooling radiator (12), while the water outlet end of the second cooling radiator (12) is connected to the top pipe of the water storage tank (20).

7. A method for using the dustproof chassis with an external heat dissipation structure according to claim 1, characterized in that: Step 1: Select a CPU cooling module (26) and a GPU cooling module (25) of appropriate size according to the size of the motherboard and the graphics card PCB to be used, and respectively assemble and install the CPU cooling module (26) and the GPU cooling module (25) with the motherboard and the graphics card PCB; Step 2: Connect the water inlet ends of the CPU cooling module (26) and the GPU cooling module (25) to the corresponding regulating valves (24) through pipes, and connect the water outlet ends of the CPU cooling module (26) and the GPU cooling module (25) to the joints (27), and then inject a proper amount of coolant into the water storage tank (20); Step 3: Install the power supply into the power supply compartment (14) through the installation opening at the bottom side of the chassis body (1), and guide the power cord at the tail of the power supply into the inside of the chassis body (1) through the wire groove (15), and finally connect the power cord to the motherboard, hard disk and graphics card respectively; Step 4: Guide the cables used to connect the mains, peripherals and display devices through the dustproof slot (18) and into the cable management compartment (33) in sequence, and then correctly connect the cables to the motherboard and the corresponding graphics card, close the cover (16), and lock the cover (16) by tightening the screws (17); Step 5: Start the computer, the circulating water pump (22) and the cooling module (11), so that the coolant circulates between the first cooling row (6), the second cooling row (12), the water storage tank (20), the water distributor (23), the GPU cooling module (25) and the CPU cooling module (26), and keeps working for a period of time to eliminate bubbles in the pipeline; The airflow generated by the two cooling modules (11) cools the coolant inside the first cooling row (6) and the second cooling row (12) during the process of passing through the first cooling row (6) and the second cooling row (12); Step 6: During the circulation of the coolant, the hot water discharged from the drainage ends of the GPU cooling module (25) and the CPU cooling module (26) is centrally injected into the second cooling row (12) through the joint, and is cooled once while passing through the second cooling row (12), and then the cooled coolant flows back into the water storage tank (20); then the circulating water pump (22) extracts the coolant in the water storage tank (20) and injects it into the first cooling row (6) for secondary cooling, and then injects it into the water distributor (23), and then injects it into the GPU cooling module (25) and the CPU cooling module (26) respectively through the regulating valve (24), so as to ensure that the coolant entering the GPU cooling module (25) and the CPU cooling module (26) is kept at the lowest temperature.

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